Heating circuit for integrated circuit

By using the contact control technology of air pressure balls and copper sheets in the integrated circuit heating circuit, the problem of low efficiency of the traditional heating circuit is solved and efficient heating of the integrated circuit is achieved.

CN109348546AInactive Publication Date: 2019-02-15YANGZHOU JIAYI METAL MATERIAL CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
YANGZHOU JIAYI METAL MATERIAL CO LTD
Filing Date
2018-12-02
Publication Date
2019-02-15
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The heating circuit of traditional integrated circuits cannot heat effectively, resulting in low heating efficiency.

Method used

An integrated circuit heating circuit is designed, which includes a fixed frame, an integrated circuit, a heating plate, an air pressure ball, a spring and a copper sheet. The air pressure ball controls the contact and disconnection of the copper sheet, thereby controlling the heating of the integrated circuit by the heating plate.

Benefits of technology

By controlling the contact and disconnection of the copper sheets through the expansion and contraction of the air pressure ball, efficient heating of the integrated circuit is achieved and the heating efficiency is improved.

✦ Generated by Eureka AI based on patent content.
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Abstract

The invention relates to a heating circuit for an integrated circuit. The heating circuit comprises a fixing frame, an integrated circuit and a heating board, wherein the integrated circuit and the heating board are fixed inside the fixing frame; bolts are arranged on the integrated circuit and inside the heating board; the bolts are connected with the integrated circuit and the heating board through screw holes; an upper part of the integrated circuit is provided with a pressurized ball and a spring; a movable rod is arranged on upper parts of the pressurized ball and the spring; a lead, a fixing rod and a copper sheet are arranged on the inner side of the fixing frame; one end of the fixing rod is fixedly connected with the inner side of the fixing frame by welding, and the other end ismovably connected with a movable rod through a rotary shaft; and the copper sheet is fixedly connected with the inner side of the fixing frame by embedding. Through adoption of the heating circuit ofthe integrated circuit, the pressurized ball is arranged in the fixing frame, and the copper sheet is switched on / off under the control of the pressurized ball in order to control the on / off of the circuit of the heating board, so that the heating board is used for heating the integrated circuit under the control.
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