Display device and method of manufacturing the same

Abstract

The present invention relates to a display device and a method for manufacturing the display device. The display device may include: a substrate; a transparent partition wall arranged on the substrate, the transparent partition wall being configured to define a plurality of openings; a light shielding member arranged on an upper surface and a side surface of the transparent partition wall, the light shielding member including a negative photosensitive organic material; and a first color conversion pattern arranged in at least one of the plurality of openings, the first color conversion pattern including a quantum dot material or a fluorescent material.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2017-0095072, filed on Jul. 27, 2017, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Example embodiments relate to a display apparatus and a method of manufacturing the display apparatus. Background Art

[0004] With the development of multimedia, display devices are becoming more and more important. Therefore, various display devices such as liquid crystal displays (LCDs) and organic light emitting diode (OLED) displays are being developed.

[0005] Specifically, an LCD includes a display panel, a liquid crystal layer, and a light source unit that provides light to the display panel, and the display panel includes field generating electrodes such as pixel electrodes and common electrodes. The LCD rearranges the liquid crystals by applying voltages to the field generating electrodes, thereby controlling the amount of light passing through the liquid crystal layer for each pixel. As a result, an image is displayed on the LCD.

[0006] As a way to make each pixel display one primary color uniquely, a color conversion pattern can be placed in each pixel on the light path from the light source to the observer. For example, a color filter can realize the primary color by absorbing a specific band of incident light and transmitting only another specific band. At the same time, it is necessary to develop a method for further improving the color purity of the display device.

[0007] A wavelength shifting material such as a quantum dot or a fluorescent material shifts the peak wavelength of incident light to emit light having a color different from the color of the incident light. That is, a color conversion pattern can be realized using the wavelength shifting material. However, if the light emitted by the wavelength shifting material propagates to another adjacent pixel, a defect in which light leaks from an unexpected pixel, i.e., a light leakage defect, may occur.

[0008] The above information disclosed in this Background section is only for enhancement of understanding of the background of the inventive concept and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art. Summary of the invention

[0009] Exemplary embodiments provide a display apparatus having improved display quality.

[0010] Exemplary embodiments also provide a method of manufacturing a display apparatus having improved display quality.

[0011] Additional aspects will be set forth in the detailed description which follows, and in part will be apparent from the disclosure, or may be learned by practice of the inventive concepts.

[0012] According to an exemplary embodiment, a display device may include: a substrate; a transparent partition wall arranged on the substrate, the transparent partition wall being configured to define a plurality of openings; a shading member arranged on an upper surface and a side surface of the transparent partition wall, the shading member including a negative photosensitive organic material; and a first color conversion pattern arranged in at least one of the plurality of openings, the first color conversion pattern including a quantum dot material or a fluorescent material.

[0013] The transparent partition wall may include: a plurality of first partition wall portions extending in a first direction; and a plurality of second partition wall portions extending in a second direction intersecting the first direction, wherein the opening may be defined by the first partition wall portions and the second partition wall portions, and the shading member has a lattice shape in a plan view.

[0014] A surface of the light shielding member disposed on the upper surface of the transparent partition wall may have greater hydrophobicity than a surface of the light shielding member disposed on the side surface of the transparent partition wall.

[0015] The light shielding member disposed on the upper surface of the transparent partition wall may have a thickness greater than a thickness of the light shielding member disposed on the side surface of the transparent partition wall.

[0016] The light shielding member disposed on the upper surface of the transparent partition wall may have a thickness of about 1.3 μm or more and an optical density of about 2.0 / 1.3 μm or more.

[0017] The shading member may be directly arranged on the transparent partition wall, and the shading member includes: a first surface, at least a portion of which directly contacts the transparent partition wall; and a second surface facing away from the first surface, wherein the roughness of the second surface may be greater than that of the first surface.

[0018] The light blocking member may further include: a third surface connecting the first surface and the second surface, wherein a roughness of the second surface may be greater than a roughness of the third surface.

[0019] The transparent partition wall may have a light transmittance of about 90% or more.

[0020] The transparent partition wall may include particles dispersed therein.

[0021] Side surfaces of the transparent partition walls may be inclined at an average inclination angle relative to a surface of the substrate, wherein the transparent partition walls may have a height of about 7.0 μm or more, and wherein the average inclination angle may be about 30 degrees to 85 degrees.

[0022] The display device may include: a first pixel configured to display a first color; a second pixel configured to display a second color, the second color having a shorter peak wavelength than the first color; and a third pixel configured to display a third color, the third color having a shorter peak wavelength than the second color, wherein the display device may further include: a liquid crystal layer arranged on the first color conversion pattern; a band filter arranged between the first color conversion pattern and the liquid crystal layer, the band filter configured to selectively transmit light having a band including a peak wavelength of the third color and selectively block light having a band including a peak wavelength longer than the peak wavelength of the third color; and a light source arranged on the liquid crystal layer, the light source configured to provide light of the third color, wherein the first color conversion pattern is arranged in the first pixel, the first color conversion pattern configured to convert a color of incident light into the first color, and wherein at least a portion of the band filter may directly contact the light shielding member.

[0023] At least a portion of the band filter may directly contact the first color conversion pattern and the light blocking member, the band filter having a substantially constant thickness.

[0024] The display device may further include: a second color conversion pattern arranged in the second pixel; and a light-transmitting pattern arranged in the third pixel, wherein the second color conversion pattern is configured to convert a color of incident light into a second color, wherein the light-shielding member may be disposed between the first color conversion pattern and the second color conversion pattern, and wherein the light-shielding member is disposed between the first color conversion pattern and the light-transmitting pattern.

[0025] The display device includes: a first pixel configured to display a first color; a second pixel configured to display a second color, the second color having a peak wavelength shorter than the first color; and a third pixel configured to display a third color, the third color having a peak wavelength shorter than the second color, wherein the display device may further include: a liquid crystal layer arranged on the first color conversion pattern; a light source arranged on the liquid crystal layer, the light source being configured to provide light of the third color; and a band filter arranged between the shading member and the first color conversion pattern, the band filter being configured to selectively transmit light having a band including a peak wavelength longer than the peak wavelength of the third color, and selectively block light having a band including a peak wavelength of the third color, wherein at least a portion of the band filter may be arranged on an upper surface of the transparent partition wall.

[0026] The display device may further include: a band filter arranged between the light shielding member and the first color conversion pattern, the band filter being configured to selectively transmit light of a specific band, wherein the band filter does not overlap with an upper surface of the transparent partition wall, and wherein at least a portion of the first color conversion pattern directly contacts the light shielding member.

[0027] The display device may further include a band filter disposed between the substrate and the transparent partition wall, the band filter being configured to selectively transmit light of a specific band.

[0028] The display device may further include an opaque material pattern disposed between the band filter and the transparent partition wall, the opaque material pattern including a material different from that of the light blocking member.

[0029] The display device may further include: a band filter arranged between the substrate and the first color conversion pattern, the band filter configured to selectively transmit light of a specific band; and an opaque material pattern arranged between the substrate and the light blocking member, the opaque material pattern including a material different from the light blocking member.

[0030] The display device may further include: a band filter arranged between the substrate and the first color conversion pattern, the band filter configured to selectively transmit light of a specific band; and an opaque material pattern arranged between the substrate and the transparent partition wall, the opaque material pattern including a material different from the light shielding member.

[0031] The display device may further include: a first light-transmitting layer arranged on the light-shielding member to surround at least a portion of the light-shielding member; and a second light-transmitting layer directly arranged on the first light-transmitting layer to surround at least a portion of the first light-transmitting layer, wherein the refractive index of the second light-transmitting layer may be greater than the refractive index of the first light-transmitting layer.

[0032] The display device may further include: a first light-transmitting layer arranged on the upper surface and side surfaces of the transparent partition wall to surround at least a portion of the transparent partition wall; and a second light-transmitting layer arranged between the first light-transmitting layer and the light-shielding member to surround at least a portion of the first light-transmitting layer, wherein the refractive index of the second light-transmitting layer may be greater than the refractive index of the first light-transmitting layer.

[0033] According to an exemplary embodiment, a method for manufacturing a display device may include: arranging a partition wall pattern having light transmittance and an opaque material pattern on a first surface of a substrate; applying a light shading member forming composition to the partition wall pattern and the opaque material pattern; and using the opaque material pattern as a light shading mask, forming a light shading member on the upper surface and side surfaces of the partition wall pattern by radiating light from a second surface of the substrate.

[0034] Arranging the partition wall pattern and the opaque material pattern may include: arranging the opaque material pattern on the first surface of the substrate such that at least a portion of the first surface of the substrate is exposed; and arranging the partition wall pattern on the exposed first surface of the substrate.

[0035] Arranging an opaque material pattern may include: arranging an opaque material layer on the first surface of the substrate; arranging a positive photosensitive layer on the opaque material layer; using a mask as a light-shielding mask to form a positive photosensitive pattern layer; and using the positive photosensitive pattern layer as an etching mask to form an opaque material pattern by partially etching the opaque material layer, wherein arranging a partition wall pattern may include: arranging a negative photosensitive layer on the opaque material pattern; and using the mask as a light-shielding mask to form a partition wall pattern.

[0036] At least a portion of the partition wall pattern may overlap with the opaque material pattern.

[0037] The partition wall pattern may be spaced apart from the opaque material pattern, and wherein at least a portion of the first surface of the substrate may be exposed without being covered by the partition wall pattern and the opaque material pattern.

[0038] Applying the light shielding member forming composition includes disposing the light shielding member forming composition in a space between the partition wall pattern and the opaque material pattern, and wherein at least a portion of the light shielding member may directly contact the substrate.

[0039] Applying the light blocking member forming composition may include arranging the light blocking member forming composition to have a thickness greater than a height of the partition wall pattern.

[0040] The method of manufacturing a display device may further include, after coating the light shielding member forming composition, treating the entire surface of the coated light shielding member forming composition with fluorine.

[0041] The method of manufacturing a display device may further include forming a concave and protrusion pattern layer on a surface of the uncured light blocking member forming composition and on a surface of the light blocking member formed on an upper surface of the partition wall pattern after radiating light.

[0042] The method of manufacturing a display device may further include: before arranging the partition wall pattern and the opaque material pattern, arranging a band filter pattern on the first surface of the substrate, wherein the opaque material pattern may be formed on the band filter pattern to overlap with the band filter pattern, and wherein the opaque material pattern may be narrower than the band filter pattern.

[0043] Arranging the partition wall pattern and the opaque material pattern may include: arranging the partition wall pattern on the first surface of the substrate so that at least a portion of the first surface of the substrate is exposed; and arranging the opaque material pattern on the portion of the first surface of the substrate exposed by the partition wall pattern.

[0044] At least a portion of the opaque material pattern overlaps the partition wall pattern.

[0045] The method of manufacturing a display device may further include, after forming a light-shielding member: exposing at least a portion of a first surface of the substrate by removing at least a portion of the opaque material pattern; disposing an ink composition onto the exposed first surface of the substrate, the ink composition comprising a wavelength-shifting material; and curing the ink composition.

[0046] Forming a shading member may include: pre-baking a shading member forming composition; partially photocuring the pre-baked shading member forming composition by using an opaque material pattern as a shading mask; developing to form a shading member arranged on the upper surface and side surface of a partition wall pattern by applying a developer to the partially photocured shading member forming composition; and hard-baking the shading member, wherein partially photocuring the pre-baked shading member forming composition may include: radiating light from the second surface of the substrate; transmitting light through the substrate; transmitting light through the partition wall pattern; transmitting light through the upper surface of the partition wall pattern; and transmitting light through the side surface of the partition wall pattern.

[0047] The foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and together with the description serve to explain the principles of the inventive concept.

[0049] Figure 1 is an exploded perspective view of a display device according to an exemplary embodiment;

[0050] Figure 2 yes Figure 1 The layout of any pixel of the display device shown;

[0051] Figure 3 is along Figure 2 A cross-sectional view of the first display panel taken along section line III-III';

[0052] Figure 4 is along Figure 2 A cross-sectional view taken along section line IV-IV';

[0053] Figure 5 yes Figure 4 An enlarged view of area "A";

[0054] Figure 6 is along Figure 2 A cross-sectional view taken along section line VI-VI';

[0055] Figure 7 yes Figure 4and Figure 6 A schematic perspective view of the partition wall shown;

[0056] Figure 8 The diagram shows Figure 4 a path of light of the second display panel;

[0057] Fig. 9A and Fig. 9B A display device according to an exemplary embodiment is illustrated;

[0058] Fig. 10A , Fig. 10B , Fig.11 , Fig. 12A , Fig. 12B , Fig.13A , Fig. 13B , Fig.14A , Fig. 14B , Fig.15A , Fig. 15B , Fig.16A , Fig. 16B , Fig.17A , Fig. 17B , Fig.18A , Fig.18B , Fig.19A , Fig.19B , Fig. 20A , Fig. 20B , Fig.21A , Fig. 21B , Fig. 21C , Fig.22A , Fig. 22B , Fig.23A , Fig. 23B , Fig.24A , Fig. 24B , Fig.25A and Fig.25B A display device according to an embodiment is illustrated;

[0059] Fig.26A , Fig.26B , Fig.26C , Fig.26D , Fig.26E , Fig.26F , Figure 26G , Fig.26H , Fig.26I , Fig.26J , Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O is a cross-sectional view illustrating a method of manufacturing a display device according to an exemplary embodiment;

[0060] Fig.27A , Fig.27B , Fig.27C , Fig.27D , Fig.27E and Fig.27F is a cross-sectional view illustrating a method of manufacturing a display device according to an exemplary embodiment; and

[0061] Fig.28A , Fig.28B , Fig.28C , Fig.28D , Fig.28E , Fig.28F , Figure 28G , Fig.28H , Fig.29A , Fig.29B , Fig.29C , Fig.29D , Fig.29E , Fig.29F , Figure 29G , Fig.29H , Fig. 30A , Fig. 30B , Fig. 30C , Fig.30D , Fig.30E , Fig.30F , Fig.31A , Fig.31B , Fig. 31C , Fig.31D , Fig.31E , Fig.31F , Fig.32A , Fig.32B , Fig.32C , Fig.32D , Fig.32E , Fig.32F , Fig.33A , Fig.33B , Fig.33C , Fig.33D , Fig.33E , Fig.33F , Fig.34A , Fig.34B , Fig.34C , Fig.34D , Fig.34E , Fig.34F , Fig.35A , Fig.35B , Fig.35C , Fig.35D , Fig.35E , Fig.35F , Figure 35G , Fig.36A , Fig.36B , Fig.36C , Fig.36D , Fig.36E , Fig.36F , Figure 36G , Fig.37A , Fig.37B , Fig.37C , Fig.37D , Fig.37E , Fig.37F, Figure 37G and Fig.37H is a cross-sectional view illustrating a method of manufacturing a display device according to an embodiment. DETAILED DESCRIPTION

[0062] In the following description, for the purpose of explanation, numerous specific details are set forth to provide a comprehensive understanding of the various exemplary embodiments. However, it is to be understood that the various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the various exemplary embodiments.

[0063] In the drawings, the size and relative sizes of layers, films, panels, regions, etc. may be exaggerated for clarity and descriptive purposes. Furthermore, the same reference numerals denote the same elements.

[0064] When an element or layer is referred to as "being located on another element or layer", "being connected to" or "being coupled to" another element or layer, the element or layer may be directly located on another element or layer, directly connected to or coupled to another element or layer, or there may be an intermediate element or layer. However, when an element or layer is referred to as "being directly located on another element or layer", "being directly connected to another element or layer" or "being directly coupled to another element or layer", there is no intermediate element or layer. For the purpose of this disclosure, "at least one of X, Y and Z" and "at least one selected from the group consisting of X, Y and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y and Z, for example, XYZ, XYY, YZ and ZZ. Throughout the text, the same number refers to the same element. As used herein, the term "and / or" includes any and all combinations of one or more of the items listed in association.

[0065] Although the terms first, second, etc. can be used in this article to describe each element, component, region, layer and / or part, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish an element, component, region, layer and / or part from another element, component, region, layer and / or part. Therefore, the first element, component, region, layer and / or part discussed below can be referred to as the second element, component, region, layer and / or part, without departing from the teaching of the present disclosure.

[0066] For descriptive purposes, spatially relative terms such as "below," "beneath," "below," "above," "on," etc. may be used herein to describe the relationship of one element or feature illustrated in the accompanying drawings to another element or feature. Spatially relative terms are intended to cover different orientations of the device when in use, in operation, and / or in manufacture other than the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as being "below" or "below" other elements or features will be "above" the other elements or features. Therefore, the exemplary term "below" may include both above and below orientations. Moreover, the device may be oriented in other directions (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are therefore interpreted accordingly.

[0067] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, the terms "include" and / or "comprise", when used in this specification, specify the presence of the described features, wholes, steps, operations, elements, components and / or combinations thereof, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0068] Various exemplary embodiments are described herein with reference to cross-sectional illustrations, which are schematic illustrations of idealized exemplary embodiments and / or intermediate structures. Therefore, variations between the illustrated shapes may be expected as a result of, for example, manufacturing techniques and / or tolerances. Therefore, the exemplary embodiments disclosed herein should not be interpreted as limited to the shapes of the regions illustrated in particular, but will include deviations in shape resulting from, for example, manufacturing. For example, an insertion region illustrated as a rectangle will typically have circular or curvilinear features and / or a gradient of insertion concentration at its edges, rather than a binary change from an insertion to a non-insertion region. Similarly, a buried region formed by insertion may result in some insertion in the region between the buried region and the surface on which the insertion is made. Therefore, the regions illustrated in the accompanying drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of the regions of the device, and are not intended to be limiting.

[0069] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0070] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0071] Figure 1 is an exploded perspective view of a display apparatus 1 according to an exemplary embodiment. Figure 2 yes Figure 1 The layout of any pixels of the display device 1 is shown.

[0072] refer to Figure 1 and Figure 2 , the display apparatus 1 according to an exemplary embodiment includes a display panel 31 and a light source unit 50 that provides light to the display panel 31 .

[0073] The display panel 31 may include a first display panel SUB1, a second display panel SUB2 facing the first display panel SUB1, and a liquid crystal layer LCL interposed between the first display panel SUB1 and the second display panel SUB2. The liquid crystal layer LCL may be sealed by the first display panel SUB1, the second display panel SUB2, and a sealing member combining the first display panel SUB1 and the second display panel SUB2 together.

[0074] A plurality of pixels arranged substantially in a matrix form in a plan view may be defined in the display panel 31. As used herein, "pixel" refers to an area formed by dividing a display area in a plan view to display a color image, and one pixel may represent a predetermined primary color. That is, one pixel may be the smallest unit of the display panel 31 that may represent a color independent of other pixels.

[0075] The pixel may include a first pixel PXa displaying a first color, a second pixel PXb displaying a second color, and a third pixel PXc displaying a third color, the second color having a shorter peak wavelength than the first color, and the third color having a shorter peak wavelength than the second color. In an exemplary embodiment, the first pixel PXa, the second pixel PXb, and the third pixel PXc sequentially arranged in the first direction X may form a basic unit, and the basic unit may be repeated in the first direction X. In addition, each of the first pixel PXa, the second pixel PXb, and the third pixel PXc may be repeated in the second direction Y.

[0076] For example, the first pixel PXa may be a pixel displaying a first color (red), the second pixel PXb adjacent to the first pixel PXa in the first direction X may be a pixel displaying a second color (green), and the third pixel PXc adjacent to the second pixel PXb in the first direction X may be a pixel displaying a third color (blue), the first color having a peak wavelength in the range of approximately 610 nanometers (nm) to 650 nanometers, the second color having a peak wavelength in the range of approximately 530nm to 570nm, and the third color having a peak wavelength in the range of approximately 430nm to 470nm.

[0077] In addition, the fourth pixel PXd adjacent to the first pixel PXa in the second direction Y can also display the first color, the fifth pixel PXe adjacent to the second pixel PXb in the second direction Y can also display the second color, and the sixth pixel PXf adjacent to the third pixel PXc in the second direction Y can also display the third color.

[0078] The display panel 31 may include a plurality of gate lines GL extending in a first direction X and a plurality of data lines DL extending in a second direction Y and insulated from the gate lines GL. The gate lines GL and the data lines DL may be respectively connected to driving units to transmit driving signals to pixel electrodes PE disposed in pixels.

[0079] The light source unit 50 may be disposed under the display panel 31 and emit light having a specific wavelength toward the display panel 31. The light source unit 50 may include a light source that directly emits light and a light guide plate that guides light received from the light source to the display panel 31. The material of the light guide plate is not particularly limited. For example, the light guide plate may include at least one of a glass material, a quartz material, and a plastic material such as polyethylene terephthalate or polycarbonate.

[0080] The light source may be a light emitting diode (LED) or an organic light emitting diode (OLED).In an exemplary embodiment, the light source may emit light having a peak wavelength shorter than the first color and the second color.

[0081] Although not shown in the drawings, one or more optical sheets may be arranged between the display panel 31 and the light source unit 50. The optical sheet may include at least one of a prism sheet, a diffusion sheet, a (reflection) polarizing sheet, a lenticular lens sheet, and a microlens sheet. The optical sheet may improve the display quality of the display device 1 by modulating the optical properties (e.g., condensing, diffusing, scattering, or polarizing properties) of light that propagates toward the display panel 31 after being emitted from the light source unit 50.

[0082] Now refer to Figure 3 The first display panel SUB1 of the display panel 31 is described in more detail.

[0083] Figure 3 is along Figure 2 FIG. 5 is a cross-sectional view of the first display panel SUB1 taken along section line III-III′.

[0084] refer to Figure 1 , Figure 2 and Figure 3 The first display panel SUB1 includes a first substrate BS1, a surface ( Figure 3 A switching element Q on the upper surface of the switching element Q and a pixel electrode PE arranged on the switching element Q.

[0085] The first substrate BS1 may include a transparent insulating substrate. For example, the first substrate BS1 may be made of at least one of a glass material, a quartz material, and a transparent plastic material. In an exemplary embodiment, the first substrate BS1 may be flexible, and the display device 1 may be a curved display device.

[0086] A plurality of switching elements Q may be arranged on the first substrate BS1. Each of the switching elements Q may be arranged in a corresponding pixel among the pixels PXa, PXb, and PXc to transmit a driving signal to the pixel electrode PE or block the driving signal. In an exemplary embodiment, each of the switching elements Q may be a thin film transistor including a gate electrode GE, an active layer AL arranged on the gate electrode GE, and a source electrode SE and a drain electrode DE arranged on the active layer AL and spaced apart from each other.

[0087] The gate electrode GE may be a control terminal connected to the gate line GL to receive a gate drive signal, the source electrode SE may be an input terminal connected to the data line DL to receive a data drive signal, and the drain electrode DE may be an output terminal electrically connected to the pixel electrode PE. The active layer AL may include at least one of amorphous silicon and polycrystalline silicon, or may include an oxide semiconductor. The active layer AL may be used as a channel of each of the switching elements Q, and the channel may be turned on or off according to a voltage applied to the gate electrode GE. The gate electrode GE and the active layer AL may be insulated from each other by an insulating film GI. Although not shown in the drawings, when the active layer AL is made of amorphous silicon, an ohmic contact layer may be further arranged between the active layer AL and the source electrode SE and the drain electrode DE.

[0088] The first protective layer PS1 may be disposed on the source electrode SE and the drain electrode DE to protect the wiring and electrodes disposed under the first protective layer PS1. The first protective layer PS1 may include an inorganic material. Examples of the inorganic material may include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiN x O y , where x>y) and silicon oxynitride (SiO x N y , where x>y).

[0089] The intermediate layer IL may be disposed on the switching element Q. The intermediate layer IL may electrically insulate the elements disposed on the intermediate layer IL from the elements disposed below the intermediate layer IL, and flatten the step difference formed by the plurality of elements stacked on the first substrate BS1. The intermediate layer IL may include one or more layers. For example, the intermediate layer IL may include at least one of an organic material and an inorganic material, or may be a stacked structure of a layer including an organic material and a layer made of an inorganic material.

[0090] A plurality of pixel electrodes PE may be arranged on the intermediate layer IL. Each of the pixel electrodes PE may generate an electric field in the liquid crystal layer LCL together with the common electrode CE to be described later, thereby controlling the orientation direction of the liquid crystal LC in the corresponding pixel. The pixel electrodes PE may be electrically connected to the corresponding drain electrodes DE of the switching element Q through contact holes formed in the intermediate layer IL and the first protective layer PS1, respectively. The pixel electrodes PE may be arranged in the pixels PXa to PXc, respectively. Therefore, independent voltages may be applied to the pixel electrodes PE, respectively, through the switching elements Q. Each of the pixel electrodes PE may be a transparent electrode made of a transparent conductive material. For example, the transparent electrode may include indium tin oxide (ITO) and indium zinc oxide (IZO). In Figure 2 In the embodiment, each of the pixel electrodes PE is shaped like a plate without a slit. However, in an exemplary embodiment, each of the pixel electrodes PE may have a radial slit.

[0091] The first liquid crystal alignment layer LCA1 may be disposed on the pixel electrode PE. The first liquid crystal alignment layer LCA1 may induce an initial alignment of the liquid crystal LC in the adjacent liquid crystal layer LCL. As used herein, "initial alignment of the liquid crystal" refers to an alignment of the liquid crystal in a state where no electric field is formed in the liquid crystal layer. The first liquid crystal alignment layer LCA1 may include a polymer organic material having an imide group in a repeating unit of a main chain.

[0092] Now refer to Figure 4 , Figure 5 , Figure 6 and Figure 7 The liquid crystal layer LCL of the display panel 31 and the second display panel SUB2 are described in more detail.

[0093] Figure 4 is along Figure 2 A cross-sectional view taken along section line IV-IV'. Figure 5 yes Figure 4 Magnified view of area "A". Figure 6 is along Figure 2 A cross-sectional view taken along section line VI-VI'. Figure 7 yes Figure 4 and Figure 6 A schematic perspective view of a partition wall 110 is shown.

[0094] First, the liquid crystal layer LCL will be described.

[0095] refer to Figure 1 , Figure 2 , Figure 3 and Figure 4, the liquid crystal layer LCL includes a plurality of initially oriented liquid crystals LC. The liquid crystal LC may have negative dielectric anisotropy and be vertically oriented in an initially oriented state. The liquid crystal layer LC may have a predetermined pretilt angle in an initially oriented state. The initial orientation of the liquid crystal LC may be induced by the first liquid crystal orientation layer LCA1 and the second liquid crystal orientation layer LCA2. When an electric field is formed between the pixel electrode PE and the common electrode CE, the liquid crystal LC may be tilted in a specific direction to change the polarization state of light passing through the liquid crystal layer LCL. In an exemplary embodiment, the liquid crystal LC may have positive dielectric anisotropy and be horizontally oriented in an initially oriented state. When an electric field is formed, the liquid crystal LC may rotate to change the polarization state of light.

[0096] Next, the second display panel SUB2 will be described.

[0097] refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The second display panel SUB2 includes a second substrate BS2, a surface ( Figure 4 The second display panel SUB2 may further include a partition wall 110 on a bottom surface of the partition wall 110, a light shielding member 210 disposed on the partition wall 110, a color conversion pattern 400 disposed on the light shielding member 210, and a common electrode CE disposed on the color conversion pattern 400. The second display panel SUB2 may further include a polarization layer POL disposed between the color conversion pattern 400 and the common electrode CE.

[0098] Like the first substrate BS1, the second substrate BS2 may be a transparent insulating substrate. The partition wall 110 may be disposed on the second substrate BS2. The partition wall 110 may expose at least a portion of the surface of the second substrate BS2. That is, the partition wall 110 may have an opening 110h that exposes at least a portion of the surface of the second substrate BS2.

[0099] For example, the partition wall 110 may include a plurality of first partition wall portions 111 extending in a first direction X and a plurality of second partition wall portions 112 extending in a second direction Y. The first partition wall portions 111 and the second partition wall portions 112 may intersect with each other and may be physically integrated with each other. That is, the first partition wall portion 111 is a portion of the partition wall 110 extending in the first direction X in a plan view, and the second partition wall portion 112 is a portion of the partition wall 110 extending in the second direction Y in a plan view. Each of the openings 110h may be surrounded by two adjacent first partition wall portions 111 and two adjacent second partition wall portions 112, and defined by two adjacent first partition wall portions 111 and two adjacent second partition wall portions 112. In other words, the partition wall 110 may be arranged at a boundary between adjacent pixels and may have a basic lattice shape in a plan view.

[0100] In an exemplary embodiment, the first partition wall portion 111 may overlap the gate electrode GE, the active layer AL, the source electrode SE, the drain electrode DE, and the contact hole formed in the intermediate layer IL, and the second partition wall portion 112 may overlap the data line DL. The maximum width W of each of the first partition wall portions 111 in the second direction Y is 1 may be greater than the maximum width W of each of the second partition wall portions 112 in the first direction X. 2 .

[0101] Although the exemplary embodiment is not limited to the following example, when the color conversion pattern 400 is formed by an inkjet process, the partition wall 110 may help align the ejected ink composition. That is, the partition wall 110 may play a guiding role for accurately ejecting and smoothly positioning the ink composition forming the color conversion pattern 400 at a desired position. In other words, the partition wall 110 may make it easy to form the color conversion pattern 400. In order to form the color conversion pattern 400 with a sufficient thickness, the height H of the partition wall 110 is 110 The height H of the partition wall 110 may have a lower limit of about 5.0 μm, about 5.5 μm, about 6.0 μm, about 6.5 μm, about 7.0 μm, about 7.5 μm, about 8.0 μm, about 8.5 μm, about 9.0 μm, about 9.5 μm, about 10.0 μm, about 10.5 μm, about 11.0 μm, about 11.5 μm, about 12.0 μm, or about 15.0 μm. 110 It may be at least 5.0 μm or more. Therefore, the color conversion pattern 400 having excellent or improved color conversion efficiency may be formed.

[0102] The partition wall 110 may have an upper surface and a side surface inclined downward from the upper surface. For example, each of the first partition wall portion 111 and the second partition wall portion 112 may have an upper surface 110t forming a flat surface and a side surface 110s inclined downward from the upper surface 110t. In an exemplary embodiment, the lower limit of the average inclination angle θ of the side surface 110s of the partition wall 110 relative to the surface of the second substrate BS2 may be about 30 degrees, about 35 degrees, or about 40 degrees. The upper limit of the average inclination angle θ of the side surface 110s relative to the surface of the second substrate BS2 may be about 85 degrees, about 80 degrees, about 70 degrees, about 60 degrees, or about 50 degrees. Although the exemplary embodiment is not limited to the following example, when the light shielding member 210 is to be formed by a back exposure process, the side surface 110s may have a predetermined inclination so that a sufficient amount of light can be easily transmitted not only through the upper surface 110t of the partition wall 110 but also through the side surface 110s of the partition wall 110. Therefore, the light shielding member 210 having a sufficient thickness may be formed on the side surface 110s of the partition wall 110. The light shielding member 210 having a sufficient thickness may suppress or reduce defects, in which, for example, when the first color conversion pattern 410 includes the first wavelength shifting material 410p, the light of the first color emitted by the first wavelength shifting material 410p travels into the second color conversion pattern 420 and thus the first color is expressed in the second pixel PXb. That is, light leakage defects may be suppressed or reduced.

[0103] As a non-limiting example, the bottom surface of the partition wall 110 may be wider than the upper surface 110t of the partition wall 110. For example, the width W of the bottom surface of each of the second partition wall portions 112 of the partition wall 110 may be greater than 110t. 2 The width W of the upper surface 110 t of each of the second partition wall portions 112 of the partition wall 110 may be about 17 μm to 30 μm, about 18 μm to about 25 μm, or about 20 μm. T It may be about 15 μm to 25 μm, about 17 μm to 20 μm, or about 18 μm.

[0104] The partition wall 110 may have light transmittance. The light transmittance of the partition wall 110 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The material of the partition wall 110 is not particularly limited as long as it has excellent or improved light transmittance. For example, the material of the partition wall 110 may include an organic material such as an epoxy resin, an acrylic resin, or an imide resin. Specifically, for example, the partition wall 110 may include at least one of ethylene glycol di(meth)acrylate polymers, polyethylene glycol di(meth)acrylate polymers, trimethylolpropane di(meth)acrylate polymers, trimethylolpropane tri(meth)acrylate polymers, pentaerythritol tri(meth)acrylate polymers, pentaerythritol tetra(meth)acrylate polymers, propylene glycol di(meth)acrylate polymers, dipentaerythritol penta(meth)acrylate polymers, dipentaerythritol hexa(meth)acrylate polymers, bisphenol A epoxy (meth)acrylate polymers, tri(acryloxyethyl)phosphate polymers and Cardo epoxy diacrylate-based polymers.

[0105] When the partition wall 110 includes an organic material, it may include a photosensitive organic material. The photosensitive organic material may include, but is not limited to, a negative photosensitive material, a portion of which is cured when light is irradiated.

[0106] In an exemplary embodiment, the partition wall 110 may further include first particles 110p dispersed therein. The first particles 110p may be a light scattering material that can scatter light that passes through the partition wall 110. The first particles 110p may have a spherical shape or various regular or irregular polygonal shapes. The refractive index of the first particles 110p may be different from the refractive index of the partition wall 110. The first particles 110p are not particularly limited as long as they can scatter and reflect the transmitted light. For example, the first particles 110p may be metal oxide particles or organic particles. Examples of metal oxides may include titanium oxide (TiO 2 ), zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ), indium oxide (In 2 O 3 ), zinc oxide (ZnO) and tin oxide (SnO 2 Examples of the organic material may include at least one of an acrylic resin and a polyurethane resin.

[0107] The light shielding member 210 may be disposed on the partition wall 110. The light shielding member 210 may cover a surface of the partition wall 110 protruding from the second substrate BS2. For example, the light shielding member 210 may be disposed on the upper surface 110t of the partition wall 110. In addition, at least a portion of the light shielding member 210 may be disposed on the side surface 110s of the partition wall 110.

[0108] The light shielding member 210 may block the transmission of light. The light shielding member 210 may be arranged at a flat boundary between adjacent pixels to prevent or reduce color mixing between adjacent pixels. In addition, the light shielding member 210 may be arranged between the first color conversion pattern 410 and the second color conversion pattern 420 and between the second color conversion pattern 420 and the light-transmitting pattern 510. The light shielding member 210 may suppress or reduce defects, in which, for example, when the first color conversion pattern 410 includes the first wavelength shifting material 410p, the light of the first color emitted by the first wavelength shifting material 410p travels into the second color conversion pattern 420 and thus the first color is expressed in the second pixel PXb. The light shielding member 210 may have an optical density of about 2.0 / 1.3 μm or more, about 3.0 / 1.3 μm or more, or about 4.0 / 1.3 μm or more. This means that the optical density of the light shielding member 210 having a thickness of 1.3 μm in the thickness direction may be 2.0 or more, about 3.0 or more, or about 4.0 or more.

[0109] The material of the light blocking member 210 is not particularly limited as long as it can block the transmission of light. For example, the light blocking member 210 may include an organic material including a colorant such as a black pigment or dye.

[0110] Examples of the colorant such as black pigment or dye of the light blocking member 210 may include inorganic pigments such as carbon black, titanium black, lignin black, perylene black, cyanine black, composite oxide pigments such as iron / manganese, and combinations thereof.

[0111] In addition, the light shielding member 210 may further include an organic material. The organic material is not particularly limited as long as it can provide the dispersibility of the black pigment or dye. Examples of organic materials include ethylene glycol di(meth)acrylate polymers, diethylene glycol di(meth)acrylate polymers, triethylene glycol di(meth)acrylate polymers, 1,6-hexanediol di(meth)acrylate polymers, pentaerythritol tri(meth)acrylate polymers, pentaerythritol tetra(meth)acrylate polymers, dipentaerythritol penta(meth)acrylate polymers, dipentaerythritol hexa(meth)acrylate polymers, bisphenol A epoxy(meth)acrylate polymers, ethylene glycol monomethyl ether(meth)acrylate polymers, trimethylolpropane tri(meth)acrylate polymers, triacryloxyethyl phosphate polymers, and Cardo epoxy acrylate diesters (cardo epoxy diacrylate-based) polymers. At least one of these. When the light shielding member 210 includes an organic material, the organic material may include a photosensitive organic material. The photosensitive organic material may include, but is not limited to, a negative photosensitive material, a portion of which is irradiated with light is cured.

[0112] In an exemplary embodiment, the first thickness t of the light shielding member 210 disposed on the upper surface 110t of the partition wall 110 is T The second thickness t of the light shielding member 210 disposed on the side surface 110s of the partition wall 110 may be S For example, the first thickness t of the light shielding member 210 disposed on the upper surface 110t of the partition wall 110 is T The thickness t may be greater than the second thickness t of the light shielding member 210 disposed on the side surface 110s of the partition wall 110. S The second thickness t S The first thickness t of the light shielding member 210 is the vertical distance from each side surface 110s of the partition wall 110 to the upper surface of the light shielding member 210 in the direction perpendicular to the side surface 110s of the partition wall 110. T and the second thickness t S There is no particular limitation as long as the light shielding member 210 can completely block or minimize the transmission of light. T and the second thickness t S The lower limit of each of may be about 1.3 μm, about 1.4 μm, about 1.5 μm, about 2.0 μm, about 2.5 μm, or about 3.0 μm.

[0113] In addition, the length L of the light shielding member 210 disposed on the side surface 110s of the partition wall 110 is S Can be greater than the height H of the partition wall 110 110For example, the length L of the light shielding member 210 measured along each side surface 110s of the partition wall 110 is S The length L of the light shielding member 210 may be about 7.0 μm or more. S The light shielding member 210 can have a sufficient height component in the third direction Z. In a non-limiting example, the maximum width W of the light shielding member 210 is 210 It may be about 33 μm or less, about 28 μm or less, or about 23 μm or less.

[0114] In addition, the height H of the partition wall 110 110 The first thickness t of the light shielding member 210 disposed on the upper surface 110t of the partition wall 110 may be T When the partition wall 110 has a first thickness t of the light shielding member 210, the thickness t T When the height of the light shielding member 210 is about twice or more, about 2.5 times or more, or about 3 times or more, the color conversion pattern 400 having a sufficient thickness can be formed, and the first thickness t of the light shielding member 210 T The light shielding member 210 can exhibit sufficient light absorption characteristics. 110 The first thickness t of the light shielding member 210 disposed on the upper surface 110t of the partition wall 110 may be T About 10 times or less.

[0115] According to the conventional shading member, it is difficult to photo-cure the shading member made of a photosensitive material due to the light absorption characteristics of the shading member. Therefore, it is impossible or difficult to form a shading member with sufficient thickness (height), or the process of forming a shading member with sufficient thickness (height) is complicated. For example, when a shading member material with a high absorptivity is used, the conventional shading member cannot be formed to a thickness (height) greater than 1.3 μm. On the other hand, when a shading member material with a low absorptivity is used, the shading member cannot properly exhibit the shading characteristics, resulting in light leakage defects.

[0116] However, in the display device 1 according to the exemplary embodiment, the partition wall 110 having a sufficient height is formed, and the light shielding member 210 is arranged to cover the surface of the partition wall 110. Therefore, the light shielding member 210 may be formed to have a height greater than that of the partition wall 110 in the height direction, thereby preventing or reducing light leakage defects between adjacent pixels.

[0117] In an exemplary embodiment, the hydrophobicity of the surface of the light shielding member 210 disposed on the upper surface 110t of the partition wall 110 may be greater than the hydrophobicity of the surface of the light shielding member 210 disposed on the side surface 110s of the partition wall 110. For example, the fluorine content per unit area of ​​the surface bonded to the light shielding member 210 disposed on the upper surface 110t of the partition wall 110 may be greater than the fluorine content per unit area of ​​the surface bonded to the light shielding member 210 disposed on the side surface 110s of the partition wall 110. That is, the difference in the fluorine content in each area of ​​the surface of the light shielding member 210 may result in a difference in the hydrophobicity in each area of ​​the surface of the light shielding member 210. Although exemplary embodiments are not limited to the following examples, when the color conversion pattern 400 is to be formed by an inkjet process, the side surface 110s of the partition wall 110 corresponding to the position where the ink composition is ejected may be lyophilic to the ink composition, and the upper surface 110t of the partition wall 110 may be repellent to the ink composition, thereby facilitating the formation of the color conversion pattern 400.

[0118] The first band filter 310 and the second band filter 320 may be arranged on the light shielding member 210. Each of the first band filter 310 and the second band filter 320 is a wavelength selective optical filter that transmits only a predetermined band of incident light by transmitting light having a certain band and blocking light having other bands. The first band filter 310 may be arranged in the opening 110h formed by the partition wall 110 in the first pixel PXa, and the second band filter 320 may be arranged in the opening 110h formed by the partition wall 110 in the second pixel PXb.

[0119] In an exemplary embodiment, each of the first and second band filters 310 and 320 may selectively transmit light having a peak wavelength longer than a peak wavelength of the third color provided by the light source unit 50 and absorb or reflect the third color light.

[0120] For example, the first wavelength band filter 310 may be arranged in the first pixel PXa for transmitting light having a wavelength band including a peak wavelength of the first color, and for absorbing light having a wavelength band including a peak wavelength of the third color. At least a portion of the first wavelength band filter 310 may be arranged on the upper surface 110t of the partition wall 110. That is, at least a portion of the first wavelength band filter 310 may overlap with the upper surface 110t of the partition wall 110 in the third direction Z.

[0121] In addition, the second wavelength band filter 320 may be arranged in the second pixel PXb for transmitting light having a wavelength band including a peak wavelength of the second color and for absorbing light having a wavelength band including a peak wavelength of the third color. At least a portion of the second wavelength band filter 320 may be arranged on the upper surface 110t of the partition wall 110. That is, at least a portion of the second wavelength band filter 320 may overlap with the upper surface 110t of the partition wall 110 in the third direction Z.

[0122] Each of the first wavelength band filter 310 and the second wavelength band filter 320 may include, but is not limited to, a colorant or a dye that absorbs light of a specific wavelength band.

[0123] Therefore, the first band filter 310 may block the light of the third color provided from the light source unit 50 and transmitted through the first color conversion pattern 410 without being color-converted by the first color conversion pattern 410. In addition, the second band filter 320 may block the light of the third color provided from the light source unit 50 and transmitted through the second color conversion pattern 420 without being color-converted by the second color conversion pattern 420. Therefore, the purity of the first color displayed by the first pixel PXa and the purity of the second color displayed by the second pixel PXb may be improved, thereby improving the display quality of the display device 1.

[0124] At least a portion of each of the first band filter 310 and the second band filter 320 may be disposed on the upper surface 110t of the partition wall 110. That is, each of the first band filter 310 and the second band filter 320 may overlap with at least a portion of the upper surface 110t of the partition wall 110 in the third direction Z. The first band filter 310 and the second band filter 320 protruding further upward than the top (i.e., the upper surface) of the partition wall 110 may make the opening 110h deeper, which in turn makes it easy to form the color conversion pattern 400.

[0125] The third band filter 330 may be disposed in the fourth pixel PXd. Like the first band filter 310, the third band filter 330 may transmit light having a band including a peak wavelength of the first color and absorb light having a band including a peak wavelength of the third color. The third band filter 330 may be spaced apart from the first band filter 310 in the second direction Y.

[0126] The color conversion pattern 400 may be arranged on the first wavelength filter 310 and the second wavelength filter 320. Each of the color conversion patterns 400 may convert the color of the transmitted light into a color different from the color of the incident light. That is, when the light passes through each of the color conversion patterns 400, the light may be converted into light of a predetermined wavelength band. In an exemplary embodiment, the first color conversion pattern 410 and the second color conversion pattern 420 of the color conversion pattern 400 may include a material, that is, a wavelength shifting material that converts or shifts the peak wavelength of the incident light into a predetermined peak wavelength. Examples of the wavelength shifting material include a quantum dot material and a fluorescent material.

[0127] For example, when electrons transition from the conduction band to the valence band, the quantum dot may emit light of a specific color. The quantum dot material may have a core-shell structure. The core may include a semiconductor nanocrystal material. Examples of the core of the quantum dot may include, but are not limited to, at least one of silicon (Si) nanocrystals, II-VI group compound nanocrystals, and III-V group compound nanocrystals. As a non-limiting example, the wavelength shifting material may include a core and a shell made of zinc sulfide (ZnS), the core including at least one of cadmium selenide (CdSe), cadmium telluride (CdTe), cadmium sulfide (CdS), and indium phosphide (InP).

[0128] When each of the color conversion patterns 400 includes a wavelength shifting material, at least a portion of the light that transmits the corresponding color conversion pattern 400 and propagates in the third direction Z may contribute to the luminescence of the wavelength shifting material. In order to increase the degree of transmitted light that contributes to the luminescence of the wavelength shifting material, each of the color conversion patterns 400 has a sufficient thickness t 400 For example, the thickness t of each of the color conversion patterns 400 is 400 The lower limit of may be about 5.0 μm, about 5.5 μm, about 6.0 μm, about 6.5 μm, about 7.0 μm, about 7.5 μm, about 8.0 μm, about 8.5 μm, about 9.0 μm, about 9.5 μm, about 10.0 μm, about 10.5 μm, about 11.0 μm, about 11.5 μm, about 12.0 μm, or about 15.0 μm. As described above, by forming the partition wall 110 to a sufficient height, the color conversion pattern 400 having a sufficient thickness can be easily formed.

[0129] The color conversion pattern 400 may include a first color conversion pattern 410 and a second color conversion pattern 420. The first color conversion pattern 410 may be disposed in the opening 110h formed by the partition wall 110 in the first pixel PXa, and the second color conversion pattern 420 may be disposed in the opening 110h formed by the partition wall 110 in the second pixel PXb.

[0130] The first color conversion pattern 410 may include a first wavelength shifting material 410p. The first wavelength shifting material 410p may be a material that emits light having a peak wavelength of a first color. The size of the first wavelength shifting material 410p may be, but is not limited to, approximately to In addition, the second color conversion pattern 420 may include a second wavelength shifting material 420p. The second wavelength shifting material 420p may be a material that emits light having a peak wavelength of the second color. The size of the second wavelength shifting material 420p may be, but is not limited to, approximately to

[0131] The light emitted from the first wavelength shifting material 410p and the second wavelength shifting material 420p is radiated in various directions regardless of the incident angle of the incident light, and thus, the side visibility of the first color and the second color displayed by the display device 1 can be improved. Figure 4 Light emitted from the upper side of the image (in the image) may be depolarized to become non-polarized light. As used herein, "non-polarized light" refers to light that is not composed of polarization components only in a specific direction and is not polarized only in a specific direction. In other words, non-polarized light is composed of random polarization components. An example of non-polarized light is natural light.

[0132] The light shielding member 210 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420 that are spaced apart from each other in the horizontal direction (e.g., the first direction X). That is, the first color conversion pattern 410, the light shielding member 210, and the second color conversion pattern 420 may at least partially overlap each other in the horizontal direction. By disposing the light shielding member 210 having sufficient light absorption characteristics between the first color conversion pattern 410 and the second color conversion pattern 420, it is possible to suppress or reduce a defect in which, for example, light emitted from the first wavelength shifting material 410p travels toward the second color conversion pattern 420 so that the second pixel PXb displays the first color, or a defect in which light emitted from the second wavelength shifting material 420p travels toward the first color conversion pattern 410 so that the first wavelength shifting material 410p emits light.

[0133] The light-transmitting pattern 510 may be arranged in the opening 110h formed by the partition wall 110 in the third pixel PXc. For example, the light-transmitting pattern 510 may be directly arranged on the second substrate BS2 and the light shielding member 210. The light-transmitting pattern 510 may transmit incident light without changing the color of the incident light. That is, the light passing through the light-transmitting pattern 510 may still have the third color provided by the light source unit 50.

[0134] In an exemplary embodiment, the light-transmitting pattern 510 may further include second particles 510p. The second particles 510p may be a light scattering material that can scatter light that passes through the light-transmitting pattern 510. The second particles 510p are not particularly limited as long as they can scatter and reflect the transmitted light. For example, the second particles 510p may be metal oxide particles or organic particles. Examples of metal oxides may include at least one of titanium oxide, zirconium oxide, aluminum oxide, indium oxide, zinc oxide, and tin oxide. Examples of organic materials may include at least one of acrylic resin and polyurethane resin.

[0135] The second particles 510p scatter the light of the third color provided from the light source unit 50 and transmitted through the light-transmitting pattern 510 in various directions regardless of the incident angle without changing the wavelength of the light of the third color. Therefore, the second particles 510p can improve the side visibility of the third color displayed by the display device 1. The light emitted toward the observer side via the light-transmitting pattern 510 can be in a non-polarized state. In an exemplary embodiment, the light-transmitting pattern 510 can be omitted.

[0136] The light blocking member 210 may be disposed between the second color conversion pattern 420 and the light-transmitting pattern 510 that are spaced apart from each other in the horizontal direction (e.g., the first direction X). That is, the second color conversion pattern 420, the light blocking member 210, and the light-transmitting pattern 510 may at least partially overlap each other in the horizontal direction. By placing the light blocking member 210 having sufficient light absorption characteristics between the second color conversion pattern 420 and the light-transmitting pattern 510, it is possible to suppress or reduce a defect in which, for example, light emitted from the second wavelength shifting material 420p proceeds toward the light-transmitting pattern 510 so that the third pixel PXc displays the second color, or a defect in which light scattered by the second particles 510p of the light-transmitting pattern 510 proceeds toward the second color conversion pattern 420 so that the second wavelength shifting material 420p emits light.

[0137] The fourth band filter 610 may be disposed on the color conversion pattern 400 and the light transmitting pattern 510. The fourth band filter 610 is a wavelength selective optical filter that transmits only some bands of incident light by transmitting light having a specific band and blocking light having other bands.

[0138] In an exemplary embodiment, the fourth band filter 610 may selectively reflect light having a peak wavelength longer than the peak wavelength of the third color provided by the light source unit 50 and transmit the light of the third color. For example, the fourth band filter 610 may selectively reflect light having a band including the peak wavelength of the first color and light having a band including the peak wavelength of the second color, and transmit light having a band including the peak wavelength of the third color. The fourth band filter 610 may include one or more layers including an inorganic material. For example, the fourth band filter 610 may include a plurality of low refractive layers and a plurality of high refractive layers alternately stacked. As used herein, "low refractive layer" refers to a layer having a relatively lower refractive index than the refractive index of an adjacent layer, and "high refractive layer" refers to a layer having a relatively higher refractive index than the refractive index of an adjacent layer. The transmission band and the reflection band of the fourth band filter 610 may be controlled by the materials of the low refractive layer and the high refractive layer, the respective thicknesses of the low refractive layer and the high refractive layer and the difference between the thicknesses, and the respective refractive indexes of the low refractive layer and the high refractive layer and the difference between the refractive indexes.

[0139] The fourth band filter 610 may be formed with a substantially constant thickness along the outer surfaces of the first color conversion pattern 410, the second color conversion pattern 420, the light-transmitting pattern 510, the first band filter 310, the second band filter 320, and the light blocking member 210. The average thickness of the fourth band filter 610 may be about 0.5 μm to 2.0 μm or about 1.0 μm. The fourth band filter 610 may at least partially contact the first color conversion pattern 410, the second color conversion pattern 420, the light-transmitting pattern 510, and the light blocking member 210.

[0140] Therefore, the fourth wavelength band filter 610 can reflect the light emitted toward the fourth wavelength band filter 610 from the light emitted in various directions from the first wavelength shifting material 410p and the second wavelength shifting material 420p toward the observer side, and thus the reflected light can contribute to color display. This can improve light utilization efficiency and enable the display device 1 to display clearer colors. In addition, among the light provided by the light source unit 50, the fourth wavelength band filter 610 can transmit the light having the peak wavelength of the third color while blocking the light having the peak wavelength longer than the peak wavelength of the third color. Therefore, the color purity of the light provided by the light source unit 50 can be further improved.

[0141] The overcoat layer OC may be arranged on the fourth band filter 610. The overcoat layer OC may be a planarization layer that minimizes the step difference formed by the plurality of elements stacked on the second substrate BS2. The overcoat layer OC may include one or more layers. For example, the overcoat layer OC may be a stacked structure of a plurality of layers. The overcoat layer OC may include an organic material having a planarization property. For example, the overcoat layer OC may include an organic material such as a Cardo resin, a polyimide resin, or an acrylic resin. The overcoat layer OC may be directly arranged on the fourth band filter 610 without distinction between pixels PXa to PXc.

[0142] The polarization layer POL may be arranged on the outer coating layer OC. The polarization layer POL may perform an optical shutter function together with the liquid crystal layer LCL and another polarization layer arranged between the liquid crystal layer LCL and the light source unit 50 to control the amount of light transmitted through each of the pixels PXa to PXc. In an exemplary embodiment, the polarization layer POL may be a reflective polarizer including a wire grating pattern. As used herein, a "wire grating pattern" refers to a plurality of linear patterns extending parallel to each other and spaced apart from each other. The reflective polarizer may polarize the transmitted light by transmitting a polarization component parallel to the transmission axis and reflecting a polarization component parallel to the reflection axis. In an exemplary embodiment, the polarization layer POL may include a coating type polarizer.

[0143] The wire grid pattern of the polarization layer POL may include a reflective material. For example, the wire grid pattern may include at least one of aluminum (Al), silver (Ag), gold (Au), copper (Cu), titanium (Ti), molybdenum (Mo), nickel (Ni), and alloys thereof.

[0144] In an exemplary embodiment, the second protective layer PS2 may be arranged between the outer coating layer OC and the polarization layer POL. The second protective layer PS2 may be in contact with the outer coating layer OC and the wire grid pattern. The second protective layer PS2 may include an inorganic material such as silicon nitride or silicon oxide. The second protective layer PS2 may prevent or reduce the outer coating layer OC from being damaged in the process of forming the wire grid pattern. In addition, the second protective layer PS2 may improve the adhesion of the wire grid pattern and prevent or reduce damage or corrosion of the wire grid pattern due to the penetration of air or moisture, thereby improving the reliability of the display device 1.

[0145] The third protective layer PS3 may be disposed on the polarizing layer POL. The third protective layer PS3 may be disposed directly on the polarizing layer POL to cover and protect the wire grid pattern. The third protective layer PS3 can prevent and reduce the wire grid pattern from being damaged or corroded due to the penetration of air or moisture, and can flatten the upper surface of the polarizing layer POL. The third protective layer PS3 may include an inorganic insulating material such as silicon nitride or silicon oxide.

[0146] The common electrode CE may be arranged on the third protective layer PS3. The common electrode CE may be integrally formed as a single piece without differentiation between the pixels PXa to PXc, and a common voltage may be applied to the common electrode CE. In an exemplary embodiment, the common electrode CE may be directly arranged on the third protective layer PS3, and may be a transparent electrode. The second liquid crystal alignment layer LCA2 may be arranged on the common electrode CE to induce an initial orientation of the liquid crystal LC in the adjacent liquid crystal layer LCL. The second liquid crystal alignment layer LCA2 may include a polymer organic material that is the same as or different from that of the first liquid crystal alignment layer LCA1.

[0147] Now refer to Figure 8 A process in which the display device 1 according to the exemplary embodiment implements color display is described in more detail. Figure 8 The diagram shows Figure 4 The light path of the second display panel SUB2.

[0148] refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 , the light source unit 50 provides the light of the third color to the display panel 31. In an exemplary embodiment, the light source unit 50 may provide the light of the third color having a peak wavelength in the range of about 430 nm to 470 nm to the display panel 31.

[0149] The light L provided by the light source unit 50 and incident on the first pixel PXa of the display panel 31 a0 The light L may be transmitted through the fourth wavelength band filter 610, converted or shifted into the peak wavelength of the first color by the first wavelength shifting material 410p, and then emitted in various directions regardless of the light L a0 What is the angle of incidence?

[0150] Specifically, among the light emitted from the first wavelength shifting material 410p, the light emitted toward the second substrate BS2 ( Figure 8 The light L emitted from the upper side of the a1 The first wavelength band filter 310 may be transmitted as is, thereby facilitating display of the first color by the first pixel PXa.

[0151] In addition, from the first wavelength shifting material 410p toward the fourth band filter 610 ( Figure 8 The light L emitted from the lower side of the a2 The light may be reflected by the fourth wavelength band filter 610 toward the viewer, thereby facilitating the first pixel PXa to display the first color.

[0152] In addition, toward the second color conversion pattern 420 ( Figure 8 The light L emitted from the left / right side of the a3 The light may be absorbed by the light blocking member 210 disposed between the first color conversion pattern 410 and the second color conversion pattern 420, thereby preventing or reducing a light leakage defect.

[0153] Likewise, the light L provided by the light source unit 50 and incident on the second pixel PXb of the display panel 31 b0 The second wavelength shifting material 420p may be converted or shifted to a peak wavelength of a second color, thereby facilitating display of the second color by the second pixel PXb.

[0154] The light L provided by the light source unit 50 and incident on the third pixel PXc of the display panel 31 c0 The fourth wavelength band filter 610 may be transmitted, and then the light-transmitting pattern 510 may be transmitted without wavelength conversion, thereby facilitating display of the third color by the third pixel PXc.

[0155] Next, other embodiments will be described. For simplicity, descriptions of elements substantially identical to those of the display device 1 according to the above-described embodiment will be omitted, and those skilled in the art will understand the substantially identical elements from the accompanying drawings. In the accompanying drawings, the same reference numerals will be used for the same elements.

[0156] Fig. 9A and Fig. 9B A display device 2 according to an exemplary embodiment is illustrated. Fig. 9A is with Figure 4 The corresponding cross-sectional view, and Fig. 9B yes Fig. 9A Magnified view of area "A".

[0157] refer to Fig. 9A and Fig. 9B , the display device 2 according to the exemplary embodiment and the display device 2 according to the exemplary embodiment Figure 1 The display device 1 of the embodiment is different in that the side surface 120s of the partition wall 120 is curved.

[0158] Specifically, the partition wall 120 may have an upper surface 120t forming a flat surface and a side surface 120s inclined downward from the upper surface 120t. In an exemplary embodiment, the side surface 120s may be slowly inclined from the upper surface 120t, gradually become more steeply inclined, and then slowly inclined again from the inflection point to reach the second substrate BS2. In this case, the upper limit of the average inclination angle θ of the side surface 120s of the partition wall 120 relative to the surface of the second substrate BS2 may be about 85 degrees, about 80 degrees, about 70 degrees, about 60 degrees, or about 50 degrees. When the side surface 120s is a curved surface, the "average inclination angle" may be an inclination angle obtained by calculating the average value of different inclinations in any interval. The average inclination angle may be represented by the ratio of the height difference to the horizontal distance between the lowermost end of the side surface 120s of the partition wall 120 and the upper surface 120t of the partition wall 120 without a slope.

[0159] The light shielding member 220 may be disposed on the partition wall 120 along the curved side surface 120s of the partition wall 120. In addition, the first and second band filters 311 and 321 may also be disposed on the light shielding member 220 along the curved side surface 120s of the partition wall 120.

[0160] Fig. 10A and Fig. 10B A display device 3 according to an exemplary embodiment is illustrated. Fig. 10A is with Figure 4 The corresponding cross-sectional view, and Fig. 10B yes Fig. 10A Magnified view of area "A".

[0161] refer to Fig. 10A and Fig. 10B , the display device 3 according to the exemplary embodiment and the display device 3 according to the exemplary embodiment Figure 1 The display device 1 of the embodiment is different in that the surface of the light shielding member 230 has a certain roughness.

[0162] In an exemplary embodiment, the light shielding member 230 may be directly disposed on the second partition wall portion 112. Here, the roughness of a first surface 230a of the light shielding member 230 contacting the second partition wall portion 112 may be less than the roughness of a second surface 230b opposite to the first surface 230a. The second surface 230b of the light shielding member 230 may be a surface contacting the first band filter 310, the second band filter 320, the light-transmitting pattern 510, and / or the fourth band filter 610.

[0163] Although the exemplary embodiment is not limited to the following example, when the light shielding member 230 is formed by a back exposure process in which light is radiated from one side of the second substrate BS2, the first surface 230a of the light shielding member 230 may be cured before the second surface 230b. That is, the first surface 230a of the light shielding member 230 that contacts the second partition wall portion 112 may be exposed and cured first, and when light passes through the light shielding member 230, the light may be gradually absorbed by the light shielding member 230. In other words, due to the light absorption characteristics of the light shielding member 230, the amount of light passing through the light shielding member 230 may be gradually reduced. Therefore, the second surface 230b of the light shielding member 230 may be exposed to a smaller amount of light than the first surface 230a. In the process of developing the light shielding member 230 cured by exposure in the curing process, the second surface 230b that is relatively less cured and does not show a constant depth may have a roughness greater than the first surface 230a.

[0164] The roughness of the second surface 230b of the light shielding member 230 can be adjusted by the intensity and / or irradiation time of the light irradiated for curing the light shielding member 230. When any one surface of the light shielding member 230 has a certain roughness, the thickness t of the light shielding member 230 T or S It can be expressed as the distance from the first surface 230a to the protruding portion of the second surface 230b.

[0165] Fig.11 is with Figure 4 Corresponding cross-sectional view of a display device 4 according to an exemplary embodiment.

[0166] refer to Fig.11 , the display device 4 according to the exemplary embodiment and the Fig. 10A and Fig. 10B The display device 3 of the embodiment is different in that it further includes a concave and protrusive pattern 700 arranged on the light shielding member 230 .

[0167] In an exemplary embodiment, the recessed and protruding pattern 700 may be arranged on the light shielding member 230, which is arranged on the upper surface of the second partition wall portion 112. The recessed and protruding pattern 700 may be a plurality of linear patterns arranged in parallel to each other in a plan view to be spaced apart from each other, or may be a substantially quadrilateral island pattern arranged in a matrix form or randomly in a plan view.

[0168] The concave and convex pattern 700 may impart a certain hydrophobicity to the surface of the light shielding member 230. For example, the surface of the light shielding member 230 disposed on the upper surface of the second partition wall portion 112 may have greater hydrophobicity than the surface of the light shielding member 230 disposed on the side surface of the second partition wall portion 112.

[0169] Although the exemplary embodiment is not limited to the following example, when the color conversion pattern is formed by an inkjet process, the recessed and protruded pattern 700 arranged on the upper surface of the second partition wall portion 112 can reduce the surface area that the ink composition can contact, thereby reducing the surface energy. Therefore, this can make it easy to form the color conversion pattern.

[0170] Fig. 12A and Fig. 12B A display device 5 according to an exemplary embodiment is illustrated. Fig. 12A is with Figure 4 The corresponding cross-sectional view, and Fig. 12B yes Fig. 12A Magnified view of area "A".

[0171] refer to Fig. 12A and Fig. 12B , the display device 5 according to the exemplary embodiment and the Fig. 10A and Fig. 10B The display device 3 of the embodiment of FIG. 1 is different in that the first band filter 312 and the second band filter 322 do not overlap with the upper surface 110 t of the second partition wall portion 112 .

[0172] In an exemplary embodiment, the highest point of each of the first and second band filters 312 and 322 from one surface of the second substrate BS2 may be lower than the height of the second partition wall portion 112, that is, the upper surface 110t of the second partition wall portion 112. Therefore, the first and second color conversion patterns 410 and 420 may contact the light blocking member 230.

[0173] When different portions of the surface of the light shielding member 230 have different degrees of hydrophobicity, for example, when the surface of the light shielding member 230 disposed on the upper surface 110t of the second partition wall portion 112 has greater hydrophobicity than the surface of the light shielding member 230 disposed on the side surface 110s of the second partition wall portion 112, the surface of the light shielding member 230 not covered by the first and second band filters 312 and 322 may have a positioning point formed by the degree of hydrophobicity. This may make it easy to form a color conversion pattern.

[0174] Fig.13A and Fig. 13B A display device 6 according to an exemplary embodiment is illustrated. Fig.13A is with Figure 4 The corresponding cross-sectional view, and Fig. 13B yes Fig.13A Magnified view of area "A".

[0175] refer to Fig.13A and Fig. 13B, the display device 6 according to the exemplary embodiment and the Fig. 10A and Fig. 10B The display device 3 of the embodiment is distinguished in that at least a portion of a light shielding member 240 is disposed between the second substrate BS2 and the color conversion pattern, and a surface of the light shielding member 240 disposed between the second substrate BS2 and the color conversion pattern is substantially parallel to a surface of the second substrate BS2.

[0176] Specifically, at least a portion of the light blocking member 240 may be disposed between the second substrate BS2 and the first wavelength filter 310, and may be in contact with the second substrate BS2 and the first wavelength filter 310. In this case, a surface of the light blocking member 240 disposed between the second substrate BS2 and the first wavelength filter 310 may be substantially parallel to a surface of the second substrate BS2.

[0177] Likewise, at least a portion of the light blocking member 240 may be disposed between the second substrate BS2 and the second band filter 320 and may be in contact with the second substrate BS2 and the second band filter 320. In this case, a surface of the light blocking member 240 disposed between the second substrate BS2 and the second band filter 320 may be substantially parallel to a surface of the second substrate BS2.

[0178] In addition, at least a portion of the light blocking member 240 may be disposed between the second substrate BS2 and the light-transmitting pattern 510 and may contact the second substrate BS2 and the light-transmitting pattern 510. In this case, a surface of the light blocking member 240 disposed between the second substrate BS2 and the light-transmitting pattern 510 may be substantially parallel to a surface of the second substrate BS2.

[0179] In the display device 6 according to the exemplary embodiment, the maximum width of the light blocking member 240 contacting the second substrate BS2 may be set relatively large. Therefore, this may minimize or reduce the color mixing defect of the display device 6.

[0180] Fig.14A and Fig. 14B A display device 7 according to an exemplary embodiment is illustrated. Fig.14A is with Figure 4 The corresponding cross-sectional view, and Fig. 14B yes Fig.14A Magnified view of area "A".

[0181] refer to Fig.14A and Fig. 14B , the display device 7 according to the exemplary embodiment and the Fig. 10A and Fig. 10B The display device 3 of the embodiment of FIG. 1 is different in that the light blocking member 250 further includes a third surface 250 s perpendicular to the surface of the second substrate BS2 .

[0182] The light shielding member 250 is directly disposed on the second partition wall portion 112 and has a first surface 250a contacting the second partition wall portion 112 and a second surface 250b opposite to the first surface 250a. The light shielding member 250 further has a third surface 250s connecting the first surface 250a and the second surface 250b and being substantially perpendicular to the surface of the second substrate BS2.

[0183] In an exemplary embodiment, the third surface 250s of the light blocking member 250 may have a roughness less than that of the second surface 250b. The second surface 250b and the third surface 250s of the light blocking member 250 may all contact the first band filter 310 , the second band filter 320 , or the light transmitting pattern 510 .

[0184] In the display device 7 according to the exemplary embodiment, the light shielding member 250 has a height component in the third direction Z. Therefore, the light shielding member 250 can suppress or reduce defects in which light propagates between adjacent pixels while maximizing or increasing the width of each opening from which light for color display is emitted. Therefore, light utilization efficiency can be improved.

[0185] Fig.15A and Fig. 15B A display device 8 according to an exemplary embodiment is illustrated. Fig.15A is with Figure 4 The corresponding cross-sectional view, and Fig. 15B yes Fig.15A Magnified view of area "A".

[0186] refer to Fig.15A and Fig. 15B , the display device 8 according to the exemplary embodiment and the Fig. 10A and Fig. 10B The display device 3 of the embodiment of FIG. 1 is distinguished in that the light shielding member 260 has an undercut 260U at its lower end. As used herein, the term "undercut" means that the lower end of an element is recessed inwardly in a plan view to form a substantially mushroom-shaped cross section.

[0187] In an exemplary embodiment, at least a portion of the first wavelength band filter 310 may be disposed between the light shielding member 260 and the second substrate BS2. In an exemplary embodiment, the first wavelength band filter 310 may not completely fill the space between the light shielding member 260 and the second substrate BS2, leaving an air layer in the space. In addition, a portion of the light shielding member 260 may contact the second substrate BS2.

[0188] Likewise, at least a portion of the second wavelength band filter 320 may be disposed between the light blocking member 260 and the second substrate BS2. In addition, at least a portion of the light-transmitting pattern 510 may be disposed between the light blocking member 260 and the second substrate BS2.

[0189] exist Fig.15A and Fig. 15B In the embodiment, the surface of the light shielding member 260 at the undercut 260U of the light shielding member 260 is inclined in a direction opposite to the direction in which the side surface 110s of the second partition wall portion 112 is inclined. However, in an exemplary embodiment, the surface of the light shielding member 260 at the undercut 260U may be substantially perpendicular to the surface of the second substrate BS2, or may be inclined in the same direction as the side surface 110s of the second partition wall portion 112.

[0190] In the display device 8 according to the exemplary embodiment, the light shielding member 260 has a height component in the third direction Z. Therefore, the light shielding member 260 can maximize or increase the width of each opening from which light for color display is emitted, while suppressing or reducing defects in which light propagates between adjacent pixels. Therefore, light utilization efficiency can be improved.

[0191] Fig.16A and Fig. 16B A display device 9 according to an exemplary embodiment is illustrated. Fig.16A is with Figure 4 The corresponding cross-sectional view, and Fig. 16B yes Fig.16A Magnified view of area "A".

[0192] refer to Fig.16A and Fig. 16B , the display device 9 according to the exemplary embodiment and the Fig.15A and Fig. 15B The display device 8 of the embodiment of FIG. 8 is distinguished in that it further includes an opaque material pattern 810 arranged on the undercut portion of the light shielding member 260 .

[0193] The opaque material pattern 810 may be disposed between the light blocking member 260 and the second substrate BS2. Fig.16A and Fig. 16B , the opaque material pattern 810 is in contact with the light blocking member 260, the second substrate BS2, and the first band filter 310. However, exemplary embodiments are not limited thereto.

[0194] The opaque material pattern 810 may include a material different from the light shielding member 260. The opaque material pattern 810 is not particularly limited as long as it can at least partially block the transmission of light. For example, the opaque material pattern 810 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials.

[0195] The opaque material pattern 810 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420 and between the second color conversion pattern 420 and the light-transmitting pattern 510. The opaque material pattern 810 may suppress or reduce light leakage between adjacent pixels. In addition, when the opaque material pattern 810 included in the display device 9 according to an exemplary embodiment is made of a reflective metal material, the opaque material pattern 810 disposed between adjacent pixels may reflect at least a portion of light propagating toward the adjacent pixels, thereby improving light utilization efficiency.

[0196] Fig.17A and Fig. 17B A display device 10 according to an exemplary embodiment is illustrated. Fig.17A is with Figure 4 The corresponding cross-sectional view, and Fig. 17B yes Fig.17A Magnified view of area "A".

[0197] refer to Fig.17A and Fig. 17B , the display device 10 according to the exemplary embodiment and the Fig.15A and Fig. 15B The display device 8 of the embodiment is different in that the light shielding member 270 is arranged on the upper surface 110t of the second partition wall portion 112 and the side surface 110s of the second partition wall portion 112 but is spaced apart from the second substrate BS2.

[0198] In an exemplary embodiment, the light blocking member 270 may at least partially surround the second partition wall portion 112 and at least partially expose the side surface 110s of the second partition wall portion 112 without completely covering the side surface 110s of the second partition wall portion 112 .

[0199] For example, at least a portion of the first wavelength filter 310 may be disposed between the light blocking member 270 and the second substrate BS2. In addition, the first wavelength filter 310 may contact the side surface 110s of the second partition wall portion 112, the second substrate BS2, and the light blocking member 270.

[0200] Likewise, at least a portion of the second wavelength filter 320 may be disposed between the light blocking member 270 and the second substrate BS2. The second wavelength filter 320 may contact the side surface 110s of the second partition wall portion 112, the second substrate BS2, and the light blocking member 270.

[0201] In addition, at least a portion of the light-transmitting pattern 510 may be disposed between the light-blocking member 270 and the second substrate BS2. The light-transmitting pattern 510 may contact the side surface 110s of the second partition wall portion 112, the second substrate BS2, and the light-blocking member 270.

[0202] Fig.18A and Fig.18B A display device 11 according to an exemplary embodiment is illustrated. Fig.18A is with Figure 4 The corresponding cross-sectional view, and Fig.18B yes Fig.18A Magnified view of area "A".

[0203] refer to Fig.18A and Fig.18B , the display device 11 according to the exemplary embodiment and the Fig.17A and Fig. 17B The display device 10 of the embodiment of FIG. 1 is different in that it further includes an opaque material pattern 820 arranged on the side surface 110 s of the second partition wall portion 112 .

[0204] The opaque material pattern 820 may be directly disposed on the side surface 110s of the second partition wall portion 112. For example, the opaque material pattern 820 may be placed between the light shielding member 270 and the second substrate BS2. In FIG. 18 , the opaque material pattern 820 is in contact with the light shielding member 270, the second substrate BS2, the second partition wall portion 112, and the first band filter 310. However, exemplary embodiments are not limited thereto.

[0205] The opaque material pattern 820 may include a material different from the light shielding member 270. The opaque material pattern 820 is not particularly limited as long as it can at least partially block the transmission of light. For example, the opaque material pattern 820 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials.

[0206] The opaque material pattern 820 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420 and between the second color conversion pattern 420 and the light-transmitting pattern 510. The opaque material pattern 820 may suppress or reduce light leakage between adjacent pixels. In addition, when the opaque material pattern 820 included in the display device 11 according to an exemplary embodiment is made of a reflective metal material, the opaque material pattern 820 disposed between adjacent pixels may reflect at least a portion of light propagating toward the adjacent pixels, thereby improving light utilization efficiency.

[0207] Fig.19A and Fig.19B A display device 12 according to an exemplary embodiment is illustrated. Fig.19A is with Figure 4 The corresponding cross-sectional view, and Fig.19B yes Fig.19A Magnified view of area "A".

[0208] refer to Fig.19A and Fig.19B , the display device 12 according to the exemplary embodiment and the Fig.15A and Fig. 15B The display device 8 of the embodiment is different in that the partition wall 130 has an undercut 130U formed at the lower end thereof.

[0209] In an exemplary embodiment, a lower end of the partition wall 130 may be recessed into the partition wall 130. That is, a width of the partition wall 130 at a portion where the partition wall 130 contacts the second substrate BS2 may be smaller than a maximum width of the partition wall 130.

[0210] In addition, at least a portion of the first wavelength filter 313 may be disposed between the partition wall 130 and the second substrate BS2 and between the light shielding member 280 and the second substrate BS2. In an exemplary embodiment, the first wavelength filter 313 may not completely fill the space between the partition wall 130 and the second substrate BS2, leaving an air layer in the space. The light shielding member 280 may be spaced apart from the second substrate BS2.

[0211] For example, the first wavelength band filter 313 may be in contact with the second substrate BS2 , the light blocking member 280 , and the partition wall 130 .

[0212] Likewise, at least a portion of the second wavelength filter 323 may be disposed between the partition wall 130 and the second substrate BS2 and between the light blocking member 280 and the second substrate BS2. The second wavelength filter 323 may contact the second substrate BS2, the light blocking member 280, and the partition wall 130.

[0213] In addition, at least a portion of the light-transmitting pattern 510 may be disposed between the partition wall 130 and the second substrate BS2 and between the light-blocking member 280 and the second substrate BS2. The light-transmitting pattern 510 may contact the second substrate BS2, the light-blocking member 280, and the partition wall 130.

[0214] In the display device 12 according to the exemplary embodiment, a portion where the first band filter 313 contacts the second substrate BS2, a portion where the second band filter 323 contacts the second substrate BS2, and a portion where the light-transmitting pattern 510 contacts the second substrate BS2 may be wider than each opening formed by the partition wall 130. Therefore, light utilization efficiency can be improved without light leakage between adjacent pixels.

[0215] Fig. 20A and Fig. 20B A display device 13 according to an exemplary embodiment is illustrated. Fig. 20A is with Figure 4 The corresponding cross-sectional view, and Fig. 20B yes Fig. 20A Magnified view of area "A".

[0216] refer to Fig. 20A and Fig. 20B , the display device 13 according to the exemplary embodiment and the display device 13 according to the exemplary embodiment Fig.19A and Fig.19B The display device 12 of the embodiment is different in that it further includes an opaque material layer 830 arranged on the undercut 130U of the partition wall 130 .

[0217] The opaque material layer 830 may be disposed between the partition wall 130 and the second substrate BS2. Fig. 20A and Fig. 20B In the embodiment, the opaque material layer 830 contacts the second substrate BS2, the partition wall 130 and the first wavelength filter 313. However, exemplary embodiments are not limited thereto. In exemplary embodiments, the opaque material layer 830 may be disposed between the light shielding member 280 and the second substrate BS2.

[0218] The opaque material layer 830 may include a material different from the light shielding member 280. The opaque material layer 830 is not particularly limited as long as it can at least partially block the transmission of light. For example, the opaque material layer 830 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials.

[0219] The opaque material layer 830 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420 and between the second color conversion pattern 420 and the light-transmitting pattern 510. The opaque material layer 830 may suppress or reduce light leakage between adjacent pixels. In addition, when the opaque material layer 830 included in the display device 13 according to an exemplary embodiment is made of a reflective metal material, the opaque material layer 830 disposed between adjacent pixels may reflect at least a portion of light propagating toward the adjacent pixels, thereby improving light utilization efficiency.

[0220] Fig.21A , Fig. 21B and Fig. 21C A display device 14 according to an exemplary embodiment is illustrated. Fig.21A is with Figure 4 The corresponding cross-sectional view, Fig. 21B yes Fig.21A A magnified view of area "A" and Fig. 21C is with Figure 6 The corresponding cross-sectional view.

[0221] refer to Fig.21A , Fig. 21B and Fig. 21C , the display device 14 according to the exemplary embodiment and the Fig. 10A and Fig. 10BThe display device 3 of the embodiment is different in that the first band filter 314 and the second band filter 324 are arranged between the second substrate BS2 and the second partition wall portion 112 .

[0222] The first wavelength filter 314 may be disposed in the first pixel and arranged lower than the second partition wall portion 112 (at Fig.21A For example, at least a portion of the first wavelength band filter 314 may be disposed between the second partition wall portion 112 and the second substrate BS2, and may be in contact with the second partition wall portion 112 and the second substrate BS2.

[0223] In addition, the second wavelength filter 324 may be disposed in the second pixel and may be set lower than the second partition wall portion 112 (at Fig.21A For example, at least a portion of the second wavelength band filter 324 may be disposed between the second partition wall portion 112 and the second substrate BS2, and may be in contact with the second partition wall portion 112 and the second substrate BS2.

[0224] The third wavelength band filter 334 may be disposed in the fourth pixel and may be disposed lower than the second partition wall portion 112 (at Fig. 21C Medium is high).

[0225] In the display device 14 according to the exemplary embodiment, each of the first band filter 314 and the second band filter 324 is disposed lower than the second partition wall portion 112. Therefore, it is possible to increase the exposed surface area of ​​the light shielding member 290. Although the exemplary embodiment is not limited to the following example, when the color conversion pattern is formed by an inkjet process, the water repellency and lyophilicity of the exposed surface of the light shielding member 290 may be used to facilitate the formation of the color conversion pattern.

[0226] Fig.22A and Fig. 22B A display device 15 according to an exemplary embodiment is illustrated. Fig.22A is with Figure 4 The corresponding cross-sectional view, and Fig. 22B yes Fig.22A Magnified view of area "A".

[0227] refer to Fig.22A and Fig. 22B , the display device 15 according to the exemplary embodiment and the display device 15 according to the exemplary embodiment Fig.21A and Fig. 21B The display device 14 of the embodiment of FIG. 1 is different in that the partition wall 140 and the light shielding member 295 have an undercut 140U at the lower end thereof.

[0228] In an exemplary embodiment, the lower end of the partition wall 140 may be recessed into the partition wall 140. In addition, at least a portion of the first color conversion pattern 410 may be disposed between the partition wall 140 and the first band filter 314 in the undercut 140U and between the light shielding member 295 and the first band filter 314. In an exemplary embodiment, the first color conversion pattern 410 may not completely fill the space between the partition wall 140 and the first band filter 314, leaving an air layer in the space. The light shielding member 295 may be spaced apart from the first band filter 314. For example, the first color conversion pattern 410 may be in contact with the first band filter 314, the light shielding member 295, and the partition wall 140.

[0229] Likewise, at least a portion of the second color conversion pattern 420 may be disposed between the partition wall 140 and the second band filter 324 in the undercut 140U and between the light blocking member 295 and the second band filter 324. The second color conversion pattern 420 may contact the second band filter 324, the light blocking member 295, and the partition wall 140.

[0230] In addition, at least a portion of the light-transmitting pattern 510 may be disposed between the partition wall 140 and the second substrate BS2 and between the light-blocking member 295 and the second substrate BS2. The light-transmitting pattern 510 may contact the second substrate BS2, the light-blocking member 295, and the partition wall 140.

[0231] In the display device 15 according to the exemplary embodiment, a portion where the first color conversion pattern 410 contacts the first band filter 314, a portion where the second color conversion pattern 420 contacts the second band filter 324, and a portion where the light-transmitting pattern 510 contacts the second substrate BS2 may be wider than each opening formed by the partition wall 140. Therefore, light utilization efficiency can be improved without light leakage between adjacent pixels.

[0232] Fig.23A and Fig. 23B A display device 16 according to an exemplary embodiment is illustrated. Fig.23A is with Figure 4 The corresponding cross-sectional view, and Fig. 23B yes Fig.23A Magnified view of area "A".

[0233] refer to Fig.23A and Fig. 23B , the display device 16 according to the exemplary embodiment and the Fig.22A and Fig. 22B The display device 15 of the embodiment of FIG. 8 is distinguished in that it further includes an opaque material layer 840 arranged on the undercut 140U of the partition wall 140 .

[0234] The opaque material layer 840 may be disposed between the partition wall 140 and the first wavelength filter 314 and between the partition wall 140 and the second wavelength filter 324. Fig.23A and Fig. 23B In the embodiment, the opaque material layer 840 contacts the first wavelength band filter 314, the partition wall 140 and the first color conversion pattern 410. However, exemplary embodiments are not limited thereto. In exemplary embodiments, the opaque material layer 840 may be placed between the light shielding member 295 and the first wavelength band filter 314.

[0235] The opaque material layer 840 may include a material different from the light shielding member 295. The opaque material layer 840 is not particularly limited as long as it can at least partially block the transmission of light. However, the opaque material layer 840 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials.

[0236] The opaque material layer 840 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420 and between the second color conversion pattern 420 and the light-transmitting pattern 510. The opaque material layer 840 may suppress or reduce light leakage between adjacent pixels. In addition, when the opaque material layer 840 included in the display device 16 according to an exemplary embodiment is made of a reflective metal material, the opaque material layer 840 disposed between adjacent pixels may reflect at least a portion of light propagating toward the adjacent pixels, thereby improving light utilization efficiency.

[0237] Fig.24A and Fig. 24B A display device 17 according to an exemplary embodiment is illustrated. Fig.24A is with Figure 4 The corresponding cross-sectional view, and Fig. 24B yes Fig.24A Magnified view of area "A".

[0238] refer to Fig.24A and Fig. 24B , the display device 17 according to the exemplary embodiment and the Fig. 10A and Fig. 10B The display device 3 of the embodiment is different in that it further includes a first light-transmitting layer 910 arranged on the light-shielding member 230 and a second light-transmitting layer 920 arranged on the first light-transmitting layer 910 .

[0239] In an exemplary embodiment, the first light-transmitting layer 910 may be directly disposed on the light-shielding member 230 and may surround at least a portion of the light-shielding member 230. For example, the first light-transmitting layer 910 may be disposed on the upper surface 110t of the second partition wall portion 112 and on the side surface 110s of the second partition wall portion 112. The light transmittance of the first light-transmitting layer 910 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The first light-transmitting layer 910 may be in contact with the second substrate BS2.

[0240] In addition, the second light-transmitting layer 920 may be directly disposed on the first light-transmitting layer 910 and may surround at least a portion of the first light-transmitting layer 910. For example, the second light-transmitting layer 920 may be disposed on the upper surface 110t of the second partition wall portion 112 and on the side surface 110s of the second partition wall portion 112. The light transmittance of the second light-transmitting layer 920 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The second light-transmitting layer 920 may be in contact with the second substrate BS2.

[0241] In an exemplary embodiment, the refractive index of the second light-transmitting layer 920 may be greater than that of the first light-transmitting layer 910. Therefore, a certain optical function may be imparted to the first light-transmitting layer 910 and the second light-transmitting layer 920.

[0242] For example, when the first color conversion pattern 410 includes a wavelength shifting material, at least a portion of the light traveling toward the second color conversion pattern 420 among the light emitted from the wavelength shifting material may be reflected at the interface between the first light-transmitting layer 910 and the second light-transmitting layer 920. This not only suppresses or reduces light leakage defects, but also improves light utilization efficiency. In addition, light passing through the interface between the first light-transmitting layer 910 and the second light-transmitting layer 920 is absorbed by the light shielding member 230. Therefore, light leakage defects may be suppressed or reduced.

[0243] exist Fig.24A and Fig. 24B , two light-transmitting layers (i.e., a first light-transmitting layer 910 and a second light-transmitting layer 920) are disposed between the light-shielding member 230 and the first wavelength band filter 310, between the light-shielding member 230 and the second wavelength band filter 320, and between the light-shielding member 230 and the light-transmitting pattern 510. However, in an exemplary embodiment, three or more light-transmitting layers may be formed to provide a nearly total reflection function at each interface.

[0244] Fig.25A and Fig.25B A display device 18 according to an exemplary embodiment is illustrated. Fig.25A is with Figure 4 The corresponding cross-sectional view, and Fig.25B yes Fig.25AMagnified view of area "A".

[0245] refer to Fig.25A and Fig.25B , the display device 18 according to the exemplary embodiment and the Fig. 10A and Fig. 10B The display device 3 of the embodiment is different in that it further includes a first light-transmitting layer 930 and a second light-transmitting layer 940 arranged between the light shielding member 230 and the second partition wall portion 112 .

[0246] In an exemplary embodiment, the first light-transmitting layer 930 may be directly disposed on the second partition wall portion 112 and may surround at least a portion of the second partition wall portion 112. For example, the first light-transmitting layer 930 may be disposed on the upper surface 110t of the second partition wall portion 112 and on the side surface 110s of the second partition wall portion 112. The light transmittance of the first light-transmitting layer 930 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The first light-transmitting layer 930 may be in contact with the second substrate BS2.

[0247] In addition, the second light-transmitting layer 940 may be directly disposed on the first light-transmitting layer 930, and may surround at least a portion of the first light-transmitting layer 930. For example, the second light-transmitting layer 940 may be disposed on the upper surface 110t of the second partition wall portion 112 and on the side surface 110s of the second partition wall portion 112. The light transmittance of the second light-transmitting layer 940 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The second light-transmitting layer 940 may be in contact with the second substrate BS2.

[0248] In an exemplary embodiment, the refractive index of the second light-transmitting layer 940 may be greater than that of the first light-transmitting layer 930. Therefore, a certain optical function may be imparted to the first light-transmitting layer 930 and the second light-transmitting layer 940.

[0249] For example, when the first color conversion pattern 410 includes a wavelength shifting material, light traveling toward the second color conversion pattern 420 among the light emitted from the wavelength shifting material may be absorbed by the light shielding member 230, thereby suppressing or reducing light leakage defects. In addition, light that passes through the light shielding member 230 without being completely blocked or minimized by the light shielding member 230 may be reflected at the interface between the first light-transmitting layer 930 and the second light-transmitting layer 940, thereby suppressing or reducing light leakage defects and improving light utilization efficiency.

[0250] exist Fig.25A and Fig.25B, two light-transmitting layers (ie, a first light-transmitting layer 930 and a second light-transmitting layer 940) are disposed between the light-shielding member 230 and the second partition wall portion 112. However, in an exemplary embodiment, three or more light-transmitting layers may be formed to provide a nearly total reflection function at each interface.

[0251] A method of manufacturing a display device according to an embodiment will be described below.

[0252] According to an exemplary embodiment, a method for manufacturing a display device includes: forming or arranging a partition wall pattern and an opaque material pattern having light transmittance on a first surface of a substrate; applying a light shielding member forming or arranging composition to the partition wall pattern and the opaque material pattern; and radiating light from a second surface of the substrate by using the opaque material pattern as a light shielding mask to form a light shielding member on an upper surface and a side surface of the partition wall pattern. The method for manufacturing a display device may further include: at least partially exposing the first surface of the substrate by removing the opaque material pattern; spraying an ink composition onto the exposed first surface of the substrate, the ink composition comprising a wavelength shifting material; and forming a color conversion pattern by curing the ink composition.

[0253] Fig.26A , Fig.26B , Fig.26C , Fig.26D , Fig.26E , Fig.26F , Figure 26G , Fig.26H , Fig.26I , Fig.26J , Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0254] refer to Fig.26A The opaque material layer 800 is formed on the surface of the substrate BS2 (at Fig.26A The opaque material layer 800 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials, or may include an opaque organic material. The method of forming the opaque material layer 800 is not particularly limited. For example, a deposition method such as sputtering may be used.

[0255] Next, refer to Fig.26B , a photosensitive layer 850 is formed on the opaque material layer 800. Forming the photosensitive layer 850 may include coating a photosensitive composition and pre-baking the photosensitive composition. In an exemplary embodiment, the photosensitive composition and the photosensitive layer 850 may include a positive photosensitive material.

[0256] Next, refer to Fig.26C , the photosensitive pattern layer 851 is formed by placing a mask M1 having an opening and radiating light. Forming the photosensitive pattern layer 851 includes: radiating light to the photosensitive layer 850 by using the mask M1 as an exposure mask, and developing by coating a developer to form the photosensitive pattern layer 851. In an exemplary embodiment in which the photosensitive layer 850 includes a positive photosensitive material, the bonds between polymers may be at least partially broken at a portion exposed through the opening of the mask M1, and the exposed portion may be removed by the developer.

[0257] Next, refer to Fig.26D , the opaque material pattern 801 is formed using the photosensitive pattern layer 852 as an etching mask. Forming the opaque material pattern 801 may include patterning the opaque material layer 800 using an etching process. The etching process may be a dry etching process or a wet etching process. As a result of the etching process, an opaque material pattern 801 exposing at least a portion of the surface of the substrate BS2 may be formed. The photosensitive pattern layer 852 used as an etching mask may be removed by an ashing process.

[0258] Next, refer to Fig.26E , the organic layer 100 is formed on the opaque material pattern 801. Forming the organic layer 100 may include coating an organic layer forming composition and pre-baking the organic layer forming composition. In an exemplary embodiment, the organic layer forming composition and the organic layer 100 may include a negative photosensitive material.

[0259] For example, the organic layer forming composition may include a photopolymerizable compound, a photopolymerization initiator and a solvent, and may further include other additives. The photopolymerizable compound is a polymerizable monomer compound, and may include a monofunctional monomer, a difunctional monomer and a multifunctional monomer. The example of a monofunctional monomer includes nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate and N-vinyl pyrrolidone. In addition, the example of a difunctional monomer includes 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxyethyl) ether of bisphenol A and 3-methylpentanediol di(meth)acrylate. In addition, examples of the multifunctional monomer include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, propoxylated dipentaerythritol hexa(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0260] The photopolymerization initiator is not particularly limited. Examples of the photopolymerization initiator include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)vinyl]-1,3 triazine initiator compounds such as 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine or 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine; oligomers such as diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, Benzyl dimethyl ketal, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropane-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methylphenylthio)-2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butane-1-one or 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propane-1-one; acetophenone initiator compounds such as 2,2'-bis(2-chlorophenyl)-4,4'- Biimidazole initiator compounds of 5,5'-tetraphenyl-biimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl)biimidazole; or imidazole compounds in which the phenyl groups at the 4,4',5,5' positions are substituted by alkoxycarbonyl groups; and combinations of the above initiator compounds.

[0261] In addition, the organic layer 100 may have light transmittance. The light transmittance of the organic layer 100 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The material forming the organic layer 100 is not particularly limited as long as it has excellent light transmittance. For example, the material forming the organic layer 100 may be an organic material such as an epoxy resin, an acrylic resin, or an imide resin.

[0262] In exemplary embodiments, the organic layer forming composition and the organic layer 100 may include particles 110 p dispersed therein.

[0263] refer to Fig.26F, the second partition wall portion 112 is formed on the substrate BS2. Forming the second partition wall portion 112 may include: radiating light to the organic layer 100 by using the mask M1 as an exposure mask, and forming the second partition wall portion 112 by applying a developer. In an exemplary embodiment in which the organic layer forming composition and the organic layer 100 are made of a negative photosensitive material, the mask M1 may be the same as the mask M1 used to form the opaque material pattern 801. The portion of the organic layer 100 exposed through the opening of the mask M1 may be cured, and the other portion may be removed by the developer. In the current operation, the second partition wall portion 112 and the opaque material pattern 801 may be separated from each other, and at least a portion of the surface of the substrate BS2 may be exposed without being covered by the second partition wall portion 112 and the opaque material pattern 801. Therefore, the second partition wall portion 112 may be formed on the exposed surface of the substrate BS2. According to an exemplary embodiment, the second partition wall portion 112 and the opaque material pattern 801 may be formed using only one mask M1. Therefore, the manufacturing cost can be reduced.

[0264] The second partition wall portion 112 may help align the ink composition in the inkjet process to be described later. That is, the second partition wall portion 112 may play a guiding role as follows: for accurately ejecting the ink composition and stably positioning it at a desired position. The lower limit of the height of the second partition wall portion 112 may be about 5.0 μm, about 5.5 μm, about 6.0 μm, about 6.5 μm, about 7.0 μm, about 7.5 μm, about 8.0 μm, about 8.5 μm, about 9.0 μm, about 9.5 μm, about 10.0 μm, about 10.5 μm, about 11.0 μm, about 11.5 μm, about 12.0 μm, or about 15.0 μm. In addition, the second partition wall portion 112 may include an upper surface 110 t forming a flat surface and a side surface 110 s inclined downward from the upper surface 110 t. An average inclination angle of the side surface 110 s of the second partition wall portion 112 with respect to the surface of the substrate BS2 may be, but is not limited to, about 30 to 85 degrees.

[0265] In an exemplary embodiment, the second partition wall portion 112 may include a first partition wall portion extending in a first direction X in plan view and a second partition wall portion extending in a second direction Y intersecting the first direction X. Therefore, the second partition wall portion 112 may have a substantially lattice shape in plan view.

[0266] Since it is already about Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8The partition wall of FIG. 1 specifically describes other features of the second partition wall portion 112 , so redundant descriptions of these features will be omitted.

[0267] Next, refer to Figure 26G , a light shielding member forming composition 200 including a light shielding material is applied to the second partition wall portion 112. In an exemplary embodiment, pre-baking of the applied light shielding member forming composition 200 may be further performed. The pre-baking of the light shielding member forming composition 200 may be performed at a temperature of about 50° C. to 120° C. for about 60 seconds to 200 seconds.

[0268] Applying the light shielding member forming composition 200 onto the second partition wall portion 112 may include applying the light shielding member forming composition 200 to have a thickness greater than the height of the second partition wall portion 112. That is, the light shielding member forming composition 200 may be applied to cover the upper surface 110t of the second partition wall portion 112. In the current operation, the light shielding member forming composition 200 may at least partially fill the space between the second partition wall portion 112 and the opaque material pattern 801.

[0269] The light blocking member forming composition 200 may include a colorant such as a black pigment or dye, a photopolymerizable compound, a photopolymerization initiator, and a solvent, and may further include an additive such as insulating particles.

[0270] Examples of colorants such as black pigments or dyes include inorganic pigments such as carbon black, titanium black, lignin black, perylene black, cyanine black, complex oxide pigments such as iron / manganese, and combinations thereof.

[0271] Photopolymerizable compounds are polymerizable monomer compounds, and may include monofunctional monomers, difunctional monomers, and polyfunctional monomers. Examples of monofunctional monomers include nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, and N-vinyl pyrrolidone. In addition, examples of difunctional monomers include 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxyethyl) ether of bisphenol A, and 3-methylpentanediol di(meth)acrylate. In addition, examples of the multifunctional monomer include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, propoxylated dipentaerythritol hexa(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0272] The photopolymerization initiator is not particularly limited. Examples of the photopolymerization initiator include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)vinyl]-1,3 triazine initiator compounds such as 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine or 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine; oligomers such as diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, Benzyl dimethyl ketal, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropane-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methylphenylthio)-2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butane-1-one or 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propane-1-one; acetophenone initiator compounds such as 2,2'-bis(2-chlorophenyl)-4,4'- Biimidazole initiator compounds of 5,5'-tetraphenyl-biimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl)biimidazole; or imidazole compounds in which the phenyl groups at the 4,4',5,5' positions are substituted by alkoxycarbonyl groups; and combinations of the above initiator compounds.

[0273] Next, refer to Fig.26H , through the back of the substrate BS2 (at Fig.26H The bottom surface of the light shielding member 210 is radiated with light to form the light shielding member 210. The forming of the light shielding member 210 may include forming the light shielding member 210 using the opaque material pattern 801 as a light shielding mask.

[0274] In an exemplary embodiment, forming the light shielding member 210 may include: radiating light from the back of the substrate BS2, allowing the light to pass through the substrate BS2, allowing the light to enter the second partition wall portion 112, allowing the light to pass through the upper surface 110t of the second partition wall portion 112, and allowing the light to pass through the side surface 110s of the second partition wall portion 112.

[0275] Light incident on the opaque material pattern 801 may be shielded by the opaque material pattern 801, and thus the light shielding member forming composition 200 may not be cured. On the other hand, light incident on the second partition wall portion 112 having excellent light transmittance may pass through the upper surface 110t and the side surface 110s of the second partition wall portion 112 to help cure the light shielding member forming composition 200. Light propagating toward the light shielding member forming composition 200 may cure the light shielding member forming composition 200. Then, as the light further propagates a certain distance, it may gradually decrease due to the light absorption characteristics of the light shielding member forming composition 200. Therefore, the light shielding member 210 may be formed on the upper surface 110t and the side surface 110s of the second partition wall portion 112, and a portion of the light shielding member forming composition 200 disposed away from the second partition wall portion 112 may maintain the state of the light shielding member forming composition 200.

[0276] In an exemplary embodiment, the thickness and surface roughness of the light blocking member 210 may be controlled by the intensity and irradiation time of the radiated light.

[0277] The second partition wall portion 112 according to an exemplary embodiment may have an inclined side surface 110s. Therefore, a sufficient amount of light may be transmitted not only through the upper surface 110t of the second partition wall portion 112, but also through the side surface 110s of the second partition wall portion 112. In addition, when the second partition wall portion 112 includes particles 110p dispersed therein, light scattered / diffused by the particles 110p can easily propagate in all directions. In an exemplary embodiment, the light shielding member 210 arranged on the upper surface 110t of the second partition wall portion 112 may be thicker than the light shielding member 210 arranged on the side surface 110s of the second partition wall portion 112.

[0278] Since it has been referenced Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The light shielding member 210 is described in detail, and thus a redundant description of the light shielding member 210 will be omitted.

[0279] Next, refer to Fig.26I, removing the remaining light shielding member forming composition 200. Removing the remaining light shielding member forming composition 200 may include removing the remaining light shielding member forming composition 200 by applying a developer. Thus, a substrate BS2, a second partition wall portion 112 disposed on the substrate BS2, and a light shielding member 210 and an opaque material pattern 801 disposed to surround the second partition wall portion 112 may be formed.

[0280] In an exemplary embodiment, hard baking the light blocking member 210 may be further performed after removing the remaining light blocking member forming composition 200 .

[0281] Next, refer to Fig.26J , removing the opaque material pattern 801. Removing the opaque material pattern 801 may include at least partially exposing the surface of the substrate BS2. Removing the opaque material pattern 801 may include removing the opaque material pattern 801 using a wet etching process. This operation may leave only the substrate BS2, the second partition wall portion 112 arranged on the substrate BS2, and the light shielding member 210 arranged to surround the second partition wall portion 112.

[0282] Next, refer to Figure 26K , the first band filter 310 and the second band filter 320 are formed in at least some of the openings formed by the second partition wall portion 112. The first band filter 310 and the second band filter 320 may be formed by patterning a photosensitive organic material using a photo process or by arranging through an inkjet process. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The first optical band filter 310 and the second optical band filter 320 are described in detail, and thus redundant descriptions of the first optical band filter 310 and the second optical band filter 320 will be omitted.

[0283] refer to Figure 26L , the first ink composition 401, the second ink composition 402, and the third ink composition 500 are arranged into the opening formed by the second partition wall portion 112. The first ink composition 401, the second ink composition 402, and the third ink composition 500 may be arranged sequentially or simultaneously. In an exemplary embodiment, the first ink composition 401 may include a first wavelength shifting material 410p that emits light having a peak wavelength of a first color, the second ink composition 402 may include a second wavelength shifting material 420p that emits light having a peak wavelength of a second color, and the third ink composition 500 may include particles 510p.

[0284] Since the second partition wall portion 112 has a sufficient height, the first ink composition 401 , the second ink composition 402 , and the third ink composition 500 may be accurately arranged at desired positions.

[0285] Next, refer to Figure 26M , drying and curing the ink composition to form the first color conversion pattern 410, the second color conversion pattern 420 and the light-transmitting pattern 510. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The first color conversion pattern 410 , the second color conversion pattern 420 , and the light-transmitting pattern 510 are described in detail, and thus a redundant description of the first color conversion pattern 410 , the second color conversion pattern 420 , and the light-transmitting pattern 510 will be omitted.

[0286] refer to Fig.26N , a fourth band filter 610, an overcoat layer OC, a polarizing layer POL, and a common electrode CE are sequentially formed on the first color conversion pattern 410, the second color conversion pattern 420, and the light-transmitting pattern 510, thereby preparing a second display panel SUB2. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 Each element of the second display panel SUB2 is described in detail, and thus a redundant description of each element of the second display panel SUB2 will be omitted.

[0287] refer to Fig.26O , a first display panel SUB1 including a switching element Q and a pixel electrode PE is prepared, and a liquid crystal layer LCL is interposed between the first display panel SUB1 and the second display panel SUB2. As a result, a display panel 31 is prepared. The first display panel SUB1 and the second display panel SUB2 may be combined together by a sealing member.

[0288] The liquid crystal layer LCL may be disposed between the first display panel SUB1 and the second display panel SUB2 by dropping a liquid crystal composition including liquid crystals LC onto the first display panel SUB1 or the second display panel SUB2 and then bonding the first display panel SUB1 and the second display panel SUB2 together. Although not shown in the drawings, placing the light source unit 50 on the first display panel SUB1 may be further performed.

[0289] A method of manufacturing a display apparatus according to an exemplary embodiment will be described below.

[0290] Fig.27A , Fig.27B , Fig.27C , Fig.27D , Fig.27E and Fig.27F is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0291] refer to Fig.27A , a second partition wall portion 112 having light transmittance and an opaque material pattern 801 are formed on the surface of the substrate BS2. Fig.26A , Fig.26B , Fig.26C , Fig.26D , Fig.26E and Fig.26F The formation of the second partition wall portion 112 and the opaque material pattern 801 is described in detail, and thus a redundant description of this operation will be omitted.

[0292] Next, refer to Fig.27B , a light shielding member forming composition 200 including a light shielding material is applied to the second partition wall portion 112. In an exemplary embodiment, pre-baking the applied light shielding member forming composition 200 may be further performed.

[0293] Next, refer to Fig.27C , treating the entire surface of the applied light shielding member forming composition 200 with fluorine. Treating the entire surface of the applied light shielding member forming composition 200 with fluorine may include spraying carbon tetrafluoride (CF 4 In the current operation, the overall fluorine content of the exposed surface (upper surface) of the applied light shielding member forming composition 200 may be increased.

[0294] Next, refer to Fig.27D , the light shielding member 210 is formed by radiating light from the back of the substrate BS2. Fig.26H The formation of the light shielding member 210 is described in detail, and thus a redundant description of this operation will be omitted.

[0295] Next, refer to Fig.27E , removing the remaining light blocking member forming composition 200. Removing the remaining light blocking member forming composition 200 may include removing the remaining light blocking member forming composition 200 by applying a developer.

[0296] The light shielding member 210 exposed after removing the remaining light shielding member forming composition 200 may have different fluorine contents in different regions thereof. For example, the fluorine content per unit area of ​​the surface of the light shielding member 210 arranged on the upper surface of the second partition wall portion 112 exposed to the fluorine treatment may be greater than the fluorine content per unit area of ​​the surface of the light shielding member 210 arranged on the side surface of the second partition wall portion 112 not exposed to the fluorine treatment.

[0297] Next, refer to Fig.27F , the opaque material pattern 801 is removed to at least partially expose the surface of the substrate BS2.

[0298] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0299] Fig.28A , Fig.28B , Fig.28C , Fig.28D , Fig.28E , Fig.28F , Figure 28G and Fig.28H is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0300] refer to Fig.28A , a second partition wall portion 112 having light transmittance and an opaque material pattern 801 are formed on the surface of the substrate BS2. Fig.26A , Fig.26B , Fig.26C , Fig.26D , Fig.26E and Fig.26F The formation of the second partition wall portion 112 and the opaque material pattern 801 is described in detail, and thus a redundant description of this operation will be omitted.

[0301] Next, refer to Fig.28B , a light shielding member forming composition 200 including a light shielding material is applied to the second partition wall portion 112. In an exemplary embodiment, pre-baking the applied light shielding member forming composition 200 may be further performed.

[0302] Next, refer to Fig.28C , the light shielding member 210 is formed by radiating light from the back of the substrate BS2. Fig.26H The formation of the light shielding member 210 is described in detail, and thus a redundant description of this operation will be omitted.

[0303] Next, refer to Fig.28D , a resin layer 750 is formed on the light shielding member 210 and the uncured portion 201. There is no particular limitation on the method of forming the resin layer 750. For example, the resin layer 750 may be formed by coating a UV-curable resin material.

[0304] Next, refer to Fig.28E , a patterned resin layer 750 is formed using a stamp ST. The stamp ST may have a reverse pattern of the recessed and protruding patterns to be formed. By placing the stamp ST on the surface of the resin layer 750 and pressing the stamp ST, the reverse pattern of the pattern formed on the stamp ST can be transferred to the surface of the resin layer 750.

[0305] Next, refer to Fig.28F , the stamp ST is removed to form a recessed and protruded pattern layer 751 on the light shielding member 210 and the uncured portion 201 .

[0306] Next, refer to Figure 28G , the uncured portion 201 of the light blocking member forming composition 200 is removed to form the concave and protrusive pattern 700 on the light blocking member 210. Removing the light blocking member forming composition 200 may include removing the remaining light blocking member forming composition 200 by applying a developer.

[0307] When the remaining light blocking member forming composition 200 is removed, the recessed and protruded pattern layer 751 overlapping the uncured portion 201 is removed, and the recessed and protruded pattern 700 may remain on the surface of the cured light blocking member 210 .

[0308] Next, refer to Fig.28H , the opaque material pattern 801 is removed to at least partially expose the surface of the substrate BS2.

[0309] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0310] Fig.29A , Fig.29B , Fig.29C , Fig.29D , Fig.29E , Fig.29F , Figure 29G and Fig.29H is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0311] refer to Fig.29A, an opaque material layer 800 and a photosensitive pattern layer 851 are formed on the surface of the substrate BS2. Fig.26A , Fig.26B and Fig.26C The formation of the opaque material layer 800 and the photosensitive pattern layer 851 is described in detail, and thus a redundant description of this operation will be omitted.

[0312] Next, refer to Fig.29B , the opaque material pattern 802 is formed using the photosensitive pattern layer 852 as an etching mask. Forming the opaque material pattern 802 may include patterning the opaque material layer 800 using an etching process. In an exemplary embodiment, the side surface of the opaque material pattern 802 may have a reverse slope. The side shape of the opaque material pattern 802 may be controlled by the type of etching process, the etchant, the etching time, the etching conditions, etc. However, exemplary embodiments are not limited thereto, and the side surface of the opaque material pattern 802 may have a non-reverse slope, or may be substantially perpendicular to the surface of the substrate BS2. The photosensitive pattern layer 852 used as an etching mask may be removed by an ashing process.

[0313] Next, refer to Fig.29C , the organic layer 100 is formed on the opaque material pattern 802. Fig.26E The formation of the organic layer 100 is described, and thus a redundant description of this operation will be omitted.

[0314] Next, refer to Fig.29D , the second partition wall portion 112 is formed on the substrate BS2. Forming the second partition wall portion 112 may include: irradiating light to the organic layer 100 by using the mask M1 as an exposure mask, and forming the second partition wall portion 112 by coating a developer. In the current operation, the second partition wall portion 112 and the opaque material pattern 802 may be spaced apart from each other, and at least a portion of the surface of the substrate BS2 may be exposed without being covered by the second partition wall portion 112 and the opaque material pattern 802.

[0315] Next, refer to Fig.29E , a light shielding member forming composition 200 including a light shielding material is applied to the second partition wall portion 112. In an exemplary embodiment, pre-baking the applied light shielding member forming composition 200 may be further performed. In the current operation, the light shielding member forming composition 200 may at least partially fill the space between the second partition wall portion 112 and the opaque material pattern 802.

[0316] Next, refer to Fig.29F , the light shielding member 240 is formed by radiating light from the back of the substrate BS2. Fig.26HThe formation of the light blocking member 240 is described in detail, and thus a redundant description of this operation will be omitted.

[0317] Next, refer to Figure 29G , removing the remaining light blocking member forming composition 200. Removing the remaining light blocking member forming composition 200 may include removing the remaining light blocking member forming composition 200 by applying a developer.

[0318] Next, refer to Fig.29H , the opaque material pattern 802 is removed to at least partially expose the surface of the substrate BS2.

[0319] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0320] Fig. 30A , Fig. 30B , Fig. 30C , Fig.30D , Fig.30E and Fig.30F is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0321] refer to Fig. 30A , an opaque material pattern 803 is formed on the surface of the substrate BS2. The side surface of the opaque material pattern 803 may be substantially perpendicular to the surface of the substrate BS2. Fig.26A , Fig.26B , Fig.26C and Fig.26D The method of forming the opaque material pattern 803 is described in detail, and thus a redundant description of the method will be omitted.

[0322] Next, refer to Fig. 30B , the second partition wall portion 112 is formed on the substrate BS2. In the current operation, the second partition wall portion 112 and the opaque material pattern 803 may at least partially contact each other. That is, the surface of the substrate BS2 may be completely covered by the second partition wall portion 112 and the opaque material pattern 803. Fig.26E and Fig.26F The formation of the second partition wall portion 112 is described, and thus a redundant description of this operation will be omitted.

[0323] Next, refer to Fig. 30C , a light shielding member forming composition 200 including a light shielding material is applied to the second partition wall portion 112. In an exemplary embodiment, pre-baking the applied light shielding member forming composition 200 may be further performed.

[0324] Next, refer to Fig.30D , the light shielding member 250 is formed by radiating light from the back of the substrate BS2. When the opaque material pattern 803 having a vertical side surface contacts the second partition wall portion 112, the side surface of the light shielding member 250 may also be vertical. Fig.26H The formation of the light blocking member 250 is described in detail, and thus a redundant description of the operation will be omitted.

[0325] Next, refer to Fig.30E , removing the remaining light blocking member forming composition 200. Removing the remaining light blocking member forming composition 200 may include removing the remaining light blocking member forming composition 200 by applying a developer.

[0326] Next, refer to Fig.30F , the opaque material pattern 803 is removed to at least partially expose the surface of the substrate BS2.

[0327] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0328] Fig.31A , Fig.31B , Fig.31C , Fig.31D , Fig.31E and Fig.31F is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0329] refer to Fig.31A , an opaque material pattern 804 is formed on the surface of the substrate BS2. Fig.26A , Fig.26B , Fig.26C and Fig.26D The method of forming the opaque material pattern 804 is described in detail, and thus a redundant description of the method will be omitted.

[0330] Next, refer to Fig.31B , the second partition wall portion 112 is formed on the substrate BS2. Fig.26E and Fig.26F The formation of the second partition wall portion 112 is described, and thus a redundant description of this operation will be omitted.

[0331] Next, refer to Fig.31C, a light shielding member forming composition 200 including a light shielding material is applied to the second partition wall portion 112. In an exemplary embodiment, pre-baking the applied light shielding member forming composition 200 may be further performed.

[0332] Next, refer to Fig.31D , the light shielding member 260 is formed by radiating light from the back of the substrate BS2. In an exemplary embodiment, the light shielding member 260 may at least partially overlap with the opaque material pattern 804. Fig.26H The formation of the light shielding member 260 is described in detail, and thus a redundant description of the operation will be omitted.

[0333] Next, refer to Fig.31E , removing the remaining light blocking member forming composition 200. Removing the remaining light blocking member forming composition 200 may include removing the remaining light blocking member forming composition 200 by applying a developer.

[0334] refer to Fig.31F The opaque material pattern 804 is removed to at least partially expose the surface of the substrate BS2. Thus, the second partition wall portion 112 disposed on the substrate BS2 and the light shielding member 260 disposed on the second partition wall portion 112 and having an undercut portion may be formed.

[0335] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0336] Fig.32A , Fig.32B , Fig.32C , Fig.32D , Fig.32E and Fig.32F is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0337] refer to Fig.32A , Fig.32B , Fig.32C , Fig.32D and Fig.32E , a second partition wall portion 112 having light transmittance and an opaque material pattern 804 are formed on the surface of the substrate BS2. Then, a light shielding member forming composition 200 is applied, and light is radiated from the back of the substrate BS2 to form a light shielding member 260. The light shielding member 260 may at least partially overlap with the opaque material pattern 804. Fig.31A , Fig.31B , Fig.31C , Fig.31Dand Fig.31E These operations are basically the same, so redundant description will be omitted.

[0338] Next, refer to Fig.32F , the opaque material pattern 804 is removed to at least partially expose the surface of the substrate BS2. In an exemplary embodiment, the opaque material pattern 810 may remain on at least a portion of the undercut portion of the light blocking member 260. Therefore, the opaque material pattern 810 may be formed between the light blocking member 260 and the substrate BS2.

[0339] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0340] Fig.33A , Fig.33B , Fig.33C , Fig.33D , Fig.33E and Fig.33F is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0341] refer to Fig.33A , an opaque material pattern 805 is formed on the surface of the substrate BS2. Fig.26A , Fig.26B , Fig.26C and Fig.26D The method of forming the opaque material pattern 805 is described in detail, and thus a redundant description of the method will be omitted.

[0342] Next, refer to Fig.33B , the partition wall 130 is formed on the substrate BS2. In an exemplary embodiment, the partition wall 130 may at least partially overlap with the opaque material pattern 805. Fig.26E and Fig.26F The formation of the partition wall 130 is described, and thus a redundant description of this operation will be omitted.

[0343] Next, refer to Fig.33C , Fig.33D and Fig.33E , a light shielding member forming composition 200 including a light shielding material is applied, light is radiated from the back of the substrate BS2 to form the light shielding member 280 , and the remaining light shielding member forming composition 200 is removed.

[0344] refer to Fig.33FThe opaque material pattern 805 is removed to at least partially expose the surface of the substrate BS2. Thus, a partition wall 130 disposed on the substrate BS2 and having an undercut 130U and a light shielding member 280 disposed on the partition wall 130 may be formed.

[0345] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0346] Fig.34A , Fig.34B , Fig.34C , Fig.34D , Fig.34E and Fig.34F is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0347] refer to Fig.34A , Fig.34B , Fig.34C , Fig.34D and Fig.34E , a partition wall 130 having light transmittance and an opaque material pattern 805 are formed on the surface of the substrate BS2. Then, a light shielding member forming composition 200 is applied, and light is radiated from the back of the substrate BS2 to form a light shielding member 280. The partition wall 130 may at least partially overlap with the opaque material pattern 805. Since these operations are similar to Fig.33A , Fig.33B , Fig.33C , Fig.33D and Fig.33E The operations are the same as those of , so redundant descriptions will be omitted.

[0348] refer to Fig.34F , the opaque material pattern 805 is removed to at least partially expose the surface of the substrate BS2. In an exemplary embodiment, the opaque material pattern 805 may remain on at least a portion of the undercut portion of the partition wall 130. Therefore, an opaque material layer 830 may be formed between the partition wall 130 and the substrate BS2.

[0349] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0350] Fig.35A , Fig.35B , Fig.35C , Fig.35D, Fig.35E , Fig.35F and Figure 35G is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0351] refer to Fig.35A The second partition wall portion 112 is formed on the surface of the substrate BS2 (in Fig.35A The second partition wall portion 112 may be formed by forming an organic layer and patterning the organic layer. Thus, the second partition wall portion 112 exposing at least a portion of the surface of the substrate BS2 may be formed.

[0352] Next, refer to Fig.35B , an opaque material layer 806 is formed on the substrate BS2 and the second partition wall portion 112. The opaque material layer 806 may include a reflective metal material or an opaque organic material. The method of forming the opaque material layer 806 is not particularly limited. For example, the opaque material layer 806 may be formed by a deposition method such as sputtering.

[0353] Next, refer to Fig.35C , forming an opaque material pattern 807. Forming the opaque material pattern 807 may include placing an etching mask and etching the opaque material layer 806 using the etching mask. In an exemplary embodiment, the opaque material pattern 807 may be arranged on at least a portion of the second partition wall portion 112. That is, the opaque material pattern 807 may at least partially overlap with the second partition wall portion 112. Therefore, the opaque material pattern 807 may be formed on the exposed surface of the substrate BS2.

[0354] Next, refer to Fig.35D , a light blocking member forming composition 200 including a light blocking material is applied onto the opaque material pattern 807. In an exemplary embodiment, pre-baking the applied light blocking member forming composition 200 may be further performed.

[0355] Next, refer to Fig.35E , a light shielding member 270 is formed by radiating light from the back of the substrate BS2. Fig.26H The formation of the light shielding member 270 is described in detail, and thus a redundant description of the operation will be omitted.

[0356] Next, refer to Fig.35F , removing the remaining light blocking member forming composition 200. Removing the remaining light blocking member forming composition 200 may include removing the remaining light blocking member forming composition 200 by applying a developer.

[0357] Next, refer to Figure 35G, the opaque material pattern 807 is removed to at least partially expose the surface of the substrate BS2. Thus, a light blocking member 270 spaced apart from the substrate BS2 may be formed.

[0358] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0359] Fig.36A , Fig.36B , Fig.36C , Fig.36D , Fig.36E , Fig.36F and Figure 36G is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0360] refer to Fig.36A , Fig.36B , Fig.36C , Fig.36D , Fig.36E and Fig.36F , a second partition wall portion 112 having transparency and an opaque material pattern 807 are formed on the surface of the substrate BS2. Then, a light shielding member forming composition 200 is applied, and light is radiated from the back of the substrate BS2 to form a light shielding member 270. The opaque material pattern 807 may at least partially overlap with the second partition wall portion 112. Since these operations are similar to Fig.35A , Fig.35B , Fig.35C , Fig.35D , Fig.35E and Fig.35F Those operations are basically the same, so redundant description will be omitted.

[0361] Next, refer to Figure 36G , the opaque material pattern 807 is removed to at least partially expose the surface of the substrate BS2. In an exemplary embodiment, the opaque material pattern 820 may remain on at least a portion of the exposed side surface of the second partition wall portion 112. Therefore, the opaque material pattern 820 may be formed to contact the second partition wall portion 112.

[0362] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0363] Fig.37A , Fig.37B , Fig.37C , Fig.37D , Fig.37E , Fig.37F , Figure 37G and Fig.37H is a cross-sectional view illustrating a method of manufacturing a display apparatus according to an exemplary embodiment.

[0364] refer to Fig.37A The first band filter 314 and the second band filter 324 are formed on the surface of the substrate BS2 (in Fig.37A Each of the first wavelength band filter 314 and the second wavelength band filter 324 may be a wavelength selective optical filter that transmits light of a specific wavelength band and blocks light of another specific wavelength band. The first wavelength band filter 314 and the second wavelength band filter 324 may be spaced apart from each other.

[0365] refer to Fig.37B , an opaque material layer 808 is formed on the first band filter 314 and the second band filter 324. The opaque material layer 808 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials, or may include an opaque organic material.

[0366] refer to Fig.37C , an opaque material pattern 809 is formed by patterning the opaque material layer 808. Forming the opaque material pattern 809 may include patterning the opaque material layer 808 using an etching mask.

[0367] In an exemplary embodiment, the width t of the opaque material pattern 809 is 1 The width of the first wavelength filter 314 and the width of the second wavelength filter 324 are comparable. 2 That is, the formed opaque material pattern 809 may partially expose the first wavelength band filter 314 and the second wavelength band filter 324 without completely covering the first wavelength band filter 314 and the second wavelength band filter 324 .

[0368] Next, refer to Fig.37D , the second partition wall portion 112 is formed on the substrate BS2. In an exemplary embodiment, the second partition wall portion 112 may at least partially overlap with the first band filter 314 and / or the second band filter 324. Fig.26E and Fig.26F The formation of the second partition wall portion 112 is described, and thus a redundant description of this operation will be omitted.

[0369] Next, refer to Fig.37E , Fig.37F and Figure 37G, a light shielding member forming composition 200 including a light shielding material is applied, light is radiated from the back of the substrate BS2 to form the light shielding member 290 , and the remaining light shielding member forming composition 200 is removed.

[0370] refer to Fig.37H , the opaque material pattern 809 is removed to at least partially expose the surface of the substrate BS2 and the first and second band filters 314 and 324. Thus, the first and second band filters 314 and 324 disposed between the substrate BS2 and the second partition wall portion 112 may be formed.

[0371] Although not shown in the drawings, Figure 26K , Figure 26L , Figure 26M , Fig.26N and Fig.26O The same method as described is used to manufacture a display device.

[0372] The display device according to the exemplary embodiment may include a light shielding member disposed between adjacent pixels to block the travel of light between the pixels. Therefore, it is possible to suppress or reduce a defect in which light leaks from an undesired pixel, thereby providing a display device with improved display quality.

[0373] The method of manufacturing a display device according to an exemplary embodiment may be employed to produce a display device having improved display quality.

[0374] Although specific exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the inventive concept is not limited to such embodiments, but rather to the broader scope of the provided claims and various obvious modifications and equivalent arrangements.

Claims

1. A method for manufacturing a display device, the method comprising: Arranging a partition wall pattern having light transmittance on a first surface of a substrate using a first exposure mask and arranging an opaque material pattern on the first surface of the substrate using the first exposure mask; applying a light shielding member forming composition onto the partition wall pattern and the opaque material pattern; as well as A light shielding member is formed on the upper and side surfaces of the partition wall pattern by radiating light from the second surface of the substrate using the opaque material pattern as a light shielding mask.

2. The method according to claim 1, wherein arranging the partition wall pattern and the opaque material pattern comprises: disposing the pattern of opaque material on the first surface of the substrate such that at least a portion of the first surface of the substrate is exposed; as well as The partition wall pattern is arranged on the exposed first surface of the substrate.

3. The method according to claim 1, further comprising: Before arranging the partition wall pattern and the opaque material pattern, arranging a band filter pattern on the first surface of the substrate, wherein the opaque material pattern is formed on the band filter pattern to overlap with the band filter pattern, and The opaque material pattern is narrower than the band filter pattern.

4. The method according to claim 1, wherein arranging the partition wall pattern and the opaque material pattern comprises: Arranging the partition wall pattern on the first surface of the substrate so that at least a portion of the first surface of the substrate is exposed; as well as The opaque material pattern is disposed on the portion of the first surface of the substrate exposed by the partition wall pattern.

5. The method according to claim 1, further comprising, after forming the light shielding member: exposing at least a portion of the first surface of the substrate by removing at least a portion of the pattern of opaque material; disposing an ink composition onto the exposed first surface of the substrate, the ink composition comprising a wavelength shifting material; as well as curing the ink composition, and The forming of the light shielding member comprises: prebaking the light shielding member forming composition; partially photocuring the prebaked light-shielding member-forming composition by using the opaque material pattern as a light-shielding mask; developing to form the light shielding members arranged on the upper surface and the side surface of the partition wall pattern by applying a developer to the partially photocured light shielding member forming composition; and hard baking the light shielding member, wherein the partially photocured pre-baked light shielding member forming composition comprises: radiating light from the second surface of the substrate; transmitting the light through the substrate; transmitting the light through the partition wall pattern; transmitting the light through the upper surface of the partition wall pattern; and The light is transmitted through the side surface of the partition wall pattern.

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