Microphone structure and electronic equipment with back cavity enhancement

Abstract

The present invention relates to the field of micro-electromechanical technology, and in particular to a back cavity enhanced microphone structure and electronic device, which comprises: a first layer of board, a groove is arranged on the first layer of board, an acoustic sensor is installed above the groove through a support, the acoustic sensor is provided with a back cavity, the back cavity faces the support, and a through hole is arranged on the support for penetrating the back cavity and the groove; a second layer of board, which is covered on the top of the first layer of board, and an acoustic through hole is arranged on the second layer of board; the first layer of board and the second layer of board constitute a microphone acoustic cavity. The technical solution of the present invention has the beneficial effect of: disclosing a back cavity enhanced microphone structure and electronic device, which has low cost, simple manufacturing process, effectively expands the volume of the back cavity, improves the sensitivity inside the microphone structure, enhances the acoustic performance of the microphone structure, and makes the sound quality received by the electronic product better.

Description

Technical Field

[0001] The present invention relates to the field of micro-electromechanical technology, and in particular to a microphone structure and electronic equipment with back cavity enhancement. Background Art

[0002] With the development of mobile multimedia technology, electronic products are constantly moving towards miniaturization and integration. In electronic products in the field of electroacoustics, microphones are used to convert sound signals into electrical signals. In recent years, microphone structures have been widely used in electronic devices such as mobile phones, headphones, laptops, and cameras.

[0003] When electronic equipment is working, it is usually in a complex electric field environment and is often affected by external electrical interference. When the microphone structure is further reduced, the back cavity space formed inside is also very small. In the limited space, the sensitivity inside the microphone structure is reduced, and the sound quality received by the electronic product is reduced. In addition, the manufacturing process is more troublesome and the cost is relatively high. Therefore, improving the acoustic performance of the microphone structure has become a hot topic of research. Summary of the invention

[0004] In view of the above problems existing in the prior art, a microphone structure and an electronic device with back cavity enhancement are provided to improve the acoustic performance of the microphone structure.

[0005] The specific technical solutions are as follows:

[0006] A cavity-reinforced microphone structure, comprising:

[0007] A first layer board, wherein a groove is arranged on the first layer board, an acoustic sensor is installed above the groove through a support member, the acoustic sensor is provided with a back cavity, the back cavity faces the support member, and a through hole is arranged on the support member for penetrating the back cavity and the groove;

[0008] A second layer of plate is covered on the first layer of plate, and an acoustic through hole is arranged on the second layer of plate;

[0009] The first layer of board and the second layer of board form a microphone acoustic cavity.

[0010] Preferably, a plurality of the through holes may be provided on the support member.

[0011] Preferably, the first layer board is also connected to a circuit chip.

[0012] Preferably, the first layer board is a printed circuit board, and a solder pad is arranged at the bottom of the printed circuit board.

[0013] Preferably, the acoustic sensor is connected to the circuit chip via leads.

[0014] Preferably, the groove is obtained by an etching process.

[0015] Preferably, the support member is a metal sheet.

[0016] An electronic device comprises the above-mentioned back cavity enhanced microphone structure.

[0017] The beneficial effect of the technical solution of the present invention is that a microphone structure and electronic equipment with enhanced back cavity are disclosed, which has low cost and simple manufacturing process, effectively expands the volume of the back cavity, improves the sensitivity inside the microphone structure, enhances the acoustic performance of the microphone structure, and makes the sound quality received by electronic products better. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The embodiments of the present invention will be described more fully with reference to the attached drawings, which are provided for illustration and description only and are not intended to limit the scope of the present invention.

[0019] Figure 1 The overall structure diagram of the microphone structure with back cavity enhancement of the present invention;

[0020] Figure 2 It is a front view of a microphone structure with back cavity enhancement in the implementation of the present invention. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0023] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0024] The present invention includes a microphone structure with back cavity enhancement, which includes:

[0025] A first layer board 1, a groove 10 is provided on the first layer board 1, an acoustic sensor 12 is installed above the groove 10 through a support member 11, the acoustic sensor 12 is provided with a back cavity 120, the back cavity 120 faces the support member 11, and a through hole 110 is provided on the support member 11 for penetrating the back cavity 120 and the groove 10;

[0026] The second layer plate 2 is covered on the first layer plate 1, and an acoustic through hole 20 is provided on the second layer plate 2;

[0027] The first layer board 1 and the second layer board 2 form a microphone acoustic cavity 3 .

[0028] The microphone structure and electronic device enhanced by the back cavity, such as Figure 1 As shown, first, the acoustic sensor 10 is used to convert the sound wave signal into a voltage signal, and the circuit chip 11 processes the output voltage signal and performs analog-to-digital conversion to finally obtain a digital signal;

[0029] Furthermore, a groove 10 is provided on the first layer of the board 1, and the groove 10 is etched by an etching process. The acoustic sensor 12 is provided with a back cavity 120, and a through hole 110 penetrates the back cavity 120 and the groove 10. The cost is low and the manufacturing process is simple. The volume of the back cavity 120 is effectively expanded, the sensitivity inside the microphone structure is improved, and the acoustic performance of the microphone structure is enhanced. Furthermore, the first layer of the board 1 and the second layer of the board 2 form a microphone acoustic cavity 3, and the acoustic through hole 20 connects the interior of the microphone acoustic cavity 3 with the outside world, and finally transmits the sound signal to the outside world, so that the sound quality received by the electronic product is better.

[0030] In a preferred embodiment, a plurality of through holes 110 may be provided on the support member 11 .

[0031] Specifically, in this embodiment, Figure 2 As shown, a groove 10 is provided on the first layer board 1, and an acoustic sensor 12 is installed above the groove 10 through a support member 11. The acoustic sensor 12 is provided with a back cavity 120, and the back cavity 120 faces the support member 11. A through hole 110 is provided on the support member 11 for penetrating the back cavity 120 and the groove 10. By setting the groove 10, the volume of the back cavity 120 is expanded, the acoustic performance of the microphone is improved, and the sound received from the outside is not distorted, thereby improving the acoustic performance without changing the space occupied by the microphone structure.

[0032] In a preferred embodiment, the opening of the groove 10 is larger than the occupied area of ​​the acoustic sensor 12 , and a support member 11 is disposed above the groove 10 to maximize the volume of the back cavity 120 .

[0033] In a preferred embodiment, the first layer board 1 is also connected to a circuit chip 13 .

[0034] In a preferred embodiment, the first layer board 1 is a printed circuit board, and a soldering pad is arranged at the bottom of the printed circuit board.

[0035] In a preferred embodiment, the acoustic sensor 12 is connected to the circuit chip 13 by wire leads.

[0036] In a preferred embodiment, the groove 10 is obtained by etching and processed by microelectronic technology, so the consistency is good.

[0037] In a preferred embodiment, the support member 11 is a metal sheet. The support member 11 is deposited on the groove by bonding or by a semiconductor process, and the metal sheet is selected to have better supporting properties.

[0038] An electronic device comprises the above-mentioned back cavity enhanced microphone structure.

[0039] Specifically, in this embodiment, a microphone structure with back cavity enhancement is applied in an electronic device. A groove 10 is provided on the first layer 1, and the groove 10 and the back cavity 120 are connected through a through hole 110. The cost is low and the manufacturing process is simple. The volume of the back cavity 120 is effectively expanded, the sensitivity inside the microphone structure is improved, and the acoustic performance of the microphone structure is enhanced. Furthermore, the interior of the microphone acoustic cavity 3 is connected to the outside through the acoustic through hole 20, and the acoustic performance is improved without changing the space occupied by the microphone.

[0040] Furthermore, the acoustic performance of the back cavity-enhanced microphone structure is improved, so that when the electronic equipment is used in a complex electric field environment, the possibility of external electrical interference is effectively reduced, so that the sound quality received by the electronic product is better.

[0041] It should be noted that the electronic device is not limited to mobile or non-mobile electronic devices, which will not be elaborated here.

[0042] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A microphone structure with back cavity enhancement, characterized in that: include: A first layer board, wherein a groove is arranged on the first layer board, an acoustic sensor is installed above the groove through a support member, the acoustic sensor is provided with a back cavity, the back cavity faces the support member, and a through hole is arranged on the support member for penetrating the back cavity and the groove; A second layer of plate is covered on the first layer of plate, and an acoustic through hole is arranged on the second layer of plate; The first layer plate and the second layer plate form a microphone acoustic cavity; The support member is a metal sheet, a plurality of through holes are arranged on the support member, and the grooves are obtained by an etching process.

2. The microphone structure with back cavity enhancement according to claim 1, characterized in that: The first layer board is also connected to a circuit chip.

3. The microphone structure with back cavity enhancement according to claim 1, characterized in that: The first layer board is a printed circuit board, and a solder pad is arranged at the bottom of the printed circuit board.

4. The microphone structure with back cavity enhancement according to claim 2, characterized in that: The acoustic sensor is connected to the circuit chip via leads.

5. An electronic device, characterized in that: A microphone structure with back cavity enhancement comprising any one of claims 1-4.

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