Frame, frame assembly, coil assembly and electronic expansion valve

By integrating support portions on the connection parts of the skeletons, the encapsulation process is stabilized, addressing deformation issues and improving the waterproof insulation of coil assemblies in electronic expansion valves.

JP7745763B2Active Publication Date: 2025-09-29ZHEJIANG DUNAN ARTIFICIAL ENVIRONMENT CO LTD
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Patent Information

Application Number
JP2024529710
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-12-15
Filing Date
2022-12-15
Publication Date
2025-09-29
Estimated Expiration
2042-12-15

AI Technical Summary

Technical Problem

The existing coil assemblies of electronic expansion valves suffer from deformation during injection molding, leading to uneven encapsulant distribution and gaps that compromise waterproof insulation performance.

Method used

Incorporating support portions on the connection parts of the skeletons to stabilize the encapsulation process, ensuring uniform encapsulant distribution and reducing gaps, thereby enhancing the waterproof insulation effect.

Benefits of technology

The support portions improve the encapsulation process by minimizing deformation and ensuring a uniform encapsulant distribution, thus enhancing the waterproof insulation performance of the coil assembly.

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Abstract

The present invention provides a skeleton, a skeleton assembly, a coil assembly and an electronic expansion valve, the skeleton including a frame body (10), a connection part (20) and a pin receiving seat (30), one end of the connection part (20) is provided on the peripheral surface of the frame body (10), the pin receiving seat (30) is provided on one end of the connection part (20) remote from the frame body (10), the skeleton further including a support part (40), the support part (40) is provided on the connection part (20), and the problem of poor waterproof effect of the coil assembly can be solved.
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