Conveying system and method for conveying objects to be processed

Abstract

To improve the efficiency of transporting the materials to be processed. [Solution] The substrate transport system 1 includes a vacuum transport chamber 7 equipped with a transport path 19 through which semiconductor substrates W are transported, a processing chamber 9 and a load lock chamber 5 arranged around the vacuum transport chamber 7 and equipped with opening and closing doors 17 and 18, a plurality of stators 11 each equipped with a coil unit 22 and arranged along the transport path 19 inside the vacuum transport chamber 7, a movable element 13 equipped with a substrate support part 13a and a magnet unit 27 that support the semiconductor substrates W, which floats and moves along the transport path 19 and transports the semiconductor substrates W supported by the substrate support part 13a into and out of the processing chamber 9 and the load lock chamber 5, and a controller 15 that controls the movable element 13. The controller 15 changes the orientation of the movable element 13 so as to change the orientation of the substrate support part 13a when at least a part of one stator 11 located in front of the opening and closing doors 17 and 18 and at least a part of the movable element 13 overlap when viewed from the Z-axis direction.

Description

Technical Field

[0001] The disclosed embodiments relate to a transport system for transporting a workpiece and a method for transporting a workpiece.

Background Art

[0002] Patent Document 1 describes semiconductor processing equipment used for transferring a semiconductor substrate between processing chambers. This semiconductor processing equipment includes a planar motor having an array of coils, and a substrate carrier that includes magnets and is levitated and position-controlled by the interaction between the magnetic field generated by the coils and the magnetic field by the magnets. The substrate carrier has a substrate support surface on which the substrate is placed, and transports the substrate between processing chambers.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The above prior art does not particularly describe how the substrate carrier transports the semiconductor substrate to the processing chamber. Therefore, there is room for improvement from the perspective of improving transport efficiency.

[0005] [[ID=3⑨]]The present invention has been made in view of such problems, and an object thereof is to provide a transport system and a method for transporting a workpiece that can improve the transport efficiency of the workpiece.

Means for Solving the Problems

[0006] ]> To solve the above problems, according to one aspect of the present invention, a transport system is applied that includes a first chamber equipped with a transport path through which a workpiece is transported, a second chamber arranged around the first chamber and equipped with an opening / closing door, a plurality of stators each equipped with a coil and arranged in the first chamber along the transport path, a movable element equipped with a support part and a magnet for supporting the workpiece, which floats and moves along the transport path and transports the workpiece supported by the support part into and out of the second chamber, and a controller for controlling the movable element, wherein the controller changes the orientation of the movable element so as to change the orientation of the support part when at least a part of one of the stators located in front of the opening / closing door and at least a part of the movable element overlap when viewed from the vertical direction.

[0007] Furthermore, according to another aspect of the present invention, a transport system is applied comprising: a first chamber equipped with a transport path through which an object to be processed is transported; a second chamber arranged around the first chamber and equipped with an opening / closing door; a plurality of stators, each equipped with a coil and arranged within the first chamber along the transport path; a movable element equipped with a support part and a magnet for supporting the object to be processed, which floats and moves along the transport path and loads the object to be processed supported by the support part into and out of the second chamber; and a controller for controlling the movable element, wherein the controller changes the orientation of the movable element so as to change the orientation of the support part when at least a portion of one of the stators located in front of the opening / closing door and at least a portion of the movable element overlap when viewed from the vertical direction; and adjusts at least one of the position and orientation of the movable element so as to be at a predetermined position in the second chamber when at least a portion of one of the stators located directly in front of the opening / closing door and at least a portion of the movable element overlap when viewed from the vertical direction.

[0008] Furthermore, according to another aspect of the present invention, a method for transporting a workpiece using a transport system comprising: a first chamber equipped with a transport path through which a workpiece is transported; a second chamber arranged around the first chamber and equipped with an opening / closing door; a plurality of stators, each equipped with a coil and arranged within the first chamber along the transport path; and a movable element equipped with a support part and a magnet for supporting the workpiece, which floats and moves along the transport path and transports the workpiece supported by the support part into and out of the second chamber, wherein the method for transporting a workpiece is applied, wherein the orientation of the movable element is changed so as to change the orientation of the support part at a position where at least a part of one of the stators positioned in front of the opening / closing door and at least a part of the movable element overlap when viewed from the vertical direction. [Effects of the Invention]

[0009] According to the embodiments of the disclosure, the transport efficiency of the workpiece can be improved. [Brief explanation of the drawing]

[0010] [Figure 1] This diagram schematically represents an example of the overall configuration of a substrate transport system. [Figure 2] This diagram schematically represents an example of a stator coil configuration. [Figure 3] This diagram schematically represents an example of the magnet configuration of a movable element. [Figure 4] This is a perspective view illustrating an example of the degrees of freedom of movement of a movable element in a planar motor, which consists of a stator and a movable element. [Figure 5A] This schematic diagram illustrates the case where the movable element rotates around its axis of rotation, with the axis of rotation of the movable element coinciding with the approximate center of a stator located in front of the opening and closing door. [Figure 5B] This is a schematic diagram illustrating the case where the movable element rotates around its axis of rotation, with the axis of rotation of the movable element offset from the center of a stator located in front of the opening and closing door. [Figure 6] This is a schematic diagram illustrating the extension and retraction movement of the single-arm retractable support unit for the circuit board. [Figure 7A]This diagram illustrates an example of operation when a movable element equipped with a single-arm retractable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 7B] This diagram illustrates an example of operation when a movable element equipped with a single-arm retractable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 7C] This diagram illustrates an example of operation when a movable element equipped with a single-arm retractable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 7D] This diagram illustrates an example of operation when a movable element equipped with a single-arm retractable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 7E] This diagram illustrates an example of operation when a movable element equipped with a single-arm retractable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 7F] This diagram illustrates an example of operation when a movable element equipped with a single-arm retractable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 8A] This diagram illustrates a partial example of the operation when a movable element equipped with a single-arm retractable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber via a second transport path. [Figure 8B] This diagram illustrates a partial example of the operation when a movable element equipped with a single-arm retractable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber via a second transport path. [Figure 8C] This diagram illustrates a partial example of the operation when a movable element equipped with a single-arm retractable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber via a second transport path. [Figure 9] This is a schematic diagram illustrating the extension and retraction movement of the circuit board support unit, which is a dual-arm retractable arm. [Figure 10A] This diagram illustrates an example of operation when a movable element equipped with a dual-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 10B]The figure shows an example of the operation when a mover having a substrate support portion with double-arm expansion and contraction transfers an unprocessed semiconductor substrate from a load lock chamber to a processing chamber and transfers a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 10C] The figure shows an example of the operation when a mover having a substrate support portion with double-arm expansion and contraction transfers an unprocessed semiconductor substrate from a load lock chamber to a processing chamber and transfers a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 10D] The figure shows an example of the operation when a mover having a substrate support portion with double-arm expansion and contraction transfers an unprocessed semiconductor substrate from a load lock chamber to a processing chamber and transfers a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 10E] The figure shows an example of the operation when a mover having a substrate support portion with double-arm expansion and contraction transfers an unprocessed semiconductor substrate from a load lock chamber to a processing chamber and transfers a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 10F] The figure shows an example of the operation when a mover having a substrate support portion with double-arm expansion and contraction transfers an unprocessed semiconductor substrate from a load lock chamber to a processing chamber and transfers a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 10G] The figure shows an example of the operation when a mover having a substrate support portion with double-arm expansion and contraction transfers an unprocessed semiconductor substrate from a load lock chamber to a processing chamber and transfers a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 10H] The figure shows an example of the operation when a mover having a substrate support portion with double-arm expansion and contraction transfers an unprocessed semiconductor substrate from a load lock chamber to a processing chamber and transfers a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 10I] The figure shows an example of the operation when a mover having a substrate support portion with double-arm expansion and contraction transfers an unprocessed semiconductor substrate from a load lock chamber to a processing chamber and transfers a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 10J]This diagram illustrates an example of operation when a movable element equipped with a dual-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 10K] This diagram illustrates an example of operation when a movable element equipped with a dual-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 10L] This diagram illustrates an example of operation when a movable element equipped with a dual-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 11] This is a schematic diagram illustrating the configuration of a circuit board support unit, which is a single-arm, non-extendable arm. [Figure 12A] This diagram illustrates an example of operation when a movable element equipped with a single-arm, non-extendable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 12B] This diagram illustrates an example of operation when a movable element equipped with a single-arm, non-extendable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 12C] This diagram illustrates an example of operation when a movable element equipped with a single-arm, non-extendable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 12D] This diagram illustrates an example of operation when a movable element equipped with a single-arm, non-extendable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 12E] This diagram illustrates an example of operation when a movable element equipped with a single-arm, non-extendable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 12F] This diagram illustrates an example of operation when a movable element equipped with a single-arm, non-extendable substrate support unit transports a processed semiconductor substrate from the processing chamber to the load lock chamber. [Figure 13] This is a schematic diagram illustrating the configuration of the substrate support section, which consists of dual, non-extendable arms. [Figure 14A]This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14B] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14C] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14D] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14E] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14F] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14G] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14H] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14I]This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14J] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14K] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14L] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 14M] This diagram illustrates an example of operation when a movable element equipped with a dual-arm, non-extendable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 15A] This is a schematic diagram illustrating an example of a semiconductor substrate position adjustment operation using a movable element. [Figure 15B] This is a schematic diagram illustrating another example of a semiconductor substrate positioning operation using a movable element. [Figure 16A] This figure illustrates an example of operation in a modified configuration in which the movable element is rotated in front of the load lock chamber, for example, when a movable element equipped with a single-arm retractable substrate support transports an unprocessed semiconductor substrate from the load lock chamber to the processing chamber. [Figure 16B] This figure illustrates an example of operation in a modified configuration in which the movable element is rotated in front of the load lock chamber, for example, when a movable element equipped with a single-arm retractable substrate support transports an unprocessed semiconductor substrate from the load lock chamber to the processing chamber. [Figure 16C]This figure illustrates an example of operation in a modified configuration in which the movable element is rotated in front of the load lock chamber, for example, when a movable element equipped with a single-arm retractable substrate support transports an unprocessed semiconductor substrate from the load lock chamber to the processing chamber. [Figure 16D] This figure illustrates an example of operation in a modified configuration in which the movable element is rotated in front of the load lock chamber, for example, when a movable element equipped with a single-arm retractable substrate support transports an unprocessed semiconductor substrate from the load lock chamber to the processing chamber. [Figure 16E] This figure illustrates an example of operation in a modified configuration in which the movable element is rotated in front of the load lock chamber, for example, when a movable element equipped with a single-arm retractable substrate support transports an unprocessed semiconductor substrate from the load lock chamber to the processing chamber. [Figure 16F] This figure illustrates an example of operation in a modified configuration in which the movable element is rotated in front of the load lock chamber, for example, when a movable element equipped with a single-arm retractable substrate support transports an unprocessed semiconductor substrate from the load lock chamber to the processing chamber. [Figure 17] This diagram schematically represents an example of the overall configuration of a substrate transport system in a modified configuration that includes a temporary storage area. [Figure 18A] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18B] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18C] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18D]This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18E] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18F] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18G] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18H] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18I] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18J] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18K]This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18L] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18M] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18N] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18O] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18P] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18Q] This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Figure 18R]This figure illustrates an example of operation in a modified configuration for setting up a temporary storage area, where a movable element equipped with a single-arm retractable substrate support unit transports unprocessed semiconductor substrates from the load lock chamber to the processing chamber, and also transports processed semiconductor substrates from the processing chamber to the load lock chamber. [Modes for carrying out the invention]

[0011] The embodiments will be described below with reference to the drawings.

[0012] <1. Overall configuration of the substrate transport system> Referring to Figure 1, an example of the overall configuration of the substrate transport system according to the embodiment will be described. The substrate transport system 1 (an example of a transport system) is a system that transports a semiconductor substrate W (an example of an object to be processed) in a vacuum environment and performs a predetermined process on the semiconductor substrate W. The semiconductor substrate W is also called a semiconductor wafer. In this embodiment, a processed semiconductor substrate is referred to as Wa, an unprocessed semiconductor substrate as Wb, and if there is no distinction between processed and unprocessed, it is referred to as semiconductor substrate W. In each figure, the processed semiconductor substrate Wa is shown with dot hatching, and the unprocessed semiconductor substrate Wb is shown in white.

[0013] Figure 1 is a schematic diagram illustrating an example of the overall configuration of a substrate transport system. As shown in Figure 1, the substrate transport system 1 includes an atmospheric transport chamber 3, a load lock chamber 5, a vacuum transport chamber 7, a plurality of processing chambers 9, a stator 11, a movable element 13, and a controller 15.

[0014] The atmospheric transport chamber 3 is an atmospheric chamber and is equipped with an atmospheric transport device (not shown) for transporting semiconductor substrates W. The atmospheric transport device takes out unprocessed semiconductor substrates Wb contained in the load port (not shown) and places them on the mounting table Wp1 in the load lock chamber 5. The atmospheric transport device also takes out processed semiconductor substrates Wa placed on the mounting table Wp1 in the load lock chamber 5 and places them in the load port.

[0015] The load lock chamber 5 (an example of the second chamber) is located around the vacuum transport chamber 7. In the example shown in Figure 1, for example, two load lock chambers 5 are connected to the wall portion 7c of the vacuum transport chamber 7 via an opening / closing door 18. The load lock chamber 5 has a platform Wp1 on which the semiconductor substrate W is placed. In each figure, the platform Wp1 of the load lock chamber 5 is shown by a dashed line. The load lock chamber 5 controls the pressure between atmospheric pressure and vacuum when transporting the semiconductor substrate W between the atmospheric transport chamber 3 and the vacuum transport chamber 7. The load lock chamber 5 is equipped with an opening / closing door 18 that opens and closes the opening of the load lock chamber 5. The opening / closing door 18 is also called a gate valve. In each load lock chamber 5, with the opening / closing door 18 open, the semiconductor substrate Wa is loaded and the semiconductor substrate Wb is unloaded by the substrate support portion 13a of the movable element 13.

[0016] The vacuum transport chamber 7 (an example of the first chamber) is depressurized to a vacuum atmosphere, and the semiconductor substrate W is transported in this vacuum atmosphere. In the example shown in Figure 1, the vacuum transport chamber 7 is formed in a roughly rectangular shape when viewed from above. Multiple processing chambers 9 (for example, three on each side, a total of six) are connected to opposing walls 7a and 7b on the long side of the vacuum transport chamber 7 via opening / closing doors 17. Multiple load lock chambers 5 (for example, two) are connected to one wall 7c on the short side of the vacuum transport chamber 7 via opening / closing doors 18. In this embodiment, the longitudinal direction of the vacuum transport chamber 7, that is, the direction in which multiple processing chambers 9 with opening / closing doors 17 facing the same direction are lined up horizontally along wall 7a or wall 7b of the vacuum transport chamber 7, is defined as the X-axis direction (an example of the first direction). The short direction of the vacuum transport chamber 7, that is, the direction in which two processing chambers 9 with opening / closing doors 17 facing each other are defined as the Y-axis direction (an example of the second direction). The vertical direction (up and down direction) is defined as the Z-axis direction. The X, Y, and Z axes are orthogonal to each other. Note that the X and Y axes do not necessarily have to be orthogonal; they only need to intersect. In this case, the vacuum transport chamber 7 may have a shape other than a rectangle (for example, a parallelogram or trapezoid).

[0017] The vacuum transport chamber 7 is equipped with a transport path 19 through which semiconductor substrates W are transported. The transport path 19 is formed by arranging a plurality of stators 11 in a line. The transport path 19 comprises a first transport path 19A and a second transport path 19B, and is formed in a substantially ladder shape. The first transport path 19A is formed by arranging a plurality of stators 11 in a line along the X-axis direction. Two first transport paths 19A are arranged in the vacuum transport chamber 7, extending substantially parallel to each other in the X-axis direction. The two first transport paths 19A are spaced apart from each other with a gap equal to the dimensions of at least one stator 11 in the Y-axis direction. In this embodiment, the two first transport paths 19A are spaced apart with a gap equal to the dimensions of two stators 11, but they may be spaced apart with a gap equal to the dimensions of one or three or more stators 11. Also, the number of first transport paths 19A is not limited to two; there may be one or three or more.

[0018] The second transport path 19B is formed by arranging at least one stator 11 in a line along the Y-axis direction and connecting the two first transport paths 19A in the Y-axis direction. In the example shown in Figure 1, for example, four second transport paths 19B are arranged. Of these four second transport paths 19B, three of them, excluding the second transport path 19B immediately preceding the load lock chamber 5, connect the two first transport paths 19A in the Y-axis direction at a position in front of the opening / closing door 17 of the processing chamber 9. Each second transport path 19B is formed by, for example, two stators 11. Note that the second transport path 19B may be formed by one stator 11, or by three or more stators 11.

[0019] Furthermore, the transport path 19 has a connection point 19C where the first transport path 19A and the second transport path 19B intersect. The connection point 19C coincides with the location of the stator 11 positioned directly in front of the opening and closing doors 17 and 18. In Figure 1, the connection point 19C is shown with a thick line.

[0020] Each stator 11 is equipped with multiple coils and is arranged along a transport path 19 within the vacuum transport chamber 7. The stator 11 is formed in a roughly rectangular shape (rectangle or square) when viewed from the Z-axis direction. Each movable element 13 is equipped with multiple magnets and levitates and moves along the transport path 19 to transport the semiconductor substrate W. The stator 11 and movable elements 13 constitute a planar motor 20. The movable elements 13 levitate due to the interaction of the magnetic field generated by the coils of the stator 11 and the magnetic field generated by the magnets of the movable elements 13, and their position is controlled by a controller 15. The movable elements 13 are equipped with a substrate support section 13a (an example of a support section) that supports the semiconductor substrate W. The movable elements 13 transport the semiconductor substrate W supported by the substrate support section 13a between the load lock chamber 5 and the processing chamber 9, or between multiple processing chambers 9, and load and unload it into and out of the load lock chamber 5 and the processing chamber 9. Note that while Figure 1 shows, for example, four movable elements 13, the number of movable elements 13 may be one or more than four.

[0021] The processing chambers 9 (an example of the second chamber) are located around the vacuum transport chamber 7. In the example shown in Figure 1, for example, six processing chambers 9 are connected to the walls 7a and 7b, three each, via opening / closing doors 17. The three processing chambers 9 connected to wall 7a are arranged along the X-axis, and the three processing chambers 9 connected to wall 7b are also arranged along the X-axis. Each processing chamber 9 has a mounting platform Wp2 on which a semiconductor substrate W is placed. In each figure, the mounting platform Wp2 of the processing chamber 9 is shown by a dashed line. In each processing chamber 9, a predetermined process is performed on the unprocessed semiconductor substrate Wb placed on the mounting platform Wp2. The predetermined process includes, for example, film deposition, etching, ashing, cleaning, etc. The number of processing chambers 9 is not particularly limited and may be one or more than six, depending on the number of processes to be performed. Each processing chamber 9 is equipped with an opening / closing door 17 that opens and closes the opening of the processing chamber 9. The opening / closing door 17 is also called a gate valve. In each processing chamber 9, with the opening / closing door 17 open, semiconductor substrates Wb are loaded and semiconductor substrates Wa are unloaded by the substrate support portion 13a of the movable element 13.

[0022] The controller 15 controls each device of the substrate transport system 1. For example, the controller 15 controls the position and orientation of each movable element 13 in the vacuum transport chamber 7, the extension and retraction of the substrate support part 13a, the opening and closing of the opening and closing doors 17 and 18, and the processing of semiconductor substrates W in each processing chamber 9. The arrows shown in Figure 1 show an example of the direction of movement and rotation of the movable element 13. The controller 15 is configured as, for example, a computer. Although not shown in the figure, the controller 15 may have, for example, a processor such as a CPU, memory such as ROM or RAM, an input device, an output device, a recording device, a communication device, etc.

[0023] <2. Configuration of the stator and movable parts> Next, an example of the configuration of the stator 11 and the movable element 13 will be described with reference to Figures 2 to 4.

[0024] Figure 2 is a schematic diagram illustrating an example of the coil configuration of the stator 11. As shown in Figure 2, the stator 11 has a stator base 21 and a coil unit 22. The coil unit 22 is formed by integrating multiple substrate coils. The coil unit 22 is formed in a roughly rectangular shape (rectangle or square) when viewed from the Z-axis direction, and the stator base 21 is formed in a roughly rectangular shape (rectangle or square) that is a predetermined size larger than the coil unit 22 when viewed from the Z-axis direction. The coil unit 22 has two sets of first substrate coils 23A, 23B, each formed in a roughly rectangular shape with the X-axis direction as its longitudinal direction and equipped with multiple substrate coils with different phases (in the example shown in Figure 2, three phases: U-phase, V-phase, and W-phase), and two sets of second substrate coils 25A, 25B, each formed in a roughly rectangular shape with the Y-axis direction as its longitudinal direction and equipped with multiple substrate coils with different phases (in the example shown in Figure 2, three phases: U-phase, V-phase, and W-phase). The first substrate coil 23A has a U-phase substrate coil Uy1, a V-phase substrate coil Vy1, and a W-phase substrate coil Wy1. Each of the substrate coils Uy1, Vy1, and Wy1 is formed by concentrated winding in a substantially rectangular shape with the X-axis direction as its longitudinal direction, and is arranged adjacent to each other in the Y-axis direction. Similarly, the first substrate coil 23B has a U-phase substrate coil Uy2, a V-phase substrate coil Vy2, and a W-phase substrate coil Wy2. Each of the substrate coils Uy2, Vy2, and Wy2 is formed by concentrated winding in a substantially rectangular shape with the X-axis direction as its longitudinal direction, and is arranged adjacent to each other in the Y-axis direction. The two first substrate coils 23A and 23B are arranged adjacent to each other in the Y-axis direction.

[0025] Furthermore, the second substrate coil 25A has a U-phase substrate coil Ux1, a V-phase substrate coil Vx1, and a W-phase substrate coil Wx1. Each of the substrate coils Ux1, Vx1, and Wx1 is formed by concentrated winding in a substantially rectangular shape with the Y-axis direction as its longitudinal direction, and is arranged adjacent to each other in the X-axis direction. Similarly, the second substrate coil 25B has a U-phase substrate coil Ux2, a V-phase substrate coil Vx2, and a W-phase substrate coil Wx2. Each of the substrate coils Ux2, Vx2, and Wx2 is formed by concentrated winding in a substantially rectangular shape with the Y-axis direction as its longitudinal direction, and is arranged adjacent to each other in the X-axis direction. The two second substrate coils 25A and 25B are arranged adjacent to each other in the X-axis direction.

[0026] The coil unit 22 is constructed by stacking two first substrate coils 23A and 23B and two second substrate coils 25A and 25B in the Z-axis direction. Figure 2 illustrates an example where the second substrate coils 25A and 25B are stacked on top of the first substrate coils 23A and 23B, but the opposite is also possible, where the first substrate coils 23A and 23B are stacked on top of the second substrate coils 25A and 25B. Furthermore, the number of first substrate coils 23A and 23B and second substrate coils 25A and 25B is not limited to two sets each when the three phases (U-phase, V-phase, and W-phase) are considered as one set. For example, there may be one set, or three or more sets. Also, the number of first substrate coils 23A and 23B and the number of second substrate coils 25A and 25B are not limited to the same number, but may be different numbers.

[0027] Figure 3 is a schematic diagram illustrating an example of the magnet configuration of the movable element 13. As shown in Figure 3, the movable element 13 comprises the aforementioned substrate support portion 13a and the movable element base 13b. The movable element 13 is formed in a substantially rectangular shape (rectangle or square) when viewed from the Z-axis direction. When viewed from the Z-axis direction, the dimensions of the movable element 13 in both the X-axis direction and the Y-axis direction are substantially the same as those of the stator 11. Note that the movable element 13 does not have to be the same size as the stator 11, as long as it is large enough to prevent passing each other on the transport path 19. Furthermore, the movable element 13 may be configured so that the dimension in either the X-axis direction or the Y-axis direction is substantially the same as that of the stator 11.

[0028] The movable element 13 has a magnet unit 27 mounted on a movable element base 13b and levitates and moves on the stator 11. The magnet unit 27 has four magnet units 27A, 27B, which consist of two magnet units 27A and two magnet units 27B. The magnet units 27A and 27B have different orientations from each other. The magnet unit 27A has a permanent magnet 27n that is elongated in the Y-axis direction and has the N pole on the side facing the stator 11, and a permanent magnet 27s that is elongated in the Y-axis direction and has the S pole on the side facing the stator 11, and is configured as a Halbach array in which another permanent magnet is inserted between the permanent magnets 27n and 27s so that its magnetization direction is perpendicular to the magnetization direction of the permanent magnets 27n and 27s. The magnet unit 27B has a permanent magnet 27n that is elongated in the X-axis direction and has the N pole on the side facing the stator 11, and a permanent magnet 27s that is elongated in the X-axis direction and has the S pole on the side facing the stator 11. It is configured as a Halbach array in which another permanent magnet is inserted between the permanent magnets 27n and 27s so that its magnetization direction is perpendicular to the magnetization direction of the permanent magnets 27n and 27s. The four magnet units 27A and 27B are arranged alternately around a rotation axis AX that is approximately parallel to the Z-axis direction. That is, two magnet units 27A are arranged point-symmetrically with respect to the rotation axis AX, and two magnet units 27B are arranged point-symmetrically with respect to the rotation axis AX. The dimensions of the magnet unit 27 in the X-axis and Y-axis directions are approximately the same as those of the coil unit 22 of the stator 11.

[0029] Figure 4 is a perspective view showing an example of the degrees of freedom of movement of the movable element 13 in a planar motor 20 composed of a stator 11 and a movable element 13. As shown in Figure 4, the movable element 13 obtains thrust in the X-axis direction through the interaction of the magnetic field from the second substrate coils 25A and 25B of the stator 11 and the magnetic field from the magnet unit 27A. The movable element 13 also obtains thrust in the Y-axis direction through the interaction of the magnetic field from the first substrate coils 23A and 23B of the stator 11 and the magnetic field from the magnet unit 27B. Furthermore, the movable element 13 obtains a rotational thrust around a rotation axis AX that is substantially parallel to the Z-axis direction (vertical direction) through the combination of the above X-axis and Y-axis thrusts. As a result, the movable element 13 is movable in the horizontal direction (all directions on the XY plane, including the X-axis and Y-axis directions) and is rotatable in the θz direction, which is the rotational direction around the Z-axis (rotation axis AX). In other words, the movable element 13 is capable of 3 degrees of freedom of movement. Furthermore, the movable element 13 gains buoyancy in the Z-axis direction through the interaction of the magnetic fields from the first substrate coils 23A, 23B and the second substrate coils 25A, 25B with the magnetic fields from the magnet units 27A, 27B. This makes it possible to adjust the levitation height in the Z-axis direction, the tilt in the θx direction (rotation direction around the X-axis), and the tilt in the θy direction (rotation direction around the Y-axis) by adjusting the current phase of the first substrate coils 23A, 23B and the second substrate coils 25A, 25B. In this case, the movable element 13 becomes capable of 6 degrees of freedom.

[0030] <3. Positional relationship between the movable part and the stator when the movable part is rotated> Next, with reference to Figures 5A and 5B, an example of the positional relationship between the movable element 13 and the stator 11 when the movable element 13 is rotated will be described.

[0031] The controller 15 causes the movable element 13 to change the orientation of the substrate support 13a at a position where at least a portion of one stator 11 located in front of the opening / closing doors 17, 18 and at least a portion of the movable element 13 overlap when viewed from the Z-axis direction. Note that the one stator 11 located in front of the opening / closing door 17 includes not only the stator 11 located directly in front of the opening / closing door 17, but also the stator 11 located on the extension line in the direction extending in the Y-axis direction from the opening / closing door 17. That is, the one stator 11 located in front of the opening / closing door 17 may be the stator 11 located directly in front of the opening / closing door 17, or any one of the stators 11 that constitute the second transport path 19B in front of the opening / closing door 17. Similarly, the one stator 11 located in front of the opening / closing door 18 includes not only the stator 11 located directly in front of the opening / closing door 18, but also the stator 11 located on the extension line in the direction extending in the X-axis direction from the opening / closing door 18. In other words, one stator 11 positioned in front of the opening / closing door 18 is one of the stators 11 that constitute the first transport path 19A connected to the opening / closing door 18. Furthermore, the position where at least a part of one stator 11 and at least a part of the movable element 13 overlap when viewed from the Z-axis direction is substantially the position where at least a part of the coil unit 22 of one stator 11 and at least a part of the magnet unit 27 of the movable element 13 overlap when viewed from the Z-axis direction. Also, changing the orientation of the movable element 13 (changing the orientation of the substrate support part 13a) includes rotational movement in at least one of the θx, θy, and θz directions.

[0032] For example, the controller 15 rotates the movable element 13 around the rotation axis AX at a position where a stator 11 positioned in front of the opening and closing doors 17 and 18 and a rotation axis AX that is substantially parallel to the Z-axis direction of the movable element 13 overlap when viewed from the Z-axis direction.

[0033] Figure 5A is a schematic diagram showing the case where the movable element 13 rotates around the rotation axis AX, with the rotation axis AX of the movable element 13 coinciding with the approximate center of one stator 11 positioned in front of (for example, directly in front of) the opening / closing door 17. As shown in Figure 5A, the approximate entire coil unit 22 of the stator 11 and the approximate entire magnet unit 27 of the movable element 13 face each other in the Z-axis direction. In this case, the controller 15 rotates the movable element 13 around the rotation axis AX due to the interaction between the magnetic field from the coil unit 22 of the one stator 11 positioned in front of the opening / closing door 17 and the magnetic field from the magnet unit 27 of the movable element 13.

[0034] Figure 5B is a schematic diagram illustrating the case where the movable element 13 rotates around the rotation axis AX, with the rotation axis AX of the movable element 13 offset from the center of one stator 11 located in front of (for example, directly in front of) the opening / closing door 17. As shown in Figure 5B, a portion of the magnet unit 27 of the movable element 13 faces a portion of the coil unit 22 of one stator 11 located in front of the opening / closing door 17 in the Z-axis direction, and the remaining portion of the magnet unit 27 of the movable element 13 faces a portion of the coil unit 22 of a stator 11 adjacent to the one stator 11 located in front of the opening / closing door 17 in the Z-axis direction. In this case, the controller 15 rotates the movable element 13 around the rotation axis AX due to the interaction between the magnetic fields of the coil unit 22 of one stator 11 located in front of the opening / closing door 17 and the coil unit 22 of an adjacent stator 11, and the magnetic field of the magnet unit 27 of the movable element 13. Alternatively, the movable element 13 may be rotated around the rotation axis AX at a position where the rotation axis AX of the movable element 13 coincides with the midpoint (boundary) between one stator 11 located in front of the opening / closing door 17 and an adjacent stator 11.

[0035] In addition, while Figures 5A and 5B above describe the case in which the movable element 13 is rotated around the rotation axis AX in front of the opening / closing door 17 of the processing chamber 9, the same applies when the movable element 13 is rotated around the rotation axis AX in front of the opening / closing door 18 of the load lock chamber 5.

[0036] In this embodiment, the controller 15 rotates the movable element 13 around the rotation axis AX when at least a portion of one stator 11 in the first transport path 19A or the second transport path 19B and at least a portion of the movable element 13 overlap when viewed from the Z-axis direction. At this time, the controller 15 may also rotate the movable element 13 around the rotation axis AX when at least a portion of one stator 11 in the second transport path 19B and at least a portion of the movable element 13 overlap when viewed from the Z-axis direction. Alternatively, the controller 15 may rotate the movable element 13 around the rotation axis AX when at least a portion of one stator 11 in the connection part 19C and at least a portion of the movable element 13 overlap when viewed from the Z-axis direction.

[0037] <4. Specific examples of the movement of the movable part controlled by the controller> Next, with reference to Figures 6 to 15, a specific example of the operation of the movable element 13 under the control of the controller 15 will be described. In the following, the six processing chambers 9 will be referred to as processing chamber 9(1), 9(2), 9(3), 9(4), 9(5), and 9(6) to distinguish them, and the two load lock chambers 5 will be referred to as load lock chamber 5(1) and 5(2) to distinguish them.

[0038] (4-1. When the substrate support is a single-arm retractable type) First, an example of operation will be described when the movable element 13 is equipped with a substrate support section 13a, which is a single-arm telescopic arm. Figure 6 is a schematic diagram showing the extension and retraction operation of the substrate support section 13a, which is a single-arm telescopic arm. As shown in Figure 6, the substrate support section 13a is equipped with an extension and retraction mechanism (not shown) and extends and retracts from the movable element 13 in a specific direction (for example, forward). In the arm-retracted state, the substrate support section 13a retracts so as to fit roughly within the movable element base 13b, and in the arm-extended state, it extends forward of the movable element 13 by a predetermined length. The predetermined length is such that, with the movable element 13 positioned on the stator 11 directly in front of the opening and closing doors 17 and 18, the tip of the substrate support section 13a can reach the mounting table Wp2 of the processing chamber 9 or the mounting table Wp1 of the load lock chamber 5.

[0039] Figures 7A to 7F illustrate an example of the operation when a movable element 13 equipped with a single-arm retractable substrate support 13a transports a processed semiconductor substrate Wa from the processing chamber 9(3) to the load lock chamber 5(1). First, as shown in Figure 7A, the movable element 13 moves to a position on the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, a position directly facing the opening / closing door 17 of the processing chamber 9(3).

[0040] Next, as shown in Figure 7B, the movable element 13 extends the substrate support portion 13a into the processing chamber 9(3) through the open door 17 and receives the processed semiconductor substrate Wa placed on the mounting table Wp2 in the processing chamber 9(3). The semiconductor substrate Wa is received, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided in the processing chamber 9(3).

[0041] Next, as shown in Figure 7C, the movable element 13 retracts the substrate support portion 13a and removes the semiconductor substrate Wa from the processing chamber 9(3).

[0042] Next, as shown in Figure 7D, the movable element 13 rotates approximately 90° counterclockwise on the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), changing the orientation of the substrate support portion 13a from the processing chamber 9(3) side to the load lock chamber 5(1) side.

[0043] Next, as shown in Figure 7E, the movable element 13 moves along the first transport path 19A to the stator 11 directly in front of the opening / closing door 18 of the load lock chamber 5(1), that is, to a position directly facing the opening / closing door 18 of the load lock chamber 5(1).

[0044] Next, as shown in Figure 7F, the movable element 13 extends the substrate support portion 13a into the load lock chamber 5(1) through the open door 18, and transfers the processed semiconductor substrate Wa to the mounting table Wp1 in the load lock chamber 5(1). The transfer of the semiconductor substrate Wa is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θy direction, or by lifter pins (not shown) provided in the load lock chamber 5(1).

[0045] In the above example, the semiconductor substrate Wa was transported from processing chamber 9(3) to load lock chamber 5(1). However, the same procedure may be followed when transporting a processed semiconductor substrate Wa from processing chamber 9(1) or processing chamber 9(2) to load lock chamber 5(1). Similarly, the same procedure may be followed when transporting a processed semiconductor substrate Wa from any of processing chambers 9(4), 9(5), or 9(6) to load lock chamber 5(2). Conversely, when transporting an unprocessed semiconductor substrate Wb from load lock chamber 5(1) to any of processing chambers 9(1), 9(2), or 9(3), or when transporting an unprocessed semiconductor substrate Wb from load lock chamber 5(2) to any of processing chambers 9(4), 9(5), or 9(6), the above procedure may be reversed.

[0046] Furthermore, when transporting the processed semiconductor substrate Wa from the processing chamber 9(3) to the load lock chamber 5(2), the movement along the first transport path 19A shown in Figure 7E above can be accomplished by passing through one of the second transport paths 19B and then moving onto the other first transport path 19A. Figures 8A to 8C show some examples of operation when a movable element 13 equipped with a single-arm retractable substrate support part 13a transports the processed semiconductor substrate Wa from the processing chamber 9(3) to the load lock chamber 5(2) by passing through the second transport path 19B.

[0047] First, the same operation as described in Figures 7A to 7D is performed. Next, as shown in Figure 8A, the movable element 13 moves along the first transport path 19A on the positive side of the Y-axis toward the load lock chamber 5(1).

[0048] Next, as shown in Figure 8B, the movable element 13 moves in the same direction as when moving along the first transport path 19A, for example, along the second transport path 19B in front of the processing chamber 9(2), towards the negative side of the Y-axis.

[0049] Next, as shown in Figure 8C, the movable element 13 moves along the first transport path 19A on the negative side of the Y-axis, in the same orientation as when moving along the second transport path 19B, toward the load lock chamber 5(2). After that, it moves to a position directly facing the opening / closing door 18 of the load lock chamber 5(2), and performs the same operation as described in Figures 7E and 7F above.

[0050] In this manner, the controller 15 moves the movable element 13 so that the orientation of the substrate support part 13a when moving along the first transport path 19A is the same as the orientation of the substrate support part 13a when moving along the second transport path 19B.

[0051] In the above description, the material was transported through the second transport path 19B in front of processing chamber 9(2), but it may also be transported through any other second transport path 19B. Furthermore, the same operation may be performed when transporting a processed semiconductor substrate Wa from processing chamber 9(1) or processing chamber 9(2) to load lock chamber 5(2). Similarly, the same operation may be performed when transporting a processed semiconductor substrate Wa from any of processing chambers 9(4), 9(5), or 9(6) to load lock chamber 5(1). Conversely, when transporting an unprocessed semiconductor substrate Wb from load lock chamber 5(2) to any of processing chambers 9(1), 9(2), or 9(3), or when transporting an unprocessed semiconductor substrate Wb from load lock chamber 5(1) to any of processing chambers 9(4), 9(5), or 9(6), the above operation may be reversed.

[0052] (4-2. When the substrate support is of the dual-arm retractable type) Next, an example of operation will be described when the movable element 13 is equipped with a substrate support section 13a, which is a double-arm telescopic type arm. Figure 9 is a schematic diagram showing the telescopic operation of the substrate support section 13a, which is a double-arm telescopic type arm. As shown in Figure 9, the substrate support section 13a has two arms 13A and 13B equipped with a telescopic mechanism (not shown). The first arm 13A and the second arm 13B are installed at different heights in the height direction (Z-axis direction). In the example shown in Figure 9, the first arm 13A is installed above the second arm 13B, but the opposite may be applied. The first arm 13A and the second arm 13B each extend and retract from the movable element 13 in a specific direction (for example, forward). In the arm-retracted state, the first arm 13A and the second arm 13B each retract so that they fit roughly within the movable element base 13b, and in the arm-extended state, they extend forward of the movable element 13 by a predetermined length. The predetermined length is such that, with the movable element 13 positioned on the stator 11 directly in front of the opening and closing doors 17 and 18, the tip of the first arm 13A or the second arm 13B can reach the mounting platform Wp2 in the processing chamber 9 or the mounting platform Wp1 in the load lock chamber 5.

[0053] Figures 10A to 10L illustrate an example of the operation when a movable element 13 equipped with a double-arm retractable substrate support 13a transports an unprocessed semiconductor substrate Wb from the load lock chamber 5(1) to the processing chamber 9(3), and also transports a processed semiconductor substrate Wa from the processing chamber 9(3) to the load lock chamber 5(1). First, as shown in Figure 10A, the movable element 13 moves to a position on the stator 11 directly in front of the opening / closing door 18 of the load lock chamber 5(1), that is, a position directly facing the opening / closing door 18 of the load lock chamber 5(1).

[0054] Next, as shown in Figure 10B, the movable element 13 extends the first arm 13A of the substrate support 13a into the load lock chamber 5(1) through the open door 18, and receives the unprocessed semiconductor substrate Wb placed on the mounting table Wp1 of the load lock chamber 5(1). The semiconductor substrate Wb is received, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θy direction, or by a lifter pin (not shown) provided in the load lock chamber 5(1).

[0055] Next, as shown in Figure 10C, the movable element 13 retracts the first arm 13A and removes the semiconductor substrate Wb from the load lock chamber 5(1).

[0056] Next, as shown in Figure 10D, the movable element 13 moves along the first transport path 19A without changing the orientation of the substrate support 13a to the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, to a position directly facing the opening / closing door 17 of the processing chamber 9(3).

[0057] Next, as shown in Figure 10E, the movable element 13 rotates approximately 90° clockwise on the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), changing the orientation of the substrate support portion 13a from the load lock chamber 5(1) side to the processing chamber 9(3) side.

[0058] Next, as shown in Figure 10F, the movable element 13 extends the second arm 13B of the substrate support 13a into the processing chamber 9(3) through the open door 17 and receives the processed semiconductor substrate Wa placed on the mounting table Wp2 in the processing chamber 9(3). The semiconductor substrate Wa is received, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by a lifter pin (not shown) provided in the processing chamber 9(3).

[0059] Next, as shown in Figure 10G, the movable element 13 retracts the second arm 13B and removes the semiconductor substrate Wa from the processing chamber 9(3).

[0060] Next, as shown in Figure 10H, the movable element 13 extends the first arm 13A of the substrate support 13a into the processing chamber 9(3) via the open door 17, and transfers the unprocessed semiconductor substrate Wb to the mounting table Wp2 in the processing chamber 9(3). The transfer of the semiconductor substrate Wb is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided in the processing chamber 9(3).

[0061] Next, as shown in Figure 10I, the movable element 13 retracts the first arm 13A. As a result, the movable element 13 is in a state where the semiconductor substrate Wa is mounted on the second arm 13B.

[0062] Next, as shown in Figure 10J, the movable element 13 rotates approximately 90° counterclockwise on the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), changing the orientation of the substrate support portion 13a from the processing chamber 9(3) side to the load lock chamber 5(1) side.

[0063] Next, as shown in Figure 10K, the movable element 13 moves along the first transport path 19A to the stator 11 directly in front of the opening / closing door 18 of the load lock chamber 5(1), that is, to a position directly facing the opening / closing door 18 of the load lock chamber 5(1).

[0064] Next, as shown in Figure 10L, the movable element 13 extends its second arm 13B into the load lock chamber 5(1) through the open door 18, and transfers the processed semiconductor substrate Wa to the mounting table Wp1 in the load lock chamber 5(1). The transfer of the semiconductor substrate Wa is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θy direction, or by a lifter pin (not shown) provided in the load lock chamber 5(1).

[0065] In the above, the semiconductor substrate W was loaded and unloaded between the load lock room 5(1) and the processing room 9(3). However, the same operation may be performed when loading and unloading the semiconductor substrate W between the load lock room 5(1) and the processing room 9(1) or the processing room 9(2). Similarly, the same operation may be performed when loading and unloading the semiconductor substrate W between the load lock room 5(2) and any of the processing rooms 9(4), 9(5), or 9(6). Furthermore, when loading and unloading the semiconductor substrate W between the load lock room 5(1) and any of the processing rooms 9(4), 9(5), or 9(6), the movement along the first transport path 19A shown in Figures 10D and 10K above can be performed by passing through one of the second transport paths 19B and moving onto the other first transport path 19A, and then performing the same operation. The same applies when loading and unloading the semiconductor substrate W between the load lock room 5(2) and any of the processing rooms 9(1), 9(2), or 9(3).

[0066] (4-3. When the substrate support is a single-arm, non-extendable type) Next, an example of operation will be described when the movable element 13 is equipped with a single-arm, non-extendable substrate support section 13a. Figure 11 is a schematic diagram showing the configuration of the single-arm, non-extendable substrate support section 13a. As shown in Figure 11, the substrate support section 13a does not have an extension mechanism and has a fixed length. The length of the substrate support section 13a is set so that, when the movable element 13 is positioned on the stator 11 directly in front of the opening and closing doors 17 and 18, the tip of the substrate support section 13a can reach the mounting table Wp2 of the processing chamber 9 or the mounting table Wp1 of the load lock chamber 5.

[0067] Figures 12A to 12F illustrate an example of operation when a movable element 13 equipped with a single-arm, non-extendable substrate support 13a transports a processed semiconductor substrate Wa from the processing chamber 9(3) to the load lock chamber 5(1). First, as shown in Figure 12A, the movable element 13 moves to a predetermined position on the stator 11 in the second transport path 19B in front of the opening / closing door 17 of the processing chamber 9(3) so that the tip of the substrate support 13a does not interfere with the opening / closing door 17 of the processing chamber 9(3).

[0068] Next, as shown in Figure 12B, the movable element 13 moves to a position on the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, a position directly facing the opening / closing door 17 of the processing chamber 9(3). This allows the movable element 13 to enter the processing chamber 9(3) through the open opening / closing door 17 and receive the processed semiconductor substrate Wa placed on the mounting table Wp2 of the processing chamber 9(3). The reception of the semiconductor substrate Wa is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided by the processing chamber 9(3).

[0069] Next, as shown in Figure 12C, the movable element 13 moves to a predetermined position on the stator 11 in the second transport path 19B, moves away from the opening / closing door 17, and unloads the semiconductor substrate Wa from the processing chamber 9(3).

[0070] Next, as shown in Figure 12D, the movable element 13 rotates approximately 90° counterclockwise on the stator 11 of the second transport path 19B, changing the orientation of the substrate support portion 13a from the processing chamber 9(3) side to the negative X-axis side.

[0071] Next, as shown in Figure 12E, the movable element 13 moves along the second transport path 19B to the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, to a position directly facing the opening / closing door 17 of the processing chamber 9(3).

[0072] Next, as shown in Figure 12F, the movable element 13 moves along the first transport path 19A to the stator 11 directly in front of the opening / closing door 18 of the load lock chamber 5(1), that is, to a position directly facing the opening / closing door 18 of the load lock chamber 5(1). This allows the movable element 13 to move the substrate support portion 13a into the load lock chamber 5(1) through the open opening / closing door 18, and transfer the processed semiconductor substrate Wa to the mounting table Wp1 of the load lock chamber 5(1). The transfer of the semiconductor substrate Wa is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θy direction, or by lifter pins (not shown) provided by the load lock chamber 5(1).

[0073] In the above example, the semiconductor substrate Wa was transported from processing chamber 9(3) to load lock chamber 5(1). However, the same procedure may be followed when transporting a processed semiconductor substrate Wa from processing chamber 9(1) or processing chamber 9(2) to load lock chamber 5(1). Similarly, the same procedure may be followed when transporting a processed semiconductor substrate Wa from any of processing chambers 9(4), 9(5), or 9(6) to load lock chamber 5(2). Conversely, when transporting an unprocessed semiconductor substrate Wb from load lock chamber 5(1) to any of processing chambers 9(1), 9(2), or 9(3), or when transporting an unprocessed semiconductor substrate Wb from load lock chamber 5(2) to any of processing chambers 9(4), 9(5), or 9(6), the above procedure may be reversed.

[0074] Furthermore, when transporting a processed semiconductor substrate Wa from any of the processing rooms 9(1), 9(2), or 9(3) to the load lock room 5(2), the same operation can be performed by passing through one of the second transport paths 19B and moving onto the other first transport path 19A, as shown in Figure 12F above. The same procedure applies when transporting a processed semiconductor substrate Wa from any of the processing rooms 9(4), 9(5), or 9(6) to the load lock room 5(1).

[0075] (4-4. When the substrate support is a dual-arm non-extendable type) Next, an example of operation will be described when the movable element 13 is equipped with a substrate support section 13a, which is a dual-arm non-extendable arm. Figure 13 is a schematic diagram showing the configuration of the substrate support section 13a, which is a dual-arm non-extendable arm. As shown in Figure 13, the substrate support section 13a does not have an extension mechanism and has a fixed length. The substrate support section 13a has two arm sections 13a1 and 13a2 at both ends. The first arm section 13a1 extends from the movable element 13 in a first direction (for example, forward), and the second arm section 13a2 extends from the movable element 13 in a second direction (for example, backward), which is opposite to the first direction. The first arm section 13a1 and the second arm section 13a2 each protrude from the movable element 13 by a predetermined length. The predetermined length is such that, with the movable element 13 positioned on the stator 11 directly in front of the opening and closing doors 17 and 18, the tip of the first arm portion 13a1 or the second arm portion 13a2 can reach the mounting platform Wp2 of the processing chamber 9 or the mounting platform Wp1 of the load lock chamber 5.

[0076] Figures 14A to 14M illustrate an example of the operation when a movable element 13 equipped with a dual-arm non-extendable substrate support section 13a transports an unprocessed semiconductor substrate Wb from the load lock chamber 5(1) to the processing chamber 9(3), and also transports a processed semiconductor substrate Wa from the processing chamber 9(3) to the load lock chamber 5(1). First, as shown in Figure 14A, the movable element 13 moves to a predetermined position on the stator 11 in the first transport path 19A in front of the opening / closing door 18 of the load lock chamber 5(1) so that the tip of the substrate support section 13a does not interfere with the opening / closing door 18 of the load lock chamber 5(1).

[0077] Next, as shown in Figure 14B, the movable element 13 moves to a position on the stator 11 directly in front of the opening / closing door 18 of the load lock chamber 5(1), that is, a position directly facing the opening / closing door 18 of the load lock chamber 5(1). This allows the movable element 13 to enter the load lock chamber 5(1) with the first arm portion 13a1 of the substrate support portion 13a through the open opening / closing door 18, and receive the unprocessed semiconductor substrate Wb placed on the mounting table Wp1 of the load lock chamber 5(1). The reception of the semiconductor substrate Wb is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θy direction, or by a lifter pin (not shown) provided by the load lock chamber 5(1).

[0078] Next, as shown in Figure 14C, the movable element 13 removes the semiconductor substrate Wb from the load lock chamber 5(1) and moves along the first transport path 19A without changing the orientation of the substrate support 13a to the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, to a position directly facing the opening / closing door 17 of the processing chamber 9(3).

[0079] Next, as shown in Figure 14D, the movable element 13 moves to a predetermined position on the stator 11 in the second transport path 19B without changing the orientation of the substrate support 13a. This position is such that when the substrate support 13a is rotated, both ends of the support 13a and the mounted semiconductor substrate Wb do not interfere with the opening and closing doors 17 of the processing chambers 9(3) and 9(6).

[0080] Next, as shown in Figure 14E, the movable element 13 rotates approximately 90° counterclockwise on the stator 11 of the second transport path 19B, changing the orientation of the first arm portion 13a1, which is mounted on the semiconductor substrate Wb, from the negative X-axis side to the processing chamber 9(6) side, and the orientation of the second arm portion 13a2 from the positive X-axis side to the processing chamber 9(3) side.

[0081] Next, as shown in Figure 14F, the movable element 13 moves along the second transport path 19B to the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, to a position directly facing the opening / closing door 17 of the processing chamber 9(3). This allows the movable element 13 to enter the processing chamber 9(3) with the second arm portion 13a2 of the substrate support portion 13a through the open opening / closing door 17, and receive the processed semiconductor substrate Wa placed on the mounting table Wp2 of the processing chamber 9(3). The reception of the semiconductor substrate Wa is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by a lifter pin (not shown) provided by the processing chamber 9(3).

[0082] Next, as shown in Figure 14G, the movable element 13 moves to a predetermined position on the stator 11 in the second transport path 19B, moves away from the opening / closing door 17, and discharges the semiconductor substrate Wa from the processing chamber 9(3). This position is such that when the substrate support 13a is rotated, both ends of the support 13a and the mounted semiconductor substrates Wa and Wb do not interfere with the opening / closing doors 17 of the processing chambers 9(3) and 9(6).

[0083] Next, as shown in Figure 14H, the movable element 13 rotates approximately 180° clockwise or counterclockwise on the stator 11 of the second transport path 19B. As a result, the orientation of the first arm portion 13a1, which is mounted on the semiconductor substrate Wb, is changed from the processing chamber 9(6) side to the processing chamber 9(3) side, and the orientation of the second arm portion 13a2, which is mounted on the semiconductor substrate Wa, is changed from the processing chamber 9(3) side to the processing chamber 9(6) side.

[0084] Next, as shown in Figure 14I, the movable element 13 moves along the second transport path 19B to the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, to a position directly facing the opening / closing door 17 of the processing chamber 9(3). This allows the movable element 13 to insert the first arm portion 13a1 of the substrate support portion 13a into the processing chamber 9(3) through the open opening / closing door 17, and transfer the unprocessed semiconductor substrate Wb to the mounting table Wp2 of the processing chamber 9(3). The transfer of the semiconductor substrate Wb is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided by the processing chamber 9(3).

[0085] Next, as shown in Figure 14J, the movable element 13 moves to a predetermined position on the stator 11 in the second transport path 19B, moving away from the opening / closing door 17. This position is such that when the substrate support 13a is rotated, both ends of the support 13a and the mounted semiconductor substrate Wa do not interfere with the opening / closing doors 17 of the processing chambers 9(3) and 9(6).

[0086] Next, as shown in Figure 14K, the movable element 13 rotates approximately 90° clockwise on the stator 11 of the second transport path 19B, changing the orientation of the second arm portion 13a2, which is mounted on the semiconductor substrate Wa, from the processing chamber 9(6) side to the negative X-axis side.

[0087] Next, as shown in Figure 14L, the movable element 13 moves along the second transport path 19B to the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, to a position directly facing the opening / closing door 17 of the processing chamber 9(3).

[0088] Next, as shown in Figure 14M, the movable element 13 moves along the first transport path 19A to the stator 11 directly in front of the opening / closing door 18 of the load lock chamber 5(1), that is, to a position directly facing the opening / closing door 18 of the load lock chamber 5(1). This allows the movable element 13 to enter the load lock chamber 5(1) with the second arm portion 13a2 of the substrate support portion 13a through the open opening / closing door 18, and transfer the processed semiconductor substrate Wa to the mounting table Wp1 of the load lock chamber 5(1). The transfer of the semiconductor substrate Wa is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θy direction, or by the lifter pins (not shown) provided by the load lock chamber 5(1).

[0089] In the above, the semiconductor substrate W was loaded and unloaded between the load lock room 5(1) and the processing room 9(3). However, the same operation may be performed when loading and unloading the semiconductor substrate W between the load lock room 5(1) and the processing room 9(1) or the processing room 9(2). Similarly, the same operation may be performed when loading and unloading the semiconductor substrate W between the load lock room 5(2) and any of the processing rooms 9(4), 9(5), or 9(6). Furthermore, when loading and unloading the semiconductor substrate W between the load lock room 5(1) and any of the processing rooms 9(4), 9(5), or 9(6), the movement along the first transport path 19A shown in Figures 14C and 14K above can be performed by passing through one of the second transport paths 19B and moving onto the other first transport path 19A, and then performing the same operation. The same applies when loading and unloading the semiconductor substrate W between the load lock room 5(2) and any of the processing rooms 9(1), 9(2), or 9(3).

[0090] (4-5. Position adjustment operation of the circuit board by the movable part) Next, the position adjustment operation of the semiconductor substrate W by the movable element 13 will be described. Figure 15A is a schematic diagram showing an example of the position adjustment operation of the semiconductor substrate W by the movable element 13. Figure 15B is a schematic diagram showing another example of the position adjustment operation of the semiconductor substrate W by the movable element 13.

[0091] The controller 15 adjusts at least one of the position and orientation of the movable element 13 so that the position of the semiconductor substrate W becomes the position of the mounting platform Wp2 (an example of a predetermined position) in the processing chamber 9, at a position where at least a portion of one stator 11 located directly in front of the opening / closing door 17 of the processing chamber 9 overlaps with at least a portion of the movable element 13. Similarly, the controller 15 adjusts at least one of the position and orientation of the movable element 13 so that the position of the semiconductor substrate W becomes the position of the mounting platform Wp1 (an example of a predetermined position) in the load lock chamber 5, at a position where at least a portion of one stator 11 located directly in front of the opening / closing door 18 of the load lock chamber 5 overlaps with at least a portion of the movable element 13.

[0092] For example, in the example shown in Figure 15A, the movable element 13 adjusts or corrects the position of the semiconductor substrate W mounted on the tip of the substrate support 13a by performing at least one of horizontal movement in the Y-axis direction and rotational movement in the θz direction around the rotation axis AX. Also, in the example shown in Figure 15B, the movable element 13 adjusts or corrects the position of the semiconductor substrate W mounted on the tip of the substrate support 13a by performing at least one of horizontal movement in the X-axis direction and horizontal movement in the Y-axis direction.

[0093] <5. Effects of the Embodiment> As described above, in the substrate transport system 1 of this embodiment, the orientation of the substrate support section 13a is changed by changing the orientation of the movable element 13 in front of the processing chamber 9 or load lock chamber 5, and the semiconductor substrate W supported by the substrate support section 13a is loaded into and unloaded from the processing chamber 9 or load lock chamber 5. This makes it possible to move the system while minimizing the change in the orientation of the movable element 13, thereby shortening the cycle time and improving the transport efficiency of the semiconductor substrate W.

[0094] In this embodiment, the controller 15 may also rotate the movable element 13 around the rotation axis AX when the rotation axis AX of the movable element 13 overlaps with a stator 11 positioned in front of the opening / closing doors 17 and 18 when viewed from the Z-axis direction. In this case, the movable element 13 can be rotated even if the movable element 13 and the stator 11 do not completely overlap, as long as the rotation axis AX of the movable element 13 overlaps with the stator 11 positioned in front of the opening / closing doors 17 and 18. This improves the degree of freedom of the rotation position of the movable element 13.

[0095] In this embodiment, the controller 15 may also rotate the movable element 13 around the rotation axis AX by the interaction between the magnetic field from the coil unit 22 of a single stator 11 positioned in front of the opening and closing doors 17 and 18 and the magnetic field from the magnet unit 27 of the movable element 13. In this case, the movable element 13 can be rotated by controlling a single stator 11, making control easier.

[0096] In this embodiment, the controller 15 may also rotate the movable element 13 around the rotation axis AX by the interaction of the magnetic field generated by the coil unit 22 of one stator 11 positioned in front of the opening and closing doors 17, 18 and the coil unit 22 of the stator 11 adjacent to that stator 11, and the magnetic field generated by the magnet unit 27 of the movable element 13. In this case, the movable element 13 can be rotated at a position spanning two stators 11, thereby improving the degree of freedom of the rotational position of the movable element 13. Furthermore, since the movable element 13 can be rotated by multiple stators 11, the output of each stator 11 can be reduced, thereby reducing the heat generated by the stators 11. In addition, the size of each stator 11 can be reduced.

[0097] In this embodiment, the transport path 19 may also be formed in a ladder shape comprising a first transport path 19A and a second transport path 19B. In this case, while enabling the planar movement of the movable element 13, the configuration and control can be simplified compared to the case of a free track. Furthermore, when multiple movable elements 13 are arranged, even if one of the movable elements 13 stops due to a malfunction or the like, the other movable elements 13 can overtake, pass, or go around it, allowing the system to continue operating. Therefore, system downtime can be reduced.

[0098] In this embodiment, the controller 15 may also rotate the movable element 13 around the rotation axis AX at a position where at least a portion of one stator 11 in the second transport path 19B and at least a portion of the movable element 13 overlap when viewed from the Z-axis direction. In this case, even if the substrate support portion 13a of the movable element 13 is non-extendable and relatively long, the movable element 13 can be moved to the second transport path 19B to separate the substrate support portion 13a from the opening / closing door 17, and then rotated to change the orientation of the substrate support portion 13a. Therefore, a transport system that can accommodate non-extendable substrate support portions 13a can be constructed.

[0099] In this embodiment, the controller 15 may also rotate the movable element 13 around the rotation axis AX at a position where at least a portion of one stator 11 and at least a portion of the movable element 13 overlap when viewed from the Z-axis direction. When the second transport path 19B is located in front of the opening / closing door 17 of the processing chamber 9, the connecting section 19C where the first transport path 19A and the second transport path 19B intersect will be located directly in front of the opening / closing door 17. As in this embodiment, by rotating the movable element 13 at the connecting section 19C, the orientation of the substrate support 13a can be changed directly in front of the opening / closing door 17. This eliminates the need to move the movable element 13 to the second transport path 19B in order to rotate it, and the travel distance of the movable element 13 can be minimized, thereby shortening the cycle time and improving the transport efficiency of the semiconductor substrate W.

[0100] In this embodiment, the controller 15 may also move the movable element 13 such that the orientation of the substrate support portion 13a when moving along the first transport path 19A is the same as the orientation of the substrate support portion 13a when moving along the second transport path 19B. For example, if the movable element 13 is not loading or unloading semiconductor substrates W into or out of the processing chamber 9 or load lock chamber 5, but is merely moving along the transport path, there is no need to change the orientation of the substrate support portion 13a. As in this embodiment, by moving the movable element 13 so that the orientation of the substrate support portion 13a is the same in the first transport path 19A and the second transport path 19B, the rotation of the movable element 13 can be kept to the minimum necessary. This shortens the cycle time and improves the transport efficiency of semiconductor substrates W.

[0101] In this embodiment, the controller 15 may also adjust at least one of the position and orientation of the movable element 13 such that the position of the semiconductor substrate W is the same as the position of the mounting tables Wp2 and Wp1 in the processing chamber 9 or load lock chamber 5, at a position where at least a portion of one stator 11 positioned directly in front of the opening and closing doors 17 and 18 overlaps with at least a portion of the movable element 13. In this case, the position of the semiconductor substrate W can be finely adjusted, thereby improving the positional accuracy when the movable element 13 receives or delivers the semiconductor substrate W to or from the processing chamber 9 or load lock chamber 5.

[0102] <6. Variation> The embodiments of the disclosure are not limited to those described above, and various modifications are possible without departing from the spirit and technical idea thereof. Such modifications are described below.

[0103] (6-1. When the movable element is rotated in front of the load lock chamber) In the above-described embodiment, when loading or unloading a semiconductor substrate W into or out of a predetermined processing chamber 9, the movable element 13 is rotated on the stator 11 in front of the processing chamber 9. However, the position in which the orientation of the movable element 13 is changed is not limited to the above. For example, the movable element 13 may be rotated in advance on the stator 11 of the first transport path 19A connected to a predetermined load lock chamber 5 (the stator 11 in front of the load lock chamber 5) so that the substrate support portion 13a faces a predetermined direction, and the semiconductor substrate W may be loaded into or unloaded from the processing chamber 6 by passing through the first transport path 19A or the second transport path 19B. Alternatively, the reverse operation may be performed.

[0104] Figures 16A to 16F illustrate an example of operation in a modified configuration in which the movable element 13 is rotated in front of the load lock chamber 5, for example, when a movable element 13 equipped with a single-arm telescopic substrate support 13a transports an unprocessed semiconductor substrate Wb from the load lock chamber 5(1) to the processing chamber 9(3). First, as shown in Figure 16A, the movable element 13 moves to a position on the stator 11 directly in front of the opening / closing door 18 of the load lock chamber 5(1), that is, a position directly facing the opening / closing door 18 of the load lock chamber 5(1).

[0105] Next, as shown in Figure 16B, the movable element 13 extends its substrate support portion 13a into the load lock chamber 5(1) through the open door 18 and receives the unprocessed semiconductor substrate Wb placed on the mounting table Wp1 in the load lock chamber 5(1). The semiconductor substrate Wb is received, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θy direction, or by lifter pins (not shown) provided in the load lock chamber 5(1).

[0106] Next, as shown in Figure 16C, the movable element 13 retracts the substrate support portion 13a and removes the semiconductor substrate Wb from the load lock chamber 5(1).

[0107] Next, as shown in Figure 16D, the movable element 13 rotates approximately 90° clockwise on the stator 11 directly in front of the opening / closing door 18 of the load lock chamber 5(1), changing the orientation of the substrate support portion 13a from the load lock chamber 5(1) side to the positive Y-axis side.

[0108] Next, as shown in Figure 16E, the movable element 13 moves along the first transport path 19A with the substrate support portion 13a facing the positive side of the Y-axis, to the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, to a position directly facing the opening / closing door 17 of the processing chamber 9(3).

[0109] Next, as shown in Figure 16F, the movable element 13 extends the substrate support portion 13a into the processing chamber 9(3) via the open door 17, and transfers the semiconductor substrate Wb to the mounting table Wp2 in the processing chamber 9(3). The transfer of the semiconductor substrate Wb is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided in the processing chamber 9(3).

[0110] In the above example, the semiconductor substrate Wb was transported from the load lock chamber 5(1) to the processing chamber 9(3). However, the same procedure may be followed when transporting an unprocessed semiconductor substrate Wb from the load lock chamber 5(1) to processing chamber 9(1) or processing chamber 9(2). Similarly, the same procedure may be followed when transporting an unprocessed semiconductor substrate Wb from the load lock chamber 5(2) to any of the processing chambers 9(4), 9(5), or 9(6). Conversely, when transporting a processed semiconductor substrate Wa from any of the processing chambers 9(1), 9(2), or 9(3) to the load lock chamber 5(1), or when transporting a processed semiconductor substrate Wa from any of the processing chambers 9(4), 9(5), or 9(6) to the load lock chamber 5(2), the above procedure may be reversed.

[0111] Furthermore, when transporting an unprocessed semiconductor substrate Wb from the load lock chamber 5(1) to any of the processing chambers 9(4), 9(5), or 9(6), the same operation can be performed by passing through one of the second transport paths 19B and moving onto the other first transport path 19A, as shown in Figure 16E above. The same procedure applies when transporting an unprocessed semiconductor substrate Wb from the load lock chamber 5(2) to any of the processing chambers 9(1), 9(2), or 9(3).

[0112] (6-2. When setting up a temporary storage area) A temporary storage area for the semiconductor substrate W may be placed in the space enclosed by the first transport path 19A and the second transport path 19B.

[0113] Figure 17 schematically shows an example of the overall configuration of the substrate transport system 1 in a modified example in which a temporary storage area is located. In the example shown in Figure 17, a temporary storage area 29 is located in the space enclosed by the two first transport paths 19A, the second transport path 19B located in front of the processing chambers 9(1) and 9(4), and the second transport path 19B located in front of the processing chambers 9(2) and 9(5). Additionally, a temporary storage area 31 is located in the space enclosed by the two first transport paths 19A, the second transport path 19B located in front of the processing chambers 9(2) and 9(5), and the second transport path 19B located in front of the processing chambers 9(3) and 9(6). In addition to the temporary storage areas 29 and 31, a temporary storage area may also be located in the space enclosed by the first transport path 19A and the second transport path 19B near the load lock chamber 5. Furthermore, there may be only one temporary storage area.

[0114] Figures 18A to 18R illustrate an example of operation in a modified configuration for setting up a temporary storage area, where a movable element 13 equipped with a single-arm retractable substrate support 13a transports unprocessed semiconductor substrates Wb from the load lock chamber 5(1) to the processing chamber 9(3), and also transports processed semiconductor substrates Wa from the processing chamber 9(3) to the load lock chamber 5(1). First, as shown in Figure 18A, the movable element 13 moves to a position on the stator 11 directly in front of the opening / closing door 18 of the load lock chamber 5(1), that is, a position directly facing the opening / closing door 18 of the load lock chamber 5(1).

[0115] Next, as shown in Figure 18B, the movable element 13 extends its substrate support portion 13a into the load lock chamber 5(1) through the open door 18 and receives the unprocessed semiconductor substrate Wb placed on the mounting table Wp1 of the load lock chamber 5(1). The semiconductor substrate Wb is received, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θy direction, or by lifter pins (not shown) provided in the load lock chamber 5(1).

[0116] Next, as shown in Figure 18C, the movable element 13 retracts the substrate support portion 13a and removes the semiconductor substrate Wb from the load lock chamber 5(1).

[0117] Next, as shown in Figure 18D, the movable element 13 moves along the first transport path 19A without changing the orientation of the substrate support 13a to the stator 11 immediately in front of the temporary storage area 31 in the vicinity of the processing chamber 9(3), that is, to a position directly facing the temporary storage area 31.

[0118] Next, as shown in Figure 18E, the movable element 13 rotates approximately 90° counterclockwise on the stator 11 directly in front of the temporary storage area 31, changing the orientation of the substrate support portion 13a from the load lock chamber 5(1) side to the temporary storage area 31 side. The movable element 13 also extends the substrate support portion 13a toward the temporary storage area 31, transferring the semiconductor substrate Wb to the temporary storage area 31. The transfer of the semiconductor substrate Wb is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided by the temporary storage area 31.

[0119] Next, as shown in Figure 18F, the movable element 13 moves along the first transport path 19A with its substrate support portion 13a retracted and facing the negative side in the Y-axis direction, to a position on the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, a position directly facing the opening / closing door 17 of the processing chamber 9(3).

[0120] Next, as shown in Figure 18G, the movable element 13 rotates approximately 180° clockwise or counterclockwise on the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), changing the orientation of the substrate support portion 13a from the negative side of the Y-axis to the processing chamber 9(3) side.

[0121] Next, as shown in Figure 18H, the movable element 13 extends the substrate support portion 13a into the processing chamber 9(3) through the open door 17 and receives the processed semiconductor substrate Wa placed on the mounting table Wp2 in the processing chamber 9(3). The semiconductor substrate Wa is received, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided in the processing chamber 9(3).

[0122] Next, as shown in Figure 18I, the movable element 13 retracts the substrate support portion 13a and removes the semiconductor substrate Wa from the processing chamber 9(3).

[0123] Next, as shown in Figure 18J, the movable element 13 moves along the first transport path 19A with the substrate support portion 13a facing the positive side of the Y-axis, to a position on the stator 11 directly in front of the temporary storage area 31 in the vicinity of the processing chamber 9(3), that is, a position directly facing the temporary storage area 31.

[0124] Next, as shown in Figure 18K, the movable element 13 rotates approximately 180° clockwise or counterclockwise on the stator 11 directly in front of the temporary storage area 31, changing the orientation of the substrate support portion 13a, on which the semiconductor substrate Wa is mounted, from the positive Y-axis side to the temporary storage area 31 side. The movable element 13 also extends the substrate support portion 13a to the temporary storage area 31, transferring the semiconductor substrate Wa to the temporary storage area 31. The transfer of the semiconductor substrate Wa is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided by the temporary storage area 31.

[0125] Next, as shown in Figure 18L, the movable element 13 retracts its substrate support portion 13a and moves along the first transport path 19A to the stator 11 directly in front of the semiconductor substrate Wb placed in the temporary storage area 31, that is, to a position directly facing the semiconductor substrate Wb in the temporary storage area 31. The movable element 13 also extends its substrate support portion 13a toward the temporary storage area 31 to receive the semiconductor substrate Wb placed in the temporary storage area 31. The reception of the semiconductor substrate Wb is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided in the temporary storage area 31. Then, the movable element 13 retracts its substrate support portion 13a.

[0126] Next, as shown in Figure 18M, the movable element 13 moves along the first transport path 19A with the substrate support 13a on which the semiconductor substrate Wb is mounted facing the negative side in the Y-axis direction, to a position on the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), that is, a position directly facing the opening / closing door 17 of the processing chamber 9(3).

[0127] Next, as shown in Figure 18N, the movable element 13 rotates approximately 180° clockwise or counterclockwise on the stator 11 directly in front of the opening / closing door 17 of the processing chamber 9(3), changing the orientation of the substrate support 13a, on which the semiconductor substrate Wb is mounted, from the negative side of the Y-axis to the processing chamber 9(3) side. The movable element 13 also extends the substrate support 13a into the processing chamber 9(3) via the open opening / closing door 17, and transfers the semiconductor substrate Wb to the mounting table Wp2 of the processing chamber 9(3). The transfer of the semiconductor substrate Wb is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided by the processing chamber 9(3).

[0128] Next, as shown in Figure 18O, the movable element 13 retracts the substrate support portion 13a.

[0129] Next, as shown in Figure 18P, the movable element 13 moves along the first transport path 19A with the substrate support portion 13a facing the positive Y-axis direction to the stator 11 directly in front of the semiconductor substrate Wa placed in the temporary storage area 31, that is, to a position directly facing the semiconductor substrate Wa in the temporary storage area 31. The movable element 13 also rotates approximately 180° clockwise or counterclockwise, changing the orientation of the substrate support portion 13a from the positive Y-axis direction to the temporary storage area 31 side. The movable element 13 also extends the substrate support portion 13a toward the temporary storage area 31 and receives the semiconductor substrate Wa placed in the temporary storage area 31. The receipt of the semiconductor substrate Wa is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θx direction, or by lifter pins (not shown) provided by the temporary storage area 31.

[0130] Next, as shown in Figure 18Q, the movable element 13 retracts the substrate support portion 13a. The movable element 13 also rotates approximately 90° clockwise, changing the orientation of the substrate support portion 13a, on which the semiconductor substrate Wa is mounted, from the temporary storage area 31 side to the load lock chamber 5(1) side.

[0131] Next, as shown in Figure 18R, the movable element 13 moves along the first transport path 19A to the stator 11 directly in front of the opening / closing door 18 of the load lock chamber 5(1), that is, to a position directly facing the opening / closing door 18 of the load lock chamber 5(1). The movable element 13 also extends the substrate support portion 13a into the load lock chamber 5(1) through the open opening / closing door 18, and transfers the processed semiconductor substrate Wa to the mounting table Wp1 of the load lock chamber 5(1). The transfer of the semiconductor substrate Wa is performed, for example, by the lifting and lowering movement of the movable element 13 in the Z-axis direction, or by the rotational movement in the θy direction, or by lifter pins (not shown) provided by the load lock chamber 5(1).

[0132] In the above, the semiconductor substrate W was loaded and unloaded between the load lock room 5(1) and the processing room 9(3). However, the same operation may be performed when loading and unloading the semiconductor substrate W between the load lock room 5(1) and the processing room 9(1) or the processing room 9(2). In this case, the temporary storage area 29 may be used. Also, the same operation may be performed when loading and unloading the semiconductor substrate W between the load lock room 5(2) and any of the processing rooms 9(4), 9(5), or 9(6). Furthermore, when loading and unloading the semiconductor substrate W between the load lock room 5(1) and any of the processing rooms 9(4), 9(5), or 9(6), the movement of the first transport path 19A shown in Figures 18D, 18F, or 18R above may be performed by passing through one of the second transport paths 19B and moving onto the other first transport path 19A, and then performing the same operation. The same applies when loading and unloading semiconductor substrates W between the load lock room 5(2) and any of the processing rooms 9(1), 9(2), or 9(3).

[0133] (6-3. Others) The above description has focused on the case where the coil unit 22 of the stator 11 is composed of concentrated-winding coils, but the coil unit 22 may also be composed of distributed-winding coils.

[0134] Furthermore, although the above description has focused on the case where the transport path 19 is formed in a substantially ladder shape, the transport path 19 may take other forms. For example, the stator 11 may be laid out across the entire floor of the vacuum transport chamber 7. Also, the stator 11 does not have to be approximately the same size as the movable element 13. For example, the dimensions of the stator 11 may be larger than those of the movable element 13 so that multiple movable elements 13 can pass each other on a single stator 11.

[0135] Furthermore, while the above description explained the case of transporting a semiconductor substrate W as an example of a workpiece, the transport system may also be used to transport workpieces other than semiconductor substrates W and perform predetermined processing.

[0136] In the above explanation, where terms such as "perpendicular," "parallel," and "plane" are used, these terms do not have a strict meaning. These terms "perpendicular," "parallel," and "plane" refer to situations where design and manufacturing tolerances and errors are acceptable, meaning they are "effectively perpendicular," "effectively parallel," and "effectively plane."

[0137] In the above explanation, if there are descriptions such as "identical," "same," "equal," or "different" regarding external dimensions, size, shape, position, etc., these descriptions do not have a strict meaning. These "identical," "same," "equal," and "different" terms mean that tolerances and errors in design and manufacturing are allowed, and that they are "substantially identical," "substantially the same," "substantially equal," or "substantially different."

[0138] In addition to what has already been described above, the methods of the above embodiments and their respective modifications may be used in appropriate combinations. Furthermore, although not exemplified individually, the above embodiments and their respective modifications may be implemented with various modifications, without departing from their intended purpose.

[0139] The problems and effects that the embodiments and modifications described above aim to solve are not limited to those stated above. The embodiments and modifications may solve problems not mentioned above, or produce effects not mentioned above, and may solve only some of the problems described or produce only some of the effects described. [Explanation of symbols]

[0140] 1. Substrate transport system (an example of a transport system) 3. Air Conveying Chamber 5. Load Lock Room (Example of Room 2) 7. Vacuum Transfer Chamber (Example of Chamber 1) 9. Processing Room (An example of Room 2) 11 Stator 13 Mover 13a Substrate support section (an example of a support section) 13b Movable base 15 Controllers 17 Opening and closing doors 18 Opening and closing doors 19 Conveyor path 19A First transport path 19B Second transport route 19C Connection 20 Planar Motors 21 Stator base 22 Coil Units 27 Magnet Unit AX rotation axis W Semiconductor substrate (an example of a material to be processed) Wa semiconductor substrate Wb semiconductor substrate Wp mounting platform Wp1 Mounting platform (example of designated position) Wp2 mounting platform (example of designated position)

Claims

1. A first chamber equipped with a transport path through which the material to be processed is transported, A second room is located around the first room and is equipped with an opening and closing door. Each of the stators is equipped with a coil unit, and a plurality of stators are arranged in the first chamber along the transport path, A movable member comprising a support section and a magnet unit for supporting the object to be processed, which floats and moves along the transport path and loads and unloads the object to be processed supported by the support section into the second chamber, It includes a controller for controlling the movable element, The aforementioned transport path is Multiple stators are arranged in a line along the first direction of the first chamber in two first transport paths, The stator is formed by arranging at least one of the stators in a line along a second direction intersecting the first direction, and has at least one second transport path connecting the two first transport paths in the second direction, The coil unit and the magnet unit have substantially the same dimensions in the first and second directions. The aforementioned controller, The orientation of the movable part is changed such that at least a portion of the coil unit of one stator positioned in front of the opening / closing door in the first or second transport path and at least a portion of the magnet unit of the movable part overlap when viewed from the vertical direction, the orientation of the support part is changed. Conveyor system.

2. The aforementioned controller, The coil unit of the stator positioned in front of the opening and closing door and the vertical rotation axis of the movable element are positioned to overlap when viewed from the vertical direction, thereby rotating the movable element around the rotation axis. The transport system according to claim 1.

3. The aforementioned controller, The interaction between the magnetic field of the coil unit of the stator positioned in front of the opening / closing door and the magnetic field of the magnet unit of the movable element causes the movable element to rotate around the rotation axis. The transport system according to claim 2.

4. The aforementioned controller, The interaction between the magnetic field formed by the coil unit of one stator positioned in front of the opening / closing door and the coil unit of a stator adjacent to that stator, and the magnetic field formed by the magnet unit of the movable element causes the movable element to rotate around the rotation axis. The transport system according to claim 2.

5. The second transport path is, Extending in the second direction in front of the opening and closing door, connecting the two first transport paths, The aforementioned controller, The orientation of the movable part is changed at a position where at least a portion of the coil unit of one stator and at least a portion of the magnet unit of the movable part in the second transport path overlap when viewed from the vertical direction. The transport system according to claim 1.

6. The aforementioned transport path is The first transport path and the second transport path have a connecting section where they intersect. The aforementioned controller, At the connection point, at least a portion of the coil unit of one stator and at least a portion of the magnet unit of the movable part overlap when viewed from the vertical direction, the orientation of the movable part is changed. The transport system according to claim 5.

7. The aforementioned controller, The movable element is moved such that the orientation of the support when moving along the first transport path and the orientation of the support when moving along the second transport path are the same. The transport system according to any one of claims 1 to 6.

8. The aforementioned controller, At a position where at least a portion of the coil unit of one of the stator positioned directly in front of the opening / closing door and at least a portion of the magnet unit of the movable element overlap, at least one of the position and orientation of the movable element is adjusted so that the position of the workpiece is at a predetermined position in the second chamber. The transport system according to any one of claims 1 to 6.

9. The system further includes a temporary storage area located in the space enclosed by the first transport path and the second transport path, where the object to be processed is temporarily placed. The transport system according to any one of claims 1 to 6.

10. A first chamber equipped with a transport path through which the material to be processed is transported, A second room is located around the first room and is equipped with an opening and closing door. Each of the stators is equipped with a coil unit, and a plurality of stators are arranged in the first chamber along the transport path, A movable member comprising a support section and a magnet unit for supporting the object to be processed, which floats and moves along the transport path and loads and unloads the object to be processed supported by the support section into the second chamber, It includes a controller for controlling the movable element, The aforementioned transport path is Multiple stators are arranged in a line along the first direction of the first chamber in two first transport paths, The stator is formed by arranging at least one of the stators in a line along a second direction intersecting the first direction, and has at least one second transport path connecting the two first transport paths in the second direction, The coil unit and the magnet unit have substantially the same dimensions in the first and second directions. The aforementioned controller, The orientation of the movable part is changed such that at least a portion of the coil unit of one stator positioned in front of the opening / closing door in the first or second transport path and at least a portion of the magnet unit of the movable part overlap when viewed from the vertical direction, the orientation of the support part is changed. At least a portion of the coil unit of one stator positioned directly in front of the opening / closing door and at least a portion of the magnet unit of the movable part are adjusted so that the position of the workpiece is at a predetermined position in the second chamber when viewed from the vertical direction, at least one of the position and orientation of the movable part. Conveyor system.

11. A first chamber equipped with a transport path through which the material to be processed is transported, A second room is located around the first room and is equipped with an opening and closing door. Each of the stators is equipped with a coil unit, and a plurality of stators are arranged in the first chamber along the transport path, A movable member comprising a support section and a magnet unit for supporting the object to be processed, which floats and moves along the transport path and loads and unloads the object to be processed supported by the support section into the second chamber, A method for transporting an object to be processed using a transport system having the following: The aforementioned transport path is Multiple stators are arranged in a line along the first direction of the first chamber in two first transport paths, The stator is formed by arranging at least one of the stators in a line along a second direction intersecting the first direction, and has at least one second transport path connecting the two first transport paths in the second direction, The coil unit and the magnet unit have substantially the same dimensions in the first and second directions. The orientation of the movable part is changed such that at least a portion of the coil unit of one stator positioned in front of the opening / closing door in the first or second transport path and at least a portion of the magnet unit of the movable part overlap when viewed from the vertical direction, the orientation of the support part is changed. A method for transporting materials to be processed.

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