Method and system for manufacturing a printed circuit board having an embedded cooling cavity, and printed circuit board

Abstract

This disclosure relates to a method for manufacturing a printed circuit board having an embedded cooling cavity. The method is: The process involves machining a portion of the soluble material to form a pattern, Plating the pattern, Filling the plated pattern with an electrical insulating material, The remaining soluble material is removed using a solvent to form a cooling cavity, Includes.

Description

Technical Field

[0001] The present disclosure relates to a method and system for manufacturing a printed circuit board having an embedded cooling cavity and a printed circuit board.

Background Art

[0002] Printed circuit boards (PCBs) with embedded windings inherently demonstrate distinct advantages such as thinness, ease of manufacturing, reproducibility of electrical parameters, and improved thermal performance.

[0003] They can be used for planar magnetic components such as transformers and inductors. Nevertheless, planar magnetic components are systematically restricted to niche markets from the low-output range to the mid-output range. Due to the emergence of wide bandgap devices (WBGs) such as silicon carbide (SiC) or gallium nitride (GaN), current power converters operate at much higher switching frequencies compared to their silicon counterparts. As a result, magnetic constraints are relaxed, and the PCB-based planar field is opened up to higher output levels.

[0004] For their systematic use in high-density systems, effective thermal management is a difficult challenge. In high-output applications, liquid cooling is mainly used. However, conventional cold plates can only cool from the outside of the device, i.e., the magnetic material. This results in insufficient heat extraction from the core of the system (i.e., the copper winding), which is a limiting factor in the design. In fact, a further increase in output density means increasing the current density, which leads to higher losses due to the limited cooling area. For relaxation purposes, it has been conventionally recommended to connect the winding to the cold plate via a copper block insulated with a thermal conductive material.

[0005] The purpose of this disclosure is to cool PCB windings from their vicinity to reduce hot spots as much as possible. Meanwhile, the cooling system should be selected to avoid the additional excessive losses that may arise from positioning metal components near AC magnetic fields (eddy currents). Finally, electrical insulation of the cooling device is a critical point for human safety. From a manufacturing perspective, the strengths of PCB-based windings are cost-effectiveness and high dimensional repeatability. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] U.S. Patent No. 7289329 [Overview of the project] [Problems that the invention aims to solve]

[0007] This disclosure aims to provide a method and system for providing an efficient cooling system for windings intended for use in magnetic components. [Means for solving the problem]

[0008] For that purpose, the present disclosure relates to a method for manufacturing a printed circuit board having an embedded cooling cavity, the method being: The process involves machining a portion of the soluble material to form a pattern, Plating the pattern, Filling the plated pattern with an electrical insulating material, The remaining soluble material is removed using a solvent to form a cooling cavity, Includes.

[0009] This disclosure also relates to a system for manufacturing a printed circuit board having an embedded cooling cavity, the system is To instruct a machine to form a pattern by machining a portion of the soluble material, The command to plate the pattern, To instruct that the plated pattern be filled with an electrical insulating material, The command is to remove the remaining soluble material using a solvent to form a cooling cavity, It is configured to perform the following actions.

[0010] Therefore, plated patterns can be used as a thermal management system in which a fluid or gas flows through the interior to cool the printed circuit board. Since the cooling system is embedded within the PCB, thermal management is significantly improved compared to conventional techniques due to the reduced number of thermal interfaces. Plated patterns can also be used to conduct electric current. In such cases, the potential of the pattern is applied to the coolant, so the coolant must be wisely selected considering its dielectric properties. Because the device can conduct electric current, it can be advantageously used for magnetic components such as inductors or transformers.

[0011] According to certain characteristics, the method involves removing the remaining soluble material using a solvent before proceeding. Machining another part of the soluble material to form a different pattern, Plating a different pattern, Filling another plated pattern with a conductive material, It also includes.

[0012] Therefore, the electrically formed patterns filled with conductive material used to conduct electricity no longer come into contact with the cooling components. Since insulation is ensured by the electrical insulating material between the patterns, there is no need to pay particular attention to the coolant in terms of its dielectric capacity or ionization risk. When using conductive fluids, the hydraulic circuit does not need to be electrically insulated. Current conduction capability remains possible.

[0013] According to certain characteristics, the method is Laminating a substrate containing at least an electrical insulating material, Inserting the laminated substrate into the magnetic component, further comprising.

[0014] Thus, the resulting circuit board can be used not only for cooling purposes but also as a set of windings that pass current and consequently magnetize the magnetic component.

[0015] According to a particular feature, the method further comprises performing at least one of chemical etching and perforation on the lamination to make electrical connections before inserting the laminated substrate into the magnetic component.

[0016] According to a particular feature, the resulting printed circuit board is inserted between the conductor of the primary winding and the conductor of the secondary winding of the transformer.

[0017] Thus, the cooling system is positioned at the center of the transformer, preventing hot spots that normally occur within this area.

[0018] According to a particular feature, the two resulting printed circuit boards are positioned at the top of the conductor of the primary winding and the bottom of the conductor of the secondary winding of the transformer.

[0019] Thus, the cooling system can cool both the conductor of the primary winding with the core component on the top side and the conductor of the secondary winding with the core component on the bottom side. In addition, since this arrangement is located in a magnetic field region that is almost zero, it helps to reduce eddy current losses in the resulting printed circuit board.

[0020] According to a particular feature, the two resulting printed circuit boards each inserted into the magnetic component are laminated, with one resulting printed circuit board functioning as the primary winding of the transformer and the other resulting printed circuit board functioning as the secondary winding of the transformer.

[0021] Thus, heat extraction is performed directly inside the windings for optimal results.

[0022] This disclosure also, It has an embedded cooling cavity, and at least a portion of the cooling cavity is surrounded by plating. Regarding printed circuit boards.

[0023] The characteristics of this disclosure will become clearer by reading the following description of exemplary embodiments, which is made with reference to the accompanying drawings. [Brief explanation of the drawing]

[0024] [Figure 1a] A first example of an algorithm for manufacturing a printed circuit board that incorporates a cooling cavity according to the present disclosure, which may be used for magnetic components, is shown. [Figure 1b] A second example of an algorithm for manufacturing a printed circuit board that incorporates a cooling cavity according to the present disclosure, which may be used for magnetic components, is presented. [Figure 2] An example of a device architecture for manufacturing a printed circuit board that incorporates a cooling cavity according to this disclosure, which may be used for magnetic components, is shown. [Figure 3] An example of a printed circuit board incorporating a cooling cavity according to this disclosure is shown. [Figure 4a] An example of steps for manufacturing a printed circuit board that incorporates a cooling cavity according to this disclosure is shown. [Figure 4b] An example of another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 4c] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 4d] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 4e] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 4f]An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 4g] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 4h] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 5a] An example of steps for manufacturing a printed circuit board that incorporates a cooling cavity according to this disclosure is shown. [Figure 5b] An example of another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 5c] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 5d] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 5e] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 5f] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 5g] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 5h] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 6a] An example of steps for manufacturing a printed circuit board that incorporates a cooling cavity according to this disclosure is shown. [Figure 6b] An example of another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 6c]An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 6d] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 6e] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 6f] An example of yet another step for manufacturing a printed circuit board that incorporates the cooling cavity according to this disclosure is shown. [Figure 7] An example of a magnetic component comprising a printed circuit board that embeds a cooling cavity according to this disclosure is shown. [Figure 8] An example of a magnetic component comprising a printed circuit board that embeds a cooling cavity according to this disclosure is shown. [Figure 9] An example of a magnetic component comprising a printed circuit board that embeds a cooling cavity according to this disclosure is shown. [Modes for carrying out the invention]

[0025] Figure 1a shows a first example of an algorithm for manufacturing a printed circuit board that incorporates a cooling cavity according to the present disclosure, which may be used for magnetic components. As shown in Figure 1a, the algorithm includes steps S100 to S105.

[0026] This algorithm is performed by a device 20 for manufacturing a printed circuit board that embeds a cooling cavity according to this disclosure, which may be used in the magnetic components disclosed below with reference to Figure 2.

[0027] Device 20 may constitute a system for manufacturing a printed circuit board having an embedded cooling cavity.

[0028] This disclosure utilizes subtractive manufacturing, which is applicable to PCB technology. To achieve this objective, conventional prepreg materials are locally replaced with special soluble prepreg materials in a liquid or solvent. Conventional prepreg materials are insoluble materials. In other words, conventional insoluble prepreg materials do not dissolve in liquids or solvents that can dissolve soluble prepreg materials. Soluble prepreg materials are, for example, polyvinyl alcohol, butenediol vinyl alcohol copolymer, or inorganic salts in compressed form. The solvent may be water.

[0029] PCB PP (prepreg), or simply prepreg, is an abbreviation for pre-impregnated material and is also called preg. It consists of fiberglass cloth impregnated with resin. During the prepreg coating process, the resin is partially cured but not solidified. When the PCB is heated during the pressing process, the resin in the prepreg flows and adheres, bonding the PCB core to the copper foil or other materials.

[0030] An example of a component for filling the cooling cavity is shown in Figure 4a.

[0031] In Figure 4a, the substrate is composed of a soluble preg material 400 and two copper layers 401 and 402.

[0032] Specifically, the soluble preg material 400 is, for example, in the shape of a plate, with two copper layers 401 and 402 provided on both sides of the soluble preg material 400. In other words, the copper layer 401, the soluble preg material 400, and the copper layer 402 are arranged in the thickness direction of the soluble preg material 400. The thickness direction is equal to the vertical direction in Figures 4a to 4h.

[0033] In step S100, device 20 commands the realization of the electrical pattern of the magnetic component that will fill the cooling cavity.

[0034] In other words, device 20 may instruct a portion of the soluble preg material 400 to be machined to form a pattern, or device 20 may instruct a machining apparatus (e.g., a milling machine or a drilling machine) to machine a portion of the soluble preg material 400 to form a pattern. The system for manufacturing a printed circuit board having an embedded cooling cavity may include a machining apparatus.

[0035] The substrate is essentially perforated or milled to form mechanical vias (i.e., holes or slits), microvias, or patterns, depending on the thickness of the substrate.

[0036] An example is shown in Figure 4b.

[0037] In Figure 4b, apertures 410a to 410g are formed within a substrate composed of a soluble preg material 400 and two copper layers 401 and 402.

[0038] Apertures 410a to 410g penetrate the substrate in the thickness direction.

[0039] The pattern is formed with apertures 410a to 410g and the remaining soluble preg material 400.

[0040] In step S101, device 20 commands, for example, to plate apertures 410a to 410g with copper.

[0041] In other words, device 20 may instruct a pattern to be plated, or device 20 may instruct a plating apparatus to plate a pattern. The plating apparatus may include, for example, a plating bath. A system for manufacturing a printed circuit board having an embedded cooling cavity may include a plating apparatus.

[0042] Figure 4c shows an example of a copper-plated aperture 420.

[0043] The plating 420 is formed on the inner surface of the aperture. In other words, the plating 420 is formed on the side surface of the remaining soluble preg material 400 facing the aperture. In this case, the plating may be formed on the top surface of the copper layer 401 and the bottom surface of the copper layer 402.

[0044] In step S102, the device 20 is instructed to fill the aperture with an electrical insulating material, such as a resin. The resin may be, for example, TAIYO THP-100 DX1 proposed by TAIYO AMERICA®, or a resin provided by Micromax® CB100.

[0045] In other words, device 20 may command the plated pattern to be filled with an electrical insulating material, or device 20 may command the filling device to fill the plated pattern with an electrical insulating material. The filling device may be, for example, a coater, an injector, or a dispenser. A system for manufacturing a printed circuit board having an embedded cooling cavity may include a filling device.

[0046] Figure 4d shows an example where the aperture filling sections 430a to 430g are made of resin.

[0047] The resin (i.e., the electrical insulating material) does not dissolve in solvents that can dissolve the soluble preg material 400.

[0048] In step S103, the substrate obtained in step S102 is laminated in order to obtain the PCB shown in Figure 4e.

[0049] The substrate obtained in step S102 includes at least the filler portion 430a to 430g (i.e., electrical insulating material).

[0050] Figure 4e shows the substrate obtained in step S102, in which a layer 441 of conventional prepreg material and a copper layer 440 are laminated to the top of the substrate, and a layer 442 of conventional prepreg material and a copper layer 443 are laminated to the bottom of the substrate.

[0051] In other words, the copper layer 440, the prepreg material 441, the substrate, the prepreg material 442, and the copper layer 443 are arranged in the thickness direction.

[0052] In step S104, in order to form an inductive component consisting of conductive patterns 460a to 460l shown in Figure 4g, the copper layer is electrically connected to the plating layer fabricated in step S101 by vias 450 and 451 shown in Figure 4f, respectively, and the copper layer is chemically etched or perforated.

[0053] In other words, at least one of chemical etching and perforation is performed on the lamination (i.e., copper layers 440 and 443 and prepreg material 441 and 442) to make electrical connections via vias 450 and 451.

[0054] In step S105, the soluble prepreg is removed using a solvent.

[0055] In other words, device 20 may form a cooling cavity by instructing a solvent to remove the remaining soluble preg material, or device 20 may instruct a removal device to form a cooling cavity by instructing a solvent to remove the remaining soluble preg material. The removal device may include, for example, an injector that can supply a solvent. A system for manufacturing a printed circuit board having an embedded cooling cavity may include a removal device.

[0056] As a result, the plated apertures 470a to 470f and conductive patterns 460a to 460l shown in Figure 4h form an inductor.

[0057] Apertures 470a to 470f correspond to the cooling cavities. A portion of each of apertures 470a to 470f is surrounded by the plating created in step S101.

[0058] In other words, the printed circuit board includes an embedded cooling cavity, and at least a portion of the cooling cavity is surrounded by plating.

[0059] Figure 1b shows a second example of an algorithm for manufacturing a printed circuit board that incorporates a cooling cavity according to the present disclosure, which may be used for magnetic components. As shown in Figure 1b, the algorithm includes steps S120 to S126.

[0060] This algorithm is performed by a device 20 for manufacturing a printed circuit board that embeds a cooling cavity according to this disclosure, which may be used in the magnetic components disclosed below with reference to Figure 2.

[0061] In the second example of this algorithm, device 20 may perform the same functions as in the first example above.

[0062] This disclosure utilizes subtractive manufacturing, which is applicable to PCB technology. To achieve this objective, conventional prepreg materials are locally replaced with specially soluble prepreg materials in liquid or solvent form.

[0063] Preferably, the soluble material dissolves in a cooling liquid material used at least partially during cooling. For example, the cooling liquid material is water. For example, the soluble material is polyvinyl alcohol (PVA) that can withstand the lamination temperature. For example, the soluble material is a butenediol vinyl alcohol copolymer. For example, the soluble material is an inorganic salt such as NaCl in a compressed form.

[0064] PCB PP (prepreg), or simply prepreg, is an abbreviation for pre-impregnated material and is also called preg. It is a composite of glass fiber cloth impregnated with resin. During the prepreg coating process, the resin is partially cured but not solidified. When the PCB is heated during the pressing process, the resin in the prepreg flows and adheres, bonding the PCB core to the copper foil or other materials.

[0065] An example is shown in Figure 5a.

[0066] In Figure 5a, the substrate is composed of a soluble preg material 500 and two copper layers 501 and 502.

[0067] In step S120, device 20 commands the realization of the electrical pattern of the magnetic component that will fill the cooling cavity.

[0068] The substrate is basically perforated or milled with mechanical vias (i.e., holes or slits), microvias, or patterns, depending on the thickness of the substrate.

[0069] An example is shown in Figure 5b.

[0070] In Figure 5b, apertures 510a to 510d are formed within a substrate composed of a soluble preg material 500 and two copper layers 501 and 502.

[0071] Another example is shown in Figure 6a.

[0072] In Figure 6a, the conventional prepreg material 600 is locally replaced with a special soluble prepreg material 601.

[0073] The soluble preg material 601 is milled to form three cavities 602.

[0074] In other words, the soluble pre-formed material 601 is milled to form a winding cavity 602.

[0075] The substrate is intended to be placed inside the magnetic core 603.

[0076] In step S121, the device 20 is instructed to plate the apertures 510a to 510d or the milled pattern 602 with, for example, copper.

[0077] Figure 5c shows an example of a copper-plated aperture 520.

[0078] In step S122, the device 20 is instructed to fill the aperture with a conductive material, such as copper. An example shown in Figure 5d is the copper-filled aperture sections 530a to 530c.

[0079] Another example shown in Figure 6b illustrates a copper-plated and copper-filled filler 612.

[0080] The copper-filled sections can be filled using a plating apparatus, coater, injector, or dispenser.

[0081] In step S123, the device 20 commands the execution of at least one of the following: drilling and milling of the substrate.

[0082] The substrate is basically perforated or milled with mechanical vias (i.e., holes or slits), microvias, or patterns, depending on the thickness of the substrate.

[0083] An example is shown in Figure 5e.

[0084] In Figure 5e, apertures 540a to 540c are formed within a substrate composed of a soluble preg material 500 and two copper layers 501 and 502.

[0085] Another example is shown in Figure 6c, where the soluble preg material is milled to form a cavity 630 that separates the filled winding (i.e., the filled portion 612, see Figure 6b).

[0086] In the same step, cavity 630 is electroless plated to form an electroless plated cavity 640, as shown in Figure 6d.

[0087] In step S125, the device 20 is instructed to fill the aperture created in step S123 with an electrical insulating material such as resin. An example shown in Figure 5f shows the resin-filled aperture sections 550a to 550c.

[0088] Another example shown in Figure 6e illustrates a resin-filled aperture 651.

[0089] In step S126, the soluble prepreg is removed using a solvent.

[0090] An example is shown in Figure 6f.

[0091] As a result, the plated apertures, plated vias, and copper-filled vias form a conductive pattern with cooling channels created by the cavities exposed by the removed soluble prepreg, and these cooling channels also function as conductive patterns.

[0092] According to certain characteristics, the following: To obtain the PCB shown in Figure 5g, the obtained substrate is laminated. To form an inductive component consisting of a conductive pattern, the copper layer is electrically connected by vias 570 and 571 to the plating layer formed in step 121 shown in Figure 5h, and the copper layer is chemically etched or perforated. This will be executed.

[0093] Figure 5g shows the PCB obtained in step S126, in which a layer 561 of conventional prepreg material and a copper layer 560 are laminated to the top of the PCB, and a layer 562 of conventional prepreg material and a copper layer 563 are laminated to the bottom of the PCB.

[0094] Figure 2 shows an example of a device architecture for manufacturing a printed circuit board that incorporates a cooling cavity according to the present disclosure, which may be used for magnetic components.

[0095] A device 20 for manufacturing a printed circuit board that incorporates a cooling cavity according to the present disclosure, which may be used for magnetic components, has an architecture based on components connected to each other by a bus 201 and a processor 200 controlled by a program disclosed in Figure 1a or Figure 1b.

[0096] Bus 201 links the processor 200 to read-only memory (ROM) 242, random access memory (RAM) 203, and input / output interface (I / O I / F) 205.

[0097] Memory 203 contains registers intended to receive program variables and instructions related to the algorithm disclosed in Figure 1a or Figure 1b.

[0098] The read-only memory, or optionally the flash memory 242, contains program instructions related to the algorithm disclosed in Figure 1a or Figure 1b, and is loaded into the random access memory 203 when the device 20 is powered on. Alternatively, the program may be executed directly from the ROM 242.

[0099] The control performed by device 20 may be implemented in software by executing a set of instructions or a program by a programmable computing machine such as a PC (personal computer), a DSP (digital signal processor), or a microcontroller, or it may be implemented in hardware by a machine or dedicated component such as an FPGA (field-programmable gate array) or an ASIC (application-specific integrated circuit).

[0100] In other words, device 20 includes a circuit configuration, or a device including a circuit configuration, that causes device 20 to execute a program related to the algorithm disclosed in Figure 1a or Figure 1b.

[0101] In other words, device 20 may include at least memory (e.g., RAM 203) on which the program is loaded, and a processor 200 capable of executing the program and performing the functions described above.

[0102] Figure 3 shows an example of a printed circuit board incorporating the cooling cavity according to this disclosure.

[0103] In the example shown in Figure 3, the conventional prepreg material 31 is locally replaced with soluble prepreg material 32. The conventional prepreg material and the soluble prepreg material are milled to provide channels 33 plated with a conductive material such as copper to provide a conductive pattern. After the soluble prepreg is melted, a liquid or gas is injected into the channels formed by the molten soluble prepreg to provide a cooling cavity.

[0104] Figure 7 shows an example of a magnetic component comprising a printed circuit board that embeds a cooling cavity according to the present disclosure.

[0105] In the example in Figure 7, the printed circuit board embedding the cooling cavity 701 is used solely as a cooler positioned closest to the primary winding conductor 700 and the secondary winding conductor 702, more precisely between the primary and secondary windings. The cooling cavity does not allow any magnetic device current to pass through. However, because the cooling cavity is made entirely or partially of conductive material, eddy currents are generated within the cooling cavity due to the presence of a nearby magnetic field generated by the magnetic device. The via density can also be adjusted to control the pressure drop of the pump device and customize the effective cooling.

[0106] Since the printed circuit board with the cooling cavity 701 embedded is used as a cooler, it is not necessary to provide the copper layers 440 and 443 and prepreg materials 441 and 442 shown in Figure 4e, or the copper layers 560 and 563 and prepreg materials 561 and 562 shown in Figure 5g, within it.

[0107] Figure 8 shows an example of a magnetic component comprising a printed circuit board that embeds a cooling cavity according to the present disclosure.

[0108] In the example in Figure 8, the printed circuit board embedding the cooling cavities 800 and 803 is used solely as a cooler positioned closest to the primary winding conductor 801 and the secondary winding conductor 802, more precisely at the top of the primary winding 801 and the bottom of the secondary winding 803. The cooling cavities do not allow any magnetic device current to pass through. However, because the cooling cavities are made entirely or partially of conductive material, eddy currents are generated within the cooling cavities due to the presence of a nearby magnetic field generated by the magnetic device. The via density can also be adjusted to control the pressure drop of the pump device and customize the effective cooling.

[0109] Since a printed circuit board with cooling cavities 800 and 803 embedded is used as a cooler, it is not necessary to provide the copper layers 440 and 443 and prepreg materials 441 and 442 shown in Figure 4e, or the copper layers 560 and 563 and prepreg materials 561 and 562 shown in Figure 5g, within it.

[0110] Figure 9 shows an example of a magnetic component comprising a printed circuit board that embeds a cooling cavity according to the present disclosure.

[0111] In the example shown in Figure 9, printed circuit boards that embed cooling cavities 900 and 901, respectively, are used as the primary and secondary windings.

[0112] Naturally, many modifications can be made to the embodiments of this disclosure described above within the scope of this disclosure.

[0113] In the embodiments described above, soluble preg materials 400, 500, and 601 were used, but the disclosure is not limited thereto. Instead of soluble preg materials 400, 500, or 601, soluble materials such as polyvinyl alcohol (PVA), butenediol vinyl alcohol copolymer, or inorganic salts such as compressed NaCl may be used. The soluble material does not have to contain glass fiber cloth.

Claims

1. A method for manufacturing a printed circuit board having an embedded cooling cavity, wherein the method is The process involves machining a portion of the soluble material to form a pattern, Plating the aforementioned pattern, Filling the plated pattern with an electrical insulating material, The remaining soluble material is removed using a solvent to form a cooling cavity, Methods that include...

2. The above method, before removing the remaining soluble material using the solvent, Machining another part of the aforementioned soluble material to form a different pattern, Plating the aforementioned other pattern, Filling the aforementioned plated pattern with a conductive material, The method according to claim 1, further comprising:

3. The method described above is Laminating a substrate containing at least the aforementioned electrical insulating material, Inserting the laminated substrate into the magnetic component, The method according to claim 1 or 2, further comprising:

4. The method according to claim 3, further comprising performing at least one of chemical etching and perforation on the lamination to make an electrical connection before inserting the laminated substrate into the magnetic component.

5. The method according to any one of claims 1 to 4, wherein the obtained printed circuit board is inserted between the conductors of the primary winding and the conductors of the secondary winding of a transformer.

6. The method according to any one of claims 1 to 4, wherein the two obtained printed circuit boards are positioned on the top of the conductor of the primary winding and the bottom of the conductor of the secondary winding of the transformer.

7. The method according to any one of claims 1 to 4, wherein two obtained printed circuit boards, each inserted into a magnetic component, are stacked, one of the obtained printed circuit boards functions as the primary winding of a transformer, and the other obtained printed circuit board functions as the secondary winding of the transformer.

8. A system for manufacturing a printed circuit board having an embedded cooling cavity, wherein the system is To instruct a machine to form a pattern by machining a portion of the soluble material, The instruction to plate the aforementioned pattern, The instruction to fill the plated pattern with an electrical insulating material, The command is to remove the remaining soluble material using a solvent to form a cooling cavity, A system configured to perform the following actions.

9. It comprises an embedded cooling cavity, at least a portion of which is surrounded by plating. Printed circuit board.

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