LED modules and lighting devices

Abstract

A light-emitting diode chip module comprises a first electrode plate and a second electrode plate, on which a first group of light-emitting diode chips and a second group of light-emitting diode chips are respectively arranged. The second group of light-emitting diode chips are electrically connected to the first group of light-emitting diode chips. A plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding. A predetermined interval is maintained between the first electrode plate and the second electrode plate. The lower surface of the first electrode plate and the lower surface of the second electrode plate are respectively connected to two different polarity ends of a power supply to drive the first group of light-emitting diode chips and the second group of light-emitting diode chips to emit light.

Description

Technical Field

[0001] The present invention relates to a light emitting diode module and a lamp device, and in particular to a light emitting diode module and a lamp device with good heat dissipation effect. Background Art

[0002] The technology of light emitting diode (LED) has been booming in recent years, which has brought about great changes in the lighting industry. Many researchers are constantly researching how to configure light emitting diodes more effectively from various angles to produce products with higher light efficiency and stability.

[0003] Improving heat dissipation and light efficiency has always been the goal of R&D personnel. This depends on developing the blind spots of LED chips that have not yet been found and providing corresponding technical solutions. Summary of the invention

[0004] According to a first embodiment of the present invention, a light-emitting diode chip module is provided, comprising a first electrode plate and a second electrode plate. A first group of light-emitting diode chips is arranged on the upper surface of the first electrode plate, and a second group of light-emitting diode chips is arranged on the upper surface of the second electrode plate. The second group of light-emitting diode chips is electrically connected to the first group of light-emitting diode chips. The first electrode plate and the second electrode plate can be patterned with a thin copper plate and then a predetermined shape of a plurality of first electrode plates and second electrode plates can be achieved by etching a partial area.

[0005] The thin plate with the first electrode plate and the second electrode plate can be put into an injection molding machine, and a plastic shell is injected with a predetermined mold. The plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding. The injected plastic has a certain fixed adhesion to the first electrode plate and the second electrode plate, so that the first electrode plate and the second electrode plate are kept at a predetermined interval. The plastic shell has an opening upward, and the lower surface of the first electrode plate and the lower surface of the second electrode plate are exposed downward so as to be connected to two different polarity ends of a power source respectively. The driving current converted by the battery or indoor power supply is used to drive the first group of light-emitting diode chips and the second group of light-emitting diode chips to emit light. The plastic shell has a groove upward, which is filled with fluorescent paint. The fluorescent paint covers the first group of light-emitting diode chips and the second group of light-emitting diode chips. The light emitted by the common light-emitting diode chip is blue light. Through the composition of the fluorescent powder, the blue light passing through the fluorescent powder can finally present white light or other light with various light characteristics.

[0006] In addition to phosphors, nanoparticles can also be used to replace phosphors. In this case, the plastic shell can be made thinner. In addition, the grooves originally used to fill the phosphors can also be filled with transparent heat dissipation materials to increase the heat dissipation effect. The plastic shell can be made of transparent materials, which can make the light emitting angle wider, reduce the loss of light, and provide higher efficiency.

[0007] The first group of light-emitting diode chips and the second group of light-emitting diode chips have a total of multiple light-emitting diode chips. For example, a light-emitting diode chip module can have three, five, ten or any other number of light-emitting diode chips. These light-emitting diode chips are placed on the first electrode plate or the second electrode plate according to a predetermined rule, and then connected in series with each other using metal wires. Of course, according to different design requirements, these light-emitting diode chips can also be connected in parallel, or partially in parallel and partially in series.

[0008] The front and rear ends of these connected LED chips can be connected to the electrode plates by metal wires or perforations. Usually, LEDs need to provide a positive and a negative power supply. Therefore, the external power supply can be connected to the two electrode plates respectively, and further provided to the multiple LED chips connected together.

[0009] In this embodiment, the plurality of light-emitting diode chips are electrically connected in series, and the two ends of the plurality of light-emitting diode chips in series are respectively connected to the first electrode plate and the second electrode plate. Under other design requirements, more than two electrode plates may also be used, and several different variations will be described below as illustrative examples.

[0010] The plurality of light emitting diode chips are connected in series by metal wires, such as thin gold wires or copper wires. Other wire arrangements may also be provided as required.

[0011] According to experiments, if the LED chips are kept non-aligned, the uniformity of light can be further increased and unnecessary light spots can be avoided. For example, in one embodiment, the relative arrangement directions of at least two LED chips differ by an angle of more than 5 degrees, 10 degrees or more. In addition to the angle, when multiple LED chip modules are arranged on a light source board, in addition to the angle, the placement position can also be adjusted to a certain extent, which can further improve the light presentation effect.

[0012] Even in different LED chip modules, the placement of the LED chips can be different, so that a more uniform optical effect can be achieved as a whole.

[0013] In one embodiment, the area of ​​the first electrode plate may be greater than the area of ​​the second electrode plate, and the number of LED chips in the first group of LED chips is greater than the number of LED chips in the second group of LED chips. For example, the ratio of the area of ​​the first electrode plate to the area of ​​the second electrode plate is approximately 1.2:1 to 2:1.

[0014] In addition, in one embodiment, the first group of LED chips and the second group of LED chips are fixed to the first electrode plate and the second electrode plate respectively by insulating glue. In other words, although these LED chips are placed on the conductive electrode plate, they are not directly connected to the electrode plate.

[0015] In order to provide a better heat dissipation effect, it is best to use an insulating glue with heat dissipation effect, so that the heat of the light-emitting diode can be transferred to other places through the electrode plate for heat dissipation.

[0016] In addition, in order to achieve a better heat dissipation effect, the size of the electrode plate can be expanded as much as possible. For example, the direction perpendicular to the direction in which the first electrode plate and the second electrode plate face each other is the extension direction. The length of the first electrode plate and the second electrode plate in the extension direction is greater than 90% relative to the total length of the plastic shell in the extension direction. In other words, although the plastic shell is used to fix the relative position of the first electrode plate and the second electrode plate, the size of the first electrode plate and the second electrode plate and the area exposed on the back of the plastic shell can be extended as much as possible.

[0017] When the back of the electrode plate occupies a larger area of ​​the plastic shell, it will be more difficult for the plastic shell to hold the electrode plate, resulting in structural instability. At this time, at least a hole can be made in the middle of the electrode plate to inject plastic during injection molding to increase the fixation between the plastic shell and the electrode plate.

[0018] Another method is to provide a surrounding portion at a portion of the four corners, such as two corners, three corners or four corners, of the back side of the plastic housing to strengthen the fixing force to the first electrode plate and the second electrode plate.

[0019] According to a second embodiment of the present invention, a lamp is provided, which includes a substrate, a plurality of patterned wires arranged on the substrate, a plurality of light emitting diode chip modules, and a driving circuit.

[0020] The above description can be referred to for the light-emitting diode chip module, each light-emitting diode chip module includes a first electrode plate, a first group of light-emitting diode chips are arranged on the upper surface of the first electrode plate; a second electrode plate, a second group of light-emitting diode chips are arranged on the upper surface of the second electrode plate, and the second group of light-emitting diode chips are electrically connected to the first group of light-emitting diode chips; a plastic shell, the plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding, so that the first electrode plate and the second electrode plate maintain a predetermined interval between each other, and the lower surface of the first electrode plate and the lower surface of the second electrode plate are respectively connected to two different polarity ends of a power supply, so as to drive the first group of light-emitting diode chips and the second group of light-emitting diode chips to emit light; and fluorescent paint, covering the first group of light-emitting diode chips and the second group of light-emitting diode chips.

[0021] The driving circuit is connected to a portion of the plurality of patterned wires to drive the plurality of light-emitting diode chip modules to emit light. The plurality of patterned wires may have a flat heat dissipation portion, which is thermally connected to the first electrode plate and the second electrode plate of the plurality of light-emitting diode chip modules. In other words, in addition to providing electrical connection, the patterned wires may also serve as auxiliary conduits for heat dissipation. The substrate may be made of aluminum material or other substrates with good heat dissipation properties to further increase the efficiency of heat dissipation.

[0022] An insulating layer may be provided between the substrate and the patterned wire to avoid short circuit. The area size of the plurality of flat heat dissipation portions corresponds, at least in part, to the number of the light-emitting diode chips carried on the first electrode plate and the second electrode plate that are thermally connected. In other words, the area of ​​the patterned wire may be configured according to the number of light-emitting diode chips connected, so that the heat dissipation effect can be achieved more uniformly and effectively.

[0023] In addition to the number of LED chips, the heat distribution on the entire light source board can also be measured and used to allocate the size of the patterned wire extension portion at different locations to evenly disperse the heat.

[0024] According to another embodiment of the present invention, a method for manufacturing a light-emitting diode chip module is provided. The pattern of the electrode plate is made by pattern etching or stamping, the electrode plate is placed in an injection molding machine to coat the electrode plate, the light-emitting diode chip module is arranged on the electrode plate, and connecting wires are arranged to complete the series or parallel connection of the light-emitting diode chips. And phosphor is filled as needed to produce light output with desired characteristics.

[0025] Next, such LED chip modules are placed on a light source board to manufacture corresponding lamps. The wires used to connect multiple LED chip modules can be patterned according to the characteristics of the LED chip modules so that their area and position can dissipate heat in the most effective way. In addition, LED chip modules with different configurations can be set at different positions on the same light source board to optimize the output light field effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is an example of a lamp implementation.

[0027] Figure 2 It is an embodiment of a light source board.

[0028] Figure 3 It is a partial cross-sectional schematic diagram of a light source panel.

[0029] Figure 4 It is a schematic diagram of some components of an embodiment of a light emitting diode chip module.

[0030] Figure 5 It is a schematic diagram of some components of an embodiment of a light emitting diode chip module.

[0031] Figure 6 It is a cross-sectional schematic diagram of an embodiment of a light emitting diode chip module.

[0032] Figure 7 It is a schematic diagram of the relationship between components on the back side of the light emitting diode chip module embodiment.

[0033] Figure 8 It is a schematic diagram of the relationship between multiple light-emitting diode chip modules and patterned metal wires.

[0034] Fig. 9 This is another schematic diagram of the relationship between multiple light-emitting diode chip modules and patterned metal wires.

[0035] Fig.10 This is an example of the arrangement of LED chips on an LED chip module.

[0036] Fig.11 This is another example of LED chip arrangement in an LED chip module.

[0037] Fig.12 This is another example of LED chip arrangement in an LED chip module.

[0038] Fig.13 This is a schematic diagram of the back configuration of the light-emitting diode chip module.

[0039] Fig.14 This is another schematic diagram of the back configuration of a light emitting diode chip module.

[0040] Fig.15 This is another schematic diagram of the back configuration of a light emitting diode chip module.

[0041] Fig.16 This is another schematic diagram of the back configuration of a light emitting diode chip module. Implementation

[0042] Please refer to Figure 1 . Figure 1 This is an example of a lamp. In this embodiment, the lamp is a light bulb, and has a light-transmitting cover 1091, a light source board 101, a heat dissipation cup 1092, a driving circuit board 1093, an Edison lamp holder 1094, and a lamp pin 1095. The lamp pin 1095 and the Edison lamp holder 1095 receive two electrical inputs from an indoor power source. The circuit of the driving circuit board 1093 generates a corresponding driving current to drive the light-emitting diode chip on the light source board 101 to emit light.

[0043] Please refer to Figure 2 . Figure 2 This is an embodiment of a light source board. In this embodiment, the light source board 101 has a plurality of light emitting diode chip modules 103. In this example, the light emitting diode chip modules 103 are arranged in a ring. However, under different light effect requirements, the light emitting diode chip modules 103 can also be arranged in various different ways, or even made into light strips or folding structures to meet different design requirements.

[0044] Please refer to Figure 3 . Figure 3 It is a partial cross-sectional diagram of the light source panel. Figure 3 In the embodiment, a light emitting diode chip module has a plastic housing 1031, a light emitting diode chip 1033 and an electrode plate 1032. Two or more light emitting diode chips 1033 are fixedly placed on two or more electrode plates 1032 by suitable glue. The back of the electrode plate 1032 is further connected to the wire 1041 on the light source board by various welding methods such as welding points 1040. There is an insulating layer 1042 under the wire 1041, and then an aluminum substrate 1043 can be set under it to achieve a better heat dissipation effect. Of course, the substrate 1043 can also be replaced by other materials.

[0045] Please refer to Figure 4 . Figure 4Schematic diagram of some components of an embodiment of a light-emitting diode chip module. In this embodiment, the first group of light-emitting diode chips has two light-emitting diode chips 422 and 423 disposed on the first electrode plate 412. The second group of light-emitting diode chips has one light-emitting diode chip 421 disposed on the second electrode plate 411. The light-emitting diode chip 421 has two electrical connection terminals 4211 and 4212. The light-emitting diode chips 421, 422, and 423 are connected in series through metal wires 431, 432, 433, and 434, and are respectively connected to the first electrode plate 411 and the second electrode plate 412, and are connected to the positive connection terminal 452 and the negative connection terminal 451 of the external power supply. The external power supply transmits the driving current to the light-emitting diode chips 421, 422, and 423 through the first electrode plate 411 and the second electrode plate 412 to generate light for illumination.

[0046] Please refer to Figure 5 , a schematic diagram of some components of a light emitting diode chip module is shown. The electrode plates 411 and 412 carrying the light emitting diode chip are fixed and kept at a predetermined interval by the plastic housing 501. The plastic housing can fix the electrode plates 411 and 412 by injection molding or gluing.

[0047] Please refer to Figure 6 , a schematic cross-sectional view of some components of a light-emitting diode chip module is demonstrated. This light-emitting diode chip module has a first electrode plate 611 and a second electrode plate 612. Light-emitting diode chips 621 and 622 are placed on the first electrode plate 612 and the second electrode plate 612. The light-emitting diode chips are connected in parallel or in series with each other through metal wires 632 and the like, and then can be connected to an external power source through wires 631 and 633 through the first electrode plate 611 and the second electrode plate 612 respectively. The plastic housing 601 fixes the first electrode plate 611 and the second electrode plate 612 to keep a certain distance, and has a groove facing upward for filling with phosphors so as to output lighting that meets the required light characteristics.

[0048] Please refer to Figure 7 , Figure 7 An example of the back configuration of the LED chip module is shown. When the LED chip emits light, it will generate a certain amount of heat. If this heat can be effectively removed, it will be of great help to the life of the LED chip. In order to increase heat dissipation, the area of ​​the electrode plate 72 can be increased.

[0049] For example, in this example, the two electrode plates have a perpendicular direction 701 in the direction of facing each other, which is called the extension direction 702. On the back of the LED chip module, the injection molded housing 71 has an overall length 731 in the extension direction 702. The electrode plate 72 has a length 731 in the extension direction 702. In a better case, the ratio of the length 731 to the length 732 exceeds 90%, or even 95%, to achieve a better heat dissipation effect.

[0050] Please refer to Figure 8 . Figure 8 It is a schematic diagram of the relationship between multiple light-emitting diode chip modules and patterned metal wires. The light-emitting diode chip modules 811, 812, 813, and 814 are arranged in a ring. Patterned wires 821, 822, and 823 are arranged on the substrate of the light source board to connect these light-emitting diode chip modules 811, 812, 813, and 814 in series or in parallel, and finally connect them to the driving power supply. In order to dissipate heat, these patterned wires 821, 822, and 823 can be made into flat patterns. In this example, the flat pattern is fan-shaped, but such a configuration is certainly not a limitation of the present invention. The back of the light-emitting diode chip module 811 has two external electrode plates 8111 and 8112 corresponding to the positive and negative poles respectively. By expanding the area, the heat dissipation effect can be increased.

[0051] Please refer to Fig. 9 , Fig. 9 This is another schematic diagram of the relationship between multiple light-emitting diode chip modules and patterned metal wires. Figure 8 Similar, but Fig. 9 The configuration of the patterned wire further corresponds to the number of LED chips carried by the connected electrode plate. For example, two electrode plates 921 and 922 of adjacent LED chip modules are connected by patterned wires 91. The patterned wires 91 set different extension area sizes and shapes according to the number of LED chips on the connected electrode plates 921 and 922. For example, in this example, the number of LED chips on the electrode plate 921 is relatively small, so the first area 911 of the patterned wire 91 closer to the electrode plate 921 is smaller, and the area close to the electrode plate 922 with more LED chips is larger. Area 912. This design can further make the heat dissipation more uniform.

[0052] Please refer to Fig.10 . Fig.10This is an example of the arrangement of LED chips on an LED chip module. In this example, an LED chip 1081 is placed on the electrode plate 1071. Two LED chips 1082 and 1083 are placed on the electrode plate 1072. The LED chip 1081 has a placement direction 10811 on the electrode plate. The placement directions of the three LED chips 1081, 1082, and 1083 are all different. This makes the emitted light more uniform and avoids unnecessary light spots and other phenomena.

[0053] For example, the placement angles of at least two LED chips differ by more than 5 degrees. In some products with higher quality requirements, the placement angle can be set to be more than 10 degrees, or even a random number can be used to set the placement angle.

[0054] Please refer to Fig.11 . Fig.11 This is another example of the arrangement of LED chips in an LED chip module. In the LED chip module of this embodiment, there are three non-rectangular electrode plates 1101, 1102, and 1103. Different numbers of LED chips 1111, 1112, 1113, and 1114 are arranged on these electrode plates 1101, 1102, and 1103. These LED chips 1111, 1112, 1113, and 1114 are connected in series through wires 1122, 1123, and 1124, and are connected to the electrode plates 1102 and 1103 through wires 1121 and 1125, and are further connected to an external power source.

[0055] In this embodiment, the electrode plates where some LED chips 1111 and 1112 are located are not connected to the external power supply, but can still play a role in heat dissipation. In other words, the electrode plates where some LED chips are located are not directly connected to the external power supply, but play a role in heat dissipation. This configuration can have a good heat dissipation effect on a circular light source plate, and it is easy to design patterned wires.

[0056] Please refer to Fig.12 . Fig.12 This is another example of LED chip arrangement of the LED chip module 122. In this example, there are three electrode plates 1201, 1202 and 1203. LED chips 1211, 1212 and 1213 are arranged on these electrode plates 1201, 1202 and 1203.

[0057] In addition to this configuration, there are many different configurations, all of which should be considered to fall within the scope of the present invention.

[0058] Please refer to Fig.13 , Fig.14 and Fig.15 . Fig.13This is a schematic diagram of the back configuration of the light-emitting diode chip module. Fig.14 This is another schematic diagram of the back configuration of a light emitting diode chip module. Fig.15 This is another schematic diagram of the back configuration of a light-emitting diode chip module. Fig.13 In the embodiment, the electrode plate 133 extends to the top 132 in the extension direction. This can achieve a better heat dissipation effect because only the part 131 of the plastic shell is left on the back. However, such a configuration may have stability problems, although it can be solved by selecting the injection molding material or doing some surface treatment, such as bumping and roughening the surface of the electrode plate.

[0059] exist Fig.14 In the embodiment, the electrode plate 142 is surrounded by the peripheral corners 141 of the plastic shell, which can further increase the stability and at the same time expand the exposed area of ​​the electrode plate as much as possible to increase the heat dissipation effect.

[0060] exist Fig.15 In the embodiment, the electrode plate 152 further has a protruding portion 153, which, together with the surrounding corners 151, can increase the heat dissipation effect.

[0061] Fig.16 A flow chart is provided for a method embodiment of manufacturing a light-emitting diode chip module. First, the pattern of the electrode plate is made by patterned etching or stamping (step 1601), the electrode plate is placed in an injection molding machine to coat the electrode plate (step 1602), the light-emitting diode chip module is arranged on the electrode plate (step 1603), and connecting wires are arranged (step 1604) to complete the series or parallel connection of the light-emitting diode chips. And phosphor is filled as needed to produce light output with desired characteristics.

[0062] Next, such LED chip modules are placed on a light source board to manufacture corresponding lamps. The wires used to connect multiple LED chip modules can be patterned according to the characteristics of the LED chip modules so that their area and position can dissipate heat in the most effective way. In addition, LED chip modules with different configurations can be set at different positions on the same light source board to optimize the output light field effect.

[0063] In addition to the above content described according to the diagrams, the following is a summary of various possible examples of embodiments of the present invention. According to a first embodiment of the present invention, a light-emitting diode chip module is provided, comprising a first electrode plate and a second electrode plate. A first group of light-emitting diode chips is arranged on the upper surface of the first electrode plate, and a second group of light-emitting diode chips is arranged on the upper surface of the second electrode plate. The second group of light-emitting diode chips is electrically connected to the first group of light-emitting diode chips. The first electrode plate and the second electrode plate can be patterned with a thin copper plate and then a predetermined shape of multiple first electrode plates and second electrode plates is achieved by etching partial areas.

[0064] The thin plate with the first electrode plate and the second electrode plate can be put into an injection molding machine, and a plastic shell is injected with a predetermined mold. The plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding. The injected plastic has a certain fixed adhesion to the first electrode plate and the second electrode plate, so that the first electrode plate and the second electrode plate are kept at a predetermined interval. The plastic shell has an opening upward, and the lower surface of the first electrode plate and the lower surface of the second electrode plate are exposed downward so as to be connected to two different polarity ends of a power source respectively. The driving current converted by the battery or indoor power supply is used to drive the first group of light-emitting diode chips and the second group of light-emitting diode chips to emit light. The plastic shell has a groove upward, which is filled with fluorescent paint. The fluorescent paint covers the first group of light-emitting diode chips and the second group of light-emitting diode chips. The light emitted by the common light-emitting diode chip is blue light. Through the composition of the fluorescent powder, the blue light passing through the fluorescent powder can finally present white light or other light with various light characteristics.

[0065] In addition to phosphors, nanoparticles can also be used to replace phosphors. In this case, the plastic shell can be made thinner. In addition, the grooves originally used to fill the phosphors can also be filled with transparent heat dissipation materials to increase the heat dissipation effect. The plastic shell can be made of transparent materials, which can make the light emitting angle wider, reduce the loss of light, and provide higher efficiency.

[0066] The first group of light-emitting diode chips and the second group of light-emitting diode chips have a total of multiple light-emitting diode chips. For example, a light-emitting diode chip module can have three, five, ten or any other number of light-emitting diode chips. These light-emitting diode chips are placed on the first electrode plate or the second electrode plate according to a predetermined rule, and then connected in series with each other using metal wires. Of course, according to different design requirements, these light-emitting diode chips can also be connected in parallel, or partially in parallel and partially in series.

[0067] The front and rear ends of these connected LED chips can be connected to the electrode plates by metal wires or perforations. Usually, LEDs need to provide a positive and a negative power supply. Therefore, the external power supply can be connected to the two electrode plates respectively, and further provided to the multiple LED chips connected together.

[0068] In this embodiment, the plurality of light-emitting diode chips are electrically connected in series, and the two ends of the plurality of light-emitting diode chips in series are connected to the first electrode plate and the second electrode plate, respectively. Under other design requirements, more than two electrode plates may also be used, and several different variations will be described below as illustrative examples.

[0069] The plurality of light emitting diode chips are connected in series by metal wires, such as thin gold wires or copper wires. Other wire arrangements may also be provided as required.

[0070] According to experiments, if the LED chips are kept non-aligned, the uniformity of the light can be further increased and unnecessary light spots can be avoided. For example, in one embodiment, the relative arrangement directions of at least two LED chips differ by an angle of more than 5 degrees, 10 degrees or more. In addition to the angle, when multiple LED chip modules are arranged on a light source board, in addition to the angle, the placement position can also be adjusted to a certain degree of randomness, which can further improve the light presentation effect.

[0071] Even in different LED chip modules, the placement of the LED chips can be different, so that a more uniform optical effect can be achieved as a whole.

[0072] In one embodiment, the area of ​​the first electrode plate may be greater than the area of ​​the second electrode plate, and the number of LED chips in the first group of LED chips is greater than the number of LED chips in the second group of LED chips. For example, the ratio of the area of ​​the first electrode plate to the area of ​​the second electrode plate is approximately 1.2:1 to 2:1.

[0073] In addition, in one embodiment, the first group of LED chips and the second group of LED chips are fixed to the first electrode plate and the second electrode plate respectively by insulating glue. In other words, although these LED chips are placed on the conductive electrode plate, they are not directly connected to the electrode plate.

[0074] In order to provide a better heat dissipation effect, it is best to use an insulating glue with heat dissipation effect, so that the heat of the light-emitting diode can be transferred to other places through the electrode plate for heat dissipation.

[0075] In addition, in order to achieve a better heat dissipation effect, the size of the electrode plate can be expanded as much as possible. For example, the direction perpendicular to the direction in which the first electrode plate and the second electrode plate face each other is the extension direction. The length of the first electrode plate and the second electrode plate in the extension direction is greater than 90% relative to the total length of the plastic shell in the extension direction. In other words, although the plastic shell is used to fix the relative position of the first electrode plate and the second electrode plate, the size of the first electrode plate and the second electrode plate and the area exposed on the back of the plastic shell can be extended as much as possible.

[0076] When the back of the electrode plate occupies a larger area of ​​the plastic shell, it will be more difficult for the plastic shell to hold the electrode plate, resulting in structural instability. At this time, at least a hole can be made in the middle of the electrode plate to inject plastic during injection molding to increase the fixation between the plastic shell and the electrode plate.

[0077] Another method is to provide a surrounding portion at a portion of the four corners, such as two corners, three corners or four corners, of the back side of the plastic housing to strengthen the fixing force to the first electrode plate and the second electrode plate.

[0078] According to a second embodiment of the present invention, a lamp is provided, which includes a substrate, a plurality of patterned wires arranged on the substrate, a plurality of light emitting diode chip modules, and a driving circuit.

[0079] The above description can be referred to for the light-emitting diode chip module, each light-emitting diode chip module includes a first electrode plate, a first group of light-emitting diode chips are arranged on the upper surface of the first electrode plate; a second electrode plate, a second group of light-emitting diode chips are arranged on the upper surface of the second electrode plate, and the second group of light-emitting diode chips are electrically connected to the first group of light-emitting diode chips; a plastic shell, the plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding, so that the first electrode plate and the second electrode plate maintain a predetermined interval between each other, and the lower surface of the first electrode plate and the lower surface of the second electrode plate are respectively connected to two different polarity ends of a power supply, so as to drive the first group of light-emitting diode chips and the second group of light-emitting diode chips to emit light; and fluorescent paint, covering the first group of light-emitting diode chips and the second group of light-emitting diode chips.

[0080] The driving circuit is connected to a portion of the plurality of patterned wires to drive the plurality of light-emitting diode chip modules to emit light. The plurality of patterned wires may have a flat heat dissipation portion, which is thermally connected to the first electrode plate and the second electrode plate of the plurality of light-emitting diode chip modules. In other words, in addition to providing electrical connection, the patterned wires may also serve as auxiliary conduits for heat dissipation. The substrate may be made of aluminum material or other substrates with good heat dissipation properties to further increase the efficiency of heat dissipation.

[0081] An insulating layer may be provided between the substrate and the patterned wire to avoid short circuit. The area size of the plurality of flat heat dissipation portions corresponds, at least in part, to the number of the light-emitting diode chips carried on the first electrode plate and the second electrode plate that are thermally connected. In other words, the area of ​​the patterned wire may be configured according to the number of light-emitting diode chips connected, so that the heat dissipation effect can be achieved more uniformly and effectively.

[0082] In addition to the number of LED chips, the heat distribution on the entire light source board can also be measured and used to allocate the size of the patterned wire extension portion at different locations to evenly disperse the heat.

[0083] According to another embodiment of the present invention, a method for manufacturing a light-emitting diode chip module is provided. The pattern of the electrode plate is made by pattern etching or stamping, the electrode plate is placed in an injection molding machine to coat the electrode plate, the light-emitting diode chip module is arranged on the electrode plate, and connecting wires are arranged to complete the series or parallel connection of the light-emitting diode chips. And phosphor is filled as needed to produce light output with desired characteristics.

[0084] Next, such LED chip modules are placed on a light source board to manufacture corresponding lamps. The wires used to connect multiple LED chip modules can be patterned according to the characteristics of the LED chip modules so that their area and position can dissipate heat in the most effective way. In addition, LED chip modules with different configurations can be set at different positions on the same light source board to optimize the output light field effect.

[0085] In addition to the above-mentioned embodiments, there may be various variations. As long as they are within the same inventive spirit and under such disclosure, various designs that can be produced by persons familiar with the technical field should all fall within the scope of the present invention.

Claims

1. A light emitting diode chip module, comprising: a first electrode plate, wherein a first group of light-emitting diode chips is disposed on an upper surface of the first electrode plate; a second electrode plate, wherein a second group of light-emitting diode chips are arranged on the upper surface of the second electrode plate, and the second group of light-emitting diode chips are electrically connected to the first group of light-emitting diode chips; a plastic shell, wherein the plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding, so that a predetermined interval is maintained between the first electrode plate and the second electrode plate, and the lower surface of the first electrode plate and the lower surface of the second electrode plate are respectively connected to two different polarity ends of a power supply, so as to drive the first group of light-emitting diode chips and the second group of light-emitting diode chips to emit light; and fluorescent paint covering the first group of light emitting diode chips and the second group of light emitting diode chips; The direction perpendicular to the facing direction of the first electrode plate and the second electrode plate is an extension direction, and the length of the first electrode plate and the second electrode plate in the extension direction is greater than 90% of the total length of the plastic housing in the extension direction.

2. The light emitting diode chip module according to claim 1, wherein: The first group of LED chips and the second group of LED chips have a total of multiple LED chips, the multiple LED chips are electrically connected in series, and two ends of the multiple LED chips in series are respectively connected to the first electrode plate and the second electrode plate.

3. The light emitting diode chip module according to claim 2, wherein: The plurality of light emitting diode chips are connected in series by metal wires.

4. The light emitting diode chip module according to claim 2, wherein: The first group of light emitting diode chips are arranged in a non-aligned manner, and the relative arrangement directions of at least two light emitting diode chips differ by an angle exceeding 5 degrees.

5. The light emitting diode chip module according to claim 1, wherein: The area of ​​the first electrode plate is greater than the area of ​​the second electrode plate, and the number of light-emitting diode chips in the first group of light-emitting diode chips is greater than the number of light-emitting diode chips in the second group of light-emitting diode chips.

6. The light emitting diode chip module according to claim 1, wherein: The first group of light emitting diode chips and the second group of light emitting diode chips are respectively fixed to the first electrode plate and the second electrode plate by insulating glue.

7. The light emitting diode chip module according to claim 6, wherein: The insulating glue has a heat dissipation effect.

8. The light emitting diode chip module according to claim 1, wherein: The plastic shell has surrounding parts at a portion of four corners to strengthen the fixing force to the first electrode plate and the second electrode plate.

9. The light emitting diode chip module according to claim 1, wherein: At least one of the first electrode plate and the second electrode plate has a through hole, and during the injection molding of the plastic housing, the material extends to the through hole to strengthen the fixing force of the first electrode plate and the second electrode plate.

10. A lamp, comprising: a substrate; a plurality of patterned wires disposed on the substrate; a plurality of light-emitting diode chip modules, each light-emitting diode chip module comprising a first electrode plate, a first group of light-emitting diode chips being disposed on an upper surface of the first electrode plate; a second electrode plate, wherein a second group of light-emitting diode chips are arranged on the upper surface of the second electrode plate, and the second group of light-emitting diode chips are electrically connected to the first group of light-emitting diode chips; a plastic shell, wherein the plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding, so that a predetermined interval is maintained between the first electrode plate and the second electrode plate, and the lower surface of the first electrode plate and the lower surface of the second electrode plate are respectively connected to two different polarity ends of a power supply, so as to drive the first group of light-emitting diode chips and the second group of light-emitting diode chips to emit light; and fluorescent paint covering the first group of light emitting diode chips and the second group of light emitting diode chips; and a driving circuit connected to a portion of the plurality of patterned wires to drive the plurality of light-emitting diode chip modules to emit light, wherein the plurality of patterned wires have flat heat dissipation portions thermally connected to the first electrode plate and the second electrode plate of the plurality of light-emitting diode chip modules, and the area sizes of the plurality of flat heat dissipation portions correspond at least in part to the number of light-emitting diode chips carried on the first electrode plate and the second electrode plate that are thermally connected, the direction perpendicular to the facing direction of the first electrode plate and the second electrode plate is the extension direction, and the length of the first electrode plate and the second electrode plate in the extension direction is greater than 90% of the total length of the plastic shell in the extension direction.

11. The lamp according to claim 10, characterized in that: The flat heat dissipation portion is an extension portion of the patterned wire electrically connected to the first electrode plate or the second electrode plate, and a plurality of patterns of the patterned wires are allocated according to heat distribution conditions to uniformly disperse heat.

12. The lamp according to claim 10, characterized in that: The first group of LED chips and the second group of LED chips have a total of multiple LED chips, the multiple LED chips are electrically connected in series, and two ends of the multiple LED chips in series are respectively connected to the first electrode plate and the second electrode plate.

13. The lamp according to claim 12, characterized in that: The plurality of light emitting diode chips are connected in series by metal wires.

14. The lamp according to claim 12, characterized in that: The first group of light emitting diode chips are arranged in a non-aligned manner, and the relative arrangement directions of at least two light emitting diode chips differ by an angle exceeding 5 degrees.

15. The lamp according to claim 10, characterized in that: The area of ​​the first electrode plate is greater than the area of ​​the second electrode plate, and the number of light-emitting diode chips in the first group of light-emitting diode chips is greater than the number of light-emitting diode chips in the second group of light-emitting diode chips.

16. The lamp according to claim 10, characterized in that: The first group of light emitting diode chips and the second group of light emitting diode chips are respectively fixed to the first electrode plate and the second electrode plate by insulating glue.

17. The lamp according to claim 16, characterized in that: The insulating glue has a heat dissipation effect.

18. The lamp according to claim 10, characterized in that: The plastic shell has surrounding parts at a portion of four corners to strengthen the fixing force to the first electrode plate and the second electrode plate.

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