Gain antenna, chip card, antenna structure and manufacturing method and device thereof

Abstract

The invention relates to a method for manufacturing an antenna structure, an antenna structure, a gain antenna, a chip card and an apparatus for manufacturing an antenna structure. In different embodiments a method for manufacturing an antenna structure is provided. The method can have applying an antenna to a carrier, punching a portion of the carrier with a portion of the antenna such that the antenna is interrupted to set a resonance frequency of the antenna, and inserting an element into a through opening formed in the carrier by the punching, wherein the antenna remains electrically interrupted, which is identical in shape to the punched portion of the carrier.

Description

Technical Field

[0001] This invention relates to a method for manufacturing an antenna structure, an antenna structure, a gain antenna, a chip card, and an apparatus for manufacturing an antenna structure. Background Technology

[0002] As in Figure 1B and Figure 1C As shown, the gain antenna may have a series resonant circuit having: inductors 102PC and 102Ls1; an (ohmic) resistor (provided, for example, by means of the resistance of a conductive line that forms the antenna) and a capacitor 102Cs, wherein the gain antenna may be, for example, a part of a chip card for wireless communication with an external reading device.

[0003] Various techniques, such as printing and etching, can be used to form antennas. Recently, experience has shown that wire embedding is one of the most cost-effective and efficient methods for manufacturing high-gain antennas. These techniques typically do not require vias, pads, or other types of connections. Figure 1B As shown, the conductor is simply configured as a coil and a capacitor in series. If desired, the conductor can be configured to have a tortuous structure that can be used to generate series resistance.

[0004] exist Figure 1C The diagram schematically illustrates the principle of a conventional series resonant circuit gain antenna. As per... Figure 1C As can be seen, the gain antenna 102 may have: a pickup coil inductor 102Ls1 (with a coupling factor k1, also referred to as coupling coefficient k1) for coupling to an external reading device 108; a coupling coil inductor 102Ls2 for coupling to a module antenna 110, the module antenna being mounted on a chip module 104, the chip module carrying a chip; a resistor 102Rs (the resistance is generated through a wire, such as a copper wire); and a series capacitor 102Cs.

[0005] These electrical components can be formed and arranged, for example, by means of a wiring method as shown in 1B.

[0006] As an embedding device, an ultrasonic wire guide tool (also known as an ultrasonic welding electrode) can be used, which may have a wire delivery channel (also known as a capillary) that guides the wire through the middle of the wire guide tool. The wire conductor can be guided through the wire guide tool, exiting from the tip of the wire guide tool, and can be "kneaded" into the substrate material by using pressure and ultrasonic vibration during the movement of the wire guide tool. Therefore, due to the pressure and vibration, the space-constrained heating of the substrate material causes the wire conductor to sink into the substrate.

[0007] Of course, the precision of the embedding device (e.g., ultrasonic welding electrode) is limited, which leads to large manufacturing tolerances. When manufacturing gain antenna inlays, the manufacturing tolerances of conventional wire embedding devices result in the resonant frequency of the antenna inlay fluctuating by approximately 1 MHz around a preset target resonant frequency.

[0008] In the manufacture of wire-embedded gain antennas for so-called Coil Module (CoM) chip cards, where the chip card provides contactless interaction between the gain antenna and an external reading device on the one hand, and contactless interaction between the gain antenna and the chip module antenna on the other hand, manufacturing tolerances of approximately 1 MHz for the wire embedding method are currently tolerated, and performance degradation of the resulting Coil Module chip card is currently tolerated.

[0009] To achieve high-performance coil module products, the fluctuation amplitude of the resonant frequency of the gain antenna should be as small as possible. Currently, the accuracy of the embedding method can only be improved by reducing the speed of the embedding method, but this increases manufacturing costs. Summary of the Invention

[0010] In various embodiments, a method is provided that involves tuning a manufactured antenna using additional processes via post-processing. This enables the achievement of a target resonant frequency or at least a reduction in the fluctuation range.

[0011] In different embodiments, the gain antenna can be designed such that it has a predetermined area for tuning.

[0012] Furthermore, in different embodiments, a measurement unit may be provided, which is capable of determining the resonant frequency of the antenna.

[0013] Furthermore, in various embodiments, devices can be provided configured to change the resonant frequency of an antenna by means of a processing procedure (e.g., cutting / grinding / stamping). The processing procedure, such as stamping, can be performed in a predetermined area of ​​the antenna in various embodiments.

[0014] In different embodiments, the antenna can be mounted on or within the carrier. The carrier can also be cut, for example, punched, in addition to the antenna, through a manufacturing process. In different embodiments, the punched portion can remain within the carrier. Here, the arrangement of the punched portion within the carrier can be altered such that the conductive connection of the antenna remains interrupted through a through-hole filled with the punched portion. For example, the punched portion can be twisted in the carrier plane or tilted about, for example, an axis inclined or perpendicular to the antenna in the carrier plane.

[0015] In different embodiments, the punched portion may be removed and the formed through-hole filled with, for example, a non-conductive material, wherein it must be ensured that the antenna remains interrupted at the filled through-hole.

[0016] By filling the through opening, for example by filling the through opening with a part of the same shape, it can be ensured that: the carrier is not structurally weakened despite the antenna being interrupted, and / or the surface of the chip card formed by the antenna structure has a smooth (i.e. non-planar) surface.

[0017] In various embodiments, a method for manufacturing an antenna structure is provided. This method may include: applying an antenna to a carrier; punching a portion of the carrier along with a portion of the antenna, such that the antenna is interrupted to set the resonant frequency of the antenna; and inserting an element of the same shape as the punched portion of the carrier into a through-hole formed in the carrier by punching, wherein the antenna remains electrically interrupted.

[0018] In different embodiments, the capacitance of the antenna can be reduced by punching.

[0019] In different embodiments, the antenna can have an inductive region and a capacitive region, wherein this portion of the antenna can be punched out in the capacitive region of the antenna.

[0020] In different embodiments, the resonant frequency can be increased by punching.

[0021] In different embodiments, the method may further include, prior to punching, measuring the resonant frequency of the antenna, wherein the resonant frequency of the antenna is set taking into account the measured resonant frequency.

[0022] In different embodiments, the method may further include: determining the position on the carrier based on the measured resonant frequency, and punching out the portion of the carrier at the position that includes the portion with the antenna.

[0023] In different embodiments, elements of the same shape, except for the antenna, may have the same material and / or the same layer sequence as the punched portion.

[0024] In different embodiments, elements of the same shape may also have antennas.

[0025] In different embodiments, elements of the same shape may be arranged in a twisted and / or tilted manner in the carrier to ensure electrical interruption of the antenna.

[0026] In different embodiments, the insertion of elements of the same shape may have: a punched portion of the insertion carrier.

[0027] In different embodiments, the method may also include rotating the punched portion of the carrier about an axis that is perpendicular to or lies within the main plane of the punched portion of the carrier.

[0028] In different embodiments, elements of the same shape may be taken from another carrier separate from the carrier.

[0029] In different embodiments, applying the antenna to the carrier involves: applying an antenna wire.

[0030] In different embodiments, the antenna conductor can have an antenna circular conductor.

[0031] In different embodiments, applying antenna wires may involve: laying out antenna wires.

[0032] In different embodiments, applying the antenna wire to the carrier can involve embedding the antenna wire into the carrier.

[0033] In different embodiments, the antenna can be embedded in the carrier by means of an ultrasonic welding electrode.

[0034] In different embodiments, the method may also include: after inserting elements of the same shape, fixing the elements of the same shape in the carrier.

[0035] In different embodiments, the measurement of the resonant frequency can also be performed after punching or continuously.

[0036] In various embodiments, an antenna structure is provided. This antenna structure may include: a carrier; an antenna on the carrier; a through-hole that passes through a portion of the carrier and includes a portion of the antenna, causing the antenna to be interrupted to set the resonant frequency of the antenna; and an element introduced into and filling the through-hole, wherein the antenna is electrically interrupted by means of the element.

[0037] In different embodiments, the antenna may be a wire antenna.

[0038] In different embodiments, the wire antenna may have a round wire.

[0039] In different embodiments, the carrier may have polyethylene terephthalate and / or polyimide.

[0040] In different embodiments, the antenna may have two ends, and the segments of the antenna adjacent to the ends may be arranged side by side to form a capacitive region.

[0041] In different embodiments, the segment adjacent to the end that forms the capacitor region may have a tortuous structure.

[0042] In different embodiments, the antenna capacitance can be reduced by interrupting the antenna.

[0043] In different embodiments, the antenna may also have an inductive region, wherein an interrupt may be provided in the capacitive region of the antenna.

[0044] In different embodiments, the resonant frequency can be increased by means of an interruption.

[0045] In different embodiments, elements of the same shape—except for antennas—may have the same material and / or the same layer sequence as the punched portion.

[0046] In different embodiments, elements of the same shape may also have antennas.

[0047] In different embodiments, elements of the same shape may be arranged in a twisted and / or tilted manner in the carrier to ensure electrical interruption of the antenna.

[0048] In different embodiments, elements of the same shape may have a punched portion of the carrier.

[0049] In different embodiments, the punched portion of the carrier may be rotatably disposed in the through opening about an axis that is perpendicular to or within the main plane of the punched portion of the carrier.

[0050] In different embodiments, elements of the same shape may be taken from another carrier separate from the carrier.

[0051] In different embodiments, the wire antenna can be embedded in the carrier.

[0052] In different embodiments, elements of the same shape can be fixed in the carrier.

[0053] In different embodiments, a gain antenna is provided having an antenna structure according to one of the different embodiments.

[0054] In different embodiments, the gain antenna may have at least one inductively coupled region.

[0055] In various embodiments, a chip card is provided. The chip card may have an antenna structure and a chip according to one of the various embodiments, wherein the antenna forms the gain antenna of the chip card.

[0056] In various embodiments, an apparatus for forming an antenna structure is provided. The apparatus may include: an application device for applying an antenna to a carrier; a stamping device for stamping a portion of the carrier with a portion of the antenna, such that the antenna is interrupted to set the resonant frequency of the antenna; and a filling device for inserting an element of the same shape as the stamped portion of the carrier into a through opening formed in the carrier by stamping, wherein the antenna remains electrically interrupted.

[0057] In different embodiments, the application device may have an ultrasonic welding electrode.

[0058] In different embodiments, the filling device may be configured to rotate the portion of the carrier after punching and position it in the through opening.

[0059] In different embodiments, rotation can be performed within the main plane of this portion of the carrier.

[0060] In different embodiments, the punching device may be configured to retain two opposing connecting regions during punching, wherein the filling device may be configured to rotate the portion of the carrier during filling, such that the connecting regions serve as axes of rotation.

[0061] In different embodiments, the filling device may include a 3D printer.

[0062] In different embodiments, the filling equipment may be integrated with the stamping equipment as a unit.

[0063] In different embodiments, the device may also have a measuring apparatus for measuring the resonant frequency, wherein the resonant frequency of the antenna is set in consideration of the measured resonant frequency.

[0064] In different embodiments, the measuring device may be configured to transmit a Dirac pulse in order to measure the resonant frequency and detect the pulse response thereby generated by means of the antenna.

[0065] In different embodiments, the measuring device may be configured to repeatedly or continuously detect the resonant frequency. Attached Figure Description

[0066] Embodiments of the invention are shown in the accompanying drawings and are described in detail below.

[0067] The attached diagram shows

[0068] Figure 1AThe image shows two disassembled chip cards, each containing a gain antenna and a chip module (CoM).

[0069] Figure 1B A schematic top view of a conventional gain antenna is shown;

[0070] Figure 1C A schematic diagram of a gain antenna is shown, which is coupled to the readout device and the chip module (CoM) without contact.

[0071] Figure 2A A schematic top view of an antenna structure according to different embodiments is shown;

[0072] Figure 2B A schematic diagram of a carrier according to different embodiments is shown, wherein a portion of the carrier with a portion of the antenna is punched out, and it is illustrated that the punched portion of the carrier is inserted into a through opening formed in the carrier by punching, such that the antenna remains electrically disconnected.

[0073] Figure 2C The photographic details of a carrier according to different embodiments are shown, wherein a portion of the carrier with a portion of the antenna is punched out and the punched portion of the carrier is disposed in a through opening formed in the carrier by punching, such that the antenna remains electrically disconnected.

[0074] Figure 2D A schematic diagram of a carrier according to different embodiments is shown, wherein a portion of the punched carrier has a portion of an antenna, and the diagram illustrates inserting the punched portion of the carrier into a through opening formed in the carrier by punching, such that the antenna remains electrically disconnected.

[0075] Figure 2E The photographic details of a carrier according to different embodiments are shown, wherein a portion of the carrier with a portion of the antenna is punched out and the punched portion of the carrier is disposed in a through opening formed in the carrier by punching, such that the antenna remains electrically disconnected.

[0076] Figure 3A , 3B 3C and 3C respectively show schematic top views of the antenna structure to form an antenna structure according to different embodiments;

[0077] Figure 4A Photographic details and schematic side views of a carrier according to different embodiments are shown, wherein a portion of the carrier with an antenna portion is punched out;

[0078] Figure 4B Show Figure 4APhotograph details and schematic diagrams of the carrier portion thereof, wherein the schematic diagram illustrates that the through-hole formed by punching is filled so that the antenna remains electrically disconnected;

[0079] Figure 5 A schematic top view of a chip card according to different embodiments is shown;

[0080] Figure 6 A schematic diagram of an apparatus for forming an antenna structure according to different embodiments is shown;

[0081] Figure 7 A photographic image of a measuring device used to determine the resonant frequency of an antenna structure is shown. This measuring device is used in an apparatus for forming an antenna structure according to different embodiments.

[0082] Figure 8 A flowchart is shown for a method of forming an antenna structure according to different embodiments; and

[0083] Figure 9 A flowchart is shown for a method of forming an antenna structure according to different embodiments. Detailed Implementation

[0084] The following detailed description refers to the accompanying drawings, which form part of the description and illustrate specific embodiments in which the invention can be carried out. In this regard, directional terms such as “up,” “down,” “front,” “rear,” “front,” “rear,” etc., are used in relation to the orientation of the described one or more drawings. Since components of the embodiments can be positioned in multiple different orientations, the directional terms are used for illustration and are not intended to be limiting. It should be understood that other embodiments can be used and structural or logical changes can be made without departing from the scope of the invention. It should be understood that, unless otherwise specifically stated, features of the different exemplary embodiments described herein can be combined with each other. Therefore, the following detailed description should not be construed as limiting, and the scope of the invention is defined by the appended claims.

[0085] Similar parts, devices, apparatuses, etc. (e.g., those with similar or identical functions) are given the same reference numerals and are distinguished from each other by means of a lower letter where necessary.

[0086] Within the scope of this specification, the terms "connection," "link," and "coupled" are used to describe direct and indirect connections, direct or indirect links, and direct or indirect couplings. In the accompanying drawings, identical or similar elements are given the same reference numerals wherever appropriate.

[0087] Figure 2AA schematic top view of antenna structures 200, 200a according to different embodiments is shown.

[0088] The antenna structure 200 may have a carrier 106 and an antenna 102, wherein the antenna is disposed on the carrier 106.

[0089] In different embodiments, the carrier may have polyethylene terephthalate (PET) and / or polyimide (PI), and / or other materials commonly used as carriers for antenna structures.

[0090] Antenna 102 can be similar to Figure 1B and Figure 1C The antenna 102 is configured as a series resonant circuit, which includes: a pickup coil inductor 102Ls1 for coupling to an external reading device; a coupling coil inductor 102Ls2 for coupling to a module antenna of a chip module (not shown); a resistor 102Rs (which is generated by a wire, such as a copper wire); and a series capacitor 102Cs.

[0091] In different embodiments, antenna 102 may have a wire antenna, which may, for example, have a round wire. Antenna 102 may be formed on (or partially embedded in) carrier 106 by means of a deployment tool, such as by means of an ultrasonic welding electrode, as described above for conventional antennas.

[0092] In different embodiments, the carrier 106 may have a through-hole 106D at one location in position 220, forming a portion 102A of the antenna 102 on the carrier, thus interrupting the antenna 102. This allows the resonant frequency of the antenna 102 to be set. In other words, the original resonant frequency of the antenna 102 after its configuration can be changed by forming the through-hole 106D through the carrier 106 and the antenna 102, for example, by increasing the original resonant frequency or by raising the original resonant frequency to reach a target resonant frequency. As long as a deviation from the target resonant frequency exists after forming the through-hole 106D, the statistical deviation can be reduced relative to the conventional manufacturing process for the antenna structure 200 described above.

[0093] The through opening 106D can be formed, for example, by punching, such as by using a punch. Alternatively, the through opening can be formed by cutting (e.g., by using a laser), by grinding, or by other known methods, and the through opening can be positioned with similar precision to a punching or cutting tool.

[0094] In different embodiments, the resonant frequency of the antenna 102 can be determined before the through opening 106D is formed.

[0095] A variety of different methods can be used to measure the resonant frequency of antenna structure 102, such as network analyzers, other antennas, etc.

[0096] In different embodiments, the impulse response in the case of utilizing the Dirac pulse can be used as the most effective measurement method.

[0097] Figure 7 A photograph of a measuring device 700 for determining the resonant frequency of antenna structure 102 is shown, also referred to as a Dirac test system. The measuring device 700 may have a measuring component 770 and a display device 772, the measuring component being configured to interact with antenna structure 102, and the display device being used to provide the measurement results. A more detailed description of the Dirac test system follows. Figure 7 A more detailed description is provided in the following section.

[0098] The Dirac test system provides a very fast method for determining resonant frequencies. This means that its application in antenna structure manufacturing is advantageous, especially in cases where, according to different embodiments, such as for embedding in a chip card, the gain antenna is manufactured as an insert with a coil-shaped antenna structure disposed thereon, the antenna structure being used for inductive coupling.

[0099] Subsequently, taking into account the measured resonant frequency, a final resonant frequency setting for antenna 102 can be performed. For example, given the current resonant frequency of the antenna, it is possible to determine, for example, based on previously performed laboratory experiments and / or model calculations, where the through-hole can be located (e.g., how much antenna 102 should be shortened), so that the resonant frequency can be shifted from the measured resonant frequency to the target resonant frequency as desired. In different embodiments, markers can be placed on the carrier, indicating the positions for the predetermined shift of the resonant frequency.

[0100] In different embodiments, the method may also include: determining the position on the carrier based on the measured resonant frequency, at which the portion of the carrier with the antenna is punched out, for example by means of marking, as the measured distance from the end of the antenna, or by means of other methods.

[0101] Antenna 102 may have two ends, and the segments of the antenna adjacent to the ends may be arranged side by side to form a capacitance region 102Cs. At least a portion of the capacitance region 102Cs may be configured to form a through opening 106D therein (and thereby tune the antenna 102 to the resonant frequency). This portion of the antenna 102, also referred to as a matching component, matching region, tuning component, or tuning region, is indicated by 102A in these figures.

[0102] Furthermore, antenna 102 may also have an inductive region, such as the pickup coil inductor 102Ls1 described above for coupling to an external reading device and the coupling coil inductor 102Ls2 for coupling to a module antenna of a chip module, wherein an interrupt can be set in the inductive region 102Cs of antenna 102. Therefore, antenna structure 200 can be used as a gain antenna, for example, for use in a chip card as described above.

[0103] In this case, the capacitance of antenna 102 can be reduced by interrupting the antenna 102, thereby increasing the resonant frequency by means of the interruption.

[0104] In different embodiments, such as when antenna structure 102 is part of an inlay with an embedded gain antenna, but also in the general case of the antenna structure described above, punching may be a preferred method for creating the through-hole 106D, because punching ensures that the cut wire ends are no longer electrically connected to each other after the inlay is inserted (e.g., laminated) into the chip card. Furthermore, punching the opening avoids or reduces contamination of the inlay surface compared to laser drilling (which causes deposition on the inlay) or laser cutting.

[0105] Furthermore, stamping can be the most cost-effective manufacturing method for cutting Cu wires up to approximately 150 μm thick, such as approximately 120 μm thick, or even approximately 112 μm thick.

[0106] This means that the method can be well implemented and of high quality by means of punching.

[0107] In different embodiments, such as in Figure 3B and Figure 3C As shown, the section adjacent to the end that forms the capacitor region, such as matching region 102A, can have a tortuous structure. This allows for a large and fine frequency matching range to be achieved in a small surface area, because a small change in the position of the tool used to form the through opening enables not only fine tuning of the resonant frequency (simply by changing the position along the tortuous structure) but also a large change in the resonant frequency when the position changes laterally to the tortuous structure.

[0108] In different embodiments, manufacturing tolerances of the (gain) antenna can be significantly mitigated by post-tuning the antenna 102 after it has been placed (e.g., rested) on the carrier 106. This means that inexpensive, such as conventional production lines, can be used and the post-tuning process can be performed only subsequently.

[0109] Furthermore, the influence of the carrier material (e.g., PET or PI) on the resonant frequency is neglected in the first approximation because it can be compensated for in subsequent tuning.

[0110] The antenna structure 200 may also have an element 222 introduced into the through opening 106D and filling the through opening, wherein the antenna 102 maintains electrical interruption by means of the element 222. The filling element 222 may be formed in the same shape as the punched part 106A, such that the carrier 106 no longer has an opening 106D at the location where the through opening 106D has been formed, which would structurally weaken and / or impair the flatness of the chip card surface.

[0111] In different embodiments, the element 222 with the same shape—other than the antenna 102—may have the same material and / or the same layer sequence as the punched portion 106A.

[0112] In different embodiments, elements of the same shape may also have an antenna, more specifically, a portion 102D of antenna 102.

[0113] In different embodiments, elements 222 of the same shape may be arranged in the carrier 106 in a twisted and / or tilted manner to ensure electrical interruption of the antenna 102.

[0114] The identical element 222 may have a punched portion 106A of the carrier 106, or for example, a punched portion that was punched from another carrier that is separate from the carrier 106, for example, with the same or similar or different structures.

[0115] For example, when elements 222 of the same shape have a punched portion 106A or a portion of the same or similar structure (including antenna component 102D), the punched portion 106A of the carrier 106 can be disposed in the through opening 106D to ensure that the antenna 102 remains uninterrupted. For example, elements of the same shape can be rotatably disposed in the through opening 106D about an axis perpendicular to or within the main plane of the punched portion 106A of the carrier 106.

[0116] exist Figure 2B This arrangement is illustrated using a schematic diagram. Here, the punched portion 106A of the carrier 106 is twistedly positioned in the carrier plane (i.e., around an axis perpendicular to the main plane of the punched portion) into the through opening 106D formed in the carrier 106 by punching, thus maintaining electrical interruption of the antenna. The direction of rotation is... Figure 2B The arrows indicate this. Here, the rotation angle is chosen to be large enough (for example, approximately 90°) to ensure the interruption of antenna 102.

[0117] To achieve this arrangement, portion 106A can first be punched out from carrier 106. Subsequently, the punched portion 106A can be rotated (e.g., rotated 90° within the plane of the punched portion 106A) and twistedly inserted into the formed through opening 106D. Subsequently, portion 106D can be secured to carrier 106, for example by means of heat or ultrasound.

[0118] Figure 2C A detailed photograph of the carrier is shown, in which the punched portion 106A is as shown in... Figure 2B Set it up as illustrated in the diagram.

[0119] exist Figure 2D Another arrangement of the above-described arrangement is illustrated with the aid of a schematic diagram. Here, the punched portion 106A of the carrier 106 is twisted about an axis 224 located in the plane of the carrier and positioned into a through opening 106D formed by punching in the carrier 106, so that the antenna 102 remains electrically disconnected. The direction of rotation is... Figure 2D The arrows indicate this. The orientation of axis 224 is chosen here to be, for example, an acute angle with respect to antenna 102, such that the antenna 102 is interrupted after twisting about axis 224.

[0120] In order to achieve Figure 2D In the arrangement, portion 106A can first be punched from the carrier 106, for example, by means of a punch, wherein the cut portion used for punching does not form a complete ring, nor is it formed at two opposing parts of the ring. Subsequently, the punched portion 106A can be rotated 180°, so that the rotated portion 106A remains in the through opening 106D. Subsequently, portion 106D can be fixed to the carrier 106, for example, by means of heat and ultrasound.

[0121] Figure 2E A detailed photograph of the carrier is shown, in which the punched portion 106A is as shown in... Figure 2D Set it up as illustrated in the diagram.

[0122] In different embodiments, the device configured to form the through opening, also referred to as a blanking device or a stamping device, can also be configured to retain two opposing (e.g., located on the rotation axis 224) connecting regions during blanking (or cutting or grinding), wherein the filling device provided for embedding elements 222 of the same shape into the through opening can be configured to rotate the portion of the carrier 106A during filling, such that the connecting regions serve as the rotation axis 224.

[0123] In different embodiments, the element 222 of the same shape can be fixed in the carrier 106, for example by providing an adhesive at the contact surface between the element 222 and the carrier 106, or by means of heating to weld or be welded.

[0124] Figure 3A , 3B Figures 3 and 3C respectively show schematic top views of antenna structure 102 to constitute antenna structure 102 according to different embodiments.

[0125] exist Figure 3A , 3B Antenna structure 102 before tuning by means of forming through opening 106D and filling through opening is shown in 3C.

[0126] Each antenna structure 102 has a tuning region 102A, which is configured to form a through opening 106D.

[0127] exist Figure 3A In the antenna structure 200b, the tuning region 102A is formed in the central region of the carrier 106 and has only a straight-extending capacitor section of the antenna 102.

[0128] exist Figure 3B In the antenna structure 200c, the tuning region is configured as a tortuous structure in the central region of the carrier 106.

[0129] exist Figure 3C In the antenna structure 200d, the tuning region 102A is configured as a tortuous structure in the edge region of the carrier 106.

[0130] In different embodiments, instead of using a prefabricated portion 222 of the same shape, the portion 222 of the same shape can be formed during filling of the through opening 106D, for example by means of 3D printing or other known methods.

[0131] To fill the through opening 106D, an electrically insulating material can be used to ensure that the antenna 102 remains interrupted at the through opening 106D.

[0132] This filling method is in Figure 4A and Figure 4B Explanation with Chinese diagrams.

[0133] Figure 4A Photograph detail 401a and schematic side view 401b of a carrier 106 according to different embodiments are shown, wherein a portion of the carrier with a portion of the antenna 102 is punched out to form a through opening 106D and thus the antenna 102 is interrupted in the tuning region 102A.

[0134] Figure 4B Show Figure 4A Photograph detail 402a and schematic side view 402b of this part of the carrier, wherein the schematic diagram illustrates that the through opening 106D formed by punching is filled with filler material so that the antenna 102 remains electrically disconnected.

[0135] In different embodiments, the filler material may have the same material as the carrier 106. Alternatively or additionally, the filler material may have another electrically insulating material.

[0136] Figure 5 A schematic top view of a chip card 500 according to different embodiments is shown.

[0137] The chip card 500 may have one of the antenna structures 102 described above. Furthermore, the chip card 500 may have a chip module 104, which, as described above, can be configured as a CoM module 104 and can be coupled to the inductive coupling region 102Ls2.

[0138] Figure 6 A schematic diagram of an apparatus 600 for forming an antenna structure according to different embodiments is shown, for example, as incorporated above. Figures 2A to 2E 3A to 3C, 4A and 4B and Figure 5 As described.

[0139] The apparatus 600 may have an application device 660 for applying the antenna to a carrier. As described above, the application device 660 may be, for example, an ultrasonic welding electrode, which may be configured to embed a wire, such as a round wire or a copper round wire, into the carrier, for example, by using ultrasonic waves. The antenna can be deployed in the carrier by means of progressive embedding.

[0140] Furthermore, the device 600 may include a stamping device 662, such as a punch, for punching a portion of the carrier containing a portion of the antenna, thereby interrupting the antenna to set its resonant frequency. The stamping device 662 may be configured such that it can be positioned at least within a tuning region (see above description) for tuning the antenna, for example, it may be arbitrarily positioned within that region.

[0141] The device 600 may also have a filling device for inserting an element of the same shape as the punched portion of the carrier into a through opening formed in the carrier by punching, wherein the antenna remains electrically disconnected.

[0142] In different embodiments, the filling device 664 may be configured to: rotate the portion of the carrier after punching and position it in the through opening, for example, as described above. Figure 2B and2C (There, rotation occurs within the main plane of that part of the carrier) or Figure 2D and Figure 2E As described (rotating there about the axis located within the main plane of that part of the carrier).

[0143] In different embodiments, such as combining Figure 2D and 2E As described, the stamping equipment can be configured to retain two opposing connecting regions during blanking, wherein the filling device 664 can be configured to rotate said portion of the carrier during filling, such that said connecting regions serve as axes of rotation.

[0144] In different embodiments, such as when the portion to be punched is itself used to fill a through opening, the filling device can be integrated with the stamping device. The stamping filling device may, for example, have a punch configured to: punch the portion and receive it in the punch, rotate the punch with the punched portion, and subsequently position the punched portion in the through opening.

[0145] In different embodiments, such as in combination Figure 4A and 4B As described, the filling equipment can include a 3D printer.

[0146] In different embodiments, the device may also include a measuring device for measuring the resonant frequency (in... Figure 6 Not shown, but see exemplary embodiments. Figure 7 The resonant frequency of the antenna is set taking into account the measured resonant frequency.

[0147] In different embodiments, the measuring device may be configured to emit a Dirac pulse to measure the resonant frequency and detect the pulse response thereby generated by means of an antenna.

[0148] Figure 7 As described above, a photographic image of a measuring device is shown below. This measuring device is used to determine the resonant frequency of an antenna structure used in an apparatus for forming an antenna structure according to different embodiments.

[0149] An exemplary embodiment is shown of a conventional, so-called Dirac test system, which performs the following: measuring the resonant frequency F of an antenna structure. res And quality Q (the antenna structure may be, for example, part of a chip card).

[0150] The Dirac Test System 700 can be configured to measure products that are not yet fully manufactured, such as carriers with antennas, for integration, for example, lamination into a chip card.

[0151] In different embodiments, the Dirac test system 700 can be configured to measure the antenna structure by transmitting Dirac test pulses through the Dirac test system and detecting the electromagnetic oscillation response of the antenna by means of its receiving antenna.

[0152] Resonant frequency F res The so-called Q-type (Q) can be calculated using an algorithm that performs a least-squares fit or a fast Fourier transform (FFT), where the Q-type is a measure of the antenna's resonant quality.

[0153] In different embodiments, the Dirac test system 700 can be configured to: test the resonant frequency F res Measurements were performed on antenna structures with a sum between 2 and 40 in the 10MHz to 70MHz range.

[0154] The measurement process in the Dirac Test System 700 is faster and more accurate compared to that in a network analyzer and / or an impedance analyzer.

[0155] In different embodiments, the measuring device may be configured to repeatedly or continuously detect resonant frequencies, for example, when the measuring device is part of a production line and is capable of measuring the resonant frequencies of multiple antenna structures to be manufactured sequentially, and / or, once again or continuously, determine the resonant frequencies achieved by creating a through-hole and optionally by re-installing another through-hole or widening a previously formed through-hole.

[0156] Figure 8 A flowchart is shown for a method 800 for forming an antenna structure according to different embodiments.

[0157] Method 800 may include: applying an antenna to a carrier (in 810); punching a portion of the carrier with a portion of the antenna, such that the antenna is interrupted to set the resonant frequency of the antenna (in 820); and inserting an element of the same shape as the punched portion of the carrier into a through opening formed in the carrier by punching, wherein the antenna remains electrically interrupted (in 830).

[0158] Figure 9 A flowchart is shown for a method 900 for forming an antenna structure according to different embodiments.

[0159] Method 900 may include: manufacturing a gain antenna (gain antenna film) (in 910); measuring the value of the gain antenna (resonant frequency F). res(in 920); and adjusting the resonant frequency of the antenna by means of stamping, grinding or cutting (in 930).

[0160] Method 900 may also include: inserting an element of the same shape as the element removed by means of stamping, grinding or cutting into a through opening formed in a carrier by punching, wherein the antenna remains electrically interrupted (not shown).

[0161] Other advantageous design options for this method are derived from the description of the device, and vice versa.

Claims

1. A method for manufacturing an antenna structure, • Apply the antenna to the carrier; • A portion of the carrier is punched along with a portion of the antenna, causing the antenna to be interrupted, in order to set the resonant frequency of the antenna; • An element with the same shape as the punched portion of the carrier is inserted into the through opening, which is formed in the carrier by punching, wherein the antenna remains electrically disconnected. • The antenna described herein has an inductive region and a capacitive region; and • Wherein, the portion of the antenna is punched out in the capacitance region of the antenna. The element with the same shape also includes a portion of the antenna. The identically shaped elements are disposed in the carrier in a twisted and / or tilted manner, thereby ensuring electrical interruption of the antenna in the carrier.

2. The method of claim 1, wherein the capacitance of the antenna is reduced by punching.

3. The method according to claim 1 or 2, wherein the resonant frequency is increased by means of punching.

4. The method according to claim 1 or 2, further comprising: • Measure the resonant frequency of the antenna before punching; • The resonant frequency of the antenna is set taking into account the measured resonant frequency.

5. The method according to claim 1 or 2, The elements of the same shape, except for the antenna, have the same material and / or the same layer sequence as the punched portion.

6. The method according to claim 1 or 2, The insertion of the elements of the same shape includes: The punched portion is inserted into the carrier.

7. The method according to claim 1 or 2, The identically shaped elements are taken from another carrier that is separate from the carrier.

8. The method according to claim 1 or 2, Applying the antenna to the carrier includes: Apply antenna wires.

9. The method according to claim 8, The antenna conductor described therein has an antenna circular conductor.

10. The method according to claim 8, Applying the antenna wire to the carrier includes: The antenna wire is embedded into the carrier.

11. The method according to claim 1 or 2, further comprising: After inserting the element of the same shape, fix the element of the same shape in the carrier.

12. The method according to claim 4, Furthermore, the resonant frequency is measured either after the punching process or continuously.

13. An antenna structure having: • Carrier; • The antenna on the carrier; • A through-hole that passes through a portion of the carrier and carries a portion of the antenna, thereby interrupting the antenna to set the resonant frequency of the antenna, wherein the through-hole is formed in the carrier by punching; • An element of the same shape as the punched portion of the carrier, introduced into and filling the through-opening, wherein the antenna maintains electrical interruption by means of the element. • The antenna described herein has an inductive region and a capacitive region; and • The interrupt is provided in the capacitor region of the antenna. The element with the same shape also includes a portion of the antenna. The identically shaped elements are disposed in the carrier in a twisted and / or tilted manner, thereby ensuring electrical interruption of the antenna in the carrier.

14. The antenna structure according to claim 13, wherein the antenna has a wire antenna.

15. The antenna structure according to claim 14, wherein the wire antenna has a circular wire.

16. The antenna structure according to any one of claims 13 to 15, wherein the elements of the same shape, except for the antenna, have the same material and / or the same layer sequence as the punched portion.

17. The antenna structure according to claim 16, wherein the element of the same shape further comprises the antenna.

18. The antenna structure according to any one of claims 13 to 15, wherein the identically shaped elements have a punched portion of the carrier.

19. The antenna structure according to any one of claims 13 to 15, wherein the identically shaped element is taken from another carrier separate from the carrier.

20. The antenna structure according to claim 14 or 15, wherein the wire antenna is embedded in the carrier.

21. The antenna structure according to any one of claims 13 to 15, wherein the identically shaped elements are fixed in the carrier.

22. A gain antenna having an antenna structure according to any one of claims 13 to 21.

23. The gain antenna of claim 22, wherein the gain antenna has at least one inductively coupled region.

24. A chip card, comprising: • The antenna structure according to any one of claims 13 to 21; and · chip, • The antenna thereon forms the gain antenna of the chip card.

25. An apparatus for forming an antenna structure according to any one of claims 13 to 21, the apparatus comprising: • An application device used to apply an antenna onto a carrier; • A stamping device for stamping a portion of the carrier with a portion of the antenna, thereby interrupting the antenna to set the resonant frequency of the antenna; • A filling device for inserting an element of the same shape as the punched portion of the carrier into a through opening formed in the carrier by punching, wherein the antenna is kept electrically disconnected. The element with the same shape also includes a portion of the antenna. The identically shaped elements are disposed in the carrier in a twisted and / or tilted manner, thereby ensuring electrical interruption of the antenna in the carrier.

26. The apparatus according to claim 25, • The stamping equipment is configured to retain two opposing connecting areas during stamping, and • The filling device is configured to rotate the punched portion of the carrier during filling, such that the connecting area serves as a rotation axis.

27. The apparatus of claim 25, wherein the filling device comprises a 3D printer.

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