Heating circuit for integrated circuit
By using the contact control technology of air pressure balls and copper sheets in the integrated circuit heating circuit, the problem of low efficiency of the traditional heating circuit is solved and efficient heating of the integrated circuit is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- YANGZHOU JIAYI METAL MATERIAL CO LTD
- Filing Date
- 2018-12-02
- Publication Date
- 2019-02-15
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The heating circuit of traditional integrated circuits cannot heat effectively, resulting in low heating efficiency.
An integrated circuit heating circuit is designed, which includes a fixed frame, an integrated circuit, a heating plate, an air pressure ball, a spring and a copper sheet. The air pressure ball controls the contact and disconnection of the copper sheet, thereby controlling the heating of the integrated circuit by the heating plate.
By controlling the contact and disconnection of the copper sheets through the expansion and contraction of the air pressure ball, efficient heating of the integrated circuit is achieved and the heating efficiency is improved.