Electronic component mounting apparatus, electronic component mounting method, and electronic component manufacturing method

Abstract

An electronic component mounting apparatus and an electronic component mounting method that achieve both productivity and product quality. [Solution] An electronic component mounting device for holding an electronic component and mounting it on a mounted member includes a mounting head that holds the electronic component and transports it to the mounted member, a first direction driver to which the mounting head is attached and that reciprocates the mounting head in a first direction, a driving force applying means that applies a driving force to the first direction driver, a temperature detection means that detects the temperature of at least one of the mounting head and the first direction driver at a set temperature detection timing, a displacement amount acquisition means that acquires the positional relationship in the first direction between the mounting head and the mounted member based on the temperature detected by the temperature detection means, and a correction means that corrects the movement amount of the mounting head in the first direction. If the positional relationship acquired by the displacement amount acquisition means exceeds a first position threshold, the movement amount of the mounting head in the first direction is corrected, and if it does not exceed the first position threshold, the movement amount is not corrected.

Description

[Technical field]

[0001] The present invention relates to an electronic component mounting apparatus, an electronic component mounting method, and an electronic component manufacturing method. [Background technology]

[0002] An electronic component mounting apparatus (chip mounting apparatus) generally picks up a chip at a pickup position, transports the picked up chip to a bonding position, and bonds the chip at the bonding position.

[0003] During operation, the position (height) of the mounting head holding the chip at the pickup position and bonding position changes due to changes in the ambient temperature over time after the electronic component mounting apparatus starts operating.

[0004] If there is such a change, there is a risk that the chip cannot be picked up accurately at the pick-up position, and that the chip cannot be bonded accurately to the mounting portion at the bonding position.

[0005] That is, the Z-direction drive body (vertical drive body) supporting the mounting head expands due to temperature changes, causing the mounting head to be positioned lower on the bonding position or pick-up position than in the initial state compared to the initial state of operation. However, the amount of descent of the mounting head when bonding from the bonding position is constant. For this reason, it will be lowered to a position lower than the normal position, which may cause cracks or the like in the chip. The same is true for the pick-up operation. That is, the amount of descent of the mounting head when picking up from the pick-up position is constant, and it will be lowered to a position lower than the normal position.

[0006] In other words, this reduces the accuracy of the vertical movement when picking up and mounting components, and degrades product quality. Therefore, it is necessary to temporarily stop the component mounting device and correct the vertical movement amount according to the displacement of the mounting head.

[0007] Therefore, in the past, there has been a component mounting device (Patent Document 1) that is equipped with a control device that controls a descent amount correction operation that corrects the descent amount of the work head based on the results of measuring the descent amount of the work head, and a correction setting device that sets how many times the component mounting operation is performed. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] JP 2009-246285 A Summary of the Invention [Problem to be solved by the invention]

[0009] However, correcting the amount of lowering of the work head according to the number of times component mounting work is performed in advance can result in the following two problems. First, if the preset correction interval is too frequent, inspections will be performed frequently even when correction is not necessary, resulting in waste. Second, if the preset correction interval is too infrequent, the time spent processing without making corrections will be long even though corrections are necessary, resulting in a deterioration in product quality.

[0010] In view of the above, the present invention provides an electronic component mounting apparatus and an electronic component mounting method that achieve both productivity and product quality. [Means for solving the problem]

[0011] The electronic component mounting device of the present invention is an electronic component mounting device for holding an electronic component and mounting it on a mounted member, comprising: a mounting head that holds the electronic component and transports the electronic component to the mounted member; a first direction driver to which the mounting head is attached and that reciprocates the mounting head in a first direction; and a driving force applying means that applies a driving force to the first direction driver. The mounting head includes a temperature detection means for detecting the temperature of at least one of the mounting head and the first direction driver at a set temperature detection timing, a displacement amount acquisition means for acquiring the displacement amount of the mounting head based on the temperature detected by the temperature detection means, and a correction means for correcting the movement amount of the mounting head in the first direction based on the displacement amount.

[0012] According to the electronic component mounting device of the present invention, a temperature detection timing changing means is provided for reducing the interval between preset temperature detection timings, thereby reducing the need to temporarily suspend operation and adjust the amount of movement of the mounting head during operation. Effect of the Invention

[0013] The present invention can reduce the need to temporarily suspend operation to adjust the amount of movement of the mounting head during operation, thereby improving productivity. Also, during operation (driving), the position of the mounting head can be restricted to within an allowable range relative to the normal position, thereby suppressing the occurrence of quality defects in products. [Brief description of the drawings]

[0014] [Figure 1] 1 is a block diagram showing an overall configuration of a first electronic component mounting apparatus according to the present invention. [Diagram 2] 1 is a simplified diagram of a main portion of an electronic component mounting apparatus. [Diagram 3] 11 is a simplified diagram showing the movement of a mounting head. [Figure 4] 11A and 11B are explanatory diagrams showing the positional relationship between the mounting head and a mounted member at the beginning of operation and the positional relationship between the mounting head and a mounted member when the mounting head is misaligned; [Diagram 5] FIG. 4 is a flowchart showing the basic operation of the first electronic component mounting apparatus. [Figure 6] FIG. 4 is a process diagram of a basic operation using the first electronic component mounting apparatus. [Figure 7] FIG. 11 is a flowchart illustrating a case where a second temperature threshold value for the temperature difference is used. [Figure 8] FIG. 11 is a flowchart illustrating a case where a first temperature threshold and a second temperature threshold are used. [Figure 9] 5A is a graph showing the relationship between the amount of displacement and time, and FIG. 5B is a graph showing the relationship between the amount of displacement and temperature difference. [Figure 10] FIG. 4 is a block diagram showing the overall configuration of a second electronic component mounting apparatus according to the present invention. [Figure 11] FIG. 11 is a flowchart showing the basic operation of the second electronic component mounting apparatus. [Figure 12] FIG. 11 is a process diagram of a basic operation of the second electronic component mounting apparatus. [Figure 13] FIG. 11 is a flowchart illustrating a case where a second position threshold is used. [Figure 14] FIG. 11 is a flowchart illustrating a case where a first position threshold and a second position threshold are used in a basic operation. [Figure 15] 13 is a simplified diagram of an electronic component mounting apparatus having a Z-direction displacement measuring stage. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

[0016] 1 is a block diagram showing the overall configuration of a first electronic component mounting apparatus according to an embodiment, which is used to mount a mounting member, which is an electronic component, on a mounted member. Here, the electronic component is, for example, a semiconductor (semiconductor chip), but is not limited to a semiconductor chip and may be an electronic component such as a resistor element or a capacitor. The mounted member may be a printed circuit board, a flexible circuit board, a lead frame, or the like.

[0017] The electronic component mounting device includes a mounting head 3 that holds a mounting member (in this case, a semiconductor chip 1 (see FIG. 3)) and transports the mounting member (semiconductor chip 1) to a mounted member (in this case, a substrate 2 (see FIG. 3)), a Z-direction driver 4 to which the mounting head 3 is attached and that reciprocates the mounting head 3 in a first direction, a driving force applying means 5 that applies a driving force to the Z-direction driver 4, a temperature detection means 6 that detects the temperature of at least one of the mounting head 3 and the Z-direction driver 4, and a displacement amount acquisition means 7 that acquires the positional relationship in the Z direction between the mounting head 3 and the mounted member (substrate 2) based on the temperature detected by the temperature detection means 6. In this embodiment, the first direction is the Z direction, which is the vertical direction. For this reason, in this embodiment, the first direction may be called the Z direction.

[0018] Specifically, an electronic component mounting device as shown in Fig. 2 is used. The Z-direction driver 4 is attached to a base material (support member 11) via a guide mechanism 10, and the mounting head 3 is also attached to the lower end of the Z-direction driver 4. In this case, the mounting head 3 is provided with a collet 12 that adsorbs the semiconductor chip 1.

[0019] The driving force applying means 5 includes a Z-axis motor (not shown) and a conversion mechanism (e.g., a ball screw mechanism) (not shown) that converts the rotational driving force of the motor into vertical movement. The guide mechanism 10 is configured with a linear guide mechanism. That is, as shown in FIG. 2, the linear guide mechanism includes a Z-axis guide rail 15 extending in the vertical direction (Z direction) and a Z-axis slider 14 that reciprocates along the vertical direction (Z direction) relative to the Z-axis guide rail 15. The Z-direction driver 4 is connected to the Z-axis slider 14. That is, the Z-axis slider 14 reciprocates along the vertical direction (Z direction) relative to the Z-axis guide rail 15 by the driving force applying means 5. This causes the Z-direction driver 4 to reciprocate in the Z direction, which is the vertical direction.

[0020] The Z-axis guide rail 15 is supported by the support member 11. The support member 11 can be reciprocated in the X-direction (one horizontal direction) via the X-direction driver 16, and can be reciprocated in the Y-direction (horizontal direction perpendicular to the X-direction) via the Y-direction driver 17. The X-direction driver 16 reciprocates in the X-direction via an X-direction driving force imparting means (not shown). The X-direction driving force imparting means includes an X-axis motor (not shown) and a conversion mechanism (e.g., a ball screw mechanism) (not shown) that converts the rotational driving force of the X-axis motor into reciprocating motion in the X-direction. At this time, a guide mechanism 18 is interposed between the X-direction driver 16 and the base 20. The guide mechanism 18 is formed of a linear guide mechanism, and includes an X-axis guide rail 21 that is arranged on the base 20 and extends in the horizontal direction (X-direction), and an X-axis slider 22 that reciprocates (slides) along the horizontal direction (X-direction) relative to the X-axis guide rail 21. The X-axis slider 22 reciprocates in the horizontal direction (X direction) by being driven by the X-axis motor, and the X-direction driver 16 attached to the X-axis slider 22 reciprocates in the horizontal direction (X direction). This causes the Z-direction driver 4 to reciprocate in the horizontal direction (X direction).

[0021] The Y-direction driving body 17 reciprocates in the Y direction via a Y-direction driving force applying means (not shown). The Y-direction driving force applying means includes a Y-axis motor (not shown) and a conversion mechanism (e.g., a ball screw mechanism) (not shown) that converts the rotational driving force of the Y-axis motor into reciprocating motion in the Y direction. At this time, a guide mechanism 23 is interposed between the X-direction driving body 16 and the Y-direction driving body 17. The guide mechanism 23 is formed of a linear guide mechanism, and includes a Y-axis guide rail 25 attached to the X-direction driving body 16 and extending in the horizontal direction (Y direction), and a Y-axis slider 26 fitted into the Y-axis guide rail 25. The Y-axis slider 26 is attached to the Y-direction driving body 17, and the Y-axis slider 26 reciprocates in the Y direction via the Y-direction driving force applying means. Therefore, the Y-direction driving body 17 reciprocates in the Y direction due to the application of driving force from the Y-direction driving force applying means.

[0022] Therefore, by performing the operation shown in FIG. 3, the electronic component mounting apparatus can pick up, for example, the chip 1 on the XYθ table and supply it onto the substrate 2, which is the member to be mounted.

[0023] That is, on the pickup position P, the collet 12 is moved (lowered) in the direction of the arrow B, and the chip 1 on the table (XYθ table) is adsorbed to the collet 12. At this time, the chip 1 to be picked up is pushed up from below by the push-up means. Next, the collet 12 is raised along the direction of the arrow A, and then moved horizontally along the direction of the arrow E to position it on the bonding position Q. Then, the chip 1 is lowered along the vertical direction as shown by the arrow D. Then, the adsorption of the chip 1 by the collet 12 is released at the lowest point, and the chip 1 is mounted. After mounting, the collet 12 is raised by the above-mentioned downward amount in the direction of the arrow C, and then moved horizontally in the direction of the arrow F to return to the pickup position P, and the next chip 1 is picked up. Thereafter, the above-mentioned processes are performed sequentially, and all the chips 1 on the wafer sheet are mounted on the mounting portions (island portions) on the bonding position Q.

[0024] As shown in FIG. 1, the electronic component mounting apparatus in the embodiment is provided with a transport means 30 for transporting the mounting head 3. The transport means 30 can be constituted by the above-mentioned X-direction driver 16, the X-direction driving force applying means, the Y-direction driver 17, and the Y-direction driving force applying means, etc.

[0025] Incidentally, in this mounting device, as described above, all the chips 1 on the wafer sheet are mounted on the mounting portion (island portion) on the bonding position Q. For this reason, as time passes, the Z-direction driver 4 thermally expands due to heat generation from the driving motor of the driving force applying means 5. That is, in the initial stage of operation, the Z-direction driver 4 that is not thermally expanded as shown by N in FIG. 4 has the collet 12 descend (movement) to the substrate set to dimension a. However, due to thermal expansion of the Z-direction driver 4, the position of the collet 12 descends as shown by N1 in FIG. 4, and the distance between the collet 12 and the substrate 2 becomes closer. For this reason, the collet 12 descends (movement) to a'. Therefore, it becomes necessary to correct the movement amount a to a'. In this case, the displacement amount (thermal displacement amount) b due to expansion becomes aa'.

[0026] Therefore, when such thermal expansion occurs, it is necessary to adjust the amount of descent of the collet 12 and the Z-direction driver 4. However, when making an adjustment, the bonding operation must be temporarily stopped before making the adjustment. Even if the adjustment is made after the operation is temporarily stopped, there is a risk that the adjustment will need to be made again when the operation is resumed. In other words, it is necessary to mount all the chips 1 on the wafer sheet on the mounting portions (island portions) on the bonding positions Q, but if such an adjustment operation is performed after the operation is temporarily stopped while the chips 1 are being bonded, productivity will be reduced.

[0027] Therefore, in order to minimize the number of times such bonding operations are paused and improve productivity, as shown in FIG. 1, in addition to the temperature detection means 6 and the displacement amount acquisition means 7, there are provided a temperature detection timing setting means 31A, a temperature detection timing changing means 32, a temperature threshold setting means 33, a correction means 34, and a determination means 35.

[0028] The temperature detection means 6 can be a temperature detector, which can be, for example, a temperature thermistor or a thermocouple. A temperature thermistor is a resistor whose electrical resistance changes greatly with temperature change, and this phenomenon can be used to measure temperature. When one end of a dissimilar metal conductor is electrically joined and a temperature difference is applied to both ends, a current is generated, which is called a thermoelectromotive force, and the temperature of the temperature measuring junction can be known by keeping the reference junction at a constant temperature, and this dissimilar metal conductor is a thermocouple. The temperature detector is attached to the Z-direction driver 4 or the mounting head 3.

[0029] The height position (coordinates) of the mounting head 3 is measured in advance based on the temperature detected by the temperature detector, and the relationship between the temperature difference and the amount of displacement of the height position of the mounting head 3 is input in advance to the displacement amount acquisition means 7. Therefore, if the temperature of the temperature detector is input to the displacement amount acquisition means 7, the height position of the mounting head 3 can be acquired (calculated) from the relationship between the temperature difference and the amount of displacement of the height position (coordinates) of the mounting head 3. Meanwhile, when bonding, first, as shown in FIG. 4, the collet 12 of the mounting head 3 is stopped at a position on the bonding position that is a predetermined height higher than the mounting position of the board 2, and then the collet 12 is lowered, and the height position of the mounting head 3 is the position on the bonding position before being lowered. Note that the relationship between the temperature detected by the temperature detector and the head height position is input in advance to the displacement amount acquisition means 7, and if the temperature is detected, the head height position can be grasped (estimated), and the head height position can be known without calculation or the like. However, the head height position may be calculated by calculation or the like. The relationship between the temperature detected by the temperature detector and the head height position may be determined by referring to a correlation table stored outside the apparatus.

[0030] Incidentally, the correction means 34 corrects the amount of movement of the mounting head 3 in the first direction (Z direction), as will be described later, and the determination means 35 determines whether to correct the amount of movement of the mounting head 3 in the first direction based on the positional relationship acquired by the displacement amount acquisition means 7. In this case, the determination means 35 determines to correct the amount of movement of the mounting head 3 in the first direction when the positional relationship acquired by the displacement amount acquisition means 7 exceeds the first position threshold, as will be described later, and determines not to correct the amount of movement when the positional relationship does not exceed the first position threshold.

[0031] The displacement amount acquisition means 7, the temperature detection timing setting means 31A, the temperature detection timing change means 32, the temperature threshold setting means 33, the correction means 34, and the determination means 35 are controlled (computer-controlled) by a computer, processor, memory, etc., not shown. Here, the computer is basically composed of an input means having an input function, an output means having an output function, a storage means having a storage function, a calculation means having a calculation function, and a control means having a control function. The input function is for reading information from the outside into the computer, and the read data and programs are converted into signals in a format suitable for the computer system. The output function is for displaying the calculation results and stored data, etc., to the outside. The storage means is for storing and saving programs, data, processing results, etc. The calculation function is for processing data by calculating and comparing according to program instructions. The control function is for decoding program instructions and issuing instructions to each means, and this control function supervises all the means of the computer. The input means include a keyboard, a mouse, a tablet, a microphone, a joystick, a scanner, a capture board, etc. Moreover, output means include monitors, speakers, printers, etc. Storage means include memories, hard disks, CDs, CD-Rs, PDs, MOs, etc. Calculation means include CPUs, etc., and control means include CPUs, motherboards, etc.

[0032] The temperature detection timing setting means 31A is a means for inputting the timing (time) for detecting the temperature by the temperature detector. Because the collet 12 is lowered to a lower position than the initial state, such as position N1 in Fig. 4, due to thermal expansion of the drive unit during operation, it is necessary to adjust the amount of lowering. For this reason, the timing (time) at which adjustment is deemed necessary is set within the operating time, and this timing (time) is input. For this reason, the temperature detection timing setting means 31 can be configured by the computer.

[0033] 9(b) is a graph showing the correlation between temperature difference and displacement, and in this mounting device, if the displacement exceeds a threshold value based on a table showing the correlation between the difference in detected temperature and the displacement for each temperature detection timing, the displacement is corrected. For this reason, the temperature threshold value setting means 33 sets the threshold value for this displacement amount.

[0034] The correction means 34 adjusts (corrects) the amount of descent of the collet 12 on the bonding position, and adjusts (corrects) the amount of descent in the Z direction of the Z direction driver 4. In this case, the rotation speed of the drive motor of the drive force applying means 5 is controlled.

[0035] Next, an electronic component mounting method using the electronic component mounting device configured as shown in FIG. 1 will be described with reference to the flow chart shown in FIG. 5. In this case, the method includes the steps shown in FIG. 6. That is, the method includes at least a temperature detection step 60 for detecting the temperature of at least one of the mounting head 3 and the Z-direction driver 4 at a set temperature detection timing, a positional relationship acquisition step 61 for acquiring the positional relationship in the first direction between the mounting head 3 and the mounted member (such as the board 2 in this case) based on the difference in temperature detected in the temperature detection step 60, a determination step 62 for determining whether to correct the Z-direction movement amount of the mounting head based on the positional relationship acquired in the positional relationship acquisition step 61, and a correction step 63 for correcting the first direction movement amount of the mounting head 3 when it is determined in the determination step 62 that the correction is to be performed. In the determination step 62, if the positional relationship calculated in the positional relationship acquisition step 61 exceeds a first threshold value, the determination step 62 determines to correct the first direction movement amount of the mounting head 3, and if it does not exceed the first threshold value, the determination step 62 determines not to correct the movement amount.

[0036] First, as shown in Fig. 5, the temperature detection timing is set (step S1), for example, every 15 minutes from the start of operation.

[0037] As the next step, a threshold value is set (step S2). The threshold value in this case is a first threshold value, which is a threshold value for the length by which the collet 12 of the mounting head 3 is estimated to have been displaced based on the difference in temperature detected by the temperature detector at each set temperature detection timing. If this first threshold value is not exceeded, even if the Z-direction driver 4 thermally expands, the amount of expansion is small, and the height position of the collet 12 above the bonding position of the collet 12 does not change much from the height position of the collet 12 in the initial operation state, and the bonding operation is not affected.

[0038] In addition, setting the temperature detection timing and setting the first threshold value can be performed in either order; that is, step S1 can be "setting the first threshold value" and step S2 can be "setting the temperature detection timing," or even "setting the temperature detection timing and the first threshold value" can be step S1.

[0039] In this way, with the temperature detection timing and the first threshold set, operation (automatic operation) is started (step S3). Here, operation means, as shown in FIG. 3, moving (lowering) the collet 12 in the direction of the arrow B on the pickup position P, and adsorbing the chip 1 on the table (XYθ table) to the collet 12. Next, the collet 12 is raised along the direction of the arrow A, and then moved horizontally along the direction of the arrow E to position it on the bonding position Q. Then, the chip 1 is lowered by a certain amount along the vertical direction as shown by the arrow D. Then, the adsorption of the chip 1 by the collet 12 is released at the lowest point, and the chip 1 is mounted. After mounting, the chip 1 is raised in the direction of the arrow C by the above-mentioned downward amount, and then moved horizontally in the direction of the arrow F to return to the pickup position P, and the next chip 1 is picked up. Thereafter, the above-mentioned processes are performed sequentially, and all the chips 1 on the wafer sheet are mounted on the mounting portions (island portions) on the bonding position Q.

[0040] Next, it is determined whether or not it is time to detect the temperature (step S5). If it is time to detect the temperature in step S5, the process proceeds to step S6 to determine whether or not the first threshold value has been exceeded. If it is not time to detect the temperature in step S5, the process waits until it is time to detect the temperature.

[0041] If the first threshold is exceeded in step S6, the process proceeds to step S7, where the amount of movement is corrected. If the position of the collet 12 exceeds the first threshold, as shown in FIG. 4, the height position of the collet 12 in the initial state changes from the state indicated by N to the state of N1, and the amount of movement differs. That is, the amount of movement changes from a to a' (a = a' + b). b is the amount of thermal displacement, which is the amount of displacement at which the stop position of the mounting head 3 on the bonding position changes from the collet 12 position at N to the collet 12 position at N1 due to thermal expansion of the Z-direction driver 4, etc.

[0042] Therefore, the movement amount is changed from a to a'. At this time, the bonding operation (operation) is stopped, the movement amount is adjusted, the bonding operation (operation) is resumed, and the process proceeds to step S9. If the first threshold is not exceeded in step S6, the movement amount is not corrected (step S8). Thereafter, the process proceeds to step S9 after steps S7 and S8.

[0043] In step S9, it is determined whether or not to continue operation. If operation is to be continued, operation continues and the process returns to step S5. If operation is not to be continued in step S9, the process ends.

[0044] The first electronic component mounting device has temperature detection timing changing means 32 that reduces the interval of the preset correction timing, so that it is possible to reduce the work of temporarily stopping the operation during operation to detect the temperature of the mounting head 3 and the Z-direction driver 4 and adjust the movement amount of the mounting head 3. Moreover, by managing the temperature, the relationship between the temperature and the movement amount of the mounting head 3 can be grasped, and the position of the mounting head can be estimated from the temperature, so that the adjustment of the movement amount can be performed relatively stably. In addition, the timing when the movement amount is not adjusted can be determined stably.

[0045] Furthermore, during operation (driving), if the position of the mounting head 3 is displaced outside the allowable range with respect to the normal position, it can be corrected, thereby making it possible to suppress defective products.

[0046] Unlike the flow chart of Fig. 5, operations as shown in Fig. 7 and Fig. 8 may be performed. In Fig. 7 and Fig. 8, a second threshold is set in addition to the first threshold. Here, the second threshold is a threshold for the displacement amount of the Z axis estimated from the temperature difference between correction timings set at predetermined time intervals, i.e., between temperature detection timings.

[0047] The operation shown in FIG. 7 will be described. In this case, although not shown in the flowchart, a first temperature detection timing, a second temperature detection timing, and a second threshold value are set. Here, the first temperature detection timing and the second temperature detection timing are set consecutively. First, the temperature at the first temperature detection timing is detected (step S10). Next, the temperature at the second temperature detection timing is detected (step S11), and the temperature difference between the first temperature detection timing and the second temperature detection timing is detected in step S12. That is, the temperature difference between the first temperature detected at the first temperature detection timing and the second temperature detected at the second temperature detection timing is detected.

[0048] Thereafter, the process proceeds to step S13, where the amount of change (amount of change in temperature) is obtained, and the process proceeds to step S14. In step S14, it is determined whether the first threshold has been exceeded. If the first threshold has been exceeded in step S14, the process proceeds to step S15, where the movement amount of the mounting head 3 is adjusted. If the first threshold has not been exceeded in step S14, the process proceeds to step S16, where the movement amount is not adjusted.

[0049] The reason why the amount of movement is not adjusted in this manner is that if the temperature difference between the temperature at the first temperature detection timing and the temperature at the second temperature detection timing does not exceed the temperature difference threshold, the amount of thermal displacement b is small, there is not much difference in the bonding operation, and there is no need to adjust the amount of movement.

[0050] From step S15 and step S16, the process moves to step S17, where it is determined whether or not to continue the operation. If the operation is to be continued, the process returns to step S10, and if the operation is not to be continued, the process ends.

[0051] In the case of detecting the temperature difference between the previous correction timing, which is the first temperature detection timing, and the current correction timing, which is the second temperature detection timing, if the temperature difference is small, the difference in the amount of displacement is also small (does not exceed the first threshold value), and there is no need to adjust the amount of movement in the Z direction at the current correction timing. Therefore, there is no need to stop the mounting operation to adjust the amount of movement, and productivity (workability) can be improved.

[0052] The operation shown in Fig. 7 will be described. In this case, although not shown in the flowchart, a first temperature detection timing, a second temperature detection timing, a first threshold value, and a correlation table between the temperature difference and the amount of displacement are set. Here, the first temperature detection timing and the second temperature detection timing are set consecutively. The first threshold value is a threshold value for the amount of displacement at which the mounting head 3 is estimated to have been displaced based on the temperature difference between the correction timings, i.e., the temperature detection timings, set at predetermined intervals.

[0053] First, the temperature is detected at a first temperature detection timing (step S10). Next, the temperature is detected at a second temperature detection timing (step S11), and the temperature difference between the first temperature detection timing and the second temperature detection timing is detected (step S12). In step S13, the amount of displacement is obtained from a correlation table between the temperature difference and the amount of displacement. After that, the process proceeds to step S14, where it is determined whether the first threshold has been exceeded. If the first threshold has been exceeded in step S14, the process proceeds to step S15, where the amount of movement of the mounting head 3 is adjusted. If the displacement threshold has not been exceeded in step S14, the process proceeds to step S16, where the amount of movement is not adjusted. Note that steps S15 and steps S16 and thereafter will be described later.

[0054] In this way, the movement amount is not adjusted because if the displacement amount estimated from the temperature difference between the temperature at the first temperature detection timing and the temperature at the second temperature detection timing does not exceed the displacement amount threshold, the thermal displacement amount b is small and no adjustment of the movement amount is required.

[0055] FIG. 9(a) shows the relationship between the correction timing (temperature detection timing) and the amount of displacement. The horizontal axis indicates the temperature detection timing for each elapsed time, and the vertical axis indicates the temperature. In this case, for example, if A is the first temperature detection timing, B is the second temperature detection timing, and C is the third temperature detection timing, a displacement amount c1 of the temperature detected at the temperature detection timing A and the temperature detection timing B occurs. If the displacement amount c1 is greater than the second threshold, the temperature detection timing is not changed by the temperature detection timing changing means 32, and temperature detection is performed at the temperature detection timing C. Furthermore, if the temperature detected at the temperature detection timing B is greater than the first threshold, the Z-axis movement amount of the mounting head 3 is corrected.

[0056] Next, if B is the first temperature detection timing, C is the second temperature detection timing, and D is the third temperature detection timing, a displacement amount c2 of the temperature detected at the temperature detection timing B and the temperature detection timing C is generated. If the temperature detected at the temperature detection timing C is smaller than the temperature threshold value, the Z-axis movement amount of the mounting head 3 is not corrected. Then, if the displacement amount c2 is larger than the displacement amount threshold value, the temperature detection timing is not changed by the temperature detection timing changing means 32, and temperature detection is performed at the set temperature detection timing D.

[0057] Next, when the first temperature detection timing is set to C, the second temperature detection timing is set to D, and the third temperature detection timing is set to E, a temperature difference c3 occurs between the temperature detection timing C and the temperature detection timing D. If the temperature detected at the temperature detection timing D is smaller than the temperature threshold, the Z-axis movement amount of the mounting head 3 is not corrected. If the difference c3 is smaller than the difference threshold, the temperature detection timing change means changes the temperature detection timing to a lower frequency. That is, the temperature is not detected at the temperature detection timing E before the change. Similarly, the difference is compared with the difference threshold based on the change in temperature detected at the successive temperature detection timings E, F, G, H, R, etc. As can be seen from FIG. 9(a), the difference tends to become smaller as time passes from the start of automatic operation.

[0058] The operation in FIG. 8 will be described. In this case, although not shown in the flow chart, the first temperature detection timing, the second temperature detection timing, the temperature threshold value, and the displacement threshold value are set. Here, the first temperature detection timing and the second temperature detection timing are set consecutively. Steps S10 to S16 are the same as in FIG. 7, so their description will be omitted. Then, in FIG. 8, in step S18, If it is smaller than the second threshold Then, the process proceeds to step S19. If it is greater than the second threshold Then, the process proceeds to step S20. In step S19, the set temperature detection timing is changed. If it is greater than the second threshold Then, the process proceeds to step S20, and the set temperature detection timing is not changed. Since step S17 is the same as that in FIG. 7, the description will be omitted. That is, when the displacement is smaller than the second threshold, the temperature detection timing can be changed to a lower frequency. In this way, even if correction is not necessary, inspection is not performed frequently, and productivity is improved. When the displacement is larger than the second threshold, the temperature detection timing is not changed and can be performed at the set frequency, so that it is possible to prevent processing without correction even when correction is necessary. In this case, the second threshold is a displacement smaller than the first threshold. Also, when the displacement is larger than the displacement threshold, the temperature detection timing may be changed to a higher frequency. In this way, correction can be performed when the displacement is large and correction of the movement amount is necessary, so that product defects caused by processing with the correction interval at a low frequency can be suppressed.

[0059] This improves the reliability of the determination as to whether or not to adjust the movement amount at the set temperature detection timing (correction timing).

[0060] Next, Fig. 10 is a simplified block diagram of a second electronic component mounting apparatus in an embodiment, which in this case includes a mounting head 3, a Z-direction driver 4, a driving force applying means 5, a correction timing setting means 31 (position detection timing setting means 31B in this case), a transporting means 30, and a correction means 34, similar to the first electronic component mounting apparatus shown in Fig. 1. In addition, the apparatus includes a position detecting means 40, a position threshold setting means 41, a position detection timing changing means 42, a determining means 43, etc.

[0061] The position detection means 40 may be a height detection sensor that detects the height position of the collet 12 in the Z direction. The height detection sensor may be attached to the collet 12 side or to the mounted member side. Contact sensors such as mechanical switches, such as limit switches and microswitches, and non-contact sensors, such as proximity sensors, photoelectric sensors, and ultrasonic sensors, may be used. Proximity sensors are sensors that detect the approach of a detection object without contact, and include high-frequency oscillation types that use electromagnetic induction, magnetic types that use magnets, and capacitance types that use changes in capacitance. Photoelectric sensors emit light such as visible light or infrared light as a signal light from a light-projecting section, detect the light reflected by the detection object with a light-receiving section (reflection type), or detect changes in the amount of light blocked with a light-receiving section (transmission type / regression reflection type) to obtain an output signal. Ultrasonic sensors emit ultrasonic waves from a sensor head, receive the ultrasonic waves reflected by the object with the sensor head again, and measure the time from the emission of the sound wave to the reception to detect the position of the object.

[0062] The first position threshold in the position threshold setting means 41 is the threshold of the height position detection sensor, and is the height position at which the fluctuation in the height position of the collet 12 due to thermal expansion is small until the first position threshold is reached, and even if bonding is performed with this fluctuation, it is not likely to have an adverse effect on the chip 1. For this reason, the first position threshold is set in advance and this threshold is input. For this reason, the position threshold setting means 41 can be configured by the computer.

[0063] The correction means 34 corrects the amount of movement of the mounting head 3 in the first direction, and the judgment means 43 judges whether to correct the amount of movement of the mounting head 3 in the first direction based on the height position detected by the position detection means 40, and if the height position detected by the position detection means 40 exceeds the first position threshold, it judges to correct the amount of movement of the mounting head 3 in the first direction, and if it does not exceed the first position threshold, it judges not to correct the amount of movement.

[0064] In this case, if the position detection means 40 (height position sensor) does not exceed (fall below) the threshold value at the set position detection timing, no correction is made at this position detection timing, so the position detection timing can be reduced. For this reason, the position detection timing change means 42 can be composed of a height position sensor and a position threshold setting means 41, etc.

[0065] Next, a mounting method (operating method) using the second electronic component mounting device will be described with reference to the flow chart of Fig. 11. In this case, as shown in Fig. 12, at least a position detection step 65 capable of detecting the height position of the mounting head 3, a determination step 66 for determining whether to correct the movement amount of the mounting head in the first direction based on the height position detected in the position detection step 65, and a correction step 67 for correcting the movement amount of the mounting head 3 in the first direction are provided. In the determination step 66, if the height position detected in the position detection step exceeds a first position threshold, it is determined that the movement amount of the mounting head in the first direction is to be corrected, and if the height position detected in the position detection step does not exceed the first position threshold, it is determined that the movement amount is not to be corrected.

[0066] In this case, first, the correction timing (position detection timing) and threshold are set. That is, the position detection timing is set (step S21), the first position threshold is set (step S22), and operation is started (step S23). In this case, the first position threshold is a threshold of the height position. This position detection timing is set, for example, every 15 minutes from the start of operation.

[0067] The first position threshold in this case is a threshold for the position (height position) in the first direction detected by the position detection means 40. As long as the height position of the collet 12 before it descends is not lower than this position, the bonding operation is not affected even if the Z-direction driver 4 is thermally expanded. The height position of the collet 12 is the height position when it is transported from the pickup position to the bonding position and stopped temporarily, and as operation continues, the Z-direction driver 4 will expand due to thermal expansion. If the Z-direction driver 4 expands in this way, the position of the collet 12 will be lower than in the initial stage.

[0068] Either the setting of the position detection timing or the setting of the first position threshold may be performed first; that is, step S21 may be "setting a threshold" and step S22 may be "setting the position detection timing" or may be "setting the position detection timing and a threshold."

[0069] The operation is the operation shown in FIG. 3. Operation is started, and it is determined whether the next position detection timing has arrived (step S24). If the position detection timing has arrived in step S24, the process proceeds to step S25, and if the position detection timing has not arrived, the process waits until the position detection timing arrives. In step S25, First position threshold exceeded In step S25, Exceeding the first position threshold If so, the amount of movement of the mounting head 3 is adjusted in step S26. This allows the chip to be bonded stably.

[0070] In step S25 If the first position threshold is not exceeded, The process proceeds to step S27, and the movement amount is not adjusted. In this way, whether the movement amount is adjusted or not, the process proceeds to step S28, and it is determined whether or not to continue the operation. If the operation is continued, Continue operation and return to step S24. If operation is not continued in step S28, the process ends.

[0071] The second electronic component mounting apparatus, like the first electronic component mounting apparatus, has a position detection timing changing means 42 that reduces the interval of the preset position detection timing, so that the work of pausing the operation and adjusting the movement amount of the mounting head 3 during operation can be reduced. In particular, the second electronic component mounting apparatus can adjust the movement amount relatively stably by managing the position of the mounting head 3, and can stably determine the timing when the movement amount is not adjusted. Meanwhile, the first electronic component mounting apparatus manages the temperature, and it is necessary to know in advance the temperature difference and the thermal expansion amount of the Z-direction driver 4, whereas the second electronic component mounting apparatus manages the position, so there is no need to know the temperature difference and the thermal expansion amount of the Z-direction driver 4, and is excellent in controllability.

[0072] The second electronic component mounting apparatus can also improve productivity by reducing the need to temporarily halt operation to adjust the amount of movement of the mounting head 3. Furthermore, during operation (driving), the displacement of the mounting head 3 from the correct position can be kept within an allowable range, making it difficult for quality defects to occur in the product and not leading to a deterioration in product quality.

[0073] Different from the flow chart of Fig. 11, operations as shown in Fig. 13 or 14 may be performed. In this case, a second position threshold different from the first position threshold and a position difference threshold are set in Fig. 13 or 14. Here, the second position threshold (position difference threshold) is a threshold for the position difference between correction timings that is set every predetermined time (every predetermined minute).

[0074] The operation shown in Fig. 13 will be described. In this case, although not shown in this flowchart, a threshold value (second position threshold value) for changing the frequency of the position detection timing is set. First, a first position, which is the position at the first position detection timing, is detected (step S30). Next, a second position, which is the position at the second position detection timing following the first position detection timing, is detected (step S31), and in step S32, the position difference between the first position and the second position is detected. That is, the position difference between the position at the previous position detection timing (the position of the mounting head 3, specifically the position of the collet 12) and the position at the current position detection timing (the position of the mounting head 3, specifically the position of the collet 12) is detected.

[0075] After that, the process proceeds to step S33, and it is determined whether the first position threshold value has been exceeded. First Position Threshold If it exceeds the first position threshold, the process proceeds to step S34, where the movement amount is adjusted. If it is determined in step S33 that the first position threshold is not exceeded, the process proceeds to step S35, where the movement amount is not adjusted.

[0076] In this way, the amount of movement is not adjusted because the position difference between the position at the previous correction timing and the position at the current correction timing is First Position Threshold If it does not exceed this value, the amount of positional displacement is small, there is little difference in the bonding operation, and there is no need to correct the amount of movement.

[0077] From step S34 and step S35, the process proceeds to step S36, where it is determined whether or not to continue operation. If operation is to be continued, the process returns to step S30, and if operation is not to be continued, the process ends.

[0078] In the case of detecting the position difference between the previous correction timing (first position detection timing) and the current correction timing (second position detection timing), if the position difference is small (does not exceed the first position threshold), there is no need to correct the amount of movement in the Z direction at the current correction timing. Therefore, there is no need to stop the mounting operation to correct the amount of movement, which can improve productivity (workability).

[0079] The operation in FIG. 14 is similar to steps S30 to S35 in FIG. 13. Then, in FIG. 14, the process moves from step S35 to step S37, and in step S37, the position difference acquired in step S32 is Is it smaller than the second position threshold? In step S37, If it is greater than the second position threshold Then, the process proceeds to step S39 and the position detection timing is not changed. If the value is less than the second position threshold in step S37 Assuming that the amount of change in the position of the mounting head 3 (specifically, the position of the collet 12) between the first position detection timing and the second position detection timing is small, the process proceeds to step S38, and the position detection timing change means 42 changes the frequency of the position detection timing to a lower frequency. Note that step S36 is the same as in FIG. 13, and therefore a description thereof will be omitted. S38 The change in the position detection timing by the position detection timing changing means in step 2 may be made more frequently. S37 Second position threshold Greater than This allows the amount of change in the position of the mounting head 3 to be large, and it is possible to increase the frequency of determining whether or not to correct the amount of movement. This makes it possible to prevent defects from occurring in products due to continued production while the frequency of correcting the amount of movement is low.

[0080] By doing so, the reliability of the determination as to whether or not to adjust the movement amount at the current correction timing is improved.

[0081] 9(a) shows the relationship between the position detection timing and the position difference. The horizontal axis shows the position detection timing for each elapsed time, and the vertical axis shows the position difference, which is the amount of displacement of the position. In this case, for example, if A is the first position detection timing, B is the second position detection timing, and C is the third position detection timing, a displacement amount c1 of the position detected at the position detection timing of A and the position detection timing of B is generated. If the displacement amount c1 is greater than the second position threshold, the position detection timing change means 42 does not change the position detection timing, and position detection is performed at the position detection timing of C. Furthermore, if the temperature detected at the temperature detection timing of B is greater than the first position threshold, the Z-axis movement amount of the mounting head 3 is corrected.

[0082] Next, if B is the first position detection timing, C is the second position detection timing, and D is the third position detection timing, a displacement amount c2 of the positions detected at the position detection timing B and the position detection timing C is generated. If the position detected at the position detection timing C is greater than the first position threshold, no correction is made to the Z-axis movement amount of the mounting head 3. Then, if the displacement amount c2 is greater than the second position threshold, the position detection timing is not changed by the position detection timing changing means 42, and position detection is performed at the set position detection timing D.

[0083] Next, when c is the first position detection timing, d is the second position detection timing, and e is the third position detection timing, a displacement amount c3 occurs between the position detection timing c and the position detection timing d. If the position detected at the position detection timing d is smaller than the first position threshold, the Z-axis movement amount of the mounting head 3 is not corrected. If the displacement amount c3 is smaller than the second position threshold, the position detection timing change means changes the position detection timing to a lower frequency. In other words, detection is not performed at the position detection timing e before the change. Similarly, the displacement amount is compared with the second position threshold based on the change amount of the position detected at the successive position detection timings e, f, g, h, r, . . . As can be seen from FIG. 9(a), the displacement amount (position difference) tends to become smaller as time passes from the start of automatic operation.

[0084] In this case, it is preferable to set the second position threshold to a value smaller than the first position threshold. For example, it may be determined that the second position threshold is exceeded if the first position threshold is not exceeded two or more times.

[0085] However, when the operation is started, there are areas on the substrate 2 where the components (chips 1) are placed and areas where they are not placed, and these areas are mixed together. In such a case, if the position (height position) of the collet 12 is detected on the bonding position Q, it may be difficult to measure the amount of displacement, or the measurement method may become complicated. However, as shown in FIG. 15, if the Z-axis displacement measurement stage 50 is provided at a location (place) different from the bonding position Q, it is less likely to be affected by the state of the substrate during production. Here, the Z-axis displacement measurement stage 50 has a flat upper surface, and the height position (predetermined height) of the flat surface is known. As shown in FIG. 15, the substrate 2 is disposed on the substrate transport section 51, and the Z-axis displacement measurement stage 50 is also set on the substrate transport section 51.

[0086] Incidentally, the adjustment of the displacement amount of the mounting head 3 was performed when bonding the chip, but it may be performed when picking up the chip 1. Even if the displacement amount is adjusted when picking up the chip 1 in this way, the operation is the same as the adjustment of the displacement amount when bonding the chip 1.

[0087] Electronic components can be manufactured using an electronic component mounting apparatus that uses the temperature detection means 6 or an electronic component mounting apparatus that uses the position detection means 40. That is, it is possible to manufacture products such as elements having electronic components such as resistor elements and capacitors.

[0088] The present invention is not limited to the above embodiment, and various modifications are possible, and it can be widely used in a manufacturing method of an article mounting a component such as a semiconductor chip, in addition to a manufacturing method of a semiconductor mounting an electronic component. The first temperature threshold, the second temperature threshold, the first position threshold, and the second position threshold can be set arbitrarily, but can be set within a range that does not interfere with the bonding operation at the bonding position Q and the pick-up operation at the pick-up position P. In addition, if the correction timing is short, unnecessary judgment operation is performed when the mounting head 3 is not fluctuating or there is only a slight fluctuation, and conversely, if it is long, the position adjustment of the mounting head 3 should be performed by the correction timing, so various settings can be made depending on the heat generation amount of the driving motor of the driving force applying means used, the material of the Z-direction driving body 4 used, etc.

[0089] When using the Z-axis displacement measurement stage 50, the position at which the Z-axis displacement measurement stage 50 is provided is arbitrary, but when adjusting the amount of displacement of the mounting head 3 when picking up the chip 1, it is preferable to provide it near the pick-up position P, but it is also preferable to provide it in a location that does not interfere with the pick-up operation of the collet 12. It may also be provided midway between the pick-up position P and the bonding position Q, allowing adjustment of the amount of displacement of the mounting head 3 when picking up and when setting to the bonding position.

[0090] The Z-direction driver 4 may be a Z-axis slider that moves (reciprocates) in the Z direction upon receiving the driving force of the driving force applying means 5, and a Z-axis driven slider that moves in the Z direction following the movement of the Z-axis slider. In this case, the mounting head 3 is attached to the Z-axis driven slider. In the case of a mounting device that includes a Z-axis slider and a Z-axis driven slider, in a mounting device that uses a temperature detection means, it is preferable to provide a temperature detector as the temperature detection means 6 on the Z-axis slider side, which is close to the driving motor of the driving force applying means 5 and is prone to temperature rise, but a temperature detector may be provided on the Z-axis driven slider side. In addition, in a mounting device that uses a position detection means 40, it is sufficient to detect the height position of the collet 12.

[0091] In the embodiment, the first direction is the Z direction, which is the vertical direction, but the first direction may be the X direction or the Y direction in the present embodiment. [Explanation of symbols]

[0092] 3 Mounting head 4 First direction drive body (Z direction drive body) 5. Driving force applying means 6 Temperature detection means 7. Displacement acquisition means 32 Temperature detection timing change means 34 Correction means 35 Judgment means 40 Position detection means 42 Position detection timing change means 43 Judgment means 60 Temperature detection process 61 Positional relationship calculation process 62 Judgment process 63 Correction process 65 Position detection process 66 Judgment process 67 Correction process

Claims

1. An electronic component mounting apparatus for holding an electronic component and mounting it on a mounting member, comprising: a mounting head that holds the electronic component and transports the electronic component to the mounting member; a first direction driver to which the mounting head is attached and which reciprocates the mounting head in a first direction; and, a driving force applying means for applying a driving force to the first direction driving body; a temperature detection means for detecting a temperature of at least one of the mounting head and the first direction driver at a set temperature detection timing; a displacement amount acquiring unit that acquires a displacement amount of the mounting head based on the temperature detected by the temperature detecting unit; a correction unit that corrects a movement amount of the mounting head in a first direction based on the displacement amount; A temperature detection timing change means is provided, the displacement amount acquisition means acquires the displacement amount based on a temperature difference between a first temperature detected by the temperature detection means at a first temperature detection timing and a second temperature detected by the temperature detection means at a second temperature detection timing, and corrects the movement amount of the mounting head in a first direction when the acquired displacement amount exceeds a first threshold value, and does not correct the movement amount when the acquired displacement amount does not exceed the first threshold value; The electronic component mounting device is characterized in that the temperature detection timing change means changes the set temperature detection timing to a lower frequency when the amount of displacement acquired by the displacement amount acquisition means is smaller than a second threshold value, which is a threshold value for the amount of displacement of the temperature difference between temperature detection timings set at each specified time.

2. An electronic component mounting device as described in claim 1, characterized in that the set temperature detection timing is changed to a higher frequency when the acquired displacement amount is greater than the second threshold value.

3. An electronic component mounting device as described in claim 1, characterized in that the set temperature detection timing is not changed when the acquired displacement amount is greater than the second threshold value.

4. An electronic component mounting apparatus for holding an electronic component and mounting it on a mounting member, comprising: a mounting head that holds the electronic component and transports the electronic component to the mounting member; a first direction driver to which the mounting head is attached and which reciprocates the mounting head in a first direction; a driving force applying means for applying a driving force to the first direction driving body; a position detection means capable of detecting a position of the mounting head; a correction unit that corrects a movement amount of the mounting head in a first direction; a position detection timing changing means for changing the position detection timing; a determination unit that determines whether to correct the amount of movement of the mounting head in the first direction based on the position of the mounting head detected by the position detection unit, obtaining a position difference from a difference between a first position detected by the position detection means at a first position detection timing and a second position detected by the position detection means at a second position detection timing; the determination means determines to correct the movement amount of the mounting head in a first direction when the position difference detected by the position detection means exceeds a first position threshold, and determines not to correct the movement amount when the position difference does not exceed the first position threshold, The electronic component mounting device is characterized in that the position detection timing change means changes the position detection timing to a lower frequency when the detected position difference is smaller than a second position threshold, which is a threshold for the position difference between correction timings set at each predetermined time.

5. An electronic component mounting device as described in claim 4, characterized in that the position detection timing is changed to a higher frequency when the position difference is greater than the second position threshold.

6. An electronic component mounting device as described in claim 4, characterized in that the position detection timing is not changed when the position difference is greater than the second position threshold.

7. An electronic component mounting method for holding an electronic component and mounting it on a substrate using an electronic component mounting apparatus including a mounting head that holds an electronic component and transports it to a substrate, a first direction driver to which the mounting head is attached and that reciprocates the mounting head in a first direction, and a driving force applying means that applies a driving force to the first direction driver, the method comprising: a temperature detection step of detecting a temperature of at least one of the mounting head and the first direction driver at a set temperature detection timing; a displacement amount acquiring step of acquiring a displacement amount of the mounting head based on the temperature detected in the temperature detecting step; and correcting an amount of movement of the mounting head in a first direction based on the amount of displacement, the displacement amount is acquired based on a temperature difference between a first temperature detected at a first temperature detection timing and a second temperature detected at a second temperature detection timing by the temperature detection process, and if the acquired displacement amount exceeds a first threshold value, the movement amount of the mounting head in the first direction is corrected, and if the acquired displacement amount does not exceed the first threshold value, the movement amount is not corrected; An electronic component mounting method characterized in that the displacement amount acquired in the displacement amount acquisition process is set at predetermined time intervals and is smaller than a second threshold value, which is a threshold value for the displacement amount of the temperature difference between temperature detection timings, and the set temperature detection timing is changed to a lower frequency.

8. a mounting head that holds an electronic component and transports it to a substrate; an electronic component mounting method for holding an electronic component and mounting it on a mounted member using an electronic component mounting apparatus including a first direction driver to which the mounting head is attached and which reciprocates the mounting head in a first direction, and a driving force applying means for applying a driving force to the first direction driver, the method comprising: a position detection step capable of detecting the position of the mounting head; a correction step of correcting a movement amount of the mounting head in a first direction, obtaining a position difference from a difference between a first position detected at a first position detection timing and a second position detected at a second position detection timing in the position detection step; When the position difference detected in the position detection process exceeds a first position threshold, a determination is made to correct the movement amount of the mounting head in a first direction, and when the position difference does not exceed the first position threshold, a determination is made not to correct the movement amount; a second position threshold value, which is a threshold value for a position difference between correction timings set at each predetermined time, for changing the position detection timing to a lower frequency when the detected position difference is smaller than a second position threshold value, which is a threshold value for a position difference between correction timings set at each predetermined time

9. A method for manufacturing an electronic component, comprising the steps of: manufacturing an electronic component using the electronic component mounting device described in claim 1 or claim 4.

Images