Camera module and composite photosensitive component thereof

Abstract

The present invention relates to a composite photosensitive component, comprising: a substrate, comprising a first surface and a second surface; a photosensitive element, arranged on the first surface and electrically connected to the substrate, the photosensitive element comprising a photosensitive area and a non-photosensitive area; a packaging body, the packaging body being provided with a housing cavity, the photosensitive element being located in the housing cavity; wherein the packaging body comprises at least one first packaging part and at least one second packaging part, the non-photosensitive area is at least partially embedded in the first packaging part, and the non-photosensitive area and the second packaging part are arranged at intervals. For the above composite photosensitive component, when the width of the non-photosensitive area on one side of the photosensitive element is relatively wide, a first packaging part in which the non-photosensitive area is embedded can be arranged, so that when a conductive connecting line is arranged on the substrate and the photosensitive element corresponding to the first packaging part, no wiring distance needs to be reserved. When the width of the non-photosensitive area on one side of the photosensitive element is relatively narrow and it is inconvenient to arrange the first packaging part, the second packaging part can be arranged at intervals, thereby reducing the size and model requirements of the photosensitive element.

Description

Technical Field

[0001] The present invention relates to the field of camera modules, and in particular to a camera module and a composite photosensitive component thereof. Background Art

[0002] With the rapid development of various smart devices, smart devices integrated with camera modules are becoming more and more lightweight while improving the image quality. Improving the image quality means that the specifications and quantity of electronic components are increasing, and the area of ​​the photosensitive elements that greatly affect the image quality is also increasing. As a result, the difficulty of assembling the camera module is increasing, and its overall size is also increasing. Therefore, the thinness of the camera module is greatly restricted, which in turn limits the volume of the smart device equipped with the camera module.

[0003] The commonly used camera module packaging process now is the COB (Chip On Board) packaging process, that is, the circuit board, photosensitive element, bracket, etc. of the camera module are made separately, and then the passive electronic components, photosensitive element and bracket are packaged on the circuit board in turn.

[0004] However, when adopting the above-mentioned packaging structure, since the photosensitive element is connected to the circuit board through the conductive connecting wire, a safe distance for the conductive connecting wire needs to be reserved when installing the bracket, which brings inconvenience to the processing of the camera module and is not conducive to the development of the camera module to be lighter and thinner in size. Summary of the invention

[0005] Based on this, it is necessary to provide a camera module that does not require a safety distance and is smaller in size and its composite photosensitive component in order to address the problem that the camera module needs to reserve a safety distance during processing but is larger in size.

[0006] A composite photosensitive component, comprising:

[0007] A substrate, comprising a first surface and a second surface arranged opposite to each other;

[0008] A photosensitive element, disposed on the first surface of the substrate and electrically connected to the substrate, the photosensitive element comprising a photosensitive area and a non-photosensitive area, wherein the non-photosensitive area surrounds the photosensitive area;

[0009] A packaging body, disposed on the first surface of the substrate, the packaging body is provided with a receiving cavity, and the photosensitive element is located in the receiving cavity;

[0010] The packaging body includes at least one first packaging part and at least one second packaging part, the non-photosensitive area is at least partially embedded in the first packaging part, and the non-photosensitive area and the second packaging part are spaced apart.

[0011] The above-mentioned composite photosensitive component includes a first packaging part embedded with a non-photosensitive area and a second packaging part spaced apart from the non-photosensitive area, so the first packaging part and the second packaging part can be selectively set according to the width of the non-photosensitive area of ​​the photosensitive element. When the width of the non-photosensitive area on one side of the photosensitive element is wider, the first packaging part embedded with the non-photosensitive area can be set, so that when the conductive connecting line is set on the substrate corresponding to the first packaging part and the photosensitive element, there is no need to reserve a wiring distance, thereby reducing the overall size of the composite photosensitive component. When the width of the non-photosensitive area on one side of the photosensitive element is narrow and it is inconvenient to set the first packaging part, the second packaging part can be spaced apart. In this way, the requirements for the size and model of the photosensitive element are reduced, and photosensitive elements of different sizes and models can be selected for installation as needed.

[0012] In one embodiment, the package body includes three first package parts and one second package part, and the three first package parts and one second package part together enclose the package body.

[0013] In one embodiment, the non-photosensitive area corresponding to the first packaging portion is provided with a conductive connecting line, and the conductive connecting line connects the non-photosensitive area and the substrate.

[0014] In one embodiment, the conductive connecting wire is completely embedded in the first packaging portion.

[0015] In one embodiment, the conductive connecting line is partially embedded in the first packaging portion.

[0016] In one embodiment, the composite photosensitive component further includes an electronic component, and the electronic component is embedded in the first packaging portion.

[0017] In one embodiment, the distance between the outer edge of the non-photosensitive area and the electronic component is greater than 100 μm.

[0018] In one embodiment, the distance between the electronic component and the inner side wall of the first packaging portion is greater than 150 μm.

[0019] In one embodiment, the composite photosensitive component further includes an electronic component, and the electronic component is embedded in the second packaging portion.

[0020] A camera module comprises the above-mentioned composite photosensitive component. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic structural diagram of a photosensitive component according to an embodiment;

[0022] Figure 2 for Figure 1 A front view of the photosensitive component shown;

[0023] Figure 3 for Figure 1 A side view of the photosensitive assembly shown;

[0024] Figure 4 A cross-sectional view of a camera module according to one embodiment. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present invention are provided in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0028] like Figure 1 to Figure 4 As shown, a composite photosensitive component 20 of the preferred embodiment includes a substrate 21, a photosensitive element 23 and a packaging body 25.

[0029] The substrate 21 includes a first surface 212 and a second surface 214 that are arranged opposite to each other. The photosensitive element 23 is arranged on the first surface 212 of the substrate 21 and is electrically connected to the substrate 21. The photosensitive element 23 includes a photosensitive area and a non-photosensitive area, and the non-photosensitive area surrounds the photosensitive area. The package 25 is arranged on the first surface 212 of the substrate 21. The package 25 is provided with a receiving cavity 252, and the photosensitive element 23 is located in the receiving cavity 252. The package 25 includes at least one first packaging part 254 and at least one second packaging part 256. The non-photosensitive area is at least partially embedded in the first packaging part 254, and the non-photosensitive area and the second packaging part 256 are arranged at intervals.

[0030] The composite photosensitive component 20 includes a first packaging portion 254 embedded with a non-photosensitive area and a second packaging portion 256 spaced apart from the non-photosensitive area. Therefore, the first packaging portion 254 and the second packaging portion 256 can be selectively set according to the width of the non-photosensitive area of ​​the photosensitive element 23.

[0031] When the width of the non-photosensitive area on one side of the photosensitive element 23 is relatively wide, a first packaging portion 254 in which the non-photosensitive area is embedded can be provided, so that when the conductive connecting wire 27 is provided on the substrate 21 and the photosensitive element 23 corresponding to the first packaging portion 254, there is no need to reserve a wire bonding distance, thereby reducing the overall size of the composite photosensitive component 20. When the width of the non-photosensitive area on one side of the photosensitive element 23 is relatively narrow and it is inconvenient to provide the first packaging portion 254, a second packaging portion 256 can be provided at intervals. In this way, the size and model requirements of the photosensitive element 23 are reduced, and photosensitive elements 23 of different sizes and models can be selected for installation as needed.

[0032] Please continue reading Figure 1 to Figure 4 The photosensitive element 23 is generally rectangular, square or circular, and can be set as CCD (Charge-coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) as needed. Specifically in the first embodiment, the photosensitive element 23 is rectangular, including a photosensitive surface and a non-photosensitive surface that are oppositely arranged. The photosensitive element 23 is attached to the substrate 21 through the non-photosensitive surface. The photosensitive surface includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area to receive light and is electrically connected to the substrate 21.

[0033] In this embodiment, the package body 25 includes three first package parts 254 and one second package part 256. The three first package parts 254 and the second package part 256 together enclose the package body 25 to surround the photosensitive element 23. Thus, among the four sides of the rectangular photosensitive element 23, three sides are embedded in the first package part 254, and the other side is spaced apart from the second package part 256.

[0034] It can be understood that the number of the first encapsulation parts 254 and the second encapsulation parts 256 is not limited thereto, and in other embodiments, the encapsulation body 25 may also include two first encapsulation parts 254 and two second encapsulation parts 256, which together enclose the encapsulation body 25. Specifically, the first encapsulation parts 254 and the second encapsulation parts 256 may be arranged alternately, or the two first encapsulation parts 254 may be adjacent to each other, and the two second encapsulation parts 256 may be adjacent to each other.

[0035] Specifically, the package body 25 is formed by processing the package colloid on the first surface 212 of the substrate 21 through a molding tool. For example, an injection molding machine is used to mold the substrate 21 through an insert molding process to form the package body 25, or a molding process commonly used in semiconductor packaging is used to form the package body 25. The package body 25 can be formed by an injection molding process or a molding process, etc., and the package body 25 is firmly connected to the substrate 21. The bonding force between the package body 25 and the substrate 21 is greater than the bonding force between the traditional bracket and the substrate 21, thereby improving the overall structural strength and use stability of the composite photosensitive component 20.

[0036] Furthermore, the material of the package body 25 formed by the injection molding process may be nylon, LCP (Liquid Crystal Polymer) or PP (Polypropylene), etc., and the material of the package body 25 formed by the molding process may be epoxy resin. It should be understood by those skilled in the art that the aforementioned selectable manufacturing methods and selectable materials are only used as examples to illustrate the possible implementation methods of the present invention, and are not limitations of the present invention.

[0037] Furthermore, a conductive connection line 27 is provided in the non-photosensitive area corresponding to the first packaging part 254, and the two ends of the conductive connection line 27 are respectively connected to the non-photosensitive area and the substrate 21. When assembling the composite photosensitive component 20, the photosensitive element 23 is mounted on the substrate 21, and the two are electrically connected through the conductive connection line 27, and then the first packaging part 254 is molded. Therefore, it is different from the prior art that a wire bonding distance needs to be reserved on the substrate 21, thereby reducing the volume of the composite packaging body 25.

[0038] In this embodiment, the conductive connection line 27 is completely embedded in the first packaging part 254, and the first packaging part 254 can protect the conductive connection line 27 from being damaged by external objects during subsequent processing. In another embodiment, the conductive connection line 27 can also be partially embedded in the first packaging part 254.

[0039] The conductive connection wire 27 may be a gold wire, a copper wire, an aluminum wire or a silver wire, etc., and may be formed by a positive punching method: a wire punching tool is used to punch a wire from the substrate 21 to the direction of the photosensitive element 23. The conductive connection wire 27 may also be formed by a reverse punching method: a wire punching tool is used to punch a wire from the photosensitive element 23 to the substrate 21. The arc height of the conductive connection wire 27 formed by the reverse punching method is smaller than that of the conductive connection wire 27 formed by the positive punching method, thereby further reducing the volume of the composite photosensitive component 20.

[0040] In one embodiment, the composite photosensitive component 20 further includes an electronic component 29 , which is embedded in the first packaging portion 254 and / or the second packaging portion 256 .

[0041] Specifically, the electronic component 29 can be one or more of a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver. It can be understood that the installation position, quantity and type of the electronic component 29 are not limited and can be set as needed.

[0042] In this way, the electronic component 29 is embedded in the first packaging part and / or the second packaging part 256, which can further reduce the overall volume of the composite photosensitive component 20. Moreover, the electronic component 29 is encapsulated in the packaging body 25 and will not be directly exposed to the space, more specifically, will not be exposed to the environment that is connected to the photosensitive element 23, so that when the composite photosensitive component 20 is assembled into the camera module 100, the electronic component 29 will not be contaminated with dust and other pollutants, and will not affect the photosensitive element 23, thereby avoiding the contamination of the photosensitive element 23 and causing the camera module 100 to have undesirable phenomena such as black spots.

[0043] Specifically, in this embodiment, the distance between the outer edge of the non-photosensitive area and the electronic component 29 is greater than 100 μm, and the distance between the electronic component 29 and the inner side wall of the first packaging part 254 is greater than 150 μm, thereby ensuring that the overall volume is reduced while reserving sufficient safety spacing to avoid being affected by the installation accuracy and manufacturing errors of components such as the electronic component 29 and the photosensitive element 23. Among them, the inner side wall of the first packaging part 254 is the side wall of the first packaging part 254 close to the end of the photosensitive element 23.

[0044] The composite photosensitive component 20 includes a package body 25 surrounded by a first package part 254 and a second package part 256, and a conductive connection line 27 between the photosensitive element 23 and the substrate 21 is provided on a side corresponding to the first package part 254. Since the first package part 254 can be molded on the substrate 21 after the conductive connection line 27 is connected to the photosensitive element 23 and the substrate 21, there is no need to reserve a wire bonding safety distance, thereby reducing the volume of the composite photosensitive component 20. In addition, since the second package part 256 is spaced apart from the photosensitive element 23 and does not need to cover the photosensitive element 23, the size requirement of the photosensitive element 23 is reduced, and photosensitive elements with different non-photosensitive area widths can be installed.

[0045] like Figure 4 The camera module 100 shown includes the above-mentioned composite photosensitive component 20 and an optical component 40.

[0046] The optical assembly 40 includes a lens barrel, a lens 44, and a voice coil motor 42 for adjusting the focal length of the lens. Specifically, the voice coil motor 42 is disposed on the package 25, the lens barrel is disposed in the voice coil motor 42, the lens 44 is disposed in the lens barrel, and the lens 44 includes a plurality of lenses stacked. Light is incident from the lens 44 and reaches the photosensitive surface of the photosensitive element 23, and the photosensitive surface converts the light signal into an electrical signal.

[0047] The above-mentioned camera module 100 has a smaller size due to the composite photosensitive component 20 provided therein, so the camera module 100 has a smaller size, which is conducive to the lightweight development of the smart device provided with the camera module 100.

[0048] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A composite photosensitive component, characterized in that: include: A substrate, comprising a first surface and a second surface arranged opposite to each other; A photosensitive element, disposed on the first surface of the substrate and electrically connected to the substrate, the photosensitive element comprising a photosensitive area and a non-photosensitive area, wherein the non-photosensitive area surrounds the photosensitive area; A packaging body, disposed on the first surface of the substrate, the packaging body is provided with a receiving cavity, and the photosensitive element is located in the receiving cavity; In which, the packaging body includes at least one first packaging part and at least one second packaging part, the non-photosensitive area is at least partially embedded in the first packaging part, the non-photosensitive area and the second packaging part are spaced apart, and the width of the non-photosensitive area on the side of the photosensitive element close to the first packaging part is greater than the width of the non-photosensitive area on the side of the photosensitive element close to the second packaging part.

2. The composite photosensitive component according to claim 1, characterized in that: The packaging body includes three first packaging parts and one second packaging part, and the three first packaging parts and one second packaging part together enclose the packaging body.

3. The composite photosensitive component according to claim 1 or 2, characterized in that: The non-photosensitive area corresponding to the first packaging part is provided with a conductive connecting line, and the conductive connecting line connects the non-photosensitive area and the substrate.

4. The composite photosensitive component according to claim 3, characterized in that: The conductive connecting wire is completely embedded in the first packaging part.

5. The composite photosensitive component according to claim 3, characterized in that: The conductive connecting line is partially embedded in the first packaging portion.

6. The composite photosensitive component according to claim 3, characterized in that: The composite photosensitive component also includes an electronic component, which is embedded in the first packaging part.

7. The composite photosensitive component according to claim 6, characterized in that: The distance between the outer edge of the non-photosensitive area and the electronic component is greater than 100 μm.

8. The composite photosensitive component according to claim 6, characterized in that: The distance between the electronic component and the inner side wall of the first packaging portion is greater than 150 μm.

9. The composite photosensitive component according to claim 1, characterized in that: The composite photosensitive component also includes an electronic component, which is embedded in the second packaging part.

10. A camera module, characterized in that: It comprises a composite photosensitive component as described in any one of claims 1 to 9.

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