Conductive wire frame strip, glue sealing method and glue sealing structure

A technology of lead frame strips and lead frames, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc. It can solve the problems of wasting lead frame bar 1 space, and it is difficult to further increase the output per unit time.

CN101477973BActive Publication Date: 2010-09-29ADVANCED SEMICON ENG INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2010-09-29

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Abstract

The invention discloses a lead frame strip, and a sealing method and a sealing structure thereof. The invention mainly provides the lead frame strip, which comprises at least a flow passage branch module, wherein, each flow passage branch module comprises a flow passage bracket and a plurality of lead frame units. A flow passage reserve zone is reserved on the flow passage bracket, and the flow passage reserve zone comprises a plurality of diverging point reserve zones. Each diverging point reserve zone is connected with two lead frame units from the two sides adopting two edge gate reserve zones, and further connected with another two lead frame units from the outer sides by adopting two connective gate reserve zones, to ensure that each diverging point reserve zone is connected with four lead frame units. Therefore, the lead frame strip can relatively reduce the quantity of the flow passage brackets, and simultaneously increase the quantity of the lead frame units.
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Description

Technical field

[0001] The present invention relates to a lead frame strip and its sealing method and structure, in particular to a lead frame strip capable of increasing the output per hour (units per hour, UPH) and its sealing method and structure. Sealed construction.

Background technique

[0002] Nowadays, in order to meet various packaging requirements, the semiconductor packaging industry has gradually developed various types of packaging structures. Among them, silicon chips (chips) cut from semiconductor silicon wafers (wafers) are usually firstly processed by wire bonding. ) or bumping (bumping) and other appropriate methods to select and fix on the leadframe (leadframe) or substrate (substrate), and then use the encapsulation gel to encapsulate and protect the silicon chip, so that the basic structure of a semiconductor package structure can be completed. Generally, there are small outline package (small outline package, SOP), small outline J-leaded package (s...

Examples

Embodiment Construction

[0030] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention will be specifically cited below, together with the accompanying drawings, for a detailed description as follows:

[0031] Please refer to Figure 2A , 2B As shown in and 2C, the lead frame bar and its sealing method and sealing structure of the preferred embodiment of the present invention are mainly used in the manufacture of semiconductor packaging products with double-row lead frames, for example, in the manufacture of small outline packages (SOPs) ), Small Outline J Package (SOJ), Small Outline Transistor Package (SOT), Small Outline Wide Package (SOW), Dual Inline Package (DIP) or other similar package products.

[0032] Please refer to Figure 2A As shown, the lead frame bar 2 of the preferred embodiment of the present invention is a strip-shaped plate body, which is usually made of c...