Test equipment for testing printed circuit boards
By designing a test device for testing printed circuit boards, and using mechanical docking of the integral needle disc and the test mold, the problem of time-consuming and error-prone testing in the prior art is solved, and an efficient testing process is achieved.
Patent Information
- Application Number
- CN201910221948.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-03-22
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2039-03-22
AI Technical Summary
The existing testing devices need to manually connect the cable detection interface when testing printed circuit boards, which makes the test process take a long time, prone to errors, and affect efficiency.
A test device including test mold, press frame, lifting assembly and needle disc assembly was designed. Through the mechanical docking of the integral needle disc and the test mold, the electrical connection between the upper and lower molds was automatically completed to avoid the Manual operation.
It greatly improves the testing efficiency, reduces errors caused by manual operations, and achieves a fast and accurate testing process.
Smart Images
Figure CN109901053B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of testing devices, and in particular provides a testing device for testing a printed circuit board. Background Art
[0002] Currently, in the industry of producing printed circuit boards, testing finished printed circuit boards is essential. The test items include open circuit, short circuit and resistance functions. The existing testing device consists of three parts, namely a press device, an electronic scanning system and a cable connection component, wherein the press device provides power, the cable connection component is used to connect the printed circuit board, and the electronic scanning system realizes the command input and output of the entire test process. However, during the test process of the existing testing device, it is necessary to manually connect the detection interface of the cable connection component to the printed circuit board one by one. In this way, the entire testing process is time-consuming and error-prone, which in turn affects the test efficiency. Therefore, it is urgent to solve the problem that the testing process of the existing testing device is time-consuming and error-prone. Summary of the invention
[0003] The purpose of the present invention is to provide a testing device for testing a printed circuit board, aiming to solve the problem that the testing process of the existing testing device is time-consuming and prone to errors.
[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a test device for testing a printed circuit board, comprising a test mold, a press frame, a first lifting assembly, a second lifting assembly, an upper mold needle disk assembly and a lower mold needle disk assembly, the test mold comprising a test upper mold and a test lower mold arranged relatively to each other up and down, the press frame comprising an upper table panel, a lower table panel and a movable panel moving between the upper table panel and the lower table panel, the upper table panel and the lower table panel are stacked and spaced in a vertical direction, the first lifting assembly is installed on the upper table panel, and the protruding end of the first lifting assembly is connected to the upper mold needle disk assembly, the upper mold needle disk assembly is installed on one end side of the movable panel, the test upper mold is installed on the other end side of the movable panel and is electrically connected to the upper mold needle disk assembly, the second lifting assembly is installed on one end side of the lower table panel, the protruding end of the second lifting assembly is connected to the lower mold needle disk assembly, and the test lower mold is installed on the other end side of the lower table panel and is electrically connected to the lower mold needle disk assembly.
[0005] Specifically, the upper mold needle disk assembly includes a test upper mold mounting plate, an upper mold needle disk mounting plate and an upper mold needle disk which are stacked in sequence along the vertical direction, the test upper mold mounting plate is connected to the protruding end of the first lifting assembly, the upper mold needle disk mounting plate is installed on the test upper mold mounting plate, and the upper mold needle disk is inserted into the upper mold needle disk mounting plate when the test upper mold mounting plate moves downward along the vertical direction, the upper mold needle disk is located at one end side of the movable panel, and the test upper mold is located at the other end side of the movable panel and opposite to the upper mold needle disk.
[0006] Furthermore, the testing device for testing printed circuit boards also includes two upper needle dial locking assemblies, which are both arranged on the movable panel and respectively distributed on the opposite sides of the upper mold needle dial, and the two upper needle dial locking assemblies move toward each other in the horizontal direction to respectively abut against the opposite sides of the upper mold needle dial.
[0007] Specifically, the second lifting assembly includes a lower mold lifting cylinder and a lower mold lifting plate connected to the protruding end of the lower mold lifting cylinder, the lower mold needle disk assembly is installed on the lower mold lifting plate and is located on one end side of the lower table panel, and the test lower mold is located on the other end side of the lower table panel.
[0008] Furthermore, the test device for testing printed circuit boards also includes four lower mold locking assemblies, each two of which form a group and are respectively arranged on opposite sides of the test lower mold, and each of the lower mold locking assemblies is clamped on the test lower mold when moving in the vertical direction.
[0009] Furthermore, the testing device for testing printed circuit boards also includes four lower needle disk locking assemblies, each two of which form a group and are respectively arranged on opposite sides of the lower mold needle disk assembly, and each of the lower needle disk locking assemblies moves toward each other in the horizontal direction to respectively abut against opposite sides of the lower mold needle disk assembly.
[0010] Specifically, the press machine tool further includes a plurality of limiting guide posts, and each of the limiting guide posts is sequentially arranged through the upper panel, the movable panel and the lower panel.
[0011] Specifically, the testing device for testing a printed circuit board further comprises an upper body, a lower body and a control panel, wherein the upper body cover is arranged on the upper platform panel, the lower body cover is arranged on the lower platform panel, and the control panel is arranged on the lower body.
[0012] Beneficial effects of the present invention: The test device for testing printed circuit boards provided by the present invention has the following working process: during the chip loading test, the first lifting assembly pushes the upper mold needle disk assembly in the vertical direction and is fixed on one end side of the movable panel, while the test upper mold is installed on the other end side of the movable panel and is connected with the upper mold needle disk assembly to achieve electrical connection; at the same time, the second lifting assembly pushes the lower mold needle disk assembly in the vertical direction and is fixed on one end side of the lower panel, while the test lower mold is installed on the other end side of the lower panel and is connected with the upper mold needle disk assembly to achieve electrical connection. At this time, the test upper mold and the test lower mold are opposite and spaced in the vertical direction, and the printed circuit board to be tested is placed on the test lower mold. When the test upper mold moves to the top of the test lower mold with the movable panel under the drive of the first lifting assembly, the printed circuit board is tested using the closed test upper mold and the test lower mold. The test process uses an integral needle disk and a test mold for mechanical docking, avoiding the time-consuming and error-prone wiring problems caused by manual docking. The test efficiency is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0014] Figure 1 A schematic diagram of the structure of a testing device for testing a printed circuit board provided by an embodiment of the present invention;
[0015] Figure 2 A schematic structural diagram of a testing device for testing a printed circuit board provided by an embodiment of the present invention from another angle;
[0016] Figure 3 A schematic structural diagram of a testing device for testing a printed circuit board provided by an embodiment of the present invention from another angle.
[0017] Among them, the reference numerals in the figure are:
[0018] Test mold 100 Test die mounting plate 111 Press frame 101 Upper die needle plate mounting plate 112 First lifting assembly 102 Upper die needle plate 113 Second lifting assembly 103 Upper needle disc locking assembly 114 Upper die needle plate assembly 104 Lower die lifting cylinder 115 Lower die needle plate assembly 105 Lower mold lifting plate 116 Test die 106 Lower die locking assembly 117 Test the lower die 107 Lower needle plate locking assembly 118 Upper panel 108 Limit guide column 119 Lower panel 109 Upper fuselage 120 Activity Panel 110 Lower fuselage 121 control Panel 122 DETAILED DESCRIPTION
[0019] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.
[0020] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0022] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0023] Please refer to Figure 1 and Figure 2 The testing device for testing a printed circuit board provided in an embodiment of the present invention includes a testing mold 100, a press frame 101, a first lifting assembly 102, a second lifting assembly 103, an upper mold needle disk assembly 104 and a lower mold needle disk assembly 105. The test mold 100 includes a test upper mold 106 and a test lower mold 107 which are arranged relatively to each other in the upper and lower directions. The press machine frame 102 includes an upper table panel 108, a lower table panel 109 and a movable panel 110 which moves between the upper table panel 108 and the lower table panel 109. The upper table panel 108 and the lower table panel 109 are stacked and spaced apart in the vertical direction. The first lifting assembly 102 is installed on the upper table panel 108, and the protruding end of the first lifting assembly 102 is connected to the upper mold needle disk assembly 104, and the upper mold needle disk assembly 104 is installed on one end side of the movable panel 110. The test upper mold 106 is installed on the other end side of the movable panel 110 and is electrically connected to the upper mold needle disk assembly 104. The second lifting assembly 103 is installed on one end side of the lower table panel 109, and the protruding end of the second lifting assembly 103 is connected to the lower mold needle disk assembly 105. The test lower mold 107 is installed on the other end side of the lower table panel 109 and is electrically connected to the lower mold needle disk assembly 105.
[0024] The test device for testing a printed circuit board provided by the embodiment of the present invention has the following working process: during the chip loading test, the first lifting assembly 102 pushes the upper die needle plate assembly 104 in the vertical direction and is fixed to one end side of the movable panel 110, while the test upper die 106 is installed on the other end side of the movable panel 110 and is connected with the upper die needle plate assembly 104 to achieve electrical connection; at the same time, the second lifting assembly 103 pushes the lower die needle plate assembly 105 in the vertical direction and is fixed to one end side of the lower table panel 109 ... The lower mold 107 is installed on the other end side of the lower table panel 109 and is connected to the upper mold needle disk assembly 104 to achieve electrical connection. At this time, the test upper mold 106 and the test lower mold 107 are opposite and spaced in the vertical direction, and the printed circuit board to be tested is placed on the test lower mold 107. When the test upper mold 106 moves to the top of the test lower mold 107 with the movable panel 110 driven by the first lifting assembly 102, the printed circuit board is tested using the closed test upper mold 106 and the test lower mold 107. The test process uses an integral needle disk to mechanically dock with the test mold 100 to avoid the time-consuming and error-prone wiring problems caused by manual docking. The test efficiency is greatly improved.
[0025] Specifically, please refer to Figure 1 and Figure 2 In this embodiment, the upper die needle disk assembly 104 includes a test upper die mounting plate 111, an upper die needle disk mounting plate 112 and an upper die needle disk 113 which are stacked in sequence in the vertical direction, wherein the test upper die mounting plate 111 realizes the connection between the test upper die 106 and the first lifting assembly 102, and the upper die needle disk 113 is fixed on the upper die needle disk mounting plate 112 by insertion. The test upper die mounting plate 111 is connected to the protruding end of the first lifting assembly 102, the upper die needle disk mounting plate 112 is mounted on the test upper die mounting plate 111, and the upper die needle disk 113 is inserted into the upper die needle disk mounting plate 112 when the test upper die mounting plate 111 moves downward in the vertical direction. The upper die needle disk 113 is located at one end side of the movable panel 110, and the test upper die position 106 is located at the other end side of the movable panel 110 and is opposite to the upper die needle disk 113. In this way, according to different test objects, the upper mold needle disk can be replaced while replacing the test mold, thereby providing universality of the test.
[0026] For further information, please refer to Figure 1 and Figure 2In this embodiment, the testing device for testing the printed circuit board further includes two upper needle disk locking assemblies 114, both of which are arranged on the movable panel 110 and respectively distributed on opposite sides of the upper die needle disk 113, and the two upper needle disk locking assemblies 114 move toward each other in the horizontal direction to respectively abut against opposite sides of the upper die needle disk 113. It can be understood that the upper needle disk locking assemblies 114 limit the horizontal freedom of the upper die needle disk 113 to prevent the upper die needle disk 113 from moving in the horizontal direction during the test process, thereby affecting the test results.
[0027] Specifically, please refer to Figure 1 and Figure 2 In this embodiment, the second lifting assembly 103 includes a lower die lifting cylinder 115 and a lower die lifting plate 116 connected to the extended end of the lower die lifting cylinder 115. The lower die needle plate assembly 105 is installed on the lower die lifting plate 116 and is located at one end of the lower table panel 109. The test lower die 107 is located at the other end of the lower table panel 109. It can be understood that the lower die lifting cylinder 115 provides power to push the lower die needle plate assembly 105 to be electrically connected with the test lower die 107, and at the same time, the disassembly and assembly are met to improve the versatility of the test.
[0028] Specifically, please refer to Figure 1 and Figure 2 In this embodiment, the test device for testing the printed circuit board further includes four lower die locking assemblies 117, each of which is a group of two lower die locking assemblies 117 and are respectively arranged on opposite sides of the test lower die 107, and each lower die locking assembly 117 is clamped on the test lower die 107 when moving in the vertical direction. It can be understood that the lower die locking assembly 117 can be an L-shaped adjustable latch, and the locking is achieved by screwing the screw. In this way, the lower die locking assembly 117 fixes the test lower die 107 on the lower table panel 109.
[0029] Specifically, please refer to Figure 1 and Figure 2 In this embodiment, the testing device for testing the printed circuit board further includes four lower needle disk locking assemblies 118, each two lower needle disk locking assemblies 108 form a group and are respectively arranged on opposite sides of the lower die needle disk assembly 105, and each lower needle disk locking assembly 108 moves toward each other in the horizontal direction to respectively abut against opposite sides of the lower die needle disk assembly 105. Similarly, the lower needle disk locking assembly 117 is used to limit the horizontal freedom of the lower die needle disk assembly 105 to prevent it from deflecting during the test process and affecting the test results.
[0030] Specifically, please refer to Figure 1In this embodiment, the press machine tool further includes a plurality of limiting guide posts 119, each of which is sequentially disposed on the upper panel 108, the movable panel 110, and the lower panel 109. Here, each limiting guide post 119 is used to guide the movable panel 110 to ensure its movement stability between the upper panel 108 and the lower panel 109.
[0031] For further information, please refer to Figure 3 In this embodiment, the testing device for testing the printed circuit board further includes an upper body 120, a lower body 121 and a control panel 122. The upper body 120 is covered on the upper panel 108, the lower body 121 is covered on the lower panel 109, and the control panel 122 is arranged on the lower body 121. Both the upper body 120 and the lower body 121 play the role of a protective shell. The specific command output is realized through the control panel 122.
[0032] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A testing device for testing a printed circuit board, characterized in that: The invention comprises a test mold, a press frame, a first lifting assembly, a second lifting assembly, an upper mold needle disk assembly and a lower mold needle disk assembly, wherein the test mold comprises a test upper mold and a test lower mold which are arranged relatively up and down, the press frame comprises an upper table panel, a lower table panel and a movable panel which moves between the upper table panel and the lower table panel, the upper table panel and the lower table panel are stacked and arranged at intervals in a vertical direction, the first lifting assembly is installed on the upper table panel, and the protruding end of the first lifting assembly is connected to the upper mold needle disk assembly, the upper mold needle disk assembly is installed on one end side of the movable panel, the test upper mold is installed on the other end side of the movable panel and is electrically connected to the upper mold needle disk assembly, the second lifting assembly is installed on one end side of the lower table panel, the protruding end of the second lifting assembly is connected to the lower mold needle disk assembly, the test lower mold is installed on the other end side of the lower table panel and is electrically connected to the lower mold needle disk assembly; The upper die needle disk assembly comprises a test upper die mounting plate, an upper die needle disk mounting plate and an upper die needle disk which are sequentially stacked in a vertical direction, the test upper die mounting plate is connected to the extended end of the first lifting assembly, the upper die needle disk mounting plate is mounted on the test upper die mounting plate, the upper die needle disk is inserted into the upper die needle disk mounting plate when the test upper die mounting plate moves downward in a vertical direction, the upper die needle disk is located at one end side of the movable panel, and the test upper die is located at the other end side of the movable panel and is opposite to the upper die needle disk; The testing device for testing a printed circuit board further comprises two upper needle disk locking assemblies, both of which are arranged on the movable panel and respectively distributed on opposite sides of the upper mold needle disk, and the two upper needle disk locking assemblies move toward each other in the horizontal direction to respectively abut against opposite sides of the upper mold needle disk; The second lifting assembly includes a lower mold lifting cylinder and a lower mold lifting plate connected to the protruding end of the lower mold lifting cylinder, the lower mold needle disk assembly is installed on the lower mold lifting plate and is located on one end side of the lower table panel, and the test lower mold is located on the other end side of the lower table panel.
2. The testing device for testing a printed circuit board according to claim 1, characterized in that: The testing device for testing printed circuit boards also includes four lower die locking assemblies, each two of which form a group and are respectively arranged on opposite sides of the test lower die, and each of the lower die locking assemblies is clamped on the test lower die when moving in the vertical direction.
3. The testing device for testing a printed circuit board according to claim 1, characterized in that: The testing device for testing printed circuit boards also includes four lower needle disk locking assemblies, each two of which form a group and are respectively arranged on opposite sides of the lower mold needle disk assembly, and each of the lower needle disk locking assemblies moves toward each other in the horizontal direction to respectively abut against opposite sides of the lower mold needle disk assembly.
4. The testing device for testing a printed circuit board according to any one of claims 1 to 3, characterized in that: The press frame further comprises a plurality of position-limiting guide posts, each of which is sequentially passed through the upper panel, the movable panel and the lower panel.
5. The testing device for testing a printed circuit board according to any one of claims 1 to 3, characterized in that: The testing device for testing a printed circuit board further comprises an upper body, a lower body and a control panel, wherein the upper body cover is arranged on the upper platform panel, the lower body cover is arranged on the lower platform panel, and the control panel is arranged on the lower body.