Method for manufacturing display device

Abstract

The present invention relates to a display device including a display panel and a method for manufacturing the display device. The display device includes: a first base substrate, defining: an outer edge of the first base substrate at which a side surface is exposed and an upper surface of the first base substrate connected to the outer edge; a first guide dam and a second guide dam, located on the upper surface and extending from the inside of the first base substrate to the outer edge; a first signal line, located on the upper surface and extending from the inside of the first base substrate to the outer edge between the first guide dam and the second guide dam; and a first side pad connected to the first signal line. The first side pad includes a first horizontal portion located on the upper surface and extending between the first guide dam and the second guide dam in a top plan view, and the first horizontal portion extends to define a first vertical portion provided on the side surface.

Description

[0001] This patent application claims priority to Korean Patent Application No. 10-2016-0071253 filed on Jun. 8, 2016 and all benefits arising therefrom, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to a display device and a method for manufacturing the display device. More particularly, the present disclosure relates to a display device having a relatively thin frame and a method for manufacturing the display device having a relatively thin frame. Background Art

[0003] Various display devices that provide multimedia contents have been developed, such as televisions, mobile phones, navigation displays, computer monitors, game units, and the like.

[0004] Each display device includes a display panel that generates and displays an image and a controller that generates various signals to drive the display panel. The controller is implemented, for example, by an electronic circuit obtained by arranging electronic components on a printed circuit board. Summary of the invention

[0005] One or more exemplary embodiments provide a display device having a relatively thin bezel.

[0006] One or more exemplary embodiments provide a method of manufacturing a display device.

[0007] An exemplary embodiment of the present invention provides a display device, which includes a first base substrate of a display panel of the display device, the display panel generates an image using a signal provided thereto, the first base substrate defining: an outer edge of the first base substrate and a substrate upper surface of the first base substrate, the substrate side surface of the first base substrate being exposed to the outside of the display panel at the outer edge, the substrate upper surface of the first base substrate being connected to the outer edge thereof; a first guide dam and a second guide dam, which are disposed on the substrate upper surface and extend from the inside of the first base substrate to the outer edge thereof; a first signal line inside the display panel to which a signal is supplied, the first signal line being disposed on the substrate upper surface and extending between the first guide dam and the second guide dam in a direction from the inside of the first base substrate to the outer edge thereof; and a first side pad, which is connected to the first signal line and to which a signal is transmitted from the outside of the display panel through the first side pad. The first side pad includes a first horizontal portion disposed on the substrate upper surface, the first horizontal portion extending between the first guide dam and the second guide dam in a direction from the inside of the first base substrate to the outer edge thereof in a top plan view, and the first horizontal portion extending to define a first vertical portion of the first side pad disposed on the substrate side surface exposed to the outside of the display panel.

[0008] In a top plan view, the first signal line may include a distal end disposed between the first guide dam and the second guide dam and overlapping the first horizontal portion.

[0009] The first guide dam and the second guide dam may be spaced apart from each other in a first direction, extend from an interior of the first base substrate to an outer edge thereof in a second direction intersecting the first direction, and further extend to define a connecting insulating portion extending in the first direction to connect the first guide dam and the second guide dam to each other.

[0010] In a top plan view, the first and second guide dams and the connection insulating portion may surround the first horizontal portion and expose the first vertical portion.

[0011] The display device may further include a second base substrate of the display panel facing the first base substrate, and the first horizontal portion may be disposed between the first base substrate and the second base substrate.

[0012] The first guide dam and the second guide dam may be arranged to be spaced apart from each other in a first direction and extend from an inner portion of the first base substrate to an outer edge thereof in a second direction intersecting the first direction. The first vertical portion provided on a side surface of the substrate exposed to the outside of the display panel may extend in a third direction substantially perpendicular to the first direction and the second direction and face the second base substrate in the second direction.

[0013] The display device may further include a printed circuit board providing a signal, and an anisotropic conductive film interposed between the first vertical portion and the printed circuit board to connect the first vertical portion and the printed circuit board to each other.

[0014] The anisotropic conductive film may overlap the first base substrate in the second direction.

[0015] The anisotropic conductive film may be spaced apart from the second base substrate in the third direction.

[0016] The display device may further include an upper conductive layer disposed on a lower surface of the second base substrate, and an insulating layer disposed between the upper conductive layer and the first horizontal portion.

[0017] The display device may further include: a third guide dam disposed on the upper surface of the substrate and extending from the inside of the first base substrate to its outer edge; a second signal line inside the display panel to which a signal is provided, the second signal line being disposed on the upper surface of the substrate and extending between the second guide dam and the third guide dam in a direction from the inside of the first base substrate to its outer edge; and a second side pad connected to the second signal line and to which the signal is transmitted from the outside of the display panel through the second side pad. The second side pad may include a second horizontal portion disposed on the upper surface of the substrate, the second horizontal portion extending between the second guide dam and the third guide dam in a direction from the inside of the first base substrate to its outer edge in a top plan view, and the second horizontal portion extending to define a second vertical portion of the second side pad disposed on the side surface of the substrate exposed to the outside of the display panel.

[0018] An exemplary embodiment of the present invention provides a method for manufacturing a display device, comprising: forming a conductive material layer on a substrate upper surface of a first base substrate of a display panel, the display panel generates an image using a signal provided thereto, wherein the first base substrate defines an outer edge thereof and a substrate upper surface thereof, a substrate side surface of the first base substrate is exposed to the outside of the display panel at the outer edge, and the substrate upper surface thereof is connected to the outer edge thereof; patterning the conductive material layer to form a first signal line inside the display panel to provide a signal thereto; forming an insulating material layer on the substrate upper surface above the first signal line; patterning the insulating material layer to form a first guide dam and a first guide dam on the substrate upper surface; Two guide dams, a first guide dam and a second guide dam both extend in a direction from the inside of a first base substrate to the outer edge of the first base substrate to define a first conductive area opened at the outer edge of the first base substrate therebetween; providing a conductive paste to a substrate side surface of the first base substrate exposed to the outside of a display panel; and moving a first portion of the conductive paste on the substrate side surface to a first conductive area defined between the first guide dam and the second guide dam to form a first horizontal portion of a first side pad, the first side pad being connected to a first signal line at the first conductive area and a signal being transmitted from the outside of the display panel to the first signal line through the first side pad.

[0019] Moving the first portion of the conductive paste may include using an adhesive force between the conductive paste and the first and second guide dams.

[0020] Moving the first portion of the conductive paste may include disposing the first base substrate so that the first guide dam and the second guide dam are disposed parallel to a gravity direction, and moving the first portion of the conductive paste may include using an adhesive force and gravity.

[0021] Adhesion within the material of the conductive paste may be smaller than adhesion between the conductive paste and the first and second guide dams.

[0022] Providing the conductive paste may include aligning an opening of the mask to overlap the first conductive region and coating the conductive paste on the mask. A first portion of the conductive paste moves through the opening into the first conductive region.

[0023] The method may further include forming a vertical portion of the first side surface pad, the vertical portion extending from the horizontal portion of the first side surface pad and disposed on the side surface of the substrate.

[0024] Moving the first portion of the applied conductive paste through the opening of the mask into the first conductive region may dispose a second portion of the applied conductive paste remaining in the opening that is different from the first portion of the applied conductive paste. Forming the vertical portion may include curing the second portion of the conductive paste remaining in the opening.

[0025] The method may further include disposing an anisotropic conductive film between the vertical portion and the flexible printed circuit board, transmitting a signal from the outside of the display panel to the first side pad through the anisotropic conductive film, and thermocompression bonding the anisotropic conductive film to connect the vertical portion to the flexible printed circuit board.

[0026] The patterned conductive material layer may further form a second signal line inside the display panel to provide a signal thereto. The patterned insulating material may further form a third guide dam on the upper surface of the substrate, the third guide dam extending in a direction from the inside of the first base substrate to the outer edge of the first base substrate to define a second conductive area between the second guide dam and the third guide dam that is open at the outer edge of the first base substrate. The method may further include moving a third portion of the conductive paste on the side surface of the substrate into a second conductive area defined between the second guide dam and the third guide dam to form a second horizontal portion of the second side pad, the second side pad being connected to the second signal line at the second conductive area and the signal being transmitted to the second signal line from outside the display panel through the second side pad.

[0027] The method may further include removing a portion of the second portion of the conductive paste remaining in the side surface region to form a vertical portion of the first side surface pad extending from the first horizontal portion thereof and disposed on the side surface of the substrate exposed to the outside of the display panel.

[0028] The method may further include providing a second base substrate facing the first base substrate of the display panel, forming an upper conductive layer and an insulating layer on a lower surface of the second base substrate; and coupling the first base substrate and the second base substrate to each other to set an upper conductive layer interposed between the first base substrate and the second base substrate and an insulating layer interposed between the upper conductive layer and the first horizontal portion.

[0029] According to the above, the signal line of the display panel is connected to the flexible printed circuit board through the side pad having a vertical portion provided on the side surface of the base substrate. Therefore, the pad area required for providing the side pad on the display panel is reduced, and thus the frame is reduced.

[0030] In addition, according to the manufacturing method of the display device, since the conductive paste moves to the connection area defined between the guide dams, the horizontal portion of the side pad can be easily formed. Therefore, the processing time, processing cost and yield of the manufacturing method of the display device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other advantages of the present disclosure will become readily apparent by reference to the following detailed description when considered in conjunction with the accompanying drawings, wherein:

[0032] Figure 1 is a perspective view showing an exemplary embodiment of a display device according to the present invention;

[0033] Figure 2 It shows that Figure 1 An enlarged exploded perspective view of a display device shown in FIG. 1 where a display panel is connected to a flexible printed circuit board;

[0034] Figure 3A It shows that Figure 2 A top plan view of an exemplary embodiment of an assembled state of a display device is shown in FIG.

[0035] Figure 3B and Figure 3C are respectively along Figure 3A sectional views taken along lines II' and II-II' shown in FIG.

[0036] Figure 4 is a cross-sectional view showing another exemplary embodiment of a display device according to the present invention;

[0037] FIG. 5A to FIG. 5H are a perspective view and a top plan view illustrating an exemplary embodiment of a method of manufacturing a display device according to the present invention;

[0038] FIG. 6A to FIG. 6C is a perspective view illustrating another exemplary embodiment of a method of manufacturing a display device according to the present invention; and

[0039] Figure 7 is a perspective view showing an exemplary embodiment of a tiled display device including more than one display device according to the present invention. DETAILED DESCRIPTION

[0040] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. The following description includes various specific details to assist in understanding, but these details are considered to be exemplary only. Therefore, it will be appreciated by those skilled in the art that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. In the accompanying drawings, the thickness of layers, films, and regions are exaggerated for clarity. The same reference numerals throughout the text refer to the same elements.

[0041] The use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.

[0042] It will be understood that the singular forms "a", "an", and "the" include plural referents unless the context clearly indicates otherwise. "At least one" is not to be construed as a limiting "a" or "an". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0043] It will be further understood that when the terms “include” and / or “including” are used in this specification, it indicates the presence of the mentioned features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0044] It will be understood that when an element or layer is referred to as being on, connected to or coupled to another element or layer, it may be directly on, directly connected to or directly coupled to another element or layer, or there may be an intermediate element or layer. On the contrary, when an element is referred to as being directly on, directly connected to or directly coupled to another element or layer, there is no intermediate element or layer. It will be understood that when an element is connected to another element, the element may be physically, electrically and / or fluidically connected to each other.

[0045] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element as shown in the figures. It will be understood that relative terms are intended to include different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures in the accompanying drawings is turned over, the elements described as being on the lower side of other elements will be oriented to be on the upper side of other elements. Therefore, depending on the specific orientation of the figure, the exemplary term "lower" may include both "lower" and "upper" orientations. Similarly, if the device in one of the figures in the accompanying drawings is turned over, the elements described as being "below" or "under" relative to other elements will be oriented to be above other elements. Therefore, the exemplary terms "below" or "under" may include both "above" and "under" orientations.

[0046] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and should not be interpreted as an ideal or overly rigid meaning unless explicitly defined herein.

[0047] Exemplary embodiments are described herein with reference to cross-sectional views as schematic diagrams of idealized embodiments. Thus, variations in the shape of the drawings due to, for example, manufacturing techniques and / or tolerances are expected. Therefore, the embodiments described herein should not be interpreted as being limited to the specific shapes of the regions as shown herein, but rather include shape deviations due to, for example, manufacturing, etc. For example, a region shown or described as flat may typically have rough and / or nonlinear features. In addition, the sharp corners shown may be rounded. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions, and are not intended to limit the scope of the claims.

[0048] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0049] The display panel of the display device includes pixels at which an image is displayed and signal lines connected to the pixels. The signal lines apply drive signals to the pixels to drive the pixels. One end (such as a far end) of the signal line is connected to a flexible printed circuit board. The flexible printed circuit board is connected between the display panel and a printed circuit board that is a controller including or being the display device. The signal lines of the display panel receive drive signals from the printed circuit board through the flexible printed circuit board.

[0050] Figure 1is a perspective view showing an exemplary embodiment of a display device 1000 according to the present invention.

[0051] refer to Figure 1 The display device 1000 includes a display panel 100, a flexible printed circuit board 200, and a printed circuit board 300. The flexible printed circuit board 200 and / or the printed circuit board 300 may be provided in plurality in the display device 1000.

[0052] The display panel 100 generates an image and displays the image through its display area DA. Components of the display panel 100 within the display area DA are operated by control signals and image data generated by the printed circuit board 300 to generate and display an image.

[0053] The display panel 100 includes a plurality of gate lines including gate lines GL1 to GLn arranged in a display area DA, a plurality of data lines including data lines DL1, DL2 and DL3 (until DLm, not shown), and a plurality of sub-pixels SPX arranged. The gate lines GL1 to GLn define their lengths extending in a first direction DR1 and the gate lines GL1 to GLn are arranged in a second direction DR2 crossing the first direction DR1. The data lines DL1 to DLm are insulated from the gate lines GL1 to GLn while crossing the gate lines GL1 to GLn. The data lines DL1 to DLm define their lengths extending in a second direction DR2 and the data lines DL1 to DLm are arranged in the first direction DR1.

[0054] When viewed in a top plan view, the display panel 100 includes a non-display area NDA defined to surround the display area DA. The sub-pixels SPX are not arranged in the non-display area NDA, and an image is not displayed through the non-display area NDA. The non-display area NDA may correspond to a frame of the display device 1000. In the top plan view, the size of the frame of the display device 1000 may be defined by the size occupied by the non-display area NDA in a plane defined by the first direction DR1 and the second direction DR2.

[0055] Each of the sub-pixels SPX is connected to a corresponding gate line among the gate lines GL1 to GLn and a corresponding data line among the data lines DL1 to DLm.

[0056] In the display area DA, the sub-pixels SPX are arranged in a matrix form along the first direction DR1 and the second direction DR2. Each sub-pixel SPX displays a primary color, such as any one of red, green and blue, but the color displayed by the sub-pixel SPX should not be limited thereto or thereby restricted. That is, in addition to the red, green and blue primary colors, the sub-pixel SPX can display a second primary color, such as yellow, cyan, magenta, etc.

[0057] A group of sub-pixels SPX together form a pixel PX. Figure 1 As an example, three sub-pixels SPX form one pixel PX, but the present invention should not be limited thereto or thereby. That is, two or four or more sub-pixels SPX may form one pixel PX.

[0058] The pixel PX corresponds to an element of the display panel 100 that uses light to generate and display a unit image within the entire image displayed by the display panel 100. The resolution of the display panel 100 is determined by the number of pixels PX arranged in the display panel 100. Figure 1 Only one pixel PX is shown, and other pixels are omitted for convenience of description.

[0059] In an exemplary embodiment, the display panel 100 may be, but is not limited to, an organic light emitting display panel, and the sub-pixel SPX may include an organic light emitting element generating light within the display panel 100. As another example, the display panel 100 may be a liquid crystal display panel, the sub-pixel SPX may include a liquid crystal layer transmitting or blocking light therethrough, and the display device 1000 may include a backlight unit disposed at the rear surface of the display panel 100 to generate light outside the display panel 100.

[0060] The display panel 100 may have a plate-like shape defined by a pair of long sides and a pair of short sides, the pair of long sides and the pair of short sides being parallel to the first direction DR1 and the second direction DR2, respectively. The display panel 100 may be disposed in a plane defined by the first direction DR1 and the second direction DR2, such as being arranged flat in such a plane, but the present invention is not limited thereto. In an exemplary embodiment, the display panel 100 may have various shapes, such as having a shape curved in at least one direction in a cross-sectional view thereof, or having at least one rounded edge when viewed in a top plan view.

[0061] The display panel 100 includes a first base substrate 110 and a second base substrate 130. The second base substrate 130 faces the first base substrate 110 and is disposed on the first base substrate 110. A liquid crystal layer or an organic light emitting element may be disposed between the first base substrate 110 and the second base substrate 130. The first base substrate 110 and the second base substrate 130 may each define an upper surface thereof, a lower surface thereof opposite to the upper surface, and a side surface connecting the upper surface and the lower surface to each other. The various layers disposed on the first base substrate 110 and the second base substrate 130 may be included in a common first display substrate and a common second display substrate, respectively.

[0062] The flexible printed circuit board 200 connects the display panel 100 and the printed circuit board 300 to each other. In an exemplary embodiment, the flexible printed circuit board 200 faces a side surface of the display panel 100. In more detail, the flexible printed circuit board 200 faces side surfaces of the first and second base substrates 110 and 130.

[0063] The flexible printed circuit board 200 overlaps the first base substrate 110 and the second base substrate 130 in the second direction DR2, and does not overlap the first base substrate 110 and the second base substrate 130 in the vertical direction. In the case where the first base substrate 110 and the second base substrate 130 are each disposed in a plane different from each other, the flexible printed circuit board 200 overlaps two different planes, so that the flexible printed circuit board 200 is considered to overlap the first base substrate 110 and the second base substrate 130 in the second direction DR2. Other elements of the display device 1000 may overlap each other in the second direction DR2 in a manner similar to that described above. The vertical direction may be a third direction DR3 substantially perpendicular to the first direction DR1 and the second direction DR2. In other words, the flexible printed circuit board 200 may not intervene between the first base substrate 110 and the second base substrate 130 and may not overlap any of the first base substrate 110 and the second base substrate 130 in a top plan view.

[0064] In an exemplary embodiment, the flexible printed circuit board 200 is provided in plurality and is arranged along a side of the display panel 100, for example, along one of the long sides extending in the first direction DR1. The number of the flexible printed circuit boards 200 should not be limited to a specific value.

[0065] As an exemplary embodiment, the flexible printed circuit board 200 may include a driving chip DC. The driving chip DC may be implemented by a tape carrier package and may include a chip in which a data driver (not shown) is implemented. The driving chip DC may further include a chip in which a gate driver is implemented. In addition, the gate driver may be provided in the non-display area NDA of the display panel 100 instead of the driving chip DC.

[0066] The printed circuit board 300 includes a controller. The controller generates and / or receives an input image signal, and converts the data format of the input image signal into a data format suitable for the interface and driving mode of the data driver, the gate driver, and the display panel 100 to generate image data. The controller outputs the image data and the control signal so that the printed circuit board 300 can output the image data and the control signal. The image data output by the printed circuit board 300 includes information for an image displayed in the display area DA of the display panel 100.

[0067] The data driver at the flexible printed circuit board 200 receives image data and control signals from the printed circuit board 300. The data driver converts the image data into data voltages in response to the control signals and applies the data voltages to the data lines DL1 to DLm of the display panel 100. The data voltages may be analog voltages corresponding to the image data.

[0068] Various electronic components may be mounted on the printed circuit board 300 to implement the controller. In an exemplary embodiment, for example, the printed circuit board 300 may include passive components (e.g., capacitors, resistors, etc.), active components (e.g., microprocessors including integrated circuits, memory chips, etc.), and wires connecting the passive components and the active components to each other.

[0069] Figure 2 It shows that Figure 1 FIG. 1 is an enlarged exploded perspective view of a region of a display device where a display panel is connected to a flexible printed circuit board.

[0070] refer to Figure 2 , the display device 1000 includes a plurality of guide dams, a plurality of signal lines and a plurality of side pads.

[0071] For ease of explanation, Figure 2 A first guide dam 411 , a second guide dam 412 , and a third guide dam 413 among the guide dams, a first signal line 431 and a second signal line 432 among the signal lines, and a first side surface pad 451 and a second side surface pad 452 among the side surface pads are shown.

[0072] In an exemplary embodiment, the first to third guide dams 411 to 413 are disposed on the substrate upper surface 111 of the first base substrate 110. The lengths of the first to third guide dams 411 to 413 extend from the (outer) edge 111a of the substrate upper surface 111 to the inner side of the substrate upper surface 111. The first to third guide dams 411 to 413 define the lengths thereof extending in the second direction DR2, and the first to third guide dams 411 to 413 are arranged at regular intervals along the first direction DR1.

[0073] In an exemplary embodiment, the display device 1000 may further include a connection insulating portion 420 disposed on the first base substrate 110. The connection insulating portion 420 may define a length thereof extending in the first direction DR1. In an exemplary embodiment, the connection insulating portion 420 may be connected to the inner ends of the first guide dam 411 to the third guide dam 413 which are distal ends relative to the edge 111a of the upper surface 111 of the substrate. The connection insulating portion 420 may be integrally provided or formed with the first guide dam 411 to the third guide dam 413. That is, the connection insulating portion 420 and the first guide dam 411 to the third guide dam 413 may be provided as a single integral member. In other words, one of the connection insulating portion 420 and the first guide dam 411 to the third guide dam 413 may extend to define the connection insulating portion 420 and the other one or all of the first guide dam 411 to the third guide dam 413.

[0074] The first connection region CA1 is defined between the first guide dam 411 and the second guide dam 412, and the second connection region CA2 is defined between the second guide dam 412 and the third guide dam 413. The first and second connection regions CA1 and CA2 may alternate with the first to third guide dams 411 to 413 in the first direction DR1.

[0075] The first side surface pad 451 includes a first horizontal portion 451 a and a first vertical portion 451 b .

[0076] In a top plan view, the first horizontal portion 451a is disposed between the first guide dam 411 and the second guide dam 412. In more detail, the first horizontal portion 451a is disposed on the substrate upper surface 111 to correspond to the first connection area CA1. The first horizontal portion 451a defines a length extending in the second direction DR2. The first horizontal portion 451a is disposed between the first base substrate 110 and the second base substrate 130 in a cross-sectional (e.g., thickness) direction such as the third direction DR3.

[0077] The first vertical portion 451b extends from an outer end of the first horizontal portion 451a adjacent to the edge 111a of the substrate upper surface 111 and disposed on the substrate side surface 112 of the first base substrate 110 connected to the edge 111a of the substrate upper surface 111. In more detail, the lower end of the first vertical portion 451b extends in a fourth direction DR4 opposite to the third direction DR3 and overlaps the first base substrate 110 in the second direction DR2. In addition, the upper end of the first vertical portion 451b extends in the third direction DR3 and overlaps the second base substrate 130 in the second direction DR2.

[0078] In an exemplary embodiment, the first vertical portion 451b may be integrally provided with the first horizontal portion 451a and may not be interposed between the first base substrate 110 and the second base substrate 130. That is, the first vertical portion 451b and the first horizontal portion 451a may be provided as a single integral member. In other words, one of the first vertical portion 451b and the first horizontal portion 451a may extend to define the other of the first vertical portion 451b and the first horizontal portion 451a.

[0079] The second side surface pad 452 includes a second horizontal portion 452a and a second vertical portion 452b. The second side surface pad 452 is disposed to be spaced apart from the first side surface pad 451 in the first direction DR1. The second guide dam 412 is interposed between the first side surface pad 451 and the second side surface pad 452.

[0080] The second horizontal portion 452a has the same shape as that of the first horizontal portion 451a, the second vertical portion 452b has the same shape as that of the first vertical portion 451b, and the connection relationship between the second horizontal portion 452a and the second vertical portion 452b is substantially the same as the connection relationship between the first horizontal portion 451a and the first vertical portion 451b. Therefore, further details of the shapes and connection relationship of the second horizontal portion 452a and the second vertical portion 452b will be omitted.

[0081] The first side pad 451 and the second side pad 452 have conductivity and include a conductive material. In an exemplary embodiment, the conductive material may include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca, LiF / Al, Mo, Ti, a compound thereof, or a combination thereof (e.g., a combination of Ag and Mg). In addition, the conductive material may include a conductive polymer, a transparent metal oxide, graphene, a metal nanowire, or a combination thereof.

[0082] The first signal line 431 and the second signal line 432 may be a first data line DL1 and a second data line DL2 (refer to Figure 1 ). The first signal line 431 and the second signal line 432 define their lengths extending along the second direction DR2 on the substrate upper surface 111. As another example, the first signal line 431 and the second signal line 432 may be gate lines GL1 to GLn (see Figure 1 ) in the two gate lines.

[0083] The first signal line 431 is connected to the first side pad 451. In an exemplary embodiment, the distal first end 431a of the first signal line 431 extends to the edge 111a in the length direction of the first signal line 431 and is disposed in the first connection area CA1. The distal first end 431a overlaps and is connected to the first horizontal portion 451a in the third direction DR3.

[0084] In exemplary embodiments, the first signal line 431 may be disposed between the first horizontal portion 451 a and the first base substrate 110 .

[0085] The second signal line 432 is disposed to be spaced apart from the first signal line 431 in the first direction DR1. The second guide dam 412 is interposed between the first signal line 431 and the second signal line 432.

[0086] The second signal line 432 is connected to the second side pad 452. In an exemplary embodiment, the distal second end 432a of the second signal line 432 extends to the edge 111a in the length direction of the second signal line 432 and is disposed in the second connection area CA2. The distal second end 432a overlaps with the second horizontal portion 452a in the third direction DR3 and is connected to the second horizontal portion 452a.

[0087] In exemplary embodiments, the second signal line 432 may be disposed between the second horizontal portion 452 a and the first base substrate 110 .

[0088] Figure 3A It shows that Figure 2 A top plan view of an exemplary embodiment of an assembled state of a display device is shown in FIG. 1 , and Figure 3B and Figure 3C are respectively along Figure 3A sectional views taken along lines II' and II-II' are shown in FIG.

[0089] The first side pad 451 and the second side pad 452 have similar structures and functions, and therefore, in the following, only reference will be made to FIG. 3A to FIG. 3C The first side surface pads 451 are described, and a detailed description of the second side surface pads 452 will be omitted.

[0090] The first horizontal portion 451 a , the connection insulating portion 420 , and the first and second guide dams 411 and 412 may each define an upper surface thereof, a lower surface thereof opposite to the upper surface, and a side surface connecting the upper and lower surfaces to each other.

[0091] refer to FIG. 3A to FIG. 3C, among the side surfaces of the first guide dam 411 and the second guide dam 412, the side surface thereof facing the first horizontal portion 451a may be in contact with the side surface of the first horizontal portion 451a. In addition, among the side surfaces of the connecting insulating portion 420, the side surface thereof facing the first horizontal portion 451a may be in contact with the side surface of the first horizontal portion 451a. When viewed in a top plan view, the first guide dam 411 and the second guide dam 412 and the connecting insulating portion 420 surround the distal end of the first horizontal portion 451a. In the illustrated exemplary embodiment, when viewed in a top plan view, the first guide dam 411 and the second guide dam 412 and the connecting insulating portion 420 expose the first vertical portion 451b. In other words, the first guide dam 411 and the second guide dam 412 and the connecting insulating portion 420 do not surround the first vertical portion 451b.

[0092] The display device 1000 may further include an upper conductive layer 131 and an insulating layer 132 disposed on the lower surface of the second base substrate 130 facing the first base substrate 110. The upper conductive layer 131 may be, but is not limited to, a common electrode disposed or formed on the entire lower surface of the second base substrate 130. The upper conductive layer 131 may include Li, Ca, LiF / Ca, LiF / Al, Al, Mg, BaF, Ba, Ag, a compound thereof, or a combination thereof (e.g., a combination of Ag and Mg), or a transparent metal oxide, such as indium tin oxide ("ITO"), indium zinc oxide ("IZO"), zinc oxide ("ZnO"), zinc indium tin oxide ("ITZO"), etc.

[0093] At least a portion of the upper conductive layer 131 is disposed between the insulating layer 132 and the second base substrate 130. At least a portion of the upper conductive layer 131 faces the first horizontal portion 451a such that the insulating layer 132 is disposed between the upper conductive layer 131 and the first horizontal portion 451a.

[0094] In an exemplary embodiment, the insulating layer 132 is disposed on the connection insulating portion 420, the first to third guide dams 411 to 413, and the first and second horizontal portions 451a and 452a. At least a portion of the insulating layer 132 is disposed between the first horizontal portion 451a and the upper conductive layer 131 to insulate the first horizontal portion 451a from the upper conductive layer 131. The insulating layer 132 has a single-layer structure of an organic layer or an inorganic layer or a multi-layer structure of an organic layer and / or an inorganic layer.

[0095] A portion of the lower surface of the insulating layer 132 defines a boundary or edge of the first connection area CA1. The upper surface of the horizontal portion 451a contacts the portion of the lower surface of the insulating layer 132 that defines the boundary or edge of the first connection area CA1. In an exemplary embodiment, the first horizontal portion 451a has a first thickness th1 corresponding to a total distance or a maximum distance between the lower surface of the first horizontal portion 451a and the lower surface of the insulating layer 132.

[0096] As described above, the lower end of the first vertical portion 451b extends in the fourth direction DR4 and overlaps the first base substrate 110 in the second direction DR2. In addition, the upper end of the first vertical portion 451b extends in the third direction DR3 and overlaps the insulating layer 132 and the second base substrate 130 in the second direction DR2.

[0097] In an exemplary embodiment, the first vertical portion 451b has a second thickness th2. The second thickness th2 corresponds to a distance between the substrate side surface 112 and the outer side surface 451_OS of the first vertical portion 451b.

[0098] In an exemplary embodiment, the flexible printed circuit board 200 overlaps the first vertical portion 451b in the second direction DR2. In more detail, the outer side surface 451_OS of the first vertical portion 451b faces the flexible printed circuit board 200 (along the Figure 3C The lower surface of the first end of the third direction DR3).

[0099] In an exemplary embodiment, the display device 1000 further includes an anisotropic conductive film 210. The anisotropic conductive film 210 is disposed between the outer side surface 451_OS of the first vertical portion 451b and the lower surface of one end of the flexible printed circuit board 200 to connect the first vertical portion 451b and the flexible printed circuit board 200 to each other. Therefore, the first signal line 431 is connected to the flexible printed circuit board 200 through the first side pad 451. The anisotropic conductive film 210 includes an adhesive resin and conductive members therein, such as a plurality of conductive balls distributed in the adhesive resin.

[0100] In an exemplary embodiment, the flexible printed circuit board 200 may be bent from the substrate side surface 112 (not shown) so that the first end (along the side surface) opposite to the first end of the flexible printed circuit board 200 is bent. Figure 3C The second end of the substrate 100 in the fourth direction DR4 faces the rear surface of the first base substrate 110 (eg, Figure 3C The farthest surface of the first base substrate 110 in the fourth direction DR4).

[0101] In an exemplary embodiment, the anisotropic conductive film 210 may be disposed on the entire surface of the outer side surface 451_OS of the first vertical portion 451b. In the case where the anisotropic conductive film 210 is located on the entire surface of the outer side surface 451_OS, the anisotropic conductive film 210 may overlap the first base substrate 110, the first horizontal portion 451a, the insulating layer 132, and the second base substrate 130 in the second direction DR2. Accordingly, the contact area between the anisotropic conductive film 210 and the first vertical portion 451b is increased, and thus a processing margin for connecting the anisotropic conductive film 210 and the flexible printed circuit board 200 to each other is obtained.

[0102] In an exemplary embodiment, the display device 1000 may further include a sealing member 120. The sealing member 120 is disposed between the first base substrate 110 and the second base substrate 130 and is disposed along the edges of the first base substrate 110 and the second base substrate 130. The sealing member 120 couples the first base substrate 110 and the second base substrate 130 to each other. In an exemplary embodiment, the sealing member 120 includes a material having adhesiveness. The sealing member 120 is spaced apart from the connection insulating portion 420 and the insulating layer 132 in the second direction DR2.

[0103] As described above, the flexible printed circuit board 200 disposed outside the plane area of ​​the display panel 100 is connected to the first signal line 431 and the second signal line 432 disposed inside the plane area of ​​the display panel 100 through the first side pad 451 and the second side pad 452, respectively. Since a portion of the first side pad 451 and the second side pad 452 and the flexible printed circuit board 200 are outside the plane area of ​​the display panel 100 and face the side surface (e.g., 112) of the display panel 100, these portions do not contribute to the plane area of ​​the pad area where the flexible printed circuit board 200 and the display panel 100 are connected to each other within the plane area of ​​the display panel 100 (e.g., in a plane defined along the first direction DR1 and the second direction DR2). Therefore, the pad area required to connect the first signal line 431 and the second signal line 432 of the flexible printed circuit board 200 and the display panel 100 to each other can be reduced. As a result, the frame of the display device 1000 can become relatively thin. That is, the size of the bezel in a plane defined in the first direction DR1 and the second direction DR2 and inside a plane area of ​​the display panel 100 may be reduced.

[0104] The first to third guide dams 411 to 413 insulate the first and second side pads 451 and 452 from each other, and therefore, it is possible to reduce or effectively prevent an electrical short circuit between the first signal line 431 and the second signal line 432. In addition, since the first signal line 431 and the second signal line 432 overlap with the first and second side pads 451 and 452, respectively, in the third direction DR3 and are connected to the first and second side pads 451 and 452 over a relatively large area, the first signal line 431 and the second signal line 432 are effectively connected to the first and second side pads 451 and 452, and the connection electrical impedance between the first and second signal lines 431 and 432 and the first and second side pads 451 and 452 can be controlled and improved.

[0105] In addition, in the method of manufacturing the display device 1000, as described below, since the first side pad 451 and the second side pad 452 are relatively easily formed by using the first to third guide dams 411 to 413, the processing time, processing cost and production volume of the manufacturing method of the display device 1000 can be improved.

[0106] Figure 4 is a cross-sectional view showing another exemplary embodiment of a display device according to the present invention.

[0107] exist Figure 4 The cross-sectional view shown in FIG. Figure 3A The cross-sectional view taken along the line II-II' shown in FIG. Figure 3C Have the same directional orientation. Figure 4 , for the first side pad (e.g., Figure 2 451 in the figure), the first horizontal portion 451c may not contact the connection insulating portion 420 and / or the insulating layer 132. In the case where the first horizontal portion 451c is separated from the connection insulating portion 420 and / or the insulating layer 132, the first horizontal portion 451c has a thickness smaller than the first thickness th1 and the thickness of the first connection region CA1 in the third direction DR3 (refer to Figure 3C ) has a third thickness th3.

[0108] For the first side pad including the above-mentioned first horizontal portion 451c, the first vertical portion 451d is only arranged on the substrate side surface 112 (for example, in the plane of the first base substrate 110), and does not overlap with the insulating layer 132 and the second base substrate 130 in the second direction DR2 (for example, not in the plane of the insulating layer 132 and the second base substrate 130).

[0109] In an exemplary embodiment, the anisotropic conductive film 210 may be disposed on the entire outer side surface 451_OD of the first vertical portion 451d of the first side surface pad. In this case, the anisotropic conductive film 210 overlaps the first base substrate 110 in the second direction DR2 and does not overlap the insulating layer 132 and the second base substrate 130 in the second direction DR2.

[0110] In the exemplary embodiment shown, the first horizontal portion 451c of the first side surface pad may be disposed on the first end 431a of the distal end of the first signal line 431 (e.g., above along the third direction DR3), but should not be limited thereto or thereby. In an alternative exemplary embodiment, the first horizontal portion 451c may be interposed between the first end 431a of the distal end of the first signal line 431 and the first base substrate 110.

[0111] FIG. 5A to FIG. 5H 2 is a perspective view illustrating an exemplary embodiment of a process in a method of manufacturing a display device according to the present invention. FIG. 5A to FIG. 5H The structure of Figure 1 and Figure 2 And obtain.

[0112] refer to Figure 1 , Figure 2 and Figure 5A In order to form the first display substrate, the first signal line 431 and the second signal line 432 are formed on the substrate upper surface 111 of the first base substrate 110. In an exemplary embodiment, the first signal line 431 and the second signal line 432 are formed by forming a conductive material layer on the entire surface of the first base substrate 110 and patterning the conductive material layer. The conductive material layer includes the conductive material mentioned above. In an exemplary embodiment, the conductive material layer is patterned by a photolithography process.

[0113] In an exemplary embodiment, among the layers of the first display substrate disposed on the first base substrate 110, the first signal line 431 and the second signal line 432 are disposed in a layer corresponding to the layer in which the driving sub-pixel SPX is disposed (refer to Figure 1 ) is in the same layer as the drain electrode or gate electrode of the driving transistor. During the patterning process of forming the drain electrode and the gate electrode, the first signal line 431 and the second signal line 432 can be formed together with the drain electrode and the gate electrode without a separate additional process.

[0114] like Figure 5BAs shown in , the first guide dam 411 to the third guide dam 413 and the connecting insulating portion 420 are formed on the first base substrate 110. The first guide dam 411 to the third guide dam 413 and the connecting insulating portion 420 are formed by forming an insulating material layer on the entire surface of the first base substrate 110 having the first signal line 431 and the second signal line 432 thereon, and patterning the insulating material layer. The insulating material layer includes any of a large number of insulating materials suitable for the purposes described herein. In an exemplary embodiment, the insulating material layer is patterned by a photolithography process.

[0115] In an exemplary embodiment, among the layers of the first display substrate disposed on the first base substrate 110, the first to third guide dams 411 to 413 may be disposed in the same layer as a layer in which a gate insulating layer of a driving transistor driving the sub-pixel SPX is disposed (refer to Figure 1 or an intermediate insulating layer interposed between the driving transistor and the pixel electrode of the sub-pixel SPX). In an exemplary embodiment, during a patterning process for forming the gate insulating layer or the intermediate insulating layer, the first to third guide dams 411 to 413 may be formed together with the gate insulating layer or the intermediate insulating layer without a separate additional process.

[0116] refer to Figure 5C , such as a second base substrate 130 having a layer of a second display substrate thereon (e.g., 131, 132, etc.) coupled to a first base substrate 110 having a layer of a first display substrate thereon. The side surfaces of the first base substrate 110 and the second base substrate 130 at their outer edges are exposed to the outside of the first base substrate 110 and the second base substrate 130. In a case where the second base substrate 130 is coupled to the first base substrate 110 and the outer side surfaces thereof are exposed, the mask MK is aligned with the exposed side surfaces of the first base substrate 110 and the second base substrate 130, such as being arranged to overlap with the planes of the first base substrate 110 and the second base substrate 130.

[0117] Although not shown in the drawings, an upper conductive layer 131 and an insulating layer 132 are formed on a lower surface of the second base substrate 130 as layers of a common second display substrate.

[0118] The mask MK includes openings OP (also referred to as "plural openings OP") defined therethrough and arranged along the first direction DR1, which are provided in plurality. In an exemplary embodiment, the mask MK is aligned so that the openings OP of the mask MK correspond to the first connection area CA1 and the second connection area CA2, respectively. In the case where the mask MK is aligned as described above, the openings OP overlap the first connection area CA1 and the second connection area CA2 in the second direction DR2. That is, the openings OP are provided in the same plane as the first connection area CA1 and the second connection area CA2 (e.g., the planes of 420, 411, 412, and 413).

[0119] In an exemplary embodiment, the inner side surface of the mask MK may be in contact with the first base substrate 110 and the second base substrate 130. That is, the innermost surface of the mask MK in the second direction DR2 may be in contact with the exposed outer side surfaces of the first base substrate 110 and the second base substrate 130. In the case where the mask MK is in contact with the first base substrate 110 and the second base substrate 130, a space may be formed around the first signal line 431 and the second signal line 432 at the first connection area CA1 and the second connection area CA2. The space may be defined by the side surfaces of the connection insulating portion 420 and the first to third guide dams 411 to 413, the lower surface of the insulating layer 132, and the upper surface of the first base substrate 110, but the present invention is not limited thereto.

[0120] The conductive paste CP is disposed on the entire surface of the outer side surface MS of the mask MK opposite to the inner side surface thereof. The conductive paste CP includes a conductive material and has fluidity and viscosity. The conductive paste CP is uniformly coated on the outer side surface MS of the mask MK.

[0121] refer to Figure 5D , the conductive paste CP disposed on the entire surface of the outer side surface MS of the mask MK is inserted into the first connection area CA1 and the second connection area CA2 through the opening OP of the mask MK, while the mask MK is in contact with the first base substrate 110 and the second base substrate 130. In an exemplary embodiment, the conductive paste CP may be moved from the outer side surface MS to the opening OP by the squeezer SQ to allow the conductive paste CP to be effectively inserted into the first connection area CA1 and the second connection area CA2 from the outer side surface MS. The squeezer SQ may move along the first direction DR1 and / or the direction opposite thereto while moving the conductive paste CP along the outer side surface MS.

[0122] refer to Figure 5E, the conductive paste CP inserted into the first connection area CA1 and the second connection area CA2 from the outside of the first base substrate 110 and the second base substrate 130 moves along the space defined at the first connection area CA1 and the second connection area CA2. Figure 5E The conductive paste CP moves in the second direction DR2 (indicated by the hollow arrow in the figure). Therefore, the conductive paste CP contacts and is connected to the first end 431a of the distal end of the first signal line 431 and the second end 432a of the distal end of the second signal line 432. The moving conductive paste CP is guided by the side walls of the first guide dam 411 to the third guide dam 413. The side surface of the connecting insulating portion 420 at the innermost side of the first connection area CA1 and the second connection area CA2 limits the movement of the conductive paste CP in the second direction DR2 to reduce or effectively prevent the conductive paste CP from crossing the connecting insulating portion 420 and entering the interior of the first base substrate 110. In an exemplary embodiment, as the conductive paste moves in the second direction DR2 in the space at the first connection area CA1 and the second connection area CA2, the space at the first connection area CA1 and the second connection area CA2 may be filled with the conductive paste CP, such as completely filled with the conductive paste CP.

[0123] In the exemplary embodiment shown, the conductive paste CP moves by capillary phenomenon. In more detail, an adhesive force is generated between the first guide dam 411 to the third guide dam 413 and the conductive paste CP, and the conductive paste CP moves in the space at the first connection area CA1 and the second connection area CA2 in the second direction DR2 by the adhesive force. To this end, the shapes and materials of the first guide dam 411 to the third guide dam 413 and the material of the conductive paste CP can be determined in various ways so that the adhesive force therebetween becomes greater than the cohesive force of the conductive paste CP. That is, the adhesive force within the material of the conductive paste CP is smaller than the adhesive force between the conductive paste CP and the first guide dam 411 to the third guide dam 413.

[0124] In an exemplary embodiment, the conductive paste CP may be effectively moved using gravity. In more detail, when the first base substrate 110 and the second base substrate 130, which are initially disposed in a plane defined along the first direction DR1 and the second direction DR2, are disposed or rotated so that the length of the first guide dam 411 to the third guide dam 413 (e.g., the second direction DR2) is substantially parallel to the gravity direction, the conductive paste CP flows downward from the outside of the first base substrate 110 and the second base substrate 130 and along the length of the first guide dam 411 to the third guide dam 413 (e.g., in the second direction DR2) due to gravity.

[0125] refer to Fig. 5F and Figure 5GIn the portion of the conductive paste CP transferred to and passing through the opening OP, the conductive paste portion CP1 filled in the first connection area CA1 and the second connection area CA2 is solidified, and thus the first horizontal portion 451a and the second horizontal portion 452a are formed (refer to Figure 2 The conductive paste portion CP1 terminates at outer edges of the first and second base substrates 110 and 130. The curing of the conductive paste portion CP1 may be processed while the mask MK is still in contact with the outer side surfaces of the first and second base substrates 110 and 130.

[0126] In addition, since the mask MK is disposed outside the first base substrate 110 and the second base substrate 130, a portion of the conductive paste CP transferred into the opening OP may remain outside the first base substrate 110 and the second base substrate 130. In the portion of the conductive paste CP transferred into and passing through the opening OP, the conductive paste portion CP2 remaining in the opening OP of the mask MK is cured while the mask MK is in contact with the outer side surfaces of the first base substrate 110 and the second base substrate 130 to form the first vertical portion 451b and the second vertical portion 452b disposed outside the first base substrate 110 and the second base substrate 130 (refer to Figure 2 ). In the case where the conductive paste portion CP2 is solidified while remaining in the opening OP, the overall shape of the first vertical portion 451b and the second vertical portion 452b may be determined according to the overall shape of the opening OP provided outside the first base substrate 110 and the second base substrate 130. The thickness of the first vertical portion 451b and the second vertical portion 452b taken in the second direction DR2 may be determined according to the amount of the conductive paste CP2 remaining outside the first base substrate 110 and the second base substrate 130 and in the opening OP along the second direction DR2.

[0127] Since the first horizontal portion 451a and the second horizontal portion 452a and the first vertical portion 451b and the second vertical portion 452b are all formed of the same conductive paste material layer, the first side pad 451 and the second side pad 452 (see Figure 2 ) may be a single integral (e.g., one-piece) member. The entire first vertical portion 451b and the second vertical portion 452b may be disposed outside the first base substrate 110 and the second base substrate 130 so that the outer surfaces of the first vertical portion 451b and the second vertical portion 452b (see Figure 3C 451_OS) in the substrate is exposed to the outside of the first base substrate 110 and the second base substrate 130.

[0128] refer to Figure 5H, the anisotropic conductive film 210 is interposed between the exposed outer surfaces of the first vertical portion 451b and the second vertical portion 452b and the inner surface of the flexible printed circuit board 200. The first side pad 451 and the second side pad 452 are connected to the flexible printed circuit board 200 with the anisotropic conductive film 210 interposed therebetween. In an exemplary embodiment, pressure and heat may be applied to the anisotropic conductive film 210 interposed between the first vertical portion 451b and the second vertical portion 452b and the flexible printed circuit board 200 in the second direction DR2 to thermocompressively bond the anisotropic conductive film 210, thereby connecting the first side pad 451 and the second side pad 452 to the flexible printed circuit board 200. In an exemplary embodiment, the anisotropic conductive film 210 connects the first side pad 451 and the second side pad 452 to pads (not shown) of the flexible printed circuit board 200 that are insulated from each other.

[0129] As described above, the first and second horizontal portions 451a and 452a may be effectively formed by using the first to third guide dams 411 to 413 previously provided on the first base substrate 110. Thus, the process time, process cost, and yield of the manufacturing method of the display device 1000 may be improved.

[0130] FIG. 6A to FIG. 6C is a perspective view illustrating a process in another exemplary embodiment of a method of manufacturing a display device according to the present invention.

[0131] In addition to the mask (ref. Figure 5C In addition to aligning the exposed side surfaces of the first base substrate 110 and the second base substrate 130, FIG. 6A to FIG. 6C An exemplary embodiment of a method of manufacturing a display device shown in FIG. 5A to FIG. 5C Those treatments shown in .

[0132] exist Fig. 6A In the embodiment, a second base substrate 130 such as having a layer of a second display substrate thereon (e.g., 131, 132, etc.) is coupled to a first base substrate 110 having a layer of a first display substrate thereon. At least the side surfaces of the first base substrate 110 and the second base substrate 130 at their outer edges are exposed to the outside of the first base substrate 110 and the second base substrate 130.

[0133] refer to Fig. 6A, in the case where the second base substrate 130 is coupled to the first base substrate 110 and the outer side surface thereof is exposed, the conductive paste CP may be coated on the side surface area AA defined on the exposed substrate side surface 112 of the first base substrate 110. In an exemplary embodiment, the side surface area AA adjacent to the substrate side surface 112 is defined at the side surface of the display panel 100, and thus includes areas corresponding to the exposed side surfaces of the first to third guide dams 411 to 413, the exposed side surface of the insulating layer 132, and the exposed side surfaces of the first and second base substrates 110 and 130.

[0134] As described above, with the conductive paste CP coated on the first to third guide dams 411 to 413, the insulating layer 132, and the exposed side surfaces of the first and second base substrates 110 and 130 at the side surface area AA, the conductive paste CP moves from the outer surface to the inside of the space formed around the first and second signal lines 431 and 432 at the first and second connection areas CA1 and CA2. In an exemplary embodiment, as the conductive paste CP moves in the second direction DR2 within the space at the first and second connection areas CA1 and CA2, the space at the first and second connection areas CA1 and CA2 is filled with the conductive paste CP, such as completely filled with the conductive paste CP.

[0135] refer to Figure 6B , in addition to a portion of the conductive paste CP transferred to the space at the first connection area CA1 and the second connection area CA2, a portion of the conductive paste CP3 also remains on the substrate side surface 112 at the side surface area AA which is set outside the elements of the first display substrate and the second display substrate. The portion of the conductive paste CP3 remaining on the substrate side surface 112 at the side surface area AA can be removed. In more detail, a portion CP4 of the remaining conductive paste CP3 that overlaps with the first guide dam 411 to the third guide dam 413 in the second direction DR2 is removed, and the first guide dam 411 to the third guide dam 413 are exposed to the outside of the first display substrate and the second display substrate. As a result, the portion CP5 of the conductive paste CP3 that is not removed becomes the first vertical portion 451b of the first side pad 451 and the second vertical portion 452b of the second side pad 452 (refer to Figure 2 ). Therefore, with the removal of this part, the Figure 6C The first vertical portion 451b and the second vertical portion 452b are shown in FIG.

[0136] Once the first vertical portion 451b of the first side pad 451 and the second vertical portion 452b of the second side pad 452 are formed, Figure 5HAs described above, the anisotropic conductive film 210 connects the first side surface pads 451 and the second side surface pads 452 to pads (not shown) of the flexible printed circuit board 200 that are insulated from each other.

[0137] As above for FIG. 6A to FIG. 6C As described above, the first horizontal portion 451a and the second horizontal portion 452a can be effectively formed by using the first to third guide dams 411 to 413 pre-set on the first base substrate 110. Thus, the processing time, processing cost and yield of the manufacturing method of the display device 1000 can be improved.

[0138] Figure 7 is a perspective view showing an exemplary embodiment of a tiled display device including more than one display device according to the present invention.

[0139] refer to Figure 7 , the display devices 1000 are arranged in a plurality and coupled to each other to form a spliced ​​display device TD that displays a relatively large overall image. The display devices 1000 are arranged in an M×N matrix (each of M and N is a natural number) and coupled to each other. As described above, because the flexible printed circuit board 200 (reference Figure 3C ) through the first side pad 451 and the second side pad 452 (reference Figure 3C ) is connected to the first signal line 431 and the second signal line 432 of the display panel 100 (see Figure 3C ), the non-display area NDA (e.g., a frame) of each of the display devices 1000 can become relatively small. Therefore, the boundary between adjacent display devices 1000 within the spliced ​​display device TD is not perceived by the user of the spliced ​​display device TD, and thus the spliced ​​display device TD displays a seamless relatively large image. As a result, since the boundary between adjacent display devices 1000 within the spliced ​​display device TD is not perceived by the user, the display quality of the spliced ​​display device TD can be improved.

[0140] Although exemplary embodiments of the present invention have been described, it should be understood that the present invention should not be limited to these exemplary embodiments, but those skilled in the art may make various changes and modifications within the spirit and scope of the present invention as claimed below.

Claims

1. A method for manufacturing a display device, comprising: forming a conductive material layer on a substrate upper surface of a first base substrate of a display panel that generates an image using a signal provided to the display panel, wherein the first base substrate defines an outer edge of the first base substrate and a substrate upper surface of the first base substrate, at which a substrate side surface of the first base substrate is exposed to the outside of the display panel, and the substrate upper surface is connected to the outer edge of the first base substrate; patterning the conductive material layer to form a first signal line inside the display panel to provide a signal thereto; forming an insulating material layer on the first signal line on the upper surface of the substrate; Patterning the insulating material layer to form a first guide dam and a second guide dam on the upper surface of the substrate, the first guide dam and the second guide dam both extending in a direction from the interior of the first base substrate to the outer edge of the first base substrate to define a first conductive region between the first guide dam and the second guide dam that is open at the outer edge of the first base substrate; providing a conductive paste to the substrate-side surface of the first base substrate exposed to the outside of the display panel; and A first portion of the conductive paste on the side surface of the substrate is moved into the first conductive area defined between the first guide dam and the second guide dam to form a first horizontal portion of a first side pad, wherein the first side pad is connected to the first signal line at the first conductive area and the signal is transmitted from the outside of the display panel to the first signal line through the first side pad.

2. The method according to claim 1, wherein: Moving the first portion of the conductive paste into the first conductive region includes using an adhesive force between the conductive paste and side surfaces of the first and second guide dams at the first conductive region.

3. The method according to claim 2, wherein: Moving the first portion of the conductive paste into the first conductive region further comprises: the first base substrate is disposed such that the first guide dam and the second guide dam extending in a direction from the inner portion of the first base substrate to the outer edge of the first base substrate to define the first conductive region between the first guide dam and the second guide dam are disposed parallel to a gravity direction, and The first portion of the conductive paste is moved using the adhesive force and gravity.

4. The method according to claim 2, wherein: Adhesion force within a material of the conductive paste is smaller than adhesion force between the conductive paste and the first and second guide dams.

5. The method according to claim 1, wherein Providing the conductive paste includes: providing a mask including an opening; aligning the opening of the mask on the side surface of the substrate to overlap the first conductive region; as well as coating the conductive paste on the mask; and The first portion of the applied conductive paste moves into the first conductive region through the opening of the mask aligned with the first conductive region.

6. The method according to claim 5, further comprising: A vertical portion of the first side surface pad is formed, the vertical portion extending from the horizontal portion of the first side surface pad and disposed on a side surface of the substrate exposed to the outside of the display panel.

7. The method according to claim 6, wherein moving the first portion of the applied conductive paste through the opening of the mask into the first conductive region, disposing a second portion of the applied conductive paste remaining in the opening that is different from the first portion of the applied conductive paste, and The vertical portion forming the first side pad includes: The second portion of the conductive paste remaining in the opening is cured to form the vertical portion from the second portion of the conductive paste.

8. The method according to claim 6, further comprising: An anisotropic conductive film is disposed between the vertical portion of the first side pad and the flexible printed circuit board, and the signal is transmitted from the outside of the display panel to the first side pad through the anisotropic conductive film; and The anisotropic conductive film is thermocompression bonded to connect the vertical portion of the first side pad to the flexible printed circuit board.

9. The method according to claim 8, wherein The conductive material layer is patterned to further form a second signal line inside the display panel to provide the signal thereto, and patterning the insulating material layer to further form a third guide dam on the upper surface of the substrate, the third guide dam extending in a direction from the inner portion of the first base substrate to the outer edge of the first base substrate to define a second conductive region between the second guide dam and the third guide dam that is open at the outer edge of the first base substrate, Further including moving a third portion of the conductive paste on the side surface of the substrate into the second conductive region defined between the second guide dam and the third guide dam to form a second horizontal portion of a second side pad, wherein the second side pad is connected to the second signal line at the second conductive region and the signal is transmitted from outside the display panel to the second signal line through the second side pad.

10. The method according to claim 1, wherein moving the first portion of the applied conductive paste into the first conductive region, disposing a second portion of the applied conductive paste different from the first portion of the applied conductive paste remaining on the substrate side surface of the first base substrate, Further including removing a portion of the second portion of the conductive paste remaining on the substrate side surface of the first base substrate to form a vertical portion of the first side pad, the vertical portion extending from the first horizontal portion of the first side pad and disposed on the substrate side surface exposed to the outside of the display panel.

11. The method according to claim 1, further comprising: providing a second base substrate of the display panel facing the first base substrate; forming an upper conductive layer and an insulating layer on a lower surface of the second base substrate; as well as The first base substrate and the second base substrate are coupled to each other to dispose the upper conductive layer interposed between the first base substrate and the second base substrate and the insulating layer interposed between the upper conductive layer and the first horizontal portion formed on the first base substrate.

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