Film forming device

Abstract

To provide a deposition apparatus that can improve productivity.SOLUTION: A deposition apparatus 1 comprises a tabular anode 11, a polymer electrolyte 13 disposed between the anode 11 and a base material 12 as a cathode, a housing 14 accommodating a plating solution S, and a power supply unit 15 that applies a voltage between the anode 11 and the base material 12, with the electrolyte film 13 being in contact with the substrate 12, a metal film derived from metal ions in the plating solution S is deposited on the surface of the substrate 12 by the application of voltage. The deposition apparatus 1 has at least one first unit 10 comprising an anode 11 and a pair of polymer electrolytes 13 arranged on the upper and lower sides of the anode 11 to sandwich the anode 11.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a film formation apparatus, and more particularly to a film formation apparatus suitable for solid phase electrodeposition. [Background technology]

[0002] As an example of a film formation apparatus suitable for solid-phase electrodeposition, as described in Patent Document 1 below, there is known an apparatus that includes an electrolyte membrane placed between an anode and a substrate serving as a cathode, a container that contains the anode and a plating solution and has an opening facing the substrate covered with the electrolyte membrane, and a power supply unit that applies a voltage between the anode and the substrate, and that forms a metal coating derived from metal ions in the plating solution on the surface of the substrate by applying the voltage. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-169399 Summary of the Invention [Problem to be solved by the invention]

[0004] However, with the above-mentioned membrane forming apparatus, when the area of ​​the electrolyte membrane is constant, it is not possible to simultaneously form membranes on multiple substrates, which makes it difficult to improve productivity. On the other hand, when the area of ​​the electrolyte membrane is increased, a new problem arises in that it is difficult to ensure uniform contact between the electrolyte membrane and the substrate during membrane formation. In other words, there are limitations to increasing the area of ​​the electrolyte membrane.

[0005] The present invention has been made to solve such technical problems, and has an object to provide a film forming apparatus that can improve productivity. [Means for solving the problem]

[0006] The film formation apparatus of the present invention comprises a plate-shaped anode, an electrolyte membrane disposed between the anode and a substrate serving as a cathode, a container for accommodating a plating solution, and a power supply unit for applying a voltage between the anode and the substrate, and is configured to form a metal coating derived from metal ions in the plating solution on the surface of the substrate by applying the voltage while the electrolyte membrane is in contact with the substrate, and is characterized by having at least one first unit consisting of the anode and a pair of electrolyte membranes disposed on either side of the anode so as to sandwich the anode.

[0007] The film formation apparatus according to the present invention has at least one first unit consisting of an anode and a pair of electrolyte membranes arranged on either side of the anode, so that two substrates can be arranged on either side of the first unit. This allows for the use of both sides of the anode, allowing for single-sided film formation on two substrates simultaneously. As a result, production volume per unit time can be doubled, enabling improved productivity.

[0008] In the film forming apparatus according to the present invention, it is preferable that a second unit consisting of the anode and the electrolyte membrane disposed on one side of the anode is provided on each side of the first unit, and the second unit is disposed opposite the first unit so that the electrolyte membrane of the second unit is adjacent to the electrolyte membrane of the first unit. In this way, a substrate can be disposed between the electrolyte membrane of the second unit and the electrolyte membrane of the first unit, i.e., electrolyte membranes can be disposed on both sides of the substrate. As a result, it is possible to simultaneously form films on both sides of multiple substrates, thereby further improving productivity.

[0009] In the film forming apparatus according to the present invention, it is preferable that the first units are plural and stacked between a pair of the second units. In this way, a substrate can be disposed between the electrolyte membranes of adjacent first units, i.e., an electrolyte membrane can be disposed on each side of the substrate. This further increases the number of substrates on which simultaneous double-sided film formation can be performed, which is expected to significantly improve productivity. [Effects of the Invention]

[0010] According to the present invention, productivity can be improved. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic cross-sectional view showing a film forming apparatus according to a first embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view showing the container in an open state. [Figure 3] FIG. 10 is a schematic cross-sectional view showing a film forming apparatus according to a second embodiment. [Figure 4] FIG. 2 is a schematic cross-sectional view showing the container in an open state. [Figure 5] FIG. 10 is a schematic cross-sectional view showing how a substrate is placed by a conveying fork. [Figure 6] FIG. 2 is a schematic cross-sectional view showing a state in which a substrate is arranged. [Figure 7] FIG. 2 is a schematic cross-sectional view showing a state in which the container is closed. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, an embodiment of a film forming apparatus according to the present invention will be described with reference to the drawings. In the description of the drawings, the same elements are given the same reference numerals, and duplicated explanations will be omitted. In the following description, the up / down and left / right directions are merely directions for convenience corresponding to the state shown in the drawings, and do not limit the posture or arrangement of the film forming apparatus.

[0013] [First embodiment] 1, the film formation apparatus 1 of this embodiment is a plating apparatus for forming (in other words, depositing) a metal film on the surface of a substrate 12 by using a solid-phase electrodeposition method. The film formation apparatus 1 includes a plate-shaped anode 11, an electrolyte membrane 13 disposed between the anode 11 and the substrate 12, a container 14 for containing the substrate 12 and a plating solution S, etc., and a power supply unit 15 for applying a voltage between the anode 11 and the substrate 12.

[0014] The anode 11 is formed into a flat plate shape from a metal material and is installed inside the container 14 so that both its upper and lower surfaces can come into contact with the plating solution S filled in the container 14. More specifically, the anode 11 is installed horizontally in the center of the container 14 via an electrode support 16 so that both its upper and lower surfaces can come into contact with the plating solution S filled in the container 14. The electrode support 16 is formed from a metal material that is insoluble in the plating solution S and has an electrically conductive metal material, and has a fixed end that is fixed to the peripheral wall of the container 14 and a holding end that holds the peripheral edge of the electrolyte membrane 13. The electrode support 16 is also formed in a mesh shape or has a plurality of through holes so that the plating solution S filled in the container 14 can move up and down.

[0015] The electrode support 16 is electrically connected to the positive electrode of the power supply unit 15 via a conductor. Therefore, the anode 11 supported by the electrode support 16 is electrically connected to the positive electrode of the power supply unit 15 via the electrode support 16 and the conductor. The anode 11 may be either a soluble anode made of the same material (e.g., copper) as the metal coating formed on the substrate 12, or an anode made of a material (e.g., titanium) that is insoluble in the plating solution S.

[0016] The electrolyte membrane 13 is a so-called solid electrolyte membrane, and has a certain degree of flexibility. When the electrolyte membrane 13 is brought into contact with the plating solution S contained in the container 14, the electrolyte membrane 13 is impregnated (contains) metal ions contained in the plating solution S. When a voltage is applied, metal derived from the metal ions is deposited on the surface of the cathode (substrate 12) in contact with the electrolyte membrane 13.

[0017] The thickness of the electrolyte membrane 13 is, for example, 5 to 200 μm. Examples of materials for the electrolyte membrane 13 include fluorine-based resins such as Nafion (registered trademark) manufactured by DuPont, hydrocarbon-based resins, polyamic acid resins, and resins with ion exchange functions such as Selemion (CMV, CMD, CMF series) manufactured by AGC.

[0018] As shown in Fig. 1, in this embodiment, there are two electrolyte membranes 13. These two electrolyte membranes 13 are arranged above and below the anode 11 so as to sandwich the anode 11 therebetween. More specifically, of the two electrolyte membranes 13, the upper electrolyte membrane 13 arranged above the anode 11 is attached to the housing 14 in a state facing the anode 11 so as to form a space for storing the plating solution S between the anode 11 and the upper electrolyte membrane 13. Similarly, the lower electrolyte membrane 13 arranged below the anode 11 is attached to the housing 14 in a state facing the anode 11 so as to form a space for storing the plating solution S between the anode 11 and the lower electrolyte membrane 13.

[0019] The anode 11 and the pair of electrolyte membranes 13 (i.e., the upper electrolyte membrane 13 and the lower electrolyte membrane 13) arranged on both sides of the anode 11 constitute a first unit 10. The film forming apparatus 1 of this embodiment has one such first unit 10.

[0020] The substrate 12 is, for example, a plate-shaped member. The substrate 12 may be made of a metal material such as copper, silver, gold, nickel, aluminum, or iron, or may be made of a resin, ceramic, or the like, coated with a metal layer made of any of the above metals. In this embodiment, there are two substrates 12. One of them (the upper substrate 12) is disposed above the upper electrolyte membrane 13 in contact with the upper electrolyte membrane 13, and the other (the lower substrate 12) is disposed below the lower electrolyte membrane 13 in contact with the lower electrolyte membrane 13.

[0021] The upper substrate 12 is held by a substrate holder 17 attached to the top plate of the housing 14. More specifically, the upper substrate 12 is fixed to the substrate holder 17 by, for example, vacuum suction, and is electrically connected to the negative electrode of the power supply unit 15 via the substrate holder 17 and a conductor. The lower substrate 12 is held by a substrate holder 17 attached to the bottom plate of the housing 14. More specifically, the lower substrate 12 is fixed to the substrate holder 17 by, for example, vacuum suction, and is electrically connected to the negative electrode of the power supply unit 15 via the substrate holder 17 and a conductor.

[0022] The substrate holder 17 is formed into a flat plate shape from, for example, a conductive material. In addition to the above-mentioned vacuum suction, the substrate 12 can also be held by the substrate holder 17 by sandwiching the peripheral edge of the substrate 12 between two frames that can be separated in the vertical direction. The substrate holder 17 attached to the top plate of the housing 14 and the substrate holder 17 attached to the bottom plate of the housing 14 are connected in parallel to the power supply unit 15 via conductors.

[0023] The accommodation body 14 is formed of a material insoluble in the plating solution, and includes a lower accommodation body 141, an intermediate accommodation body 142, and an upper accommodation body 143. As shown in Fig. 2, the lower accommodation body 141 has, for example, a cylindrical shape with a bottom, and accommodates a substrate holder 17 attached to the bottom plate of the accommodation body 14 and the lower substrate 12 held by the substrate holder 17. The upper accommodation body 143 has, for example, a cylindrical shape with a top, and accommodates a substrate holder 17 attached to the top plate of the accommodation body 14 and the upper substrate 12 held by the substrate holder 17.

[0024] The intermediate container 142 is disposed between the lower container 141 and the upper container 143, has a cylindrical shape, and contains the anode 11, two electrolyte membranes 13, and the plating solution S. The anode 11 is horizontally supported in the center of the intermediate container 142 via an electrode support 16. The upper electrolyte membrane 13 is attached to the upper end of the intermediate container 142 so as to close the upper opening of the intermediate container 142. The lower electrolyte membrane 13 is attached to the lower end of the intermediate container 142 so as to close the lower opening of the intermediate container 142.

[0025] The intermediate container 142 is also provided with a supply port 142a through which the plating solution S is supplied and a discharge port 142b through which the plating solution S is discharged. In the vertical direction, the supply port 142a is located below the anode 11 disposed in the intermediate container 142, and the discharge port 142b is located above the anode 11. The supply port 142a and the discharge port 142b are connected to a tank (not shown) via piping. The plating solution S delivered from the tank by a liquid delivery pump (not shown) flows into the container 14 through the supply port 142a, passes through the electrode support 16 having a mesh or multiple through-holes, is discharged through the discharge port 142b, and returns to the tank. A pressure regulation valve (not shown) is preferably further provided downstream of the discharge port 142b. This arrangement allows the plating solution S in the container 14 to be pressurized to a predetermined pressure by the pressure regulation valve and the liquid delivery pump.

[0026] The lower housing 141, the intermediate housing 142, and the upper housing 143 are each formed so as to be able to be raised and lowered by a lifting device. The lifting device may be any device that can raise and lower the lower housing 141, the intermediate housing 142, and the upper housing 143, and may be configured, for example, with a hydraulic or pneumatic cylinder, an electric actuator, a linear guide and motor, an expandable structure, etc.

[0027] In this embodiment, the lifting device is, for example, a linear guide having a pair of guide rails 18 erected on both the left and right sides of the housing body 14, and a plurality of slide blocks 19 through which the guide rails 18 are inserted and which are slidable along the guide rails 18. The slide blocks 19 are arranged on both the left and right sides of the lower housing body 141, the intermediate housing body 142, and the upper housing body 143, respectively, and are fixed to the outer walls of the lower housing body 141, the intermediate housing body 142, and the upper housing body 143.

[0028] By using a linear guide having such a structure, the lower accommodation body 141, the intermediate accommodation body 142, and the upper accommodation body 143 can be raised and lowered, respectively. For example, after a film has been formed and the plating solution S has been discharged from the accommodation body 14, the upper accommodation body 143 and the intermediate accommodation body 142 can be raised and lowered in sequence, thereby separating the lower accommodation body 141, the intermediate accommodation body 142, and the upper accommodation body 143, respectively, and opening the accommodation body 14 (see FIG. 2). Therefore, the substrates 12 on which the film has been formed can be removed, and new substrates 12 (i.e., substrates 12 on which a film is to be formed) can be attached.

[0029] When opening the housing 14, the lower housing 141, the intermediate housing 142, and the upper housing 143 can be separated from each other by, for example, lowering the lower housing 141 and raising the upper housing 143 without moving the intermediate housing 142. Furthermore, the lower housing 141, the intermediate housing 142, and the upper housing 143 can be separated from each other by sequentially lowering the lower housing 141 and the intermediate housing 142 without moving the upper housing 143.

[0030] The film forming apparatus 1 of this embodiment has a first unit 10 consisting of an anode 11 and a pair of electrolyte membranes 13 arranged on either side of the anode 11 so as to sandwich the anode 11. By arranging two substrates 12 on both the top and bottom of the first unit 10 so as to sandwich the first unit 10, it is possible to utilize both sides of the anode 11 and simultaneously form films on one side of the two substrates 12. This doubles the production volume per unit time, thereby enabling to improve productivity.

[0031] A film forming method using the film forming apparatus 1 of this embodiment will be briefly described below.

[0032] First, the lower housing 141, the intermediate housing 142, and the upper housing 143 are moved apart using an elevator device having guide rails 18 and slide blocks 19, thereby opening the housing 14. Next, the substrates 12 are fixed to the substrate holders 17 of the lower housing 141 and the substrate holders 17 of the upper housing 143, respectively. Next, the lower housing 141, the intermediate housing 142, and the upper housing 143 are moved closer to each other using an elevator device having guide rails 18 and slide blocks 19, thereby closing the housing 14. When the housing 14 is closed, the upper electrolyte membrane 13 comes into contact with the lower surface of the upper substrate 12, and the lower electrolyte membrane 13 comes into contact with the upper surface of the lower substrate 12, respectively.

[0033] Next, the liquid feed pump is driven to send the plating solution S stored in the tank to the container 14. As a result, the plating solution S stored in the tank flows into the intermediate container 142 through the supply port 142a of the intermediate container 142. Then, under the liquid pressure of the plating solution S, the upper electrolyte membrane 13 presses against the upper substrate 12, and the lower electrolyte membrane 13 presses against the lower substrate 12.

[0034] Next, a voltage is applied between the anode 11 and the substrate 12, which is the cathode, using the power supply unit 15. When the voltage is applied, metal derived from metal ions is precipitated from the electrolyte membrane 13, and a metal coating is formed on the lower surface of the upper substrate 12 and the upper surface of the lower substrate 12. When a metal coating of a desired thickness is formed, the voltage application is terminated, compressed air is supplied from the outlet 142b into the intermediate container 142, and the plating solution S contained in the intermediate container 142 is discharged from the supply port 142a.

[0035] Next, the container 14 is opened as described above, and the substrate 12 after film formation is removed. Then, if double-sided film formation is required, the removed substrate 12 is inverted and fixed to the substrate holder 17, and if double-sided film formation is not required, a new substrate 12 is fixed to the substrate holder 17. Thereafter, the above-described procedure is repeated.

[0036] [Second embodiment] A second embodiment of the film forming apparatus will be described below with reference to Figures 3 to 7. The film forming apparatus 1A of this embodiment differs from the first embodiment described above in that a plurality of (three) first units 10 are stacked, and that second units 20 are further disposed on both sides of the stacked plurality of first units 10. Only these differences will be described below.

[0037] 3, the film forming apparatus 1A of this embodiment includes three first units 10 stacked in the vertical direction, and second units 20 respectively disposed above and below the three stacked first units 10. The second units 20 each include an anode 11 and an electrolyte membrane 13 disposed on one side of the anode 11.

[0038] More specifically, the housing 14A of the film forming apparatus 1A includes three intermediate housings 142 stacked in the vertical direction, a lower housing 144 disposed below the three intermediate housings 142, and an upper housing 145 disposed above the three intermediate housings 142. As shown in FIG. 4 , the lower housing 144 has, for example, a cylindrical shape with a bottom, and houses the anode 11, the electrolyte membrane 13, and the plating solution S. The anode 11 is suspended horizontally in the center of the lower housing 144 via an electrode support 16. The electrolyte membrane 13 is disposed above the anode 11 and is attached to the upper end of the lower housing 144 so as to close the opening of the lower housing 144.

[0039] The anode 11 and the electrolyte membrane 13 constitute a second unit 20. Here, the second unit 20 is disposed opposite the first unit 10 so that the electrolyte membrane 13 constituting the second unit 20 is adjacent to the electrolyte membrane 13 of the first unit 10.

[0040] The lower housing 144 is provided with a supply port 144a through which the plating solution S is supplied and a discharge port 144b through which the plating solution S is discharged. In the vertical direction, the supply port 144a is located below the anode 11 disposed in the lower housing 144, and the discharge port 144b is located above the anode 11. The supply port 144a and the discharge port 144b are connected to the tank via piping.

[0041] The upper housing 145 has, for example, a topped cylindrical shape and contains the anode 11, the electrolyte membrane 13, and the plating solution S. The anode 11 is horizontally suspended in the center of the upper housing 145 via an electrode support 16. The electrolyte membrane 13 is disposed below the anode 11 and is attached to the lower end of the upper housing 145 so as to close the opening of the upper housing 145. Similarly, the anode 11 and the electrolyte membrane 13 constitute a second unit 20. The second unit 20 is disposed opposite the first unit 10 so that the electrolyte membrane 13 constituting the second unit 20 is adjacent to the electrolyte membrane 13 of the first unit 10.

[0042] The upper housing 145 is provided with a supply port 145a through which the plating solution S is supplied and a discharge port 145b through which the plating solution S is discharged. In the vertical direction, the supply port 145a is located below the anode 11 disposed in the upper housing 145, and the discharge port 145b is located above the anode 11. The supply port 145a and the discharge port 145b are connected to the tank via piping.

[0043] In this embodiment, the tank and the liquid feed pump may be integrated into one unit, or one may be provided for each of the intermediate housing body 142, the lower housing body 144, and the upper housing body 145.

[0044] In this embodiment, the intermediate storage body 142, the lower storage body 144 and the upper storage body 145 are also formed so as to be able to move up and down by an elevator device having a guide rail 18 and a slide block 19.

[0045] In the film forming apparatus 1A of this embodiment, a second unit 20, three stacked first units 10, and another second unit 20 are arranged in this order from top to bottom. That is, three first units 10 are stacked between a pair of second units 20. Furthermore, each second unit 20 is arranged facing the first unit 10 so that the electrolyte membrane 13 constituting that unit is adjacent to the electrolyte membrane 13 of the first unit 10. Therefore, a substrate 12 can be arranged between the electrolyte membrane 13 of the second unit 20 and the electrolyte membrane 13 of the first unit 10, and between the electrolyte membranes 13 of adjacent first units 10. That is, an electrolyte membrane 13 can be arranged on both the top and bottom surfaces of the substrate 12. This allows simultaneous double-sided film formation on multiple (here, four) substrates 12, further significantly improving productivity.

[0046] As shown in FIG. 3, in the film forming apparatus 1A of this embodiment, the five anodes 11 are connected in parallel to the positive pole of the power supply unit 15 via their respective electrode supports 16 and conductors, and the four substrates 12 are connected in parallel to the negative pole of the power supply unit 15 via conductors.

[0047] A film formation method using the film formation apparatus 1A of this embodiment will be briefly described below.

[0048] First, the upper housing 145, the middle housings 142, and the lower housing 144 are moved apart using a lifting device having guide rails 18 and slide blocks 19, thereby opening the housing 14A (see FIG. 4).

[0049] Next, as shown in FIG. 5, the substrate 12 is removed from a substrate storage rack (not shown) using a transport fork 30 and transported to the film forming apparatus 1A. The transport fork 30 has multiple (four in this example) arms 31 extending in the same direction. Methods for removing the substrate 12 from the substrate storage rack include, for example, contact and non-contact methods of lifting the substrate 12. In the contact method, for example, a vacuum pad is attached to the tip of the arm 31, and the substrate 12 is lifted by the vacuum pad. In the non-contact method, for example, a Bernoulli chuck is attached to the tip of the arm 31, and the substrate 12 is lifted by the Bernoulli chuck.

[0050] As shown in Fig. 6, the substrate 12 transported by the transport fork 30 is placed on the upper surface of the upper electrolyte membrane 13 of each first unit 10 and on the upper surface of the electrolyte membrane 13 housed in the lower housing 144 so that the upper and lower surfaces of the substrate 12 are in contact with the electrolyte membrane 13 when the housing 14A is closed. Next, the lower housing 144, each intermediate housing 142, and the upper housing 145 are brought closer together using an elevating device having guide rails 18 and slide blocks 19, thereby closing the housing 14A. When the housing 14A is closed, the upper and lower surfaces of each substrate 12 are in contact with the electrolyte membrane 13 (see Fig. 7).

[0051] Next, the liquid feed pump is driven to send the plating solution S stored in the tank to the accommodation body 14A. As a result, the plating solution S stored in the tank flows into the intermediate accommodation body 142, the lower accommodation body 144, and the upper accommodation body 145 from the supply ports 142a, 144a, and 145a. Then, under the liquid pressure of the plating solution S, each electrolyte membrane 13 presses against the substrate 12.

[0052] Next, a voltage is applied between the anode 11 and the substrate 12, which is the cathode, using the power supply unit 15. When the voltage is applied, metal derived from the metal ions is precipitated from the electrolyte membrane 13, and a metal coating is formed on the surface of the substrate 12. At this time, since the upper and lower surfaces of the substrate 12 are in contact with the electrolyte membrane 13, metal coatings are simultaneously formed on the upper and lower surfaces of the substrate 12.

[0053] When a metal film having a desired thickness is formed, the voltage application is terminated. Next, compressed air is supplied from the outlets 142b, 144b, and 145b into the intermediate container 142, the lower container 144, and the upper container 145, and the plating solution S contained in the intermediate container 142, the lower container 144, and the upper container 145 is discharged from the supply ports 142a, 144a, and 145a.

[0054] Next, the container 14A is opened as described above, the substrate 12 on both sides of which a film has been formed is removed, and a new substrate 12 is transported and placed using the transport fork 30. Thereafter, the above-described procedure is repeated.

[0055] In the present embodiment, an example has been described in which three first units 10 are stacked between a pair of second units 20, but the present invention is not limited to this, and the number of first units 10 may be increased or decreased as appropriate. Furthermore, when the number of stacked first units 10 is increased, the number of substrates 12 on which films can be simultaneously formed on both sides can be further increased, and a significant improvement in productivity can be expected.

[0056] Furthermore, in the above-described first and second embodiments, examples have been described in which the anode 11 and the electrolyte membrane 13 are arranged to face each other in the vertical direction (i.e., vertical arrangement), but the present invention is also applicable to examples in which the anode 11 and the electrolyte membrane 13 are arranged to face each other in the left-right direction (i.e., horizontal arrangement). For example, a plurality of first units 10 may be stacked in the left-right direction, and second units 20 may be further arranged on both the left and right sides of the stacked plurality of first units 10, respectively.

[0057] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various design modifications can be made without departing from the spirit of the present invention as set forth in the claims. [Explanation of symbols]

[0058] 1, 1A: film forming apparatus, 10: first unit, 11: anode, 12: substrate, 13: electrolyte membrane, 14, 14A: container, 15: power supply unit, 16: electrode support, 17: substrate holder, 18: guide rail, 19: slide block, 20: second unit, 30: conveying fork, 31: arm, 141, 144: lower container, 142: intermediate container, 142a, 144a, 145a: supply port, 142b, 144b, 145b: discharge port, 143, 145: upper container

Claims

1. A film formation device comprising: a plate-shaped anode; an electrolyte membrane disposed between the anode and a substrate serving as a cathode; a container for accommodating a plating solution; and a power supply unit for applying a voltage between the anode and the substrate, wherein, with the electrolyte membrane in contact with the substrate, a metal coating derived from metal ions in the plating solution is formed on a surface of the substrate by applying the voltage; A film forming apparatus comprising at least one first unit including the anode and a pair of the electrolyte membranes disposed on either side of the anode so as to sandwich the anode.

2. a second unit including the anode and the electrolyte membrane disposed on one side of the anode is provided on each side of the first unit; 2. The film forming apparatus according to claim 1, wherein the second unit is disposed opposite the first unit so that the electrolyte membrane of the second unit is adjacent to the electrolyte membrane of the first unit.

3. The film forming apparatus according to claim 2 , wherein the first units are plural and are stacked between a pair of the second units.

Images