Heat dissipation bracket and electronic device including same

Abstract

The present invention relates to a heat dissipation bracket for fixing a component while performing a heat dissipation function, and an electronic device including same. The present invention provides a heat dissipation bracket and an electronic device including same. The heat dissipation bracket included in the electronic device comprises: a plate-shaped bracket body; an electronic element contact part protruding from a first surface of the bracket body; and a heat dissipation fin spaced apart from the electronic element contact part and formed on the first surface of the bracket body, wherein the electronic element contact part is in contact with an electronic element mounted on a circuit board of the electronic device to enable heat transfer therebetween.

Description

Heat dissipation bracket and electronic device including the same

[0001] The present invention relates to a heat dissipation bracket that fixes a component while performing a heat dissipation function, and an electronic device including the same.

[0002] Small electronic devices are widely used for skin care, massage, and the like.

[0003] For example, Korean Patent Publication No. 10-2024-0161894 discloses a beauty device that includes a head portion that generates at least one of ultrasound, microcurrent, EP (Electroporation), and LED (light emitting diode), and applies stimulation to the skin according to a selected mode.

[0004] Published Patent Application No. 10-2022-0139745 discloses a skin beauty care device that performs various functions in combination, including a main circuit board mounted inside a main body case that supplies microcurrent, generates micro-vibrations, and generates low and high frequencies.

[0005] Such electronic devices consume a significant amount of energy and generate heat for the operation and control of electronic components. Additionally, to achieve product miniaturization, it is necessary to accommodate a large number of components within a small space.

[0006] However, conventional technology has a problem in that it does not provide a method to effectively dissipate heat generated during the operation of electronic devices and to save product installation space.

[0007] The present invention aims to provide a heat dissipation bracket for providing a component mounting space and effectively dissipating heat generated from an electronic device, and an electronic device including the same.

[0008] The present invention provides a heat dissipation bracket for an electronic device, comprising: a plate-shaped bracket body; an electronic component contact portion protruding from a first surface of the bracket body; and a heat dissipation fin formed on the first surface of the bracket body and spaced apart from the electronic component contact portion, wherein the electronic component contact portion contacts an electronic component mounted on a circuit board of the electronic device in a manner capable of heat transfer.

[0009] In one embodiment, a component receiving portion is concavely formed on a second surface opposite to the first surface of the bracket body.

[0010] In addition, a battery that supplies power to the electronic device may be accommodated in the above-mentioned component receiving portion.

[0011] In one embodiment, a thermal pad, a heat dissipation adhesive, or a heat dissipation grease may be provided on the end surface of the electronic device contact portion.

[0012] In one embodiment, a substrate mounting portion for mounting a sub-circuit board may be formed on one side of the bracket body.

[0013] In addition, a substrate fixing hole for screw-fixing the sub-circuit board may be formed in the substrate mounting portion.

[0014] In addition, the substrate mounting portion may be positioned in a direction perpendicular to the first surface of the bracket body.

[0015] In one embodiment, a bracket fixing portion for fixing the bracket body may be formed on one side of the bracket body.

[0016] In one embodiment, the heat dissipation fin may include a plurality of bar-shaped fins.

[0017] In one embodiment, the heat dissipation fin may include a plurality of plate-shaped wave heat dissipation fins having waves.

[0018] In addition, the lower portion of the wave heat dissipation fin that is closer to the first surface may be formed to be thicker than the upper portion.

[0019] The present invention provides an electronic device comprising: a housing; a head portion provided at one end of the housing; a circuit board provided inside the housing; and the heat dissipation bracket described above.

[0020] In one embodiment, the first surface of the bracket body is positioned facing the circuit board, and the electronic element is mounted on one surface of the circuit board facing the first surface.

[0021] In addition, the heat dissipation fins and the circuit board may be arranged in a spaced-apart state.

[0022] According to the present invention, while providing a space for mounting components, it has the effect of effectively dissipating heat generated from electronic devices.

[0023] FIG. 1 is a perspective view illustrating an example of an electronic device to which a heat dissipation bracket according to one embodiment of the present invention is applied.

[0024] FIG. 2 is an exploded perspective view of an electronic device to which a heat dissipation bracket according to one embodiment of the present invention is applied.

[0025] FIG. 3 is an exploded perspective view from another direction of an electronic device to which a heat dissipation bracket according to one embodiment of the present invention is applied.

[0026] FIG. 4 is a cross-sectional view (cross-section in the A-A' direction of FIG. 1) of an electronic device to which a heat dissipation bracket according to one embodiment of the present invention is applied.

[0027] FIG. 5 is a diagram showing the coupling relationship between a heat dissipation bracket according to one embodiment of the present invention and other parts of an electronic device.

[0028] FIGS. 6 and FIGS. 7 are perspective views of a heat dissipation bracket according to one embodiment of the present invention.

[0029] FIG. 8 is a perspective view in which a battery and an auxiliary substrate are combined in a heat dissipation bracket according to one embodiment of the present invention.

[0030] FIG. 9 is an exploded perspective view of a heat dissipation bracket, a battery, and an auxiliary substrate according to one embodiment of the present invention.

[0031] FIG. 10 is a perspective view of a heat dissipation bracket according to another embodiment of the present invention.

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, it should be noted that in assigning reference numerals to the components of each drawing, the same components are given the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the present invention, if it is determined that a detailed description of related known components or functions may obscure the essence of the present invention, such detailed description is omitted. Additionally, while preferred embodiments of the present invention will be described below, the technical concept of the present invention is not limited or restricted thereto and can be modified and implemented in various ways by those skilled in the art.

[0033] FIG. 1 is a perspective view illustrating an example of an electronic device to which a heat dissipation bracket according to an embodiment of the present invention is applied. FIG. 2 is an exploded perspective view of an electronic device to which a heat dissipation bracket according to an embodiment of the present invention is applied, and FIG. 3 is an exploded perspective view from another direction of an electronic device to which a heat dissipation bracket according to an embodiment of the present invention is applied. FIG. 4 is a cross-sectional view (cross-section in the A-A' direction of FIG. 1) of an electronic device to which a heat dissipation bracket according to an embodiment of the present invention is applied. In addition, FIG. 5 is a diagram showing the coupling relationship between a heat dissipation bracket according to an embodiment of the present invention and other parts of an electronic device.

[0034] A heat dissipation bracket (50) according to one embodiment of the present invention is embedded in an electronic device (1) and is characterized by performing heat dissipation of a heat-generating element in addition to the function of a bracket for mounting other parts.

[0035] The electronic device (1) may be a small electronic device for skin care or massage, but the heat dissipation bracket (50) according to the present invention is not limited to such a skin care device or massage device. However, in the following description, the electronic device (1) is described as a skin care device.

[0036] The electronic device (1) includes a housing (3), a head part (7) provided at one end of the housing (3), a circuit board (10, 40) provided inside the housing (3), a battery (20) that supplies operating power to the electronic device (1), and a heat dissipation bracket (50).

[0037] The housing (3) forms the exterior of the electronic device (1), and the housing (3) may be formed by combining a first housing (3a) and a second housing (3b). The first housing (3a) may be provided so that a part of an input part (5), such as a switch for controlling the operation of the electronic device (1), is exposed.

[0038] The head portion (7) can be in contact with the user's skin to apply microcurrent, ultrasound, or vibration to the skin. For example, the head portion (7) may be equipped with an ultrasound generating portion (8) that generates ultrasound.

[0039] The first circuit board (10) may include an electronic circuit that operates the electronic device (1) according to the input of the input section (5). In one embodiment, the circuit board (10) may be fixed inside the first housing (3a). Additionally, the housing (3) may further include a second circuit board (40), and the second circuit board (40) may be fixed inside the second housing (3b).

[0040] An electronic component (12) that generates relatively large amounts of heat during operation may be mounted on the first circuit board (10). In one embodiment, the electronic component (12) may be provided on one side of the first circuit board (10) facing the heat dissipation bracket (50).

[0041] The battery (20) supplies power for the operation of the electronic device (1), and in one embodiment, the battery (20) may be a rechargeable battery such as a lithium-ion battery. The battery (20) may further include a battery control board (22) having a circuit for controlling the charging and discharging of the battery. In one embodiment, the battery control board (22) may be provided coupled to one side of the battery (20), but in the embodiment of the present invention, the battery control board (22) may be provided within the housing (3) separately from the battery (20), or the circuit for battery control may be provided on the first circuit board (10) or the second circuit board (40).

[0042] The heat dissipation bracket (50) may include a bracket body (52), an electronic component contact portion (54) protruding from a first surface of the bracket body (52), a heat dissipation fin (56) formed on the first surface of the bracket body (52), a bracket fixing portion (58) provided on one side of the bracket body (52), and a component receiving portion (62) formed on a second surface of the bracket body (52). Additionally, the heat dissipation bracket (50) may further include a substrate mounting portion (60) on which a sub-circuit board (30) can be mounted. In the above description, the first surface of the bracket body (52) is a surface facing the first circuit board (10), and the second surface refers to the opposite surface of the first surface.

[0043] The heat dissipation bracket (50) can be made of a metal material, for example, aluminum, and can be manufactured by a metal processing method such as a press, casting method, or mechanical cutting.

[0044] Referring to FIGS. 4 and 5, the electronic component contact portion (54) of the heat dissipation bracket (50) can be in contact with the electronic component (12) to transfer heat. In one embodiment, a thermal pad (14) may be provided between the electronic component contact portion (54) and the electronic component (12). The thermal pad (14) may be made of a material having high thermal conductivity and excellent electrical insulation properties, for example, silicone. In some cases, instead of the thermal pad (14), a thermal glue or thermal grease may be applied to the upper surface of the electronic component contact portion (54).

[0045] Heat generated from the electronic element (12) is transferred to the heat dissipation bracket (50) through the electronic element contact portion (54) and is dissipated through the heat dissipation fins (56) of the heat dissipation bracket (50), thereby preventing an excessive rise in temperature of the electronic element (12). The end of the heat dissipation fins (56) and the first circuit board (10) are spaced apart, and the heat released through the heat dissipation fins (56) can propagate through the internal space of the housing (3) of the electronic device (1) and be dissipated through the housing (3).

[0046] Although cooling can be achieved by attaching a separate heat sink to electronic components that generate a lot of heat, in the case of small electronic devices, there is a problem that it is difficult to apply because the structure for arranging and fixing the separate heat sink becomes complex and the heat sink itself occupies space. In this regard, the present invention has the advantage of saving space and improving heat dissipation performance by having the heat dissipation bracket (50) perform a heat dissipation function by contacting the electronic component (12) that generates a lot of heat, in addition to the function of a bracket for mounting other components.

[0047] FIGS. 6 and FIGS. 7 are perspective views of a heat dissipation bracket according to one embodiment of the present invention.

[0048] As described above, the heat dissipation bracket (50) includes a bracket body (52), an electronic component contact portion (54) protruding from a first surface of the bracket body (52), a heat dissipation fin (56) formed on the first surface of the bracket body (52), a bracket fixing portion (58) provided on one side of the bracket body (52), and a component receiving portion (62) formed on a second surface of the bracket body (52). Additionally, the heat dissipation bracket (50) further includes a substrate mounting portion (60) on which a sub-circuit board (30) can be mounted, and an additional bracket fixing portion (53) for fixing the heat dissipation bracket (50) to a second housing (3b) may be further provided.

[0049] The bracket body (52) may be in the shape of a plate of a predetermined thickness, and a component receiving portion (62) is concavely formed on the second surface of the bracket body (52).

[0050] The electronic component contact portion (54) is formed protruding from the first surface of the bracket body (52), and the electronic component contact portion (54) may be provided in the approximately central part of the first surface of the bracket body (52). The end of the electronic component contact portion (54) may be formed as a flat surface, and in some cases, a plurality of protrusions or surface treatments may be performed on the end of the electronic component contact portion (54) to increase the contact area with the thermal pad (14). Meanwhile, in the implementation of the present invention, the position of the electronic component contact portion (54) may be changed according to the mounting position within the housing (3) of the heat dissipation bracket (50) and the position of the electronic component (12) of the first circuit board (10).

[0051] The heat dissipation fins (56) may be disposed on the first surface of the bracket body (52). In one embodiment, as shown in FIG. 6, the heat dissipation fins (56) may be provided with a plurality of bar-shaped fins spaced apart from each other. The shape and arrangement of these heat dissipation fins (56) may be modified in various ways to improve heat dissipation performance. The thickness and length of the heat dissipation fins (56) and the spacing between each heat dissipation fin (56) can be appropriately selected considering the airflow and heat dissipation effect inside the housing (3).

[0052] In one embodiment, in order to fix the heat dissipation bracket (50) to the housing (3), the heat dissipation bracket (50) may be provided with a first bracket fixing part (58) and a second bracket fixing part (53). The first bracket fixing part (58) is formed protruding from the side of the bracket body (52) and includes a first fixing hole (58a). The second bracket fixing part (53) is formed in a shape extending to one side of the bracket body (52) and includes a second fixing hole (53a).

[0053] The substrate mounting portion (60) is positioned perpendicular to one end of the bracket body (52) and may include a substrate fixing hole (61) for screw-fixing the sub-circuit board (30). In one embodiment, an electronic component that generates a lot of heat may be mounted on the sub-circuit board (30), and the heat generated from the electronic component through the sub-circuit board (30) may be transferred to the heat dissipation bracket (50) to dissipate heat.

[0054] FIG. 8 is a perspective view of a battery and an auxiliary substrate combined with a heat dissipation bracket according to one embodiment of the present invention, and FIG. 9 is an exploded perspective view of the heat dissipation bracket, battery, and auxiliary substrate according to one embodiment of the present invention.

[0055] Referring to FIGS. 8 and 9, a battery (20) can be accommodated in the component receiving portion (62) of the heat dissipation bracket (50). By accommodating the battery (20) in the component receiving portion (62) of the heat dissipation bracket (50), a mounting space for the battery (20) is provided, and the internal space of the electronic device (1) can be utilized efficiently.

[0056] FIG. 10 is a perspective view of a heat dissipation bracket according to another embodiment of the present invention.

[0057] Referring to FIG. 10, the heat dissipation bracket (50') is provided with a plate-shaped wave-shaped heat dissipation fin (70) having a wave. Air flow is effectively achieved through the shape of the wave-shaped heat dissipation fin (70) and the space between the wave-shaped heat dissipation fins (70), and an improved heat dissipation effect can be achieved by providing a larger surface area compared to a straight-shaped heat dissipation fin.

[0058] In one embodiment, the thickness of the lower portion of the wave-shaped heat dissipation fin (70) that is close to the first surface of the bracket body (52) may be set to be greater than the thickness of the upper portion. When a user holds and uses the electronic device (1) with their hand, the electronic device (1) may move continuously. Due to the structure of the wave-shaped heat dissipation fin (70) in which the lower portion is thicker than the upper portion, air flow through the wave-shaped heat dissipation fin (70) is improved, and heat dissipation efficiency may be improved by generating vortices due to the wave shape.

[0059] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications, changes, and substitutions within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments and accompanying drawings. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

[0060] <Explanation of Symbols>

[0061] 1 : Electronic device 3 : Housing

[0062] 5 : Input section 7 : Head section

[0063] 10: First circuit board 12: Electronic component

[0064] 14 : Thermal pad 20 : Battery

[0065] 30: Sub-circuit board 40: Second circuit board

[0066] 50, 50' : Thermal bracket 52 : Bracket body

[0067] 54: Electronic component contact part 56: Heat dissipation fin

[0068] 58 : Bracket fixing part 60 : Circuit board mounting part

[0069] 62 : Component receiving section 70 : Wave-shaped heat dissipation fins

Claims

1. In a heat dissipation bracket provided in an electronic device, Plate-shaped bracket body; An electronic component contact portion protruding from the first surface of the bracket body; and A heat dissipation fin formed on the first surface of the bracket body, spaced apart from the electronic component contact portion; Includes, A heat dissipation bracket characterized by the above electronic component contact portion making contact with an electronic component mounted on a circuit board of the electronic device in a manner that allows for heat transfer.

2. In Paragraph 1, A heat dissipation bracket characterized by having a component receiving portion formed concavely on a second surface opposite to the first surface of the bracket body.

3. In Paragraph 2, A heat dissipation bracket characterized by the fact that a battery supplying power to the electronic device is accommodated in the above-mentioned component receiving portion.

4. In Paragraph 1, A heat dissipation bracket characterized by having a thermal pad, heat dissipation adhesive, or heat dissipation grease provided on the end surface of the electronic component contact portion.

5. In Paragraph 1, A heat dissipation bracket characterized by having a board mounting portion formed on one side of the bracket body for mounting a sub-circuit board.

6. In Paragraph 5, A heat dissipation bracket characterized by having a substrate fixing hole formed in the substrate mounting portion for screw-fixing the sub-circuit board.

7. In Paragraph 5, A heat dissipation bracket characterized in that the substrate mounting portion is arranged in a direction perpendicular to the first surface of the bracket body.

8. In Paragraph 1, A heat dissipation bracket characterized by having a bracket fixing portion formed on one side of the bracket body to fix the bracket body.

9. In Paragraph 1, A heat dissipation bracket characterized by the above heat dissipation fins including a plurality of bar-shaped fins.

10. In Paragraph 1, A heat dissipation bracket characterized by including a plurality of plate-shaped wave heat dissipation fins having waves in the heat dissipation fins.

11. In Paragraph 10, A heat dissipation bracket characterized in that the wave heat dissipation fin above is formed such that the lower portion closer to the first surface is thicker than the upper portion.

12. Housing; A head portion provided at one end of the above housing; A circuit board provided inside the above housing; and An electronic device comprising a heat dissipation bracket according to any one of claims 1 to 11.

13. In Paragraph 12, An electronic device characterized in that the first surface of the bracket body is positioned facing the circuit board, and the electronic component is mounted on one surface of the circuit board facing the first surface.

14. In Paragraph 13, An electronic device characterized in that the heat dissipation fins and the circuit board are spaced apart.

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