Attachment device, liquid ejection device, electrode formation device, multilayer separator formation device, and attachment method
The tape attachment device with a rotating roller allows for precise application of liquid to both surfaces and sides of electrode substrates, addressing the challenge of large adhesion in borderless printing without using electrostatic forces.
Patent Information
- Application Number
- JP2022014268
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-02-01
- Publication Date
- 2025-11-06
- Estimated Expiration
- 2042-02-01
AI Technical Summary
Existing methods for forming electrodes in electrochemical elements, such as batteries and fuel cells, struggle with accurately applying liquid to both the surface and side surfaces of electrode substrates without using electrostatic forces, which are ineffective for large adhesion amounts.
A tape attachment device comprising a tape holding member, a tape attachment member, and a tape pressure member with a rotating roller that presses the tape against the transport surface, allowing for precise installation of a liquid-adhering member during borderless printing.
Enables accurate installation of a liquid-adhering member for printing on both the surface and side surfaces of electrode substrates without adhering to the transport surface, using a small and simple device.
Smart Images

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Abstract
Description
[Technical Field]
[0001] The present invention relates to a bonding apparatus, a liquid ejection apparatus, an electrode forming apparatus, a multilayer separator forming apparatus, and a bonding method. [Background technology]
[0002] Conventionally, electrodes used in electrochemical elements such as electricity storage devices such as batteries, power generation devices such as fuel cells, and solar power generation devices have been formed by dispersing a powdered active material or catalyst composition in a liquid, applying the liquid to an electrode substrate, fixing the liquid, and drying the liquid. The liquid has usually been applied by a spray, a dispenser, a die coater, lift-up coating, or even by printing using an inkjet head.
[0003] Patent Document 1 discloses a technique in which, after applying a liquid, the liquid adhering to the transport surface during idle ejection is made to fly by electrostatic force, and then the liquid is removed by a liquid removal member. Summary of the Invention [Problem to be solved by the invention]
[0004] However, according to the prior art, when the amount of adhesion is large, such as in borderless printing in which printing is performed not only on the surface but also on the side surfaces of the electrode substrate, it is unrealistic to use electrostatic force to cause the particles to fly.
[0005] The present invention has been made in consideration of the above, and aims to enable a liquid-adhering member used for printing without adhering liquid to the transport surface during borderless printing, in which printing is performed on not only the surface but also the sides of an electrode substrate, to be accurately installed using a small and simple device. [Means for solving the problem]
[0006] In order to solve the above-mentioned problems and achieve the object, the present invention provides a tape attachment device comprising: a tape holding member that holds a tape; a tape attachment member that positions and attaches a leading end of the tape held by the tape holding member; and a tape pressure member that operates to pressurize and attach the tape, which is attached to the tape attachment member and restrained in a taut state, to a conveying surface that conveys a substrate, while peeling the tape from the tape attachment member. The tape pressure member has a rotating roller that presses the tape against the transport surface, and the rotating roller can move in an arc around the tape and move along the transport surface after coming into contact with the transport surface. It is characterized by: [Effects of the Invention]
[0007] According to the present invention, when performing borderless printing in which printing is performed on not only the surface but also the side surfaces of an electrode substrate, it is possible to accurately install a liquid-adhering member used for printing without adhering liquid to the transport surface using a small and simple device. [Brief explanation of the drawings]
[0008] [Figure 1] FIG. 1 is a diagram schematically illustrating an electrode printing device according to a first embodiment. [Figure 2] FIG. 2 is a side view showing an ink removal mechanism provided in the electrode printing device. [Figure 3] FIG. 3 is a plan view showing an ink removal mechanism provided in the electrode printing device. [Figure 4] FIG. 4 is a front view showing a cross section of the ink removing mechanism provided in the electrode printing device as viewed from the downstream side in the transport direction. [Figure 5] FIG. 5 is a diagram showing the positional relationship between the electrode substrate and the liquid adhering member. [Figure 6] FIG. 6 is a diagram showing the configuration of the tape application device. [Figure 7] FIG. 7 is a diagram showing the positional relationship of the main components of the tape application device. [Figure 8] FIG. 8 is a diagram showing the tape leading end restraining step. [Figure 9] FIG. 9 is a diagram showing the tape leading end cutting step. [Figure 10]FIG. 10 is a diagram showing the tape tip pressure attachment step. [Figure 11] FIG. 11 is a diagram showing the positional relationship of the rear end of the tape when it is attached all around. [Figure 12] FIG. 12 is a diagram showing the tape rear end cutting step. [Figure 13] FIG. 13 is a diagram showing the tape splice joining step. [Figure 14] FIG. 14 is a plan view showing an ink removing mechanism provided in the electrode printing device according to the second embodiment. [Figure 15] FIG. 15 is a front view showing a cross section of the ink removing mechanism provided in the electrode printing device as viewed from the downstream side in the transport direction. [Figure 16] FIG. 16 is a diagram schematically illustrating an electrode forming apparatus according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION
[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a bonding apparatus, a liquid ejection apparatus, an electrode forming apparatus, a multilayer separator forming apparatus, and a bonding method will be described in detail with reference to the accompanying drawings.
[0010] (First embodiment) FIG. 1 is a diagram schematically showing an electrode printing device 1 according to the first embodiment.
[0011] 1, the electrode printing device 1 is a liquid ejection device that uses liquid ink as a functional layer-forming ink to position-selectively form a functional layer on at least one of the surface of an electrode substrate (hereinafter also referred to as "electrode substrate surface") as a substrate and the surface of an active material layer (hereinafter also referred to as "active material layer surface"). In other words, the electrode printing device 1 uses liquid ink to position-selectively form a functional layer on the electrode substrate surface and / or the active material layer surface.
[0012] In this specification and claims, a functional layer is a layer that exhibits a function in the production and / or use of an electrochemical device. For example, when an insulating resin layer and / or inorganic layer is provided on an electrode active material, the functional layer functions as an insulating layer.
[0013] In addition, in the following embodiments, a configuration in which a functional layer is provided on an electrode substrate will be described, but the multilayer separator forming apparatus may also be one in which the substrate is a separator formed from a resin such as polypropylene or a nonwoven fabric rather than an electrode substrate, or one in which the substrate is a multilayer separator in which a layer different from the separator is provided on the separator.
[0014] 1, the electrode printing apparatus 1 is equipped with a transport mechanism 3 as a transport unit that transports an electrode substrate 2, which is a substrate, and / or an electrode having an active material layer on the electrode substrate 2. The electrode printing apparatus 1 also has an image recognition device 9, a liquid ejection head 4, a light source 5, a heater 6, a liquid ejection head 7, a light source 5, a heater 6, and the like arranged in this order from upstream to downstream in the transport direction X of the electrode substrate 2 by the transport mechanism 3.
[0015] The electrode substrate 2 is, for example, a current collector, which is a metal part for extracting the power stored in the electrode body inside the battery case to the outside of the battery case, or, for example, an electrode element having a current collector and an active material layer formed on the current collector.
[0016] The electrode substrate 2 is a flat conductive foil, and is generally suitable for use in secondary batteries and capacitors, which are electricity storage devices, especially lithium-ion secondary batteries. Examples of conductive foils that can be used include aluminum foil (hereinafter referred to as "aluminum foil"), copper foil, stainless steel foil, titanium foil, etched foils made by etching these foils to form fine holes, and perforated electrode substrates used in lithium-ion capacitors.
[0017] The electrode substrate 2 may be a nonwoven or woven planar carbon paper fiber electrode used in power generation devices such as fuel cells, or one of the above-mentioned perforated electrode substrates having fine holes.
[0018] The image recognition device 9 is disposed on the most upstream side in the conveying direction X, and functions as information acquisition means for acquiring defect information and position information on the surface of the active material layer formed on the electrode substrate 2. The image recognition device 9 is configured, for example, by a camera or a line sensor. The image recognition device 9 is used when an active material layer already exists on the electrode substrate 2, and recognizes and records the positions of the active material image and the positions of defects on the electrode substrate 2, so it is not an essential component and is provided as needed.
[0019] The transport mechanism 3 transports the electrode substrate 2 so that the electrode substrate 2 passes in front of the liquid ejection head 4, the light source 5, and the heater 6 in that order. The transport mechanism 3 can be configured, for example, by a drive mechanism including a belt for moving the electrode substrate 2, a combination of an air levitation mechanism or rollers, and a motor for driving these. The transport mechanism 3 may also be provided with a guide member or the like that assists the movement of the electrode substrate 2.
[0020] The liquid ejection head 4 functions as a liquid ejection head for forming an ink layer, ejecting a liquid ink (liquid composition) for forming a resin layer and / or an inorganic layer onto the electrode substrate 2 to form an ink layer. The liquid ejection head 4 ejects the liquid ink onto the electrode substrate 2 in response to image signals related to information for forming a frame pattern (described later) as an ink layer pattern, and, if necessary, defect information acquired by the image recognition device 9, to form an ink layer in a precursor state to the resin layer and / or the inorganic layer. The liquid ejection head 4 may be a linear array of heads having a width equal to or greater than the width of the electrode substrate 2 in the width direction perpendicular to the transport direction X. There are no particular limitations on the pressure generating means and driving method for ejecting the liquid ink from the liquid ejection head 4. For example, a thermal actuator that uses the pressure of vapor generated by the heat of a heating element to eject liquid ink droplets, a piezoelectric actuator that uses mechanical pressure pulses generated by a piezoelectric element to eject liquid ink droplets, or an electrostatic actuator consisting of a vibration plate and an opposing electrode may be used. Furthermore, the liquid ink may be ejected by turning the pressure on and off in a liquid ink supply system as needed.
[0021] The light source 5 has a curing function of irradiating light onto the ink layer formed on the electrode substrate 2 to cure the ink layer into a resin layer. Examples of light source 5 that can be used include mercury lamps such as low-, medium-, and high-pressure mercury lamps, tungsten lamps, arc lamps, excimer lamps, excimer lasers, semiconductor lasers, high-power UV-LEDs, YAG lasers, laser systems combining lasers with nonlinear optical crystals, high-frequency induced ultraviolet light generators, electron beam irradiation devices such as EB cure, and X-ray irradiation devices. Among these, it is preferable to use high-frequency induced ultraviolet light generators, high- and low-pressure mercury lamps, and semiconductor lasers, in order to simplify the system. Furthermore, the light source 5 may be provided with a focusing mirror or a scanning optical system.
[0022] The heater 6 functions as a curing / drying means or heating means / heating mechanism that heats the ink layer formed by ejecting the ink for forming the inorganic layer onto the electrode substrate 2, thereby promoting curing and drying the ink. As the heater 6, for example, an infrared lamp, a roller (heat roller) with a built-in heating element, a blower that blows out warm or hot air, or a boiler-type furnace that introduces hot air using steam or the like can be used.
[0023] The liquid ejection head 7 functions as an application means for applying an additional active material as needed when an active material layer is to be formed continuously on the electrode substrate 2 on which a resin layer has already been formed. Instead of the liquid ejection head 7, a die head with an intermittent function, a high-speed dispenser, a jet nozzle, a spray nozzle, or a liquid ejection head similar to the above may be used to apply the ink for forming the active material layer.
[0024] In this case, the liquid ejection head 7 functions as a liquid ejection head for forming an active material layer, which ejects an ink (liquid composition) for forming an active material layer containing an active material onto the surface of the electrode substrate 2. The liquid ejection head 7 is provided as needed, and also functions as an application means for applying the ink for forming a resin layer and / or an inorganic layer to defective areas on the surface of the active material layer, based on the defect information acquired by the image recognition device 9.
[0025] In this way, the liquid ejection head 7 may function as a liquid ejection head for forming an ink layer similar to the liquid ejection head 4 that ejects liquid ink, which is an ink for forming a resin layer and / or an inorganic layer, onto the electrode substrate 2 to form an ink layer.
[0026] The electrode printing device 1 is equipped with a transport mechanism 3, an image recognition device 9, a liquid ejection head 4, a light source 5, a heater 6, and a control device that controls the operations of the liquid ejection head 7, the light source 5, the heater 6, and the like.
[0027] Next, the operation of the electrode printing device 1 will be described.
[0028] First, the control device of the electrode printing device 1 drives the transport mechanism 3 to transport the electrode substrate 2 from right to left in the transport direction X in Fig. 1. The transport speed of the electrode substrate 2 at this time is set to, for example, within a range of 0.1 m / min to several hundred m / min.
[0029] If an image recognition device 9 is provided upstream of the electrode printing device 1, the control device of the electrode printing device 1 uses the image recognition device 9 to observe the electrode surface, reads the image using a camera or line sensor that records the position information of the defective area, recognizes the defective area and its position, and provides feedback to the subsequent liquid ink ejection and printing by the liquid ejection head 4.
[0030] When the electrode substrate 2 is transported to the front of the liquid ejection head 4, the control device of the electrode printing device 1 controls the liquid ejection head 4 in response to the image signal to eject the liquid ink. As a result, an ink layer is formed on the electrode substrate 2.
[0031] Next, the control device of the electrode printing device 1 transports the electrode substrate 2 on which the ink layer has been formed to the front of the light source 5. As the electrode substrate 2 passes in front of the light source 5, the control device of the electrode printing device 1 drives the light source 5 to irradiate light onto the ink layer formed on the electrode substrate 2, thereby curing the ink layer. The intensity of the irradiated light at the position on the surface of the ink layer differs depending on the wavelength of the light source used, but is usually several mW / cm 2 ~1KW / cm 2 The exposure amount to the ink layer can be appropriately set depending on the sensitivity of the liquid ink, the moving speed of the printing surface (the conveying speed of the electrode substrate 2), and the like.
[0032] Next, the control device of the electrode printing device 1 transports the electrode substrate 2 carrying the cured ink layer into or near the heater 6. As the electrode substrate 2 passes through or near the heater 6, the control device of the electrode printing device 1 drives the heater 6 to heat the ink layer formed on the electrode substrate 2, drying the solvent contained in the ink layer and forming an insulating layer. The heater 6 requires sufficient heating to remove the solvent from the ink layer, so its capacity is determined by factors such as the speed of the transport mechanism 3 and the boiling point of the solvent. Therefore, the heater 6 typically heats to a maximum temperature of approximately 200°C or less, preferably a relatively high temperature of 80°C to 200°C or 60°C to 180°C. The drying time depends on the thickness of the ink layer, but is typically approximately 0.5 to 60 minutes, more preferably 1 to 10 minutes. The crosslinking reaction may also be accelerated during this heating process. 1, the heating time by the heater 6 is usually relatively short, about several seconds to several tens of seconds. Therefore, when the ink layer is to be almost completely cured by the heater 6, heating is performed so that the maximum temperature reaches, for example, about 200°C or less, preferably a relatively high temperature of about 80°C to 200°C or 60°C to 180°C.
[0033] Next, if an active material layer has not yet been formed on the electrode substrate 2, the control device of the electrode printing device 1 ejects ink for forming an active material layer onto the surface of the electrode substrate 2 using a liquid ejection head 7 or the like to form an active material layer, which is then dried using a heater 6. The heater 6 requires sufficient heating to remove the solvent from the active material, and its capacity is determined by factors such as the speed of the conveying mechanism 3 and the boiling point of the solvent. Therefore, the heater 6 typically heats to a maximum temperature of, for example, about 200°C or less, preferably a relatively high temperature of about 80°C to 200°C or 60°C to 180°C. The drying time depends on the thickness of the active material layer, but is typically about 0.5 to 60 minutes, more preferably 1 to 10 minutes.
[0034] Thereafter, the control device of the electrode printing device 1 winds up the electrode substrate 2 if it is in a strip shape, or transports it to a stocker (a container for storing thin-film electrodes), thereby completing the electrode printing.
[0035] The heating means for heating the ink layer is generally known as a heat source, and any controllable means may be used, but if a light source that can emit infrared light in addition to visible light is used as the light source 5, heating can be performed simultaneously with light irradiation. This is more preferable because it can accelerate curing.
[0036] When the ink layer is irradiated with light, the ink layer is heated by the heat generated by the light source 5, so the heating means does not necessarily have to be provided as an independent component like the heater 6. However, it takes a long time to completely cure the ink layer by leaving it at room temperature using only the heat from the light source 5. Therefore, leaving it at room temperature is preferably applied to applications where a sufficiently long time can be ensured for complete curing. For example, printed matter such as a newspaper advertisement to be distributed the next day can be completely cured by leaving it at room temperature, as it can be ensured that the time required for curing is long, about one day and one night.
[0037] Examples of such light sources include the Light Hammer series (manufactured by Fusion UV Systems). LED manufacturers, such as Nichia Corporation, sell high-intensity UV-LEDs and laser diodes with a power of 1 W or more, which can be suitably used by arranging them in a line or on a plane. When light penetrates into gaps in the active material powder and is difficult to reach, an electron beam or X-ray irradiation device can be used as the light source; for example, a compact EB irradiation device manufactured by Iwasaki Electric Co., Ltd. is suitably used.
[0038] In the electrode printing device 1, which is a device for ejecting liquid ink according to this embodiment, two or more liquid ejection heads for ejecting different liquid inks (for example, liquid ink layers of both resin and inorganic layers) can be provided, which can be used for simultaneous multi-layer printing and for mixing liquid inks at the point of impact.
[0039] In the above-described electrode printing device 1, in order to move the electrode substrate 2 relative to the liquid ejection head 4 or 7, a transport mechanism 3 is provided to transport the electrode substrate 2 in order to form a resin layer and / or an inorganic layer of a desired thickness, but the liquid ejection head 4 may be moved in the transport direction X as needed. Alternatively, both the electrode substrate 2 and the liquid ejection head 4 or 7 may be moved.
[0040] Furthermore, by appropriately utilizing the techniques described in this embodiment, it is possible to perform overprinting or form a relatively thick resin layer and / or inorganic layer pattern. That is, by repeatedly ejecting liquid ink within a predetermined region of the electrode substrate and curing the resulting ink layer, it is possible to form a resin layer and / or inorganic layer having a thickness of several tens of μm or more.
[0041] When an electrode active material layer is formed on an electrode substrate 2 and a resin layer or an inorganic layer is formed using a liquid ejection head 4 or 7, the control device of the electrode printing device 1 uses an image recognition device 9 to feed back any defects in the obtained electrode active material layer, and by changing the concentration, thickness or type of liquid ejected by the liquid ejection head 4 or 7, respectively, the defects in the electrode active material layer are improved when patterning the active material, resin layer, inorganic layer, and inorganic layer.
[0042] The thin-film electrode according to this embodiment is intended to have a single-piece thickness of typically 1 mm or less, more preferably 500 μm or less. The lower limit of the thickness is not particularly specified, but is approximately 1 μm due to the limitations of current foil manufacturing technology. By realizing and providing a thin-film electrode of the above thickness that achieves the effects described above and below, it is possible to contribute to high performance, lighter weight, and smaller size of various devices (especially lithium-ion secondary batteries).
[0043] Incidentally, in the electrode printing device 1, when a liquid (liquid composition) is ejected from the liquid ejection heads 4, 7, which are ejection units, to form an ink layer or an active material layer on the electrode substrate 2, borderless printing is performed in which the ink is ejected beyond the edges of the electrode substrate 2 in the width direction perpendicular to the conveyance direction X. Here, borderless printing in this embodiment means printing not only on the surface of the electrode substrate 2 but also on the side surfaces of the electrode substrate 2, and is different from borderless printing, which generally prints on the entire surface. However, when borderless printing is performed in this manner, there is a problem in that the ink ejected outside the electrode substrate 2 stains the belts and other components of the conveyance mechanism 3.
[0044] Therefore, in the electrode printing device 1 according to this embodiment, an ink removing mechanism is used to remove the ink that has been ejected outside the electrode substrate 2. This point will be described below.
[0045] Here, Figure 2 is a side view showing the ink removal mechanism provided in the electrode printing device 1, Figure 3 is a plan view showing the ink removal mechanism provided in the electrode printing device 1, and Figure 4 is a front view showing a cross section of the ink removal mechanism provided in the electrode printing device 1 as seen from the downstream side in the transport direction.
[0046] As shown in Figures 2 to 4, the ink removal mechanism includes a liquid adhering member 11 that is provided on the belt 3a that constitutes the conveying mechanism 3 and that adheres the liquid L ejected from the liquid ejection heads 4 and 7, and a liquid removal member 12 that is a removal section that removes the liquid L on the liquid adhering member 11.
[0047] The liquid adhesive member 11 is in the form of a long tape, and is provided on the belt 3a constituting the conveying mechanism 3 so as to cover an area around one end of the electrode substrate 2 in a direction parallel to the conveying surface and perpendicular to the conveying direction X (the position where the liquid L is ejected outside the electrode substrate 2). Therefore, a part of the liquid adhesive member 11 is sandwiched between the end of the electrode substrate 2 and the belt 3a constituting the conveying mechanism 3. As a result, the electrode substrate 2 is inclined with respect to the conveying surface of the electrode substrate 2 on the belt 3a constituting the conveying mechanism 3.
[0048] The liquid adhesive member 11 is formed, for example, from an impermeable material. The term "impermeable" refers to the property that the liquid L does not penetrate into the liquid adhesive member 11 and does not flow onto the back surface of the liquid adhesive member 11. Specifically, the liquid adhesive member 11 is formed, for example, from a synthetic resin such as a fluororesin, PTFE (Polytetrafluoroetheylene), PET (Polyethyleneterephthalate) resin, or polyimide film. By forming the liquid adhesive member 11 from an impermeable material in this way, the liquid L ejected outside the electrode substrate 2 does not penetrate into the liquid adhesive member 11, and therefore does not soil the conveying surface of the electrode substrate 2 on the belt 3a constituting the conveying mechanism 3.
[0049] The liquid adhesive member 11 is placed on the belt 3a constituting the conveying mechanism 3 by a tape application device 100 (see FIG. 6) provided on the upstream side in the conveying direction of the conveying mechanism 3. In this way, by placing the liquid adhesive member 11 on the upstream side in the conveying direction of the conveying mechanism 3, the liquid L ejected from the liquid ejection heads 4, 7 can be attached to the liquid adhesive member 11 on the downstream side in the conveying direction of the conveying mechanism 3.
[0050] By providing the liquid adhesion member 11 formed from such a non-permeable material so as to cover one end of the conveying surface of the electrode substrate 2 (the position where the liquid L is ejected outside the electrode substrate 2), the liquid L ejected outside the electrode substrate 2 from the liquid ejection heads 4, 7 adheres to the liquid adhesion member 11, thereby preventing the liquid L ejected outside the electrode substrate 2 from adhering to the conveying surface of the electrode substrate 2 on the belt 3a that constitutes the conveying mechanism 3.
[0051] The liquid removing member 12 is provided in the vicinity of the roller 3b on the downstream side in the conveying direction of the electrode substrate 2 of the belt 3a constituting the conveying mechanism 3. The liquid removing member 12 removes the liquid L discharged onto the liquid adhering member 11, for example, by scraping the liquid L on the liquid adhering member 11 with a brush and then sucking it up.
[0052] Although an example has been described in which the tape application member 100 is provided on the upstream side of the electrode substrate 2 in the transport direction and the liquid removal member 12 is provided on the downstream side of the electrode substrate 2 in the transport direction, the tape application member 100 may be provided on the downstream side of the electrode substrate 2 in the transport direction and the liquid removal member 12 may be provided on the upstream side of the electrode substrate 2 in the transport direction, or each may be provided on the upstream side or downstream side of the electrode substrate 2 in the transport direction.
[0053] In this way, by removing the liquid L adhering to the liquid adhering member 11 by the liquid removal member 12 at one end of the belt 3a constituting the conveying mechanism 3 that is parallel to the conveying surface of the electrode substrate 2 and perpendicular to the conveying direction X (the position where the liquid L is ejected outside the electrode substrate 2), it is possible to prevent the liquid L from remaining inside the electrode printing device 1 at least at one end of the conveying surface, and the inside of the electrode printing device 1 can be kept clean.
[0054] Next, the positional relationship between the electrode substrate 2 and the liquid adhering member 11 will be described.
[0055] 5 is a diagram showing the positional relationship between the electrode substrate 2 and the liquid adhesive member 11. Normally, when the gap t between the electrode substrate 2 and the liquid adhesive member 11 is small, the liquid L adhering to the liquid adhesive member 11 is drawn in by capillary action, and the liquid L adhering to the liquid adhesive member 11 ends up adhering to the back surface of the electrode substrate 2. When the liquid L adheres to the back surface of the electrode substrate 2 in this way, the belt 3a constituting the conveying mechanism 3 and surrounding parts become soiled.
[0056] Therefore, in this embodiment, the distance between the liquid adhesive member 11 and the side that is located highest relative to the liquid adhesive member 11 among the sides of the surface of the electrode substrate 2 that comes into contact with the liquid adhesive member, i.e., the longest distance from the end of the electrode substrate 2 perpendicularly downward to the liquid adhesive member 11 (gap distance: t in the figure), is set to 30 μm or more. This makes it possible to prevent the liquid L that has adhered to the liquid adhesive member 11 by capillary action from flowing around to the back surface of the electrode substrate 2.
[0057] Next, a tape applying device 100 that applies the liquid adhesive member 11 to the belt 3a will be described.
[0058] Here, Fig. 6 is a diagram showing the configuration of the tape application device 100, and Fig. 7 is a diagram showing the positional relationship of the main components of the tape application device 100. Fig. 7(a) is a side view, and Fig. 7(b) is a front view. As shown in Figs. 6 and 7, the tape application device 100 holds an adhesive tape roll 200 in the form of a roll of adhesive tape 200a, at least one side of which is an adhesive surface.
[0059] As shown in Figures 6 and 7, the tape application device 100 includes guide shafts 104a and 104b positioned on a structure holding frame 104, a slide base 105 configured to be fixable onto the guide shafts 104a and 104b, a base plate 106 fixed to the slide base 105, a tape set shaft 106a which is the main body of the tape holding member, a set roll arm shaft 106b, and a tape roll stopper 106c.
[0060] The tape application device 100 is mounted on a base plate 106 fixed to a slide base 105. The tape application device 100 is movable in the axial direction of guide shafts 104a and 104b.
[0061] The tape setting shaft 106a is capable of smoothly rotating due to a bearing member or the like with low load resistance in the rotational direction, and sets the adhesive tape roll 200. The tape roll stopper 106c is a regulating member that regulates the axial direction of the adhesive tape 200a. In other words, the tape roll stopper 106c determines the axial edge position of the adhesive tape roll 200 set on the tape setting shaft 106a. By regulating the axial direction of the tape in this way and using a bearing member with low load resistance in the rotational direction, the tape posture can be stably maintained and the tape position is determined, preventing sagging or twisting, thereby improving application accuracy.
[0062] As shown in Figures 6 and 7, the tape application device 100 comprises a film set arm 107, stand pins 107a and 107b attached to the film set arm 107, a pressure roller arm 108, shafts 108a and 108b formed integrally with the pressure roller arm 108, a pressure roller 109 which is the main body of the tape pressure member, a pressure handle 110 attached to the film set arm 107, and pressure means 111.
[0063] The pressing handle 110 is configured to be rotatable around a stand pin 107b attached to the film set arm 107. The pressing handle 110 is also configured to engage with a shaft 108b formed integrally with the pressing roller arm 108.
[0064] The pressure means 111 is provided between the stand pin 107b, which is the rotation center of the pressure handle 110, and the shaft 108b formed integrally with the pressure roller arm 108. The pressure means 111 has the function of uniquely determining the position of the pressure roller arm 108 relative to the film set arm 107, and also functions to press the pressure roller arm 108 against the belt 3a that constitutes the transport mechanism 3 by the rotation of the pressure handle 110, which will be described later.
[0065] As shown in Figures 6 and 7, the tape application device 100 includes a set roll arm 112, a set roll stand 112a provided on the set roll arm 112, a tape attachment roller 113 rotatably supported on the set roll stand 112a, a tape attachment guide 114 which is the main body of the tape attachment member, and a tape rear end attachment plate 115.
[0066] The tape attachment roller 113 and the tape attachment guide 114 are provided on a set roll arm 112 that is configured to be rotatable about a set roll arm shaft 106b.
[0067] The tape attachment guide 114 is provided adjacent to and surrounds a part of the outer periphery of a tape attachment roller 113 which is rotatably supported on a set roll stand 112 a provided on the set roll arm 112 .
[0068] As shown in FIG. 7, the tape attachment guide 114 is provided with a tape edge eye mark 114a at a position in the depth direction of the drawing that coincides with the edge position of the adhesive tape roll 200 in the axial direction.
[0069] 7, a leading edge cut guide 114b, which indicates the cutting position of the leading edge of the adhesive tape 200a, is provided on the tape attachment guide 114 perpendicular to the direction in which the adhesive tape 200a is pulled out. The leading edge cut guide 114b is configured with a slit or groove so as to be able to guide the position of the cutting edge of a cutter knife or the like.
[0070] That is, by providing a slit or groove parallel to the tape width direction in the tape attachment guide 114, which serves as the tape application surface, the leading end of the adhesive tape 200a can be cut straight, thereby stabilizing the application quality of the cut portion and improving the safety of the work.
[0071] The tape trailing end joining plate 115 is provided adjacent to, but not in contact with, the belt 3a, midway along the path of the adhesive tape 200a connecting the tape set shaft 106a and the tape attachment guide 114. As shown in FIG. 7, a trailing end cutting guide 115a, similar to the leading end cutting guide 114b, is provided on the surface of the tape trailing end joining plate 115, perpendicular to the direction of withdrawal of the adhesive tape 200a. The trailing end cutting guide 115a is configured as a slit or groove to guide the leading end of a cutter knife or the like. The provision of such a tape trailing end joining plate 115 facilitates the cutting of the trailing end of the adhesive tape 200a. Furthermore, by providing a slit or groove parallel to the tape width direction on the tape-facing surface of the tape trailing end joining plate 115, the trailing end of the adhesive tape 200a can be cut straight, thereby stabilizing the quality of the cut portion. Furthermore, the safety of the operation can be improved.
[0072] First, the tape leading end restraining step in the tape application device 100 having the above-described configuration will be described.
[0073] FIG. 8 is a diagram showing the tape leading end restraining step.
[0074] First, as shown in Fig. 8, the worker pulls out the adhesive tape roll 200, which has been set on the tape set shaft 106a with its axial edge position determined, so that it faces the belt 3a that constitutes the conveyance mechanism 3. Next, the worker presses the non-adhesive side of the leading edge of the pulled-out adhesive tape 200a against the tape attachment roller 113 and the tape attachment guide 114 to attach the tape. Note that tension acts on the adhesive tape 200a due to the peel force when unwinding it from the roll, so the worker can attach the pulled-out adhesive tape 200a to the tape attachment roller 113 and the tape attachment guide 114 in a taut state without slack.
[0075] Furthermore, the worker applies the leading end of the adhesive tape 200a using as a guide the tape edge mark 114a (see FIG. 7), which indicates the position corresponding to the edge position in the width direction of the adhesive tape 200a. This allows the worker to position the adhesive tape 200a straight and prevent it from being displaced from the adhesive tape roll 200 without twisting, and thus allows the worker to restrain the leading end of the adhesive tape 200a, thereby improving the application accuracy.
[0076] Furthermore, by moving the slide base 105 on the guide shafts 104a and 104b, the operator can apply the adhesive tape 200a to any position on the belt 3a constituting the conveying mechanism 3. In other words, regardless of the width size of the electrode substrate 2, the operator can adjust the relative position between the edge of the electrode substrate 2 and the adhesive tape 200a.
[0077] Next, the tape leading end cutting process in the tape application device 100 will be described.
[0078] FIG. 9 is a diagram showing the tape leading end cutting step.
[0079] The worker cuts off the tip of the adhesive tape 200a, which has been restrained and positioned in the tape tip restraining step shown in Figure 8, and which may have adhesion of oils from the worker's hands or the like that may impair adhesiveness.
[0080] The adhesive tape 200a is often made of a thin film material that stretches easily, and when cutting by pressing a blade such as a cutter knife against it, the stretching of the adhesive tape 200a makes it difficult to determine the cutting position and to cut it straight. Also, if the cut surface of the adhesive tape 200a is curved, it is likely that parts will not adhere to the application substrate surface (the tape application roller 113 and the tape application guide 114), causing the tape to lift up after application. Furthermore, when cutting and piercing the film, a large portion of the blade is exposed, which poses a safety issue.
[0081] Therefore, in this embodiment, the adhesive tape 200a is attached to the tape set guide 114 to prevent the adhesive tape 200a from stretching, and the tip cut guide 114b guides the movement of the blade to determine the cutting position, thereby achieving high quality attachment of the cut portion and safe operation.
[0082] Specifically, as shown in Fig. 9, the operator cuts the leading end of the adhesive tape 200a along the leading end cut guide 114b with a cutter knife or the like, and then rotates the pressing handle 110 attached to the film set arm 107 in the counterclockwise direction (arrow A direction) in the figure. Then, as the pressing handle 110 rotates, the pressing roller arm 108 and the pressing roller 109 rotate. In this way, the operator can press the adhesive tape 200a, the leading end of which is restrained in the tensioned state described in Fig. 8, against the surface of the belt 3a constituting the conveying mechanism 3 to adhere it.
[0083] As shown in FIG. 7, the pressure roller 109 is configured to cover the entire width of the adhesive tape 200a so as to be able to press the adhesive tape 200a evenly.
[0084] Furthermore, the operator continues to press the pressing handle 110. This operation of pressing the pressing handle 110 increases the path length of the adhesive tape 200a, thereby increasing the tension of the adhesive tape 200a. Then, as the operator presses the pressing handle 110, the tape attachment roller 113 rotates toward the pressing roller 109 (clockwise in the figure), and the adhesive tape 200a stuck on the tape attachment roller 113 is cut off from the cut surface.
[0085] In this way, the adhesive tape 200a can be maintained in a tensed state during the tape tip separation process, so that the tip, which may come into contact with a human hand during the tip restraint process of the adhesive tape 200a described in Figure 8 and may have foreign matter such as hand oils attached that would inhibit the adhesiveness, can be removed without shifting position.
[0086] Next, the tape tip pressure joining process in the tape joining apparatus 100 will be described.
[0087] FIG. 10 is a diagram showing the tape tip pressure attachment step.
[0088] Here, the process shows a process of spreading and adhering the adhesive tape 200a, which has been attached to the surface of the tape attachment roller 113 in the tape tip separation process of Figure 9, onto the surface of the belt 3a that constitutes the conveying mechanism 3, and a process of pressing and adhering the adhesive tape 200a to the surface of the belt 3a.
[0089] From the state shown in Fig. 9, the operator rotates the pressure handle 110 clockwise around the stand pin 107b, which moves the pressure roller arm 108 together with the pressure roller 109 in the direction of arrow B in Fig. 9. At this time, the film set arm 107 is fixed in the position shown in Fig. 9 by a latch mechanism (not shown).
[0090] 9, the pressure means 111 presses the pressure roller arm 108 toward the belt 3a, and the pressure roller 109 rolls while applying pressure to the surface of the belt 3a from above the adhesive tape 200a. At this time, the tape attachment roller 113 and tape attachment guide 114 used to restrain the leading end of the adhesive tape 200a in the process described in Figures 8 and 9 are provided on the set roll arm 112 which is configured to be rotatable about the set roll arm shaft 106b, and therefore retract without interfering with the movement of the pressure roller 109.
[0091] While maintaining the posture shown in Figure 10, the worker can move the tape application device 100 and the belt 3a that constitutes the conveying mechanism 3 relative to each other, thereby applying the adhesive tape 200a to the surface of the belt 3a.
[0092] For example, by rotating the belt 3a counterclockwise (the direction of the arrow C of the roller 3c on the upstream side of the belt 3a constituting the conveying mechanism 3 in the conveying direction of the electrode substrate 2 in Figure 10), the adhesive tape 200a is unwound from the adhesive tape roll 200 as the belt 3a moves and is attached to the entire surface of the belt 3a.
[0093] The adhesive tape 200a is subjected to tension due to the peel force when it is unwound from the adhesive tape roll 200, and is applied while being pressed by the pressure roller 109, so it can be applied without shifting due to meandering in the conveying direction of the belt 3a or lifting up from the surface of the belt 3a.
[0094] In this way, the pressure roller 109 can maintain the pressing state, and the adhesive tape 200a can be stuck to the surface of the belt 3a to any position while being unwound from the adhesive tape roll 200 in accordance with the relative movement with the belt 3a constituting the conveying mechanism 3. This makes it possible to stick the adhesive tape to any length by adjusting the amount of relative movement.
[0095] Furthermore, by using the pressure roller 109, which is a rotating roller, as the tape pressure member, it can move in an arc around the periphery of the adhesive tape 200a, and after coming into contact with the surface of the belt 3a, it can move so as to be pushed up along the surface of the belt 3a. This allows the leading end of the adhesive tape 200a attached to the surface of the tape attachment roller 113 to be pressed and spread out onto the surface of the belt 3a.
[0096] Furthermore, in this embodiment, the tape path exists within the movable range of the pressure roller 109. This allows the adhesive tape 200a stuck on the tape attachment roller 113 to be cut off from the cut surface without shifting the tape position, and the tip of the adhesive tape 200a that may have come into contact with a human hand during the process of restraining the tip and may have foreign matter such as hand oils that may impair the adhesiveness attached thereto to be removed.
[0097] Next, a description will be given of how to treat the rear end of the adhesive tape 200a when the tape is attached to the belt 3a all around.
[0098] Here, FIG. 11 is a diagram showing the positional relationship of the rear end of the tape when it is attached all around.
[0099] The position indicated by "a" in Fig. 11 is the point of contact between the adhesive tape 200a unwound from the adhesive tape roll 200 and the belt 3a constituting the conveying mechanism 3. The position indicated by "b" in Fig. 11 is the position where the leading end of the initially applied adhesive tape 200a returns after making a circuit.
[0100] Next, the tape rear end cutting process in the tape application apparatus 100 will be described.
[0101] FIG. 12 is a diagram showing the tape rear end cutting step.
[0102] The operator stops the movement of the belt 3a constituting the conveying mechanism 3 at a position where the relationship between the distance from the rear end cut guide 115a to point a and the distance from point a to point b satisfies the following formula. Distance from rear end cut guide 115a to point a ≧ Distance from point a to point b
[0103] Next, as shown in FIG. 12, the operator rotates the pressure handle 110 in the direction opposite to the arrow B in FIG. 10, and unlocks and opens the film set arm 107, thereby releasing the pressure roller 109 from the pressed state.
[0104] Next, the worker presses the adhesive tape 200a unwound from the adhesive tape roll 200 against the tape trailing end joining plate 115 to join the tape.
[0105] Next, the worker cuts the adhesive tape 200a at the position of the adhesive tape rear end cutting guide 115a.
[0106] Next, the tape splicing process in the tape applying device 100 will be described.
[0107] FIG. 13 is a diagram showing the tape splice joining step.
[0108] As shown in FIG. 13, the operator closes and latches the film set arm 107, and simultaneously places the pressure roller 109 in a pressing state.
[0109] Next, the worker rotates the belt 3a constituting the conveying mechanism 3 in the direction of the arrow D shown in Fig. 13. As this rotational movement occurs, the trailing end cutting point c of the adhesive tape 200a is cut off in accordance with the movement of the belt 3a constituting the conveying mechanism 3. Then, the trailing end cutting point c of the adhesive tape 200a is pressed at the nip point of the pressure roller 109, and overlaps and adheres to point b of the leading end of the circulating tape.
[0110] By the following process, the rear end of the adhesive tape 200a is overlapped on the first-attached front end and pressed by the pressure roller 109 to be attached, so that the adhesive tape 200a can be attached to the entire circumference of the belt 3a that constitutes the conveying mechanism 3 to form the liquid-adhering member 11.
[0111] In this embodiment, the tip of the adhesive tape 200a that was initially applied is point b, which is the tip position to which the tip of the adhesive tape 200a returns after circling around, but this is not limited to this, and the application length of the adhesive tape 200a can be changed by performing a similar process at any position, not just the tip of the adhesive tape 200a.
[0112] As described above, according to this embodiment, during borderless printing, the liquid L ejected onto the electrode substrate 2 is caused to adhere to the liquid adhering member 11, and then the liquid L is removed from the liquid adhering member 11 by the liquid removing member 12. This allows printing to be performed without the liquid L adhering to the belt 3a that constitutes the transport mechanism 3 during borderless printing.
[0113] Furthermore, according to this embodiment, the leading end of the adhesive tape 200a is restrained and positioned, the adhesive tape 200a restrained in a taut state is pressed against the belt 3a to attach it, and the portion of the initially restrained leading end that is likely to have hand oils or the like thereon is cut off, and then the leading end of the adhesive tape 200a is pressed against the belt 3a to attach it, thereby enabling reliable attachment with high positional accuracy with a simple and compact configuration. In other words, according to this embodiment, the liquid-adhering member 11 used for printing without adhering liquid to the conveying surface during borderless printing can be accurately installed with a small and simple device.
[0114] The control device of the electrode printing device 1 may be configured to control the liquid ejection heads 4, 7 so as not to eject the liquid L onto areas where the liquid adhering member 11 is not provided on the conveying surface of the electrode substrate 2 on the belt 3a constituting the conveying mechanism 3. In this way, the liquid L does not spill over the liquid adhering member 11, and therefore the conveying surface of the conveying mechanism 3 and the electrode printing device 1 are not soiled.
[0115] In this embodiment, ink (liquid L) is ejected from the liquid ejection heads 4 and 7 to form an ink layer or an active material layer on the electrode substrate 2, but this is not limited to this, and an insulating layer may also be formed by ejecting liquid L containing an insulating material from the liquid ejection head.
[0116] (Second embodiment) Next, a second embodiment will be described.
[0117] The second embodiment differs from the first embodiment in that a liquid adhering member 11 is provided so as to cover both ends (positions where the liquid L is ejected outside the electrode substrate 2) of the belt 3a constituting the transport mechanism 3, which are parallel to the transport surface of the electrode substrate 2 and perpendicular to the transport direction X. In the following description of the second embodiment, the same parts as those in the first embodiment will be omitted, and only differences from the first embodiment will be described.
[0118] Here, Figure 14 is a plan view showing the ink removal mechanism provided in the electrode printing device 1 according to the second embodiment, and Figure 15 is a front view showing the cross section of the ink removal mechanism provided in the electrode printing device 1 as seen from the downstream side in the transport direction.
[0119] 14 and 15, the liquid adhesive member 11 is provided so as to cover both end portions (positions where the liquid L is ejected outside the electrode substrate 2) of the belt 3a constituting the transport mechanism 3, which are parallel to the transport surface of the electrode substrate 2 and perpendicular to the transport direction X. Therefore, a part of the liquid adhesive member 11 is sandwiched between the end portion of the electrode substrate 2 and the belt 3a constituting the transport mechanism 3. As a result, the electrode substrate 2, provided that it has flexibility, is inclined at both end portions in the direction perpendicular to the transport direction X with respect to the transport surface of the electrode substrate 2 of the belt 3a constituting the transport mechanism 3.
[0120] By providing the liquid adhesion member 11 formed from such a non-permeable material so as to cover both ends of the conveying surface of the electrode substrate 2 (positions where the liquid L is ejected outside the electrode substrate 2), the liquid L ejected outside the electrode substrate 2 from the liquid ejection heads 4, 7 adheres to the liquid adhesion member 11, thereby preventing the liquid L ejected outside the electrode substrate 2 from adhering to the conveying surface of the electrode substrate 2 on the belt 3a that constitutes the conveying mechanism 3.
[0121] In this embodiment as well, the distance between the liquid adhesive member 11 and the side that is located highest with respect to the liquid adhesive member 11 among the sides of the surface of the electrode substrate 2 that comes into contact with the liquid adhesive member, i.e., the longest distance (gap distance) perpendicularly from the end of the electrode substrate 2 to the liquid adhesive member 11, is set to 30 μm or more. This makes it possible to prevent the liquid L that has adhered to the liquid adhesive member 11 by capillary action from flowing around to the back surface of the electrode substrate 2.
[0122] (Third embodiment) Next, a third embodiment will be described.
[0123] The third embodiment differs from the first and second embodiments in that the third embodiment is an electrode forming apparatus that includes an electrode printing apparatus 1. In the following description of the third embodiment, descriptions of the same parts as those in the first and second embodiments will be omitted, and only differences from the first and second embodiments will be described.
[0124] 16 is a schematic diagram of an electrode forming apparatus 50 according to the third embodiment. As shown in Fig. 16, the electrode forming apparatus 50 includes, at the downstream of the electrode printing apparatus 1, a post-processing mechanism 20, such as a press roll as a means for pressing the obtained thin-film electrode, or a cutting mechanism such as a slit blade or laser for cutting the thin-film electrode.
[0125] Although the preferred embodiments and examples of the present invention have been described above, the present invention is not limited to such specific embodiments and examples, and unless otherwise specifically limited in the above description, various modifications and changes are possible within the spirit and scope of the present invention as defined in the claims. For example, the technical matters described in the above embodiments and examples may be combined as appropriate.
[0126] For example, in the above examples, the thin-film electrode of the present invention that exhibits the above-described effects has been described in detail as being applied to a lithium-ion secondary battery. However, the present invention is not limited to this, and can also be applied or adapted to the above-described secondary battery, which is an electricity storage device, or a power generation device such as a fuel cell.
[0127] The effects appropriately described in the embodiments of the present invention are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments of the present invention. [Explanation of symbols]
[0128] 1 Liquid discharge device 2 Base 3. Conveyor 4,7 Discharge part 11 Liquid-adhering member 100 Application device 106a Tape holding member 109 Tape pressure member 114 Tape attachment member 114a Mark 115 Tape rear end joining member 200a tape [Prior art documents] [Patent documents]
[0129] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-264172
Claims
1. a tape holding member that holds the tape; a tape attachment member for positioning and attaching the tip of the tape held by the tape holding member; a tape pressure member that operates to press the tape, which is attached to the tape attachment member and restrained in a tensile state, onto a transport surface that transports a substrate while peeling the tape from the tape attachment member; and Equipped with the tape pressure member has a rotating roller that presses the tape against the transport surface, the rotating roller is movable in an arc around the tape, and after coming into contact with the transport surface, moves along the transport surface; A sticking device characterized by:
2. A tape holding member that holds a tape; a tape attachment member for positioning and attaching the tip of the tape held by the tape holding member; a tape pressure member that operates to press the tape, which is attached to the tape attachment member and restrained in a tensile state, onto a transport surface that transports a substrate while peeling the tape from the tape attachment member; and Equipped with the tape attachment member comprises a rotating roller; When the tape pressing member moves along the transport surface and comes into contact with the transport surface, the tape pressing member can move in a manner such that it is pushed up. The application device is characterized by the above.
3. A tape holding member that holds a tape; a tape attachment member for positioning and attaching the tip of the tape held by the tape holding member; a tape pressure member that operates to press the tape, which is attached to the tape attachment member and restrained in a tensile state, onto a transport surface that transports a substrate while peeling the tape from the tape attachment member; and Equipped with The tape attachment member has a slit or groove parallel to the width direction of the tape on the surface to which the tape is attached. A sticking device characterized by:
4. A tape holding member for holding a tape; a tape attachment member for positioning and attaching the tip of the tape held by the tape holding member; a tape pressure member that operates to press the tape, which is attached to the tape attachment member and restrained in a tensile state, onto a transport surface that transports a substrate while peeling the tape from the tape attachment member; and Equipped with a tape trailing end joining member provided on the conveying surface side at a middle of the path of the tape connecting the tape holding member and the tape attachment member; A sticking device characterized by:
5. A tape holding member for holding a tape; a tape attachment member for positioning and attaching the tip of the tape held by the tape holding member; a tape pressure member that operates to press the tape, which is attached to the tape attachment member and restrained in a tensile state, onto a transport surface that transports a substrate while peeling the tape from the tape attachment member; and Equipped with the tape, the tape holding member, the tape attachment member, and the tape pressing member are movable in the width direction of the transport surface while maintaining alignment with the transport surface; A sticking device characterized by:
6. the tape pressing member is capable of continuously maintaining a state in which the tape is pressed against the transport surface; 6. The application device according to claim 1, wherein the application device is a tape application device.
7. The path of the tape exists within the movable range of the tape pressure member.
6. The application device according to claim 1, wherein the application device is a tape application device.
8. the tape attachment member comprises a rotating roller; When the tape pressing member moves along the transport surface and comes into contact with the transport surface, the tape pressing member can move in a manner such that it is pushed up.
6. The sticking device according to claim 1, 3, 4 or 5.
9. The tape has at least one adhesive side and is in a roll shape.
9. The application device according to claim 1, wherein the application device is a tape application device.
10. The tape holding member includes a regulating member for restricting the tape in the axial direction and a bearing member having low load resistance in the rotational direction.
10. The application device according to claim 1, wherein the application device is a tape application device.
11. the tape attachment member is provided with a mark indicating a position that coincides with the edge position in the width direction of the tape positioned by the tape holding member; 11. The application device according to claim 1, wherein the application device is a tape application device.
12. The tape attachment member has a slit or groove parallel to the width direction of the tape on the surface to which the tape is attached.
6. The sticking device according to claim 1, 2, 4 or 5.
13. a tape trailing end joining member provided on the conveying surface side at a middle of the path of the tape connecting the tape holding member and the tape attachment member; 6. The sticking device according to claim 1, 2, 3 or 5.
14. the tape trailing end joining member has a slit or groove parallel to the width direction of the tape on the surface facing the tape; 14. The application device according to claim 13.
15. An application device comprising: a tape holding member for holding a tape; a tape attachment member for positioning and attaching the tip of the tape held by the tape holding member; and a tape pressure member for pressing the tape, which is attached to the tape attachment member and held in a taut state, against a conveying surface for conveying a substrate while peeling the tape from the tape attachment member, thereby applying pressure to the conveying surface for conveying a substrate; a transport unit that transports the substrate; a liquid attachment member provided on the transport unit by the application device and partially sandwiched between an end of the base and the transport unit; a discharge part that discharges a liquid composition onto the substrate and the liquid-adhering member; Equipped with the substrate is inclined with respect to a conveying surface of the substrate in the conveying section; A liquid ejection device characterized by:
16. The application device according to any one of claims 1 to 14; a conveying unit that conveys the substrate; a liquid attachment member provided on the transport unit by the application device and partially sandwiched between an end of the base and the transport unit; a discharge part that discharges a liquid composition onto the substrate and the liquid-adhering member; Equipped with the substrate is inclined with respect to a conveying surface of the substrate in the conveying section; A liquid ejection device characterized by:
17. The liquid ejection device according to claim 15 or 16, a post-processing mechanism provided downstream of the liquid ejection device; Equipped with The substrate is an electrode substrate. An electrode forming apparatus characterized by:
18. The liquid ejection device according to claim 15 or 16 is provided, The substrate is a separator. A multilayer separator forming apparatus characterized by:
19. a tape holding step of holding the tape on a tape holding member; a tape attaching step of positioning and attaching the leading end of the tape held by the tape holding member to a tape attaching member; a tape pressing step of operating a tape pressing member to press the tape, which is attached to the tape attachment member and restrained in a tensile state, onto a conveying surface along which a substrate is conveyed, while peeling the tape from the tape attachment member; Including, The tape attaching step includes positioning the tape on the tape attaching member and attaching the tape to the tape attaching member, and then cutting off the leading end of the tape from the tape attaching member. A method of application characterized by the above.
20. A tape holding step of holding a tape on a tape holding member; a tape attaching step of positioning and attaching the leading end of the tape held by the tape holding member to a tape attaching member; a tape pressing step of operating a tape pressing member to press the tape, which is attached to the tape attachment member and restrained in a tensile state, onto a conveying surface along which a substrate is conveyed, while peeling the tape from the tape attachment member; Including, In the tape pressing step, the tape is attached to the conveying surface while being pressed by the tape pressing member, and then the tape pressing member is moved along the conveying surface, so that the tape is peeled off from the tape attachment member and attached to the conveying surface up to the leading end of the tape. A method of application characterized by the above.
21. A tape holding step of holding a tape on a tape holding member; a tape attaching step of positioning and attaching the leading end of the tape held by the tape holding member to a tape attaching member; a tape pressing step of operating a tape pressing member to press the tape, which is attached to the tape attachment member and restrained in a tensile state, onto a conveying surface along which a substrate is conveyed, while peeling the tape from the tape attachment member; Including, the tape pressing step presses the tape against the transport surface with the tape pressing member, and adheres the tape to an arbitrary position by moving the tape pressing member and the transport surface relative to each other; A method of application characterized by the above.
22. The substrate is an electrode substrate.
22. The application method according to any one of claims 19 to 21.
23. The substrate is a separator.
22. The application method according to any one of claims 19 to 21.
24. A tape holding step of holding a tape on a tape holding member; a tape attaching step of positioning and attaching the leading end of the tape held by the tape holding member to a tape attaching member; a tape pressing step of operating a tape pressing member to press the tape, which is attached to the tape attachment member and restrained in a tensile state, onto a conveying surface along which a substrate is conveyed, while peeling the tape from the tape attachment member; Including, The substrate is an electrode substrate. A method of application characterized by the above.
25. A tape holding step of holding a tape on a tape holding member; a tape attaching step of positioning and attaching the leading end of the tape held by the tape holding member to a tape attaching member; a tape pressing step of operating a tape pressing member to press the tape, which is attached to the tape attachment member and restrained in a tensile state, onto a conveying surface along which a substrate is conveyed, while peeling the tape from the tape attachment member; Including, The substrate is a separator. A method of application characterized by the above.
Citation Information
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