Heat dissipation unit and method for manufacturing the same
By designing a close bonding structure between the heat pipe and the base in the heat dissipation unit, and using mechanical processing and pin cutting processing to improve the flatness of the contact plane, the problem of poor flatness between the heat pipe and the heat dissipation substrate in the prior art is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN201510729300.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2015-10-29
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2035-10-29
AI Technical Summary
The existing heat dissipation unit has poor flatness at the contact point between the heat pipe and the heat dissipation substrate, which leads to thermal resistance and is prone to excessive cutting of pins during milling and processing to damage the heat pipe.
A heat dissipation unit is designed in which the heat pipe is closely combined with the base through the through hole, and the heat pipe is cut into the base by mechanical processing to improve the flatness of the contact plane, and the boss surface is fine-processed by cutting pins to improve the flatness.
It effectively improves the flatness of the heat pipe and the heat dissipation substrate, reduces thermal resistance, avoids damage to the heat pipe during processing, and improves heat dissipation efficiency.
Smart Images

Figure CN106659055B_ABST
Abstract
Description
[Technical field]
[0002] A heat dissipation unit and a manufacturing method thereof, in particular to a heat dissipation unit with a better thermal contact plane and a manufacturing method thereof. [Background technology]
[0004] Current electronic devices have central processing units and other computing chips, and when performing calculations, they will generate heat, so heat dissipation components are needed to increase the heat dissipation efficiency and achieve the purpose of heat dissipation. The most commonly used heat dissipation components are heat pipes, temperature dispersion plates, radiators, heat sinks, and other components. These components are mainly used to increase the heat conduction speed or to conduct heat to a remote end for remote heat dissipation, or to increase the heat dissipation area to improve the heat dissipation efficiency. Generally, the central processing unit mainly conducts heat by contacting with the radiator, and the radiator is a kind of device that provides the effect of increasing the heat dissipation area. In order to make its heat conduction speed faster, the heat pipe is combined with the radiator, and an opening or a groove is opened at the part where the radiator contacts the central processing unit so that the heat pipe can be directly exposed to contact with the central processing unit to conduct heat and then transfer the heat to the central processing unit. A heat sink with a larger heat dissipation area is often used for heat dissipation. This heat dissipation element that combines a heat pipe and a heat sink is often used. However, this heat dissipation element still has a defect that cannot be improved. The defect is that when a groove for accommodating the heat pipe is opened on one side of the heat sink, the heat pipe is fixed in the groove by penetrating or vertically placing it, but the heat pipe still has a local part protruding from the contact part of the heat sink and the central processing unit, resulting in poor flatness and thermal resistance. It is known that the protruding part is generally removed by milling. However, since the part of the heat pipe protruding from the groove of the heat sink is not all at the same height, and the wall of the heat pipe itself also has different thicknesses, it is quite easy to over-cut and damage the wall of the heat pipe during milling, making the heat pipe ineffective. Therefore, how to improve the known defects is the most important goal. [Summary of the invention]
[0006] In order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a heat dissipation unit that can improve the flatness accuracy of the surface where the heat dissipation unit contacts the heat source.
[0007] Another object of the present invention is to provide a method for manufacturing a heat dissipation unit that improves the flatness accuracy of the plane where the heat dissipation unit contacts the heat source.
[0008] To achieve the above-mentioned purpose, the present invention provides a heat dissipation unit, comprising: a base, having a first side and a second side, the second side being provided with a groove and a plurality of through holes connecting the first and second sides; a heat pipe, having a heat absorption area and a conduction area, and the conduction area is configured to extend from the heat absorption area to at least one end in a direction opposite to the heat absorption area, and the portion of the heat pipe corresponding to the through hole protrudes and is accommodated in the through holes, and at the same time is flush with the first side of the base.
[0009] The heat pipe is either a flat heat pipe or a D-type heat pipe.
[0010] The first side and the second side are respectively arranged on the lower side and the upper side of the base.
[0011] The convex parts are arranged correspondingly on the base to directly contact with at least one heat source to conduct heat.
[0012] To achieve the above object, the present invention provides a method for manufacturing a heat dissipation unit, comprising the following steps:
[0013] Providing a base and a heat pipe; forming a groove and a plurality of through holes on the upper side of the base; placing the heat pipe in the groove and performing mechanical processing on the upper side of the base to force the heat pipe into the groove and the through holes;
[0014] The lower side of the base is machined, and the portion of the heat pipe protruding from the through hole is pressed into the through hole so that it is flush with the lower side of the base.
[0015] The through holes are arranged in a groove near the center of the base.
[0016] The mechanical processing is any one of stamping processing, rolling processing or forging processing.
[0017] The lower side of the base is machined, and the portion of the heat pipe protruding from the through hole is pressed into the through hole so that it is flush with the lower side of the base. After this step, the boss of the base is finely machined by cutting and pinning to improve the surface flatness of the boss.
[0018] The heat pipe is either a flat heat pipe or a D-type heat pipe.
[0019] The heat dissipation unit and its manufacturing method of the present invention can improve the problem that the heat dissipation unit composed of a heat dissipation substrate and a heat pipe in the prior art is difficult to control the accuracy of the contact point between the heat pipe, the heat dissipation substrate and the heat source during assembly.
Brief Description of the Drawings
[0021] Figure 1 It is a three-dimensional exploded view of the first embodiment of the heat dissipation unit of the present invention;
[0022] Figure 2 It is a three-dimensional assembly diagram of the first embodiment of the heat dissipation unit of the present invention;
[0023] Figure 3 It is a combined cross-sectional view of the first embodiment of the heat dissipation unit of the present invention;
[0024] Figure 4 A perspective exploded view of the second embodiment of the heat dissipation unit of the present invention
[0025] Figure 5A schematic diagram of the manufacturing method of the heat dissipation unit of the present invention;
[0026] Figure 6 A schematic diagram of the manufacturing method of the heat dissipation unit of the present invention;
[0027] Figure 7 is a flow chart of the steps of the first embodiment of the manufacturing method of the heat dissipation unit of the present invention;
[0028] Figure 8 FIG. 4 is a flow chart of the steps of the second embodiment of the manufacturing method of the heat dissipation unit of the present invention.
[0029] The components represented by the serial numbers in the accompanying drawings are:
[0030] Cooling unit 1
[0031] Heat pipe 11
[0032] Heat absorption area 111
[0033] Conductive zone 112
[0034] Base 12
[0035] First side 121
[0036] Second side 122
[0037] Groove 123
[0038] Through hole 124
[0039] Heat source 2. [Specific implementation method]
[0041] The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the embodiments shown in the accompanying drawings.
[0042] See also Figure 1 , Figure 2 , Figure 3 , is a three-dimensional exploded, assembled and cross-sectional view of the first embodiment of the heat dissipation unit of the present invention. As shown in the figure, the heat dissipation unit 1 comprises: a heat pipe 11, a base 12;
[0043] The heat pipe 11 has a heat absorption zone 111 and a conduction zone 112, and the conduction zone 112 is configured to extend from at least one end of the heat absorption zone 111 in a direction opposite to the heat absorption zone. The heat pipe 11 can be a flat heat pipe, a D-shaped heat pipe, or a round heat pipe, or they can be used in combination with each other.
[0044] The base 12 has a first side 121 and a second side 122 . The second side 122 is provided with a groove 123 and a plurality of through holes 124 connecting the first and second sides 121 , 122 . The heat pipe 11 is accommodated in the groove 123 , and the heat pipe 11 is correspondingly accommodated at the through holes 124 (partially) protruding from the through holes 124 and aligned with the first side 121 of the base 12 .
[0045] The base 12 is provided with a through hole 124 to directly contact at least one heat source 2 for heat transfer.
[0046] According to this embodiment Figure 3 It can be seen that the portion (part) of the heat pipe 11 corresponding to the through hole 124 of the base 12 protrudes and is accommodated in the through hole 124 and is aligned with the first side 121 of the base 12, while the remaining portion of the heat pipe 11 is accommodated in the groove 123 of the base 12 and is aligned with the second side 122 of the base 12.
[0047] See also Figure 4 , is a three-dimensional exploded view of the second embodiment of the heat dissipation unit of the present invention. This embodiment uses a circular heat pipe 11 and a base 12 for illustration. When the circular heat pipe 11 is placed in the groove 123 of the base 12 (the groove shape in this embodiment is an arc shape), the heat pipe 11 partially protrudes from the groove 123 of the base 12. The portion of the heat pipe 11 protruding from the groove 123 can be forced into the groove 123 by mechanical processing (stamping, rolling, forging), and at the same time filled into the through hole 124, so that the The heat pipe 11 is formed in the groove 123 and the through hole 124 and is tightly combined with them. After being pressed by mechanical processing, a part of the heat pipe 11 protrudes from the first side 121 of the base 12 through the through hole 124. The part can be pressed back into the through hole 124 by mechanical processing again and aligned with the first side 121 of the base 12, so that the two sides of the heat pipe 11 that are deformed are aligned with the first and second sides 121 and 122 of the base 12. This embodiment adopts stamping processing ( Figure 5 As shown) for illustration, but not limited thereto, it can also be rolled (such as Figure 6 shown).
[0048] See also Figure 7 , is a flowchart of the steps of the first embodiment of the manufacturing method of the heat dissipation unit of the present invention, and refer to the aforementioned Figures 1 to 4 as well as Figure 5 , Figure 6 The processing schematic diagram, as shown in the figure, the manufacturing method of the heat dissipation unit includes the following steps:
[0049] S1: Provide a base and a heat pipe;
[0050] A base 12 and a heat pipe 11 are provided. The base 12 can be selected from copper, aluminum or alloys thereof. The heat pipe 11 is a flat heat pipe, a D-shaped heat pipe or a round pipe.
[0051] S2: forming a groove and a plurality of through holes on the upper side of the base;
[0052] A groove 123 is formed on the upper side (second side 122) of the base 12 by removing material, and a plurality of through holes 124 are set in the groove 123 near the center of the base 12. The through holes 124 penetrate the base 12 and are connected to the lower side (first side 121) of the base 12.
[0053] S3: placing the heat pipe into the groove and performing mechanical processing on the upper side of the base to force the heat pipe into the groove and the through hole;
[0054] The heat pipe 11 is placed into the groove 123 of the base 12, and pressure is applied to the heat pipe through mechanical processing to force the heat pipe into the groove and the portion of the heat pipe corresponding to the through hole into the through hole at the same time. The mechanical processing is any one of stamping processing, rolling processing or forging processing, and the mechanical processing can be one-time processing (stamping processing such as Figure 5 as shown) or repeated multiple processing (rolling processing as shown Figure 6 shown).
[0055] S4: Machining is performed on the lower side of the base, and the portion of the heat pipe protruding from the through hole is pressed into the through hole so that it is flush with the lower side of the base.
[0056] The heat pipe 11 corresponds to the through holes 124 of the base 12 and is forced into the through holes 124 due to machining, and a portion of the heat pipe 11 protrudes from the through holes 124 on the surface of the lower side (first side 121) of the base 12. The portions of the heat pipe 11 protruding from the through holes 124 of the base 12 are pressed into the through holes 124 of the base 12 by machining, so that the portions of the heat pipes 11 protruding from the through holes 124 are flush with the surface of the lower side (first side 121) of the base 12.
[0057] See also Figure 8 , is a flow chart of the steps of the second embodiment of the manufacturing method of the heat dissipation unit of the present invention, and this embodiment includes the following steps:
[0058] S1: Provide a base and a heat pipe;
[0059] S2: forming a groove and a plurality of through holes on the upper side of the base;
[0060] S3: placing the heat pipe into the groove and performing mechanical processing on the upper side of the base to force the heat pipe into the groove and the through hole;
[0061] S4: Machining is performed on the lower side of the base, and the portion of the heat pipe protruding from the through hole is pressed into the through hole so that it is flush with the lower side of the base.
[0062] However, the present embodiment is partially identical to the first embodiment, so it will not be described here in detail. The difference between the present embodiment and the first embodiment is that there is a step S5: finishing the boss of the base by cutting and pinning, thereby improving the surface flatness of the boss;
[0063] The surfaces of the base 12 and the heat pipe 11 that have been machined are once again processed by cutting to improve the surface accuracy. The cutting process can be any one of milling, planing or grinding.
[0064] The manufacturing method of the present invention can greatly improve the defects of the conventional heat pipe and the base after the precision control is difficult, and improve the defects of the conventional heat pipe and the base after the loose connection causing the thermal resistance.
Claims
1. A heat dissipation unit, characterized in that: Include: A base having a first side and a second side, wherein the second side is provided with a groove and a plurality of through holes connecting the first side and the second side; A heat pipe has a heat absorption area and a conduction area, and the conduction area is configured to extend from the heat absorption area to at least one end in the direction opposite to the heat absorption area, and the heat pipe protrudes from the part corresponding to the through hole and is accommodated in the through holes, and at the same time is flush with the first side of the base, and the heat pipe is completely placed in the groove and combined with the base.
2. The heat dissipation unit according to claim 1, characterized in that: The heat pipe is either a flat heat pipe or a D-type heat pipe.
3. The heat dissipation unit according to claim 1, characterized in that: The first side and the second side are respectively arranged on the lower side and the upper side of the base.
4. The heat dissipation unit according to claim 1, characterized in that: The convex parts corresponding to the base are in direct contact with at least one heat source to conduct heat.
5. A method for manufacturing a heat dissipation unit, characterized in that: It includes the following steps: Providing a base and a heat pipe; A groove and a plurality of through holes are formed on the upper side of the base; Placing the heat pipe into the groove and machining the upper side of the base to force the heat pipe into the groove and the through hole; The lower side of the base is machined, and the portion of the heat pipe protruding from the through hole is pressed into the through hole to be flush with the lower side of the base. The heat pipe is completely placed in the groove and combined with the base.
6. The method for manufacturing a heat dissipation unit according to claim 5, characterized in that: The through hole is arranged in a groove near the center of the base.
7. The method for manufacturing a heat dissipation unit according to claim 5, characterized in that: The mechanical processing is any one of stamping processing, rolling processing or forging processing.
8. The method for manufacturing a heat dissipation unit according to claim 5, characterized in that: The lower side of the base is machined, and the portion of the heat pipe protruding from the through hole is pressed into the through hole so that it is flush with the lower side of the base. After this step, the boss of the base is finely machined by cutting and pinning to improve the surface flatness of the boss.
9. The method for manufacturing a heat dissipation unit according to claim 5, characterized in that: The heat pipe is either a flat heat pipe or a D-type heat pipe.
Citation Information
Patent Citations
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