Array camera module and circuit board assembly with height difference and manufacturing method and electronic device thereof

Abstract

An array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the circuit board assembly includes: a first circuit board; a second circuit board; and a first base, the first base includes a first base body and an extension portion, the first base body is integrally formed on the first circuit board to form a first light window, the extension portion extends from the first base body at least partially in a direction away from the first base body to form a height difference with the bottom surface of the first circuit board, and the extension portion is integrally formed on the second circuit board.

Description

Technical Field

[0001] The present invention relates to the field of camera modules, and further to an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device. Background Art

[0002] With the continuous development of smart devices, the requirements for camera modules are getting higher and higher. For example, in the past two years, the camera of smart phones has changed from a single camera to a dual camera, and the development of dual camera modules has also become an important trend in the development of mobile phone camera modules.

[0003] In simple terms, dual cameras can collect images through the cooperation of two cameras, thereby achieving richer image acquisition functions. Existing dual cameras can be divided into two categories according to their functions: one is to use dual cameras to generate stereoscopic vision, obtain the depth of field of the image, use the depth of field information for background blur, 3D scanning, auxiliary focus, motion recognition and other applications, or use the information of two pictures for fusion; the other is to use the left and right pictures for fusion in the hope of obtaining higher resolution, better color, better dynamic range and other better image quality or to achieve the function of optical zoom.

[0004] However, no matter what kind of dual camera function it has, it needs hardware support and the most basic problem to be considered is the assembly and fixation between the two cameras. How to assemble the two cameras stably and compactly to form an integrated module is the basic problem to be considered in dual camera modules.

[0005] Furthermore, the two cameras that make up the dual camera are usually two different types of cameras, such as one for imaging and the other for recording depth of field. Such different functional requirements usually make the two cameras of different sizes, such as different heights. How to stably combine these two cameras of different heights to form a whole is another important issue encountered in the development of dual camera modules.

[0006] Furthermore, if two cameras need to cooperate to collect relatively accurate information about the same target, their light incident surfaces need to be in the same position, similar to the human eye, which is in a relatively consistent light incident surface, so that more accurate information can be obtained. However, for two cameras with different heights and sizes, special hardware design is required to make the outer end surfaces of the two cameras consistent to meet the cooperation requirements of the two cameras.

[0007] On the other hand, when the camera is installed on an electronic device, such as a smartphone, the exterior needs to remain flat and the two cameras must look beautiful, so the outer end faces of the two cameras are also required to be highly consistent.

[0008] Furthermore, the two cameras that cooperate with each other collect image information, and the accuracy of image collection and the quality of imaging are closely related to the incident light of the two cameras. The consistency of the optical axis between the two cameras is the basis for ensuring the imaging quality of the camera module. In other words, how to improve the consistency of the optical axis of the two camera modules, or make its error within a predetermined range, improve the accuracy of installation, and make it have better imaging quality on the basis of stably and compactly fixing the two cameras is another important issue that needs to be considered in the development of dual cameras.

[0009] Furthermore, the first two types of dual-camera functions have different requirements for camera hardware. The former requires a larger distance between the two cameras, so that higher depth of field accuracy can be obtained. Therefore, the former hardware hopes that the distance between the two cameras is relatively far; while the latter requires the superposition and synthesis of the images of the two cameras, so when designing the hardware, it is hoped that the two cameras are relatively close, so that when the two images are fused, there will be no more errors due to the difference. In other words, the control of the distance between the two cameras is a consideration for realizing cameras with different functions. Summary of the invention

[0010] One object of the present invention is to provide an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the array camera module includes at least two camera module units with different heights, and the outer end surfaces of the two camera module units have a high flatness, meeting the optical matching requirements of the two camera module units.

[0011] One object of the present invention is to provide an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the outer end surfaces of the array camera module are consistent and suitable for the surface flatness requirements of the electronic device to be installed.

[0012] One object of the present invention is to provide an array camera module and a circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the array camera module has a height difference space, which is located on the bottom side of the array module, so that there is a height difference on the bottom side of the array camera module, which can provide more installation space for the camera module itself and other electronic devices.

[0013] One object of the present invention is to provide an array camera module and a circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the array camera module includes a first base, which connects at least two camera module units stably and with a height difference, thereby eliminating the need for external components to supplement the height difference.

[0014] An object of the present invention is to provide an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein at least two of the camera module units are camera modules with different functions.

[0015] One object of the present invention is to provide a camera module with a height difference and a manufacturing method thereof, wherein the first base includes a first base body and an extension portion, the first base body is fixed to a first circuit board, and the extension portion extends integrally from the first base body to provide a supporting and fixed position for a second circuit board, thereby fixing the two camera module units.

[0016] One object of the present invention is to provide an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the first base is manufactured by a one-time molding method and has good surface flatness, thereby improving the assembly accuracy of the installed components.

[0017] One object of the present invention is to provide an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the first base provides a flat mounting surface for the second camera module unit so that the optical axes of the two camera module units are consistent.

[0018] One object of the present invention is to provide an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device. In some embodiments, the second circuit board is mounted on the extension portion of the first base, so that the extension portion provides a flat mounting condition for the second circuit board.

[0019] One object of the present invention is to provide an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein in some embodiments, the second circuit board is embedded in the first base, thereby reducing the height of the second camera module unit and reducing the installation process of the second circuit board.

[0020] One object of the present invention is to provide an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the first base forms a first light window to provide a light path for a photosensitive element of the camera module unit.

[0021] One object of the present invention is to provide an array camera module and a circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the array camera module includes at least one support, and the support is mounted on the base to facilitate the installation of a filter element.

[0022] One object of the present invention is to provide an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device. In some embodiments, the support is directly mounted on the second circuit board so as to directly support and install the filter element through the support.

[0023] One object of the present invention is to provide an array camera module and circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the array camera module includes at least one supplementary support, and the supplementary support cooperates with the first base to form a light window to provide a light path for a photosensitive element.

[0024] One object of the present invention is to provide an array camera module and a circuit board assembly with a height difference, a manufacturing method thereof, and an electronic device, wherein the circuit board includes a circuit board body and at least one electronic component, and the first base covers the electronic component, thereby reducing the space occupied by the electronic component, making the array camera module more compact.

[0025] In order to achieve at least one of the above-mentioned purposes of the invention, one aspect of the present invention provides an array camera module, which includes: at least two camera module units, the outer ends of the two array camera units are of the same height, and a height difference is formed at the bottom.

[0026] According to the array camera module described in some embodiments, the two array camera module units are respectively a first camera module unit and a second camera module unit, wherein the first camera module unit includes at least a first photosensitive component and at least one lens, the lens is located in the light sensing path of the first photosensitive component, the first photosensitive component includes an extension portion, the extension portion at least partially extends in a direction away from the photosensitive component, and the second camera module unit is fixedly connected to the extension portion, so that the ends of the first camera module unit and the second camera module unit are fixedly connected in a consistent manner.

[0027] According to some embodiments of the array camera module, the first photosensitive component includes a first circuit board and a first base, wherein the first base includes a base body, the base body is integrally formed on the first circuit board, the extension portion at least partially extends outward from the base, and the extension portion has a height difference with the first circuit board.

[0028] According to the array camera module described in some embodiments, the first photosensitive component includes a first photosensitive element, the first base body forms a first light window, and the first photosensitive element is arranged in the first light window to facilitate light sensing.

[0029] According to some embodiments of the array camera module, the second camera module unit includes a second circuit board, a second photosensitive element and a first lens, the second photosensitive element is electrically connected to the second circuit board, the second circuit board is arranged in the extension part, and the lens is located in the photosensitive path of the second photosensitive element.

[0030] According to the array camera module described in some embodiments, the second circuit board is mounted on the extension portion.

[0031] According to the array camera module described in some embodiments, the second circuit board is buried in the extension portion.

[0032] According to the array camera module described in some embodiments, the second circuit board has a sinking hole, and the second circuit board is arranged in the sinking hole and supported by the extension part.

[0033] According to the array camera module described in some embodiments, the second camera module unit includes a second base, and the second base is integrally formed on the second circuit board.

[0034] According to the array camera module described in some embodiments, the second base is integrally connected to the first base.

[0035] One aspect of the present invention provides a circuit board assembly for an array camera module, comprising:

[0036] a first circuit board;

[0037] a second circuit board; and

[0038] A first base, the first base includes a first base body and an extension portion, the first base body is integrally formed on the first circuit board to form a first light window, the extension portion extends from the first base body at least partially in a direction away from the first base body to form a height difference with the bottom surface of the first circuit board, and the extension portion is integrally formed on the second circuit board.

[0039] According to some embodiments, the second circuit board has at least one second electrical connection area, and the second electrical connection area is exposed on the surface of the extension portion.

[0040] According to some embodiments, the circuit board assembly includes a second photosensitive element, wherein the second photosensitive element is supported by the extension portion and electrically connected to the second electrical connection area of ​​the second circuit board.

[0041] According to some embodiments, the circuit board assembly includes a second photosensitive element, which is mounted on the second circuit board and electrically connected to the second electrical connection area of ​​the second circuit board.

[0042] According to some embodiments, the second circuit board has four second electrical connection areas, which are respectively arranged on two opposite sides, so that the four second electrical connection areas are respectively electrically connected to a second photosensitive element.

[0043] According to some embodiments, the circuit board assembly includes a connection board, and the connection board electrically connects the first circuit board and the second circuit board.

[0044] According to some embodiments, the first base includes an extended mounting portion extending at least partially upward from the base body to form a first limiting groove to facilitate the installation of a first lens or a first lens supporting element.

[0045] According to some embodiments, the circuit board assembly includes a second base, the second base includes a second base body and a second light window, the second base body is integrally connected to the first base, and forms the second light window for providing a light path for a second photosensitive element.

[0046] According to some embodiments, the second base includes a second extension mounting portion, which extends upward from the second base body at least partially to form a second limiting groove to facilitate the installation of a second lens or a second lens supporting element.

[0047] According to some embodiments, the circuit board assembly includes a first supplementary base, the first base body of the first base has a first notch, and the first supplementary base is limited to supplement the first notch so that the first light window is closed.

[0048] According to some embodiments, the circuit board assembly includes a second supplementary base, the second base body of the second base has a second notch, and the second supplementary base is limited to supplement the second notch so that the second light window is closed.

[0049] According to some embodiments, the circuit board assembly includes a second base, the second base is integrally formed on the second circuit board, and the second base is integrally connected to the first base.

[0050] According to some embodiments, the first base has a first mounting groove, which is connected to the first light window to provide a mounting position.

[0051] According to some embodiments, the circuit board assembly includes a first support, and the first support is installed in the first installation groove to provide a mounting position.

[0052] According to some embodiments, the second base has a second mounting groove, and the second mounting groove is connected to the second light window to provide a mounting position.

[0053] According to some embodiments, the circuit board assembly includes a second support, and the second support is installed in the second installation groove to provide a mounting position.

[0054] According to some embodiments, the circuit board assembly includes a first photosensitive element, the first photosensitive element is mounted on the first circuit board, and the first base is located at the periphery of the first photosensitive element.

[0055] According to some embodiments, the circuit board assembly includes a first photosensitive element, the first photosensitive element is mounted on the first circuit board, and the first base is integrally formed with at least a portion of the first photosensitive element.

[0056] According to some embodiments, the first photosensitive element is electrically connected to the first circuit board through at least one first electrical connection element, and the first base covers the first electrical connection element.

[0057] According to some embodiments, the second base is located at the periphery of the second photosensitive element.

[0058] According to some embodiments, the second base is integrally formed with at least a portion of the second photosensitive element.

[0059] According to some embodiments, the second photosensitive element is electrically connected to the second circuit board through at least one second electrical connection element, and the second base covers the second electrical connection element.

[0060] According to some embodiments, the first circuit board includes a first circuit board body and at least one first electronic component, the first electronic component is electrically connected to the first circuit board body, and the first base is integrally formed with the first circuit board body and covers the first electronic component.

[0061] According to some embodiments, the second circuit board includes a second circuit board body and at least one second electronic component, the second electronic component is electrically connected to the second circuit board body, and the second base is integrally formed with the second circuit board body to cover the second electronic component.

[0062] According to some embodiments, the second circuit board has a sink hole, and the second photosensitive element is disposed in the sink hole.

[0063] According to some embodiments, the first base includes a first supporting element for supporting a mold when the first base is formed by the mold.

[0064] According to some embodiments, the first supporting element is a glue coating or a glue pad, and is disposed between a portion of the first base and the first circuit board.

[0065] According to some embodiments, the second base includes a second supporting element for supporting a mold when the second base is formed by the mold.

[0066] According to some embodiments, the second supporting element is a glue coating or a glue pad, and is disposed between a portion of the second base and the second circuit board.

[0067] According to some embodiments, the side wall of the first base body has an inclined angle.

[0068] According to some embodiments, the second base sidewall has an inclined angle.

[0069] According to some embodiments, the circuit board assembly includes a first filter element, and the first filter element is integrally formed and fixed to the first base.

[0070] According to some embodiments, the circuit board assembly includes a second filter element, and the second filter element is integrally formed and fixed to the second base.

[0071] According to some embodiments, the circuit board assembly includes a supporting element and at least one lens, the lens is supported by the supporting element, and the lens is fixed to the first base in an integral manner.

[0072] According to some embodiments, the circuit board assembly includes a supporting element and at least one lens, the lens is supported by the supporting element, and the lens is fixed to the second base in an integral manner.

[0073] According to some embodiments, the one-piece forming method is selected from: molding and compression molding.

[0074] Another aspect of the present invention provides an array camera module circuit board assembly, comprising:

[0075] a first circuit board;

[0076] a second circuit board; and

[0077] A first base, the first base includes a base body and an extension portion, the base body is integrally formed on the first circuit board to form a first light window, providing a light path for a first photosensitive element, the extension portion at least partially extends outward from the base body so that the bottom surface is consistent with the bottom surface of the first circuit board, and the second circuit board is integrally formed on the extension portion.

[0078] Another aspect of the present invention provides an array circuit board assembly, comprising:

[0079] A first circuit board;

[0080] a second circuit board;

[0081] A first base, the first base is integrally formed with the first circuit board to form a first light window; and

[0082] A second base; the second base is integrally formed on the second circuit board to form a second light window, and the first base is integrally connected to the second base, so that there is a height difference between the bottom of the first circuit board and the bottom of the second circuit board.

[0083] According to some embodiments, the first base has a first mounting groove suitable for mounting the first filter element.

[0084] According to some embodiments, the second base has a second mounting groove suitable for mounting a second filter element.

[0085] According to some embodiments, the circuit board assembly includes a first support and a first second support, the first support is integrally connected to the second support, and the first support and the second support are respectively mounted on the first base and the second base to provide a mounting position.

[0086] According to some embodiments, the circuit board assembly includes a first supplementary base, the first base body of the first base has a first notch, and the first supplementary base is limited to supplement the first notch so that the first light window is closed.

[0087] According to some embodiments, the circuit board assembly includes a second supplementary base, the second base body of the second base has a second notch, and the second supplementary base is limited to supplement the second notch so that the second light window is closed.

[0088] According to some embodiments, the one-piece forming method is selected from: molding and compression molding.

[0089] Another aspect of the present invention provides an array camera module, which comprises

[0090] a circuit board assembly; and

[0091] At least two lenses, wherein the two lenses are respectively arranged at positions corresponding to the first circuit board and the second circuit board to respectively constitute two camera module units, and the top ends of the two camera module units are of the same height.

[0092] According to some embodiments, the array camera module includes two filter elements, which are respectively arranged in the two camera module units.

[0093] According to some embodiments, the array camera module includes two lens supporting elements, and the two lenses are respectively mounted on the lens supporting elements.

[0094] According to some embodiments, at least one of the lens supporting elements is a lens seat element, so that the corresponding camera module unit constitutes a fixed-focus camera module.

[0095] According to some embodiments, at least one of the lens supporting elements is a driving element, so that the corresponding camera module unit constitutes a dynamic focus camera module.

[0096] Another aspect of the present invention provides an electronic device, comprising:

[0097] An array camera module as described above; and

[0098] The electronic device body; the array camera module is arranged on the electronic device body to obtain image information of the array camera module.

[0099] According to some embodiments, the electronic device body is selected from: a smart phone, a wearable device, a tablet computer, a laptop computer, an e-book, a personal digital assistant, a camera, and a monitoring device. BRIEF DESCRIPTION OF THE DRAWINGS

[0100] Figure 1 It is a schematic diagram of an array camera module according to a first preferred embodiment of the present invention.

[0101] Figure 2 Schematic diagram of an array circuit board assembly according to a first preferred embodiment of the present invention.

[0102] Figure 3 It is a schematic diagram of the process of forming an array circuit board assembly according to the first preferred embodiment of the present invention.

[0103] Figure 4 It is a schematic diagram of an array camera module according to a second preferred embodiment of the present invention.

[0104] Figure 5 It is a partial top view of an array camera module according to a second preferred embodiment of the present invention.

[0105] Figure 6 It is a schematic diagram of a modified implementation of an array camera module according to the second preferred embodiment of the present invention.

[0106] Figure 7 It is a schematic diagram of an array camera module according to a third preferred embodiment of the present invention.

[0107] Fig. 8A It is a schematic diagram of an array camera module according to a fourth preferred embodiment of the present invention.

[0108] Figure 8B It is a schematic diagram of a modified implementation of an array camera module according to the fourth preferred embodiment of the present invention.

[0109] Figure 8C It is a schematic diagram of another variant implementation of the array camera module according to the fourth embodiment of the present invention.

[0110] Fig. 9 It is a schematic diagram of an array camera module according to the fifth preferred embodiment of the present invention.

[0111] Fig.10 It is a schematic diagram of an array camera module according to a sixth preferred embodiment of the present invention.

[0112] Fig.11A It is a schematic diagram of an array camera module according to the seventh preferred embodiment of the present invention.

[0113] Fig. 11B It is a schematic diagram of a modified implementation of an array camera module according to the seventh preferred embodiment of the present invention.

[0114] Fig.12 It is a schematic diagram of an array camera module according to the eighth preferred embodiment of the present invention.

[0115] Fig.13 It is a schematic diagram of an array camera module according to the ninth preferred embodiment of the present invention.

[0116] Fig.14 It is a schematic diagram of an array camera module according to the tenth preferred embodiment of the present invention.

[0117] Fig.15 It is a schematic diagram of an array camera module according to the eleventh preferred embodiment of the present invention.

[0118] Fig.16 It is a schematic diagram of an array camera module according to the twelfth preferred embodiment of the present invention.

[0119] Fig.17 It is a schematic diagram of an array camera module according to the thirteenth preferred embodiment of the present invention.

[0120] Fig.18A It is a schematic diagram of an array camera module according to the fourteenth preferred embodiment of the present invention.

[0121] Fig.18B It is a schematic diagram of a deformation implementation mode of an array camera module according to the fourteenth preferred embodiment of the present invention.

[0122] Fig.19is a schematic diagram of an array circuit board assembly according to the fourteenth preferred embodiment of the present invention.

[0123] Fig. 20 It is a schematic diagram of the process of forming an array circuit board assembly according to the fourteenth preferred embodiment of the present invention.

[0124] Fig.21 It is a schematic diagram of an array camera module according to the fifteenth preferred embodiment of the present invention.

[0125] Fig. 22 It is a schematic diagram of a modified implementation of the array camera module according to the fifteenth preferred embodiment of the present invention.

[0126] Fig.23 Schematic diagram of an array camera module according to sixteen preferred embodiments of the present invention.

[0127] Fig.24 It is a schematic diagram of an array camera module according to the seventeenth preferred embodiment of the present invention.

[0128] Fig.25 It is a schematic diagram of an array camera module according to the eighteenth preferred embodiment of the present invention.

[0129] Fig.26 It is a schematic diagram of an array camera module according to the nineteenth preferred embodiment of the present invention.

[0130] Fig. 27 It is a schematic diagram of an array camera module according to the twentieth preferred embodiment of the present invention.

[0131] Fig.28 It is a schematic diagram of an array camera module according to the twenty-first preferred embodiment of the present invention.

[0132] Fig.29 It is a schematic diagram of an array camera module according to the twenty-second preferred embodiment of the present invention.

[0133] Fig.30 It is a schematic diagram of an array camera module according to the twenty-third preferred embodiment of the present invention.

[0134] Fig.31 It is a schematic diagram of an array camera module according to the twenty-fourth preferred embodiment of the present invention.

[0135] Fig.32 It is a schematic diagram of an array camera module according to the twenty-fifth preferred embodiment of the present invention.

[0136] Fig.33 It is a schematic diagram of an array camera module according to the twenty-sixth preferred embodiment of the present invention.

[0137] Fig.34A , 34B It is a stereoscopic schematic diagram of the array camera module according to the above embodiment of the present invention, which is used to illustrate two external connection methods.

[0138] Fig.35 It is a block diagram of the array camera module manufacturing method according to the above-mentioned preferred embodiment of the present invention.

[0139] Fig.36 It is a schematic diagram of the application of the array camera module according to the above preferred embodiment of the invention. DETAILED DESCRIPTION

[0140] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0141] Those skilled in the art should understand that, in the disclosure of the present invention, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0142] The camera module with multiple cameras is one of the important trends in the recent development of the camera module. The cooperation of multiple camera modules can realize more functions. Theoretically, the multi-camera array can obtain functions that are superior to those of the camera module with a single lens in many aspects compared to the camera module with a single camera. However, the realization of these functions requires hardware support, so most of the existing multi-camera modules remain in the theoretical stage. According to an embodiment of the present invention, an array camera module 100 is provided, which includes at least two camera module units, each of which cooperates with each other to complete image acquisition. It combines each of the camera module units stably and keeps the outer end faces consistent, so that the light incident surface of each of the camera module units is highly consistent, so that each of the camera module units cooperates with each other better to acquire images, and the acquired information is more accurate. Furthermore, the array camera module 100 reserves a height difference space formed by the height difference on the bottom side of the array camera module 100, so that when the array camera module 100 is installed in an electronic device, the components of the electronic device can be accommodated in the height difference space, so that the internal space is fully utilized and the exterior of the electronic device remains flat. Further, according to a preferred embodiment of the present invention, at least one base can be formed between the plurality of array camera modules 100 by an integrated molding method, and the base provides an assembly position for a plurality of camera module units, so that each of the camera module units is compactly and stably fixed to each other, and each of the camera module units maintains good consistency. And the integrated molding method has good surface flatness, providing flat installation conditions for other components, thereby improving the installation accuracy of each component and further ensuring the consistency of the optical axis between each of the camera module units.

[0143] For ease of description, the following description is made by taking a dual-camera array camera module 100 composed of two camera module units as an example. In other embodiments of the present invention, the array camera module 100 may include more camera module units, and the present invention is not limited in this regard.

[0144] Reference Figures 1 to 3 According to the array camera module 100 of the first preferred embodiment of the present invention, the array camera module 100 includes at least two camera module units, the outer end surfaces of the two camera module units are consistent, and the bottom has a height difference H, forming a height difference space 110.

[0145] Specifically, the two camera module units are respectively a first camera module unit 10 and a second camera module unit 20. The first camera module unit 10 includes a first circuit board 11, a first photosensitive element 13 and at least a first lens 14. The second camera module unit 20 includes a second circuit board 21, a second photosensitive element 23 and at least a second lens 24.

[0146] The first photosensitive element 13 is electrically connected to the first circuit board 11 so as to transmit photosensitive information to the first circuit board 11, and the first lens 14 is located in the photosensitive path of the first photosensitive element 13 so as to receive light for the first photosensitive element 13 to sense light. The second photosensitive element 23 is electrically connected to the second circuit board 21 so as to transmit photosensitive information to the second circuit board 21, and the second lens 24 is located in the photosensitive path of the second photosensitive element 23 so as to receive light for the second photosensitive element 23 to sense light. In particular, in some embodiments, the first photosensitive element 13 and the second photosensitive element 23 can be respectively arranged on the first circuit board 11 and the second circuit board 21 by surface mounting technology SMT (Surface Mount Technology), and are respectively electrically connected to the first circuit board 11 and the second circuit board 21 by at least one first electrical connection element 133 and one second electrical connection element 233. The first electrical connection element 133 and the second electrical connection element 233 are exemplified by, but not limited to, gold wire, silver wire, copper wire, aluminum wire, pad, pin, etc.

[0147] Further, the first camera module unit 10 includes a first base 12, which is fixedly connected to the first circuit board 11. The first base 12 includes a first base body 123 and an extension portion 124, the first base body 123 is fixedly connected to the first circuit board 11, and the extension portion 124 at least partially extends outward from the base body to provide an installation position for the second camera module unit 20. The second circuit board 21 is fixedly connected to the extension portion 124 of the first base 12, so that the first camera module unit 10 and the second camera module unit 20 are stably connected together through the first base 12.

[0148] In other words, the extension portion 20 of the first camera module unit 10 forms a connecting portion, providing a supporting and fixed position for the second camera module unit 20, so that the first camera module unit 10 and the second camera module unit 20 are stably connected and fixed to form the array camera module.

[0149] More specifically, according to the present invention, the first base 12 is arranged on the first circuit board 11 by an integrated molding method, such as a molding method, so that the first base 12 and the first circuit board 11 are stably fixed and the additional installation and fixing process is reduced. For example, the process of glue bonding is reduced, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is reduced. The integrated molding method can be molding, such as transfer molding, or compression molding.

[0150] For example, the first base 12 can be set on the first circuit board 11 by mold molding, such as molding on the circuit board, which is different from the traditional COB (Chip On Board) method. Through the mold molding method, the molding shape and surface flatness can be better controlled. For example, the extension part 124 has a good flatness, thereby providing a flat installation condition for the second camera module unit 20, and the extension part 124 can have a good parallelism with the first circuit board 11 through the mold molding method, which helps to ensure the consistency of the optical axes of the first camera module unit 10 and the second camera module unit 20. It is worth mentioning that the consistency of the optical axes means that the central optical axes of the two camera module units are parallel, or the angle between the two central optical axes is within a predetermined error range, so that the imaging quality meets the predetermined requirements, and the present invention is not limited in this regard.

[0151] In this embodiment of the present invention, the first base 12 is located at the periphery of the first photosensitive element 13, and the second base 22 is located at the periphery of the second photosensitive element 23. Further, the first base 12 is located at the periphery of the first electrical connection element 133, and the second base 22 is located at the periphery of the electrical connection element 233.

[0152] More specifically, the extension portion 124 has a support surface 1241, and the support surface 1241 extends in a direction away from the first camera module unit 10, so that the second camera module unit 20 is adjacent to the first camera module unit 10 in parallel. Taking the optical axis direction of the camera module unit as the height direction, the height of the extension portion 124 is higher than the first circuit board 11, so that the first base 12 and the first circuit board 11 form the height difference space 110. In other words, there is a height difference between the extension portion 124 and the first circuit board 11, so that there is a height difference between the second camera module unit 20 installed on the extension portion 124 and the first camera module unit 10. From this, it can be seen that the height difference between the first camera module unit 10 and the second camera module unit 20 is compensated by the height difference between the extension portion 124 and the first circuit board 11, so that the two camera module units of different heights are stably assembled together, and the outer end surfaces remain consistent, so that the first camera module unit 10 and the second camera module unit 20 are arranged side by side with consistent light incident directions, and the light incident surfaces are consistent, so that when the first camera module unit 10 and the second camera module unit 20 cooperate with each other to collect image information, more accurate information can be obtained.

[0153] The second circuit board 21 is supported and fixed to the extension portion 124, so as to provide a flat installation condition for the second camera module unit 20 through the extension portion 124. More specifically, the second circuit board 21 is fixed to the support surface 1241 of the extension portion 124 by a mounting method, such as glue fixing, and the bottom surface of the first circuit board 11 and the bottom surface of the second circuit board 21 form the height difference H, so that two separate and independent circuit boards can be fixedly assembled with a height difference to form an array camera module.

[0154] Furthermore, the height difference space 110 is located at the bottom of the array camera module 100. When the array camera module 100 is installed in an electronic device, the height difference space is located inside the electronic device, so that the outside of the electronic device remains relatively flat, and the components of the electronic device can be arranged in the height difference space 110, so as to make full use of the internal space of the electronic device, which is more conducive to the development of lightweight and thin electronic devices.

[0155] It is worth mentioning that in the drawings of the present invention, the height difference H is only used to illustrate the existence of the height difference between the first camera module unit 10 and the second camera module unit 20, and does not limit the height difference between the first camera module unit 10 and the second camera module unit 20. When the heights of the second camera module unit 10 and the second camera module unit 20 are different, the relative position relationship of the components of the first camera module unit 10 and the second camera module unit 20 will also change accordingly. For example, when the height difference between the first camera module unit 10 and the second camera module unit 20 is relatively small, the top surface of the first base body 123 can extend upward, and the second base body 223 is integrally connected to the first base body 223 when it is formed.

[0156] Furthermore, the support surface 1241 of the extension portion 124 is formed by integral mold molding, thereby ensuring good flatness, and the direction of the extension portion 124 and the first circuit board 11 can be consistent through mold control, for example, the direction of the extension portion 124 is parallel to the direction of the first circuit board 11, so that the directions of the first circuit board 11 and the second circuit board 21 are consistent, providing a consistent installation foundation for the first camera module unit 10 and the second camera module unit 20, so that the optical axes of the first camera module unit 10 and the second camera module unit 20 are consistent.

[0157] In some other embodiments of the present invention, the first base 12 can be formed by injection molding, for example, the first base 12 is formed by injection molding, with the first base body 123 and the extension portion 124, and then the first base 12 is bonded and fixed to the first circuit board 11, and then the second circuit board 21 is installed on the extension portion 124 of the first base 12, so that the first camera module unit 10 and the second camera module unit 20 are assembled together, and the outer ends are basically consistent and have a height difference.

[0158] Further, according to this embodiment of the present invention, the first circuit board 11 includes a first circuit board body 111 and at least one first electronic component 112, and the first electronic component 112 protrudes from the first circuit board body 111, and is used to cooperate with the operation of the first circuit board body 111. The first base 12 is integrally formed with the first circuit board body 111, and covers the first electronic component 112, so as to reduce the space occupied by the first electronic component 112. The first electronic component 112 is exemplified but not limited to a resistor, a capacitor, a driver, etc. Of course, in other embodiments of the present invention, the first electronic component 112 may not be provided or the first electronic component 112 may protrude from the first circuit board body 111, such as being embedded in the first circuit board body 111, and the present invention is not limited in this regard.

[0159] Each of the first electronic components 112 can be mounted on the edge area of ​​the first circuit board 11 at intervals, such as outside the first photosensitive element 13, through processes such as SMT. It is worth mentioning that each of the first electronic components 112 can be located on the same side or opposite sides of the first circuit board 11. For example, in a specific example, the first photosensitive element 13 and each of the first electronic components can be located on the same side of the first circuit board 11, and the first photosensitive element 13 is mounted on the chip mounting area of ​​the first circuit board 11, and each of the first electronic components 112 is mounted on the edge area of ​​the first circuit board 11 at intervals. After molding, the first base 12 covers each of the first electronic components 112, so as to isolate the adjacent first electronic components 112 and isolate the first electronic components 112 from the first photosensitive element 13 by the first base 12.

[0160] In the camera module of the present invention, the method of covering each of the first electronic components 112 by the first base 12 after molding has many advantages. First, the first base 12 covers each of the first electronic components 112, so that there will be no adverse phenomenon of mutual interference between adjacent first electronic components 112, and the imaging quality of the camera module unit can be guaranteed even when the distance between adjacent first electronic components 112 is relatively close. In this way, a larger number of first electronic components 112 can be mounted on the first circuit board 11 with a small area, so that the structure of the camera module unit is more compact, which is beneficial to improve the imaging quality of the camera module unit on the basis of controlling the size of the camera module unit; secondly, the first base 12 covers each of the first electronic components 112, so that no safety distance needs to be reserved between the first base 12 and each of the first electronic components 112 in either the horizontal direction or the height direction, so as to reduce the size of the camera module unit. Third, the first base 12 covers each of the first electronic components 112, so that there is no need to use glue to connect and level the first base 12 and the first circuit board 11, which is conducive to reducing the height dimension of the camera module unit. Fourth, the first base 12 covers each of the first electronic components 112. During the subsequent transportation and assembly of the camera module unit to form the array camera module 100, the first base 12 can prevent the first electronic components 112 from shaking and falling off, which is conducive to ensuring the structural stability of the array camera module 100. Fifth, the first base 1223 covers each of the first electronic components 112. During the subsequent transportation and assembly of the camera module unit to form the array camera module 100, it can prevent contaminants from contaminating each of the first electronic components 112, thereby ensuring the imaging quality of the array camera module 100. Sixth, after the first base 12 covers the electronic component, it can isolate the first electronic component 112 from the air. In this way, the oxidation rate of the metal part of the first electronic component 112 can be slowed down, which is beneficial to improving the environmental stability of the first electronic component 112 and the array camera module 100.

[0161] It is worth mentioning that the first base 12 is integrally formed with the first circuit board 11 and covers the first electronic component 112 of the first circuit board 11, so that the first base 12 and the first circuit board body 111 have a larger connection area and a more stable connection, so that the extension portion 124 can provide stable support and has good structural strength through integral molding. Therefore, the extension portion 124 can firmly and reliably support and fix the second camera module unit 20, thereby ensuring the yield of the product.

[0162] It is also worth mentioning that the second camera module unit 20 is installed on the extension part 124 of the first base 12, so that the distance between the first camera module unit 10 and the second camera module unit 20 can be conveniently controlled by the extension length of the extension part 124 and the installation position of the second camera module unit 20, thereby conveniently meeting the coordination requirements of different types of camera module units.

[0163] According to this embodiment of the present invention, the first base 12 has a first light window 121 to provide a light path for the first photosensitive element 13. In other words, the first photosensitive element 13 is located in the first light window 121, and the light sensing path of the first photosensitive element 13 is consistent with the direction of the first light window 121.

[0164] More specifically, the first base body 123 forms the first light window 121 to provide a light path for the first photosensitive element 13. In some embodiments, the first base body 123 is a closed ring structure to adapt to the shape of the first photosensitive element 13.

[0165] In this embodiment of the present invention, the first base 12 surrounds the periphery of the first photosensitive element 13.

[0166] The first base 12 has a first mounting groove 122, which is connected to the first light window 121 and is used to provide a mounting position. The first camera module unit 10 includes a first filter element 16, which is located between the first lens 14 and the first photosensitive element 13 to filter the light that passes through the first lens 14 and reaches the first photosensitive element 13. The first filter element 16 is installed in the first mounting groove 122.

[0167] It is worth mentioning that, in this embodiment of the present invention, the first filter element 16 is installed in the first installation groove 122, that is, the first installation groove 122 provides a mounting position for the first filter element 16. In other embodiments of the present invention, the first installation groove 122 can also provide a mounting position for other components, for example but not limited to, providing a mounting position for the first lens supporting element 15, the first lens 14, and providing a mounting position for components such as the support 18 (to be proposed later).

[0168] Further, according to this embodiment of the present invention, the second camera module unit 20 includes a second base 22, and the second base 22 is fixedly connected to the second circuit board 21. The second base 22 includes a second base body 223 and a second light window 221. The second base body 223 forms the second light window 221 to provide a light path for the second photosensitive element 23. In other words, the second photosensitive element 23 is located in the second light window 221, and the second photosensitive element 23 and the second light window 221 are in the same direction. In some embodiments, the second base body 223 is a closed ring structure that adapts to the shape of the second photosensitive element 23.

[0169] The second base 22 has a second mounting groove 222 connected to the second light window 221, and the second mounting groove is set in the second base body 223. The second camera module unit 20 includes a second filter element 26, and the second filter element 26 is located between the second lens 24 and the second photosensitive element 23, so as to filter the light passing through the second lens 24 to reach the second photosensitive element 23. The second filter element 26 is installed in the first mounting groove 122.

[0170] It is worth mentioning that in this embodiment of the present invention, the second filter element 26 is installed in the second installation groove 222, that is, the second installation groove 222 provides a mounting position for the second filter element 26. In other embodiments of the present invention, the second installation groove 222 can also provide a mounting position for other components, for example but not limited to, providing a mounting position for the second lens supporting element 25, the second lens 24, and the support 28 (proposed later) and other components.

[0171] The first filter element 16 and the second filter element 26 can be implemented as different types, for example, the filter element can be implemented as an infrared cutoff filter, a full-spectrum filter, a blue glass filter, and other filters or a combination of multiple filters. For example, the filter element can be implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive element. For example, when the array camera module 100 is used in an environment with sufficient light such as daytime, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive element to filter the infrared rays in the light reflected by the object entering the camera module unit through the infrared cutoff filter. When the camera module unit is used in an environment with darker light such as night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive element to allow the infrared rays in the light reflected by the object entering the camera module unit to pass through.

[0172] Further, according to this embodiment of the present invention, the second base 22 is integrally formed with the second circuit board 21, so that the second base 22 and the second circuit board 21 are stably fixed, and additional installation and fixing processes are reduced. For example, the process of gluing is reduced, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is reduced.

[0173] The second circuit board 21 includes a second circuit board body 211 and at least one second electronic component 212, the second electronic component 212 protruding from the second circuit board body 211, and used to cooperate with the operation of the second circuit board body 211. The second base 22 is integrally formed with the second circuit board body 211, and covers the second electronic component 212. The second base 22 can be integrally formed in the same manner as the first base 12, and has the same advantages as the first base 12, which will not be repeated here.

[0174] Further, according to this embodiment of the present invention, the first camera module unit 10 includes at least one first lens supporting element 15, the first lens 14 is installed on the first lens supporting element 15, and the first lens supporting element 15 is installed on the first base body 123 of the first base 12, so that the first lens 14 is located in the light sensing path of the first photosensitive element 13.

[0175] The second camera module unit 20 includes at least one second lens supporting element 25, the second lens 24 is installed on the second lens supporting element 25, and the second lens supporting element 25 is installed on the second base body 223 so that the second lens 24 is located in the light sensing path of the second photosensitive element 23.

[0176] Further, the first lens support element 15 and the second lens support element 25 can be implemented as a driving element or a lens mount element, so as to form a dynamic focus camera module or a fixed focus camera module. The driving element is exemplified by, but not limited to, a voice coil motor, a piezoelectric motor, etc. For example, when the first lens support element 15 and the second lens support element 25 are both implemented as a driving element, the first camera module unit 10 and the second camera module unit 20 are both dynamic focus camera modules, that is, the array camera module 100 is composed of two dynamic focus camera modules. When the first lens support unit 15 is implemented as a driving element and the second lens support element 25 is implemented as a lens mount element, the first camera module unit 10 is a dynamic focus camera module and the second camera module unit 20 is a fixed focus camera module, that is, the array camera module 100 is composed of a dynamic focus camera module and a fixed focus camera module. When the first lens supporting element 15 is implemented as a lens holder element, and the second lens element 24 is implemented as a driving element, the first camera module unit 10 is a fixed-focus camera module, and the second camera module unit 20 is a dynamic-focus camera module. When both the first lens supporting element 15 and the second lens supporting element 25 are implemented as the lens holder element, both the first camera module unit 10 and the second camera module unit 20 are fixed-focus camera modules.

[0177] It is worth mentioning that, in some embodiments, when the first lens supporting element 15 or the second lens supporting element 25 is implemented as a driving element, the first lens supporting element 15 and the second lens supporting element 25 are electrically connected to the first circuit board 11 or the second circuit board 21, so as to drive the first lens 14 or the second lens 24 to work. For example, the first lens supporting element 15 and the second lens supporting element 25 can be electrically connected to the first circuit board 11 or the second circuit board 21 by setting pins, pads or leads.

[0178] The types of the first camera module unit 10 and the second camera module unit 20 can be configured according to needs so as to cooperate with each other to achieve better image acquisition effects, and the present invention is not limited in this regard.

[0179] It is worth mentioning that in the first camera module unit 10, the first lens supporting element 15 is installed on the top surface of the first base body 123, and the first filter element 16 is installed in the first mounting groove 122 of the first base body 123; in the second camera module unit 20, the second lens supporting element 25 is installed on the top surface of the second base body 223, and the second filter element 26 is installed in the second mounting groove 222 of the second base 22, and the first base 12 and the second base 22 can be respectively arranged on the first line by an integrated molding method. The circuit board body 111 and the second circuit board body 211 provide smooth installation conditions through the first base body 123 and the second base body 223, such as providing smooth and consistent installation conditions for the first filter element 16, the second filter element 26, the first lens support element 15 and the second lens support element 25, thereby improving the respective assembly accuracy of the first camera module unit 10 and the second camera module unit 20, reducing the cumulative error, and helping to improve the consistency of the central optical axis of the first camera module unit 10 and the second camera module unit 20.

[0180] The first circuit board 11, the first photosensitive element 13 and the first base 12 constitute a first photosensitive component. The second circuit board 21, the second photosensitive element 23 and the second base 22 constitute a second photosensitive component. And the first photosensitive component and the second photosensitive component constitute an array circuit board assembly. That is to say, the first circuit board 11, the first base 12, the first photosensitive element 13, the second circuit board 21, the second photosensitive element 23 and the second base 22 constitute the array circuit board assembly, so that different types of lenses or lens supporting elements can be conveniently installed on the first base 12 and the second base 22, respectively, to form the array camera module 100 with a predetermined height difference H. In other words, the array camera module 100 includes at least one array circuit board assembly with a height difference and two lenses, and the two lenses are respectively located on the two photosensitive paths of the array circuit board assembly.

[0181] For example, refer to Figure 3The formation process of the array circuit board assembly of the array camera module 100 may be: first, the first base 12 with the extension portion 124 is integrally formed at a predetermined position of the first circuit board 11, and the first base body 123 of the first base 12 covers the first electronic component 112 on the first circuit board body 111; then the second circuit board 21 is installed on the extension portion 124 of the first base 12; further, the second base 22 is integrally formed at a predetermined position of the second circuit board 21, and the second base 22 covers the second electronic component 212 of the second circuit board 21; further, the first photosensitive element 13 and the second photosensitive element 23 are respectively mounted on the first circuit board 11 and the second circuit board 21, so that they are respectively located in the first light window 121 of the first base 12 and the second light window 221 of the second base 22. Of course, in other embodiments of the present invention, the first photosensitive element 13 and the second photosensitive element 23 may be first mounted on the first circuit board body 111 and the second circuit board body 211, respectively, and then the first base 12 and the second base 22 are formed, respectively. Those skilled in the art will understand that the formation order of the array circuit board assembly is not a limitation of the present invention.

[0182] It is worth mentioning that in Figure 3 As shown in FIG. 1 , after forming the first base 12, the first photosensitive element 13 and the second photosensitive element 23 are mounted on the first circuit board 11 and the second circuit board 21, respectively. In other manufacturing methods of the present invention, the first photosensitive element 13 and the second photosensitive element 23 may be mounted on the first circuit board 11 and / or the second circuit board 21, respectively, and then the first base 12 and the second base 22 are formed. Of course, other orders are also possible, such as mounting the first photosensitive element 13 on the first circuit board 11 first, and then forming the first base 12, and then installing the second circuit board 21 on the extension 124 of the first base 12, and then electrically connecting the second photosensitive element 23 on the second circuit board 21, and then forming the second base 22. That is, in different embodiments, the steps of electrically connecting the first photosensitive element 13 on the first circuit board 11, forming the first base 12 on the first circuit board 11, arranging the second circuit board 21 on the first base 12, electrically connecting the second photosensitive element 23 on the second circuit board 21, and forming the second base 22 on the second circuit board 21 can be arranged in sequence as needed, and are not limited to Figure 3 The method shown in .

[0183] like Figure 4 and Figure 5, is a schematic diagram of an array camera module 100 according to a second preferred embodiment of the present invention. Different from the above-mentioned embodiment, in this embodiment of the present invention, the second circuit board 21 is buried in the extension portion 124 of the first base 12, thereby reducing the relative height of the second circuit board 21 and the extension portion 124, and reducing the installation and fixing process of the second circuit board 21. The second base 22 is integrally connected to the first base 12. In other words, the second circuit board 21 is fixed to the extension portion 124 of the first base 12 by integral molding. For example, during the manufacturing process, the first circuit board 11 and the second circuit board 21 are respectively arranged at predetermined positions with a predetermined height difference, and then the first circuit board 11 and the second circuit board 21 are simultaneously integrally molded and fixed. During the manufacturing process, the second base 22 can be formed at the same time, or the second base 22 can be formed again after the extension portion 124 is formed.

[0184] Furthermore, the second circuit board body 211 has at least one second electrical connection area 2111 to facilitate the electrical connection of the second photosensitive element 23. The second electrical connection area 2111 is exposed on the surface of the extension portion 124 to facilitate the electrical connection of the second photosensitive element 23. For example, the second electrical connection element 233 is electrically connected to the second photosensitive element 23 and the second electrical connection area 2111 by means of gold wire, so that the second photosensitive element 23 and the second circuit board 21 are electrically connected. The exposure method of the second electrical connection area 2111 is implemented by, for example but not limited to, providing a protrusion inside the mold to abut against the second electrical connection area 2111, so that the second electrical connection area 2111 of the second circuit board body 211 is not covered by the integral molding material. The second electrical connection area 2111 is implemented as a strip pad by way of example but not limited to. It is worth mentioning that in the attached Figure 4 In the embodiment of the present invention, the second circuit board body 211 is substantially completely covered by the extension portion, and only the second electrical connection area 2111 is exposed to electrically connect the second photosensitive element 23, that is, the second photosensitive element 23 is supported on the surface of the extension portion 124. In other words, during the manufacturing process, the first circuit board 11 and the second circuit board 21 are first integrally formed and fixed, and then the photosensitive element 23 is electrically connected. In other embodiments of the present invention, the second photosensitive element 23 can be directly mounted on the second circuit board 21, and the second photosensitive element 23 is electrically connected to the second electrical connection area 2111 of the second circuit board 21, and then the first circuit board 11 and the second circuit board 21 are integrally formed and fixed.

[0185] Reference Figure 5In this embodiment, the second photosensitive element 23 is electrically connected to the second circuit board 21 by providing the second electrical connection elements 233 on four sides. Accordingly, the second circuit board 21 has four second electrical connection areas 2111, which are respectively provided on two opposite sides. The four second electrical connection areas 2111 are exposed on the surface of the extension portion 124. The second photosensitive element 23 is electrically connected to each second electrical connection area 2111 through each second electrical connection element 233.

[0186] For example, the manufacturing process of the array circuit board assembly may be: first, the first circuit board 11 and the second circuit board 21 are arranged at predetermined positions so that they have a height difference; further, the first base 12 and the second base 22 are formed in one piece, and the second circuit board 21 is covered by the extension portion 124 of the first base 12, and the second electrical connection area 2111 of the second circuit board 21 is exposed on the surface of the extension portion 124; further, the first photosensitive element 13 and the second photosensitive element 23 are electrically connected to the first circuit board 11 and the second circuit board 21, respectively.

[0187] Of course, in other embodiments, the first circuit board 11 may be covered by the first base 12, and at least one first electrical connection area of ​​the first circuit board 11 may be exposed to the outside, so that the first photosensitive element 13 is electrically connected to the first electrical connection area. In another embodiment of the present invention, the second circuit board 21 may not be completely covered by the second base 22, for example, the bottom of the second circuit board 21 is embedded in the extension portion 124, and the surface of the second circuit board 21 is exposed to the outside, so that the position of the second circuit board 21 is limited by the extension portion 124, preventing displacement during installation, and reducing the relative height of the second circuit board 21 and the extension portion 124.

[0188] like Figure 6 FIG. 1 is a modified embodiment of the array camera module 100 according to the second preferred embodiment of the present invention. Figure 5 In the embodiment, the array circuit board assembly includes a connecting board 128 connected to the first circuit board 11 and the second circuit board 21. More specifically, the connecting board 128 electrically connects the first circuit board 11 and the second circuit board 21, so that the first circuit board 11 and the second circuit board 21 communicate information. When the first circuit board 11 and the second circuit board 21 are electrically connected, the first circuit board and the second circuit board 21 can share an output terminal. The connecting board 128 is, for example, but not limited to, a soft board.

[0189] like Figure 7, is an array camera module 100 according to a third preferred embodiment of the present invention. Different from the above embodiments, the first base 12 includes a first extension mounting portion 125, which at least partially extends upward from the first base body 123, and forms a first limiting groove 126 for limiting the mounting of the first lens 14 or the first lens supporting element 15. The second base 22 includes a second extension mounting portion 225, which at least partially extends upward from the second base body 223, and forms a second limiting groove 226 for limiting the mounting of the second lens 24 or the second lens supporting element 25.

[0190] In this embodiment of the present invention, the first lens 14 is installed in the first limiting groove 126. That is, the shape of the first extension mounting portion 125 is adapted to the first lens 14, so as to be suitable for limiting and mounting the first lens 14, thereby forming a fixed-focus camera module. The second lens 24 is installed in the second limiting groove 226. That is, the shape of the second extension mounting portion 225 is adapted to the second lens 24, so as to be suitable for limiting and mounting the second lens 24, thereby forming a fixed-focus camera module. That is, both units of the array camera module 100 are fixed-focus camera modules.

[0191] In some other embodiments of the present invention, the first lens support element 15 is installed in the first limiting groove 126, the first lens 14 is installed in the first lens support element 15, and the first lens support element 15 is implemented as a driving element, so that the first camera module unit 10 forms a dynamic focus camera module. The second lens support element 25 is installed in the second limiting groove 226, the second lens 24 is installed in the second lens support element 25, and the second lens support element 25 is implemented as a driving element, so that the second camera module unit 20 forms a dynamic focus camera module. In other words, both camera module units of the array camera module 100 are dynamic focus camera modules.

[0192] Of course, in other embodiments of the present invention, it may also be a combination of dynamic focus and fixed focus, and the present invention is not limited in this regard.

[0193] like Fig. 8A , is an array camera module 100 according to a fourth preferred embodiment of the present invention. In this embodiment of the present invention, the first camera module unit 10 includes a first support 18 for mounting other components, such as the first filter element 16, the first lens 14 or the first lens support element 15.

[0194] In the drawings of this embodiment of the present invention, the first support 18 is mounted on the first base body 123, and the first filter element 16 is mounted on the first support 18. In particular, the first support 18 sinks into the first light window 121 of the first base 12, so that the position of the first filter element 16 sinks and is close to the first photosensitive element 13, reducing the back focal length of the first camera module unit 10 and reducing the required area of ​​the first filter element 16.

[0195] The second camera module 20 includes a second support 28 for mounting other components, such as the second filter element 26, the second lens 24 or the second lens support element 25. In this embodiment of the present invention, the second support 28 is mounted on the second base body 223, and the second filter element 26 is mounted on the second support 28. In particular, the second support 28 is sunken into the second light window 221 of the second base 22, so that the position of the second filter element 26 is sunken, close to the second photosensitive element 23, reducing the back focal length of the second camera module unit 20, and reducing the required area of ​​the second filter element 26. Of course, in other embodiments of the present invention, the array camera module 100 may include only one support, such as the first support 18 or the second support 28. It should be understood by those skilled in the art that the number of the supports is not a limitation of the present invention.

[0196] In this embodiment, the first support 18 is installed in the first mounting groove 122 of the first base 12, and the second support 28 is installed in the second mounting groove 222 of the second base 22. In other embodiments of the present invention, the first base body 123 and the second base body 223 may be platform structures, and the first support 18 and the second support 28 do not sink downward, and are directly installed on the platform structures of the first support 18 and the second support 28. It should be understood by those skilled in the art that the installation position and specific structure of the support are not limitations of the present invention.

[0197] like Figure 8BAs shown, it is a modified implementation of the array camera module 100 according to the fourth preferred embodiment of the present invention. In this implementation, the first support 18 and the second support 28 are integrally connected. That is, the adjacent parts of the first support 18 and the second support 28 are connected to each other, so that they can be installed on the first base 12 and the second base 22 at one time, and relatively consistent installation conditions are provided. Further, the first base 12 and the second base 22 are integrally connected. That is to say, when the second base 22 is formed, it is not only integrally formed with the second circuit board 21, but also integrally formed with at least part of the surface of the first base, so that the first base 12 and the second base 22 are more firmly connected.

[0198] like Figure 8C , is another variant implementation of the array camera module 100 according to the fourth preferred embodiment of the present invention. In this implementation, the second camera module unit 20 includes a second support 28, and the second support 28 is directly mounted on the second circuit board 21. That is, in this way, the second camera module unit 20 does not include the second base 22, and the second support 28 assumes the support function of the second base 22.

[0199] More specifically, the second support 28 is directly mounted on the top surface of the second circuit board body 211. For example, the first support 28 is bonded and fixed to the second circuit board body. The second support 28 has a light hole 281 to provide a light path for the second photosensitive element 23. The second support 28 has an avoidance space 282, which is connected to the light hole 281 and is used to avoid the second electronic component 212 and the second photosensitive element 23.

[0200] Further, in this manner, the second lens supporting element 25 and / or the second lens 24 are directly mounted on the top surface of the second support 28 .

[0201] like Fig. 9, is a schematic diagram of an array camera module 100 according to the fifth preferred embodiment of the present invention. The first camera module unit 10 includes a first supplementary base 19, which is supplementarily installed on the first base body 123 and cooperates with the first base body 123 to form the first light window 121. That is to say, in this embodiment, the first base body 123 is not a closed annular structure, but a closed annular structure is formed after being supplemented by the first supplementary base 19. In other words, the first base body 123 has at least one first notch 1231, which is connected to the outside, and the first supplementary base 19 is at least partially supplemented in the first notch 1231. The first notch 1231 limits the position of the first supplementary base 19, so that the supplement can be accurately and quickly installed. The shapes of the first notch 1231 and the first supplementary base 19 can be set according to requirements, such as an inverted trapezoidal structure, a triangular structure, a square structure, etc., and the present invention is not limited in this regard.

[0202] The second camera module unit 20 includes a second supplementary base 29, which is supplemented and installed on the second base body 223, and cooperates with the second base body 223 to form the second light window 221. That is to say, in this embodiment, the second base body 223 is not a closed annular structure, but a closed annular structure is formed after being supplemented by the second supplementary base 29. In other words, the second base body 223 has at least one second notch 2231, which is connected to the outside, and the second supplementary base 29 is at least partially supplemented in the second notch 2231. The second notch 2231 limits the position of the second supplementary support 18, so that the supplement can be installed accurately and quickly. The shapes of the second notch 2231 and the second supplementary base 29 can be set according to needs, such as an inverted trapezoidal structure, a triangular structure, a square structure, etc., and the present invention is not limited in this regard.

[0203] Of course, in other embodiments of the present invention, the array camera module 100 may only include one supplementary base, such as the first supplementary base 19 or the second supplementary base 29. Those skilled in the art should understand that the shape and number of the supplementary base are not limitations of the present invention.

[0204] like Fig.10 , which is a schematic diagram of an array camera module 100 according to a sixth preferred embodiment of the present invention. In this embodiment, the second circuit board body 211 has a second sinking hole 2112, and the second photosensitive element 23 is sunken in the second sinking hole 2112, thereby reducing the relative height of the second photosensitive element 23 and the second circuit board body 211.

[0205] The second sinking hole 2112 is connected to both sides of the second circuit board 21. When the second photosensitive element 23 sinks into the second sinking hole 2112, the bottom of the second photosensitive element 23 is supported by the extension portion 124 of the first base 12. In other words, the extension portion 124 provides a mounting plane for the second photosensitive element 23. The first base 12 is formed on the first circuit board 11 by an integral molding method, so that the extension portion 124 and the first circuit board 11 have good consistency, so that the second photosensitive element 23 and the first circuit board 11 have good consistency, so that the first camera module unit 10 and the second camera module unit 20 have good optical axis consistency, or the imaging quality of the first camera module 10 and the second camera module unit 20 is better. That is, the imaging quality of the array camera module 100 is better.

[0206] In another embodiment of the present invention, the second circuit board body 211 has a sinking groove, and the second photosensitive element 23 is sunken in the sinking groove, thereby reducing the relative height of the second photosensitive element 23 and the second circuit board body 211. Unlike the above-mentioned sinking hole 2112, the sinking groove does not connect the two sides of the second circuit board body 211. In other words, the sinking depth of the second circuit board body 211 and the relative height of the second photosensitive element 23 and the second circuit board body 211 can be achieved by controlling the depth of the sinking groove. It should be understood by those skilled in the art that whether the sinking groove or the sinking hole connects the two sides of the second circuit board body 211 and the sinking depth of the second photosensitive element 23 is not a limitation of the present invention.

[0207] like Fig.11A , which is a schematic diagram of an array camera module 100 according to a seventh preferred embodiment of the present invention. In this embodiment, the first base body 123 and the second base body 223 are integrally connected, the first base body 123 is fixedly connected to the first circuit board 11, and the second base body 223 is fixedly connected to the second circuit board 21, so that the first camera module unit 10 and the second camera module unit 20 are stably connected.

[0208] That is, in this way, the first camera module unit 10 and the second camera module unit 20 are fixedly connected by the integral connection of the second base body 223 and the first base body 123. There is a height difference between the first base 12 and the second base 22. That is, the second base body 223 has the same function as the extension part 124, fixing the second circuit board 21.

[0209] For example, during the manufacturing process, the first circuit board 11 and the second circuit board 21 are set at predetermined positions with a predetermined height difference. Further, the first base body 123 and the second base body 223 are formed at predetermined positions of the first circuit board 11 and the second circuit board 21, respectively, so that the relative positions of the first circuit board 11 and the second circuit board 21 are determined and have a height difference. Then, the first photosensitive element 13 and the second photosensitive element 23 are installed on the first circuit board 11 and the second circuit board 21. Of course, in other embodiments of the present invention, other sequential manufacturing methods can also be used, and the present invention is not limited in this regard.

[0210] Fig. 11B : is a schematic diagram of a variant implementation of the array camera module according to the seventh preferred embodiment of the present invention. In this implementation, the first support 18 and the second support 28 are connected integrally. That is to say, the adjacent parts of the first support 18 and the second support 28 are connected to each other, so that they can be installed on the first base 12 and the second base 22 at one time, and relatively consistent installation conditions are provided. And the integral connection of the first support 18 and the second support 28 can provide more stable support for the filter element and other components, such as the lens or the lens support element, and increase the structural strength when the first base 12 and the second base 22 are integrally connected.

[0211] like Fig.12 , which is a schematic diagram of an array camera module 100 according to an eighth preferred embodiment of the present invention. The array camera module 100 comprises a support plate 129 , the support plate 129 is fixedly connected to the first base body 123 , and the second circuit board 21 is mounted on the support plate 129 .

[0212] Furthermore, the support plate 129 has a through hole 1290 , and the through hole 1290 corresponds to the first light window 121 , so as to provide a light passage for the first photosensitive element 13 .

[0213] In other words, in this manner, the first base 12 does not form the extension portion 124, but the first camera module unit 10 and the second camera module unit 20 are fixedly connected by the support plate 129, so that the bottoms of the first camera module unit 10 and the second camera module unit 20 have a height difference, and the outer ends are consistent. The support plate 129 is, for example but not limited to, a metal plate, preferably a steel plate.

[0214] That is to say, the second circuit board 21 of the second camera module unit 20 is supported and fixed to the top surface of the support plate 129, for example, by bonding.

[0215] That is, in this manner, the support plate 129 of the first camera module unit 10 forms the connection portion, providing a supporting and fixing position for the second camera module unit 20, so that the first camera module unit 10 and the second camera module unit 20 are stably fixed with a height difference. The top surface of the support plate 129 forms the height difference H with the bottom surface of the first circuit board 11, that is, the bottom surface of the first circuit board 11 and the bottom surface of the second circuit board 21 form the height difference H.

[0216] like Fig.13 , which is a schematic diagram of an array camera module 100 according to a ninth preferred embodiment of the present invention. In this embodiment, the extension portion 124 of the first base 12 extends downward, so that the bottom of the extension portion 124 is consistent with the bottom of the first circuit board 11. In other words, the outer end and the bottom of the array camera module 100 are consistent as a whole, thereby forming a relatively regular and flat structure, which is convenient for installation in electronic equipment.

[0217] In other words, in this embodiment, the extension portion 124 at least partially extends outward from the base body 123, so that the bottom surface of the extension portion 124 is consistent with the bottom surface of the first circuit board body 111, and the top surface of the extension portion 124, that is, the supporting surface 1241 forms a height difference with the first circuit board body 111, and the second circuit board 211 is installed on the supporting surface 1241, so that the top and bottom ends of the array camera module are consistent.

[0218] like Fig.14 The above is a schematic diagram of an array camera module 100 according to the tenth preferred embodiment of the present invention. In this embodiment, the first base 12 includes a first supporting element 127, which is used to support the mold during the manufacturing process to prevent damage to the first circuit board 11 or the first photosensitive element 13. In other words, during the manufacturing process, the manufacturing mold can be pressed against the first supporting element 127, so that the mold does not directly contact the first circuit board 11 or the first photosensitive element 13, and the molding material is prevented from overflowing to the inside.

[0219] Furthermore, the first supporting element 127 may be an annular structure, which is consistent with the shape of the first base body 123. The first supporting element 127 has elasticity, for example but not limited to, a glue coating or a glue pad.

[0220] The first supporting element 127 is disposed between a portion of the first base 12 and the first circuit board 111. Specifically, the first supporting element 127 is disposed between the first base body 123 and the inner edge and the corresponding first circuit board 11.

[0221] Furthermore, the side wall of the first base body 123 has an inclined angle, so as to facilitate mold manufacturing, such as facilitating the demolding process, and reducing the burr phenomenon at the bottom of the first base body 123.

[0222] The second base 22 includes a second supporting element 227, which is used to support the mold during the manufacturing process to prevent damage to the second circuit board 21 or the second photosensitive element 23. In other words, during the manufacturing process, the manufacturing mold can be pressed against the second supporting element 227, so that the mold does not directly contact the first circuit board 11 or the second photosensitive element 23, and the molding material is prevented from overflowing to the inside.

[0223] Furthermore, the second supporting element 227 may be an annular structure, which is consistent with the shape of the second base body 223. The second supporting element 227 has elasticity, for example but not limited to, a glue coating or a glue pad.

[0224] The second supporting element 227 is disposed between a portion of the second base 22 and the second circuit board 211. Specifically, the second supporting element 227 is disposed between the second base body 223 and the inner edge and the corresponding second circuit board 21.

[0225] Furthermore, the side wall of the second base body 223 has an inclined angle, so as to facilitate mold manufacturing, such as facilitating the demolding process, and reducing the burr phenomenon at the bottom of the second base body 223.

[0226] Fig.15 1 is a schematic diagram of an array camera module 100 according to an eleventh preferred embodiment of the present invention. In this embodiment of the present invention, the first filter element 16 is fixedly connected to the first base 12, and further, the first filter element 16 is fixedly connected to the first base body 123. Specifically, the first filter element 16 is fixedly connected to the first base body 123 by an integral molding method.

[0227] Furthermore, the first filter element 16 is supported on the first supporting element 127 , so as to facilitate the fixed connection of the first filter element 16 in an integral manner.

[0228] The second filter element 26 is fixedly connected to the second base 22. Further, the second filter element 26 is fixedly connected to the second base body 223. Specifically, the second filter element 26 is fixedly connected to the second base body 223 by integral molding.

[0229] Furthermore, the second filter element 26 is supported on the second supporting element 227 , so that the second filter element 26 can be conveniently fixedly connected in an integral manner.

[0230] For example, in some embodiments, the filter elements 16 and 26 may be integrally connected to the base bodies 123 and 223 by molding.

[0231] By way of example but not limitation, the formation process of the array circuit board assembly of the array camera module 100 may be: firstly, the first supporting element 127 and the second supporting element 227 are respectively arranged on the first circuit board 11 and the second circuit board 21, and then the first filter element 16 is arranged on the first supporting element 127, and then the first base 12 is formed integrally above the first filter element 16, thereby fixing the first filter element 16 in an integral manner; and then the second circuit board 21 is arranged on the extension portion 124 of the first base 12, and further, the second filter element 26 is arranged on the second supporting element 227, and the second base body 223 is formed integrally above the second filter element 26, thereby fixing the second filter element 26 in an integral manner.

[0232] like Fig.16 , is a schematic diagram of an array camera module 100 according to the twelfth preferred embodiment of the present invention. In this embodiment of the present invention, the first camera module unit 10 and the second camera module unit 20 each include at least one supporting element 127, 227 and at least one lens 17, 27, and the lenses 17, 27 are supported by the supporting elements 127, 227, respectively. Each of the lenses 17, 27 is respectively arranged on the first base body 123 and the second base body 223. Specifically, the lenses 17, 27 are fixed to the first base body 123 and the second base body 223 in an integral manner, and are respectively located in the light sensing paths of the first photosensitive element 13 and the second photosensitive element 23.

[0233] The light reflected by the object enters the interior of the camera module unit from the lens 14, 24 and the lens 17, 27, and is subsequently received by the first photosensitive element 13 and the second photosensitive element 23 and photoelectrically converted, thereby obtaining an image associated with the object. The setting of the lens 17, 27 can reduce the optical TTL (the distance from the lens plane above the lens aperture to the photosensitive plane of the chip), thereby further reducing the size of the camera module unit without affecting the optical performance, meeting the needs of electronic devices for carrying a small-sized array camera module 100. At the same time, the setting of the lens 17, 27 can also reduce the stain sensitivity. For example, in one embodiment, the stain sensitivity can be reduced by 50%.

[0234] In this preferred embodiment of the present invention, preferably, the lens 17, 27 is implemented as a lens with a heat-hardening property, that is, the lens 17, 27 is implemented as a heat-hardening lens, so that the lens 17, 27 can withstand the ambient temperature in the molding process during the molding process. For example, in the molding process of one embodiment, it can withstand a molding ambient temperature of 175°C. That is to say, before the molding process, the lens 17 that is resistant to high temperature and has undergone heat-hardening treatment is connected to the supporting element 127, and is placed in a mold together with the first circuit board 11, and the fluid solidified molding material is molded around the supporting element 127 and the outer surface of the lens 17 to form the first base 12 as a whole, so that the first base 12 can be integrally formed with the first circuit board 11, that is, the first base 12, the first circuit board 11 and the lens 17 form an integrated structure. It can be understood by those skilled in the art that the lens 17, 27 of the present invention can not only be a heat-hardening lens 17, 27, but also a lens 17, 27 of other properties, and the present invention is not limited thereto. Similarly, the other lens 27, the second base 22 and the second circuit board 21 may be integrally formed into an integrated structure.

[0235] Furthermore, the lens 17, 27 includes a lens body 171, 271 and a lens periphery 172, 272 disposed around the lens body 171, 271. Since the lens 17, 27 is a precision optical element, the edge of the lens body 171, 271 is relatively thin. The lens periphery 172, 272 disposed at the edge of the lens body 171, 271 and connected as one piece is a thickened bracket design, which can carry the lens body 171, 271, so as not to affect the optical performance of the lens body 171, 271 while enabling the lens body 171, 271 to be integrally molded and connected to the base in the mold. That is to say, before the base is molded, the lens periphery 172, 272 of the lens 17, 27 is arranged in the non-photosensitive area of ​​the photosensitive element, and the lens body 171, 271 of the lens 17, 27 is arranged in the photosensitive path of the photosensitive element; after the base is molded, the molded base covers the circuit board, a part of the supporting element of the photosensitive element and the lens periphery 172, 272 of the lens 17, 27.

[0236] It is worth mentioning that the supporting element and the lens 17, 27 can effectively improve the product yield of the array camera module 100 and improve the imaging quality of the array camera module 100. Further, the supporting element 127, 227 includes a frame-shaped supporting body and a through hole, wherein the supporting body is arranged on the circuit board so that a photosensitive area of ​​the photosensitive element corresponds to the through hole of the supporting element and the lens body 171, 271 of the lens 17, 27, so that the supporting body and the lens 17, 27 can protect the photosensitive element during the molding process.

[0237] In this embodiment, the first photosensitive element 13 and the second photosensitive element 23 are not packaged in an integral manner. Before the first base 12 and the second base 22 are integrally formed, the first photosensitive element 13 and the second photosensitive element 23 need to be respectively arranged on the first circuit board 11 and the second circuit board 21, for example, the first photosensitive element 13 and the second photosensitive element 23 are respectively arranged on the first circuit board 11 and the second circuit board 21 by surface mounting, or the first photosensitive element 13 or the second photosensitive element 23 is respectively packaged on the first circuit board and the second circuit board 21 by a viscous medium, for example, by glue packaging.

[0238] like Fig.17, is a schematic diagram of an array camera module 100 according to the thirteenth preferred embodiment of the present invention. The array camera module 100 includes three camera module units, namely a first camera module unit 10, a second camera module unit 20 and a third camera module unit 30. The first camera module unit 10 has a height difference H with the second camera module unit 20 and the third camera module unit 30, and the outer ends of the first camera module unit 10, the second camera module unit 20 and the third camera module unit 30 are consistent. The height of the first camera module unit 10 and the camera module units are consistent.

[0239] Specifically, the first base 12 includes an extension portion 124, and the third camera module unit 30 and the second camera module unit 20 are respectively arranged on the extension portion 124, so that the first camera module unit 10, the second camera module unit 20 and the third camera module unit 30 are compactly and stably connected.

[0240] That is, the extension portion 124 provides a mounting plane for the third circuit board 31 and the second circuit board 21. In particular, in this embodiment of the present invention, the second base 22 of the second camera module unit 20 and the third base 32 of the third camera module unit 30 are integrally connected, thereby ensuring the consistency of the optical axes of the first camera module unit 10, the second camera module unit 20 and the third camera module unit 30.

[0241] Refer to Figures 18 to Fig. 20 According to the array camera module 100 of the fourteenth preferred embodiment of the present invention, the array camera module 100 includes at least two camera module units, the outer end surfaces of at least two of the camera module units are consistent, and the bottoms of at least two of the camera module units have a height difference H, forming a height difference space 110.

[0242] Specifically, the two camera module units are respectively a first camera module unit 10 and a second camera module unit 20. The first camera module unit 10 includes a first circuit board 11, a first photosensitive element 13 and a first lens 14. The second camera module unit 20 includes a second circuit board 21, a second photosensitive element 23 and at least one second lens 24.

[0243] Further, the first camera module unit 10 includes a first base 12, which is fixedly connected to the first circuit board 11. The first base 12 includes a first base body 123 and an extension portion 124, the first base body 123 is fixedly connected to the first circuit board 11, and the extension portion 124 at least partially extends outward from the base body to provide an installation position for the second camera module unit 20. The second circuit board 21 is fixedly connected to the extension portion 124 of the first base 12, so that the first camera module unit 10 and the second camera module unit 20 are stably connected together through the first base 12.

[0244] The first photosensitive element 13 is electrically connected to the first circuit board 11 so as to transmit photosensitive information to the first circuit board 11, and the first lens 14 is located in the photosensitive path of the first photosensitive element 13 so as to receive light for the first photosensitive element 13 to sense light. The second photosensitive element 23 is electrically connected to the second circuit board 21 so as to transmit photosensitive information to the second circuit board 21, and the second lens 24 is located in the photosensitive path of the second photosensitive element 23 so as to receive light for the second photosensitive element 23 to sense light. In particular, in some embodiments, the first photosensitive element 13 and the second photosensitive element 23 can be respectively disposed on the first circuit board 11 and the second circuit board 21 by a surface mounting process SMT (Surface Mount Technology) or COB (Chip On Board) process, and are respectively electrically connected to the first circuit board 11 and the second circuit board 21 by at least one first electrical connection element 133 and one second electrical connection element 233. The first electrical connection element 133 and the second electrical connection element 233 are exemplified but not limited to gold wire, silver wire, copper wire, aluminum wire, pad, pin, etc. More specifically, according to the present invention, the first base 12 is provided on the first circuit board 11 by an integrated molding method, such as a molding method, so as to stably fix the first base 12 and the first circuit board 11 and reduce the additional installation and fixing process. For example, the process of glue bonding is reduced, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is reduced.

[0245] The first photosensitive element 13 has a photosensitive area 131 and a non-photosensitive area 132, and the photosensitive area 131 is used for photosensitivity. In this embodiment of the present invention, the non-photosensitive area 132 is electrically connected to the circuit board 11 through the electrical connection element 133. Further, the base 12 is at least partially integrally formed with the non-photosensitive area 132 of the photosensitive element 13. In other words, the first base 12 integrally encapsulates the first circuit board 11 and the first photosensitive element 13. The base 12 covers the electrical connection element 133.

[0246] Reference Fig.18B , is a variant implementation of the fourteenth preferred embodiment of the present invention, in which the photosensitive element of at least one of the camera modules is at least partially encapsulated by the base, and the photosensitive element of at least one of the camera modules is not encapsulated by the base. Fig.18B , at least part of the non-photosensitive area 132 of the first circuit board 11 and the first photosensitive element 13 of the first camera module unit 10 is integrally packaged by the first base 12, and the second circuit board 21 of the second camera module unit 20 is integrally packaged by the second base. In other words, the way the photosensitive element is packaged in the embodiment of the present invention and the way the photosensitive element is installed in other embodiments can be freely combined to form array camera modules of different structures, and the present invention is not limited in this regard.

[0247] It is worth mentioning that, compared with the above-mentioned method of molding only on the circuit board, the method of molding on the photosensitive element expands the scope of the base that can be integrally molded to the non-photosensitive area of ​​the photosensitive element, thereby increasing the connection area of ​​the bottom of the base without affecting the normal photosensing work of the photosensitive element, so that the base and the circuit board and the photosensitive element can be more stably connected, and the top can provide a larger installation area for other components, such as the lens, the lens support element, etc. The electrical connection element 133 is covered by the base 12, thereby avoiding external interference with the electrical connection element 133, and preventing the electrical connection element 133 from being oxidized or contaminated with dust to affect the imaging quality of the camera module unit.

[0248] For example, the first base 12 can be set on the first circuit board 11 by mold molding, such as molded on a photosensitive element, which is different from the traditional COB method. Through the mold molding method, the molding shape and surface flatness can be better controlled. For example, the extension portion 124 has good flatness, thereby providing a flat installation condition for the second camera module unit 20, which helps to ensure the consistency of the optical axes of the first camera module unit 10 and the second camera module unit 20. It is worth mentioning that the consistency of the optical axes means that the central optical axes of the two camera module units are parallel, or the angle between the two central optical axes is within a predetermined error range, and the present invention is not limited in this regard.

[0249] More specifically, the extension portion 124 has a support surface 1241, and the support surface 1241 extends away from the first camera module unit 10, so that the first camera module unit 10 is parallel to the second camera module unit 20. Taking the optical axis direction of the camera module unit as the height direction, the height of the extension portion 124 is higher than the first circuit board 11, so that the first base 12 and the first circuit board 11 form the height difference space 110. That is to say, there is a height difference between the extension portion 124 and the first circuit board 11, so that there is a height difference between the second camera module unit 20 installed on the extension portion 124 and the first camera module unit 10. Therefore, when the height difference H between the first camera module unit 10 and the second camera module unit 20 is consistent with the sum of the height difference between the extension portion 124 and the first circuit board 11 and the thickness of the second circuit board 21, the end heights of the first camera module unit 10 and the second camera module unit 20 can be kept consistent, that is, the outer ends of the array camera module 100 units are flat. From this, it can be seen that the height difference between the first camera module unit 10 and the second camera module unit 20 is compensated by the height difference between the extension portion 124 and the first circuit board 11, so that the two camera module units of different heights are stably assembled together, and the outer end surfaces remain consistent, so that the first camera module unit 10 and the second camera module unit 20 are arranged side by side with consistent light incident directions, and the light incident surfaces are consistent, so that when the first camera module unit 10 and the second camera module unit 20 cooperate with each other to collect image information, more accurate information can be obtained.

[0250] Furthermore, the height difference space 110 is located at the bottom of the array camera module 100. When the array camera module 100 is installed in an electronic device, the height difference space 110 is located inside the electronic device, so that the outside of the electronic device remains relatively flat, and components of the electronic device can be arranged in the height difference space 110, so as to make full use of the internal space of the electronic device, which is more conducive to the development of lightweight and thin electronic devices.

[0251] Furthermore, the support surface 1241 of the extension portion 124 is formed by integral mold molding, thereby ensuring good flatness, and the direction of the extension portion 124 and the first circuit board 11 can be consistent through mold control, for example, the direction of the extension portion 124 is parallel to the direction of the first circuit board 11, so that the directions of the first circuit board 11 and the second circuit board 21 are consistent, providing a consistent installation foundation for the first camera module unit 10 and the second camera module unit 20, so that the optical axes of the first camera module unit 10 and the second camera module unit 20 are consistent.

[0252] Further, according to this embodiment of the present invention, the first circuit board 11 includes a first circuit board body 111 and at least one first electronic component 112, and the first electronic component 112 protrudes from the first circuit board body 111, and is used to cooperate with the operation of the first circuit board body 111. The first base 12 is integrally formed with the first circuit board body 111, and covers the first electronic component 112, so as to reduce the space occupied by the first electronic component 212. The first electronic component 212 is exemplified but not limited to a resistor, a capacitor, a driver, etc. Of course, in other embodiments of the present invention, the first electronic component 112 may not be provided or the first electronic component 112 may protrude from the first circuit board body 111, such as being embedded in the first circuit board body 111, and the present invention is not limited in this respect.

[0253] Each of the first electronic components 112 can be mounted on the edge area of ​​the first circuit board 11 at intervals, such as outside the first photosensitive element 13, through processes such as SMT. It is worth mentioning that each of the first electronic components 112 can be located on the same side or opposite sides of the first circuit board 11. For example, in a specific example, the first photosensitive element 13 and each of the first electronic components 112 can be located on the same side of the first circuit board 11, and the first photosensitive element 13 is mounted on the chip mounting area of ​​the first circuit board 11, and each of the first electronic components 112 is mounted on the edge area of ​​the first circuit board 11 at intervals. After molding, the first base 12 covers each of the first electronic components 112, so as to isolate the adjacent first electronic components 112 and isolate the first electronic components 112 from the first photosensitive element 13 by the first base 12.

[0254] In the camera module of the present invention, the method of covering each of the first electronic components 112 and the first electrical connection components 133 by the first base 12 after molding has many advantages. First, the first base 12 covers each of the first electronic components 112 and the first electrical connection components 133, so that there will be no adverse phenomenon of mutual interference between adjacent first electronic components 112 and first electrical connection components 133. Even when the distance between adjacent first electronic components 112 and first electrical connection components 133 is close, the imaging quality of the camera module unit can be guaranteed. In this way, a small area can be made A larger number of the first electronic components 112 can be mounted on the first circuit board 11, so that the structure of the camera module unit is more compact, which is beneficial to improve the imaging quality of the camera module unit on the basis of controlling the size of the camera module unit; secondly, the first base 12 covers each of the first electronic components 112 and the first electrical connection element 133, so that no safety distance needs to be reserved between the first base 12 and each of the first electronic components 112 and the first electrical connection element 133 in either the horizontal direction or the height direction, so that the size of the camera module unit can be reduced. Thirdly, the first base 12 covers each of the first electronic components 112 and the first electrical connection element 133, so that there is no need to use glue for connection and leveling between the first base 12 and the first circuit board 11, which is beneficial to reduce the height dimension of the camera module unit. Fourth, the first base 12 covers each of the first electronic components 112 and the first electrical connection components 133. In the process of subsequent transportation and assembly of the camera module unit to form the array camera module 100, the first base 12 can prevent the first electronic components 112 and the first electrical connection components 133 from shaking and falling off, thereby facilitating the structural stability of the array camera module 100. Fifth, the first base 1223 covers each of the first electronic components 112 and the first electrical connection components 133. In the process of subsequent transportation and assembly of the camera module unit to form the array camera module 100, contaminants can be prevented from contaminating each of the first electronic components 112 and the first electrical connection components 133, thereby ensuring the imaging quality of the array camera module 100. Sixth, after the first base 12 covers the electronic component, it can isolate the first electronic component 112 and the first electrical connection element 133 from the air. In this way, the oxidation rate and aging rate of the first electronic component 112 and the first electrical connection element 133 can be slowed down, which is beneficial to improving the environmental stability of the first electronic component 112, the first electrical connection element 133 and the array camera module 100.

[0255] It is worth mentioning that the first base 12 is integrally formed on the first circuit board 11, and covers the first electronic component 112 and the first electrical connection component 133 of the first circuit board 11, so that the first base 12 and the first circuit board body 111 have a larger connection area and a more stable connection, so that the extension part 124 can provide stable support and has good structural strength through integral molding. Therefore, the extension part 124 can firmly and reliably support and fix the second camera module unit 20, thereby ensuring the yield of the product.

[0256] It is also worth mentioning that the second camera module unit 20 is installed on the extension part 124 of the first base 12, so that the distance between the first camera module unit 10 and the second camera module unit 20 can be conveniently controlled by the extension length of the extension part 124 and the installation position of the second camera module unit 20, thereby conveniently meeting the coordination requirements of different types of camera module units.

[0257] According to this embodiment of the present invention, the first base 12 has a first light window 121 to provide a light path for the first photosensitive element 13. In other words, the first photosensitive element 13 is located in the first light window 121, and the light sensing path of the first photosensitive element 13 is consistent with the direction of the first light window 121.

[0258] More specifically, the first base body 123 forms the first light window 121 to provide a light path for the first photosensitive element 13. In some embodiments, the first base body 123 is a closed ring structure to adapt to the shape of the first photosensitive element 13.

[0259] The first base 12 has a first mounting groove 122 connected to the first light window 121. The first camera module unit 10 includes a first filter element 16, which is located between the first lens 14 and the first photosensitive element 13 to filter the light passing through the first lens 14 to reach the first photosensitive element 13. The first filter element 16 is installed in the first mounting groove 122.

[0260] Further, according to this embodiment of the present invention, the second camera module unit 20 includes a second base 22, and the second base 22 is fixedly connected to the second circuit board 21. The second base 22 includes a second base body 223 and a second light window 221. The second base body 223 forms the second light window 221 to provide a light path for the second photosensitive element 23. In other words, the second photosensitive element 23 is located in the second light window 221, and the second photosensitive element 23 and the second light window 221 are in the same direction. In some embodiments, the second base body 223 is a closed ring structure that adapts to the shape of the second photosensitive element 23.

[0261] The second base 22 has a second mounting groove 222 connected to the second light window 221, and the second mounting groove 222 is set in the second base body 223. The second camera module unit 20 includes a second filter element 26, and the second filter element 26 is located between the second lens 24 and the second photosensitive element 23, so as to filter the light passing through the second lens 24 to reach the second photosensitive element 23. The second filter element 26 is installed in the first mounting groove 122.

[0262] The first filter element 16 and the second filter element 26 can be implemented as different types, for example, the filter element can be implemented as an infrared cutoff filter, a full-spectrum filter, a blue glass filter, and other filters or a combination of multiple filters. For example, the filter element can be implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive element. For example, when the array camera module 100 is used in an environment with sufficient light such as daytime, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive element to filter the infrared rays in the light reflected by the object entering the camera module unit through the infrared cutoff filter. When the camera module unit is used in an environment with darker light such as night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive element to allow the infrared rays in the light reflected by the object entering the camera module unit to pass through.

[0263] The second photosensitive element 23 has a photosensitive area 221 and a non-photosensitive area 222, and the photosensitive area 221 is used for photosensitivity. In this embodiment of the present invention, the non-photosensitive area 222 is electrically connected to the circuit board 21 through the electrical connection element 233. Further, the base 22 is at least partially integrally formed with the non-photosensitive area 222 of the photosensitive element 23. In other words, the first base 22 integrally encapsulates the first circuit board 21 and the first photosensitive element 23. The base 22 covers the electrical connection element 233.

[0264] Further, according to this embodiment of the present invention, the second base 22 is integrally formed with the second circuit board 21 and at least part of the non-photosensitive area 222, so that the second base 22, the second circuit board 21 and the second photosensitive element 23 are stably fixed, and additional installation and fixing processes are reduced. For example, the process of gluing is reduced, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is reduced.

[0265] The second circuit board 21 includes a second circuit board body 211 and at least one second electronic component 212, the second electronic component 212 protruding from the second circuit board body 211, and used to cooperate with the work of the second circuit board body 211. The second base 22 is integrally formed with the second circuit board body 211, and covers the second electronic component 212 and the second electrical connection element 233. The second base 22 can be integrally formed in the same manner as the first base 12, and has the same advantages as the first base 12, which will not be repeated here.

[0266] Further, according to this embodiment of the present invention, the first camera module unit 10 includes at least one first lens supporting element 15, the first lens 14 is installed on the first lens supporting element 15, and the first lens supporting element 15 is installed on the first base body 123 of the first base 12, so that the first lens 14 is located in the light sensing path of the first photosensitive element 13.

[0267] The second camera module unit 20 includes at least one second lens supporting element 25, the second lens 24 is installed on the second lens supporting element 25, and the second lens supporting element 25 is installed on the second base body 223 so that the second lens 24 is located in the light sensing path of the second photosensitive element 23.

[0268] Further, the first lens support element 15 and the second lens support element 25 can be implemented as a driving element or a lens mount element, so as to form a dynamic focus camera module or a fixed focus camera module. The driving element is exemplified by, but not limited to, a voice coil motor, a piezoelectric motor, etc. For example, when the first lens support element 15 and the second lens support element 25 are both implemented as a driving element, the first camera module unit 10 and the second camera module unit 20 are both dynamic focus camera modules, that is, the array camera module 100 is composed of two fixed focus camera modules. When the first lens 14 support unit is implemented as a driving element and the second lens support element 25 is implemented as a lens mount element, the first camera module unit 10 is a dynamic focus camera module and the second camera module unit 20 is a fixed focus camera module, that is, the array camera module 100 is composed of a dynamic focus camera module and a fixed focus camera module. When the first lens supporting element 15 is implemented as a lens holder element, and the second lens 24 element is implemented as a lens holder element, the first camera module unit 10 is a fixed-focus camera module, and the second camera module unit 20 is a dynamic-focus camera module. When both the first lens supporting element 15 and the second lens supporting element 25 are implemented as the lens holder element, both the first camera module unit 10 and the second camera module unit 20 are fixed-focus camera modules.

[0269] It is worth mentioning that, in some embodiments, when the first lens supporting element 15 or the second lens supporting element 25 is implemented as a driving element, the first lens supporting element 15 and the second lens supporting element 25 are electrically connected to the first circuit board 11 or the second circuit board 21, so as to drive the first lens 14 or the second lens 24 to work. For example, the first lens supporting element 15 and the second lens supporting element 25 can be electrically connected to the first circuit board 11 or the second circuit board 21 by setting pins, pads or leads.

[0270] The types of the first camera module unit 10 and the second camera module unit 20 can be configured according to requirements so as to cooperate with each other to achieve a better image acquisition effect. The present invention is not limited in this regard.

[0271] It is worth mentioning that in the first camera module unit 10, the first lens supporting element 15 is installed on the top surface of the first base body 123, and the first filter element 16 is installed in the first mounting groove 122 of the first base body 123; in the second camera module unit 20, the second lens supporting element 25 is installed on the top surface of the second base body 223, and the second filter element 26 is installed in the second mounting groove 222 of the second base 22, and the first base 12 and the second base 22 can be respectively arranged on the first line by an integrated molding method. The circuit board body 111 and the second circuit board body 211 provide smooth installation conditions through the first base body 123 and the second base body 223, such as providing smooth and consistent installation conditions for the first filter element 16, the second filter element 26, the first lens support element 15 and the second lens support element 25, thereby improving the respective assembly accuracy of the first camera module unit 10 and the second camera module unit 20, reducing the cumulative error, and helping to improve the consistency of the central optical axis of the first camera module unit 10 and the second camera module unit 20.

[0272] The first circuit board 11, the first base 12, the first photosensitive element 13, the second circuit board 21 and the second photosensitive element 23 constitute an array circuit board assembly, and different types of lenses can be conveniently mounted on the first base 12 and the second base 22, respectively, so as to form the array camera module 100 with a predetermined height difference H. In other words, the array camera module 100 includes at least one array circuit board assembly with a height difference and two lenses, and the two lenses are respectively located in two photosensitive paths of the array circuit board assembly.

[0273] For example, refer to Fig. 20The formation process of the array circuit board assembly of the array camera module 100 may be that the first photosensitive element 13 and the second photosensitive element 23 are first mounted on the first circuit board 11 and the second circuit board 21, and the photosensitive element and the circuit board are electrically connected through the electrical connection element, and then the first circuit board 11 and at least part of the non-photosensitive area 132 of the first photosensitive element 13 are integrally formed to form the first base 12 with the extension portion 124, and the first base body 123 of the first base 12 covers the first electronic element 112 and the first circuit board body 111. an electrical connection element 133; and then installing the second circuit board 21 on the extension portion 124 of the first base 12; further, the second base 22 is formed by integrally molding at least part of the non-photosensitive area 232 of the second circuit board 21 and the second photosensitive element 23, and the second base 22 covers the second electronic component 212 and the second electrical connection element 233 of the second circuit board 21, and the photosensitive area 131 of the first photosensitive element 13 and the photosensitive area 231 of the second photosensitive element 23 correspond to the first light window 121 of the first base 12 and the second light window 221 of the second base 22. Of course, in other embodiments of the present invention, there may be other manufacturing sequences, and those skilled in the art can understand that the formation sequence of the array circuit board assembly is not a limitation of the present invention.

[0274] like Fig.21 , which is a schematic diagram of an array camera module 100 according to the fifteenth preferred embodiment of the present invention. Different from the above-mentioned embodiments, in this embodiment of the present invention, the second circuit board 21 is buried in the extension portion 124 of the first base 12, thereby reducing the relative height of the second circuit board 21 and the extension portion 124, and reducing the installation and fixing process of the second circuit board 21. The second base 22 is integrally connected to the first base 12.

[0275] Furthermore, the second circuit board body 211 has at least one second electrical connection area 2111 to facilitate electrical connection to the second photosensitive element 23. For example, the second electrical connection element 233 is electrically connected to the second photosensitive element 23 and the second electrical connection area 2111 by gold wire, so that the second photosensitive element 23 is electrically connected to the second circuit board 21. For example, during the manufacturing process, the circuit boards 11 and 21 with the photosensitive elements 13 and 23 can be respectively arranged at predetermined positions, and then the first base and the second base are integrally formed, and the extension portion of the first base covers the bottom of the second circuit board.

[0276] The second electrical connection area 2111 is implemented as a strip pad by way of example but not limited thereto. In this embodiment, the second photosensitive element 23 is electrically connected to the second circuit board by providing the second electrical connection elements 233 on all four sides. Accordingly, the second circuit board 21 has four second electrical connection areas 2111, which are respectively provided on two opposite sides. Four second electrical connection areas 2111 are exposed on the surface of the extension portion 124. The second photosensitive element 23 is electrically connected to each second electrical connection area 2111 through each second electrical connection element 233.

[0277] In some embodiments of the present invention, the second base 22 is provided on the first base 1 by a second integral molding. That is, when manufacturing the array circuit board assembly, the first circuit board 11 and the second circuit board 21 are first imaged integrally to form the first base 12, and the second electrical connection area 2111 of the second circuit board 21 is exposed to the outside, and then the second photosensitive element 23 is provided on the second circuit board 21, and the second photosensitive element 23 and the second electrical connection area 2111 of the circuit board 21 are electrically connected through the electrical connection element 233, and then the second base 22 is formed integrally on the second circuit board 21.

[0278] Of course, in some embodiments, the second photosensitive element 23 may be first disposed on the second circuit board 21 , and then the first base 11 and the second base may be formed in one step, so that the second circuit board 21 is covered by the extension portion 124 of the first base 11 .

[0279] like Fig. 22 FIG. 1 is a modified embodiment of the array camera module 100 according to the fifteenth preferred embodiment of the present invention. Fig.21 In the embodiment, the array circuit board assembly includes a connecting board 128 connected to the first circuit board 11 and the second circuit board 21. More specifically, the connecting board 128 electrically connects the first circuit board 11 and the second circuit board 21, so that the first circuit board 11 and the second circuit board 21 communicate information. When the first circuit board 11 and the second circuit board 21 are electrically connected, the first circuit board and the second circuit board 21 can share an output terminal. The connecting board 128 is, for example, but not limited to, a soft board.

[0280] like Fig.23, is an array camera module 100 according to the sixteenth preferred embodiment of the present invention. Different from the above embodiments, the first base 12 includes a first extension mounting portion 125, which at least partially extends upward from the first base body 123, and forms a first limiting groove 126 for limiting the installation of the first lens 14 or the first lens supporting element 15. The second base 22 includes a second extension mounting portion 225, which at least partially extends upward from the second base body 223, and forms a second limiting groove 226 for limiting the installation of the second lens 24 or the second lens supporting element 25.

[0281] In this embodiment of the present invention, the first lens 14 is installed in the first limiting groove 126. That is, the shape of the first extension mounting portion 125 is adapted to the first lens 14, so as to be suitable for limiting and mounting the first lens 14, thereby forming a fixed-focus camera module. The second lens 24 is installed in the second limiting groove 226. That is, the shape of the second extension mounting portion 225 is adapted to the second lens 24, so as to be suitable for limiting and mounting the second lens 24, thereby forming a fixed-focus camera module. That is, both units of the array camera module 100 are fixed-focus camera modules.

[0282] In some other embodiments of the present invention, the first lens support element 15 is installed in the first limiting groove 126, the first lens 14 is installed in the first lens support element 15, and the first lens support element 15 is implemented as a driving element, so that the first camera module unit 10 forms a dynamic focus camera module. The second lens support element 25 is installed in the second limiting groove 226, the second lens 24 is installed in the second lens support element 25, and the second lens support element 25 is implemented as a driving element, so that the second camera module unit 20 forms a dynamic focus camera module. In other words, both camera module units of the array camera module 100 are dynamic focus camera modules.

[0283] Of course, in other embodiments of the present invention, it may also be a combination of dynamic focus and fixed focus, and the present invention is not limited in this regard.

[0284] like Fig.24 1 is an array camera module 100 according to the seventeenth preferred embodiment of the present invention. In this embodiment of the present invention, the first camera module unit 10 includes a first support 18 for mounting other components, such as the first filter element 16, the first lens 14 or the first lens support element 15.

[0285] In the drawings of this embodiment of the present invention, the first support 18 is mounted on the first base body 123, and the first filter element 16 is mounted on the first support 18. In particular, the first support 18 sinks into the first light window 121 of the first base 12, so that the position of the first filter element 16 sinks and is close to the first photosensitive element 13, reducing the back focal length of the first camera module unit 10 and reducing the required area of ​​the first filter element 16.

[0286] The second support 28 is mounted on the second base body 223, and the second filter element 26 is mounted on the second support 28. In particular, the second support 28 is sunken into the second light window 221 of the second base 22, so that the position of the second filter element 26 is sunken, close to the second photosensitive element 23, reducing the back focal length of the second camera module unit 20, and reducing the required area of ​​the second filter element 26. Of course, in other embodiments of the present invention, the array camera module 100 may include only one support, such as the first support 18 or the second support 28. It should be understood by those skilled in the art that the number of the supports is not a limitation of the present invention.

[0287] In this embodiment, the first support 18 is installed in the first mounting groove 122 of the first base 12, and the second support 28 is installed in the second mounting groove 222 of the second base 22. In other embodiments of the present invention, the first base body 123 and the second base body 223 may be platform structures, and the first support 18 and the second support 28 do not sink downward, and are directly installed on the platform structures of the first support 18 and the second support 28. It should be understood by those skilled in the art that the installation position and specific structure of the support are not limitations of the present invention.

[0288] like Fig.25, is a schematic diagram of an array camera module 100 according to the eighteenth preferred embodiment of the present invention. The first camera module unit 10 includes a first supplementary base 19, which is supplementarily installed on the first base body 123 and cooperates with the first base body 123 to form the first light window 121. That is to say, in this embodiment, the first base body 123 is not a closed annular structure, but a closed annular structure is formed after being supplemented by the first supplementary base 19. In other words, the first base body 123 has at least one first notch 1231, which is connected to the outside, and the first supplementary base 19 is at least partially supplemented in the first notch 1231. The first notch 1231 limits the position of the first supplementary base 19, so that the supplement can be accurately and quickly installed. The shapes of the first notch 1231 and the first supplementary base 19 can be set according to requirements, such as an inverted trapezoidal structure, a triangular structure, a directional structure, etc., and the present invention is not limited in this regard.

[0289] The second camera module unit 20 includes a second supplementary base 29, which is supplemented and installed on the second base body 223, and cooperates with the second base body 223 to form the second light window 221. That is to say, in this embodiment, the second base body 223 is not a closed annular structure, but a closed annular structure is formed after being supplemented by the second supplementary base 29. In other words, the second base body 223 has at least one second notch 2231, which is connected to the outside, and the second supplementary base 29 is at least partially supplemented in the second notch 2231. The second notch 2231 limits the position of the second supplementary support 18, so that the supplement can be installed accurately and quickly. The shapes of the second notch 2231 and the second supplementary base 29 can be set according to needs, such as an inverted trapezoidal structure, a triangular structure, a directional structure, etc., and the present invention is not limited in this regard.

[0290] Of course, in other embodiments of the present invention, the array camera module 100 may include a supplementary base, such as the first supplementary base 19 or the second supplementary base 29. Those skilled in the art should understand that the shape and number of the supplementary base are not limitations of the present invention.

[0291] like Fig.26 , is a schematic diagram of an array camera module 100 according to a nineteenth preferred embodiment of the present invention. In this embodiment, the second circuit board body 211 has a second sinking hole 2112, and the second photosensitive element 23 is sunken in the second sinking hole 2112, thereby reducing the relative height of the second photosensitive element 23 and the second circuit board body 211.

[0292] The second sinking hole 2112 is connected to both sides of the second circuit board 21. When the second photosensitive element 23 sinks into the second sinking hole 2112, the bottom of the second photosensitive element 23 is supported by the extension portion 124 of the first base 12. In other words, the extension portion 124 provides a mounting plane for the second photosensitive element 23. The first base 12 is formed on the first circuit board 11 by an integral molding method, so that the extension portion 124 and the first circuit board 11 have good consistency, so that the second photosensitive element 23 and the first circuit board 11 have good consistency, so that the first camera module unit 10 and the second camera module unit 20 have good optical axis consistency.

[0293] like Fig. 27 , which is a schematic diagram of an array camera module 100 according to the twentieth preferred embodiment of the present invention. In this embodiment, the second base body 223 and the second base body 223 are connected integrally, the first base body 123 is fixedly connected to the first circuit board 11, and the second base body 223 is fixedly connected to the second circuit board 21, so that the first camera module unit 10 and the second camera module unit 20 are stably connected.

[0294] That is, in this manner, the first base 12 does not form the extension portion 124, and the first camera module unit 10 and the second camera module unit 20 are fixedly connected by the integral connection of the second base body 223 and the first base body 123. The first base 12 and the second base 22 have a height difference.

[0295] For example, during the manufacturing process, the first circuit board 11 and the second circuit board 21 are set at predetermined positions with a predetermined height difference. Further, the first base body 123 and the second base body 223 are formed at predetermined positions of the first circuit board 11 and the second circuit board 21, respectively, so that the relative positions of the first circuit board 11 and the second circuit board 21 are determined and have a height difference. Then, the first photosensitive element 13 and the second photosensitive element 23 are installed on the first circuit board 11 and the second circuit board 21. Of course, in other embodiments of the present invention, other sequential manufacturing methods can also be used, and the present invention is not limited in this regard.

[0296] like Fig.28, which is a schematic diagram of an array camera module 100 according to the twenty-first preferred embodiment of the present invention. The array camera module 100 comprises a support plate 129 , which is fixedly connected to the first base body 123 , and the second circuit board 21 is mounted on the support plate 129 .

[0297] Furthermore, the support plate 129 has a through hole 1290 , and the through hole 1290 corresponds to the first light window 121 , so as to provide a light passage for the first photosensitive element 13 .

[0298] In other words, in this manner, the first base 12 does not form the extension portion 124, but the first camera module unit 10 and the second camera module unit 20 are fixedly connected by the support plate 129, so that the bottoms of the first camera module unit 10 and the second camera module unit 20 have a height difference, and the outer ends are consistent. The support plate 129 is, for example but not limited to, a steel plate.

[0299] like Fig.29 , is a schematic diagram of an array camera module 100 according to the twenty-second preferred embodiment of the present invention. In this embodiment, the extension portion 124 of the first base 12 extends downward, so that the bottom of the extension portion 124 is consistent with the bottom of the first circuit board 11. In other words, the outer end and the bottom of the array camera module 100 are consistent as a whole, thereby forming a relatively regular and flat structure, which is easy to install in electronic equipment.

[0300] like Fig.30 The above is a schematic diagram of an array camera module 100 according to the twenty-third preferred embodiment of the present invention. In this embodiment, the first base 12 includes a first supporting element 127, which is used to support the mold during the manufacturing process to prevent damage to the first circuit board 11 or the first photosensitive element 13. In other words, during the manufacturing process, the manufacturing mold can be pressed against the first supporting element 127, so that the mold does not directly contact the first circuit board 11 or the first photosensitive element 13, and the molding material is prevented from overflowing inward.

[0301] Furthermore, the first supporting element 127 may be an annular structure, which is consistent with the shape of the first base body 123. The first supporting element 127 has elasticity, for example but not limited to, a glue coating or a rubber pad.

[0302] Furthermore, the side wall of the first base body 123 has an inclined angle, so as to facilitate mold manufacturing, such as facilitating the demolding process, and reducing the burr phenomenon at the bottom of the first base body 123.

[0303] The second base 22 includes a second supporting element 227, which is used to support the mold during the manufacturing process to prevent damage to the second circuit board 21 or the second photosensitive element 23. In other words, during the manufacturing process, the manufacturing mold can be pressed against the second supporting element 227, so that the mold does not directly contact the first circuit board 11 or the second photosensitive element 23, and the molding material is prevented from overflowing to the inside.

[0304] Furthermore, the second supporting element 227 may be an annular structure, which is consistent with the shape of the second base body 223. The second supporting element 227 has elasticity, for example but not limited to, a glue coating or a rubber pad.

[0305] Furthermore, the side wall of the second base body 223 has an inclined angle, so as to facilitate mold manufacturing, such as facilitating the demolding process, and reducing the burr phenomenon at the bottom of the second base body 223.

[0306] Fig.31 1 is a schematic diagram of an array camera module 100 according to the twenty-fourth preferred embodiment of the present invention. In this embodiment of the present invention, the first filter element 16 is fixedly connected to the first base body 123. Specifically, the first filter element 16 is fixedly connected to the first base body 123 by an integral molding method.

[0307] Furthermore, the first filter element 16 is supported on the first supporting element 127 , so as to facilitate the fixed connection of the first filter element 16 in an integral manner.

[0308] The second filter element 26 is fixedly connected to the second base body 223. Specifically, the second filter element 26 is fixedly connected to the second base body 223 by integral molding.

[0309] Furthermore, the second filter element 26 is supported on the second supporting element 227 , so that the second filter element 26 can be conveniently fixedly connected in an integral manner.

[0310] For example, the filter elements 16 and 26 can be integrally connected to the base bodies 123 and 223 by molding.

[0311] By way of example but not limitation, the formation process of the array circuit board assembly of the array camera module 100 may be: firstly, the first supporting element 127 and the second supporting element 227 are respectively arranged on the first circuit board 11 and the second circuit board 21, and then the first filter element 16 is arranged on the first supporting element 127, and then the first base 12 is formed integrally above the first filter element 16, thereby fixing the first filter element 16 in an integral manner; and then the second circuit board 21 is arranged on the extension portion 124 of the first base 12, and further, the second filter element 26 is arranged on the second supporting element 227, and the second base body 223 is formed integrally above the second filter element 26, thereby fixing the second filter element 26 in an integral manner.

[0312] like Fig.32 , which is a schematic diagram of an array camera module 100 according to the twenty-fifth preferred embodiment of the present invention. In this embodiment of the present invention, the first camera module unit 10 and the second camera module unit 20 each include at least one supporting element 127, 227 and at least one lens 17, 27, and each of the lenses 17, 27 is respectively disposed on the first base body 123 and the second base body 223. Specifically, the lenses 17, 27 are fixed to the first base body 123 and the second base body 223 in an integral manner, and are respectively located in the light sensing paths of the first photosensitive element 13 and the second photosensitive element 23.

[0313] The light reflected by the object enters the interior of the camera module unit from the lens 14, 24 and the lens 17, 27, and is subsequently received by the first photosensitive element 13 and the second photosensitive element 23 and photoelectrically converted, thereby obtaining an image associated with the object. The setting of the lens 17, 27 can reduce the optical TTL (the distance from the lens plane above the lens aperture to the photosensitive plane of the chip), thereby further reducing the size of the camera module unit without affecting the optical performance, meeting the needs of electronic devices for carrying a small-sized array camera module 100. At the same time, the setting of the lens 17, 27 can also reduce the stain sensitivity. For example, in one embodiment, the stain sensitivity can be reduced by 50%.

[0314] In this preferred embodiment of the present invention, preferably, the lens 17, 27 is implemented as a lens with a heat-hardening property, that is, the lens 17, 27 is implemented as a heat-hardening lens, so that the lens 17, 27 can withstand the ambient temperature in the molding process during the molding process. For example, in the molding process of one embodiment, it can withstand a molding ambient temperature of 175°C. That is to say, before the molding process, the lens 17 that is resistant to high temperature and has undergone heat-hardening treatment is connected to the supporting element 127, and is placed in a mold together with the first circuit board 11, and the fluid solidified molding material is molded around the supporting element 127 and the outer surface of the lens 17 to form the first base 12 as a whole, so that the first base 12 can be integrally formed with the first circuit board 11, that is, the first base 12, the first circuit board 11 and the lens 17 form an integrated structure. It can be understood by those skilled in the art that the lens 17, 27 of the present invention can not only be a heat-hardening lens 17, 27, but also a lens 17, 27 of other properties, and the present invention is not limited thereto. Similarly, the other lens 27, the second base 22 and the second circuit board 21 may be integrally formed into an integrated structure.

[0315] Furthermore, the lens 17, 27 includes a lens body 171, 271 and a lens periphery 172, 272 disposed around the lens body 171, 271. Since the lens 17, 27 is a precision optical element, the edge of the lens body 171, 271 is relatively thin. The lens periphery 172, 272 disposed at the edge of the lens body 171, 271 and connected as one piece is a thickened bracket design, which can carry the lens body 171, 271, so as not to affect the optical performance of the lens body 171, 271 while enabling the lens body 171, 271 to be integrally molded and connected to the base in the mold. That is to say, before the base is molded, the lens periphery 172, 272 of the lens 17, 27 is arranged in the non-photosensitive area of ​​the photosensitive element, and the lens body 171, 271 of the lens 17, 27 is arranged in the photosensitive path of the photosensitive element; after the base is molded, the molded base covers the circuit board, a part of the supporting element of the photosensitive element and the lens periphery 172, 272 of the lens 17, 27.

[0316] It is worth mentioning that the supporting element and the lens 17, 27 can effectively improve the product yield of the array camera module 100 and improve the imaging quality of the array camera module 100. Further, the supporting element 127, 227 includes a frame-shaped supporting body and a through hole, wherein the supporting body is arranged on the circuit board so that a photosensitive area of ​​the photosensitive element corresponds to the through hole of the supporting element and the lens body 171, 271 of the lens 17, 27, so that the supporting body and the lens 17, 27 can protect the photosensitive element during the molding process.

[0317] In this embodiment, the first photosensitive element 13 and the first and second photosensitive elements 23 are not packaged in an integral manner, and it is necessary to respectively set the first photosensitive element 13 and the second photosensitive element 23 on the first circuit board 11 and the second circuit board 21 before integrally forming the first base 12 and the second base 22.

[0318] like Fig.33 , is a schematic diagram of an array camera module 100 according to the twenty-sixth preferred embodiment of the present invention. The array camera module 100 includes three camera module units, namely a first camera module unit 10, a second camera module unit 20 and a third camera module unit 30. The first camera module unit 10 has a height difference H with the second camera module unit 20 and the third camera module unit 30, and the outer ends of the first camera module unit 10, the second camera module unit 20 and the third camera module unit 30 are consistent. The height of the first camera module unit 10 and the camera module units are consistent.

[0319] Specifically, the first base 12 includes an extension portion 124, and the first camera module unit 10 and the second camera module unit 20 are respectively arranged on the extension portion 124, so that the first camera module unit 10, the second camera module unit 20 and the third camera module unit are compactly and stably connected.

[0320] That is, the extension portion 124 provides a mounting plane for both the first circuit board 11 and the second circuit board 21. In particular, in this embodiment of the present invention, the second base 22 of the second camera module unit 20 and the third base 32 of the third camera module unit 30 are integrally connected, thereby ensuring the consistency of the optical axes of the second camera module unit 20 and the third camera module unit 30.

[0321] Those skilled in the art should understand that the specific features in the above embodiments are only examples and are not limitations. The various features in the above embodiments can be combined with each other as needed to form new implementation methods. The features of the present invention are not limited to one embodiment.

[0322] Reference Fig.34A , 34B 2 are two stereoscopic schematic diagrams of the array camera module according to the above embodiment of the present invention, which are used to illustrate different external connection methods. Fig.34A , the array camera module includes an external connection terminal 30 for electrically connecting to an electronic device so as to transmit the information collected by the array camera module to the electronic device. The external connection terminal 30 may be a soft connector. That is to say, in this embodiment of the present invention, the first camera module unit 10 and the second camera module unit 20 have the same external connection terminal 30, and the first circuit board 11 and the second circuit board 21 are electrically connected to the external connection terminal 30.

[0323] Reference Fig.34B , the array camera module includes two external connection terminals 30, which are respectively used to be electrically connected to an electronic device, so as to transmit the information collected by the array camera module to the electronic device. The external connection terminal 30 can be a soft connector. That is to say, in this embodiment of the present invention, the first camera module unit 10 and the second camera module unit 20 each have the external connection terminal 30, and the first circuit board 11 and the second circuit board 21 are respectively electrically connected to the corresponding external connection terminals 30.

[0324] Reference Fig.35 According to the above preferred embodiment of the present invention, the present invention provides a method 1000 for manufacturing an array circuit board assembly with a height difference, the method comprising the following steps:

[0325] 1001: forming a first base 12 with an extension portion 124 on a first circuit board 11;

[0326] 1002: Dispose a second circuit board 21 on the extension portion 124;

[0327] 1003: forming a second base 22 on the second circuit board 21; and

[0328] 1004 : A first photosensitive element 13 and a second photosensitive element 23 are respectively provided on the first circuit board 11 and the second circuit board.

[0329] The forming method in step 1001 and step 1003 may be an integral forming method, such as a molding method. The extension portion 124 has a height difference with the first circuit board 11 .

[0330] In the step 1001 , the extending direction of the extending portion is consistent with that of the first circuit board, so as to provide the second circuit board 21 with installation conditions consistent with those of the first circuit board 11 .

[0331] In some implementations, step 1001 and step 1002 may be performed simultaneously, so that the second circuit board 21 is buried in the extension portion 124 .

[0332] In some embodiments, step 1004 may be performed before step 1001 , for example, by first setting the first photosensitive element 13 so that the first base can integrally encapsulate the first circuit board 11 and at least part of the non-photosensitive area 132 of the photosensitive element 13 .

[0333] Furthermore, the first lens, the second lens, the first filter element, the second filter element and other components are respectively installed on the array circuit board assembly to assemble the array camera module.

[0334] like Fig.36 , is a schematic diagram of the application of the array camera module according to the above preferred embodiment of the invention. The present invention further provides an electronic device 300, wherein the electronic device includes an electronic device body 200 and at least one array camera module 100, wherein each of the array camera modules is respectively arranged on the electronic device body 200 for acquiring images. It is worth mentioning that the type of the electronic device body 200 is not limited. For example, the electronic device body 200 can be any electronic device that can be configured with the camera module, such as a smart phone, a wearable device, a tablet computer, a laptop computer, an e-book, a personal digital assistant, a camera, a monitoring device, etc. It can be understood by those skilled in the art that although the attached Fig.36 The electronic device body 200 is implemented as a smart phone as an example, but it does not constitute a limitation on the content and scope of the present invention. The ends of the array camera modules are consistent, so that the outer surface of the electronic device is flat.

[0335] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A circuit board assembly for an array camera module, characterized in that: include: a first circuit board; a second circuit board; and A first base, the first base includes a first base body and an extension portion, the first base body is integrally formed on the first circuit board to form a first light window, the extension portion extends from the first base body at least partially in a direction away from the first base body to form a height difference with the bottom surface of the first circuit board, the extension portion is integrally formed on the second circuit board, and the second circuit board is buried in the extension portion of the first base. 2 . The circuit board assembly according to claim 1 , wherein the second circuit board has at least one second electrical connection area, and the second electrical connection area is exposed on the surface of the extension portion. 3 . The circuit board assembly according to claim 2 , wherein the circuit board assembly comprises a second photosensitive element, wherein the second photosensitive element is supported by the extension portion and electrically connected to the second electrical connection area of ​​the second circuit board.

4. The circuit board assembly according to claim 2, wherein the circuit board assembly comprises a second photosensitive element, wherein the second photosensitive element is mounted on the second circuit board and electrically connected to the second electrical connection area of ​​the second circuit board.

5. The circuit board assembly according to claim 2, wherein the second circuit board has four second electrical connection areas, which are respectively arranged on two opposite sides, so that the four second electrical connection areas are respectively electrically connected to a second photosensitive element.

6. The circuit board assembly according to claim 1, wherein the circuit board assembly comprises a connection board, wherein the connection board electrically connects the first circuit board and the second circuit board.

7. The circuit board assembly according to claim 6, wherein the first base includes an extended mounting portion extending at least partially upward from the base body to form a first limiting groove to facilitate the installation of a first lens or a first lens supporting element.

8. The circuit board assembly according to claim 1, wherein the circuit board assembly comprises a second base, the second base comprises a second base body and has a second light window, the second base body is integrally connected to the first base, and forms the second light window for providing a light path for a second photosensitive element.

9. The circuit board assembly according to claim 8, wherein the second base includes a second extended mounting portion, and the extended mounting portion at least partially extends upward from the second base body to form a second limiting groove to facilitate the installation of a second lens or a second lens supporting element.

10. The circuit board assembly according to claim 1, wherein the circuit board assembly comprises a first supplementary base, the first base body of the first base has a first notch, and the first supplementary base is limited to supplement the first notch so that the first light window is closed.

11. The circuit board assembly according to claim 8, wherein the circuit board assembly comprises a second supplementary base, the second base body of the second base has a second notch, and the second supplementary base is limited to supplement the second notch so that the second light window is closed. 12 . The circuit board assembly according to claim 1 , wherein the circuit board assembly comprises a second base, the second base is integrally formed with the second circuit board, and the second base is integrally connected to the first base.

13. The circuit board assembly according to any one of claims 1-12, wherein the first base has a first mounting groove, and the mounting groove is connected to the first light window to provide a mounting position.

14. The circuit board assembly according to claim 13, wherein the circuit board assembly comprises a first support, wherein the first support is mounted in the first mounting groove to provide a mounting position. 15 . The circuit board assembly according to claim 8 , wherein the second base has a second mounting groove, and the second mounting groove is connected to the second light window to provide a mounting position. 16 . The circuit board assembly according to claim 15 , wherein the circuit board assembly comprises a second support, and the second support is mounted in the second mounting groove to provide a mounting position.

17. The circuit board assembly according to any one of claims 1-12, wherein the circuit board assembly comprises a first photosensitive element, the first photosensitive element is mounted on the first circuit board, and the first base is located at the periphery of the first photosensitive element.

18. The circuit board assembly according to any one of claims 1-12, wherein the circuit board assembly comprises a first photosensitive element, the first photosensitive element is mounted on the first circuit board, and the first base is integrally formed with at least a portion of the first photosensitive element. 19 . The circuit board assembly according to claim 18 , wherein the first photosensitive element is electrically connected to the first circuit board through at least one first electrical connection element, and the first base covers the first electrical connection element.

20. The circuit board assembly according to claim 3 or 4, wherein the circuit board assembly comprises a second base, and the second base is located at the periphery of the second photosensitive element.

21. The circuit board assembly according to claim 4, wherein the circuit board assembly comprises a second base, and the second base is integrally formed with at least a portion of the second photosensitive element.

22. The circuit board assembly according to claim 21, wherein the second photosensitive element is electrically connected to the second circuit board through at least one second electrical connection element, and the second base covers the second electrical connection element.

23. The circuit board assembly according to any one of claims 1-12, wherein the first circuit board comprises a first circuit board body and at least one first electronic component, the first electronic component is electrically connected to the first circuit board body, and the first base is integrally formed with the first circuit board body and covers the first electronic component.

24. The circuit board assembly according to claim 4 or 21, wherein the second circuit board comprises a second circuit board body and at least one second electronic component, the second electronic component is electrically connected to the second circuit board body, and the second base is integrally formed with the second circuit board body and covers the second electronic component.

25. The circuit board assembly according to claim 3 or 4, wherein the second circuit board has a sink hole, and the second photosensitive element is disposed in the sink hole.

26. The circuit board assembly according to any one of claims 1-12, wherein the first base comprises a first supporting element for supporting the mold when the first base is formed by a mold.

27. The circuit board assembly of claim 26, wherein the first supporting element is a glue coating or a glue pad, and is disposed between a portion of the first base and the first circuit board.

28. The circuit board assembly according to any one of claims 8, 9, and 12, wherein the second base includes a second supporting element for supporting a mold when the second base is formed by a mold.

29. The circuit board assembly of claim 28, wherein the second supporting element is a glue coating or a glue pad, and is disposed between a portion of the second base and the second circuit board.

30. The circuit board assembly according to any one of claims 1-12, wherein the side wall of the first base body has an inclined angle.

31. The circuit board assembly according to claim 3 or 4, wherein the circuit board assembly comprises a second base, and a side wall of the second base has an inclined angle.

32. The circuit board assembly according to any one of claims 1-12, wherein the circuit board assembly comprises a first filter element, and the first filter element is integrally formed and fixed to the first base.

33. The circuit board assembly according to claim 3 or 4, wherein the circuit board assembly comprises a second base and a second filter element, and the second filter element is integrally formed and fixed to the second base.

34. The circuit board assembly according to any one of claims 1-12, wherein the circuit board assembly comprises a supporting element and at least one lens, the lens is supported by the supporting element, and the lens is integrally fixed to the first base.

35. The circuit board assembly according to claim 3 or 4, wherein the circuit board assembly comprises a second base, a supporting element and at least one lens, the lens is supported by the supporting element, and the lens is integrally fixed to the second base.

36. The circuit board assembly according to any one of claims 1 to 12, wherein the one-piece forming method is selected from: molding and compression molding.

37. An array camera module circuit board assembly, characterized in that: include: a first circuit board; a second circuit board; and A first base, the first base includes a base body and an extension portion, the base body is integrally formed on the first circuit board to form a first light window, providing a light path for a first photosensitive element, the extension portion at least partially extends outward from the base body so that the bottom surface is consistent with the bottom surface of the first circuit board, the second circuit board is integrally formed on the extension portion, and the second circuit board is buried in the extension portion of the first base.

38. An array circuit board assembly, characterized in that: include: A first circuit board; a second circuit board; A first base, the first base is integrally formed with the first circuit board to form a first light window; and a second base; the second base is integrally formed on the second circuit board to form a second light window, the first base is integrally connected to the second base, so that there is a height difference between the bottom of the first circuit board and the bottom of the second circuit board, and the second circuit board is buried in the extension of the first base.

39. The array circuit board assembly according to claim 38, wherein the array circuit board assembly comprises a first photosensitive element, the first photosensitive element is mounted on the first circuit board, and the first base is located at the periphery of the first photosensitive element.

40. The array circuit board assembly according to claim 38, wherein the array circuit board assembly comprises a first photosensitive element, the first photosensitive element is mounted on the first circuit board, and the first base is integrally formed with or at least partially integrally formed with the first photosensitive element.

41. The array circuit board assembly according to claim 40, wherein the first photosensitive element is electrically connected to the first circuit board through at least one first electrical connection element, and the first base covers the first electrical connection element.

42. The array circuit board assembly according to claim 38, wherein the array circuit board assembly comprises a second photosensitive element, the second photosensitive element is mounted on the second circuit board, and the second base is located at the periphery of the second photosensitive element.

43. The array circuit board assembly according to claim 38, wherein the array circuit board assembly comprises a second photosensitive element, the second photosensitive element is mounted on the second circuit board, and the second base is integrally formed with at least a portion of the second photosensitive element.

44. The array circuit board assembly according to claim 43, wherein the second photosensitive element is electrically connected to the second circuit board through at least one second electrical connection element, and the second base covers the second electrical connection element.

45. The array circuit board assembly according to any one of claims 38-44, wherein the array circuit board assembly comprises a connecting board, wherein the connecting board electrically connects the first circuit board and the second circuit board.

46. ​​An array circuit board assembly according to any one of claims 38-44, wherein the first base has a first mounting groove suitable for mounting a first filter element.

47. An array circuit board assembly according to any one of claims 38-44, wherein the second base has a second mounting groove suitable for mounting a second filter element.

48. An array circuit board assembly according to any one of claims 38-44, wherein the array circuit board assembly comprises a first support and a first second support, the first support is integrally connected to the second support, the first support and the second support are respectively mounted on the first base and the second base to provide a mounting position.

49. An array circuit board assembly according to any one of claims 38-44, wherein the array circuit board assembly comprises a first supplementary base, the first base body of the first base has a first notch, and the first supplementary base is limited to supplement the first notch so that the first light window is closed.

50. The array circuit board assembly according to any one of claims 38-44, wherein the array circuit board assembly comprises a second supplementary base, the second base body of the second base has a second notch, and the second supplementary base is limited to supplement the second notch so that the second light window is closed.

51. The array circuit board assembly according to any one of claims 38-44, wherein the one-piece forming method is selected from: molding and compression molding.

52. An array camera module, characterized in that: include A circuit board assembly according to any one of claims 1 to 36; and At least two lenses, wherein the two lenses are respectively arranged at positions corresponding to the first circuit board and the second circuit board to respectively constitute two camera module units, and the top ends of the two camera module units are of the same height.

53. An array camera module according to claim 52, wherein the array camera module comprises two filter elements, which are respectively arranged on the two camera module units.

54. An array camera module according to claim 52, wherein the array camera module comprises two lens supporting elements, and the two lenses are respectively mounted on the lens supporting elements.

55. An array camera module according to claim 54, wherein at least one of the lens supporting elements is a lens mount element, so that the corresponding camera module unit constitutes a fixed-focus camera module.

56. An array camera module according to claim 54, wherein at least one of the lens supporting elements is a driving element, so that the corresponding camera module unit constitutes a dynamic focus camera module.

57. An electronic device, characterized in that: include: An array camera module according to any one of claims 52 to 56; and The electronic device body; the array camera module is arranged on the electronic device body to obtain image information of the array camera module.

58. The electronic device according to claim 57, wherein the electronic device body is selected from: a smart phone, a wearable device, a tablet computer, a laptop computer, an e-book, a personal digital assistant, a camera, and a monitoring device.

Images