Electronic devices

Abstract

To provide an electronic device with suppressed dielectric loss.SOLUTION: An electronic device 1 includes a plurality of electronic components 20 (20A, 20B, 20C) and bridges 31 (31A, 31B) for electrically connecting the electronic components 20. Each bridge 31 is formed of a glass board 310 and is smaller than any of the electronic components 20. The bridges 31 include bridge wiring 311 for electrically interconnecting the electronic components 20.SELECTED DRAWING: Figure 1

Claims

1. Multiple electronic components, The system comprises a bridge that electrically connects the plurality of electronic components, The bridge is formed from a glass substrate and is smaller than any of the plurality of electronic components. The bridge comprises bridge wiring that electrically connects a plurality of electronic components to each other, and a bridge insulating layer that insulates the bridge wiring. The aforementioned bridge insulating layer is an organic insulating layer. The relative permittivity of the organic insulating layer is lower than that of the glass material constituting the glass substrate of the bridge. Each of the aforementioned plurality of electronic components has a first opposing portion that faces the bridge, The bridge has a second opposing portion that faces the first opposing portion of the plurality of electronic components, and a third opposing portion formed on the opposite side of the second opposing portion. The electronic device further comprises a bridge through electrode that penetrates from the second opposing portion to the third opposing portion.

2. The electronic component layer having the plurality of electronic components, A wiring layer having wiring, The electronic device according to claim 1, further comprising the bridge and a connecting layer for electrically connecting the plurality of electronic components and the wiring layer.

3. The electronic device according to claim 2, wherein the bridge through electrode electrically connects the plurality of electronic components to the wiring of the wiring layer.

4. The connecting layer has an insulating layer that covers the periphery of the bridge. The electronic device according to claim 2, wherein the insulating layer has a connecting layer through electrode formed therein that penetrates from a portion facing the electronic component layer to a portion facing the wiring layer, and electrically connects the electronic component to the wiring of the wiring layer.

5. The electronic device according to claim 2 or 3, wherein the plurality of electronic components are arranged in a line adjacent to one another.

6. The electronic device according to claim 2 or 3, wherein when the electronic component layer and the connecting layer are viewed in the stacking direction, the bridge is arranged to overlap with each of the plurality of electronic components.

7. The aforementioned plurality of electronic components include at least a first electronic component, a second electronic component, and a third electronic component. The aforementioned bridge has multiple instances, The electronic device according to claim 1, wherein the plurality of bridges include a first bridge that electrically connects the first electronic component and the second electronic component to each other, and a second bridge that electrically connects the second electronic component and the third electronic component to each other.

8. At least a portion of the bridge is made of a light-transmitting member from the second opposing portion to the third opposing portion, The electronic device according to claim 1, wherein the bridge has alignment marks.

9. The bridge further includes bridge wiring that electrically connects a plurality of the electronic components to each other. The electronic device according to claim 8, wherein the alignment marks are located on the same layer as the bridge wiring.

10. The electronic device according to claim 9, wherein the alignment marks are made of the same material as the bridge wiring.

11. It further has a wiring layer having wiring, The electronic device according to claim 8, wherein the wiring layer has a second alignment mark corresponding to the alignment mark of the bridge.

12. A method for manufacturing an electronic device according to claim 1, The process includes a bridge manufacturing process for manufacturing the aforementioned bridge, The aforementioned bridge manufacturing process is: The process of preparing the glass substrate, A bridge wiring formation step is to form bridge wiring on the main surface side of the glass substrate for electrically connecting a plurality of the electronic components to each other. A bridge insulating layer formation step, wherein the bridge insulating layer is an organic insulating layer, and A method for manufacturing an electronic device, comprising a cutting step of cutting the glass substrate to chip size.

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