A topcon cell preparation method based on poly stacking optimization
NL4000078B1Active Publication Date: 2026-06-17SUNSNYC CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- NL4000078P0
- Authority / Receiving Office
- NL · NL
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-05-20
- Filing Date
- 2025-05-19
- Publication Date
- 2026-06-17
- Estimated Expiration
- 2045-05-19
Abstract
The invention discloses a TOPCon cell preparation method based on poly-layer optimization, relating to the field of cell preparation, comprising: Sl, preparing a first tunneling oxide layer; S2, preparing a first amorphous silicon layer on the first tunneling oxide layer; S3, preparing a second tunneling oxide layer on the first amorphous silicon layer; S4, preparing a second amorphous silicon layer on the second tunneling oxide layer; S5, preparing a third amorphous silicon layer on the second amorphous silicon layer; S6, preparing a mask protection layer on the third amorphous silicon layer; S7, performing high-temperature annealing and removing the mask protection layer; S8, preparing a silicon nitride anti-reflection layer on the third amorphous silicon layer; S9, printing silver paste on the silicon nitride anti-reflection layer; by using this method to fabricate the TOPCon cell, the second tunneling oxide layer, the second amorphous silicon layer, and the third amorphous silicon layer do not require any removal process. Meanwhile, this method adopts a full tunneling and amorphous silicon approach, achieving 100% compatibility with production line equipment, requiring no additional equipment, reducing cost while also enabling efficiency improvement.
Need to check novelty before this filing date? Find Prior Art