Slot die, method for manufacturing the slot die, coating device equipped with the slot die, and perovskite solar cell manufactured by the coating device

Abstract

The objective of this study is to develop a slot die that prevents cracks from occurring during processing of the HIP layer formed in the die flow path when manufacturing a slot die, and that prevents contamination of the die flow path by halides when manufacturing perovskite solar cells. [Solution] The Rockwell hardness of the first HIP layer formed on the manifold portion and discharge port side flow path portion of the upper body and the Rockwell hardness of the second HIP layer formed on the discharge port side flow path portion of the lower body are formed to be greater than the Rockwell hardness of the HIP layer formed on the manifold portion of the lower body, and a pre-HIPed HIP rod-shaped body is provided between the second HIP layer formed on the discharge port side flow path portion of the lower body and the third HIP layer formed on the manifold portion of the lower body.

Description

[Technical Field]

[0001] The present invention relates to a slot die in which a HIP layer is formed by HIP treatment at least from the manifold portion of the slot die flow path to the discharge outlet. More specifically, the present invention relates to a slot die in which a coating liquid or molten resin containing a halide is supplied to the die flow path, and which is provided with a HIP layer that protects the die flow path from corrosive properties caused by the halide. [Background technology]

[0002] One type of solar cell that has recently attracted particular attention is the perovskite solar cell, a technology developed in Japan. Perovskite solar cells can be manufactured as thin as a film, are lightweight and flexible, and can be installed in a variety of locations, including roofs with low load-bearing capacity, building walls and windows, carports, storage sheds, and even handheld fans and the exterior of automobiles. Furthermore, perovskite solar cells can be manufactured using a coating method, and are characterized by their high efficiency and low cost of production, making them a technology that is attracting great expectations.

[0003] FIG. 4 illustrates, for example, a process for manufacturing a solar cell component, known as the cell process. In FIG. 4, a substrate 104 having electrodes and a barrier film laminated thereon is transported by a back roll 102 and an adjustment roll 103. A coating liquid made of a perovskite compound containing a halide is supplied from a supply flow path 106 to a manifold portion 107 using a slot die 104, and then coated by being discharged from a discharge port 108, thereby forming a photoelectric conversion element layer 105.

[0004] Generally, a suitable perovskite compound to be contained in the photoelectric conversion element layer 105 is a compound represented by the following composition formula (1): RNH3PbX3···(1) Examples of suitable perovskite compounds include alkylaminolead halides represented by the following formula: In composition formula (1), R represents an alkyl group, X represents a halogen anion, and examples of halogens that make up the halogen anion include F, Cl, Br, and I. Perovskite compounds having this composition formula (1) have a wide absorption wavelength range and can absorb a wide range of wavelengths of sunlight, so they are said to have excellent photoelectric conversion efficiency.

[0005] Although perovskite solar cells are a very promising technology, there is a major problem with their manufacture. This problem is the use of halides in the manufacture of perovskite solar cells. For example, Patent Document 1 states, "When a perovskite layer is formed by coating, surfaces other than the coated surface, such as the surface of the second electrode, may be contaminated. Because perovskite contains corrosive halogen elements, it is preferable to remove the contamination." (0038) Patent Document 1 proposes devising a layer structure for the photoelectric conversion element as a countermeasure against corrosive halides, but there are also applications proposing devising a coating liquid as a countermeasure against corrosive halides.

[0006] Although various countermeasures against corrosive halogen elements have been proposed, they are currently insufficient in practice. The reason for this is thought to be that no consideration has been given to the contamination of slot dies by halides. In fact, when observing slot dies used in manufacturing processes, black contaminants are often found adhering to the manifold section of the slot die flow path, around the discharge port, and in the flow path between the manifold section and the discharge port. These are clearly contaminants caused by halides. However, there are currently very few patent applications related to countermeasures against slot die contamination by halides.

[0007] In a previous patent application (Patent Document 2), the applicant explained, "Regarding the HIP layer, which protects the die from corrosion, scratches, and abrasion caused by the binder liquid, negative electrode paste, and positive electrode paste (hereinafter referred to as coating liquid), the alloy powder used to form the HIP layer in the present invention is an alloy powder made of a Ni-Cr-Si-B nickel-based alloy or an alloy powder made of a Co-Cr-Si-B cobalt-based alloy. The HIP layer is formed by directly diffusion bonding such alloy powders using a HIP process. The HIP layer formed using such alloy powders has an HRC of 57-62, allowing the production of a die with excellent corrosion resistance against highly corrosive halogen gases (fluorine-based gases and chlorine-based gases)." Furthermore, Figure 4 of Patent Document 2 illustrates HIP layers formed by directly diffusion bonding corrosion-resistant alloy powders to the base material of the die body using a HIP process in the manifold portion of the slot die flow path and in the outlet-side flow path portion extending from the manifold portion to the outlet. The coating solution containing a halogen compound is supplied from a tank by a pump through piping to the supply port of the slot die. While contamination of the piping can be easily addressed by maintenance, contamination or scratches inside the slot die will immediately stop the operation of the production line, so measures to prevent contamination and scratches at the slot die are very important. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] WO2022 / 102128 publication [Patent Document 2] Patent No. 6654769 Summary of the Invention [Problem to be solved by the invention]

[0009] As proposed in Patent Document 2, forming a HIP layer with a Rockwell hardness of HRC 57-62 by HIP treatment on the manifold portion of the die flow path and the outlet-side flow path portion formed from the manifold portion to the outlet does not pose any problems in terms of production, but it has become clear that problems arise when using a slot die in which the curved surface (R-surface) of the manifold portion is polished after HIP treatment. Specifically, the curved surface (R-surface) of the manifold portion after HIP treatment is polished by machining with a diamond or borazon blade. When a slot die is used in the manufacturing process of the photoelectric conversion element layer, although the HIP layer solves the problem of contamination by halide, it has become clear that there is a high probability of cracks occurring on the processed surface of the curved surface (R-surface).

[0010] The present invention aims to develop a slot die that can prevent contamination of the slot die by halides by forming a HIP layer in the die flow path of the slot die, and can prevent cracks from occurring in the HIP layer during the manufacture of the slot die. [Means for solving the problem]

[0011] The slot die of the present invention, which has been made to solve the above problems, comprises an upper body and a lower body, a die flow path formed by the upper body and the lower body, and a discharge port provided at the tip of the die body for discharging a coating liquid or molten resin supplied to the die flow path. The slot die has a HIP layer formed by HIP processing in at least a manifold portion of the die flow path and a discharge port-side flow path portion extending from the manifold portion to the discharge port, in which a corrosion-resistant alloy powder or gel is directly diffusion-bonded to the base material of the die body. The HIP layer is formed such that the Rockwell hardness of the first HIP layer formed on the manifold portion and discharge port-side flow path portion of the upper body and the Rockwell hardness of the second HIP layer formed on the discharge port-side flow path portion of the lower body are greater than the Rockwell hardness of the third HIP layer formed on the manifold portion of the lower body. Furthermore, a HIP-processed rod is provided between the second HIP layer formed on the discharge port-side flow path portion of the lower body and the third HIP layer formed on the manifold portion of the lower body.

[0012] The present invention has been made to solve the above-mentioned problems by providing a method for manufacturing a slot die, in which the slot die body comprises an upper body and a lower body, the die flow path is formed by the upper body and the lower body, and a discharge port for discharging the coating liquid or molten resin supplied to the die flow path is provided at the tip of the die body, and when a HIP layer is formed by HIP treatment in at least a manifold portion of the die flow path and a discharge port-side flow path portion formed from the manifold portion to the discharge port, a second HIP layer formed in the discharge port-side flow path portion of the lower body and the manifold portion of the lower body are directly diffusion-bonded to the base material of the die body. This method for manufacturing a slot die is characterized by the steps of: placing a pre-HIP-treated HI rod-shaped body between the manifold and the third HIP layer formed in the manifold section; filling each HIP layer with alloy powder or gel suitable for forming each HIP layer so that the Rockwell hardness of the first HIP layer formed in the manifold section and the flow path section on the discharge outlet side of the upper body and the Rockwell hardness of the second HIP layer formed in the flow path section on the discharge outlet side of the lower body are greater than the Rockwell hardness of the third HIP layer formed in the manifold section of the lower body; and then forming the first, second, and third HIP layers on the base material of the die body by HIP treatment.

[0013] The coating device of the present invention, which has been made to solve the above problems, is a slot die in which a slot die body is composed of an upper body and a lower body, a die flow path is formed by the upper body and the lower body, and a discharge port for discharging the coating liquid or molten resin supplied to the die flow path is provided at the tip side of the die body, and in which a HIP layer is formed by directly diffusing alloy powder or gel having good corrosion resistance to the base material of the die body by HIP treatment at least in a manifold portion of the die flow path and in a discharge port side flow path portion formed from the manifold portion to the discharge port, in the coating device provided with the slot die. This coating device is characterized in that the Rockwell hardness of the first HIP layer formed in the flow path section and the Rockwell hardness of the second HIP layer formed in the flow path section on the discharge outlet side of the lower body are greater than the Rockwell hardness of the third HIP layer formed in the manifold section of the lower body, and a slot die is installed in which a HIP-treated HIP rod is provided between the second HIP layer formed in the flow path section on the discharge outlet side of the lower body and the third HIP layer formed in the manifold section of the lower body, and a coating liquid or molten resin containing a halide is supplied to the die flow path. [Effects of the Invention]

[0014] Preventing cracks from occurring during processing of the HIP layer prevents the long-term adhesion of black halide contaminants to the manifold section of the slot die flow path and the discharge-side flow path section formed from the manifold section to the discharge outlet. This makes it possible to form photoelectric conversion element layers over a long period of time, allowing perovskite solar cells to be manufactured continuously without compromising their quality. [Brief explanation of the drawings]

[0015] [Figure 1] Cross-sectional view of a slot die according to the present invention [Figure 2] Plan view, right side view, and B-B cross section of the slot die of the present invention [Figure 3] 1 is a diagram showing the manufacturing process of the slot die of the present invention. [Figure 4] An explanatory diagram showing a slot die when forming a photoelectric conversion element layer. DETAILED DESCRIPTION OF THE INVENTION

[0016] An embodiment of the present invention will be described below with reference to FIGS. Figure 1 is an easy-to-understand illustration of the AA cross section of the overall view of Figure 2(a) for explaining the configuration of the present invention. As shown in Figure 1, the slot die 1 of the present invention is composed of an upper body 2 and a lower body 3. The die flow path in the slot die is formed by a supply path (not shown) provided in the upper body 2 or the lower body 3, a manifold section 4 provided in the lower body, and a discharge outlet-side flow path section 5 extending from the manifold section 4 to the discharge outlet 6. A shim member, shown in Figure 2(b), is fitted between the upper body 2 and the lower body 3 to adjust the vertical width of the flow path corresponding to the thickness of the photoelectric conversion element layer.

[0017] In order to prevent corrosion by halides in the die flow passage of the slot die 1, a first HIP layer 11 is formed on the underside of the upper body 2 from the manifold section 4 along the discharge port-side flow passage section 5, a second HIP layer 12 is formed on the upper surface of the lower body 3 along the discharge port-side flow passage section 5, and a third HIP layer 13 is formed on the manifold section of the lower body 2. These first HIP layer 11, second HIP layer 12, and third HIP layer 13 are all HIP layers formed by directly diffusion-bonding alloy powder or gel made of a Ni-Cr-Si-B-based nickel-based alloy or a Ni-Cr-Si-B-based cobalt-based alloy to the die body by HIP processing.

[0018] One of the features of the present invention is that the Rockwell hardness of the first HIP layer 11 and the Rockwell hardness of the second HIP layer 12 are greater than the Rockwell hardness of the third HIP layer 13. By adopting this configuration, it is possible to prevent cracks from occurring on the curved surface of the lower body 3 in the manifold portion 4. As a result of investigation, it was found that the occurrence of cracks on the curved surface of the lower body 3 in the manifold portion 4 can be minimized by setting the Rockwell hardness of the first HIP layer 11 and the Rockwell hardness of the second HIP layer to 55 to 68 and the Rockwell hardness of the third HIP layer to 30 to 50. Setting the Rockwell hardness of the first HIP layer 11 and the Rockwell hardness of the second HIP layer 12 to the same value is efficient in terms of slot die production.

[0019] Another feature of the present invention is that a HIP-treated HIP rod 14 is provided between the second HIP layer 12 formed in the discharge port-side flow path section 5 of the lower body 3 and the third HIP layer 13 formed in the manifold 4 of the lower body 3. By adopting this configuration, it is possible to prevent cracks from occurring between the second HIP layer 12 and the third HIP layer 13 due to differences in Rockwell hardness. As a result of investigation, it was found that the occurrence of cracks between the second HIP layer 12 and the third HIP layer 13 can be suppressed for a long period of time by setting the Rockwell hardness of the HIP rod 14 to be the same as that of the second HIP layer 12 or the third HIP layer 13.

[0020] Next, a method for manufacturing the slot die 1 of the present invention will be described with reference to FIG. 3(a) shows the first stage of manufacturing a slot die, in which a member to become the upper body 2 and a member to become the lower body 3 have been assembled, with a core 21-1 set in the member to become the upper body 2 so as to form a first HIP layer 11 along the manifold section 4 and the outlet-side flow path section 5, and cores 21-2 and 21-3 set in the member to become the lower body 3 so as to form a second HIP layer 12 in the outlet-side flow path section 5 and a third HIP layer 13 in the manifold section. In addition, a HIP rod 14, which has been previously HIP-processed, is set between the second HIP layer 12 to be formed in the outlet-side flow path section 5 of the member to become the lower body 3 and the third HIP layer 13 to be formed in the manifold section.

[0021] 3(b) shows the next stage, in which alloy powder or gel made of a Ni-Cr-Si-B nickel-based alloy or Ni-Cr-Si-B cobalt-based alloy is filled into the areas where the first HIP layer 11, second HIP layer 12, and third HIP layer 13 will be formed, through the powder supply port of the HIP processing equipment. For efficiency, the same alloy powder or gel for the first HIP layer 11 and the second HIP layer 12 is filled through the first powder supply port 22 of the HIP processing equipment, and the alloy powder or gel for the third HIP layer 13 is filled through the second powder supply port 23 of the HIP processing equipment. Furthermore, the pre-HIPed HIP rod 14 is preferably made of the same alloy powder or gel as the second HIP layer or the third HIP layer to be formed.

[0022] It is efficient to fill the first HIP layer 11 with an alloy powder or gel suitable for achieving a Rockwell hardness of 55 to 68, and the second HIP layer 12 with an alloy powder or gel suitable for achieving a Rockwell hardness of 30 to 50. In FIG. 3( b ), the same alloy powder or gel is filled through the first powder supply port 22 to ensure that the first HIP layer 11 and the second HIP layer 12 have the same Rockwell hardness. However, separate powder supply ports may be provided to provide different Rockwell hardnesses for the first HIP layer 11 and the second HIP layer 12. Even in this case, however, the alloy powder or gel must be selected so that the Rockwell hardness of the first HIP layer 11 and the second HIP layer 12 is greater than the Rockwell hardness of the third HIP layer 13. It is also preferable that the hardness of the HIP rod 14, which has been pre-HIP treated, is manufactured so that it has the same hardness as the alloy powder or gel of the second or third HIP layer to be formed.

[0023] After the alloy powder or gel is filled, the next step is HIP processing, in which an alloy powder or gel made of a Ni-Cr-Si-B nickel-based alloy or a Ni-Cr-Si-B cobalt-based alloy is HIP-processed to form HIP layers that are directly diffusion-bonded to the components that will become the upper body 2 and the lower body 3. Figure 3(c) shows the assembled upper body 2 and lower body 3 components after HIP processing, unfolded. The cores are removed. With core 21-1 removed from the component that will become the upper body 2, the first HIP layer 11 is integrally formed with the upper body 2 by direct diffusion bonding. With core 21-2 removed from the component that will become the lower body 3, the second HIP layer 12 is integrally formed with the lower body 3 by direct diffusion bonding. With core 21-3 removed from the component that will become the lower body 3, the third HIP layer 13 is integrally formed with the lower body 3 by direct diffusion bonding. In addition, the HIP-processed HIP rod 14, which was placed between the second HIP layer 12 and the third HIP layer 13 at the stage shown in Figure 3(a), is directly diffusion bonded to the lower body 3, the second HIP layer, and the third HIP layer.

[0024] After this, the components that will become the upper body 2 and the lower body 3 are each ground to form a slot die as shown in Figure 1. The first HIP layer 11 and the second HIP layer are polished with a diamond grinding wheel or a borazon grinding wheel, and the third HIP layer 13 is machined with a diamond cutting tool or a borazon cutting tool to polish the curved surface (R surface) of the manifold portion. Thereafter, the slot die 1 is completed by assembling the finished upper body 2 and lower body 3 with a shim member sandwiched between them.

[0025] Next, an example of the present invention will be described. The slot die is manufactured by the manufacturing method described in the embodiment section. The size of the slot die will be explained using the overall view of Figure 2(a). In the left-hand drawing of Figure 2(a), the vertical width is generally 100 mm to 150 mm, and the horizontal width is generally 500 mm or more. In the right-hand drawing of Figure 2(a), the horizontal width is generally 80 mm to 100 mm. In the left-hand drawing of Figure 2(a), the horizontal width of 500 mm or more corresponds to the case where a single sheet is handled with a horizontal width of 500 mm, and the horizontal width is adjusted when handling multiple sheets.

[0026] The thickness of the first HIP layer formed on the upper body and the second HIP layer formed on the lower body are generally 3 mm or more. The depth of the manifold portion of the lower body is generally about 200 mm, and the thickness of the HIP layer formed there is also generally 3 mm or more. The HIP rod is a long rod with a lateral width of 3 mm to 4 mm and a vertical width of 4 mm to 5 mm, and the length of the rod is adjusted to correspond to the length of the manifold portion. Note that the sizes related to the slot die described above are merely commonly used sizes, and the slot die of the present invention is not limited to these sizes.

[0027] The applicant used an upper body 2 and a lower body 3 made of SUS329J stainless steel (HRC 25-35) as the base material for the slot die, and produced a slot die capable of handling a single wafer measuring 80 x 100 x 500 mm. In the manufacturing process of the slot die of the present invention described in the embodiment with reference to FIG. 3, a HIP rod 14, which had been prepared in advance by HIPing alloy powder made of a Ni-Cr-Si-B nickel-based alloy having a Rockwell hardness of 40, was attached to the lower body 3, and alloy powder made of a Ni-Cr-Si-B nickel-based alloy having a Rockwell hardness of 60 was filled to form a first HIP layer 11 and a second HIP layer 12, and alloy powder made of a Ni-Cr-Si-B nickel-based alloy having a Rockwell hardness of 40 was filled to form a third HIP layer 13, after which HIP treatment was performed.

[0028] The HIP-treated upper and lower bodies 2 and 3 were then ground to the shape shown in Figure 1. The HIP-treated first and second HIP layers 11 and 12 were ground with a diamond or borazon grinding wheel to a thickness of 3 mm. The HIP-treated third HIP layer 13 was ground with a diamond or borazon grinding tool to a curved (R) surface. A shim member 7 with a thickness appropriate for the thickness of the photoelectric conversion element layer was then installed between the upper and lower bodies 2 and 3, completing the slot die of the present invention. No cracks were generated in either HIP layer during the processing of the HJP layers.

[0029] In a perovskite solar cell production line where a coating fluid containing a halogen compound is supplied as the coating fluid for the photoelectric conversion element layer, the progress was observed using a completed slot die. As a result, even after one year, no black contamination caused by halogen compounds was found to have adhered to the manifold part of the slot die flow path or the discharge side flow path.

[0030] In order to prevent black contaminants due to halides from adhering to the slot die flow path by forming a HIP layer on at least the manifold portion of the die flow path and the discharge outlet side flow path portion formed from the manifold portion to the discharge outlet, (1) The Rockwell hardness of the third HIP layer of the manifold portion of the lower body is formed to be lower than the Rockwell hardness of the first HIP layer and the second HIP layer. (2) During HIP treatment, a HIP rod that has been pre-treated is placed between the second and third HIP layers to be formed before filling the alloy powder or gel that will form the HIP layers. These conditions are the gist of the present invention, and the present invention is not limited to the configurations described in the examples. [Explanation of symbols]

[0031] 1. Slot die 2. Upper body 3 Lower body 4. Manifold section 5...Discharge port side flow path section 6...Discharge port 7. Shim member 11. First HIP layer 12. Second HIP layer 13. Third HIP layer 14...HIP rod 21...Nakako 22...1st powder supply port 23...Second powder supply port 101...Base material 102 Back Roll 103 Adjustment roll 104···Slot die 105 Photoelectric conversion element layer 106...supply route 107 Manifold section 108...Discharge port

Claims

1. The slot die body comprises an upper body and a lower body, a die flow path is formed by the upper body and the lower body, and a discharge port is provided at a tip side of the die body for discharging a coating liquid or a molten resin supplied to the die flow path, In a slot die, a HIP layer is formed in at least a manifold portion of a die flow path and in a flow path portion on the discharge outlet side formed from the manifold portion to the discharge outlet, in which a corrosion-resistant alloy powder or gel is directly diffusion-bonded to the base material of the die body by HIP treatment, The HIP layers are formed such that the Rockwell hardness of the first HIP layer formed on the manifold portion and the discharge port side flow path portion of the upper body and the Rockwell hardness of the second HIP layer formed on the discharge port side flow path portion of the lower body are greater than the Rockwell hardness of the third HIP layer formed on the manifold portion of the lower body, and a HIP rod-shaped body that has been HIP-treated is provided between a second HIP layer formed on the discharge port side flow path portion of the lower body and a third HIP layer formed on the manifold portion of the lower body. A slot die characterized by:

2. The slot die according to claim 1, characterized in that the HIP layer is a HIP layer in which alloy powder or gel made of a Ni-Cr-Mo-Si-B based nickel-based alloy or a Co-Cr-Mo-Si-B based cobalt-based alloy is directly diffusion bonded by HIP treatment.

3. The slot die of claim 1, characterized in that the HIP layer is a HIP layer in which an alloy powder or gel in which ceramics are further added to a Ni-Cr-Si-B based nickel-based alloy or a Co-Cr-Si-B based cobalt-based alloy is directly diffusion bonded by HIP treatment.

4. The slot die of claim 1, wherein the Rockwell hardness of the first HIP layer and the Rockwell hardness of the second HIP layer are preferably HRC 55 to HRC 68, and the Rockwell hardness of the third HIP layer is preferably HRC 30 to HRC 50.

5. 2. The slot die of claim 1, wherein the Rockwell hardness of the first HIP layer is the same as the Rockwell hardness of the second HIP layer.

6. 2. The slot die of claim 1, wherein the Rockwell hardness of the HIP rod is the same as the Rockwell hardness of the second HIP layer or the Rockwell hardness of the third HIP layer.

7. A method for manufacturing a slot die, wherein the slot die body comprises an upper body and a lower body, a die flow path is formed by the upper body and the lower body, and a discharge port for discharging a coating liquid or molten resin supplied to the die flow path is provided at a tip side of the die body, When forming a HIP layer in which a corrosion-resistant alloy powder or gel is directly diffusion-bonded to the base material of the die body by HIP treatment in at least the manifold portion of the die flow path and the discharge port side flow path portion formed from the manifold portion to the discharge port, A method for manufacturing a slot die, comprising the steps of: placing a pre-HIP-treated HI rod-shaped body between a second HIP layer formed on the outlet-side flow path portion of the lower body and a third HIP layer formed on the manifold portion of the lower body; filling each HIP layer with alloy powder or gel suitable for forming each HIP layer so that the Rockwell hardness of the first HIP layer formed on the manifold portion and outlet-side flow path portion of the upper body and the Rockwell hardness of the second HIP layer formed on the outlet-side flow path portion of the lower body are greater than the Rockwell hardness of the third HIP layer formed on the manifold portion of the lower body; and then forming the first HIP layer, second HIP layer, and third HIP layer on the base material of the die body by HIP treatment.

8. The slot die body comprises an upper body and a lower body, a die flow path is formed by the upper body and the lower body, and a discharge port is provided at a tip side of the die body for discharging a coating liquid or a molten resin supplied to the die flow path, A coating device provided with a slot die in which a HIP layer is formed by directly diffusing alloy powder or gel having good corrosion resistance to the base material of the die body by HIP treatment in at least a manifold portion of the die flow path and a flow path portion on the discharge outlet side formed from the manifold portion to the discharge port, The coating device is provided with a slot die in which the Rockwell hardness of a first HIP layer formed on the manifold portion and the flow path portion on the discharge port side of the upper body and the Rockwell hardness of a second HIP layer formed on the flow path portion on the discharge port side of the lower body are greater than the Rockwell hardness of a third HIP layer formed on the manifold portion of the lower body, and a HIP-treated HIP rod-shaped body is provided between the second HIP layer formed on the flow path portion on the discharge port side of the lower body and the third HIP layer formed on the manifold portion of the lower body; A coating device characterized in that a coating liquid or molten resin containing a halide is supplied to the die flow path.

9. A perovskite solar cell produced by the coating apparatus of claim 8.

10. An electronic device comprising: a perovskite solar cell manufactured by the coating apparatus of claim 8; and an electronic device electrically connected to the perovskite solar cell.

11. An electronic device comprising: a perovskite solar cell manufactured by the coating apparatus of claim 8; a storage battery electrically connected to the perovskite solar cell; and an electronic device electrically connected to the perovskite solar cell and the storage battery.

12. A power supply module comprising: a perovskite solar cell manufactured by the coating device of claim 8; and a power supply IC electrically connected to the perovskite solar cell.

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