Separating machine for printed circuit board panels

Abstract

The invention relates to a separating machine (10) for separating individual printed circuit boards (12) from a printed circuit board panel (14), said separating machine (10) comprising: at least one first laser source (16) for generating a first laser beam and a first laser spot on the printed circuit board panel (14); at least one first laser beam guide (22) for directing the at least one first laser beam onto the printed circuit board panel (14), wherein the first laser beam guide (22) is designed in such a way that the at least one first laser spot can be moved over the printed circuit board panel (14); at least one first base plate (28) which can be moved on a machine frame (26) and on each of which at least one printed circuit board panel (14) can be arranged; at least one first linear direct drive (29) for moving the at least one base plate (28) parallel to a x-axis, wherein the at least one first linear direct drive (29) comprises a respective motor part and a magnetic rail which interacts with the motor part; a control unit (30) for controlling the at least one first laser beam guide (22) and the at least one first linear direct drive (29), wherein the control unit (30) is designed in such a way that the at least one first laser beam guide (22) and the at least one first linear direct drive (29) are moved simultaneously, such that the movement of the printed circuit board panel (14) and the movement of the first laser beam for moving the laser spot over the printed circuit board panel (14) are overlaid.

Description

[0001] Title: Cutting machine for printed circuit board panels

[0002] Description

[0003] The invention relates to a separation machine for separating individual printed circuit boards from a printed circuit board panel.

[0004] Prior art includes, among other things, separation machines for separating individual printed circuit boards from a printed circuit board panel using a milling head.

[0005] The invention is based on the objective of providing a separation machine that can precisely, flexibly, and quickly separate individual printed circuit boards from a printed circuit board panel. The objective of the invention is achieved by a separation machine for separating individual printed circuit boards from a printed circuit board panel with the features of claim 1.The cutting machine comprises at least one first laser source for generating a first laser beam and a first laser spot on the printed circuit board panel; at least one first laser beam guide for aligning the at least one first laser beam on the printed circuit board panel, wherein the first laser beam guide is designed such that the at least one first laser spot is movable over the printed circuit board panel; at least one first base plate movable on a machine frame, on which at least one printed circuit board panel can be arranged; at least one first linear direct drive for moving the at least one base plate parallel to an x-axis, wherein the at least one first linear direct drive comprises a motor part and a magnetic rail interacting with the motor part.

[0006] The cutting machine further comprises a control unit for controlling the at least one first laser beam guide and the at least one first linear direct drive, wherein the control unit is arranged such that the at least one first laser beam guide and the at least one first linear direct drive are moved simultaneously, so that the movement of the printed circuit board panel and the movement of the first laser beam are superimposed to move the laser spot over the printed circuit board panel (printed circuit board panel cutting “on the fly”).

[0007] This allows for a high degree of flexibility during the cutting process. Due to the superposition of movements, the movement of the laser spot across the printed circuit board (PCB) panel can be optimized, particularly accelerated. Furthermore, the angle of impact on the PCB panel can be adjusted. Additionally, the energy input into the PCB panel, especially at the edges, can be optimized using this superimposed movement. This ensures a homogeneous cutting result even with complex cutting paths.

[0008] It is advantageous if the first laser beam guide includes at least one laser scanner, in particular at least one galvanometer mirror. This allows the laser beam and the laser spot to be moved precisely and quickly.

[0009] It is further advantageous if at least one second base plate is provided that can be moved along the machine frame and is movable parallel to the x-axis by means of at least one second linear direct drive. This allows at least one printed circuit board panel to be processed on the first base plate while the second base plate is being loaded and / or unloaded with another printed circuit board panel.

[0010] An advantageous embodiment provides that the first base plate and the second base plate can each be moved parallel to the x-axis between a separation position and a loading position and / or unloading position.

[0011] Preferably, at least one cutting head movable on the machine frame is provided, with the cutting head being movable by means of axis drives along a z-axis and a y-axis perpendicular to the x-axis. The cutting head is preferably designed as a milling tool or as a sawing tool.

[0012] This allows the printed circuit board panels to be processed using either a laser or a cutting head, depending on the application (material, geometry, etc.). Simultaneous processing of a single printed circuit board panel with both a laser and a cutting head is also possible. Furthermore, it is conceivable that one printed circuit board panel on a first base plate is processed with a laser, while another panel on a second base plate is processed with a cutting head. The control unit can be configured accordingly. This further increases the degree of processing flexibility.

[0013] Alternatively or additionally to the cutting head, at least one second laser source can be provided to generate a second laser beam and a second laser spot on the printed circuit board panel. Preferably, at least one second laser beam guide is provided to align the at least one second laser beam onto the printed circuit board panel. The second laser beam guide is preferably designed such that the at least one second laser spot is movable across the printed circuit board panel.

[0014] It is advantageous if the first laser beam guide and / or the second laser beam guide and / or the cutting head is rigidly arranged on a portal, in particular parallel to the x-axis.

[0015] It is further advantageous if a laser beam guide and / or a cutting head are arranged on a first portal and a further laser beam guide and / or a further cutting head are arranged on a further portal, in particular rigidly parallel to the x-axis. One portal is preferably arranged to be movable along the x-axis, in particular on the machine frame. Two portals are preferably arranged to be movable independently of each other along the x-axis, in particular on the machine frame.

[0016] A further advantageous embodiment provides that the control unit is also configured to control the first laser source and / or the second laser source in such a way that, depending on the printed circuit board panel, and in particular the material of the printed circuit board panel, a different laser beam parameter, especially a different wavelength, is used by means of the first laser source and / or the second laser source. Accordingly, different printed circuit board panels can be processed using a cutting machine.

[0017] It is advantageous if the cutting machine has an extraction device for removing particles when individual printed circuit boards are cut from a printed circuit board panel. The extraction device is preferably configured to generate a suction and / or compressed air flow directed along a main airflow direction onto the printed circuit board panel.

[0018] It is further advantageous if the control unit is arranged such that a first laser beam is moved to form a first laser spot on a first printed circuit board panel by means of a first laser beam guide and a second laser beam is moved to form a second laser spot on the first printed circuit board panel and / or on a second printed circuit board panel by means of a second laser beam guide.

[0019] Another preferred embodiment provides that the control unit is configured such that simultaneously the first printed circuit board panel on the first base plate is moved parallel to the x-axis and a first laser beam is moved by means of a first laser beam guide to form a first laser spot on the first printed circuit board panel, so that the movement of the first printed circuit board panel and the movement of the first laser beam to move the first laser spot over the first printed circuit board panel are superimposed, and wherein simultaneously the second printed circuit board panel on the second base plate is moved parallel to the x-axis and a second laser beam is moved by means of a second laser beam guide to form a second laser spot on the second printed circuit board panel.so that the movement of the second printed circuit board panel and the movement of the second laser beam are superimposed to form the movement of the second laser spot across the second printed circuit board panel. This allows for further increases in the flexibility and speed of processing while maintaining the same separation quality. It is particularly advantageous if the more dynamic unit, especially the movement of the laser beam, compensates for slower movements of the more inert unit, especially the linear direct drive.

[0020] It is advantageous if the control unit is configured such that the linear direct drive of the at least one base plate is accelerated when the laser beam feed rate decreases, and / or the linear direct drive of the at least one base plate is decelerated when the laser beam feed rate increases. This allows for a constant energy input even when moving around corners. When moving around corners, the movement of the laser spot across the printed circuit board decelerates. The superposition of the linear direct drive movements compensates for this. Therefore, a uniform separation result can be achieved even with complex separation paths.

[0021] It is further advantageous if the control unit is configured to communicate in real time during operation with the first laser beam guide and / or the second laser beam guide and with the first linear direct drive and / or the second linear direct drive. In the case of a laser source, the control unit communicates with the first laser beam guide and with the first linear direct drive in real time.

[0022] Preferably, the control unit is connected to the first and / or second laser beam guide and to the first and / or second linear direct drive via a bus system, in particular an EtherCAT bus system. Preferably, the bus system connects the control unit, the first laser beam guide, and the second laser beam guide to each other for real-time communication.

[0023] Preferably, the control unit is configured to control the at least one linear direct drive and the laser beam guidance synchronously in real time via a bus system, in particular an EtherCAT bus system. Further details and advantageous embodiments of the invention can be found in the following description, which further describes and explains exemplary embodiments of the invention.

[0024] They show:

[0025] Fig. 1 shows a schematic top view of a cutting machine with two base plates and two separately designed cutting elements;

[0026] Fig. 2 shows a schematic side view of the cutting machine according to Fig. 1 in a first processing state;

[0027] Fig. 3 shows another schematic side view of the cutting machine according to Fig. 1 in a second processing state; and

[0028] Fig. 4 shows a perspective view of the cutting machine according to Fig. 1.

[0029] The separating machine 10 is designed to separate individual printed circuit boards 12 from a printed circuit board panel 14.

[0030] The cutting machine 10 has a first laser source 16 for cutting the printed circuit board panels 14 and a cutting head 18 designed as a milling tool for cutting the printed circuit board panels 14. According to Fig. 3, a second laser source 20 may also be provided. The first laser source 16 and / or the second laser source 20 serve to generate a laser beam and a laser spot on the printed circuit board panel 14. The laser spot causes energy to be introduced into the printed circuit board panel 14 to cut out the printed circuit boards 12.

[0031] By means of a first laser beam guide 22, the at least one first laser beam from the first laser source 16 is directed onto the printed circuit board panel 14. The first laser beam guide 22 is configured such that the first laser spot is movable over the printed circuit board panel 14. The first laser beam guide 22 preferably includes a laser scanner, in particular a galvanometer mirror.

[0032] For the second laser source 20, a second laser beam guide 22 is provided, which corresponds to the first laser beam guide 22.

[0033] The first laser source 16 and the cutting head 18 and / or the second laser source 20 are preferably arranged on a gantry 24. The gantry 24 is either fixedly connected to a machine frame 26 or the gantry 24 is movable along an x-axis relative to the machine frame 26.

[0034] The separating head 18 is preferably movable by means of axis drives along a z-axis perpendicular to the x-axis and a y-axis perpendicular to it.

[0035] Preferably, the first laser source 16 and the second laser source 20, or the associated laser beam guide 22, can also be moved parallel to the y-axis by means of axis drives. It is conceivable that the laser source 16, 20 and the laser beam guide 22 are each designed as a single, jointly movable laser unit.

[0036] The machine frame 26 has two movable base plates 28, on each of which at least one printed circuit board panel 14 can be arranged. Each base plate 28 has at least one linear direct drive 29 for moving the base plate 28 parallel to the x-axis. Each linear direct drive 29 has a motor component and a magnetic rail that interacts with the motor component.

[0037] Furthermore, the cutting machine 10 has a control unit 30 for controlling the first laser source 16 and / or the first laser beam guide 22 and / or the second laser source 20 and / or the second laser beam guide 22 and / or the cutting head 18 and / or the axis drives of the cutting head 18 and / or the linear direct drives of the base plates 28.

[0038] The control unit 30 is preferably configured such that the at least one first laser beam guide 22 and the at least one first linear direct drive 29 of the first base plate 28 are moved simultaneously, so that the movement of the first circuit board panel 14 and the movement of the first laser beam superimpose to move the first laser spot across the first circuit board panel. The control unit 30 is further preferably configured such that the at least one second laser beam guide 22 and the at least one second linear direct drive 29 of the second base plate 28 are moved simultaneously, so that the movement of the second circuit board panel 14 and the movement of the second laser beam superimpose to move the second laser spot across the second circuit board panel 14. Accordingly, a higher processing speed can be achieved. Furthermore, for example,Consistent separation quality is achieved during cornering because the increased energy input during braking can be compensated for by the simultaneous movement of the linear direct drives. Otherwise, the increased energy input would lead to carbonization, for example in flame-resistant materials, which can cause conductive layers.

[0039] It is conceivable that a printed circuit board panel 14 is being processed on a base plate 28 simultaneously, while another base plate 28 is being loaded and unloaded. For this purpose, the cutting machine 10 has a processing area 32 and a loading area 34. According to Fig. 1, the first base plate 28 is in the processing area 32 and the second base plate 28 is in the loading area 34. For processing, the base plate 28 can be moved into the processing position. For loading and unloading, the base position can be moved into the loading and / or unloading position, with the positions being assignable to areas 32 and 34. Loading and unloading can preferably be carried out inline and automatically.

[0040] As shown in Fig. 3, the first laser source 16 and the cutting head 18 are located above the first base plate 28, and the second laser source 20 is located above the second base plate 28. This illustrates that a printed circuit board panel 14 can be processed simultaneously by two different cutting devices. Alternatively, the cutting devices can be selected depending on the printed circuit board panel 14. Furthermore, a printed circuit board panel 14 can also be processed by two or more laser sources 16, 20. The control unit 30 is also configured to control the first laser source 16 and / or the second laser source 20 such that, depending on the printed circuit board panel 14, and in particular the material of the printed circuit board panel 14, a different laser beam parameter, especially a different wavelength, is used by means of the first laser source 16 and / or the second laser source 20.It is conceivable that the control unit 30 first checks which circuit board panel 14 is to be processed and then the appropriate laser beam parameter, in particular the appropriate wavelength, is set, preferably by selecting the first laser source 16 or second laser source 20.

[0041] The cutting machine 10 also has a suction device, in particular ionized or non-ionized, for extracting particles during cutting, wherein the suction device is in particular designed to generate a suction and / or compressed air flow directed along a main airflow direction onto the printed circuit board panel 14.

Claims

Patent claims 1. Separating machine (10) for separating individual printed circuit boards (12) from a printed circuit board panel (14), the separating machine (10) comprising: - at least one first laser source (16) to generate a first laser beam and a first laser spot on the printed circuit board panel (14) ; - at least one first laser beam guide (22) for aligning the at least one first laser beam onto the printed circuit board panel (14) , wherein the first laser beam guide (22) is designed such that the at least one first laser spot is movable over the printed circuit board panel (14); - at least one first base plate (28) movable on a machine frame (26), on which at least one printed circuit board panel (14) can be arranged; - at least one first linear direct drive (29) for moving the at least one base plate (28) parallel to an x-axis, wherein the at least one first linear direct drive (29) comprises a motor part and a magnetic rail cooperating with the motor part; - a control unit (30) for controlling the at least one first laser beam guide (22) and the at least one first linear direct drive (29), wherein the control unit (30) is configured such that the at least one first laser beam guide (22) and the at least one first linear direct drive (29) are moved simultaneously, so that the movement of the printed circuit board (14) and the movement of the first laser beam superimpose to form the movement of the laser spot over the printed circuit board (14).

2. Separation machine (10) according to claim 1, wherein the first laser beam guide (22) comprises at least one laser scanner, in particular at least one galvanometer mirror.

3. Separating machine (10) according to claim 1 or 2, wherein at least one second base plate (28) movable on the machine frame (26) is provided, which can be moved parallel to the x-axis by means of at least one second linear direct drive (29).

4. Cutting machine (10) according to claim 3, wherein the first base plate (28) and the second base plate (28) are each movable parallel to the x-axis between a processing position and a loading position and / or unloading position.

5. Cutting machine (10) according to one of the preceding claims, wherein at least one cutting head (18) movable on a machine frame (26), in particular a milling tool or a sawing tool, is provided, wherein the cutting head (18) is movable by means of axis drives along a z-axis extending perpendicular to the x-axis and a y-axis extending perpendicular thereto.

6. Separation machine (10) according to one of the preceding claims, wherein at least one second laser source (20) is provided for generating a second laser beam and a second Laser spots on the printed circuit board (14) , and in particular at least a second laser beam guide (22) is provided for aligning the at least one second laser beam on the printed circuit board (14) , and wherein the second laser beam guide (22) is designed such that the at least one second laser spot is movable over the printed circuit board (14) .

7. Cutting machine (10) according to one of the preceding claims, wherein the first laser beam guide (22) and / or the second laser beam guide (22) and / or the cutting head (18) is rigidly arranged on a portal (24) parallel to the x-axis.

8. Cutting machine (10) according to one of the preceding claims, wherein a laser beam guide (22) and / or a cutting head (18) are arranged on a first portal (24) and a further laser beam guide (22) and / or a further cutting head (18) are arranged on a further portal (24).

9. Cutting machine (10) according to one of the preceding claims, wherein the control unit (30) is further configured to control the first laser source (16) and / or the second laser source (20) in such a way that, depending on the printed circuit board panel (14), in particular the material of the printed circuit board panel (14), a different laser beam parameter, in particular a different wavelength, is used for processing by means of the first laser source (16) and / or the second laser source (20).

10. Cutting machine (10) according to one of the preceding claims, wherein the cutting machine (10) has a suction device for extracting particles during cutting, wherein the suction device is in particular configured to generate a suction and / or compressed air flow directed along a main airflow direction onto the printed circuit board panel (14).

11. Cutting machine (10) according to one of the preceding claims, wherein the control unit (30) is configured such that a first laser beam is moved by means of a first laser beam guide (22) to form a first laser spot on a first printed circuit board panel (14) and a second laser beam is moved by means of a second laser beam guide (22) to form a second laser spot on the first printed circuit board panel (14) and / or on a second printed circuit board panel (14).

12. Cutting machine (10) according to one of the preceding claims, wherein the control unit (30) is configured such that simultaneously the first printed circuit board panel (14) is moved on the first base plate (28) parallel to the x-axis and a first laser beam is moved by means of a first laser beam guide (22) to form a first laser spot on the first printed circuit board panel, such that the movement of the first printed circuit board panel (14) and the movement of the first laser beam to move the first laser spot over the first printed circuit board panel (14) are superimposed, and wherein simultaneously the second printed circuit board panel (14) is moved on the second base plate (28) parallel to the x-axis and a second laser beam is moved by means of a second laser beam guide to form a second laser spot on the second printed circuit board (14) is moved, so that the movement of the second printed circuit board (14) and the movement of the second laser beam are superimposed to form the movement of the second laser spot over the second printed circuit board (14).

13. Cutting machine (10) according to one of the preceding claims, wherein the control unit (30) is configured such that the linear direct drive (29) of the at least one base plate (28) is accelerated when the feed rate of the laser beam decreases, and / or wherein the linear direct drive (29) of the at least one base plate (28) is decelerated when the feed rate of the laser beam increases.

14. Cutting machine (10) according to one of the preceding claims, wherein the control unit (30) is configured such that it communicates in real time during operation with the first laser beam guide (22) and / or the second laser beam guide (22) and with the first linear direct drive (29) and / or the second linear direct drive (29).

15. Cutting machine (10) according to one of the preceding claims, wherein the control unit (30) is connected to the first laser beam guide (22) and / or the second laser beam guide (22) and to the first linear direct drive (29) and / or the second linear direct drive (29) by means of a bus system, in particular by means of an EtherCAT bus system.

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