Circuit board for automatic test system of implantable medical equipment

Abstract

The present invention provides a circuit board suitable for an automatic testing system for an implantable medical device, comprising: a tested implant device connection part, used to connect various output electrodes of the tested implant device; a load unit, used to simulate the load of the tested implant device; a selection unit and an acquisition device connection part, wherein the acquisition device connection part is connected to the tested implant device connection part through the selection unit, wherein the selection unit is used to control the connectivity between the acquisition device connection part and the various output electrodes connected thereto, and the acquisition device connection part is also used to connect an external acquisition device so that the external acquisition device obtains the signal emitted by the output electrode under the influence of the load.

Description

Technical Field

[0001] The present invention relates to the technical field of medical equipment detection, and in particular to a circuit board suitable for an automatic testing system of a complete machine of an implanted medical equipment. Background Art

[0002] An implantable medical device (IMD) is a medical device installed inside the user's body. This device has a battery and a circuit board (with sensors, chips and other components). The IMD relies on set programs and operating parameters to implement the corresponding therapy. These operating parameters can be set differently according to the user's condition. Because the causes and conditions of the user's disease are different, the implantable medical devices installed in different users generally have different operating states, which are reflected in many aspects of the implantable medical device, such as battery voltage, operating time, power, current size, frequency, etc.

[0003] In order to ensure the stability and safety of the implant, it is usually necessary to conduct a comprehensive inspection of the implant, especially the circuit board of the implant. There are many micro-precision components on the circuit board of the implanted device. During the inspection process, direct contact with the circuit board should be avoided as much as possible to prevent damage to various components. At the same time, the inspection efficiency should also be considered. Summary of the invention

[0004] In view of this, the present invention provides a circuit board suitable for an automatic testing system for an implantable medical device, comprising:

[0005] A connection part of the implanted device under test, used for connecting various output electrodes of the implanted device under test;

[0006] A load cell, used to simulate the load of the implanted device under test;

[0007] A selection unit and an acquisition device connection part, wherein the acquisition device connection part is connected to the connection part of the implanted device under test through the selection unit, wherein the selection unit is used to control the connectivity relationship between the acquisition device connection part and each output electrode connected to it, and the acquisition device connection part is also used to connect an external acquisition device so that the external acquisition device can obtain the signal emitted by the output electrode under the influence of the load.

[0008] Optionally, the selection unit includes at least two switch groups, and the acquisition device connection portion is provided with at least two access ports, and each of the access ports is connected to each of the output electrodes through a different switch group.

[0009] Optionally, the load unit comprises:

[0010] Multiple groups of load elements are used to simulate the loads of different types of implanted devices;

[0011] A plurality of analog switches are used to control the connection status between the plurality of groups of load elements and the collection device connection part and the output electrode.

[0012] Optionally, the load element includes a load element for simulating a deep brain stimulation device, a load element for simulating a vagus nerve stimulation device, a load element for simulating a spinal cord electrical stimulation device, and a load element for simulating a sacral nerve stimulation device.

[0013] Optionally, the tested implant device connection portion comprises:

[0014] A contact transfer device, provided with a plurality of metal springs, for respectively connecting to the output electrodes of the implanted device under test;

[0015] The gold finger plug is provided with a plurality of metal contacts, which are respectively connected to the plurality of metal springs;

[0016] The gold finger socket is fixed on the circuit board body, used for plugging the gold finger plug, and connected to the selection unit through a wire.

[0017] Optionally, the contact adapter is integrated with the gold finger plug.

[0018] Optionally, the tested implant device connection portion comprises:

[0019] The contact transfer device is fixed on the circuit board body and is provided with a plurality of metal springs for respectively connecting the output electrodes of the implanted device under test and connecting the selection unit through a wire.

[0020] Optionally, the contact conversion device includes a shell provided with at least one groove, the metal spring sheets are arranged in pairs in the groove, and the metal spring sheet pairs and the bottom of the groove are used to clamp the output cable of the implanted device under test.

[0021] Optionally, the number of metal spring pairs in each groove is the same as the number of electrodes on a single output cable of the implanted device under test.

[0022] Optionally, the length of the groove is suitable for accommodating the end of the output cable, so that when the top of the end of the output cable contacts the bottom of the side end of the groove, each of the metal spring sheet pairs corresponds to the position of the output electrode. According to the circuit board suitable for the automatic test system of the implantable medical device provided by the present invention, the implant device under test and the external detection device can be connected through the circuit board, and the implant device under test can simulate the actual working state through the load unit, and the connection state between the external device and the output electrode is controlled by the selection unit, so as to obtain the signal sent by the implant device under test. The circuit board can adapt to different detection requirements by flexibly setting the selection unit, thereby improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The features and advantages of the present invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the present invention in any way. In the accompanying drawings:

[0024] Figure 1 is a schematic structural diagram of an implant device detection system in one embodiment of the present invention;

[0025] Figure 2 is a structural schematic diagram of an implant device detection system in another embodiment of the present invention;

[0026] Figure 3 is a flow chart of a circuit board detection method in an embodiment of the present invention;

[0027] Figure 4 is a flow chart of a circuit board detection method in another embodiment of the present invention;

[0028] Figure 5 is a schematic diagram of the structure of a test board in an embodiment of the present invention;

[0029] Figure 6 is a schematic diagram of the circuit structure of a test board in an embodiment of the present invention;

[0030] Figure 7 is a schematic structural diagram of a connection portion of an implant device under test in one embodiment of the present invention;

[0031] Figure 8 is a schematic structural diagram of a connection portion of an implant device under test in another embodiment of the present invention;

[0032] Fig. 9 Schematic diagram of the structure of the contact switching device in the embodiment of the present invention. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] The implanted device communicates wirelessly and charges / powers the implanted battery / capacitor in the body. The implanted device generally includes a circuit board, a charging and communication coil, a battery, an output electrode, and a plurality of sampling resistors. The implanted device under test in the embodiment of the present invention does not include a battery or a capacitor.

[0035] The embodiment of the present invention provides an automatic testing system for detecting implanted medical instruments, such as Figure 1 As shown, the system includes: a shifting tool 11, a power supply 12 and a computer 13. The shifting tool 11 is provided with a charging programmer 14 and a test board 16, and the shifting tool 11 is used to change the relative position of the charging programmer 14 and the implant device 15 to be tested.

[0036] There are many options for the specific structure of the shifting tool 11. For example, it can be an electric device with one or more guide rails. The charging programmer 14 and the implanted device 15 can be placed on two platforms that can achieve relative movement, so that the position change between the two can be achieved. The charging programmer 14 in the embodiment of the present invention simulates an in vitro charging device, and an induction coil is also provided inside the charging programmer 14. The relative position described in this embodiment can be a relative distance, and can also include a relative angle, etc., depending on the structure of the shifting tool 11.

[0037] The test board 16 is provided with components for providing load to the implant device 15 under test and an interface for connecting the implant device 15 under test. The components on the test board 16 may include, for example, a number of relays, analog switches, resistors and other devices, which are used to simulate the load condition of the implant device 15 under test when it is actually implanted in a human body.

[0038] The computer 13 is connected to the test board 16, the charging programmer 14 and the power source 12 respectively, and is used to control the components on the test board 16 to provide a load to the implant device 15 under test, and to control the coil of the charging programmer 14 to charge the power source 12 (this power source is a battery simulator, which is set as a rechargeable battery during the charging test) through the implant device 15 under test, and to obtain the working parameters of the implant device 15 under test through the charging programmer 14. These working parameters can be transmitted to the charging programmer 14 by wireless communication.

[0039] During the charging process of the power source 12, the shifting tool 11 can change the relative position of the coil of the charging programmer 14 and the implant device 15 under test. The change in the distance or angle between the two will affect the working parameters of the implant device 15 under test, such as the charging current, charging voltage, temperature, etc. The coil of the charging programmer 14 will communicate with the implant device 15 under test through wireless communication to read these parameters. For collecting the charging current, an ammeter 17 can be set between the power source 12 and the test board 16 to measure the charging current. After that, the computer 13 can compare the data with the charging current of the current sensor of the implant device 15 under test transmitted through wireless communication. These working parameters will be used as test results to determine whether the implant device 15 under test is qualified and reliable. In the non-charging state, that is, the stage when the implant device 15 under test is undergoing treatment testing, the ammeter 17 can be used to read the power supply power consumption test data.

[0040] The test system provided by the embodiment of the present invention utilizes a power supply to simulate the battery of an implanted device, utilizes a charging programmer to simulate an in vitro charging device, and utilizes a test board to simulate the load condition of the implanted device in use, so that the implanted device under test is in an actual working environment. At the same time, a shifting tool is used to change the relative position of the charging programmer coil and the implanted device to simulate the charging operations that may occur during actual use by the user. The charging process is controlled by a computer and the working parameters of the implanted device are read. The system performs highly targeted tests on the charging performance of the implanted device, and the entire test process is automated with high work efficiency.

[0041] As a preferred implementation, the computer 13 in this embodiment can also read the working parameters of the charging programmer 14, and calculate the charging efficiency according to the working parameters of the implant device 15 under test and the working parameters of the charging programmer 14. Charging efficiency = charging current of the implant device 15 under test * voltage of the implant device 15 under test / (charging programmer voltage * charging programmer current).

[0042] The charging current and voltage of the implanted device 15 under test and the charging programmer 14 can be sampled by themselves respectively, and the charging efficiency can be calculated by the charging programmer 14 and sent to the computer 13.

[0043] Another embodiment of the present invention provides a system for detecting a circuit board of an implanted medical instrument. Figure 2As shown, the shifting tool 11 of this embodiment is also provided with a magnet 19. The implant device is usually provided with an electromagnetic switch for resetting, and the user can trigger this switch through a magnet to achieve corresponding control. The magnet 19 in this embodiment is used to detect the reset function of the implant device 15 under test. The computer 13 can control the shifting tool 11 to change the relative position of the magnet 19 and the implant device 15 under test, and detect the working state of the electromagnetic switch on the implant device 15 under test.

[0044] In this embodiment, the shifting fixture 11 is to control the position change of two groups of devices, namely, the relative position between the magnet 19 and the implanted device 15 under test, and the relative position between the coil of the charging programmer 14 and the implanted device 15 under test. To this end, the shifting fixture 11 can be provided with two orthogonal guide rails, wherein the X-axis guide rail is used to change the relative position between the magnet 19 and the implanted device 15 under test, and when the magnet 19 moves along the X-axis guide rail, it can approach or move away from the implanted device 15 under test laterally; and the Y-axis guide rail is used to change the relative position between the coil of the charging programmer 14 and the implanted device 15 under test, and when the charging programmer 14 moves along the Y-axis guide rail, it can approach or move away from the implanted device 15 under test longitudinally.

[0045] In order to more comprehensively detect the performance of the implanted device, the system of this embodiment also collects the output signal of the implanted device 15 under test. The power supply 12 in this embodiment is also used to provide power to the charging programmer 14, the test board 16 and the implanted device 15 under test, so that the implanted device 15 under test outputs a waveform signal according to the load board provided by the test board 16, such as an electric pulse stimulation signal.

[0046] Correspondingly, the system further includes an acquisition card 18 for acquiring the waveform signal output by the implanted device 15 under test, and the computer 13 obtains the waveform signal output by the implanted device 15 under test through the acquisition card.

[0047] The computer 13 can also set the output parameters of the implant device 15 under test through the charging programmer 14. The computer 13 controls the charging programmer to program the implant device 15 under test through wireless communication, and can set the pulse output amplitude and frequency of the implant device 15 under test according to the test requirements.

[0048] The test of the output waveform, the test of the charging process, and the test of the reset function can be performed in any order, and these detection operations do not conflict with each other.

[0049] Those skilled in the art can understand that there are usually many types and models of implantable devices provided by manufacturers, such as brain pacemakers, spinal cord stimulators, etc. In order to enable the detection system provided by the present invention to detect circuit boards from different implantable devices, as a preferred embodiment, the charging programmer 14 in this embodiment is also used to read the inherent information of the implantable device 15 under test, and the computer 13 can determine the signal used to control the components on the test board 16 based on the inherent information. In this way, suitable load signals can be provided to implantable devices of different models, so that the system has good scalability.

[0050] The above process of reading the inherent information should be performed before the detection begins. In combination with the above detection function, the embodiment of the present invention further provides a detection method, which is executed by the above computer 13. Figure 3 As shown, the method comprises the following steps:

[0051] S1, obtaining the inherent information of the tested implant device 15 of the implant device through the charging programmer 14, the information can be recorded in the tested implant device 15, and can also be recorded in the charging programmer 14, specifically, the type information, model information, etc.;

[0052] S2A, determine the distance value and charging parameters based on the inherent information, the distance value represents the distance between the coil of the charging programmer 14 and the implanted device 15 under test; the charging parameter can be, for example, the charging current. Before the test, each inherent information and its corresponding test scheme (including the distance value and charging parameter) can be stored in the computer 13. After the test starts, when the test board 16 is connected to the implanted device 15 under test, the computer 13 can obtain the inherent information and query the corresponding test scheme (including the distance value and charging parameter).

[0053] S3A, sending the charging parameters to the charging programmer 14 and the implanted device under test 15. The charging parameters in this embodiment include power output parameters applicable to the charging programmer 14 and power receiving parameters applicable to the implanted device under test 15. These charging parameters can, for example, specify that the charging programmer 14 outputs power at one or more charging currents, and correspondingly can also specify that the implanted device under test 15 switches appropriate resistance parameters to adapt to the size of the charging current. As described above, the computer 13 is connected to the test board 16, and the charging parameters can be transmitted to the implanted device under test 15 through the test board 16.

[0054] S4A, according to the distance value, the mobile tooling 11 is controlled to adjust the distance between the coil of the charging programmer 14 and the implanted device 15 under test, and the computer 13 sets the power supply 12 to the charged state, and controls the charging programmer 14 to charge the power supply 12 through the implanted device 15 under test based on the charging parameters. This step can have multiple specific implementations, for example, the above distance value can be set to one or more, that is, the two can be wirelessly charged at a fixed or multiple different distances; at each distance, the corresponding charging parameter can also be set to one or more, and the charging effect can be flexibly and comprehensively tested according to product and user needs.

[0055] S5A, receiving the working parameters of the implanted device 15 under test according to the charging parameters, specifically, the working parameters recorded by the sensor on the implanted device 15 under test can be read by the test board 16, for example, the charging voltage, charging current, temperature value, etc.;

[0056] S6A, judging whether the implanted device 15 under test is normal according to the working parameters, for example, judging whether the charging voltage, charging current, temperature value, etc. of the implanted device 15 under test are in line with expectations, thereby determining whether its status is normal.

[0057] The detection method provided in the embodiment of the present invention determines the corresponding test parameters by automatically acquiring the inherent information of the implanted device under test, sends appropriate charging parameters to the charging programmer and the implanted device under test, so that the implanted device under test is in an actual working environment, and at the same time uses a shifting tool to change the relative position of the coil of the charging programmer and the implanted device under test to simulate the charging operations that may occur during actual use by the user. In this method, the charging process is controlled by a computer and the working parameters of the implanted device under test are read, so as to perform more targeted detection of the implanted device. The detection process realizes automated operation and has high work efficiency.

[0058] In order to improve convenience and accuracy, the above inherent information is preferably stored in the implant device 15 under test, and the above step S1 may specifically include the following steps:

[0059] S11, sending a start signal to the charging programmer 14, and waiting for the charging programmer 14 to communicate with the implanted device 15 under test to obtain inherent information.

[0060] S12, receiving the inherent information fed back by the charging programmer 14.

[0061] The start signal can be a simple digital signal. After receiving the start signal, the charging programmer 14 can send a handshake signal to the implanted device under test 15 wirelessly, and the signal can be a waveform signal; the implanted device under test 15 can parse the handshake signal and respond, sending inherent information to the charging programmer 14, and then to the computer 13.

[0062] As a preferred implementation, the charging parameters in this embodiment include charging time and charging current, wherein each distance value corresponds to the same charging time and multiple charging currents. For example, four distance values ​​X1...X4, charging time t, and charging current A1...A4 can be preset, and these parameters can form multiple combinations. S4A may include the following steps:

[0063] S4A1, control the mobile tooling 11 to set the charging programmer 14 and the implanted device 15 under test at different distances to stay for corresponding charging time;

[0064] S4A2, when staying, controls the charging programmer 14 to charge the power source 12 through the implanted device under test 15 and the implanted device under test 15 based on multiple charging currents respectively.

[0065] For example, you can stay at the X1 distance for at least 4*t (four time periods of equal length), and use A1...A4 to charge in each time period, thereby completing the corresponding charging action of X1; then adjust the distance to X2, and also stay for four time periods of equal length, and use A1...A4 to charge in each time period, and then use the same operation method at the X3 and X4 distances to complete the corresponding charging actions of X1...X4.

[0066] S5A is performed synchronously with S4A, and the computer 13 collects the working parameters of the implanted device 15 under test in real time during the charging process, thereby obtaining four groups of parameters, namely the working parameters corresponding to four different distances, wherein each group of parameters includes working parameters corresponding to four charging currents.

[0067] The above preferred detection scheme can accurately detect the working status of the implanted device under different distances and different charging parameters, thereby improving the reliability of the detection result.

[0068] In order to further improve the reliability and convenience of the detection operation, after the above step S1, the following steps may be further included:

[0069] S1A, determining the criterion parameters according to the inherent information, this step can be performed simultaneously with S2A. The criterion parameters should correspond to the working parameters collected in step S5A, for example, including standard charging voltage, standard charging current, temperature upper limit value, etc.

[0070] When the criterion parameters can be obtained, step S6A may include the following steps:

[0071] S6A1, comparing the working parameters with the criterion parameters;

[0072] S6A2, judging whether the implanted device 15 under test is normal according to the comparison result, for example, judging whether the working parameter is consistent with the judgment parameter, or whether the error between the two is within an acceptable range, thereby determining whether the implanted device 15 under test is normal.

[0073] The following is an introduction to the output waveform detection operation. After step S1, the computer 13 can control the charging programmer 14 to set the implant device 15 to be tested by wireless communication, for example, the output amplitude and frequency can be set, and then the output signal detection process is performed. Specifically, Figure 4 As shown, the method may also include the following steps:

[0074] S2B, determine the load parameters and power supply parameters based on the inherent information. The load parameters and power supply parameters can also be part of the test plan. This step can be performed simultaneously with the above step S2A. The load parameters and power supply parameters of each type or model of product are different. For example, the load parameter is a 1k resistor for a neurostimulator and a 500 ohm resistor for a spinal cord stimulator; the power supply parameter is, for example, the supply voltage.

[0075] S3B, controlling the power supply 12 to supply power to the implanted device 15 under test according to the power supply parameters, and the computer 13 setting the power supply 12 to an output power state to supply power to the implanted device 15 under test to simulate an actual working state;

[0076] S4B, sending a load parameter to the test board 16 connected to the tested implant device 15, the test board 16 will adjust its own component state according to the received load parameter to simulate the load of the tested implant device 15, so that the tested implant device 15 outputs a waveform signal under the influence of the load parameter;

[0077] S5B, acquiring the waveform signal output by the implant device 15 under test through the acquisition card 18;

[0078] S6B, judging whether the implanted device 15 under test is normal according to the waveform signal.

[0079] The above steps S3B-S6B and steps S3A-S6A are executed in isolation without interfering with each other. This method performs full-automatic detection on the output signal of the implant device 15 to further improve the comprehensiveness and convenience of the detection operation.

[0080] Regarding the determination of the output waveform, similar to step S1A, after step S1, the following steps may also be included:

[0081] S1B, determining the criterion signal based on the inherent information;

[0082] In this case step S6B may include:

[0083] S6B1, comparing the waveform signal with the criterion signal;

[0084] S6B2, judging whether the implanted device 15 under test is normal according to the comparison result. There are many specific ways of signal comparison, which will not be described in detail in the present invention.

[0085] In addition to the detection of the charging function and the output signal, a step of detecting the reset function of the implanted device 15 under test can also be added. This step is performed while ensuring that the power supply 12 is in a state of supplying power to the implanted device 15 under test. The computer 13 controls the magnet on the mobile tooling 11 to approach the implanted device 15 under test, and at the same time, the charging programmer 14 is used to check whether the implanted device 15 under test is reset (various parameters are restored to their initial values).

[0086] An embodiment of the present invention provides a computer device, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor executes the above-mentioned implantable medical instrument circuit board detection method.

[0087] Accordingly, the embodiment of the present invention provides a circuit board suitable for an automatic testing system for an implantable medical device, as the above-mentioned test board 16, such as Figure 5 The test board 16 shown includes:

[0088] The tested implant device connection part 161 is used to connect the various output electrodes of the tested implant device 15. The tested implant device connection part 161 has various specific forms, and its purpose is to maintain electrical connection with the output electrodes.

[0089] The load unit 163 is used to simulate the load of the implanted device under test. The implanted device will bear a certain load in the human body. The loads of implanted devices of different types and uses are different. This unit can be equipped with a variety of load elements to simulate the loads borne by different implanted devices 15 under test, such as a 1k resistor for a neurostimulator, a 500 ohm resistor for a spinal cord stimulator, etc.

[0090] The selection unit 164 and the acquisition device connection part 165. The acquisition device connection part 165 is connected to the implant device connection part 161 under test through the selection unit 164. The function of the selection unit 164 is to control the connection relationship between the acquisition device connection part 165 and the output electrode connected thereto, and at the same time, the acquisition device connection part 165 is connected to an external acquisition device, i.e., the acquisition card 18, and the acquisition card 18 can obtain the signal emitted by the connected electrode under the influence of the load.

[0091] In actual situations, the implanted device 15 under test usually includes a large number of output electrodes. For example, a brain pacemaker may have more than ten output electrodes, and each output electrode can send out stimulation signals independently. In order to perform accurate detection, the detection program may only control some of the output electrodes to send out signals at the same time. Accordingly, the acquisition device connection part 165 can connect all the output electrodes through the selection unit 164, and the selection unit 164 can only connect some of the electrodes that are outputting signals at the same time.

[0092] According to the implantable medical instrument detection circuit board provided in an embodiment of the present invention, the implanted device under test and an external detection device can be connected through the circuit board, and the implanted device under test can simulate the actual working state through the load unit. At the same time, the connection state between the external device and the output electrode is controlled by the selection unit, so as to obtain the signal emitted by the implanted device under test. The circuit board can adapt to different detection requirements by flexibly setting the selection unit, thereby improving the detection efficiency.

[0093] As a preferred embodiment, Figure 6 As shown, the selection unit 164 includes a plurality of analog switches, which are connected to the output electrodes (including the metal shell) of the implanted device under test one by one, and the connection relationship between the output electrodes and the acquisition device connection part 165 is controlled by the open and closed states of the analog switches. The acquisition device connection part 165 outputs the waveform signal emitted by the electrode under the influence of the load to the external acquisition device.

[0094] In this embodiment, the selection unit 164 is provided with two switch groups, and the acquisition device connection part 165 is provided with two corresponding access ports Out1 and Out2, and each access port is connected to the output electrode (including the metal shell) of the implant device 15 under test through a different switch group. In this embodiment, the port Out1 is connected to one end of the first switch group 1641, and the other end of the first switch group 1641 is connected to all the output electrodes and the metal shell; the port Out2 is connected to one end of the second switch group 1642, and the other end of the second switch group 1642 is connected to all the output electrodes and the metal shell.

[0095] The two ports Out1 and Out2 of the acquisition device connection part 165 are connected to any two of the output electrodes and metal shells of the implanted device under test. The states of the first switch group 1641 and the second switch group 1642 can be controlled by a single-chip microcomputer. Specifically, any two output electrodes are connected to the computer interface, serial port chip and single-chip microcomputer, and the computer controls the corresponding analog switches in the first switch group 1641 and the second switch group 1642 according to the test requirements, thereby realizing the connection between the acquisition card and the electrode output end.

[0096] In practical applications, in order to collect more output signals at the same time, more access ports and more switch groups can be set.

[0097] In a preferred embodiment, the load unit 163 may include:

[0098] A plurality of groups of load elements 1631 are used to simulate loads of different types of implanted devices;

[0099] Multiple analog switches, which form a third switch group 1632, are used to control the connection status of multiple groups of load elements 1631 with the acquisition device connection part 165 and the output electrode. Two ports Out1 and Out2 are connected to the two ends of the load. Through the computer connection interface, serial port chip and single-chip microcomputer, the computer controls the corresponding analog switches in the third switch group 1632 according to the test requirements, thereby realizing the connection between the two ports Out1 and Out2 and different loads. Optional loads include DBS (deep brain stimulation), VNS (vagusneve stimulation), SCS (Spinal cord stimulation) and SNM (Sacral Neuromodulation) loads, etc.

[0100] Thereby, loads of different product categories are connected to any two output electrodes, and the output waveform of the implant device 15 under test is connected to the ports Out1 and Out2 and fed back to the acquisition card 18 for processing.

[0101] Regarding the power supply of the test board 16 and the collection of the charging current, the power supply 12 and the ammeter 17 can be connected to the test board 16. The power supply 12 can provide two power supplies, one is a variable voltage power supply 10 (ranging from 4.1V to 2V), which uses a battery simulation power supply (charging product for charging function testing) to power the implanted device 15 under test; the other is a constant voltage, which powers the electrical components on the test board 16 through a voltage chip.

[0102] Regarding the tested implant device connection portion 161, the present invention provides two optional implementations.

[0103] As a first implementation method, Figure 7 As shown, the connection part 161 of the implantable device under test includes a contact adapter 1611, a gold finger plug 1612 and a gold finger socket 1613. The contact adapter 1611 and the gold finger plug 1612 are fixedly connected, for example, they can be integrally arranged; the gold finger plug 1612 and the gold finger socket 1613 are pluggable.

[0104] The contact adapter 1611 is provided with a plurality of metal springs for respectively connecting the output electrodes of the implanted device under test. For example, if there are 8 output electrodes on an output cable of the implanted device under test, the contact adapter 1611 is provided with 8 sets of metal springs correspondingly to maintain electrical connection with these electrodes;

[0105] The gold finger plug 1612 is provided with a plurality of metal contacts, which respectively correspond to the metal springs of the contact adapter 1611, and can be electrically connected through wires, for example;

[0106] The gold finger socket 1613 is fixed on the circuit board body 160 , and is used to plug the gold finger plug 1612 , and is connected to the selection unit 164 through a wire.

[0107] In the above-mentioned embodiment, a gold finger socket is arranged on the circuit board body, and is connected to the contact adapter through a gold finger plug, so as to realize the connection of the output electrode of the implanted device under test. The gold finger socket can not only connect the whole implanted device under test, but also be used to connect the core circuit board of the implanted device under test. This method makes the test board itself have a certain versatility and can meet different test requirements.

[0108] As a second implementation method, Figure 8 As shown, the tested implant device connection part 161 includes:

[0109] The contact transfer device 1611 is different from the previous embodiment in that the device is directly fixed on the circuit board body 160. Its metal springs are respectively connected to the output electrodes of the implanted device under test, and are directly connected to the selection unit 164 through wires.

[0110] Compared with the previous embodiment, the above embodiment has a simple structure and is more targeted, and can be specifically used to meet the testing requirements of the entire implant device under test.

[0111] Regarding the contact transfer device 1611, the embodiment of the present invention provides a preferred structure, such as Fig. 9 As shown, the device includes a housing 16110 provided with a groove 16111. In this embodiment, the implanted device under test has two groups of output electrodes, so the device is correspondingly provided with two grooves 16111, and metal springs 16112 are arranged in pairs in the grooves 16111. The metal spring pairs and the bottom of the grooves 16111 can clamp the output cable 151 of the implanted device under test. The metal spring pairs themselves have a certain elasticity, and combined with the bottom of the housing, this structure can play the effect of firmly fixing and facilitating plugging and unplugging.

[0112] The multiple output electrodes of the implanted device under test are evenly arranged at the end of the output cable 151. Accordingly, the number of metal spring pairs in the groove 16111 in this embodiment is the same as the number of electrodes on the single output cable 151 of the implanted device under test. Fig. 9 The output cable 151 of the implantable device under test in the embodiment shown in the figure is provided with 8 output electrodes at the end, and 8 pairs of metal springs 16112 are respectively provided in the two grooves 16111. The length of the groove 16111 in the embodiment matches the length of the output electrodes arranged at the end of the output cable 151, and is only suitable for accommodating the end of the output cable 151. When the output cable 151 is inserted into the groove 16111, the end of the cable 151 can touch the bottom of the side end of the groove 16111, and at the same time, each pair of metal springs just contacts each output electrode.

[0113] In the above structure, the groove length of the contact adapter matches the electrode arrangement length at the end of the output cable, and the clamping acceptance point of the output cable of the implanted device under test is only on the metal electrode. This structure is convenient for testers to operate and can protect the output cable.

[0114] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A circuit board suitable for an automatic test system for an implantable medical device, characterized in that: include: A connection part of the implanted device under test, used to connect various output electrodes of the implanted device under test, each of which can send out a stimulation signal independently; A load unit, used to simulate the load borne by the implanted device under test in the human body, the load unit comprising: a plurality of groups of load elements, respectively used to simulate the loads of different types of implanted devices; a plurality of simulation switches, used to control the connection states of the plurality of groups of load elements and the connection parts of the acquisition device and the output electrodes, so that the implanted device under test outputs a waveform signal according to the load provided by the circuit board; A selection unit and an acquisition device connection part, wherein the acquisition device connection part is connected to the connection part of the implanted device under test through the selection unit, wherein the selection unit is used to control the connectivity relationship between the acquisition device connection part and each output electrode connected to it, and the acquisition device connection part is also used to connect an external acquisition device so that the external acquisition device obtains the stimulation signal emitted by the output electrode under the influence of the load.

2. The circuit board according to claim 1, characterized in that: The selection unit includes at least two switch groups, and the acquisition device connection part is provided with at least two access ports, and each of the access ports is connected to each of the output electrodes through a different switch group.

3. The circuit board according to claim 1, characterized in that: The load elements include a load element for simulating a deep brain stimulation device, a load element for simulating a vagus nerve stimulation device, a load element for simulating a spinal cord electrical stimulation device, and a load element for simulating a sacral nerve stimulation device.

4. The circuit board according to claim 1, characterized in that: The implant device connection portion to be tested comprises: A contact transfer device, provided with a plurality of metal springs, for respectively connecting to the output electrodes of the implanted device under test; The gold finger plug is provided with a plurality of metal contacts, which are respectively connected to the plurality of metal springs; The gold finger socket is fixed on the circuit board body, used for plugging the gold finger plug, and connected to the selection unit through a wire.

5. The circuit board according to claim 4, characterized in that: The contact adapter is integrally arranged with the gold finger plug.

6. The circuit board according to claim 1, characterized in that: The implant device connection portion to be tested comprises: The contact transfer device is fixed on the circuit board body and is provided with a plurality of metal springs for respectively connecting the output electrodes of the implanted device under test and connecting the selection unit through a wire.

7. The circuit board according to any one of claims 4 to 6, characterized in that: The contact switching device comprises a shell provided with at least one groove, the metal spring sheets are arranged in pairs in the groove, and the metal spring sheet pairs and the bottom of the groove are used to clamp the output cable of the implanted device under test.

8. The circuit board according to claim 7, characterized in that: The number of the metal spring sheet pairs in each groove is the same as the number of electrodes on a single output cable of the implanted device under test.

9. The circuit board according to claim 8, characterized in that: The length of the groove is suitable for accommodating the end of the output cable, so that when the top of the end of the output cable contacts the bottom of the side end of the groove, each of the metal spring sheet pairs corresponds to the position of the output electrode.

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