A monolithic plate ultra-thin stack structure

Abstract

This utility model discloses an ultra-thin stacked structure consisting of a battery, a motherboard, a button bracket, a button board, and a shielding cover. The motherboard has a first connecting surface connected to the battery, and this first connecting surface is a single-sided component. The motherboard is located inside the button bracket, and the button board is located outside the button bracket. The motherboard and the button board are respectively connected to the button bracket. The shielding cover is placed on a second connecting surface of the motherboard, which is opposite to the first connecting surface. This utility model, by adopting a single-sided design and a battery-motherboard mounting design in the battery area, reduces the height of components on the battery side, thereby effectively reducing the overall thickness. The 4G component stacking density is reduced, signal interference is decreased, and the shielding cover design prevents short circuits with taller components during reliability testing, meeting the stringent performance and reliability requirements of 4G communication.

Description

Technical Field

[0001] This utility model relates to the field of whole-board stacking technology for functional mobile phones, and in particular to a whole-board ultra-thin stacking structure. Background Technology

[0002] Currently, most 4G feature phones on the market adopt a full-size PCB design. This design utilizes the large area of ​​the entire PCB board to provide ample layout space and routing area for the necessary 4G functional components, ensuring RF performance and signal integrity, and can relatively easily accommodate all the necessary 4G functional modules. However, the biggest drawback of the full-size PCB design is its large physical size, which directly makes it difficult to effectively reduce the overall thickness of the device.

[0003] On the other hand, the half-size PCB (or split-board) design theoretically has the potential to achieve ultra-thin bodies because its motherboard has a smaller physical area and can be made thinner in the height direction. However, due to its extremely limited space, it simply cannot accommodate the numerous, relatively large components and complex interconnections required by 4G feature phones. Forcing a high density of 4G components into such a confined space can easily cause serious signal interference problems, making it difficult to meet the stringent performance and reliability requirements of 4G communication. Utility Model Content

[0004] The main purpose of this invention is to propose an ultra-thin stacked structure for the whole board, which aims to solve the problems of the existing technology where the thickness of the whole board affects the grip comfort, the limited space of the half board, and the serious signal interference caused by stacking high-density 4G devices.

[0005] To achieve the above objectives, this utility model proposes an ultra-thin stacked structure comprising a battery, a motherboard, a button bracket, a button board, and a shielding cover. The first connecting surface of the motherboard is connected to the battery, and the first connecting surface is a single-sided fabric. The motherboard is located inside the button bracket, and the button board is located outside the button bracket. The motherboard and the button board are respectively connected to the button bracket. The shielding cover is placed on the second connecting surface of the motherboard, and the second connecting surface is disposed opposite to the first connecting surface.

[0006] In one embodiment, a first positioning post is provided on the inner side of the button bracket, and a first positioning hole is provided on the motherboard, wherein the first positioning post is inserted into the first positioning hole.

[0007] In one embodiment, a buckle is provided on the side of the button bracket, and the button bracket is fixed to the motherboard by the buckle.

[0008] In one embodiment, a second positioning post is provided on the outer side of the button bracket, and a second positioning hole is provided on the button plate, with the second positioning post inserted into the second positioning hole.

[0009] In one embodiment, a mounting groove is provided on the outer side of the button bracket, and the button plate is embedded in the mounting groove.

[0010] In one embodiment, the button bracket is provided with a clearance hole, and the shielding cover is located in the clearance hole.

[0011] In one embodiment, a layer of floating tin is soldered to the side of the shielding cover that is connected to the motherboard.

[0012] In one embodiment, an insulating layer is provided on the top of the inner wall of the shielding cover.

[0013] In one embodiment, the ultra-thin stacked structure further includes an FPC, a first pad is provided on the inner side of the button board, a second pad is provided on the inner side of the motherboard, one end of the FPC is soldered to the button board through the first pad, and the other end of the FPC is soldered to the motherboard through the second pad.

[0014] In one embodiment, the ultra-thin stacked structure further includes a screen connected to the motherboard and located on the upper side of the button panel.

[0015] This invention adopts a whole-board design, with the motherboard having a single-sided layout in the battery area and a battery-to-motherboard design, which reduces the height of components on the battery side, thereby effectively reducing the overall thickness. The 4G component stacking density is reduced, signal interference is reduced, and the shielding cover design avoids short circuits with taller components during reliability testing, meeting the stringent performance and reliability requirements of 4G communication. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a front view of an ultra-thin stacked structure.

[0018] Figure 2 This is a side view of the ultra-thin stacked structure.

[0019] Figure 3 for Figure 2 A magnified view of a section at point A in the middle;

[0020] Figure 4 This is a forward exploded view of a partially integrated ultrathin stacked structure.

[0021] Figure 5 This is a reverse decomposition diagram of a localized, ultra-thin stacked structure;

[0022] Figure 6 This is a schematic diagram of the shielding cover.

[0023] Explanation of icon numbers:

[0024] 1. Battery; 2. Motherboard; 3. Button bracket; 4. Button board; 5. Shielding cover; 21. First connecting surface; 22. Second connecting surface; 31. First positioning post; 23. First positioning hole; 32. Buckle; 33. Second positioning post; 41. Second positioning hole; 34. Mounting slot; 35. Clearance hole; 51. Floating solder layer; 52. Insulating layer; 6. FPC; 42. First solder pad; 43. Second solder pad; 7. Screen.

[0025] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0028] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0029] This utility model proposes a whole-plate ultra-thin stacked structure.

[0030] In the embodiments of this utility model, such as Figure 1 , Figure 2 , Figure 3 , Figure 6 As shown, the ultra-thin stacked structure includes a battery 1, a motherboard 2, a button bracket 3, a button board 4, and a shielding cover 5. The first connecting surface 21 of the motherboard 2 is connected to the battery 1. The first connecting surface 21 is a single-sided fabric component. The motherboard 2 is located inside the button bracket 3, and the button board 4 is located outside the button bracket 3. The motherboard 2 and the button board 4 are respectively connected to the button bracket 3. The shielding cover 5 covers the second connecting surface 22 of the motherboard 2. The second connecting surface 22 is arranged opposite to the first connecting surface 21.

[0031] This utility model adopts a whole board design, and the motherboard 2 is arranged on one side in the battery 1 area. The battery 1 and motherboard 2 are designed to be attached to each other, which reduces the height of the components on the battery 1 side, thereby effectively reducing the overall thickness. The stacking density of 4G components on the motherboard 2 is reduced, which reduces signal interference. The design of the shielding cover 5 avoids short circuits with taller components during reliability testing, thus meeting the strict performance indicators and reliability requirements of 4G communication.

[0032] like Figure 5As shown, a first positioning post 31 is provided on the inner side of the button bracket 3, and a first positioning hole 23 is provided on the motherboard 2. The first positioning post 31 is inserted into the first positioning hole 23. A buckle 32 is provided on the side of the button bracket 3, and the button bracket 3 is fixed to the motherboard 2 by the buckle 32. By providing a first positioning post 31 on the inner side of the button bracket 3 and inserting it into the first positioning hole 23 on the motherboard 2, the button bracket 3 and the motherboard 2 can be effectively positioned, avoiding malfunctions or damage caused by loosening or misalignment. The cooperation of the first positioning post 31 and the first positioning hole 23 simplifies the assembly steps and improves production efficiency. The cooperation of the first positioning post 31 and the first positioning hole 23 ensures the precise position of the button bracket 3 on the motherboard 2, ensuring the accuracy and stability of button operation, improving the user experience of the product, and the buckle 32 on both sides fixes the motherboard 2, preventing the button bracket 3 from being misaligned during assembly.

[0033] like Figure 4 As shown, a second positioning post 33 is provided on the outer side of the button bracket 3, and a second positioning hole 41 is provided on the button plate 4. The second positioning post 33 is inserted into the second positioning hole 41. The insertion of the second positioning post 33 into the second positioning hole 41 on the button plate 4 ensures a more precise relative position between the button bracket 3 and the button plate 4, thereby ensuring accurate button triggering and normal operation, improving reliability. The cooperation between the second positioning post 33 and the second positioning hole 41 effectively prevents displacement or loosening between the button bracket 3 and the button plate 4, improving the overall stability of the component and reducing misoperation or damage caused by external pressure or vibration. The precise cooperation between the second positioning post 33 and the second positioning hole 41 helps reduce errors in the assembly process, avoiding product defects caused by inaccurate positioning, thereby improving the overall quality and reliability of the product.

[0034] The button bracket 3 has a mounting groove 34 on its outer side, and the button plate 4 is embedded in the mounting groove 34. Embedding the button plate 4 in the mounting groove 34 prevents loosening or misalignment between the button plate 4 and the button bracket 3, improving the overall structural stability. The design of the mounting groove 34 simplifies the installation process of the button plate 4; simply embed the button plate 4 into the groove, making the operation simple and intuitive. Furthermore, this design typically makes disassembly easier, eliminating the need for complex operations when maintaining or replacing the button plate 4. Embedding the button plate 4 in the mounting groove 34 effectively improves the structure's shock resistance and durability. Because the button plate 4 is fixed in position within the groove, the impact of external impacts or vibrations on the button plate 4 is reduced, thereby extending the product's lifespan. The fit between the mounting groove 34 and the button plate 4 ensures precise alignment, preventing inaccurate button operation due to positional deviations and guaranteeing button reliability and user comfort.

[0035] The button bracket 3 is provided with a clearance hole 35, and the shielding cover 5 is located in the clearance hole 35. The shielding cover 5 is located inside the button plate 4, and the button bracket 3 is located outside the shielding cover 5. The design of the clearance hole 35 allows the shielding cover 5 to be easily positioned and fixed in the correct position during installation, reducing the complexity of the assembly process. The design of the clearance hole 35 also reduces the overall thickness of the device.

[0036] A layer of floating tin 51 is soldered to the surface of the shielding cover 5 that connects to the motherboard 2. By soldering a layer of floating tin 51 to the surface of the shielding cover 5 that connects to the motherboard 2, a more stable and robust electrical connection can be provided, ensuring good contact between the shielding cover 5 and the motherboard 2 and avoiding signal transmission or electrical performance degradation due to poor contact.

[0037] The floating tin layer 51 can also help conduct heat to a certain extent, reduce local overheating caused by poor contact between the shielding cover 5 and the motherboard 2, and help optimize the heat dissipation effect.

[0038] An insulating layer 52 is provided on the top of the inner wall of the shielding cover 5. By providing the insulating layer 52 on the top of the inner wall of the shielding cover 5, direct contact between the shielding cover 5 and other circuits or components can be effectively prevented, thus preventing short circuits caused by contact and protecting the safety of the motherboard 2. The insulating layer 52 provides additional electrical isolation, ensuring that the shielding cover 5 does not affect the normal operation of the internal circuits, especially in high-frequency or high-voltage application environments, effectively reducing electrical interference or malfunctions. The presence of the insulating layer 52 helps improve the electromagnetic interference resistance of the shielding cover 5, preventing external electromagnetic waves from affecting sensitive internal circuits, while also preventing internal circuits from interfering with external devices, thereby improving the stability and signal quality of the equipment. By providing the insulating layer 52 on the top of the inner wall, damage to the shielding cover 5 and other electronic components caused by current leakage or overvoltage can be effectively reduced, thereby extending the service life of the equipment and improving its long-term stability.

[0039] The ultra-thin stacked structure also includes an FPC6. The button board 4 has a first solder pad 42 on its inner side, and the motherboard 2 has a second solder pad 43 on its inner side. One end of the FPC6 is soldered to the button board 4 through the first solder pad 42, and the other end of the FPC6 is soldered to the motherboard 2 through the second solder pad 43.

[0040] By using FPC6 (Flexible Printed Circuit Board) as the connection medium, the connection between the keypad 4 and the motherboard 2 becomes more flexible. FPC6 provides a stable electrical connection even in space-constrained environments, facilitating complex circuit layouts within a thinner structure. The use of FPC6 makes the overall board structure more compact and ultra-thin, suitable for the miniaturization and lightweight requirements of modern electronic devices. This structure effectively integrates functions within limited space, avoiding the space waste that may occur when using traditional circuit boards. By setting a first pad 42 on the inside of the keypad 4 and connecting it to the FPC6, and setting a second pad 43 on the inside of the motherboard 2 and connecting it to the FPC6, the electrical connection between the keypad 4 and the motherboard 2 is ensured to be stable, preventing loose connections or poor contact, and improving device reliability. Due to the material properties of FPC6, it can conduct heat more effectively, avoiding localized overheating. This helps to ensure temperature balance between the keypad 4 and the motherboard 2, improving the device's heat dissipation performance and extending its service life.

[0041] The ultra-thin stacked structure also includes a screen 7, which is connected to the motherboard 2 and is located on the upper side of the button board 4. The screen 7 has a thickness of 1.5mm, and with the assembly space, the total thickness is 2.0mm. The shielding cover 5 has a standard height of 1.55mm, and with the solder tin, the total height is 1.6mm.

[0042] The ultra-thin stacked design of the overall structure, especially the precise dimensional control of the screen 7, shielding cover 5, and other components, enables a more compact design. This ultra-thin design is suitable for modern consumer electronics, especially smartphones, tablets, and other devices that require space-saving and lightweight construction, enhancing portability and aesthetics. By controlling the thickness of the screen 7 to 1.5mm and strictly controlling the assembly space to 2.0mm, the overall structure of the device is more streamlined. This optimized space utilization reduces the physical space occupied by the product, making the design more advantageous, especially for products with high space requirements (such as smart devices and wearable devices). Precise design and height control of the shielding cover 5, screen 7, and assembly space improve the product's durability. Through reasonable design, component damage or performance degradation caused by improper assembly or unsuitable dimensions is avoided, thereby improving the overall reliability of the product.

[0043] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. For those skilled in the art, this utility model can have various modifications, combinations, and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A single-plate ultrathin stacked structure, characterized in that, The device includes a battery (1), a motherboard (2), a button bracket (3), a button board (4), and a shielding cover (5). The first connecting surface (21) of the motherboard (2) is connected to the battery (1), and the first connecting surface (21) is a single-sided fabric. The motherboard (2) is located inside the button bracket (3), and the button board (4) is located outside the button bracket (3). The motherboard (2) and the button board (4) are respectively connected to the button bracket (3). The shielding cover (5) is placed on the second connecting surface (22) of the motherboard (2), and the second connecting surface (22) is opposite to the first connecting surface (21).

2. The ultra-thin stacked structure of a single plate as described in claim 1, characterized in that, The inner side of the button bracket (3) is provided with a first positioning post (31), and the motherboard (2) is provided with a first positioning hole (23). The first positioning post (31) is inserted into the first positioning hole (23).

3. The ultra-thin stacked structure of a single plate as described in claim 1, characterized in that, The button bracket (3) is provided with a buckle (32) on its side, and the button bracket (3) is fixed to the motherboard (2) by the buckle (32).

4. The ultra-thin stacked structure of a single plate as described in claim 1, characterized in that, The button bracket (3) is provided with a second positioning post (33) on the outside, and the button plate (4) is provided with a second positioning hole (41). The second positioning post (33) is inserted into the second positioning hole (41).

5. The ultra-thin stacked structure of a single plate as described in claim 1, characterized in that, The button bracket (3) has a mounting groove (34) on its outer side, and the button plate (4) is embedded in the mounting groove (34).

6. The ultra-thin stacked structure of a single plate as described in claim 1, characterized in that, The button bracket (3) is provided with a clearance hole (35), and the shielding cover (5) is located in the clearance hole (35).

7. The ultra-thin stacked structure of a single plate as described in claim 1, characterized in that, A layer of floating tin (51) is soldered to the surface where the shielding cover (5) is connected to the motherboard (2).

8. The ultra-thin stacked structure of a single plate as described in claim 1, characterized in that, An insulating layer (52) is provided on the top of the inner wall of the shielding cover (5).

9. The ultra-thin stacked structure of a single plate as described in claim 1, characterized in that, The ultra-thin stacked structure also includes an FPC (6), a first pad (42) is provided on the inner side of the button board (4), a second pad (43) is provided on the inner side of the motherboard (2), one end of the FPC (6) is soldered to the button board (4) through the first pad (42), and the other end of the FPC (6) is soldered to the motherboard (2) through the second pad (43).

10. The ultra-thin stacked structure of a single plate as described in claim 1, characterized in that, The ultra-thin stacked structure also includes a screen (7), which is connected to the motherboard (2) and is located on the upper side of the button board (4).

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