A LED filament lamp with high thermal conductivity

Abstract

The present invention discloses an LED filament lamp with high thermal conductivity, which comprises a lamp holder seat, a power board, a connecting piece, a hollow heat sink, a plurality of filament light source boards, a heat sink fixing seat and a lampshade; the bottom end of the lampshade is connected to the lamp holder seat; a concave circular hole is provided at the top of the lampshade; a heat sink fixing seat is provided in the concave circular hole; the heat sink fixing seat is connected to the top end of the hollow heat sink; a plurality of long strip card slots arranged in a ring matrix are provided on the outer wall of the hollow heat sink; a filament light source board is provided in the long strip card slot; an outward arc-shaped protrusion is provided between two adjacent long strip card slots; the bottom end of the hollow heat sink is sleeved in the connecting piece; the connecting piece is provided above the power board; the power board is provided in the lamp holder seat; the heat transfer of the present invention is more intuitive and convenient, and the high thermal conductivity of the LED filament lamp is truly realized, while the heat damage and light decay of the LED chip caused by untimely heat dissipation are also solved, the reduction of luminous flux is avoided, and the service life of the filament lamp is also prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, and in particular to an LED filament lamp with high thermal conductivity. Background Art

[0002] In recent years, LED filaments have been widely used in filament lamps because of their 360° full-angle light emission. Existing LED filaments are formed by encapsulating a group of LED chips on a transparent substrate, and then connecting multiple filaments to form a light-emitting effect similar to that of tungsten filament lamps. At present, LED filaments basically have no heat sink, and LED filaments cannot conduct heat dissipation, so it is difficult to conduct away the heat generated by the LED chip. The heat can only be conducted and dissipated by radiation and internal gas convection, which easily causes heat accumulation and shortens the life of the LED filament.

[0003] Existing LED filament lamps are usually manufactured by filling with heat-conducting gas and sealing with glass. This process has high technical requirements for the sealing of the bulb and is expensive. It is easy to cause problems such as the bulb not being tightly sealed, explosion, and fragile glass bulb. Long-term use will inevitably lead to leakage problems, which will reduce the heat dissipation capacity and even burn the LED filament. In addition, the heat dissipation performance of the gas is limited and can only meet the development of low-power LED filament lamps. Once the power is increased, the heat generated by the LED filament cannot be dissipated in time, which is easy to cause thermal damage and light decay of the LED chip, resulting in low light flux maintenance rate and short life of the whole lamp. Summary of the invention

[0004] The purpose of the present invention is to provide an LED filament lamp with high thermal conductivity, simple structure, reasonable design and convenient use, in view of the defects and shortcomings of the prior art.

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the present invention is as follows: it comprises a lamp holder, a power board, a connecting piece, a hollow heat dissipation column, a plurality of filament light source boards, a heat dissipation fixing seat, and a lampshade; the bottom end of the lampshade is connected to the lamp holder; the power board, the connecting piece, the hollow heat dissipation column, a plurality of filament light source boards, and the heat dissipation fixing seat are all arranged in the space formed by the lamp holder and the lampshade; a concave circular hole is provided at the top of the lampshade; a heat dissipation fixing seat is provided in the concave circular hole; the heat dissipation fixing seat is connected to the top of the hollow heat dissipation column; a plurality of long strip card slots arranged in a ring matrix are provided on the outer wall of the hollow heat dissipation column; a filament light source board is provided in the long strip card slot; an outward arc-shaped protrusion is provided between two adjacent long strip card slots; the bottom end of the hollow heat dissipation column is sleeved in the connecting piece; the connecting piece is provided above the power board; the power board is provided in the lamp holder;

[0006] Preferably, the filament light source board is provided with a substrate; the substrate is a rectangular substrate; the substrate is made of a ceramic plate or a superconducting aluminum substrate; the outer surface of the substrate is provided with an LED chip encapsulation area, a circuit area and a solder resist pad in sequence; the circuit area is provided with a circuit layer; the solder resist pad is electrically connected to the circuit layer; the LED chip encapsulation area is provided with an LED chip, a bonding wire, and a fluorescent glue; the LED chip is electrically connected to the circuit layer through the bonding wire; the fluorescent glue completely covers the LED chip and the bonding wire;

[0007] Preferably, the connector is a cylindrical connector; a mounting through hole is provided in the middle of the connector and is matched with the bottom end of the hollow heat dissipation column; a small card slot corresponding to the long card slot and used to assemble the filament light source board is provided on the inner wall of the mounting through hole; a retractable metal contact end is provided on the side wall of the small card slot; the retractable metal contact end is electrically connected to the power board through a wire;

[0008] Preferably, the hollow heat dissipation column is a hollow truncated cone structure; the material of the hollow heat dissipation column is aluminum or a heat-conducting insulating plastic material; the outer surface of the arc-shaped protrusion on the outer wall of the hollow heat dissipation column is wrapped with a thin film layer by electroplating, spraying or sputtering;

[0009] Preferably, the lampshade is a transparent or translucent hemispherical bulb shell structure; the lampshade is made of plastic or glass;

[0010] Preferably, the heat dissipation fixing seat is a transparent or translucent convex cylindrical structure; a plurality of heat dissipation holes are provided on the top and lower peripheral walls of the heat dissipation fixing seat.

[0011] After adopting the above structure, the LED filament lamp with high thermal conductivity described in the present invention has the following advantages:

[0012] 1. The single-sided filament light source board is assembled through the long slot on the hollow heat dissipation column, and then the combination of the two is assembled on the connector. At the same time, the solder resist pad of the filament light source board is connected to the metal contact end in the connector. The structure is simple and easy to operate, and no welding or gluing is required;

[0013] 2. The lampshade can be directly assembled with the hollow heat dissipation column through the heat dissipation fixing seat and then assembled with the lamp holder seat without sealing the bubble;

[0014] 3. Although the filament light source board uses 180° single-sided light emission, after it is assembled to the peripheral wall of the hollow heat dissipation column, the light emitted will form a 360° light emission effect after diffuse reflection and refraction by the protrusions on the surface of the hollow heat dissipation column;

[0015] 4. The hollow heat dissipation column is arranged as a hollow truncated cone structure, and the top of the hollow heat dissipation column and the top of the lampshade are matched with a heat dissipation fixing seat. A part of the heat generated by the single-sided light emission of the substrate passes through the hollow area of ​​the heat dissipation column and is transferred to the outside of the lampshade through the heat dissipation holes at the top of the heat dissipation fixing seat, and another part of the heat accumulated in the lampshade is directly transferred to the outside of the lampshade through the heat dissipation holes at the lower end of the heat dissipation fixing seat. Compared with the filament lamp in the background technology which uses the heat-conducting gas to transfer heat by thermal radiation, the present invention takes the heat transfer into consideration in many aspects, and the heat transfer is more intuitive and convenient, which truly realizes the high thermal conductivity of the LED filament lamp, and also solves the thermal damage and light decay of the LED chip caused by untimely heat dissipation, avoids the reduction of the luminous flux, and also prolongs the service life of the filament lamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 It is an assembly schematic diagram of the present invention;

[0018] Figure 2 It is a schematic diagram of the structure of the present invention;

[0019] Figure 3 It is a schematic diagram of the structure of the connector;

[0020] Figure 4 It is a structural schematic diagram of a hollow heat dissipation column;

[0021] Figure 5 It is a structural diagram of a filament light source board;

[0022] Figure 6 It is a top view of the filament light source board;

[0023] Figure 7 It is a structural schematic diagram of the heat dissipation fixing seat;

[0024] Figure 8 It is a cross-sectional schematic diagram of the lampshade.

[0025] Description of reference numerals:

[0026] 1. Lamp holder; 2. Power board; 3. Connector; 4. Filament light source board; 5. Hollow heat sink; 6. Heat sink fixing seat; 7. Lampshade; 3-1. Small card slot; 3-2. Retractable metal contact terminal; 3-3. Mounting through hole; 4-1. Substrate; 4-2. Solder resist pad; 4-3. Package LED chip area; 4-4. Circuit area; 4-31. LED chip; 4-32. Bonding wire; 4-33. Fluorescent glue; 4-41. Circuit layer; 5-1. Internal hollow area; 5-2. Top of hollow heat sink; 5-3. Long card slot; 5-4. Arc-shaped protrusion; 5-5. Bottom of hollow heat sink; 6-1. Heat dissipation hole; 6-2. Lower end peripheral wall; 7-1. Concave circular hole; 7-2. Top of lampshade; 7-3. Bottom of lampshade. DETAILED DESCRIPTION

[0027] The present invention will be further described below in conjunction with the accompanying drawings.

[0028] See also Figure 1-2 4, the technical solution adopted in this specific embodiment is: it comprises a lamp holder 1, a power board 2, a connector 3, a hollow heat dissipation column 5, a plurality of filament light source boards 4, a heat dissipation fixing seat 6, and a lampshade 7; the bottom end 7-3 of the lampshade is connected to the lamp holder 1; the power board 2, the connector 3, the hollow heat dissipation column 5, a plurality of filament light source boards 4, and the heat dissipation fixing seat 6 are all arranged in the space formed by the lamp holder 1 and the lampshade 7; the top end 7-2 of the lampshade is provided with a concave circular hole 7-1; the concave circular hole 7-1 is provided with a heat dissipation fixing seat 6; the heat dissipation fixing seat 6 Connected to the top 5-2 of the hollow heat dissipation column; a plurality of long strip card slots 5-3 arranged in a ring matrix are provided on the outer wall of the hollow heat dissipation column 5; a filament light source board 4 is arranged in the long strip card slot 5-3; the heat generated by the filament light source board 4 is transferred to the internal hollow area 5-1 through the outer peripheral wall of the hollow heat dissipation column 5 for heat dissipation; an outward arc-shaped protrusion 5-4 is provided between two adjacent long strip card slots 5-3; the bottom end 5-5 of the hollow heat dissipation column is sleeved in the connecting piece 3; the connecting piece 3 is arranged above the power board 2; the power board 2 is arranged in the lamp holder 1;

[0029] See also Figure 5-6As shown, the filament light source board 4 is provided with a substrate 4-1; the substrate 4-1 is a rectangular substrate; the material of the substrate 4-1 is a ceramic plate or a superconducting aluminum substrate; the outer surface of the substrate 4-1 is provided with a packaged LED chip area 4-3, a circuit area 4-4 and a solder resist pad 4-2 in order from top to bottom; the circuit area 4-4 is provided with a circuit layer 4-41; the solder resist pad 4-2 is electrically connected to the circuit layer 4-41, and plays a role in introducing power; the packaged LED chip area 4-3 is provided with an LED chip 4-31, a bonding wire 4-32, and a fluorescent glue 4-33; the LED chip 4-31 is electrically connected to the circuit layer 4-41 through the bonding wire 4-32 to form a circuit conduction; the fluorescent glue 4-33 completely covers the LED chip 4-31 and the bonding wire 4-32;

[0030] See also Figure 3 As shown, the connector 3 is a cylindrical connector; a mounting through hole 3-3 is provided in the middle of the connector 3 and is matched with the bottom end of the hollow heat dissipation column; a small card slot 3-1 for assembling the filament light source board corresponding to the long card slot is provided on the inner wall of the mounting through hole 3-3; a retractable metal contact end 3-2 is provided on the side wall of the small card slot 3-1, and the retractable metal contact end 3-2 is used for the filament light source board 4 to be inserted into the small card slot 3-1 and to be in contact with the solder resist pad 4-2 on the filament light source board; the retractable metal contact end 3-2 is electrically connected to the power supply board 2 through a wire;

[0031] See also Figure 4 As shown, the hollow heat dissipation column 5 is a hollow truncated cone structure; the hollow heat dissipation column 5 is made of aluminum or heat-conducting insulating plastic material; the outer surface of the arc-shaped protrusions 5-4 on the outer wall of the hollow heat dissipation column is wrapped with a thin film layer by electroplating, spraying or sputtering, and the thin film layer plays a role of diffuse reflection and refraction; the light emitted by the filament light source board 4 is diffusely reflected and refracted by the thin film layer on the arc-shaped protrusions around the hollow heat dissipation column, and finally refracted by the lampshade 7;

[0032] See also Figure 8 As shown, the lampshade 7 is a transparent or translucent hemispherical bulb shell structure, which can accommodate the hollow heat dissipation column 5, the filament light source board 4, etc.; the material of the lampshade 7 is plastic or glass;

[0033] See also Figure 7 As shown, the heat dissipation fixing seat 6 is a transparent or translucent convex cylindrical structure; a plurality of heat dissipation holes 6-1 are provided on the top and lower peripheral walls 6-2 of the heat dissipation fixing seat; the heat dissipation holes at the top can transfer the heat accumulated in the hollow area of ​​the hollow heat dissipation column to the outside through the heat dissipation holes, and the heat dissipation holes on the lower peripheral wall can transfer a certain amount of heat generated by the light source panel to the outside through the heat dissipation holes.

[0034] After adopting the above structure, the LED filament lamp with high thermal conductivity described in this specific embodiment has the following advantages:

[0035] 1. The single-sided filament light source board is assembled through the long slot on the hollow heat dissipation column, and then the combination of the two is assembled on the connector. At the same time, the solder resist pad of the filament light source board is connected to the metal contact end in the connector. The structure is simple and easy to operate, and no welding or gluing is required;

[0036] 2. The lampshade can be directly assembled with the hollow heat dissipation column through the heat dissipation fixing seat and then assembled with the lamp holder seat without sealing the bubble;

[0037] 3. Although the filament light source board uses 180° single-sided light emission, after it is assembled to the peripheral wall of the hollow heat dissipation column, the light emitted will form a 360° light emission effect after diffuse reflection and refraction by the protrusions on the surface of the hollow heat dissipation column;

[0038] 4. The hollow heat dissipation column is arranged as a hollow truncated cone structure, and the top of the hollow heat dissipation column and the top of the lampshade are matched with a heat dissipation fixing seat. A part of the heat generated by the single-sided light emission of the substrate passes through the hollow area of ​​the heat dissipation column and is transferred to the outside of the lampshade through the heat dissipation holes at the top of the heat dissipation fixing seat, and another part of the heat accumulated in the lampshade is directly transferred to the outside of the lampshade through the heat dissipation holes at the lower end of the heat dissipation fixing seat. Compared with the filament lamp in the background technology which uses the heat-conducting gas to transfer heat by thermal radiation, the present invention takes the heat transfer into consideration in many aspects, and the heat transfer is more intuitive and convenient, which truly realizes the high thermal conductivity of the LED filament lamp, and also solves the thermal damage and light decay of the LED chip caused by untimely heat dissipation, avoids the reduction of the luminous flux, and also prolongs the service life of the filament lamp.

[0039] The above description is only used to illustrate the technical solution of the present invention rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A LED filament lamp with high thermal conductivity, characterized in that It comprises a lamp holder, a power board, a connector, a hollow heat dissipation column, a plurality of filament light source boards, a heat dissipation fixing seat and a lampshade; the bottom end of the lampshade is connected to the lamp holder; the power board, the connector, the hollow heat dissipation column, a plurality of filament light source boards and the heat dissipation fixing seat are all arranged in a space formed by the lamp holder and the lampshade; a concave circular hole is arranged at the top of the lampshade; a heat dissipation fixing seat is arranged in the concave circular hole; the heat dissipation fixing seat is connected to the top of the hollow heat dissipation column; a plurality of long strip card slots arranged in a ring matrix are arranged on the outer wall of the hollow heat dissipation column; the long strip card slots are provided in the ... provided at the top of the lampshade; a heat dissipation fixing seat is provided in the concave circular hole; the heat dissipation fixing seat is connected to the top of the hollow heat dissipation column; a plurality of long strip card slots arranged in a ring matrix are A filament light source board is provided; an outward arc-shaped protrusion is provided between two adjacent long strip slots; the bottom end of the hollow heat dissipation column is sleeved in the connecting piece; the connecting piece is arranged above the power board; the power board is arranged in the lamp holder; the filament light source board is provided with a substrate; the substrate is a rectangular substrate; the substrate is made of a ceramic plate or a superconducting aluminum substrate; an LED chip encapsulation area, a circuit area and a solder resist pad are provided on the outer surface of the substrate in sequence; a circuit layer is provided on the circuit area; the solder resist pad is electrically connected to the circuit layer; the LED encapsulation LED chips, bonding wires and fluorescent glue are arranged on the chip area; the LED chips are electrically connected to the circuit layer through the bonding wires; the fluorescent glue completely covers the LED chips and the bonding wires; the connector is a cylindrical connector; a mounting through hole is arranged in the middle of the connector and is matched with the bottom end of the hollow heat dissipation column; a small card slot corresponding to the long strip card slot for assembling the filament light source board is arranged on the inner wall of the mounting through hole; a retractable metal contact end is arranged on the side wall of the small card slot; the retractable metal contact end is electrically connected to the power supply board through the wire; the hollow heat dissipation column is a hollow truncated cone structure; the hollow heat dissipation column is made of aluminum or heat-conductive insulating plastic material; a thin film layer is wrapped on the outer surface of the arc-shaped protrusion on the outer wall of the hollow heat dissipation column by electroplating, spraying or sputtering; the lampshade is a transparent or translucent hemispherical bulb shell structure; the lampshade is made of plastic or glass; the heat dissipation fixing seat is a transparent or translucent convex cylindrical structure; a plurality of heat dissipation holes are arranged on the top and lower peripheral walls of the heat dissipation fixing seat.

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