Periscopic camera module

Abstract

Disclosed in the present invention is a periscopic camera module. The periscopic camera module comprises a reflecting prism, an optical lens and a photosensitive assembly, wherein the reflecting prism is provided with an incident surface, a reflecting surface and an emergent surface which divert incident light, and the incident surface of the reflecting prism defines a light incident side of the periscopic camera module; the photosensitive assembly comprises a circuit board and a photosensitive chip connected to the circuit board, and the photosensitive chip has a photosensitive area and a non-photosensitive area surrounding the photosensitive area; and the optical lens and the reflecting prism are arranged in a photosensitive path of the photosensitive assembly, wherein the photosensitive area of the photosensitive chip is oriented towards the light incident side of the periscopic camera module so as to reduce the height of the periscopic camera module, so that the periscopic camera module is suitable for achieving a light and thin electronic device.

Description

Periscope camera module Technical Field

[0001] The present invention relates to a camera module, and in particular to a periscope camera module, wherein a photosensitive area of ​​a photosensitive chip of the periscope camera module is biased toward the light incident side to reduce the height dimension of the periscope camera module. Background Art

[0002] As living standards rise, consumers are increasingly demanding camera functions in mobile devices such as mobile phones and tablets. For example, telephoto functionality is becoming increasingly essential for mobile camera modules. To achieve this, an optical lens with a telephoto function needs to be configured in the camera module. However, this increases the height of the camera module, making it difficult to meet the growing demand for thinner and lighter mobile devices. Consequently, a periscope design has been adopted in the prior art. Specifically, in a periscope camera module, the optical path of the periscope camera module is laid flat, and a light path reflector is provided along the optical path, causing the light path to bend at a certain angle (e.g., 90°) before entering the photosensitive chip of the photosensitive component. This reduces the height of the entire optical system. However, as consumers' demand for photography increases, the length and width of the photosensitive chip of the photosensitive component are also increasing. This makes it impossible to further reduce the height of the periscope camera module using traditional packaging solutions. Therefore, the packaging structure of the periscope camera module needs to be optimized.

[0003] In addition, in recent years, portable electronic devices are increasingly developing in the direction of intelligence and lightness. On this basis, in order to meet the requirements of portable electronic devices for the imaging capabilities of camera modules, periscope camera modules have been developed and equipped. Figures 1A and 1B are photosensitive components of a periscope camera module in the prior art, which include a chip circuit board 10P, a photosensitive chip 20P, and a lead-out circuit board 30P, wherein the chip circuit board 10P has a plate front 11P, a plate back 12P corresponding to the plate front 11P, and a plate through-hole 13P passing through the plate front 11P and the plate back 12P. The photosensitive chip 20P has a chip front 21P and a chip back 22P corresponding to the chip front 21P. Based on the chip flip-chip process, the chip front 21P of the photosensitive chip 20P and the plate front 12P of the chip circuit board 10P are mounted, and the photosensitive chip 20P is located in the non-photosensitive area. The chip pad and the plate pad of the chip circuit board 10P located on the back side 12P of the plate are connected, the photosensitive area of ​​the photosensitive chip 20P corresponds to the plate through-hole 13P of the chip circuit board 10P, one end of the export circuit board 30P is connected to one side of the chip circuit board 10P, and the other end can be connected to the portable electronic device, that is, the function of the export circuit board 30P is to connect the periscope camera module and the portable electronic device. Therefore, it can be understood that the circuit 14P derived from the photosensitive chip 20P by the chip circuit board 10P must be exported through the export circuit board 30P, and connected by the export circuit board 30P and the portable electronic device. Since the pads on at least two sides of the chip circuit board 10P and the photosensitive chip 20P are connected, and only one end of the export circuit board 30P is connected to one side of the chip circuit board 10P, the circuit 14P on the side of the chip circuit board 10P away from the connection position of the chip circuit board 10P and the export circuit board 30P needs to bypass the top or bottom of the plate through-hole 13P of the chip circuit board 10P and extend to the side of the chip circuit board 10P used to connect to the export circuit board 30P, that is, the chip circuit board 10P needs to reserve sufficient width above and / or below the plate through-hole 13P for laying out the circuit 14P, which results in the height of the periscope camera module being unable to be lowered, and further results in the periscope camera module being unable to adapt to the further lightweight development trend of portable electronic devices. Contents of the invention

[0004] One object of the present invention is to provide a periscope camera module, wherein the photosensitive chip of the periscope camera module is biased toward the light incident side, so as to facilitate reducing the height dimension of the camera module, so that the periscope camera module is suitable for electronic devices that pursue lightweight and thinness.

[0005] One object of the present invention is to provide a periscope camera module, wherein the long side of the photosensitive chip located on the light incident side is not provided with a chip pad, which is conducive to reducing the height dimension of the photosensitive chip and further reducing the height dimension of the periscope camera module, and the structure of the photosensitive chip enables the photosensitive chip to be arranged in a manner biased toward the light incident side.

[0006] One object of the present invention is to provide a periscope camera module, wherein the base of the periscope camera module for mounting the optical lens is an injection-molded part made of plastic, and the periscope camera module assembles the optical lens by snapping a cover made of metal onto the base. The cover made of metal can have a thinner size, so that the optical lens can be arranged in a manner biased toward the light incident side, thereby enabling the photosensitive chip to be arranged in a manner biased toward the light incident side.

[0007] One object of the present invention is to provide a periscope camera module, wherein the periscope camera module forms a front reinforcement portion on the front of the circuit board, and the side of the front reinforcement portion located on the light incident side has a narrower width dimension, which is conducive to reducing the height dimension of the front reinforcement portion and further reducing the height dimension of the periscope camera module, and the structure of the front reinforcement portion enables the photosensitive chip to be arranged in a manner biased towards the light incident side. For example, in some embodiments, the front reinforcement portion is integrally combined with the front of the circuit board based on a molding process, and the molding process enables the side of the front reinforcement portion located on the light incident side to have a narrower width dimension, which is conducive to reducing the height dimension of the front reinforcement portion and further reducing the height dimension of the periscope camera module.

[0008] One object of the present invention is to provide a periscope camera module, by forming the front reinforcement portion on the front side of the circuit board, so that the opening of the circuit board has good structural strength while being biased toward the light incident side, that is, the front reinforcement portion has the function of preventing the circuit board from deformation and breakage, so that the photosensitive chip can be arranged in a manner biased toward the light incident side.

[0009] One object of the present invention is to provide a periscope camera module, wherein the periscope camera module forms a back reinforcement portion on the back side of the circuit board, and the side of the back reinforcement portion located on the light incident side has a wider width dimension. In this way, when the side of the front reinforcement portion located on the light incident side has a narrower width dimension, the back reinforcement portion can reinforce the side of the circuit board located on the light incident side, thereby preventing the circuit board from deforming or breaking.

[0010] One object of the present invention is to provide a periscope camera module, wherein after the front reinforcement portion is formed on the front of the circuit board and the back reinforcement portion is formed on the back of the circuit board, the front reinforcement portion, the back reinforcement portion and / or the circuit board can be cut to further reduce the width of the front reinforcement portion, the back reinforcement portion and / or the circuit board on the light incident side, thereby achieving the purpose of further reducing the height dimension of the periscope camera module. In addition, when cutting the circuit board, the front reinforcement portion can prevent the circuit board from being deformed or broken due to cutting, thereby improving the yield rate of the periscope camera module.

[0011] According to one aspect of the present invention, the present invention provides a periscope camera module, comprising:

[0012] Optical lens;

[0013] a light redirecting element capable of redirecting incident light; and

[0014] A photosensitive component includes a circuit board and a photosensitive chip connected to the circuit board, the photosensitive chip has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, the optical lens and the light deflection element are arranged in the photosensitive path of the photosensitive component, wherein the photosensitive area of ​​the photosensitive chip is biased toward the light incident side of the periscope camera module.

[0015] According to one embodiment of the present invention, the light deflecting element is a reflective prism having an incident surface, a reflective surface and an exit surface for deflecting incident light, wherein the incident surface of the reflective prism defines the light incident side of the periscope camera module.

[0016] According to an embodiment of the present invention, the light redirecting element is a reflector having a reflective surface, so as to allow the light redirecting element to redirect incident light by reflection.

[0017] According to one embodiment of the present invention, the photosensitive component includes a front reinforcement portion having a light-through hole, wherein the front reinforcement portion is formed on the front side of the circuit board, and the light-through hole of the front reinforcement portion corresponds to the photosensitive area of ​​the photosensitive chip, wherein the width dimension of the front reinforcement portion on the light-entering side of the periscope camera module is smaller than the width dimension of the front reinforcement portion on the light-entering side away from the periscope camera module.

[0018] According to one embodiment of the present invention, the photosensitive chip is arranged on the back side of the circuit board, and the circuit board has an opening corresponding to the photosensitive area of ​​the photosensitive chip, wherein the width dimension of the side of the circuit board located on the light incident side of the periscope camera module is smaller than the width dimension of the side of the circuit board away from the light incident side of the periscope camera module.

[0019] According to one embodiment of the present invention, the photosensitive component includes a back reinforcement portion having a mounting channel, and the opening of the circuit board is connected to the mounting channel of the back reinforcement portion, wherein the photosensitive chip is mounted on the back of the circuit board through the mounting channel of the back reinforcement portion, wherein the width dimension of the back reinforcement portion on the side of the light incident side of the periscope camera module is greater than the width dimension of the back reinforcement portion on the side away from the light incident side of the periscope camera module.

[0020] According to one embodiment of the present invention, the periscope camera module further includes a base made of plastic and a cover made of metal, one end of the base has a base through-hole, one end of the cover has a cover through-hole, the cover is buckled on the side of the base, and the periscope camera module forms a receiving cavity between the base and the cover, the base through-hole of the base and the cover through-hole of the cover are respectively connected to the receiving cavity, wherein the reflective prism and the optical lens are received in the receiving cavity, the base through-hole of the base corresponds to the optical lens, and the cover through-hole of the cover corresponds to the incident surface of the reflective prism, wherein the base is mounted on the front mounting surface of the front reinforcement portion of the photosensitive component.

[0021] According to one embodiment of the present invention, the photosensitive component includes a substrate, which is mounted on the back mounting surface of the back reinforcement portion, and there is a gap between the substrate and the photosensitive chip.

[0022] According to one embodiment of the present invention, the gap between the substrate and the photosensitive chip is filled with thermally conductive adhesive.

[0023] According to one embodiment of the present invention, the photosensitive component includes a connecting circuit board, and the connecting circuit board is connected to the short side of the circuit board.

[0024] According to one embodiment of the present invention, the photosensitive component includes a connecting circuit board, which includes a connecting portion, a bending portion and a lead-out portion. The connecting portion is stacked on the substrate, and the opposite ends of the bending portion are respectively connected to the short side of the plate of the circuit board and the side of the connecting portion corresponding to the short side of the plate of the circuit board after bending. The lead-out portion is connected to the side of the connecting portion away from the light incident side of the periscope camera module.

[0025] According to one embodiment of the present invention, the height dimension of the connecting portion of the connecting circuit board is smaller than the height dimension of the circuit board, and the connecting portion is biased toward the side of the circuit board located on the light incident side of the periscope camera module, and the lead-out portion extends outward from the side of the connecting portion away from the light incident side of the periscope camera module and is bent.

[0026] According to one embodiment of the present invention, an arc-shaped column is provided at one end of the substrate adjacent to the bent portion, and the bent portion surrounds the outer side of the arc-shaped column of the substrate.

[0027] According to one embodiment of the present invention, the photosensitive component has a cutting side, and the cutting side is located on the light incident side of the periscope camera module.

[0028] One object of the present invention is to provide a photosensitive component and a periscope camera module, wherein the height dimension of the periscope camera module can be further reduced to meet the further lightweight and thinning development trend of portable electronic devices.

[0029] One object of the present invention is to provide a photosensitive component and a periscope camera module, wherein the connecting circuit board of the photosensitive component conducts a pair of circuits located on opposite sides of the plate perforation of the chip circuit board. In this way, a smaller number of circuits can be laid out on at least one side of the chip circuit board, or even no circuits can be laid out, so as to facilitate reducing the height size of the periscope camera module.

[0030] One object of the present invention is to provide a photosensitive component and a periscope camera module, wherein the height difference between the inner surface and the outer surface of the chip circuit board is greater than the thickness of the photosensitive chip, so as to prevent the photosensitive chip from protruding from the lower surface of the chip circuit board. In this way, during the process of mounting the connecting circuit board on the chip circuit board, the photosensitive chip is prevented from being pressurized to prevent the photosensitive chip from being deformed or compressed, thereby improving the yield of the periscope camera module.

[0031] One object of the present invention is to provide a photosensitive component and a periscope camera module, wherein the photosensitive component is provided with a heat-conducting portion between the lower surface of the photosensitive chip and the connecting circuit board to dissipate the heat generated by the photosensitive chip and reduce the temperature of the photosensitive chip during operation.

[0032] According to one aspect of the present invention, the present invention provides a photosensitive component, comprising:

[0033] Connect the circuit board;

[0034] An output circuit board has a connection end and an assembly end opposite to each other;

[0035] A photosensitive chip having an upper chip surface and a lower chip surface opposite to each other, wherein the upper chip surface has a photosensitive area and a non-photosensitive area surrounding the photosensitive area; and

[0036] A chip circuit board has an upper plate surface and a lower plate surface relative to each other, and a plate through-hole passing through the upper plate surface and the lower plate surface, wherein the connection end of the lead-out circuit board is connected to one side of the chip circuit board, wherein the non-photosensitive area of ​​the photosensitive chip is mounted on the lower plate surface of the chip circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the plate through-hole of the chip circuit board, wherein the connecting circuit board is mounted on the lower plate surface of the chip circuit board, and the connecting circuit board connects a pair of circuits of the chip circuit board located on opposite sides of the plate through-hole.

[0037] According to one embodiment of the present invention, the connecting circuit board conducts at least one circuit of the chip circuit board for connecting to a side of the export circuit board and at least one circuit of the chip circuit board away from the export circuit board.

[0038] According to one embodiment of the present invention, the connecting circuit board conducts at least one circuit of the chip circuit board for connecting to one side of the export circuit board and at least one circuit of the chip circuit board close to the export circuit board.

[0039] According to one embodiment of the present invention, the four sides of the chip circuit board used to define the plate through-hole are respectively defined as a plate first side, a plate second side, a plate third side and a plate fourth side in a clockwise direction, the plate first side and the plate third side correspond to each other in the width direction, and the plate second side and the plate fourth side correspond to each other in the height direction, wherein the connection end of the lead-out circuit board is connected to the plate first side of the chip circuit board, wherein the connection circuit board conducts at least one circuit located on the plate first side and at least one circuit located on the plate third side.

[0040] According to one embodiment of the present invention, the four sides of the chip circuit board used to define the plate through-hole are defined as a first side of the plate, a second side of the plate, a third side of the plate and a fourth side of the plate in a clockwise direction, respectively. The first side of the plate and the third side of the plate correspond to each other in the width direction, and the second side of the plate and the fourth side of the plate correspond to each other in the height direction, wherein the connection end of the lead-out circuit board is connected to the first side of the plate of the chip circuit board, wherein the connection circuit board conducts at least one circuit located on the first side of the plate and at least one circuit located on the second side of the plate.

[0041] According to one embodiment of the present invention, the connecting circuit board is located on the back of the photosensitive chip.

[0042] According to one embodiment of the present invention, the lower surface of the chip circuit board has an inner surface and an outer surface surrounding the inner surface, and the height difference between the inner surface and the outer surface is greater than the thickness of the photosensitive chip, wherein the photosensitive chip is mounted on the inner surface of the chip circuit board, and the connecting circuit board is mounted on the outer surface of the chip circuit board, and there is a gap between the chip lower surface of the photosensitive chip and the connecting circuit board.

[0043] According to one embodiment of the present invention, the photosensitive component includes a heat-conducting portion, and the heat-conducting portion is arranged in the gap between the chip lower surface of the photosensitive chip and the connecting circuit board.

[0044] According to one embodiment of the present invention, the photosensitive chip has a MIPI interface, the chip circuit board has a MIPI circuit, the MIPI circuit is completely arranged on the chip circuit board, and the MIPI circuit connects the MIPI interface of the photosensitive chip and the export circuit board.

[0045] According to one embodiment of the present invention, the chip circuit board is a rigid circuit board, and the connection circuit board is a flexible circuit board.

[0046] According to one embodiment of the present invention, the connection circuit board has two wiring layers, and the chip circuit board has four or six wiring layers, wherein the lines in the two wiring layers of the connection circuit board are parallel lines.

[0047] According to one embodiment of the present invention, the number of routing layers of the connecting circuit board is two, and the number of routing layers of the chip circuit board is four or six, wherein the lines of one layer of the two layers of routing of the connecting circuit board are parallel lines, and the lines of the other layer of routing are grid lines.

[0048] According to one embodiment of the present invention, the photosensitive component includes a reinforcement unit, and the reinforcement unit includes a front reinforcement part and a back reinforcement part, wherein the front reinforcement part has a light window, and the front reinforcement part is arranged on the upper surface of the plate of the chip circuit board, and the light window of the front reinforcement part is communicated with the plate through-hole of the chip circuit board, wherein the back reinforcement part has a mounting channel, and the back reinforcement part is arranged on the lower surface of the plate of the chip circuit board, and the connecting circuit board is accommodated in the mounting channel of the back reinforcement part.

[0049] According to one embodiment of the present invention, the front reinforcing portion is integrally formed on the upper surface of the plate of the chip circuit board, and the back reinforcing portion is integrally formed on the lower surface of the plate of the chip circuit board.

[0050] According to another aspect of the present invention, the present invention further provides a periscope camera module, which includes:

[0051] Optical lens;

[0052] Light path reflection component; and

[0053] The photosensitive component further comprises:

[0054] Connect the circuit board;

[0055] An output circuit board has a connection end and an assembly end opposite to each other;

[0056] A photosensitive chip having an upper chip surface and a lower chip surface opposite to each other, wherein the upper chip surface has a photosensitive area and a non-photosensitive area surrounding the photosensitive area; and

[0057] A chip circuit board having an upper plate surface and a lower plate surface relative to each other, and a plate through-hole passing through the upper plate surface and the lower plate surface, wherein the connection end of the export circuit board is connected to one side of the chip circuit board, wherein the non-photosensitive area of ​​the photosensitive chip is mounted on the lower plate surface of the chip circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the plate through-hole of the chip circuit board, wherein the connecting circuit board is mounted on the lower plate surface of the chip circuit board, and the connecting circuit board conducts at least one circuit located on the first side of the plate and at least one circuit located on the second side of the plate, wherein the optical lens and the light path reflection component are respectively arranged in the photosensitive path of the photosensitive chip of the photosensitive component.

[0058] According to another aspect of the present invention, the present invention further provides a method for manufacturing a photosensitive component, wherein the manufacturing method comprises the following steps:

[0059] (a) mounting a non-photosensitive area of ​​a photosensitive chip on the lower surface of a chip circuit board, wherein the photosensitive area of ​​the photosensitive chip corresponds to a through-hole of the chip circuit board; and

[0060] (b) Mounting a connecting circuit board on the lower surface of the chip circuit board, wherein the connecting circuit board conducts a pair of circuits of the chip circuit board located on opposite sides of the plate through-hole to obtain the photosensitive component.

[0061] According to one embodiment of the present invention, the step (a) further comprises the steps of:

[0062] (a.1) providing a first solder on the inner pad of the chip circuit board;

[0063] (a.2) providing a second solder on the chip pad of the photosensitive chip; and

[0064] (a.3) After attaching the photosensitive chip to the chip circuit board, hot-press bonding the first solder and the second solder to achieve mounting of the photosensitive chip and the chip circuit board.

[0065] According to one embodiment of the present invention, in step (b), the top side pads of the connecting circuit board and the outer side pads of the chip circuit board are connected by a hot pressing welding process or an anisotropic conductive film process to mount the connecting circuit board on the lower surface of the chip circuit board.

[0066] According to one embodiment of the present invention, in the step (a), the photosensitive chip is mounted on the inner surface of the chip circuit board to prevent the photosensitive chip from protruding from the lower surface of the plate of the chip circuit board. In the step (b), a gap is formed between the lower surface of the chip of the photosensitive chip and the connecting circuit board to prevent the photosensitive chip from being pressed during the process of mounting the connecting circuit board on the lower surface of the plate of the chip circuit board through a hot pressing welding process or an anisotropic conductive adhesive film process.

[0067] According to one embodiment of the present invention, before step (b), thermally conductive silicone is provided on the chip lower surface of the photosensitive chip and the connecting circuit board, so that after step (b), the thermally conductive silicone forms a heat-conducting portion between the chip lower surface of the photosensitive chip and the connecting circuit board.

[0068] According to one embodiment of the present invention, before step (a), the manufacturing method further includes the step of: (c) providing a back reinforcement portion on the lower surface of the plate of the chip circuit board, and the mounting channel of the back reinforcement portion is connected to the plate through-hole of the chip circuit board, so that in step (a), the non-photosensitive area of ​​the photosensitive chip is mounted on the plate surface of the chip circuit board through the mounting channel of the back reinforcement portion.

[0069] According to one embodiment of the present invention, before the step (b), the manufacturing method further comprises the step of: providing a side encapsulation on the side of the photosensitive chip.

[0070] According to one embodiment of the present invention, the side encapsulation fills the gap between the side of the photosensitive chip and the back reinforcement portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0071] 1A and 1B are schematic diagrams of a photosensitive component in the prior art from different perspectives.

[0072] FIG2A is a schematic three-dimensional diagram of a periscope camera module according to the first embodiment of the present invention from one viewing angle.

[0073] FIG2B is a schematic three-dimensional diagram of the periscope camera module according to the first embodiment of the present invention from another perspective.

[0074] FIG3 is a schematic three-dimensional cross-sectional view of a position of the periscope camera module according to the first embodiment of the present invention.

[0075] FIG4 is a schematic three-dimensional cross-sectional view of another position of the periscope camera module according to the first embodiment of the present invention.

[0076] FIG5 is an enlarged schematic diagram of a local position in FIG4.

[0077] FIG6 is a schematic cross-sectional view of a position of the periscope camera module according to the first embodiment of the present invention.

[0078] FIG7 is an enlarged view of a local position of FIG6 .

[0079] 8A and 8B are schematic diagrams of one of the packaging steps of the periscope camera module according to the first embodiment of the present invention.

[0080] 9A and 9B are schematic diagrams of the second packaging step of the periscope camera module according to the first embodiment of the present invention.

[0081] 10A and 10B are schematic diagrams of the third packaging step of the periscope camera module according to the first embodiment of the present invention.

[0082] 11A and 11B are schematic diagrams of the fourth packaging step of the periscope camera module according to the first embodiment of the present invention.

[0083] 12A and 12B are schematic diagrams of the fifth packaging step of the periscope camera module according to the first embodiment of the present invention.

[0084] 13A and 13B are schematic diagrams of the sixth packaging step of the periscope camera module according to the first embodiment of the present invention.

[0085] FIG14 is a schematic diagram of the seventh packaging step of the periscope camera module according to the first embodiment of the present invention.

[0086] 15A and 15B are schematic diagrams showing the states of the photosensitive component of an optional implementation of the periscope camera module according to the first embodiment of the present invention before and after cutting.

[0087] FIG16 is a schematic cross-sectional view of a position of the periscope camera module according to the first embodiment of the present invention.

[0088] FIG17 is an enlarged view of a local position of FIG16 .

[0089] FIG18 is a schematic cross-sectional view of a periscope camera module according to a second embodiment of the present invention.

[0090] FIG19 is a schematic cross-sectional view of a photosensitive component of the periscope camera module according to the second embodiment of the present invention in one direction.

[0091] FIG20 is an enlarged view of a local position of FIG19.

[0092] FIG21 is a schematic cross-sectional view of the photosensitive component of the periscope camera module according to the second embodiment of the present invention in another direction.

[0093] Figure 22 is a schematic diagram of a partial structure of the photosensitive component of the periscope camera module according to the second embodiment of the present invention.

[0094] 23A to 23H are schematic diagrams of the manufacturing process of the photosensitive component of the periscope camera module according to the second embodiment of the present invention. DETAILED DESCRIPTION

[0095] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components set forth in the following description or illustrated in the following figures. The present invention is capable of other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used herein are for descriptive purposes and should not be considered restrictive. The use of "comprises," "includes," or "has" and variations thereof herein is intended to cover the items and their equivalents set forth below, as well as additional items. Unless otherwise specified or limited, the terms "mount," "connect," "support," and "couple" and variations thereof are used broadly and cover both direct and indirect mounting, connection, support, and coupling. In addition, "connect" and "couple" are not limited to physical or mechanical connections or couplings.

[0096] Furthermore, on the first hand, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second hand, the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" cannot be understood as a limitation on the quantity.

[0097] With reference to Figures 2A to 14 of the accompanying drawings of the present invention, a periscope camera module according to a first embodiment of the present invention will be disclosed and explained in the following description. The periscope camera module includes a light deflection element 10, an optical lens 20, and a photosensitive component 30. Light incident on the periscope camera module is deflected by the light deflection element 10 and then enters the optical lens 20. After passing through the optical lens 20, it reaches the photosensitive component 30. The photosensitive component 30 performs photoelectric conversion to form an image, allowing the periscope camera module to obtain image information. Preferably, the light deflection element 10 is capable of deflecting the incident light by 90 degrees.

[0098] That is, in the specific example of the periscope camera module of the present invention shown in Figures 2A to 14, the optical lens 20 and the light deflection element 10 are sequentially arranged in the light sensing path of the photosensitive component 30, that is, the optical lens 20 is located between the light deflection element 10 and the photosensitive component 30. Alternatively, in other examples of the periscope camera module of the present invention, the light deflection element 10 and the optical lens 20 are sequentially arranged in the light sensing path of the photosensitive component 30, that is, the light deflection element 10 is located between the optical lens 20 and the photosensitive component 30. Alternatively, in other examples of the periscope camera module of the present invention, there are two or more optical lenses 20, and the light deflection element 10 is arranged between two adjacent optical lenses 20; or there are two or more light deflection elements 10, and the optical lens 20 is arranged between two adjacent light deflection elements 10.

[0099] Continuing to refer to Figures 2A to 14, the periscope camera module includes a base 40 and a cover 50, one end of the base 40 has a base through-hole 41, one end of the cover 50 has a cover through-hole 51, the cover 50 is buckled onto the side of the base 40, and the periscope camera module forms a receiving cavity 60 between the base 40 and the cover 50, the base through-hole 41 of the base 40 and the cover through-hole 51 of the cover 50 are respectively connected to the receiving cavity 60. The light deflecting element 10 and the optical lens 20 are both accommodated in the accommodating cavity 60, and the photosensitive component 30 is arranged at the end of the base 40 where the base through-hole 41 is provided, wherein the cover through-hole 51 of the cover 50 corresponds to the light deflecting element 10, so as to allow the light incident on the periscope camera module to reach the light deflecting element 10 after passing through the cover through-hole 51 of the cover 50, and the base through-hole 41 of the base 40 corresponds to the optical lens 20, so as to allow the incident light passing through the optical lens 20 to reach the photosensitive component 30 after further passing through the base through-hole 41 of the base 40.

[0100] Specifically, the base 40 further has a base groove 42 and a side opening 43 connected to the base groove 42, the base groove 42 is provided with a prism mounting position 421 and a lens mounting position 422, wherein the light deflection element 10 is installed at the prism mounting position 421 through the side opening 43 of the base 40, and the optical lens 20 is installed at the lens mounting position 422 through the side opening 43 of the base 40 in a manner that the base through-hole 41 of the base 40 corresponds to the optical lens 20. After the cover body 50 is fastened to the base 40 in a manner that the cover through-hole 51 of the cover body 50 corresponds to the light deflection element 10, on the one hand, the cover body 50 closes the side opening 43 of the base 40, and on the other hand, the periscope camera module forms the accommodating cavity 60 between the base 40 and the cover body 50, and the light deflection element 10 and the optical lens 20 are both accommodated in the accommodating cavity 60.

[0101] In some embodiments of the present invention, the light deflecting element 10 can be fixedly bonded to the base 40 by glue. In other embodiments of the present invention, the light deflecting element 10 can move relative to the base 40 to achieve the optical image stabilization function of the periscope camera module. It is worth mentioning that the light deflecting element 10 can move relative to the base 40 by rotating around the height direction and around the width direction axis to achieve two-axis optical image stabilization of the periscope camera module, wherein the height direction refers to the direction in which the light enters the light deflecting element 10, the length direction refers to the direction in which the light exits the light deflecting element 10, and the width direction refers to the direction perpendicular to both the height direction and the length direction, that is, the height direction, length direction and width direction of the periscope camera module are perpendicular to each other.

[0102] In some embodiments of the present invention, the optical lens 20 can be fixedly bonded to the base 40 by glue. In other embodiments of the present invention, the optical lens 20 can move relative to the base 40 to achieve focus and / or optical image stabilization of the periscope camera module.

[0103] It is worth mentioning that the buckling method of the base 40 and the cover 50 is not limited in the periscope camera module of the present invention. For example, in the specific example of the periscope camera module of the present invention shown in Figures 2A to 14, the base 40 is an injection-molded part made of plastic material, and at least one buckle 44 is provided on the opposite sides in the width direction and one end portion where the light deflection element 10 is provided. The cover 50 is a metal part, which includes a panel 52, two side panels 53 and an end panel 54. The two side panels 53 and the end panel 54 extend downward from the opposite sides and one end portion of the panel 52 as a whole, and the opposite sides of the end panel 54 are connected to one of the two side panels 53. At the end, the cover body through-hole 51 is formed on the panel 52, and the two side panels 53 and the end panel 54 are respectively provided with at least one card hole 55, wherein after the cover body 50 is assembled to the base 40, the panel 52 is located on the side of the base 40 for closing the side opening 43 of the base 40, and each of the side panels 53 and the end panels 54 are respectively located on the opposite sides and the outside of the end of the base 40, and these buckles 44 of the base 40 are respectively snapped into these card holes 55 of the cover body 50, so that the base 40 and the cover body 50 are reliably snapped.

[0104] Preferably, referring to FIG2A , the periscope camera module further includes a light-shielding portion 70 , which is coated on the panel 52 of the cover 50 and surrounds the cover perforation 51 of the cover 50 to reduce the reflection of stray light and improve the imaging quality of the periscope camera module.

[0105] Continuing with FIG. 6 , in this specific example of the periscope camera module of the present invention, the light deflection element 10 is a reflective prism having an incident surface 11, a reflective surface 12, and an exit surface 13. Incident light enters the incident surface 11 of the light deflection element 10, is reflected by the reflective surface 12, and then exits through the exit surface 13, thereby deflecting the incident light. Preferably, the light deflection element 10 deflects the incident light by 90°. For example, in the specific example of the periscope camera module of the present invention shown in Figures 2A to 14, the incident surface 11, the reflective surface 12, and the exit surface 13 of the light deflection element 10 are all planes, wherein the extension direction of the incident surface 11 and the extension direction of the reflective surface 12 have a 45° angle, the extension direction of the exit surface 13 and the extension direction of the reflective surface 12 have a 45° angle, and the extension direction of the incident surface 11 and the extension direction of the exit surface 13 have a 90° angle, so that the light deflection element 10 can deflect the incident light by 90°. Optionally, in other embodiments of the present invention, the incident surface 11, the reflective surface 12, and the exit surface 13 of the light deflection element 10 can be designed as convex or concave surfaces.

[0106] It is worth mentioning that since the incident light enters from the incident surface 11 of the light deflection element 10, the incident surface 11 of the light deflection element 10 defines the light incident side 100 of the periscope camera module. In other words, the light incident side 100 of the periscope camera module refers to the side where external light enters the periscope camera module.

[0107] Optionally, in other embodiments of the periscope camera module of the present invention, the light deflection element 10 is a reflector having a reflective surface 12, and incident light can be reflected and deflected by the reflective surface 12 of the light deflection element 10. The emitting surface 12 of the light deflection element 10 can be a flat surface, a convex surface, or a concave surface, which is selected according to needs.

[0108] Continuing to refer to Figures 2A to 14, the photosensitive component 30 includes a circuit board 31 and a photosensitive chip 32 connected to the circuit board 31, the photosensitive chip 32 having a photosensitive area 321 and a non-photosensitive area 322 surrounding the photosensitive area 321, wherein the photosensitive component 30 is arranged at the end of the base 40 provided with the base through-hole 41 in such a manner that the base through-hole 41 of the base 40 corresponds to the photosensitive area 321 of the photosensitive chip 32, so that the optical lens 20 and the light deflection element 10 are sequentially arranged in the photosensitive path of the photosensitive component 30, so that the light incident on the periscope camera module is deflected by the light deflection element 10 and then incident on the optical lens 20, and after passing through the optical lens 20, reaches the photosensitive area 321 of the photosensitive chip 32 of the photosensitive component 30, and the photosensitive chip 32 performs photoelectric conversion to form an image, so as to allow the periscope camera module to obtain image information.

[0109] Unlike the periscope camera module of the prior art, in this specific example of the periscope camera module of the present invention shown in Figures 2A to 14, the photosensitive component 30 is arranged on the base 40 in a manner such that the photosensitive area 321 of the photosensitive chip 32 is biased toward the light incident side 100 of the periscope camera module. This helps to reduce the height of the periscope camera module, making the periscope camera module suitable for electronic devices that pursue lightweight and thin designs. Accordingly, the optical lens 20 is biased toward the light incident side 100 of the periscope camera module. That is, in the periscope camera module of the present invention, along the direction in which the light is incident on the light deflection element 10, the midpoint of the optical lens 20 in this direction is higher than the midpoint of the periscope camera module in this direction, thereby causing the optical lens 20 to be biased toward the light incident side 100 of the periscope camera module.

[0110] It can be understood that in the periscope camera module of the present invention, the base 40 is made of plastic and is usually thicker, the cover 50 is made of metal and can usually be thinner, and the optical lens 20 is mounted on the base 40 and accommodated in the accommodating cavity 60 formed between the base 40 and the cover 50. Therefore, by controlling the thickness of the base 40 and the cover 50, the position of the optical lens 20 can be conveniently biased toward the light incident side 100 of the periscope camera module.

[0111] Furthermore, since the photosensitive component 30 is applied to the periscope camera module, in order to reduce the height of the periscope camera module, the circuit board 31 and the photosensitive chip 32 are both designed to be rectangular, and the circuit board 31 has two opposite long sides 311 and two opposite short sides 312. One of the two long sides 311 is located at the light incident side 100 of the periscope camera module, and the other long side 311 is away from the light incident side 100 of the periscope camera module. On the light incident side 100 of the periscope camera module, the circuit board 31 is respectively provided with a row of plate soldering pads 313 on one of the two short sides 312 of the plate and one of the two long sides 311 of the plate, which is away from the light incident side 100 of the periscope camera module. That is, one of the two long sides 311 of the plate 311 of the circuit board 31, which is located on the light incident side 100 of the periscope camera module, is not provided with the plate soldering pads 313.

[0112] Correspondingly, the photosensitive chip 32 has two opposite chip long sides 323 and two opposite chip short sides 324. One of the two chip long sides 323 is located on the light incident side 100 of the periscope camera module, and the other chip long side 323 is away from the light incident side 100 of the periscope camera module. The photosensitive chip 32 is provided with a row of chip bonding pads 325 on each of the two chip short sides 324 and the one of the two chip long sides 323 that is away from the light incident side 100 of the periscope camera module. That is, one of the two chip long sides 323 of the photosensitive chip 32 that is located on the light incident side 100 of the periscope camera module is not provided with the chip bonding pads 325. This helps to reduce the height of the photosensitive chip 32 and further reduce the height of the periscope camera module.

[0113] It can be understood that in the periscope camera module of the present invention, the photosensitive chip 32 is connected to the circuit board 31, and the positions of the two long sides 311 of the plate of the circuit board 31 and the positions of the two long sides 323 of the chip of the photosensitive chip 32 correspond one to one, and the positions of the two short sides 312 of the plate of the circuit board 31 and the positions of the two short sides 324 of the chip of the photosensitive chip 32 correspond one to one. Therefore, the height dimension of the circuit board 31 is consistent with the distance between the two long sides 311 of the plate of the circuit board 31, and the height dimension of the photosensitive chip 32 is consistent with the distance between the two long sides 323 of the chip of the photosensitive chip 32. One of the long sides 311 of the plate located on the light incident side 100 of the periscope camera module is not provided with the plate soldering pad 313, and one of the two long sides 323 of the photosensitive chip 32 located on the light incident side 100 of the periscope camera module is not provided with the chip soldering pad 325. Therefore, the distance between the two long sides 311 of the plate of the circuit board 31 can be reduced, so that the height dimension of the circuit board 31 can be reduced. Correspondingly, the distance between the two long sides 323 of the photosensitive chip 32 can be reduced, so that the height dimension of the photosensitive chip 32 is reduced, which is beneficial to reduce the height dimension of the periscope camera module.

[0114] Furthermore, since one of the two long sides 311 of the plate of the circuit board 31, which is located on the light incident side 100 of the periscope camera module, is not provided with the plate soldering pad 313, and one of the two long sides 323 of the photosensitive chip 32, which is located on the light incident side 100 of the periscope camera module, is not provided with the chip soldering pad 325, when the photosensitive component 30 is assembled on the base 40, the photosensitive area 321 of the photosensitive chip 32 can be further biased toward the light incident side 100 of the periscope camera module, thereby further achieving the purpose of reducing the height dimension of the periscope camera module.

[0115] It is worth mentioning that the plate pad 313 of the circuit board 31 and the chip pad 325 of the photosensitive chip 32 are connected to each other to connect the photosensitive chip 32 and the circuit board 31. In some embodiments of the present invention, the photosensitive chip 32 is located on the front side of the circuit board 31. For example, the photosensitive chip 32 can be directly mounted on the front side of the circuit board 31, and the chip pad 325 of the photosensitive chip 32 and the plate pad 313 of the circuit board 31 are connected by gold wire to connect the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the front side of the circuit board 31 refers to the side of the circuit board 31 facing the optical lens 20, and the back side of the circuit board 31 refers to the side of the circuit board 31 facing away from the optical lens 20. Therefore, the front and back sides of the circuit board 31 are located on opposite sides of the circuit board 31.

[0116] In this embodiment of the present invention shown in Figures 2A to 14, the circuit board 31 has an opening 314 that runs through the front and back of the circuit board 31. That is, the opening 314 of the circuit board 31 extends from the front to the back of the circuit board 31. The photosensitive chip 32 is mounted on the back of the circuit board 31 by directly soldering the chip pads 325 and the board pads 313 to connect the photosensitive chip 32 and the circuit board 31. The opening 314 of the circuit board 31 corresponds to the photosensitive area 321 of the photosensitive chip 32. In this way, light emitted by the optical lens 20 can reach the photosensitive area 321 of the photosensitive chip 32 after passing through the opening 314 of the circuit board 31.

[0117] It can be understood that, since one of the two long sides 311 of the circuit board 31 located on the light incident side 100 of the periscope camera module is not provided with the plate soldering pad 313, the width dimension of the circuit board 31 on the side located on the light incident side 100 of the periscope camera module can be narrowed, thereby facilitating the reduction of the height dimension of the circuit board 31 and further reducing the height dimension of the periscope camera module. Correspondingly, since one of the two long sides 323 of the photosensitive chip 32 located on the light incident side 100 of the periscope camera module is not provided with the chip soldering pad 325, the width dimension of the photosensitive chip 32 on the side located on the light incident side 100 of the periscope camera module can be narrowed, thereby facilitating the reduction of the height dimension of the photosensitive chip 32 and further reducing the height dimension of the periscope camera module.

[0118] Furthermore, the photosensitive component 30 includes a front reinforcement portion 33, which has a light hole 331, wherein the front reinforcement portion 33 is formed on the front of the circuit board 31, and the photosensitive area 321 of the photosensitive chip 32 corresponds to the light hole 331 of the front reinforcement portion 33, so that the light emitted through the optical lens 20 can reach the photosensitive area 321 of the photosensitive chip 32 after passing through the light hole 331 of the front reinforcement portion 33 and the opening 314 of the circuit board 31.

[0119] In some embodiments of the present invention, the inner side surface of the front reinforcing portion 33 for forming the light-through hole 331 is a curved surface, which is beneficial for demoulding and reducing stray light.

[0120] In other embodiments of the present invention, the inner side surface of the front reinforcement portion 33 used to form the light-through hole 331 is a bevel, and the angle between the extension direction of the bevel and the central axis of the photosensitive chip 32 (that is, the line passing through the center of the photosensitive area 321 of the photosensitive chip 32 and perpendicular to the plane where the photosensitive area 321 is located) is less than 45°. Preferably, the angle between the extension direction of the bevel and the central axis of the photosensitive chip 32 is 0°, that is, the bevel is perpendicular to the plane where the photosensitive area 321 of the photosensitive chip 32 is located. It is worth noting that the bevel of the front reinforcement portion 33 refers to the inclination relative to the central axis of the photosensitive chip 32.

[0121] In other embodiments of the present invention, the inner side surface of the front reinforcement portion 33, which is used to form the light-through hole 331, is composed of an inclined surface and a curved surface. The inclined surface extends outward from the circuit board 31, and the curved surface extends further outward from the inclined surface. The angle between the extending direction of the inclined surface and the central axis of the photosensitive chip 32 is less than 45°. Preferably, the angle between the extending direction of the inclined surface and the central axis of the photosensitive chip 32 is 0°.

[0122] In the periscope camera module of the present invention, the periscope camera module integrally forms the front reinforcement portion 33 on the front side of the circuit board 31 by a molding process. The molding process enables the front reinforcement portion 33 to have a narrower width dimension on the side of the light incident side 100 of the periscope camera module. This is conducive to reducing the height dimension of the front reinforcement portion 33 and further reducing the height dimension of the periscope camera module. In addition, the structure of the front reinforcement portion 33 enables the photosensitive chip 32 to be arranged in a manner biased toward the light incident side 100 of the periscope camera module.

[0123] In addition, by forming the front reinforcement portion 33 on the front side of the circuit board 31, the opening 314 of the circuit board 31 has good structural strength while being biased toward the light incident side 100 of the periscope camera module, that is, the front reinforcement portion 33 has the function of preventing the circuit board 31 from deforming or breaking, so that the photosensitive chip 32 can be arranged in a manner biased toward the light incident side 100 of the periscope camera module.

[0124] It is worth mentioning that, because the front reinforcement portion 33 is formed integrally with the front surface of the circuit board 31 by molding a molded material, the front reinforcement portion 33 has a flat front mounting surface 332. It is understood that the front mounting surface 332 of the front reinforcement portion 33 surrounds the light hole 331.

[0125] Continuing with reference to Figures 3 to 7 , the photosensitive assembly 30 further includes a back reinforcement portion 34 having a mounting channel 341. The back reinforcement portion 34 is formed on the back of the circuit board 31, and the opening 314 of the circuit board 31 is connected to the mounting channel 341 of the back reinforcement portion 34. The plate pads 313 of the circuit board 31 are exposed in the mounting channel 341 of the back reinforcement portion 34. The photosensitive chip 32 can be reversely mounted on the circuit board 31 through the mounting channel 341 of the back reinforcement portion 34. Preferably, the inner side surface of the back reinforcement portion 34 used to form the mounting channel 341 is a curved surface to facilitate demolding.

[0126] It can be understood that after the photosensitive chip 32 is mounted on the back side of the circuit board 31, the back side reinforcement portion 34 surrounds the photosensitive chip 32 to allow the back side reinforcement portion 34 to protect the photosensitive chip 32. Preferably, the height dimension of the back side reinforcement portion 34 is greater than 30 μm, that is, a back side mounting surface 342 of the back side reinforcement portion 34 is at least 30 μm lower than the back side of the circuit board 31 to allow the back side reinforcement portion 34 to protect the photosensitive chip 32. Preferably, the height dimension of the back side reinforcement portion 34 is between 30 μm and 50 μm. For example, in some typical examples, the height dimension of the back side reinforcement portion 34 can be 40 μm. In this way, the back side reinforcement portion 34 protects the photosensitive chip 32 without increasing the size of the photosensitive component 30.

[0127] In the periscope camera module of the present invention, the periscope camera module forms the back reinforcement portion 34 on the back side of the circuit board 31 by a molding process. Preferably, referring to FIG6 , the width dimension of the back reinforcement portion 34 on the side of the light incident side 100 of the periscope camera module is greater than the width dimension of the back reinforcement portion 34 on the side away from the light incident side 100 of the periscope camera module, that is, the back reinforcement portion 34 on the side of the light incident side 100 of the periscope camera module has a wider width dimension. In this way, when the front reinforcement portion 33 on the light incident side 100 of the periscope camera module has a narrower width dimension, the back reinforcement portion 34 can strengthen the circuit board 31 on the periscope camera module. One side of the light incident side 100 of the camera module is reinforced to prevent the circuit board 31 from being deformed or broken. At the same time, the side of the back reinforcement portion 34 away from the light incident side 100 of the periscope camera module is narrowed so that the back reinforcement portion 34 can avoid the plate pad 313 of the circuit board 31 located on this side, so as to allow the chip pad 325 of the photosensitive chip 32 located on the light incident side 100 away from the periscope camera module to be soldered to the plate pad 313 of the circuit board 31 located on the light incident side 100 away from the periscope camera module.

[0128] It is worth mentioning that, since the back reinforcement portion 34 is formed by integrally molding a molding material on the back side of the circuit board 31 through a mold, the back reinforcement portion 34 has a flat back mounting surface 342 .

[0129] Continuing to refer to Figures 3 to 6, since the photosensitive component 30 is provided with the front reinforcement part 33 and the back reinforcement part 34 on the front and back of the circuit board 31 respectively, the front reinforcement part 33 and the back reinforcement part 34 can respectively enhance the strength and flatness of the circuit board 31 on the front and back of the circuit board 31. During the manufacture and use of the periscope camera module, the front reinforcement part 33 and the back reinforcement part 34 can make the circuit board 31 less likely to bend and deform, thereby greatly reducing the risk of failure of the photosensitive chip 32.

[0130] It is worth mentioning that the order of forming the front reinforcement portion 33 on the front of the circuit board 31 and the back reinforcement portion 34 on the back of the circuit board 31 is not limited in the periscope camera module of the present invention. For example, in some embodiments, first, the front reinforcement portion 33 is formed on the front of the circuit board 31, and secondly, the back reinforcement portion 34 is formed on the back of the circuit board 31. In other embodiments, first, the back reinforcement portion 34 is formed on the back of the circuit board 31, and secondly, the front reinforcement portion 33 is formed on the front of the circuit board 31. In other embodiments, at the same time as the front reinforcement portion 33 is formed on the front of the circuit board 31, the back reinforcement portion 34 is formed on the back of the circuit board 31, that is, the front reinforcement portion 33 and the back reinforcement portion 34 are formed by the same molding process.

[0131] Continuing to refer to FIG6 , the photosensitive assembly 30 further includes at least one electronic component 35 , which can be a passive electronic device such as a resistor or capacitor, or an active electronic device such as a diode or a memory chip, wherein the electronic component 35 is mounted on the front of the circuit board 31 , and the front reinforcement portion 33 wraps the electronic component 35 . In this way, the circuit board 31 does not need to provide a dedicated space for mounting the electronic component 35 , which is conducive to reducing the size of the circuit board 31 and reducing the height of the periscope camera module. It can be understood that by wrapping the electronic component 35 mounted on the circuit board 31 with the front reinforcement portion 33 integrally combined with the circuit board 31 , not only can the risk of the electronic component 35 falling off be reduced, but the electronic component 35 and the photosensitive chip 32 can also be isolated to prevent the falling objects of the electronic component 35 from contaminating the photosensitive area 321 of the photosensitive chip 32 . Alternatively, in other embodiments, the electronic components 35 may be mounted on the back of the circuit board 31, with the back reinforcement portion 34 wrapping the electronic components 35. Of course, mounting the electronic components 35 on both the front and back of the circuit board 31 is optional. In this embodiment, the front reinforcement portion 33 wraps the electronic components 35 mounted on the front of the circuit board 31, and the back reinforcement portion 34 wraps the electronic components 35 mounted on the back of the circuit board 31.

[0132] Preferably, the electronic component 35 is not mounted on one of the two long sides 311 of the circuit board 31, which is located on the light incident side 100 of the periscope camera module. That is, the electronic component 35 is only mounted on at least one of the two short sides 312 of the circuit board 31 and one of the two long sides 311 of the circuit board 31, which is away from the light incident side 100 of the periscope camera module. In this way, the long side 311 of the two long sides 311 of the circuit board 31, which is located on the light incident side 100 of the periscope camera module, can have a narrower width dimension, which is conducive to reducing the height dimension of the periscope camera module.

[0133] Now turning to Figure 6, the photosensitive component 30 further includes a filter element 36, which can be mounted on the front mounting surface 332 of the front reinforcement portion 33 by glue to keep the filter element 36 in the photosensitive path of the photosensitive chip 32, wherein the filter element 36 can filter unnecessary stray light such as infrared rays in the incident light to improve the imaging quality of the periscope camera module. It can be understood that since the front mounting surface 332 of the front reinforcement portion 33 has a high flatness, the flatness of the filter element 36 can be guaranteed. Preferably, an annular silk screen is provided around the side of the filter element 36 facing the optical lens 20 to reduce stray light and improve the imaging quality of the periscope camera module.

[0134] Preferably, the filter element 36 is mounted on the inner side of the front mounting surface 332 of the front reinforcement portion 33 by glue, and the base 40 is mounted on the outer side of the front mounting surface 332 of the front reinforcement portion 33 by glue, so that the base through-hole 41 of the base 40 can correspond to the filter element 36 to allow the incident light passing through the base through-hole 41 of the base 40 to enter the photosensitive component 30 after passing through the filter element 36.

[0135] Continuing to refer to Figures 2A to 14, the photosensitive component 30 further includes a connecting circuit board 37, which is connected to one of the two short sides 312 of the board 31 of the circuit board 31. In this way, the setting of the connecting circuit board 37 will not increase the height dimension of the periscope camera module, wherein the connecting circuit board 37 is used to connect the periscope camera module to the mobile terminal.

[0136] Furthermore, the connecting circuit board 37 includes a connecting portion 371, a bending portion 372 and a lead-out portion 373. The connecting portion 371 is stacked on the back of the circuit board 31. The opposite ends of the bending portion 372 are respectively connected to one of the short sides 312 of the plate of the circuit board 31 and the side of the connecting portion 371 corresponding to the short side 312 of the plate of the circuit board 31 after bending. The lead-out portion 373 is connected to the side of the connecting portion 371 away from the light incident side 100 of the periscope camera module.

[0137] In some embodiments of the present invention, the connecting portion 371 is a rigid circuit board, and the bending portion 372 is a flexible circuit board. During the packaging of the periscope camera module, first, the circuit board 31 and the connecting portion 371 are side by side, so as to facilitate molding the back reinforcement portion 34 on the back of the circuit board 31 and to facilitate mounting the photosensitive chip 32 on the circuit board 31. Secondly, after bending the bending portion 372, the connecting portion 371 can be wrapped around the back of the circuit board 31 and be stacked on the circuit board 31 to reduce the width direction of the periscope camera module. It can be understood that since the connecting portion 371 is a rigid circuit board, it is convenient to fix the connecting portion 371 and reduce the risk of warping of the connecting portion 371.

[0138] In addition, the lead-out portion 373 of the connecting circuit board 37 can be bent again to facilitate connection between the lead-out portion 373 and the mobile terminal. The specific structure of the lead-out portion 373 of the connecting circuit board 37 is not limited in the periscope camera module of the present invention. For example, the lead-out portion 373 can be composed of a flexible circuit board or a soft-hard combination circuit board, and a connector is provided on the lead-out portion 373 to connect to the mobile terminal through the connector.

[0139] Continuing to refer to Figures 2A to 14, the height dimension of the connecting portion 371 of the connecting circuit board 37 is smaller than the height dimension of the circuit board 31, and the connecting portion 371 is biased toward one of the long sides 312 of the board of the circuit board 31 where the board pad 313 is not provided. When the lead-out portion 373 extends outward from the side of the connecting portion 371 away from the light incident side 100 of the periscope camera module and is bent, it will not occupy additional height-direction space of the periscope camera module, which is conducive to reducing the height dimension of the periscope camera module.

[0140] 6 and 7 , the photosensitive component 30 further includes a substrate 38, which is fixed to the back mounting surface 342 of the back reinforcement portion 34, and a gap 301 is defined between the substrate 38 and the back surface of the photosensitive chip 32. In this manner, on the one hand, the substrate 38 can enhance the structural strength of the photosensitive component 30, and on the other hand, the substrate 38 can dissipate heat for the photosensitive chip 32. In some specific examples of the present invention, the substrate 38 can be a metal plate such as an aluminum plate, which can be fixed to the back mounting surface 342 of the back reinforcement portion 34 by, but not limited to, gluing.

[0141] Preferably, the gap 301 between the substrate 38 and the back of the photosensitive chip 32 of the photosensitive component 30 can be filled with thermal conductive adhesive 302, so that the heat generated by the photosensitive chip 32 during operation can be quickly transferred to the substrate 38 by the thermal conductive adhesive 302, and the heat can be dissipated outwards by the substrate 38.

[0142] In addition, the connecting portion 371 of the connecting circuit board 37 can be fixed to the substrate 38 in an overlapping manner. For example, the connecting portion 371 can be fixed to the substrate 38 by gluing, so that the connecting portion 371 is overlapped on the back of the circuit board 38. Preferably, the substrate 38 has at least one positioning post 381, and the connecting portion 371 of the connecting circuit board 37 has at least one positioning through-hole 3711. When the connecting portion 371 is overlapped with the substrate 38, the positioning post 381 of the substrate 38 extends into and is positioned in the positioning through-hole 3711 of the connecting portion 371, thereby positioning the connecting portion 371 and the substrate 38.

[0143] Preferably, an arc column 382 is provided at one end of the bending portion 372 of the substrate 38 adjacent to the connecting circuit board 37, wherein when the bending portion 372 is bent to form, the arc column 382 of the substrate 38 is used to guide the bending shape of the bending portion 372 to avoid the bending portion 372 from forming a right-angle bending line and improve the reliability of the bending portion 372, wherein after the bending portion 372 is bent to form, the bending portion 372 surrounds the arc column 382 of the substrate 38, and the arc column 382 of the substrate 38 is used to support the bending portion 372 to avoid the bending portion 372 from forming a right-angle bending line when subjected to force and improve the reliability of the bending portion 372.

[0144] 8A to 14 show the packaging process of the periscope camera module of the present invention, which is specifically as follows.

[0145] 8A and 8B , the circuit board 31 and the connecting portion 371 are positioned side by side, with one short side 312 of the circuit board 31 and one side of the connecting portion 371 connected via a flexible board 303. One of the two long sides 311 of the circuit board 31 has a narrower width and is located near the top in FIG8A and 8B , while the other long side 311 has a wider width and is located near the bottom in FIG8A and 8B . Three rows of pads 313 are provided on the back of the circuit board 31, adjacent to the opening 314 of the circuit board 31. Two of the three rows of pads 313 are located on the two short sides 312 of the circuit board 31, while the other row of pads 313 is located on the wider long side 311 of the circuit board 31.

[0146] 9A and 9B , the front side reinforcement portion 33 is formed on the front side of the circuit board 31, and the front side reinforcement portion 33 surrounds the opening 314 of the circuit board 31 so that the opening 314 of the circuit board 31 is connected to the light-through hole 331 of the front side reinforcement portion 33, wherein the side of the front side reinforcement portion 34 located near the top in FIG9A and FIG9B has a narrower width dimension, and the side of the front side reinforcement portion 33 located near the bottom in FIG9A and FIG9B has a wider width dimension. The back side of the circuit board 31 is formed with a back side reinforcement portion 34. The back side reinforcement portion 34 surrounds the opening 314 of the circuit board 31 so that the opening 314 of the circuit board 31 is connected to the mounting channel 341 of the back side reinforcement portion 34. The side of the back side reinforcement portion 34 located near the top in Figures 9A and 9B has a wider width dimension, and the side of the back side reinforcement portion 34 located near the bottom in Figures 9A and 9B has a narrower width dimension. In this way, on the one hand, the back side reinforcement portion 34 exposes the board pad 313 of the circuit board 31 to the mounting channel 341 of the back side reinforcement portion 34. On the other hand, when the side of the front side reinforcement portion 33 located near the top in Figures 9A and 9B has a narrower width dimension, the back side reinforcement portion 34 can reinforce the upper long side 311 of the board 31, thereby preventing the circuit board 31 from deforming or breaking.

[0147] 10A and 10B , the photosensitive chip 32 is provided with chip pads 325 only on the lower one of the two chip long sides 323 and on both chip short sides 324. The photosensitive chip 32 is mounted on the back side of the circuit board 31 via the mounting channel 341 of the back side reinforcement 34, and the chip pads 325 of the photosensitive chip 32 are directly soldered to the board pads 313 of the circuit board 31. It is understood that after the photosensitive chip 32 is mounted on the back side of the circuit board 31, on the one hand, the opening 314 of the circuit board 31 corresponds to the photosensitive area 321 of the photosensitive chip 32, and on the other hand, the back side reinforcement 34 surrounds the photosensitive chip 32 to protect the photosensitive chip 32.

[0148] The photosensitive chip 32 and the circuit board 31 can be soldered by means of thermocompression bonding. Specifically, a first solder is provided on the plate pad 313 of the circuit board 31, and a second solder is provided on the chip pad 325 of the photosensitive chip 32. The first solder and the second solder are bonded by thermocompression bonding to solder the chip pads 325 of the photosensitive chip 32 and the plate pads 313 of the circuit board 31, thereby achieving the mounting of the photosensitive chip 32 and the circuit board 31. Preferably, a non-conductive glue is further provided at the bonding position of the circuit board 31 and the photosensitive chip 32, so as to increase the connection strength between the circuit board 31 and the photosensitive chip 32 while protecting the solder. In some embodiments, the first solder and the second solder may be gold materials. In other embodiments, the first solder may be a tin material, and the second material may be a gold material.

[0149] It is worth noting that the timing of applying the first solder to the sheet pads 313 of the circuit board 31 can be selected as needed. For example, in some embodiments, applying the first solder to the sheet pads 313 of the circuit board 31 can occur before forming the back side reinforcement 34 on the back side of the circuit board 31. That is, after forming the front side reinforcement 33 on the front side of the circuit board 31, the first solder is first applied to the sheet pads 313 of the circuit board 31, for example, by using a reflow soldering machine. Then, the back side reinforcement 34 is formed on the back side of the circuit board 31, wherein the back side reinforcement 34 avoids the first solder applied to the sheet pads 313 of the circuit board 31. Preferably, before forming the back side reinforcement 34 on the back side of the circuit board 31, the circuit board 31, the front side molding 33, and the first solder applied to the sheet pads 313 of the circuit board 31 can be cleaned to reduce contamination.

[0150] It is worth mentioning that in some embodiments of the present invention, the opening 314 of the circuit board 31 is preset, that is, the opening 314 is preset on the circuit board 31 before the front reinforcement portion 33 and the back reinforcement portion 34 are formed on the front and back of the circuit board 31. In other embodiments of the present invention, the opening 314 of the circuit board 31 is formed after the front reinforcement portion 33 and the back reinforcement portion 34 are formed on the front and back of the circuit board 31. That is, first, the front reinforcement portion 33 and the back reinforcement portion 34 are formed on the front and back of the circuit board 31, and then the opening 314 of the circuit board 31 is formed by cutting the portion of the circuit board 31 exposed to the light-through hole 331 of the front reinforcement portion 33 and the mounting channel 341 of the back reinforcement portion 34.

[0151] It is worth mentioning that after the photosensitive chip 32 is mounted on the circuit board 31 , a side encapsulation is provided between the photosensitive chip 32 and the back reinforcement portion 34 to protect the photosensitive chip 32 .

[0152] 11A and 11B , the filter element 36 can be mounted on the front mounting surface 332 of the front reinforcing portion 33 by glue.

[0153] Referring to Figures 12A and 12B, the substrate 38 is mounted on the back mounting surface 342 of the back reinforcement portion 34, wherein the gap 301 between the substrate 38 and the photosensitive chip 32 can be provided with the thermal conductive adhesive 302 to improve the heat dissipation capability of the photosensitive component 30.

[0154] 13A and 13B , the flexible sheet 303 is allowed to bend around the arc-shaped column 382 of the substrate 38 to form the bending portion 372 . After bending, the connecting portion 371 can be superimposed on the substrate 38 , and the positioning column 381 of the substrate 38 extends into and is positioned in the positioning through-hole 3711 of the connecting portion 381 .

[0155] Referring to Figure 14, after the light deflection element 10, the optical lens 20, the base 40 and the cover body 50 are formed into a lens assembly, the end of the base 40 provided with the base through-hole 41 is mounted on the front mounting surface 332 of the front reinforcement portion 33 of the photosensitive component 30 to obtain the periscope camera module.

[0156] Figures 15A to 17 show a periscope camera module according to another first embodiment of the present invention. Different from the periscope camera module shown in Figures 2A to 14, in the periscope camera module shown in Figures 15A to 17, the photosensitive component 30 has a cutting side 304, and the cutting side 304 of the photosensitive component 30 is located at the light incident side 100 of the periscope camera module. In this way, the height dimension of the periscope camera module can be further reduced.

[0157] Specifically, referring to Figures 15A and 15B, after the front reinforcement portion 33 is formed on the front of the circuit board 31 and the back reinforcement portion 34 is formed on the back of the circuit board 31, the circuit board 31, the front reinforcement portion 33 and the back reinforcement portion 34 are cut on the side close to the top in Figures 15A and 15B so that the width dimension of this side of the circuit board 31, the width dimension of this side of the front reinforcement portion 33 and the width dimension of this side of the back reinforcement portion 34 are further narrowed, so that after the periscope camera module is packaged, the photosensitive area 321 of the photosensitive chip 32 can be further biased toward the light incident side 100 of the periscope camera module to reduce the height dimension of the periscope camera module.

[0158] It is understood that the circuit board 31 is not provided with the plate soldering pads 313 and is not mounted with the electronic components 35 on the side located near the top in Figures 15A and 15B. Therefore, when the circuit board 31, the front reinforcement portion 33, and the back reinforcement portion 34 are cut on the side located near the top in Figures 15A and 15B, the circuit of the circuit board 31 and the electronic components 35 will not be damaged. In addition, because the front reinforcement portion 33 and the back reinforcement portion 34 are formed on the front and back sides of the circuit board 31 located near the top in Figures 15A and 15B, respectively, when the circuit board 31, the front reinforcement portion 33, and the back reinforcement portion 34 are cut on the side located near the top in Figures 15A and 15B, the circuit board 31 will not experience edge chipping, thereby improving the reliability of the periscope camera module.

[0159] With reference to Figures 18 to 22 of the accompanying drawings in the specification of the present invention, a periscope camera module according to a second embodiment of the present invention will be disclosed and explained in the following description, wherein the periscope camera module includes an optical path reflection component 10, a lens component 20 and a photosensitive component 30, wherein the optical path reflection component 10 is arranged on the light incident side of the lens component 20, and the photosensitive component 30 is arranged on the light exit side of the lens component 20, wherein the incident light is deflected 90° by the optical path reflection component 10 and reaches the photosensitive component 30 after passing through the lens component 20, and the photosensitive component 30 performs photoelectric conversion to form an image.

[0160] In another example of the periscope camera module of the present invention, the light path reflection component 10 and the photosensitive component 30 are sequentially arranged on the light-emitting side of the lens component 20, that is, the light path reflection component 10 is located between the lens component 20 and the photosensitive component 30, wherein the incident light passes through the lens component 20 and is deflected 90° by the light path reflection component 10 before reaching the photosensitive component 30, and the photosensitive component 30 performs photoelectric conversion into imaging.

[0161] In another example of the periscope camera module of the present invention, the periscope camera module includes a plurality of the lens assemblies 20, and the light path reflection assembly 10 is located between two adjacent lens assemblies 20, wherein the incident light is deflected 90° by the light path reflection assembly 10 after passing through at least one of the lens assemblies 20, and the deflected incident light reaches the photosensitive assembly 30 after further passing through at least one of the lens assemblies 20, and the photosensitive assembly 30 performs photoelectric conversion into imaging.

[0162] Referring to Figure 18, the periscope camera module includes a shell 40, which has a receiving cavity 41 and a light inlet 42 and a light outlet 43 respectively connected to the receiving cavity 41, wherein the light path reflection component 10 is received in the receiving cavity 41 of the shell 40, and the incident surface 11 of the light path reflection component 10 corresponds to the light inlet 42 of the shell 40, so as to allow the incident light entering from the light inlet 42 of the shell 40 to be incident on the incident surface 11 of the light path reflection component 10, wherein the lens assembly 20 is received in the receiving cavity 41 of the shell 40, wherein the photosensitive component 30 is arranged at the light outlet 43 of the shell 40, so as to allow the light emitted from the light outlet 43 of the shell 40 to reach the photosensitive component 30, and the photosensitive component 30 performs photoelectric conversion to form an image.

[0163] With reference to FIG18 , in this specific example of the periscope camera module of the present invention, the lens assembly 20 is movable so that the periscope camera module has a focus and / or anti-shake function. For example, the lens assembly 20 is configured to be movable along the length direction so that the camera module has a focus function, and / or the lens assembly 20 is configured to be movable along the height direction and the width direction so that the camera module has an anti-shake function, wherein the direction in which light enters the optical path reflection assembly 10 is the height direction, the direction in which light exits the optical path reflection assembly 10 is the length direction, the height direction and the length direction are perpendicular, and the direction perpendicular to the height direction and the length direction is the width direction.

[0164] It is worth mentioning that the specific structure for driving the lens assembly 20 to move along the length direction and the specific structure for driving the lens assembly 20 to move along the height direction and the width direction are not limited in the periscope camera module of the present invention.

[0165] In one embodiment of the periscope camera module of the present invention, the optical path reflection component 10 is configured to be rotatable around the central axis of the incident surface 11 of the optical path reflection component 10 and is configured to be rotatable around the central axis of the exit surface 12 of the optical path reflection component 10, so that the periscope camera module has an optical image stabilization function. It is worth mentioning that the specific structure of driving the optical path reflection component 10 to rotate around the central axis of the incident surface 11 of the optical path reflection component 10 and around the central axis of the exit surface 12 is not limited in the periscope camera module of the present invention.

[0166] Continuing with reference to Figures 18 to 22, the photosensitive component 30 includes a chip circuit board 31, a photosensitive chip 32, and a connecting circuit board 33. The chip circuit board 31 has an upper plate surface 311 and a lower plate surface 312 opposite to each other, and a plate through-hole 313 that passes through the upper plate surface 311 and the lower plate surface 312. The photosensitive chip 32 has an upper chip surface 321 and a lower chip surface 322 opposite to each other, the upper chip surface 321 having a photosensitive area 3211 and a non-photosensitive area 3212 surrounding the photosensitive area 3211, wherein the non-photosensitive area 3212 of the photosensitive chip 32 is mounted on the lower plate surface 312 of the chip circuit board 31, and the photosensitive area 3211 of the photosensitive chip 32 corresponds to the plate through-hole 313 of the chip circuit board 31. The connecting circuit board 33 is mounted on the lower surface 312 of the chip circuit board 31, wherein the connecting circuit board 33 conducts a pair of circuits of the chip circuit board 31 located on one side of the plate through-hole 313. For example, a pair of circuits of the chip circuit board 31 located on the opposite side of the plate through-hole 313 and conducting the photosensitive chip 32 can be conducted by the connecting circuit board 33. In this way, in the height direction of the periscope camera module, the area above and / or below the plate through-hole 313 of the chip circuit board 31 can be arranged with fewer circuits, or even the circuit arrangement can be cancelled, so as to facilitate reducing the width dimension of the area above and / or below the plate through-hole 313 of the chip circuit board 31, thereby reducing the height dimension of the periscope camera module.

[0167] For example, in this specific example of the periscope camera module of the present invention, referring to Figure 22, the four sides of the chip circuit board 31 used to define the plate through-hole 313 are defined as a plate first side 314, a plate second side 315, a plate third side 316 and a plate fourth side 317 in a clockwise direction, wherein the plate first side 314 and the plate third side 316 correspond to each other in the width direction of the periscope camera module, and the plate second side 315 and the plate fourth side 317 correspond to each other in the height direction of the periscope camera module. At least one first circuit 3141 located on the first side 314 of the plate and at least one second circuit 3161 located on the third side 316 of the plate are connected through the connecting circuit board 33. In this way, the second side 315 of the plate does not need to be arranged with a circuit for conducting the first circuit 3141 and the second circuit 3161, so that the width dimension of the second side 315 of the plate can be reduced, which is conducive to reducing the height dimension of the periscope camera module. The fourth side 317 of the plate also does not need to be arranged with a circuit for conducting the first circuit 3141 and the second circuit 3161, so that the width dimension of the fourth side 317 of the plate can be reduced, which is conducive to reducing the height dimension of the periscope camera module.

[0168] In this specific example of the periscope camera module of the present invention shown in Figures 18 to 22, at least one first circuit 3141 located on the first side 314 of the plate and at least one third circuit 3151 located on the second side 315 of the plate can also be conductively connected through the connecting circuit board 33. For example, the third circuit 3151 away from the first side 314 of the plate can be conductively connected to the first circuit 3141 through the connecting circuit board 33. In this way, the chip circuit board 31 can be arranged with a smaller number of the third circuits 3151 on the second side 315 of the plate to reduce the width dimension of the second side 315 of the plate, which is conducive to reducing the height dimension of the periscope camera module.

[0169] Referring to Figures 18, 19, and 22, the photosensitive assembly 30 includes a lead-out circuit board 34 having a connecting end 341 and an assembly end 342 opposite each other, and a connector 343 located at the assembly end 342. The connecting end 341 of the lead-out circuit board 34 is connected to the first side 314 of the chip circuit board 31, and the connector 343 of the lead-out circuit board 34 is capable of being connected to a portable electronic device. In other words, the connection between the periscope camera module and the portable electronic device is achieved by the lead-out circuit board 34. Therefore, the third circuit 3151 located on the second side 315 of the board and the second circuit 31612 located on the third side 316 of the board must both bypass the board through-hole 313 of the chip circuit board 31 and extend to the first side 314 of the board. After further extending to the lead-out circuit board 34, they are connected to the portable electronic device through the lead-out circuit board 34.

[0170] In the periscope camera module of the present invention, the connecting circuit board 33 is mounted on the lower surface 312 of the chip circuit board 31, and the connecting circuit board 33 conductively connects at least one first circuit 3141 and at least one second circuit 3161 and / or conductively connects at least one first circuit 3141 and at least one third circuit 3151. In this way, a smaller number of the third circuits 3151 can be arranged on the second side 315 of the plate, and the fourth side 317 of the plate can no longer be arranged with a circuit for conducting the first circuit 3141 and the second circuit 3161, so that the width dimension of the second side 315 of the plate and the width dimension of the fourth side 317 of the plate can be reduced, which is conducive to reducing the height dimension of the periscope camera module.

[0171] Specifically, in this specific example of the periscope camera module of the present invention shown in Figures 18 to 22, the chip circuit board 31 has three columns of inner solder pads 318 and three columns of outer solder pads 319. These inner solder pads 318 and outer solder pads 319 are respectively located on the lower surface 312 of the board, and the first side 314, the second side 315, and the third side 316 of the board are respectively provided with a column of the inner solder pads 318 and a column of the outer solder pads 319. The photosensitive chip 32 has three columns of chip solder pads 323. Three of the four sides of the photosensitive area 3211 of the photosensitive chip 32 are respectively provided with a column of chip solder pads 323. The photosensitive chip 32 is mounted on the lower surface 312 of the chip circuit board 31 in a manner such that each column of chip solder pads 323 and each column of the inner solder pads 318 are respectively soldered. The connecting circuit board 33 has three columns of top side pads 331 , wherein the connecting circuit board 33 is mounted on the lower surface of the chip circuit board 31 in a manner that each column of the top side pads 331 and each column of the outer pads 319 are respectively welded.

[0172] That is to say, in the periscope camera module of the present invention, first, the photosensitive chip 32 is flip-chip soldered to the chip circuit board 31, and secondly, the connecting circuit board 33 is soldered to the lower surface 312 of the plate of the chip circuit board 31, so that the connecting circuit board 33 can conduct the circuit of the chip circuit board 31 on the opposite side of the plate through-hole 313 and the photosensitive chip 32 on the back side of the photosensitive chip 32. For example, the connecting circuit board 33 can conduct the first circuit 3141 located on the first side 314 of the plate and the second circuit 3161 located on the third side 316 of the plate on the back side of the photosensitive chip 32, so that the first circuit 3141 and the second circuit 3161 form a complete circuit. The circuit board 33 can also conduct the first circuit 3141 and the third circuit 3151 on the back side of the photosensitive chip 32 so that the first circuit 3141 and the third circuit 3151 form a complete circuit. In this way, it is possible to avoid the increase in the lateral (height and width) dimensions of the chip circuit board 31 or the increase in the thickness (length) dimension of the chip circuit board 31 caused by all the circuits leading out from the photosensitive chip 32 extending on the chip circuit board 31, thereby avoiding the problem of the height dimension of the periscope camera module increasing due to the increase in the lateral dimension of the chip circuit board 31 and avoiding the risk of bending of the chip circuit board 31 after the plate perforation 313 is set due to the increase in the thickness dimension of the circuit board 31.

[0173] It is worth mentioning that in a specific example of the periscope camera module of the present invention, the connecting circuit board 33 is only used to conduct the first circuit 3141 and the second circuit 3161 of the chip circuit board 31 located at the plate through-hole 313. That is, the connecting circuit board 33 is only used to conduct the circuits of the chip circuit board 31 located on opposite sides of the plate through-hole 313. Therefore, the number of the top-side pads 331 of the connecting circuit board 33 is less than the number of the chip pads 323 of the photosensitive chip 32, and thus the number of the outer pads 319 of the chip circuit board 31 is less than the number of the inner pads 318. In a specific example of the periscope camera module of the present invention, the number of the top-side pads 331 of the connecting circuit board 33 is less than half the number of the chip pads 323 of the photosensitive chip 32. More specifically, when the model of the photosensitive chip 32 is different, the number of pads of the photosensitive chip 32 and the corresponding number of circuits that need to be derived from the photosensitive component 30 are also different. However, considering that the connecting circuit board 33 only needs to conduct the circuits of the chip circuit board 31 located on opposite sides of the plate through-hole 313, and the size of the connecting circuit board 33 is also limited by the size of the photosensitive component 30, the number of the top-side pads 331 of the connecting circuit board 33 is set between 28 and 60. Furthermore, considering that an increase in the number of the top-side pads 331 of the connecting circuit board 33 results in an increase in the size of the connecting circuit board 33, the number of the top-side pads 331 of the connecting circuit board 33 is set between 28 and 60.

[0174] In addition, in a specific example of the periscope camera module of the present invention, the main purpose of providing the connecting circuit board 33 in the periscope camera module is to connect at least one circuit on the side of the chip circuit board 31 that is connected to the lead-out circuit board 34 with at least one circuit on the side of the chip circuit board 31 that is away from the lead-out circuit board 34, and then lead out through the lead-out circuit board 34. For example, the main purpose of the connecting circuit board 33 is to connect the first circuit 3141 of the chip circuit board 31 located on the first side 314 of the board with the second circuit 3161 located on the third side 316 of the board. Because one circuit in the connecting circuit board 33 needs to connect to two top-side pads 331, the number of circuits in the connecting circuit board 33 is greater than or equal to one-half the number of circuits in the lead-out circuit board 34. Each pin in the connector 343 of the lead-out circuit board 34 is electrically connected to the circuits in the connecting circuit board 33. In a specific example, the number of top-side pads 331 of the connecting circuit board 33 is greater than the number of pins in the connector 343.

[0175] It is worth mentioning that as the pixel of the photosensitive chip 32 increases, in order to meet the demand for data transmission speed, the photosensitive chip 32 has at least one MIPI interface (Mobile Industry Processor Interface). Accordingly, the chip circuit board 31 has at least one MIPI circuit for conducting the MIPI interface of the photosensitive chip 32, and the MIPI circuit of the chip circuit board 31 extends to the export circuit board 34. Since the MIPI circuit of the chip circuit board 31 is used to transmit high-speed signals, it is required that the MIPI circuit reduce layer changes in the process of extending from the MIPI interface of the photosensitive chip 32 to the export circuit board 34 to avoid impedance mutation caused by layer changes and the problem of affecting high-speed signal transmission. Therefore, the MIPI circuit of the chip circuit board 31 is not connected to the outer pad 319, that is, the MIPI circuit of the chip circuit board 31 is not conducted through the connecting circuit board 33, but is all arranged on the chip circuit board 31 and directly exported from the chip circuit board 31 to the export circuit board 34, avoiding the problem of layer change of the MIPI circuit. In a specific example of the periscope camera module of the present invention, the MIPI circuit of the chip circuit board 31 is arranged on the first side 314 of the plate to avoid the complexity of the MIPI circuit routing path and layer change problems. In another specific example of the periscope camera module of the present invention, the MIPI circuit of the chip circuit board 31 can also be arranged on the end of the second side 315 of the plate close to the first side 314 of the plate.

[0176] More specifically, the MIPI interface of the photosensitive chip 32 includes a D-PHY interface and a C-PHY interface. The D-PHY interface requires the use of two parallel circuits, and the differential impedance value of the two circuits is 100Ω±10%. The C-PHY interface only requires the use of a single circuit, and its single-ended impedance value is 50Ω±10%. It should be understood that the range of specific impedance values ​​is adjusted for different products, but multiple layer changes during the routing of the MIPI circuit of the chip circuit board 31 will cause impedance mutations, and there is a probability that the differential impedance values ​​of the two lines of the D-PHY interface will mutate, as well as the single-ended impedance value of the C-PHY interface will mutate, affecting the signal transmission of the photosensitive chip 32. Therefore, in the periscope camera module of the present invention, the MIPI circuit of the chip circuit board 31 is arranged on the side of the chip circuit board 31 for connecting to the export circuit board 34, so that the complex routing path and layer change problems of the MIPI circuit can be avoided, so that the MIPI circuit of the chip circuit board 31 is not conducted through the connecting circuit board 33, but is all arranged on the chip circuit board 31 and directly exported from the chip circuit board 31 to the export circuit board 34.

[0177] In addition, since the size of the photosensitive chip 32 is small and more interfaces need to be configured, the size of the chip pads 323 of the photosensitive chip 32 is small and needs to be densely arranged. Since the size of the chip circuit board 31 is large and the number of the top side pads 331 of the connecting circuit board 33 is less than the number of the chip pads 323 of the photosensitive chip 32, the setting space of the outer pads 319 of the chip circuit board 31 and the setting space of the top side pads 331 of the connecting circuit board 33 are both larger than the setting space of the chip pads 323 of the photosensitive chip 32. In a specific example of the periscope camera module of the present invention, the size of the top side pad 331 of the connecting circuit board 33 is larger than the size of the chip pad 323 of the photosensitive chip 32, and the gap between adjacent top side pads 331 of the connecting circuit board 33 is larger than the gap between adjacent chip pads 323 of the photosensitive chip 32. Accordingly, relative to the process difficulty of welding the photosensitive chip 32 and the chip circuit board 31, the process difficulty of welding the connecting circuit board 33 and the chip circuit board 31 can be reduced. For example, the process of welding the connecting circuit board 33 and the chip circuit board 31 can be implemented by a hot pressing welding (HotBar) process or an anisotropic conductive film (ACF) process, wherein the principle of the hot pressing welding process is to print solder paste on the outer pad 319 of the chip circuit board 31, melt the solder paste after passing through a reflow oven and pre-solder it on the chip circuit board 31, and then place the object to be soldered (i.e., the connecting circuit board 33) on the chip circuit board 31 on which the solder paste has been printed, and finally use the heat of the hot pressing head to melt the solder and connect the chip circuit board 31 and the connecting circuit board 33.

[0178] In one example of the periscope camera module of the present invention, the chip circuit board 31 is a rigid circuit board, and the connecting circuit board 33 is a flexible circuit board. This can reduce the length of the periscope camera module. For example, in a specific example of the periscope camera module of the present invention, the length of the connecting circuit board 33 (i.e., the thickness of the connecting circuit board 33) can be less than or equal to 0.1 mm.

[0179] In one example of the periscope camera module of the present invention, the number of wiring layers of the connecting circuit board 33 is less than the number of wiring layers of the chip circuit board 31, and it is sufficient as long as the connecting circuit board 33 satisfies the requirements of exporting at least one circuit on the side of the chip circuit board 31 used to connect to the export circuit board 34 and exporting at least one circuit on the side of the chip circuit board 31 away from the export circuit board 34. For example, in a specific example of the periscope camera module of the present invention, the number of wiring layers of the connecting circuit board 33 is two layers, and the number of wiring layers of the chip circuit board 31 is four or six layers. It is worth mentioning that the lines of the connecting circuit board 33 are mainly parallel lines, or one layer of lines of the connecting circuit board 33 is a grid line used as a ground line, and the remaining lines are parallel lines.

[0180] Accordingly, in the present invention, the number of wiring layers of the connecting circuit board 33 is less than the number of wiring layers of the chip circuit board 31, thereby avoiding unnecessary increase in the thickness of the connecting circuit board 33, thereby avoiding a significant increase in the thickness of the photosensitive component 30.

[0181] With reference to Figures 18 to 21 , there is a gap 50 between the chip lower surface 322 of the photosensitive chip 32 and the connecting circuit board 33. The thickness of the gap 50 is between 0.01 mm and 0.06 mm, that is, the chip lower surface 323 of the photosensitive chip 32 and the connecting circuit board 33 are not in direct contact. In a specific example of the periscope camera module of the present invention, the thickness of the gap 100 between the chip lower surface 322 of the photosensitive chip 32 and the connecting circuit board 33 is less than 0.05 mm. In this way, when the connecting circuit board 33 is mounted on the plate lower surface 312 of the chip circuit board 31, the photosensitive chip 32 is avoided from being affected.

[0182] In an example of the periscope camera module of the present invention, in order to reduce the thickness of the photosensitive component 30, the lower surface 312 of the chip circuit board 31 has an inner surface 3121 and an outer surface 3122 surrounding the inner surface 3121, and the inner surface 3121 and the outer surface 3122 have a height difference, so that the plate through-hole 313 of the chip circuit board 31 forms a stepped plate opening 3111 on the lower surface 312 of the plate, and the photosensitive chip 32 is mounted on the inner surface 3121 of the chip circuit board 31 and the photosensitive area 3211 of the photosensitive chip 32 faces the plate through-hole 313 of the chip circuit board 31, so as to allow incident light to reach the photosensitive area 3211 of the photosensitive chip 32 after passing through the plate through-hole 313, and the connecting circuit board 33 is mounted on the outer surface 3122 of the chip circuit board 31. In order to form the stepped plate opening 3111, the chip circuit board 31 includes a frame-shaped circuit board body 3112 and a conductive portion 3113 extending inward from the circuit board body 3112. The photosensitive chip 32 is inverted and electrically connected to the conductive portion 3113 of the chip circuit board 31, and the connection end 341 of the lead-out circuit board 34 is connected to the circuit board body 3112.

[0183] In a specific example of the periscope camera module of the present invention, the height difference between the inner surface 3121 and the outer surface 3122 of the chip circuit board 31 is greater than the thickness of the photosensitive chip 32, thereby preventing the photosensitive chip 32 from protruding from the lower surface 312 of the chip circuit board 31. That is, the lower surface 322 of the photosensitive chip 32 is lower than the outer surface 3122 of the chip circuit board 31. In this way, the connecting circuit board 33 can be smoothly attached to the outer surface 3122 of the chip circuit board 31, and the gap 50 is formed between the lower surface 322 of the photosensitive chip 32 and the connecting circuit board 33. This reduces the risk of the photosensitive chip 32 being compressed or even crushed during the process of hot-pressing the connecting circuit board 33 to the chip circuit board 31. In other words, the connecting circuit board 33 is located on the back of the photosensitive chip 32.

[0184] 18 to 21 , the photosensitive assembly 30 includes a heat conducting portion 35 located in the gap 50 for dissipating heat generated by the photosensitive chip 32 to reduce the operating temperature of the photosensitive chip 32. In a specific example of the periscope camera module of the present invention, the heat conducting portion 35 is formed by thermally conductive silicone grease filled between the chip bottom surface 322 of the photosensitive chip 32 and the connecting circuit board 33.

[0185] 18 to 21 , the photosensitive assembly 30 includes a reinforcement unit 36, which includes a front reinforcement portion 361 having a light window 3611. The front reinforcement portion 361 is disposed on the upper surface 311 of the chip circuit board 31, and the through-hole 313 of the chip circuit board 31 is connected to the light window 3611 of the front reinforcement portion 361, allowing incident light to pass through the light window 3611 of the front reinforcement portion 361 and the through-hole 313 of the chip circuit board 31 to reach the photosensitive area 3211 of the photosensitive chip 32. The front reinforcement portion 361 can reinforce the strength of the chip circuit board 31 to improve the flatness of the chip circuit board 31.

[0186] In a specific example of the periscope camera module of the present invention, the front reinforcement portion 361 is integrally formed on the upper surface 311 of the plate of the chip circuit board 31. For example, based on a molding process, the front reinforcement portion 361 can be integrally formed on the upper surface 311 of the plate of the chip circuit board 31. In this way, on the one hand, there is no need to apply glue between the front reinforcement portion 361 and the chip circuit board 31 to reduce the process steps and reduce the thickness of the photosensitive component 30. On the other hand, with the aid of the mold, the top surface of the front reinforcement portion 361 has a higher flatness.

[0187] The photosensitive component 30 further includes at least one electronic component 37, which can be a passive electronic component such as a capacitor, a resistor or an inductor, or an active electronic component such as a diode or a memory chip. The electronic component 37 is mounted on the upper surface 311 of the chip circuit board 31. In the process of integrally forming the front reinforcement part 361 on the upper surface 311 of the chip circuit board 31, the front reinforcement part 361 can embed the electronic component 37. In this way, on the one hand, there is no need to reserve a safety distance between the front reinforcement part 361 and the electronic component 37, which is conducive to reducing the overall size of the photosensitive component 30. On the other hand, the front reinforcement part 361 can isolate the electronic component 37 and the photosensitive chip 32 to prevent contaminants such as debris from falling off from the electronic component 37 and contaminating the photosensitive chip 32.

[0188] 18 to 21 , the photosensitive assembly 30 includes a filter element 38, which is mounted on the top surface of the front reinforcement portion 361 and seals the light window 3611. Thus, incident light must enter the light window 3611 of the front reinforcement portion 361 after passing through the filter element 38, so that the filter element 38 filters a specific type of light in the incident light. For example, in a specific embodiment of the periscope camera module of the present invention, the filter element 38 is an infrared cutoff filter, which is used to filter infrared light in the incident light.

[0189] The reinforcement unit 36 ​​also includes a back reinforcement portion 362, which has a mounting channel 3621. The back reinforcement portion 362 is provided on the lower surface 312 of the chip circuit board 31, and the outer pads 319 of the chip circuit board 31 are exposed to the mounting channel 3621 of the back reinforcement portion 362 for mounting the connecting circuit board 33. The back reinforcement portion 362 can reinforce the strength of the chip circuit board 31 to improve the flatness of the chip circuit board 31. It is understood that the connecting circuit board 33 is accommodated in the mounting channel 3621 of the back reinforcement portion 362. In a specific example of the periscope camera module of the present invention, the connecting circuit board 33 and the back reinforcement portion 362 have a minimum spacing of 0.15 mm.

[0190] In a specific example of the periscope camera module of the present invention, the back reinforcement portion 362 is integrally formed on the lower surface 312 of the plate of the chip circuit board 31. For example, based on a molding process, the back reinforcement portion 362 can be integrally formed on the lower surface 312 of the plate of the chip circuit board 31. In this way, there is no need to apply glue between the back reinforcement portion 362 and the chip circuit board 31, so as to reduce the process steps and reduce the thickness of the photosensitive component 30.

[0191] 18 to 21 , the photosensitive component 30 includes a heat sink 39 , which may be a highly oriented pyrolytic graphite sheet, wherein the heat sink 39 is mounted on the back reinforcement portion 362 , and the heat sink 39 closes the mounting channel 3621 of the back reinforcement portion 362 to increase heat dissipation capacity.

[0192] 23A to 23H , the present invention further provides a method for manufacturing the photosensitive component 30, wherein the manufacturing method comprises the following steps:

[0193] (a) The front reinforcing portion 361 is disposed on the upper surface 311 of the chip circuit board 31, wherein the plate through-hole 313 of the chip circuit board 31 is connected to the light window 3611 of the front reinforcing portion 361. For example, in a specific embodiment of the manufacturing method of the present invention, first, the electronic component 37 is mounted on the plate upper surface 311 of the chip circuit board 31 (see FIG23A ). Then, the front reinforcing portion 361 is integrally formed on the plate upper surface 311 of the chip circuit board 31 using a molding process (see FIG23B ). During the process of integrally forming the front reinforcing portion 361 on the plate upper surface 311 of the chip circuit board 31, the front reinforcing portion 361 not only embeds the electronic component 37 but also forms the light window 3611 of the front reinforcing portion 361, and the light window 3611 is connected to the plate through-hole 313 of the chip circuit board 31.

[0194] (b) Providing a first solder on the inner pads 318 of the chip circuit board 31 . In a specific example of the manufacturing method of the present invention, a reflow device may be used to provide the first solder on the inner pads 318 of the chip circuit board 31 .

[0195] (c) The back side reinforcement portion 362 is disposed on the lower surface 312 of the chip circuit board 31, wherein the through-hole 313 of the chip circuit board 31 is connected to the mounting channel 3621 of the back side reinforcement portion 362. (See FIG23C .) For example, in one embodiment of the manufacturing method of the present invention, the back side reinforcement portion 362 is integrally formed on the lower surface 312 of the chip circuit board 31 using a molding process. During the integral molding of the back side reinforcement portion 362 on the lower surface 312 of the chip circuit board 31, the mounting channel 3621 of the back side reinforcement portion 362 is formed, and the mounting channel 3621 is connected to the through-hole 313 of the chip circuit board 31.

[0196] (d) The photosensitive chip 32 and the chip circuit board 31 are connected and electrically connected via the mounting channel 3621 of the back reinforcement portion 362 by means of thermal compression bonding, wherein the chip pad 323 of the photosensitive chip 32 is provided with a second solder. The first solder and the second solder are thermally compressed to achieve connection and electrical connection between the photosensitive chip 32 and the chip circuit board 31, as shown in FIG23D. In a specific example of the manufacturing method of the present invention, a non-conductive adhesive is further provided at the bonding position between the photosensitive chip 32 and the chip circuit board 31 to protect the solder and enhance the connection strength between the photosensitive chip 32 and the chip circuit board 31. In a specific example of the manufacturing method of the present invention, the photosensitive chip 32 is prevented from protruding from the lower surface 312 of the chip circuit board 31. The specific types of the first solder and the second solder are not limited in the manufacturing method of the present invention. For example, in one specific example, the first solder and the second solder can both be gold materials. In this way, the first solder and the second solder can be bonded by hot pressing to achieve conduction between the photosensitive chip 32 and the chip circuit board 31. In another specific example, the first solder is tin solder and the second solder is gold solder. In this way, the first solder and the second solder can be bonded by hot pressing to achieve conduction between the photosensitive chip 32 and the chip circuit board 31.

[0197] (e) The connecting circuit board 33 is mounted on the lower surface 312 of the chip circuit board 31 through the mounting channel 3621 of the back reinforcement portion 362, wherein the electrical connection between the top side pads 331 of the connecting circuit board 33 and the outer side pads 319 of the chip circuit board 31 can be achieved by a hot pressing (HotBar) process or an anisotropic conductive film (ACF) process, refer to Figure 23F. In a specific example of the manufacturing method of the present invention, before the connecting circuit board 33 is mounted on the lower surface 312 of the chip circuit board 31 through the mounting channel 3621 of the back reinforcement portion 362, thermal conductive silicone can be first provided on the chip lower surface 322 of the photosensitive chip 32 or the connecting circuit board 33, so that after the connecting circuit board 33 is mounted on the lower surface 312 of the chip circuit board 31, the thermal conductive silicone forms the heat conducting portion 35 between the chip lower surface 322 of the photosensitive chip 32 and the connecting circuit board 33, refer to Figure 23E.

[0198] (f) The filter element 38 is mounted on the top surface of the front reinforcing portion 361 , wherein the filter element 38 closes the light window 3611 of the front reinforcing portion 361 , as shown in FIG. 23H .

[0199] In a specific example of the manufacturing method of the present invention, before the front reinforcing portion 361 is disposed on the upper surface 311 of the chip circuit board 31, the chip circuit board 31 is pre-set with the plate through-hole 313. In a specific example of the manufacturing method of the present invention, after the front reinforcing portion 361 is disposed on the upper surface 311 of the chip circuit board 31 and the back reinforcing portion 362 is disposed on the lower surface 312 of the chip circuit board 31, the chip circuit board 31 is cut so that the chip circuit board 31 has the plate through-hole 313.

[0200] In an example of the manufacturing method of the present invention, the manufacturing method further includes a cleaning step, wherein the cleaning step can be performed before the front reinforcement portion 361 is set, that is, the chip circuit board 31 is cleaned first, and then the front reinforcement portion 361 is set on the upper surface 311 of the plate of the chip circuit board 31, wherein the cleaning step can also be performed before the back reinforcement portion 362 is set, that is, the chip circuit board 31 provided with the front reinforcement portion 361 is cleaned first, and then the back reinforcement portion 362 is set on the lower surface 312 of the plate of the chip circuit board 31. Through the cleaning step, the dirt on the upper surface 311 and the lower surface 312 of the plate of the chip circuit board 31 can be reduced, which is conducive to improving the yield of the photosensitive component 30.

[0201] In one example of the manufacturing method of the present invention, the manufacturing method further includes a step of encapsulating. Specifically, after the photosensitive chip 32 is mounted on the chip circuit board 31, encapsulation is provided on the side of the photosensitive chip 32 to protect the photosensitive chip 32. For example, in a specific example of the manufacturing method of the present invention, the side encapsulation can fill the gap between the side of the photosensitive chip 32 and the inner wall of the back reinforcement portion 362.

[0202] In an example of the manufacturing method of the present invention, the manufacturing method further includes the step of attaching the heat sink 39 to the back reinforcement portion 362 , and the heat sink 39 closes the mounting channel 3621 of the back reinforcement portion 362 .

[0203] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are only for illustrative purposes and are not intended to limit the present invention.

[0204] The purpose of the present invention has been completely and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be modified or altered in any way without departing from the principles.

Claims

1. A periscope camera module, characterized in that: include: Optical lens; A light redirecting element capable of redirecting incident light; as well as A photosensitive component includes a circuit board and a photosensitive chip connected to the circuit board, the photosensitive chip has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, the optical lens and the light deflection element are arranged in the photosensitive path of the photosensitive component, wherein the photosensitive area of ​​the photosensitive chip is biased toward the light incident side of the periscope camera module.

2. The periscope camera module according to claim 1, wherein the light deflecting element is a reflective prism having an incident surface, a reflective surface and an exit surface for deflecting incident light, wherein the incident surface of the reflective prism defines the light incident side of the periscope camera module.

3. The periscope camera module according to claim 1, wherein the light deflection element is a reflector having a reflective surface to allow the light deflection element to deflect incident light by reflection.

4. The periscope camera module according to claim 1, wherein the photosensitive component includes a front reinforcement portion having a light-through hole, wherein the front reinforcement portion is formed on the front side of the circuit board, and the light-through hole of the front reinforcement portion corresponds to the photosensitive area of ​​the photosensitive chip, wherein the width dimension of the front reinforcement portion on a side located on the light incident side of the periscope camera module is smaller than the width dimension of the front reinforcement portion on a side away from the light incident side of the periscope camera module.

5. The periscope camera module according to claim 4, wherein the photosensitive chip is arranged on the back side of the circuit board, and the circuit board has an opening corresponding to the photosensitive area of ​​the photosensitive chip, wherein the width dimension of the side of the circuit board located on the light incident side of the periscope camera module is smaller than the width dimension of the side of the circuit board away from the light incident side of the periscope camera module.

6. The periscope camera module according to claim 5, wherein the photosensitive component includes a back reinforcement portion having a mounting channel, the opening of the circuit board is connected to the mounting channel of the back reinforcement portion, wherein the photosensitive chip is mounted on the back side of the circuit board through the mounting channel of the back reinforcement portion, wherein the width dimension of the back reinforcement portion on a side located on the light incident side of the periscope camera module is greater than the width dimension of the back reinforcement portion on a side away from the light incident side of the periscope camera module.

7. The periscope camera module according to claim 4 further includes a base made of plastic and a cover made of metal, one end of the base has a base through-hole, one end of the cover has a cover through-hole, the cover is buckled on the side of the base, the periscope camera module forms a receiving cavity between the base and the cover, the base through-hole of the base and the cover through-hole of the cover are respectively connected to the receiving cavity, wherein the reflective prism and the optical lens are received in the receiving cavity, the base through-hole of the base corresponds to the optical lens, and the cover through-hole of the cover corresponds to the incident surface of the reflective prism, wherein the base is mounted on the front mounting surface of the front reinforcement portion of the photosensitive component.

8. The periscope camera module according to claim 6, wherein the photosensitive component includes a substrate, the substrate is mounted on the back mounting surface of the back reinforcement portion, and there is a gap between the substrate and the photosensitive chip.

9. The periscope camera module according to claim 8, wherein the gap between the substrate and the photosensitive chip is filled with thermal conductive adhesive.

10. The periscope camera module according to any one of claims 1 to 9, wherein the photosensitive component includes a connecting circuit board, and the connecting circuit board is connected to the short side of the circuit board.

11. The periscope camera module according to claim 8 or 9, wherein the photosensitive component includes a connecting circuit board, the connecting circuit board includes a connecting portion, a bending portion and a lead-out portion, the connecting portion is superimposed on the substrate, and the opposite ends of the bending portion are respectively connected to the short side of the plate of the circuit board and the side of the connecting portion corresponding to the short side of the plate of the circuit board after bending, and the lead-out portion is connected to the side of the connecting portion away from the light incident side of the periscope camera module.

12. The periscope camera module according to claim 11, wherein a height dimension of the connecting portion of the connecting circuit board is smaller than a height dimension of the circuit board, and the connecting portion is biased toward a side of the circuit board located on the light incident side of the periscope camera module, and the lead-out portion extends outward from a side of the connecting portion away from the light incident side of the periscope camera module and is bent.

13. The periscope camera module according to claim 11, wherein an arc column is provided at one end of the substrate adjacent to the bending portion, and the bending portion surrounds the outer side of the arc column of the substrate.

14. The periscope camera module according to any one of claims 1 to 9, wherein the photosensitive component has a cutting side, and the cutting side is located at the light incident side of the periscope camera module.

15. A photosensitive component, characterized in that: include: Connect the circuit board; A lead-out circuit board has an opposing connection end and an assembly end; A photosensitive chip having an upper chip surface and a lower chip surface opposite to each other, wherein the upper chip surface has a photosensitive area and a non-photosensitive area surrounding the photosensitive area; as well as A chip circuit board has an upper plate surface and a lower plate surface relative to each other, and a plate through-hole penetrating the upper plate surface and the lower plate surface, wherein the connection end of the lead-out circuit board is connected to one side of the chip circuit board, wherein the non-photosensitive area of ​​the photosensitive chip is mounted on the lower plate surface of the chip circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the plate through-hole of the chip circuit board, wherein the connecting circuit board is mounted on the lower plate surface of the chip circuit board, and the connecting circuit board conducts a pair of circuits of the chip circuit board located on opposite sides of the plate through-hole.

16. The photosensitive component according to claim 15, wherein the connecting circuit board conducts at least one circuit of the chip circuit board for connecting to one side of the export circuit board and at least one circuit of the chip circuit board away from the export circuit board.

17. The photosensitive component according to claim 15, wherein the connecting circuit board conducts at least one circuit of the chip circuit board for connecting to one side of the export circuit board and at least one circuit of the chip circuit board on one side close to the export circuit board.

18. The photosensitive component according to claim 16, wherein the four sides of the chip circuit board used to define the plate perforation are respectively defined as a first side of the plate, a second side of the plate, a third side of the plate and a fourth side of the plate in a clockwise direction, the first side of the plate and the third side of the plate correspond to each other in the width direction, the second side of the plate and the fourth side of the plate correspond to each other in the height direction, wherein the connecting end of the export circuit board is connected to the first side of the plate of the chip circuit board, wherein the connecting circuit board conducts at least one circuit located on the first side of the plate and at least one circuit located on the third side of the plate.

19. The photosensitive component according to claim 17, wherein the four sides of the chip circuit board used to define the plate perforation are respectively defined as a first side of the plate, a second side of the plate, a third side of the plate and a fourth side of the plate in a clockwise direction, the first side of the plate and the third side of the plate correspond to each other in the width direction, the second side of the plate and the fourth side of the plate correspond to each other in the height direction, wherein the connecting end of the export circuit board is connected to the first side of the plate of the chip circuit board, wherein the connecting circuit board conducts at least one circuit located on the first side of the plate and at least one circuit located on the second side of the plate.

20. The photosensitive component according to any one of claims 15 to 19, wherein the connecting circuit board is on the back of the photosensitive chip.

21. A photosensitive component according to any one of claims 15 to 19, wherein the lower surface of the plate of the chip circuit board has an inner surface and an outer surface surrounding the inner surface, the height difference between the inner surface and the outer surface is greater than the thickness of the photosensitive chip, wherein the photosensitive chip is mounted on the inner surface of the chip circuit board, the connecting circuit board is mounted on the outer surface of the chip circuit board, and there is a gap between the lower surface of the photosensitive chip and the connecting circuit board.

22. The photosensitive component according to claim 21, wherein the photosensitive component comprises a heat-conducting portion, and the heat-conducting portion is arranged in the gap between the chip lower surface of the photosensitive chip and the connecting circuit board.

23. A photosensitive component according to any one of claims 15 to 19, wherein the photosensitive chip has a MIPI interface, the chip circuit board has a MIPI circuit, the MIPI circuit is completely arranged on the chip circuit board, and the MIPI circuit connects the MIPI interface of the photosensitive chip and the export circuit board.

24. The photosensitive component according to any one of claims 15 to 19, wherein the chip circuit board is a rigid circuit board, and the connecting circuit board is a flexible circuit board.

25. The photosensitive component according to any one of claims 15 to 19, wherein the number of wiring layers of the connecting circuit board is two, the number of wiring layers of the chip circuit board is four or six, and the lines in the two layers of wiring of the connecting circuit board are parallel lines.

26. The photosensitive component according to any one of claims 15 to 19, wherein the number of wiring layers of the connecting circuit board is two, and the number of wiring layers of the chip circuit board is four or six, wherein the lines of one of the two layers of wiring of the connecting circuit board are parallel lines, and the lines of the other layer of wiring are grid lines.

27. A photosensitive component according to any one of claims 15 to 19, wherein the photosensitive component includes a reinforcement unit, the reinforcement unit includes a front reinforcement part and a back reinforcement part, wherein the front reinforcement part has a light window, the front reinforcement part is arranged on the upper surface of the plate of the chip circuit board, the light window of the front reinforcement part and the plate through-hole of the chip circuit board are communicated, wherein the back reinforcement part has a mounting channel, the back reinforcement part is arranged on the lower surface of the plate of the chip circuit board, and the connecting circuit board is accommodated in the mounting channel of the back reinforcement part.

28. The photosensitive component according to claim 27, wherein the front reinforcement portion is integrally formed on the upper surface of the plate of the chip circuit board, and the back reinforcement portion is integrally formed on the lower surface of the plate of the chip circuit board.

29. A periscope camera module, characterized in that: include: Optical lens; Optical path reflection component; as well as According to any one of claims 1 to 28, the optical lens and the light path reflection component are respectively arranged in the photosensitive path of the photosensitive chip of the photosensitive component.

Images