Laser processing method and stage for glass substrates
The laser processing method and stage for glass substrates address damage and contamination issues by using a breathable film and movable pins to maintain a gap and vacuum fixation, enhancing accuracy and yield.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- ABSOLICS INC
- Filing Date
- 2025-11-17
- Publication Date
- 2026-06-19
AI Technical Summary
Existing laser processing methods for glass substrates face issues such as damage and contamination due to laser reflection, plume formation, and adsorbed residue, which affect processing accuracy and yield.
A laser processing method and stage design that includes a breathable film and movable pins to maintain a gap between the glass substrate and the stage, using vacuum fixation to support and fix the substrate, minimizing direct contact and laser reflection, and employing a ventilation film to reduce contamination.
The method and stage design prevent damage and contamination, enhance processing accuracy, and improve yield by reducing laser-induced defects and residue formation during glass substrate processing.
Smart Images
Figure 2026100801000001_ABST
Abstract
Description
Technical Field
[0001] The embodiment relates to a laser processing method and a stage for a glass substrate that suppress damage and contamination.
Background Art
[0002] In manufacturing electronic components, forming a circuit on a semiconductor wafer is called the front-end (FE) process, and assembling the wafer into a state where it can be used as an actual product is called the back-end (BE) process. This back-end process includes a packaging process.
[0003] The four core technologies of the semiconductor industry that have enabled the rapid development of recent electronic products are semiconductor technology, semiconductor packaging technology, manufacturing process technology, and software technology.
[0004] Semiconductor technology has developed into various forms such as a line width in nano units below micro, more than 10 million cells, high-speed operation, and a large amount of heat dissipation. However, relatively, there is no technology that perfectly packages this.
[0005] Therefore, the electrical performance of a semiconductor may sometimes be determined by packaging technology and the electrical connection thereby, rather than the performance of the semiconductor technology itself.
[0006] Recently, glass can be applied to a high-end packaging substrate. By forming through holes in the glass substrate and applying a conductive substance to these through holes, the wiring length between the element and the motherboard can be shortened, enabling it to have excellent electrical characteristics. The demand for improvement in the technology for processing such glass substrates is also increasing.
[0007] Related prior arts include US Patent Publication US2017 / 0210114A1, Korean Registered Patent No. 10-2574243, etc.
Summary of the Invention
Problems to be Solved by the Invention
[0008] The objective of this embodiment is to present a stage and processing method that can process glass substrates with excellent yield and accuracy in laser processing processes such as the formation of TGVs (Through Glass Vias). Contact between the stage or breathable film and the glass substrate can cause problems such as laser reflection, plume formation, and the generation of adsorbed residue. The objective of this embodiment is to provide a laser processing method for glass substrates and a stage that can be used therein, which solve the drawbacks of damaging the glass substrate or reducing processing accuracy. [Means for solving the problem]
[0009] To achieve the above objective, a laser processing method for a glass substrate according to one embodiment includes a placement step of placing a glass substrate on a stage on which a breathable film is arranged, leaving space between the substrate and the glass substrate, and a processing step of irradiating the glass substrate with a laser to form a defect, thereby manufacturing a glass substrate on which a defect has been formed.
[0010] The aforementioned defect forms glass through vias or glass cavities in the glass substrate either by the defect itself or by etching.
[0011] The stage may include a stage body, a support portion protruding from the stage body, a stage cavity surrounded by the support portion and with an open top, and a pin disposed in the stage cavity that is permitted to move up and down.
[0012] A grounding mounting portion may be placed on the aforementioned support portion.
[0013] The grounding mounting portion can be allowed to have a vacuum or released at the position where it is in contact with the glass substrate.
[0014] The ventilation film may be placed within the stage cavity.
[0015] The breathable film can suppress the reflection of the laser toward the glass substrate.
[0016] When the laser is irradiated in the processing step, a vacuum can be allowed in the grounding mounting portion.
[0017] When the pin rises during the processing step, it can come into contact with the bottom surface of the glass substrate.
[0018] The glass substrate may be an arrangement of multiple individual packaging substrates separated by a dummy region.
[0019] When the pin rises during the processing step, it can come into contact with the bottom surface of the dummy area.
[0020] The breathable film and the glass substrate do not come into direct contact.
[0021] The processing step may include a fixing step in which the pin rises and contacts the bottom surface of the glass substrate, fixing the position of the glass substrate and allowing a vacuum in the grounding mounting portion to attract the glass substrate; a processing step in which a laser is irradiated onto the glass substrate; and a release step in which the vacuum in the grounding mounting portion is released and the pin is lowered.
[0022] Another example of a stage for achieving the above objective is a stage applied to laser processing, which includes a stage body, a support portion positioned protruding from the stage body, a stage cavity surrounded by the support portion and with an open top, and pins that are permitted to move up and down.
[0023] The aforementioned pins may be arranged one or more times within the stage cavity.
[0024] The stage body may have a metal surface.
[0025] A ventilation film may be placed inside the aforementioned stage cavity.
[0026] A grounding placement portion may be arranged on the support portion.
[0027] A hole or pattern is formed in the grounding placement portion, and the hole or pattern may be connected to a vacuum pump.
[0028] A glass substrate may be arranged on the upper part of the stage cavity.
[0029] The upper part of the grounding placement portion supports and fixes the position of the glass substrate, and the pins can support the bottom surface of the glass substrate.
[0030] The ventilation film may be a porous polymer film.
Advantages of the Invention
[0031] The laser processing method and stage of the glass substrate in the embodiment can solve the problems of contamination and damage that may occur to the glass substrate during the laser processing process.
[0032] The laser processing method and stage of the glass substrate in the embodiment can solve problems such as a decrease in processing accuracy due to laser reflection, generation of a plume due to contact between the stage or ventilation film and the glass substrate, damage to the ventilation film by the laser, and generation of adsorption residues by contacting the glass substrate.
Brief Description of the Drawings
[0033] [Figure 1] It is a conceptual diagram for explaining the laser processing process of a glass substrate according to the prior art in cross-section. [Figure 2] It is a schematic diagram for explaining the stage according to the embodiment in cross-section. [Figure 3A] It is a schematic diagram of the stage according to the embodiment as viewed from above. [Figure 3B] It is a schematic diagram for explaining the state in which a glass substrate is arranged on the stage according to the embodiment as viewed from above. [Figure 4A] This is a conceptual diagram illustrating, in cross-section, the process in which a glass substrate is placed on a stage, pins rise to support the glass substrate, the glass substrate is fixed in place by suction, laser processing is performed, and once the laser processing is complete, the suction fixing of the glass substrate is released and the pins descend. [Figure 4B] This is a conceptual diagram illustrating, in cross-section, the process in which a glass substrate is placed on a stage, pins rise to support the glass substrate, the glass substrate is fixed in place by suction, laser processing is performed, and once the laser processing is complete, the suction fixing of the glass substrate is released and the pins descend. [Figure 4C] This is a conceptual diagram illustrating, in cross-section, the process in which a glass substrate is placed on a stage, pins rise to support the glass substrate, the glass substrate is fixed in place by suction, laser processing is performed, and once the laser processing is complete, the suction fixing of the glass substrate is released and the pins descend. [Figure 4D] This is a conceptual diagram illustrating, in cross-section, the process in which a glass substrate is placed on a stage, pins rise to support the glass substrate, the glass substrate is fixed in place by suction, laser processing is performed, and once the laser processing is complete, the suction fixing of the glass substrate is released and the pins descend. [Best Mode for Carrying Out the Invention]
[0034] The embodiments are described below in detail with reference to the accompanying drawings, so that they can be easily implemented by a person with ordinary skill in the art to which the embodiments belong. However, the embodiments can be realized in a variety of different forms and are not limited to the embodiments described herein. Similar parts are denoted by the same reference numerals throughout the specification.
[0035] Throughout this specification, the term “these combinations” as used in any expression in Markush form means one or more mixtures or combinations selected from the group of components described in the Markush form, and includes one or more of those components.
[0036] Throughout this specification, terms such as “First,” “Second,” or “A,” “B” are used to distinguish identical terms from one another. Furthermore, singular expressions include plural expressions unless the context clearly indicates otherwise.
[0037] In this specification, "~system" may mean that the compound contains a compound corresponding to "~" or a derivative of "~".
[0038] In this specification, the meaning of B being located on A means either B being in direct contact with A, or B being located on A with other layers located between them, and is not limited to B being in contact with the surface of A.
[0039] In this specification, the meaning of B being connected to A means either that A and B are directly connected, or that A and B are connected through other components between them, and is not limited to the direct connection of A and B unless otherwise specified.
[0040] Figure 1 is a conceptual diagram illustrating the laser processing process of a glass substrate using existing technology in cross-section. In the laser processing of the glass substrate, a breathable film (air permeable film) 200a is placed on a stage 100a, and the glass substrate 300 is placed on top of it. The glass substrate 300 may warp, but the stage 100a holds the glass substrate 300 in place by adsorption via the air permeable film 200a, fixing its position and mitigating mild warpage. Laser irradiation is then performed on the glass substrate 300, which is thus fixed in place.
[0041] Stage 100a can be manufactured from a metal such as aluminum. Light is easily reflected from the surface of such metals. Glass is translucent, and the laser 1 irradiated onto the glass substrate 300 can pass through the glass substrate 300 to reach stage 100a, be reflected, and re-enter the bottom surface of the glass substrate 300. This can cause defects D in unintended locations on the glass substrate 300, leading to a decrease in processing accuracy. In addition, the light from laser 1 can accelerate the aging of the breathable film 200a. Contamination and damage may occur to the glass substrate 300 during the process of direct contact with the breathable film 200a, and if the aging of the breathable film 200a progresses, contamination such as residue P remaining on the glass substrate 300 may worsen.
[0042] The concrete examples propose methods for solving these problems, as well as the stages in which they can be utilized.
[0043] stage Figure 2 is a schematic diagram illustrating the stage in a cross-section in the embodiment example. Figure 3A is a schematic diagram of the stage in the embodiment example viewed from above. Figure 3B is a schematic diagram illustrating the state in which a glass substrate is placed on the stage in the embodiment example viewed from above. The embodiment example will be explained in more detail with reference to Figures 2, 3A, and 3B.
[0044] To achieve the above objective, the Stage 100 in the embodiment is a Stage 100 applied to laser processing, and includes a Stage body 110, a support portion 120 positioned protruding from the Stage body 110, a Stage cavity surrounded by the support portion 120 and with an open top, and a pin 130 that is allowed to move up and down.
[0045] The stage body 110 serves to provide stable support and fix the position of the stage.
[0046] Unlike existing stages, the stage in this example has a protruding support portion 120 and a pin 130.
[0047] The stage body 110 is often manufactured from a metal plate such as aluminum.
[0048] The stage body 110 may have a metallic surface. For example, the stage body may be made of aluminum or an aluminum alloy.
[0049] The support portion 120 is configured to support the glass substrate by protruding from the stage body 110. In the drawing, the support portion is shown as being positioned at the edge of the stage body 110, but it is not limited to this configuration. The support portion 120 supports the glass substrate 300 which is positioned on the upper surface of the stage body 110, and ensures that a certain space (stage cavity) is provided between the upper surface of the stage body 110 and the glass substrate 300. In other words, the support portion 120 supports the glass substrate 300 so that it appears to be floating above the stage body 110.
[0050] The support section 120 may be made of the same material as the main stage body.
[0051] The support portion 120 may include an elastic polymer material.
[0052] The support portion 120 may be coated with an elastic polymer material.
[0053] A grounding mounting portion 125 may be further arranged on the support portion 120.
[0054] The grounding mounting portion 125 is positioned on the support portion and supports the glass substrate.
[0055] The grounding mounting portion 125 suppresses damage to the glass substrate 300 when in contact with it, and can also support and fix the glass substrate while adsorbing it.
[0056] The grounding mounting section 125 is, for example, positioned for the adsorption of the glass substrate 300 and may be connected to the vacuum pump 140 by a connection section 127.
[0057] The grounding mounting portion 125 has holes and patterns formed on its surface and inside, and these holes and patterns are connected to the connection portion 127, allowing the vacuum to be enabled or disabled by the vacuum pump 140.
[0058] If a vacuum is permitted in the grounding mounting portion 125, the glass substrate 300, which is positioned on top of the grounding mounting portion 125, can be attracted to it, thereby fixing the position of the glass substrate 300.
[0059] The grounding portion 125 may, for example, be formed of the same material as the support portion 120.
[0060] The drawing illustrates that the connecting portion 127 is positioned at the boundary between the grounding portion 125 and the support portion 120, but the connecting portion 127 can also extend through the inside of the stage to the bottom or side of the stage and be connected to the vacuum pump 140.
[0061] The space enclosed by the support section 120 and with its top open is called the stage cavity.
[0062] A ventilation film 200 may be placed inside the stage cavity. Details about the ventilation film 200 will be described later.
[0063] In the laser etching process, a space is maintained between the glass substrate and the stage, and the glass substrate 300 is stably adsorbed and fixed by the vacuum applied to the grounding mounting section 125. Furthermore, the etching process can be performed while suppressing unwanted damage to the stage that may occur due to the laser light, and suppressing contamination of the glass substrate that may occur due to direct adhesion between the glass substrate and the upper surface of the stage body, or between the glass substrate and the breathable film.
[0064] The pins 130 are positioned within the stage cavity and are capable of vertical movement and position fixing. For example, one, two, three, or four or more pins 130 may be positioned within the stage cavity. Alternatively, 40 or fewer, 32 or fewer, or 50 or fewer pins may be positioned.
[0065] The pins 130 serve to support the glass substrate 300. Large-area glass substrates 300 may be used, and sagging may occur in parts of the glass substrate 300 that are not supported by the support portion 120. This can reduce the accuracy of laser processing. Therefore, the embodiment uses the pins 130 to support the glass substrate 300 while minimizing the possibility of contamination and damage to the glass substrate 300.
[0066] The glass substrate 300 used in the concrete example may be a semiconductor glass substrate.
[0067] Glass substrates used as semiconductor materials are more difficult to process than those used as display materials. Because semiconductor glass substrates often have fine lines arranged on them, they require even more precise processing than display materials. Therefore, the risk of defects due to warping or relative positional errors in the glass substrate is even higher.
[0068] The pin 130 may be positioned in a location corresponding to the dummy area 330 of the glass substrate 300.
[0069] Unlike display materials, which are preferred for their large surface area, semiconductor glass substrates used for ultra-small elements and packaging involve arranging numerous individual elements on a large surface area glass substrate according to the design, and then separating and applying them through processes such as dicing.
[0070] For example, the portion applied to the substrate of a semiconductor package is referred to as an individual product area, and such individual product areas are arranged with margins to constitute a product area 350. A large number of such product areas may be arranged within the glass substrate 300 with intervals between them. Such intervals are referred to as dummy areas 330.
[0071] Specifically, the glass substrate 300 may be a strip substrate in which multiple individual packaging substrates (individual product areas) are arranged with a dummy area 330 in between.
[0072] Specifically, the glass substrate 300 may be a quad substrate in which multiple strip substrates are arranged with a dummy region 330 in between.
[0073] Specifically, the glass substrate 300 may be a panel substrate in which multiple quad substrates are arranged with a dummy region 330 in between.
[0074] The glass substrate 300 in the example may be a strip substrate, a quad substrate, or a panel substrate.
[0075] The pin 130 may be positioned to correspond to a dummy region 330 of the glass substrate 300. In other words, the pin 130 can rise to contact the lower surface of the glass substrate 300 to support it, and the position where one end of the pin contacts the lower surface of the glass substrate 300 may be the dummy region 330. In this case, contamination of the product region 350 can be reduced, so that the glass substrate can be processed with a better yield.
[0076] As an example, Figure 3B illustrates how a glass substrate 300 with four product regions 350 arranged on it is placed on the stage 100 of the embodiment. The product regions 350 are arranged on the rectangular glass substrate 300, with dummy regions 330 in between each other.
[0077] The center of gravity of the glass substrate 300 may be located within the dummy region 330. Exemplarily, the pin may be located in the center of the stage cavity, and the center may be located within the dummy region 330 of the glass substrate.
[0078] The pins 130 can be positioned to be in contact with the center of the glass substrate 300 and with the dummy region 330 between the center and the edge. The drawing shows an example in which five pins 130 are applied, but the number of pins 130 applied is not particularly limited.
[0079] Exemplary, Figure 3A illustrates stage 100 before the glass substrate 300 is placed. The positions of the pins 130 are set to correspond to the dummy area 330 of the glass substrate 300, and the breathable film 200 is placed.
[0080] The pin 130 may have a structure (not shown) that allows it to be connected to the stage body 110 and inserted or ejected. Furthermore, since the pin 130 is vertically movable, its height can be adjusted. Additionally, the pin 130 can be selectively fixed so that it does not descend even under a certain pressure when it is in an ejected position.
[0081] Multiple pins 130 can be arranged on the stage body 110 in rows and columns at regular intervals. In addition, pins 130 located in positions corresponding to the dummy area 330 of the glass substrate 300, which will be described later, can be selectively moved up and down.
[0082] The pin 130 may move up and down in response to pressure. For example, the pin 130 may rise when the pressure in the stage cavity decreases and may be fixed in the raised position. Also, the pin 130 may descend when the pressure in the stage cavity increases and may be maintained in the lowered position.
[0083] The pin 130 has a pin mounting portion 135 located at one end.
[0084] The pin mounting portion 135 is the area that comes into direct contact with the bottom surface of the glass substrate 300 when the pin 130 rises, and it is preferable that a material having cushioning and covering functions be applied to it.
[0085] For example, the pin mounting portion 135 may include siloxane polymers, polyvinyl acetate, polyvinyl acetal, polyvinyl butyral, polyurethane, polyether block amide, and the like.
[0086] Furthermore, the pin mounting portion 135 may, as an example, include PTFE (Polytetrafluoroethylene), FEP (Fluorinated ethylene propylene), PFA (Perfluoroalkoxy), or PAEK (Polyaryletherketone).
[0087] A pin mounting portion 135 made of such material can help to stably fix its position on the stage 100 while substantially suppressing damage to the glass substrate 300.
[0088] The ventilation film 200 can be placed inside the stage cavity.
[0089] The breathable film 200 may be placed inside the stage cavity, separated from the glass substrate 300.
[0090] The ventilation film 200 may be placed on the upper surface of the stage cavity.
[0091] The breathable film 200 may be placed over the entire bottom surface of the stage cavity, excluding the areas where the pins are located.
[0092] The breathable film 200 may be a porous film applied to processes such as laser processing of semiconductors. For example, Nitto's Sunmap may be used as the breathable film 200, but it is not limited to this.
[0093] The breathable film 200 may, for example, be a porous polyethylene film.
[0094] The breathable film 200 may, for example, be a porous ultra-high molecular weight polyethylene film.
[0095] The breathable film 200 may, for example, be a porous polyethylene film with an adhesive layer provided on top.
[0096] The breathable film 200 may be a pad-shaped film (vacuum pad) that allows air to move through the film while possessing a certain level of mechanical strength or higher.
[0097] The breathable film 200 may, for example, be a perforated film.
[0098] The breathable film 200 may, for example, be a perforated polytetrafluoroethylene film.
[0099] The breathable film 200 may be a film with low light reflectivity. For example, the breathable film 200 may be a black Sunmap film to reduce light reflectivity.
[0100] The breathable film 200 may have an antistatic function.
[0101] A glass substrate 300 is placed on top of the stage cavity, and laser processing can be performed on it.
[0102] The glass substrate 300 is placed on the stage cavity, and a space enclosed by the stage cavity and the glass substrate is maintained below the glass substrate 300. The pins 130 placed in this space support the bottom surface of the glass substrate 300 and prevent the glass substrate from sagging.
[0103] The stage in this example minimizes the possibility of contamination by preventing direct contact between the glass substrate and the breathable film, and reduces damage to the stage itself by placing the breathable film at the bottom of the stage cavity, thus contributing to more efficient laser processing of glass substrates.
[0104] Laser processing method for glass substrates Figures 4A to 4D are conceptual diagrams illustrating, in cross-section, the process in which a glass substrate is placed on a stage according to a real-world example, pins rise to support the glass substrate, the glass substrate is fixed by suction, laser processing is performed, and once the laser processing is complete, the suction fixing of the glass substrate is released and the pins descend. The laser processing method for a glass substrate according to a real-world example will be explained with reference to Figures 4A to 4D.
[0105] The laser processing method for a glass substrate in the embodiment includes a placement step and a processing step to manufacture a glass substrate 300 on which a defect 310 is formed. The defect 310 can form glass through vias or glass cavities in the glass substrate 300 either by the defect itself or by etching.
[0106] The placement step involves placing the glass substrate 300 on the stage 100 on which the breathable film 200 is placed (see Figure 4A). Specific explanations of the breathable film, stage, glass substrate, etc., are omitted here as they overlap with the explanations above.
[0107] The aforementioned arrangement may be performed during the process of transporting the glass substrate, which is placed on a cassette or the like, to a stage, or it may be performed in a cleanroom by a robotic arm or the like.
[0108] The processing step is to irradiate the glass substrate 300 with a laser 1 to form a defect 310.
[0109] The processing step may include a fixing step, a processing step, and a release step.
[0110] The fixing process includes the step of the pin 130 rising and contacting the bottom surface of the glass substrate 300 to support the glass substrate 300. It also includes the step of using a vacuum pump 140 connected to the grounding mounting section 125 to attract the glass substrate 300 on the grounding mounting section 125 and fix the position of the glass substrate 300 (see Figure 4B).
[0111] Specifically, the glass substrate 300 is made up of multiple individual packaging substrates arranged with a dummy region 330 in between, and when the pin 130 rises in the processing step, it can come into contact with the bottom surface of the dummy region 330.
[0112] The processing step involves irradiating the glass substrate 300 with a laser 1 (see Figure 4C). The laser irradiation can be any laser applicable to processing the glass substrate 300. When irradiating with the laser 1 in the processing step, the glass substrate 300 can be maintained in a state of adsorption using a vacuum pump 140 connected to the grounding mounting unit 125.
[0113] The aforementioned release process involves releasing the vacuum connected to the grounding mounting portion 125 and lowering the pin 130 (see Figure 4D).
[0114] The release of the vacuum connected to the grounding mounting section 125 and the lowering of the pin may be performed sequentially, or substantially simultaneously.
[0115] In this manner, with the glass substrate fixed, a laser beam can be irradiated onto predetermined positions on the glass substrate to form desired structures such as defects, through holes, and cavities. Furthermore, if necessary, through holes, cavities, and other structures can also be formed on the glass substrate after dry or wet etching following the laser irradiation process.
[0116] The implemented processing method utilizes features such as a stepped stage, a glass substrate adsorption mechanism, and a pin drive system. By designing the stage to have an empty space below the laser processing area and to contact the glass substrate with a dummy area, problems such as damage / contamination of the glass substrate due to laser reflection, plume generation, and adhesive (adsorption) residue can be prevented. Furthermore, by utilizing the pins and support parts, the flatness of the glass substrate can be maintained within a certain level, improving the accuracy of laser processing. In addition, by making the pins selectively driven, the pins rise when a vacuum connected to the grounding mounting part 125 is allowed and descend when the vacuum is released, it may be easier to attach and detach the glass substrate to the stage.
[0117] Although preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto. Various modifications and improvements by those skilled in the art, utilizing the basic concepts of the present invention as defined in the appended claims, also fall within the scope of the present invention. [Explanation of symbols]
[0118] 100 stages 110 Stage Unit 120 Support part 125 Grounding mounting section 127 Connection part 140 Vacuum pump 130 pins 135 Pin mounting section 200 breathable film 300 glass substrates 310 Defect or through hole 330 Dummy Area 350 product areas 1. Laser
Claims
1. A placement step involves placing a glass substrate on a stage on which a breathable film is arranged, leaving space between them. A glass substrate having defects is manufactured by a processing step of irradiating the glass substrate with a laser to form defects, A laser processing method for a glass substrate, wherein the defect forms glass through vias or glass cavities in the glass substrate by the defect itself or by etching.
2. The aforementioned stage is The main stage and A support portion is positioned protruding from the main body of the stage, A stage cavity surrounded by the aforementioned support portion and with its top open, The stage cavity includes a pin that is positioned thereand is allowed to move up and down, A grounding mounting portion is placed on the aforementioned support portion. The grounding portion is configured such that a vacuum is permitted or released at the position where it contacts the glass substrate. The laser processing method for a glass substrate according to claim 1, wherein the breathable film is disposed within the stage cavity.
3. The method for laser processing a glass substrate according to claim 1, wherein the breathable film suppresses the reflection of the laser toward the glass substrate.
4. The laser processing method for a glass substrate according to claim 2, wherein a vacuum is permitted in the grounding mounting portion when the laser is irradiated in the processing step.
5. The laser processing method for a glass substrate according to claim 2, wherein when the pin rises in the processing step, it comes into contact with the bottom surface of the glass substrate.
6. The glass substrate is arranged in which a plurality of individual packaging substrates are separated by a dummy region. The laser processing method for a glass substrate according to claim 2, wherein when the pin rises in the processing step, it comes into contact with the bottom surface of the dummy area.
7. The method for laser processing a glass substrate according to claim 1, wherein the breathable film and the glass substrate are not in direct contact.
8. The aforementioned processing step is The pin rises and contacts the bottom surface of the glass substrate, fixing the position of the glass substrate, and a vacuum is allowed in the grounding mounting portion to attract the glass substrate; The process of irradiating the glass substrate with a laser, A laser processing method for a glass substrate according to claim 2, comprising a release step of releasing the vacuum in the grounding mounting portion and lowering the pin.
9. A stage applicable to laser processing, The main stage and A support portion is positioned protruding from the main body of the stage, A stage cavity surrounded by the aforementioned support portion and with its top open, Includes a pin that allows vertical movement, The aforementioned pins are arranged one or more times within the stage cavity. The aforementioned stage body has a metal surface.
10. The stage according to claim 9, wherein a breathable film is placed inside the stage cavity.
11. A grounding mounting portion is placed on the aforementioned support portion. The grounding portion has holes or patterns formed in it, and the holes or patterns are connected to a vacuum pump. A glass substrate is placed on top of the aforementioned stage cavity. The upper part of the grounding mounting portion supports and fixes the position of the glass substrate, The stage according to claim 9, wherein the pins support the bottom surface of the glass substrate.
12. The stage according to claim 10, wherein the breathable film is a porous polymer film.