Shock absorbing structure

Abstract

To provide a shock absorbing structure having an enhanced component protection property while suppressing increase in size of a mounted device.SOLUTION: A circuit board 13 on which electronic components are mounted is housed in a housing 12. A holding member 11 is housed in the housing 12 and has lower rigidity than the housing 12. The holding member 11 includes a pillar section 112 and a beam section 113. An upper end 112a and a lower end 112b of the pillar section 112 are brought into contact with the housing 12. The beam section 113 extends in a cantilever state from the pillar section 112 and holds the circuit board 13.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a shock absorbing structure that protects components mounted on an apparatus from external forces. [Background technology]

[0002] Patent Document 1 discloses a device for non-invasively measuring the blood pressure of a subject. The device is equipped with a shock absorbing structure for protecting a pump that delivers or sucks in a fluid to control the internal pressure of a cuff attached to the arm of the subject. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-088513 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide an impact absorbing structure that enhances the ability to protect components while suppressing an increase in the size of the device in which it is mounted. [Means for solving the problem]

[0005] One aspect of the present invention to achieve the above object is a shock absorbing structure, comprising: A housing and a circuit board housed in the housing and having electronic components mounted thereon; A holding member housed in the housing and having a rigidity lower than that of the housing; It is equipped with The holding member is A pillar portion having both ends in contact with the housing; a beam portion extending in a cantilever shape from the column portion and supporting the circuit board; It is equipped with:

[0006] According to the above-mentioned configuration, an external force applied to the housing is transmitted through both ends of the pillar portion of the holding member that is disposed so as to be in active contact with the housing. Since the rigidity of the holding member is lower than that of the housing, the transmission of the external force can be performed with active cushioning.

[0007] In addition, since the circuit board is supported by the beam extending cantilever-like from the column so as to be separated from the above-mentioned force transmission path, the transmission of external forces applied to the housing to the circuit board can be further suppressed.

[0008] In other words, the holding member can be made to have the function of supporting the circuit board including the electronic components in the housing and the function of protecting the circuit board from external forces applied to the housing. This makes it possible to suppress an increase in the size of the shock absorbing structure compared to a case in which a configuration for protecting the circuit board from external forces and a configuration for supporting the circuit board in the housing are provided separately. Therefore, it is possible to enhance the protection capability of the electronic components while suppressing an increase in the size of the device in which the shock absorbing structure is mounted.

[0009] One aspect of the present invention to achieve the above object is a shock absorbing structure, comprising: A housing and a circuit board housed in the housing and having electronic components mounted thereon; A holding member housed in the housing and having a rigidity lower than that of the housing; An apparatus component housed in the housing and having a higher rigidity than the holding member; It is equipped with the circuit board has an opening; The holding member is A support portion supporting the circuit board; a post portion disposed within the opening and in contact with the housing; a base portion contacting the housing at a position different from the column portion; a holder that holds the device component between the post and the base; It is equipped with The circuit board is supported by the support portion so as to be slidable along the column portion.

[0010] According to the above-mentioned configuration, an external force applied to the housing is transmitted through the pillars and base of the holding member that are disposed so as to be in active contact with the housing. Since the rigidity of the holding member is lower than that of the housing, the external force can be transmitted with active buffering. On the other hand, since an equipment component that is more rigid than the holding member is held between the pillars and the base, the equipment component can function as a reinforcing material for the holding member.

[0011] In addition, because the circuit board is slidable along the pillars, the transmission of external forces applied to the housing to the circuit board can be further suppressed through relative displacement between the holding member and the circuit board.

[0012] That is, the holding member can be given the function of supporting the circuit board including the electronic components in the housing and the function of protecting the circuit board from external forces applied to the housing. Also, a separate configuration for reinforcing the holding member can be omitted. This makes it possible to suppress an increase in size of the shock absorbing structure compared to a case in which a configuration for protecting the circuit board from external forces, a configuration for supporting the circuit board in the housing, and a configuration for reinforcing the holding member are separately provided. Therefore, it is possible to enhance the protection capability of the electronic components while suppressing an increase in size of the device in which the shock absorbing structure is mounted.

[0013] One aspect of the present invention to achieve the above object is a shock absorbing structure, comprising: A housing and A circuit board housed in the housing and having electronic components mounted thereon; A holding member housed in the housing and having a rigidity lower than that of the housing; It is equipped with the circuit board is sandwiched between a part of the housing and a part of the holding member, When the housing is deformed by an external force, a part of the housing deforms a part of the holding member, displacing the circuit board in a direction away from the housing.

[0014] According to this configuration, the influence of deformation of the housing due to external force can be suppressed on the circuit board. That is, the holding member can be made to have the function of supporting the circuit board including the electronic components in the housing and the function of protecting the circuit board from external forces applied to the housing. This makes it possible to suppress the increase in size of the shock absorbing structure compared to a case in which a configuration for protecting the circuit board from external forces and a configuration for supporting the circuit board in the housing are separately provided. Therefore, it is possible to enhance the protection capability of the electronic components while suppressing the increase in size of the device in which the shock absorbing structure is mounted. [Brief description of the drawings]

[0015] [Figure 1] 2 illustrates an external appearance of a holding member according to the first embodiment; [Diagram 2] 2 illustrates an external appearance of the shock absorbing structure including a cross section taken along line II-II in FIG. 1 and seen from the direction of the arrows. [Diagram 3] 3 illustrates a cross section of the shock absorbing structure as viewed from the direction of arrow III in FIG. 2; [Figure 4] 13 illustrates an external appearance of a holding member according to a second embodiment. [Diagram 5] 5 illustrates an external appearance of the shock absorbing structure including a cross section seen from the direction of the arrow along line VV in FIG. 4. [Figure 6] 6 illustrates a cross section of a portion of the shock absorbing structure as viewed from the direction of arrow VI in FIG. 5. [Figure 7] 7 illustrates a state in which an external force is applied to the housing illustrated in FIG. 6. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] An example of an embodiment will be described in detail below with reference to the accompanying drawings. In the accompanying drawings, an arrow F indicates the forward direction of the illustrated structure. An arrow B indicates the rearward direction of the illustrated structure. An arrow U indicates the upward direction of the illustrated structure. An arrow D indicates the downward direction of the illustrated structure. An arrow R indicates the rightward direction of the illustrated structure. An arrow L indicates the leftward direction of the illustrated structure. These directional expressions are used for convenience of explanation and do not limit the posture or direction of the illustrated structure in an actual use state.

[0017] The term "front-rear direction" as used herein means a direction along the above-mentioned front and rear directions. The term "up-down direction" as used herein means a direction along the above-mentioned top and bottom directions. The term "left-right direction" as used herein means a direction along the above-mentioned left and right directions.

[0018] The expression "extending in the front-to-rear direction" used in this specification includes extending at an angle relative to the front-to-rear direction, and means extending at an angle closer to the front-to-rear direction than the up-down and left-to-right directions.

[0019] The expression "extending in the vertical direction" used in this specification includes extending at an angle relative to the vertical direction, and means extending at an angle closer to the vertical direction than the front-back and left-right directions.

[0020] The expression "extending in the left-right direction" used in this specification includes extending at an angle relative to the left-right direction, and means extending at an angle closer to the left-right direction than the front-back and up-down directions.

[0021] A shock absorbing structure 10 according to a first embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 illustrates an external view of a retaining member 11 included in the shock absorbing structure 10. Fig. 2 illustrates an external view of the shock absorbing structure 10 including a cross section taken along line II-II in Fig. 1 and seen from the direction of the arrow. Fig. 3 illustrates a cross section of the shock absorbing structure 10 taken from the direction of the arrow III in Fig. 2.

[0022] 2 and 3, the shock absorbing structure 10 includes a housing 12. The housing 12 includes an upper housing 121 and a lower housing 122. The upper housing 121 and the lower housing 122 are joined together to define an accommodation space 123.

[0023] As illustrated in Fig. 1, the shock absorbing structure 10 includes a circuit board 13. Electronic components are mounted on the circuit board 13. The electronic components according to this embodiment include a piezoelectric diaphragm pump 131 illustrated in Figs. 2 and 3. The circuit board 13 is housed in a housing 12 while being held by a holding member 11. That is, the holding member 11 is also housed in the housing 12.

[0024] The shock absorbing structure 10 according to this embodiment can be mounted on a portable blood pressure monitor for non-invasively measuring the blood pressure of a subject. In other words, the housing 12 can be a part of the blood pressure monitor. The piezoelectric diaphragm pump 131 is used to send air to a cuff (not shown) used for blood pressure measurement and to inhale air from the cuff. Air is an example of a fluid.

[0025] The holding member 11 has a passage 111 that allows air to pass through. The passage 111 extends in the front-rear direction within the holding member 11. The passage 111 is configured to communicate with the cuff. The passage 111 is an example of a fluid passage.

[0026] As illustrated in FIG. 1, the holding member 11 includes a pillar portion 112. The pillar portion 112 extends in the vertical direction. The pillar portion 112 has an upper end portion 112a and a lower end portion 112b. As illustrated in FIG. 3, the upper end portion 112a is in contact with the inner wall surface of the upper housing 121. The lower end portion 112b is in contact with the inner wall surface of the lower housing 122. The upper end portion 112a and the lower end portion 112b are examples of both ends of a pillar portion.

[0027] 1, the holding member 11 includes a beam portion 113. The beam portion 113 extends in a cantilever shape in the left-right direction from the column portion 112. The circuit board 13 is held by the beam portion 113.

[0028] The holding member 11 is formed to have a lower rigidity than the housing 12. For example, this rigidity relationship can be realized by forming the holding member 11 using a material that is softer than the material for forming the housing 12. Alternatively, the holding member 11 and the housing 12 may be formed from the same material, and the thickness and shape may be appropriately adjusted to realize this rigidity relationship.

[0029] According to the above-mentioned configuration, an external force applied to the housing 12 is transmitted through the pillars 112 of the holding member 11, which are disposed so as to be in active contact with the housing 12. For example, an external force applied to the upper housing 121 is transmitted through the upper end 112a of the pillars 112 to the lower end 112b, and is released to the lower housing 122. Conversely, an external force applied to the lower housing 122 is transmitted through the lower end 112b of the pillars 112 to the upper end 112a, and is released to the upper housing 121.

[0030] Since the rigidity of the holding member 11 is lower than that of the housing 12, the transmission of the external force can be performed with active buffering. In addition, since the circuit board 13 is held by the beam portion 113 extending in a cantilever shape from the pillar portion 112 so as to be separated from the above-mentioned force transmission path, the transmission of the external force applied to the housing 12 to the circuit board 13 can be further suppressed.

[0031] That is, the holding member 11 can be provided with a function of supporting the circuit board 13 including electronic components within the housing 12 and a function of protecting the circuit board 13 from external forces applied to the housing 12. This makes it possible to suppress an increase in size of the shock absorbing structure 10 compared to a case in which a configuration for protecting the circuit board 13 from external forces and a configuration for supporting the circuit board 13 within the housing 12 are separately provided. Therefore, it is possible to enhance the protection capability of the electronic components while suppressing an increase in size of the sphygmomanometer in which the shock absorbing structure 10 is mounted.

[0032] 3, the lower housing 122 has a shoulder portion 122a that protrudes inward. The beam portion 113 of the holding member 11 can be placed on the shoulder portion 122a without being fixed thereto.

[0033] This configuration can increase the degree of freedom of displacement of the beam 113 extending in a cantilever shape from the column 112 of the holding member 11. The beam 113 is actively displaced in response to an external force transmitted to the column 112, making it easier to release the external force that may act on the circuit board 13. This can further increase the ability to protect the electronic components.

[0034] In addition to or instead of this, tip 113a of beam portion 113 can be disposed so as to face lower housing 122 with a gap therebetween.

[0035] According to such a configuration, not only can the degree of freedom of displacement of beam portion 113 be increased, but also external force applied to housing 12 from the side can be made less likely to be transmitted to beam portion 113. Therefore, the ability to protect electronic components can be further improved.

[0036] In this embodiment, the holding member 11 having the passage 111 through which the air passes to be pumped and drawn in by the piezoelectric diaphragm pump 131 is a one-piece molded product. The holding member 11 can be formed by, for example, injection molding.

[0037] That is, in addition to the above-mentioned supporting and cushioning functions, the retaining member 11 can also be given the function of forming an air flow path. This can reduce the number of parts in the device on which the shock absorbing structure 10 is mounted and form the passage 111 with high dimensional accuracy.

[0038] While the piezoelectric diaphragm pump 131 has the advantages of being space-saving and quiet during operation, it is known that it is not suitable for mounting in a portable device that is relatively prone to being dropped or bumped due to its low resistance to vibration and impact. However, by employing the shock absorbing structure 10 as described above, the piezoelectric diaphragm pump 131 can be actively adopted in a portable blood pressure monitor.

[0039] A shock absorbing structure 20 according to a second embodiment will be described with reference to Fig. 4 to Fig. 7. Fig. 4 illustrates an external view of a retaining member 21 included in the shock absorbing structure 20. Fig. 5 illustrates an external view of the shock absorbing structure 20 including a cross section seen from the direction of the arrow along line VV in Fig. 4. Fig. 6 illustrates a cross section of a portion of the shock absorbing structure 20 seen from the direction of the arrow VI in Fig. 5.

[0040] 5, the shock absorbing structure 20 includes a housing 22. The housing 22 includes an upper housing 221 and a lower housing 222. The upper housing 221 and the lower housing 222 are joined together to define an accommodation space 223.

[0041] The shock absorbing structure 20 includes a circuit board 23 and a solenoid valve 24. Electronic components are mounted on the circuit board 23. For example, the electronic components may include circuit elements that drive the solenoid valve 24. The solenoid valve 24 is an example of an apparatus component.

[0042] As illustrated in Fig. 4, the holding member 21 includes a support portion 211. The support portion 211 is configured to support the circuit board 23 from below. As illustrated in Fig. 5, the circuit board 23 is accommodated in the housing 22 in a state in which the circuit board 23 is supported by the holding member 21. That is, the holding member 21 is also accommodated in the housing 22.

[0043] The holding member 21 includes a pillar portion 212. The pillar portion 212 extends in the vertical direction. The pillar portion 212 has an upper end portion 212a. As illustrated in FIG. 6, the upper end portion 212a is in contact with the inner wall surface of the upper housing 221.

[0044] A through hole 231 is formed in the circuit board 23. The through hole 231 is an example of an opening. With the circuit board 23 supported by the support portion 211 of the holding member 21, the pillar portion 212 is disposed within the through hole 231. As a result, the circuit board 23 is supported by the support portion 211 so as to be slidable in the up-down direction along the pillar portion 212.

[0045] As illustrated in Fig. 4, the holding member 21 includes a base 213. As illustrated in Fig. 5, the base 213 is in contact with an inner wall surface of the lower housing 222. That is, the base 213 is in contact with the housing 22 at a position different from the position at which the pillar portion 212 is in contact.

[0046] 4, the holding member 21 includes a holding portion 214. The holding portion 214 holds the solenoid valve 24 between the column portion 212 and the base portion 213. The solenoid valve 24 has higher rigidity than the holding member 21.

[0047] The holding member 21 is formed to have a lower rigidity than the housing 22. For example, this rigidity relationship can be realized by forming the holding member 21 using a material that is softer than the material for forming the housing 22. Alternatively, the rigidity relationship may be realized by forming the holding member 21 and the housing 22 from the same material and appropriately adjusting the thickness and shape.

[0048] According to the above-described configuration, an external force applied to the housing 22 is transmitted through the pillars 212 and the base 213 of the holding member 21, which are disposed so as to be in active contact with the housing 22. For example, an external force applied to the upper housing 221 is transmitted to the base 213 through the pillars 212 and is released to the lower housing 222. Conversely, an external force applied to the lower housing 222 is transmitted to the pillars 212 through the base 213 and is released to the upper housing 221.

[0049] Since the rigidity of the holding member 21 is lower than that of the housing 22, the transmission of external forces can be performed while being actively cushioned. On the other hand, since the solenoid valve 24, which has a higher rigidity than the holding member 21, is held between the pillar portion 212 and the base portion 213, the solenoid valve 24 can be made to function as a reinforcing material for the holding member 21.

[0050] In addition, since circuit board 23 is slidable along pillar portion 212, the transmission of external force applied to housing 22 to circuit board 23 can be further suppressed through relative displacement between holding member 21 and circuit board 23.

[0051] That is, the holding member 21 can be given the function of supporting the circuit board 23 including electronic components within the housing 22 and the function of protecting the circuit board 23 from external forces applied to the housing 22. Also, a separate configuration for reinforcing the holding member 21 can be omitted. This makes it possible to suppress an increase in size of the shock absorbing structure 20 compared to a case in which a configuration for protecting the circuit board 23 from external forces, a configuration for supporting the circuit board 23 within the housing 22, and a configuration for reinforcing the holding member 21 are provided separately. Therefore, it is possible to enhance the protection capability of the electronic components while suppressing an increase in size of the device in which the shock absorbing structure 20 is mounted.

[0052] As illustrated in Fig. 5, upper housing 221 may include ribs 221a. As illustrated in Fig. 6, the peripheral edge of circuit board 23 may be sandwiched between ribs 221a and support portion 211 of holding member 21. Ribs 221a are an example of a part of a housing. Support portion 211 is an example of a part of a holding member.

[0053] 7, when upper housing 221 is deformed by an external force, rib 221a deforms support portion 211 and displaces circuit board 23 downward along pillar portion 212. In other words, rib 221a displaces circuit board 23 in a direction away from upper housing 221 which is deforming.

[0054] According to this configuration, the influence of deformation of upper housing 221 due to external force can be prevented from reaching circuit board 23. Therefore, the ability to protect electronic components can be further improved.

[0055] The above-described embodiment is merely an example for facilitating understanding of the present invention. The configurations according to the above-described embodiment may be appropriately modified or improved without departing from the spirit and scope of the present invention.

[0056] The configuration described with reference to the holding member 11 according to the first embodiment can be applied to the holding member 21 according to the second embodiment. For example, a pump can be mounted on the circuit board 23, and a passage through which air passes when it is delivered and sucked in by the pump can be formed in the holding member 21. The type of pump is not limited to a piezoelectric diaphragm pump. In this case, it is preferable that the holding member 21 is an integrally molded product.

[0057] The configuration described with reference to the holding member 21 according to the second embodiment can be applied to the holding member 11 according to the first embodiment. For example, a device component having higher rigidity than the holding member 11 can be held between the upper end 112a and the lower end 112b of the column portion 112.

[0058] In the shock absorbing structure 20 according to the second embodiment, as long as the circuit board 23 can slide along the pillar portion 212 of the holding member 21, the pillar portion 212 does not necessarily need to be disposed in the through hole 231. The pillar portion 212 can be disposed in a notch or groove formed in the circuit board 23. The notch or groove is an example of an opening.

[0059] The use of the device in which the shock absorbing structure according to each of the above embodiments is mounted is not particularly limited as long as it is necessary to protect a circuit board on which electronic components with relatively low resistance to vibration and shock are mounted. Examples of such other electronic components include cement resistors and electrolytic capacitors. [Explanation of symbols]

[0060] 10: shock absorbing structure, 11: holding member, 111: passage, 112: pillar portion, 112a: upper end portion, 112b: lower end portion, 113: beam portion, 113a: tip portion, 12: housing, 122a: shoulder portion, 13: circuit board, 131: piezoelectric diaphragm pump, 20: shock absorbing structure, 21: holding member, 211: support portion, 212: pillar portion, 213: base portion, 214: holding portion, 22: housing, 221a: rib, 23: circuit board, 231: through hole, 24: solenoid valve

Claims

1. A housing and a circuit board housed in the housing and having electronic components mounted thereon; A holding member housed in the housing and having a rigidity lower than that of the housing; Equipped with The holding member is A pillar portion having both ends in contact with the housing; a beam portion extending in a cantilever shape from the column portion and supporting the circuit board; It is equipped with the electronic component is a pump that pumps or draws in a fluid; The holding member has a fluid passage that allows the fluid to pass through. Shock absorbing structure.

2. The beam portion is placed on a part of the housing without being fixed thereto. The shock absorbing structure according to claim 1.

3. The tip of the beam portion faces the housing with a gap therebetween. The shock absorbing structure according to claim 1 or 2.

4. a device component housed in the housing and having a higher rigidity than the holding member; The device part is held by the column. The shock absorbing structure according to any one of claims 1 to 3.

5. A housing and a circuit board housed in the housing and having electronic components mounted thereon; A holding member housed in the housing and having a rigidity lower than that of the housing; It is equipped with the electronic component is a pump that pumps or draws in a fluid; the holding member has a fluid passage that allows the fluid to pass through, the circuit board is sandwiched between a part of the housing and a part of the holding member, When the housing is deformed by an external force, a part of the housing deforms a part of the holding member and displaces the circuit board in a direction away from the housing. Shock absorbing structure.

6. The pump is a piezoelectric diaphragm pump. The shock absorbing structure according to claim 1 or 5.

7. The holding member is an integrally molded product. The shock absorbing structure according to claim 1 or 5.

8. The fluid passage is configured to be in communication with a cuff for non-invasively measuring the blood pressure of a subject. The shock absorbing structure according to claim 1 or 5.

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