A microstrip receiving antenna, a transmitting antenna and a vehicle-mounted phased array antenna
By designing a multi-layer board microstrip receiving and transmitting antenna and installing it on the same multi-layer microwave board to form an on-board phased array transmitting and receiving antenna, the existing on-board millimeter-wave radar antenna has solved the problem that the existing on-board millimeter-wave radar antenna does not have imaging functions, is large in size, and is high in production costs, and the miniaturization and two-dimensional imaging functions are realized, which improves radar scanning accuracy.
Patent Information
- Application Number
- CN201910537791.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-06-20
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2039-06-20
AI Technical Summary
The existing vehicle-mounted millimeter-wave radar antennas do not have imaging functions, are large in size and have high production costs.
A multi-layer plate microstrip receiving antenna and transmitting antenna are designed. By setting rectangular radiation patches of different sizes on the outermost surface of the multi-layer microwave plate, coupling gaps and feeding strips are designed inside the plate, combining the underlying microstrip feeder and signal holes to realize the microstrip receiving and transmitting functions. These antennas are installed on the same multi-layer microwave board to form an on-board phased array transceiver antenna.
The antenna has both miniaturization and two-dimensional imaging functions, which improves the scanning accuracy of the on-board phased array radar and reduces production costs and volume.
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Figure CN110311211B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of millimeter wave frequency band antennas, and in particular to a microstrip receiving antenna, a transmitting antenna and a vehicle-mounted phased array antenna. Background Art
[0002] At present, the wireless waves used in radar scanning technology mainly include: far infrared / near infrared, ultrasonic waves, millimeter waves, etc. In actual application, far infrared / near infrared light waves are easily affected by changes in weather and environment. When encountering bad weather such as rain or fog, their penetration ability becomes poor, and when encountering extreme weather, far infrared / near infrared light wave radars may even be unusable; and the propagation speed of ultrasonic waves is much slower than that of electromagnetic waves. When a car is traveling at a speed of 100 kilometers on a highway, ultrasonic waves cannot catch up with the driving speed, resulting in large errors in the scanning results of ultrasonic radars when they are used on vehicles. At the same time, ultrasonic radars also have poor directivity and large divergence angles. The resolution is reduced due to serious energy loss during the divergence process, and it is easy to mistake vehicles in the near lanes or objects on the roadside for measurement targets, resulting in further reduction in the scanning accuracy of ultrasonic radars when they are used on vehicles; millimeter wave radars have the advantages of short wavelength, high directivity, and strong penetration ability along a straight line. They can not only detect the distance, relative position velocity and azimuth of the target, but also can form images, etc., and are very suitable for use in vehicle-mounted radar systems.
[0003] At present, the automotive millimeter-wave radar antennas on the market are usually implemented by a one-dimensional linear array composed of a few channel series-fed antennas, so they only have a one-dimensional scanning function, which can realize the functions of ranging, speed measurement, and collision avoidance, but do not have imaging functions. At the same time, traditional automotive millimeter-wave radar antennas usually set various processing chips and antenna arrays on the same side of the PCB board, resulting in a large space area for automotive millimeter-wave radar antennas; at the same time, traditional high-frequency antennas are usually implemented using LTCC technology, which has a high production cost.
[0004] It can be seen that there are technical problems in the prior art that the vehicle-mounted millimeter-wave radar antenna does not have imaging function, is large in size, and has high production cost. Summary of the invention
[0005] The present application provides a microstrip receiving antenna, a transmitting antenna and a vehicle-mounted phased array antenna, which are used to solve the technical problems in the prior art that the vehicle-mounted millimeter-wave radar antenna has no imaging function, is large in size and has a high production cost.
[0006] The first aspect of the present application provides a multilayer microstrip receiving antenna, comprising:
[0007] Receiving multi-layer microwave board;
[0008] A first radiation patch and a second radiation patch are arranged on the outer surface of the first microwave board which is the outermost of the receiving multi-layer microwave board, the first radiation patch and the second radiation patch are rectangular, and the first radiation patch and the second radiation patch have different sizes;
[0009] A coupling slot is provided on the second microwave board in the receiving multi-layer microwave board and is located within the projection range of the first radiation patch and the second radiation patch on the second microwave board;
[0010] A feeding strip line is arranged on a third microwave board in the receiving multi-layer microwave board and connected to the coupling slot;
[0011] A bottom layer microstrip feed line is arranged on an outer surface of a fourth microwave board which is located at the outermost side of the receiving multi-layer microwave board, and the fourth microwave board is different from the first microwave board;
[0012] The first signal hole is arranged in the receiving multi-layer microwave board and connects the feeding strip line and the bottom microstrip feeding line.
[0013] Optionally, the receiving antenna further includes:
[0014] At least two first metal layers, the first metal layers are arranged on the surface of the inner microwave board of the multi-layer microwave receiving board for grounding;
[0015] The first grounding hole is arranged in the multi-layer microwave receiving board and connects two first metal ground layers.
[0016] Optionally, the receiving antenna further includes:
[0017] At least two first shielding holes are arranged in the receiving multilayer microwave board and surround the feeding strip line, wherein the at least two first shielding holes enclose a first shielding cavity.
[0018] Optionally, the axes of the first signal hole, the first grounding hole, and the first shielding hole are parallel, and the axes are perpendicular to the board surface of the multi-layer microwave receiving board.
[0019] Optionally, the number of the first radiation patches and the second radiation patches is an even number, wherein the first radiation patches and the second radiation patches are arranged symmetrically with respect to the same straight line.
[0020] A second aspect of an embodiment of the present application provides a multilayer microstrip transmitting antenna, comprising:
[0021] Launching multi-layer microwave panels;
[0022] An upper radiation patch is arranged on the outer surface of the first outermost layer of the multi-layer microwave emitting board;
[0023] The lower radiation patch is arranged on the second layer of the multi-layer microwave emitting board, and the upper radiation patch is located within the projection range of the lower radiation patch on the first layer of the board;
[0024] A bottom microstrip is arranged on the outer surface of the third layer of the transmitting multi-layer microwave board, which is located at the outermost side, and the third layer is different from the first layer;
[0025] The second signal hole is arranged in the transmitting multi-layer microwave board and connects the lower radiation patch and the bottom microstrip.
[0026] Optionally, the transmitting antenna further includes:
[0027] At least two layers of second metal ground layers, the second metal ground layers are arranged on the surface of the inner microwave board of the multi-layer microwave emitting board for grounding;
[0028] The second grounding hole is arranged in the multi-layer microwave emitting board and connects two second metal ground layers.
[0029] Optionally, the axial directions of the second signal hole and the second grounding hole are parallel, and the axial directions are perpendicular to the board surface of the multi-layer microwave receiving board.
[0030] Optionally, the upper radiation patch is rectangular, and when the number of the upper radiation patches is at least two, the at least two upper radiation patches are arranged in a straight line.
[0031] The third aspect of the present application provides a vehicle-mounted phased array transceiver antenna, comprising:
[0032] The receiving array plane composed of the receiving antennas according to the first aspect, wherein the receiving multi-layer microwave boards of all the receiving antennas in the receiving array plane are the same first multi-layer microwave board;
[0033] The transmitting array plane composed of transmitting antennas according to the second aspect, wherein the transmitting multi-layer microwave boards of all transmitting antennas in the transmitting array plane are the same second multi-layer microwave board;
[0034] Among them, all the first radiation patches and the second radiation patches in the receiving array plane and all the upper radiation patches in the transmitting array plane are located on the same surface of the same microwave layer board, all the feeding strip lines in the receiving array plane and all the lower radiation patches in the transmitting array plane are located on the same surface of the same microwave layer board; all the bottom layer microstrip feed lines in the receiving array plane and all the bottom layer microstrips in the transmitting array plane are located on the same surface of the same microwave layer board; and the thickness of the first multi-layer microwave board and the second multi-layer microwave board are the same.
[0035] Optionally, the array structure of the first radiation patch, the second radiation patch, and the upper radiation patch is a sparse array structure.
[0036] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
[0037] The technical solution in the embodiment of the present application is to arrange rectangular first radiation patches and second radiation patches of different sizes on the outermost surface of the multilayer microwave board, design coupling gaps and feeding strip lines in the board, arrange bottom microstrip feed lines on the other outer surface, and arrange a first signal hole connecting the feeding strip lines and the bottom microstrip feed lines in the board to obtain a microstrip receiving antenna; arrange an upper radiation patch on the outermost surface of the multilayer microwave board, arrange a lower radiation patch that can cover the upper radiation patch in the board, arrange a bottom microstrip on the other outer surface, and arrange a second signal hole connecting the lower radiation patch and the bottom microstrip in the board to obtain a microstrip transmitting antenna. The microstrip transmitting antenna and the microstrip receiving antenna are installed on the same multilayer microwave board to obtain a vehicle-mounted phased array transceiver antenna. The antenna works in the high frequency band of millimeter waves, has both miniaturization and two-dimensional imaging functions, and has the technical effect of improving the scanning accuracy of vehicle-mounted phased array radars. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] Figure 1 A cross-sectional structural diagram of a multilayer microstrip receiving antenna provided by an embodiment of the present invention;
[0039] Figure 2 A three-dimensional structural diagram of a multilayer microstrip receiving antenna provided by an embodiment of the present invention;
[0040] Figure 3 A cross-sectional structural diagram of a multilayer microstrip transmitting antenna provided by an embodiment of the present invention;
[0041] Figure 4 A three-dimensional structural diagram of a multilayer microstrip transmitting antenna provided by an embodiment of the present invention;
[0042] Figure 5 An array structure diagram of a vehicle-mounted phased array transceiver antenna provided in an embodiment of the present invention;
[0043] Figure 6 A layout structure diagram of a receiving antenna subarray of a sparse array structure provided in an embodiment of the present invention. DETAILED DESCRIPTION
[0044] The present application provides a microstrip receiving antenna, a transmitting antenna and a vehicle-mounted phased array antenna, which are used to solve the technical problems in the prior art that the vehicle-mounted millimeter-wave radar antenna has no imaging function, is large in size and has a high production cost.
[0045] The technical solution in the embodiment of the present application is to solve the above technical problems, and the overall idea is as follows:
[0046] The technical solution in the embodiment of the present application is to arrange rectangular first radiation patches and second radiation patches of different sizes on the outermost surface of the multilayer microwave board, design coupling gaps and feeding strip lines in the board, arrange bottom microstrip feed lines on the other outer surface, and arrange a first signal hole connecting the feeding strip lines and the bottom microstrip feed lines in the board to obtain a microstrip receiving antenna; arrange an upper radiation patch on the outermost surface of the multilayer microwave board, arrange a lower radiation patch that can cover the upper radiation patch in the board, arrange a bottom microstrip on the other outer surface, and arrange a second signal hole connecting the lower radiation patch and the bottom microstrip in the board to obtain a microstrip transmitting antenna. The microstrip transmitting antenna and the microstrip receiving antenna are installed on the same multilayer microwave board to obtain a vehicle-mounted phased array transceiver antenna. The antenna works in the high frequency band of millimeter waves, has both miniaturization and two-dimensional imaging functions, and has the technical effect of improving the scanning accuracy of vehicle-mounted phased array radars.
[0047] The technical solution of the present application is described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present application and the specific features in the embodiments are detailed descriptions of the technical solution of the present application, rather than limitations on the technical solution of the present application. In the absence of conflict, the embodiments of the present application and the technical features in the embodiments can be combined with each other.
[0048] The term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.
[0049] Embodiment 1
[0050] Please refer to Figure 1 , Figure 2 , Embodiment 1 of the present application provides a multilayer microstrip receiving antenna, comprising:
[0051] Receiving multi-layer microwave board;
[0052] The first radiation patch 101 and the second radiation patch 102 are arranged on the outer surface of the first microwave board which is the outermost of the receiving multi-layer microwave board. The first radiation patch 101 and the second radiation patch 102 are rectangular, and the first radiation patch 101 and the second radiation patch 102 have different sizes. It should be noted that the different sizes in the embodiment of the present application can refer to that the length and width of the first radiation patch 101 and the second radiation patch 102 are different, thereby forming two different resonant frequencies. At the same time, the length and width of the first radiation patch 101 and the second radiation patch 102 correspond to the working frequency of the microstrip receiving antenna, thereby making the infinite electromagnetic wave frequency received by the first radiation patch 101 and the second radiation patch 102 belong to the working frequency band of the receiving antenna, that is, the millimeter wave high frequency band.
[0053] A coupling slot 103 is provided on the second microwave board in the receiving multi-layer microwave board and is located within the projection range of the first radiation patch 101 and the second radiation patch 102 on the second microwave board;
[0054] A feeding strip line 104 is provided on a third microwave board in the receiving multi-layer microwave board and connected to the coupling slot 103;
[0055] A bottom layer microstrip feed line 105 is arranged on the outer surface of a fourth microwave board which is located at the outermost side of the receiving multi-layer microwave board, and the fourth microwave board is different from the first microwave board;
[0056] The first signal hole 106 is disposed in the receiving multi-layer microwave board and connects the feeding strip line 104 and the bottom microstrip feeding line 105 .
[0057] In actual operation, the high-frequency millimeter wave signal can be received by the first radiation patch 101 and the second radiation patch 102, and then the signal is coupled to the feeding strip line 104 through the coupling slot 103, and then transmitted to the bottom microstrip feed line 105 through the first signal hole 106, and finally transmitted to the subsequent circuit by the bottom microstrip feed line 105. At the same time, the receiving antenna in the embodiment of the present application does not have a radio frequency processing chip on the surface of the microwave board where the radiation patch is located, thereby reducing the overall cross-sectional area of the antenna, which has the technical effect of making the millimeter wave high-frequency band microstrip antenna more miniaturized.
[0058] Furthermore, the receiving antenna in the embodiment of the present application further includes:
[0059] At least two first metal layers 1071, wherein the first metal layers 1071 are arranged on the surface of the inner microwave board of the receiving multi-layer microwave board for grounding;
[0060] The first grounding hole 1072 is disposed in the receiving multi-layer microwave board and connects two first metal ground layers 1071 .
[0061] That is to say, the first metal ground layer 1071 in the embodiment of the present application can be two layers or more, and the first grounding holes 1072 can also be one or more. Each first grounding hole 1072 connects two layers of the first metal ground layers 1071. As for which two layers of the first metal ground layers 1071 each first grounding hole 1072 is connected to, the user can set it according to needs, thereby improving the applicability and scalability of the receiving antenna in the embodiment of the present application.
[0062] Furthermore, the receiving antenna also includes:
[0063] At least two first shielding holes 108 are disposed in the receiving multi-layer microwave board and surround the feeding strip line 104 , wherein the at least two first shielding holes 108 form a first shielding cavity.
[0064] It should be noted that the first shielding holes 108 can be arranged in the microwave board where the feeding stripline 104 is located, or in two layers of microwave boards adjacent to the feeding stripline 104, as long as they are located to surround the feeding stripline 104. At the same time, the microwave board closest to the feeding stripline 104 can enclose the first shielding cavity with the first shielding holes 108.
[0065] In the technical solution of the embodiment of the present application, a resonance point different from that formed by the first radiation patch 101 and the second radiation patch 102 can be formed through the first shielding cavity, thereby further widening the bandwidth of the receiving antenna; at the same time, the first shielding cavity also has the function of reducing the coupling influence between antenna array elements, and can avoid the degradation of antenna array surface performance caused by strong coupling. Therefore, the technical solution in the embodiment of the present application also has the technical effect of further improving the antenna communication performance.
[0066] Furthermore, the axes of the first signal hole 106, the first grounding hole 1072, and the first shielding hole 108 are parallel, thereby forming a quasi-coaxial structure to achieve the transmission function of the radio frequency signal. Moreover, in the technical solution in the embodiment of the present application, the relative distance between the first grounding hole 1072 and the first signal hole 106 is a preset distance, thereby making the impedance of the quasi-coaxial structure a preset impedance, thereby further improving the communication performance and applicability of the receiving antenna. Moreover, the axes of the first signal hole 106, the first grounding hole 1072, and the first shielding hole 108 are perpendicular to the board surface of the receiving multi-layer microwave board, thereby making the actual space volume of the first signal hole 106, the first grounding hole 1072, and the first shielding hole 108 minimized, which can save processing and production raw materials on the one hand, and reduce the difficulty of processing and production on the other hand.
[0067] Furthermore, the number of the first radiation patches 101 and the second radiation patches 102 is an even number, wherein the first radiation patches 101 and the second radiation patches 102 are symmetrically arranged with respect to the same straight line.
[0068] The same straight line may be any straight line on the radiation patch, for example, a center line, a diagonal line, a vertical line on the surface where the radiation patch is located, or even a line on the first radiation patch 101 or the second radiation patch 102, etc. Of course, the first radiation patch 101 and the second radiation patch 102 may also be symmetrically arranged with respect to multiple straight lines at the same time, thereby forming antenna magnetic fields of different modes to meet different needs.
[0069] In the embodiment of the present application, the number of the first radiation patches 101 is four, the number of the second radiation patches 102 is two, the first radiation patches 101 and the second radiation patches 102 are not only symmetrical with respect to a center line of the radiation patches, but the second radiation patches 102 are also symmetrical with respect to the center line where the two first radiation patches 101 are located. Of course, other similar settings can be used in actual operation, and the technical solutions of the embodiment of the present application are not further limited.
[0070] Embodiment 2
[0071] Please refer to Figure 3 , Figure 4 , Embodiment 2 of the present application provides a multilayer microstrip transmitting antenna comprising:
[0072] Launching multi-layer microwave panels;
[0073] The upper radiation patch 201 is arranged on the outer surface of the first outermost layer of the multi-layer microwave emitting board;
[0074] The lower radiation patch 202 is arranged on the second layer of the transmitting multi-layer microwave board, and the upper radiation patch 201 is located within the projection range of the lower radiation patch 202 on the first layer; it should be noted that the number of the upper radiation patch 201 and the lower radiation patch 202 can be one or more. In the embodiment of the present application, the lower radiation patch 202 is a whole lower radiation patch 202 formed by piecing together multiple radiation patches. Two different resonant frequencies can be formed by setting the upper radiation patch 201 and the lower radiation patch 202, thereby widening the bandwidth of the microstrip transmitting antenna.
[0075] A bottom microstrip 203 is arranged on the outer surface of the third layer of the transmitting multi-layer microwave board, which is located at the outermost side, and the third layer is different from the first layer;
[0076] The second signal hole 204 is disposed in the transmitting multi-layer microwave board and connects the lower radiation patch 202 and the bottom microstrip 203 .
[0077] In actual operation, the RF signal can be input from the bottom microstrip 203, and transmitted to the lower radiation patch 202 through the second signal hole 204, and then radiated to the upper radiation patch 201 through the lower radiation patch 202, and finally radiated to the external space through the upper radiation patch 201. Similar to the receiving antenna in the first embodiment, the transmitting antenna in the embodiment of the present application will not be provided with a RF processing chip on the surface of the microwave board where the radiation patch is located, which can also reduce the overall cross-sectional area of the antenna, and has the technical effect of making the millimeter-wave high-frequency band microstrip antenna more miniaturized.
[0078] Furthermore, the transmitting antenna further comprises:
[0079] At least two layers of second metal ground layers 2051, wherein the second metal ground layers 2051 are arranged on the surface of the inner microwave board of the multi-layer microwave emitting board for grounding;
[0080] The second grounding hole 2052 is arranged in the transmitting multi-layer microwave board and connects two layers of the second metal ground layer 2051 .
[0081] Similarly, the second metal ground layer 2051 in the embodiment of the present application can also be two layers or more, and the second grounding holes 2052 can also be one or more. Each second grounding hole 2052 connects two layers of the second metal ground layers 2051. As for which two layers of the second metal ground layers 2051 each second grounding hole 2052 is connected to, the user can set it according to needs, thereby improving the applicability and scalability of the receiving antenna in the embodiment of the present application.
[0082] Furthermore, the axes of the second signal hole 204 and the second grounding hole 2052 are parallel, and the axes are perpendicular to the board surface of the transmitting multilayer microwave board. Similar to the receiving antenna in Example 1, the axes of the second signal hole 204 and the second grounding hole 2052 are parallel, thereby forming a quasi-coaxial structure to achieve the transmission function of the radio frequency signal. Moreover, in the technical solution in the embodiment of the present application, the relative distance between the second grounding hole 2052 and the second signal hole 204 is a predetermined distance, thereby making the impedance of the quasi-coaxial structure in the transmitting antenna a predetermined impedance, thereby further improving the communication performance and applicability of the transmitting antenna.
[0083] Furthermore, the upper radiation patch 201 is rectangular, and when the number of the upper radiation patches 201 is at least two, the at least two upper radiation patches 201 are arranged in a straight line.
[0084] Embodiment 3
[0085] Please refer to Figure 5 , Figure 6 Embodiment 3 of the present application provides a vehicle-mounted phased array transceiver antenna, including:
[0086] The receiving array surface 301 composed of receiving antennas as described in the first embodiment, wherein the receiving multi-layer microwave boards of all receiving antennas in the receiving array surface 301 are the same first multi-layer microwave board;
[0087] The transmitting array surface 302 composed of transmitting antennas as described in the second embodiment, wherein the transmitting multi-layer microwave boards of all transmitting antennas in the transmitting array surface 302 are the same second multi-layer microwave board;
[0088] Among them, all the first radiation patches 101 and the second radiation patches 102 in the receiving array face 301 and all the upper radiation patches 201 in the transmitting array face 302 are located on the same surface of the same microwave layer board, all the feeding strip lines 104 in the receiving array face 301 and all the lower radiation patches 202 in the transmitting array face 302 are located on the same surface of the same microwave layer board; all the bottom layer microstrip feed lines 105 in the receiving array face 301 and all the bottom layer microstrips 203 in the transmitting array face 302 are located on the same surface of the same microwave layer board; and the first multi-layer microwave board and the second multi-layer microwave board have the same thickness.
[0089] Through the above-mentioned arrangement, the receiving antenna and transmitting antenna of the vehicle-mounted phased array transceiver antenna product in the embodiment of the present application can be compatible, so that the design and production of the overall transceiver antenna can be completed under the conditions of minimum production cost and product space volume.
[0090] Further, in the embodiment of the present application, the array structure of the multilayer microstrip receiving antenna in the receiving array plane 301 is as follows: Figure 6 The sparse array structure shown ( Figure 6 All the small squares in the figure are the multilayer microstrip receiving antennas in the first embodiment), that is, Figure 2 The multilayer microstrip receiving antenna in the Figure 6 The sparse array structure in the receiving antenna subarray is formed, and then Figure 6 The receiving antenna subarray in Figure 5 The receiving array 301 in the embodiment can greatly save the array layout space and is conducive to the arrangement of the back chip; and the array structure of the multilayer microstrip transmitting antenna can be a sequential arrangement structure, so that the arrangement of the upper radiation patch 201 is also as follows Figure 5 The linear transmitting array face 302 is shown. This arrangement can make the antenna array face structure more regular, which is convenient for design and chip layout; at the same time, multiple multilayer microstrip receiving antennas and multilayer microstrip transmitting antennas in the embodiments of the present application can be further arranged in an array, so that the high sidelobe problem caused by the regular array arrangement can be solved by full array amplitude phase weighting, so that the vehicle-mounted phased array antenna can realize phased array two-dimensional scanning, and further realize the radar imaging function.
[0091] It can be seen that the technical solution in the embodiment of the present application is to arrange rectangular first radiation patches and second radiation patches of different sizes on the outermost surface of the multilayer microwave board, design coupling gaps and feeding strip lines in the board, arrange bottom microstrip feed lines on the other outer surface, and arrange a first signal hole connecting the feeding strip lines and the bottom microstrip feed lines in the board to obtain a microstrip receiving antenna; an upper radiation patch is arranged on the outermost surface of the multilayer microwave board, a lower radiation patch that can cover the upper radiation patch is arranged in the board, and a bottom microstrip is arranged on the other outer surface, and a second signal hole connecting the lower radiation patch and the bottom microstrip is arranged in the board to obtain a microstrip transmitting antenna. The microstrip transmitting antenna and the microstrip receiving antenna are installed on the same multilayer microwave board to obtain a vehicle-mounted phased array transceiver antenna. The antenna operates in the high frequency band of millimeter waves, has both miniaturization and two-dimensional imaging functions, and has the technical effect of improving the scanning accuracy of vehicle-mounted phased array radars.
[0092] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.
[0093] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Furthermore, the various method steps in the technical solution of the present application can be reversed and the order can be changed while still falling within the scope of the invention covered by the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.
Claims
1. A vehicle-mounted phased array transceiver antenna, characterized in that: include: A receiving array plane composed of receiving antennas, wherein the receiving multi-layer microwave boards of all the receiving antennas in the receiving array plane are the same first multi-layer microwave board; The receiving antenna comprises: a receiving multi-layer microwave board; a first radiation patch and a second radiation patch, which are arranged on the outer surface of the first microwave board which is at the outermost side of the receiving multi-layer microwave board, the first radiation patch and the second radiation patch are rectangular, and the sizes of the first radiation patch and the second radiation patch are different; a coupling slot, which is arranged on the second microwave board in the receiving multi-layer microwave board and is located within the projection range of the first radiation patch and the second radiation patch in the second microwave board; a feeding strip line, which is arranged on the third microwave board in the receiving multi-layer microwave board and is connected to the coupling slot; a bottom layer microstrip feed line, which is arranged on the outer surface of the fourth microwave board which is at the outermost side of the receiving multi-layer microwave board, and the fourth microwave board is different from the first microwave board; a first signal hole, which is arranged in the receiving multi-layer microwave board and connects the feeding strip line and the bottom layer microstrip feed line; An emitting array plane composed of emitting antennas, wherein the emitting multilayer microwave boards of all emitting antennas in the emitting array plane are the same second multilayer microwave board; the emitting antenna comprises: an emitting multilayer microwave board; an upper radiation patch, arranged on the outer surface of a first layer of the emitting multilayer microwave board at the outermost layer; a lower radiation patch, arranged on the second layer of the emitting multilayer microwave board, wherein the upper radiation patch is located within the projection range of the lower radiation patch within the first layer; a bottom layer microstrip, arranged on the outer surface of a third layer of the emitting multilayer microwave board at the outermost layer, wherein the third layer is different from the first layer; a second signal hole, arranged in the emitting multilayer microwave board, and connecting the lower radiation patch and the bottom layer microstrip; Among them, all the first radiation patches and the second radiation patches in the receiving array plane and all the upper radiation patches in the transmitting array plane are located on the same surface of the same microwave layer board, all the feeding strip lines in the receiving array plane and all the lower radiation patches in the transmitting array plane are located on the same surface of the same microwave layer board; all the bottom layer microstrip feed lines in the receiving array plane and all the bottom layer microstrips in the transmitting array plane are located on the same surface of the same microwave layer board; and the thickness of the first multi-layer microwave board and the second multi-layer microwave board are the same.
2. The phased array transceiver antenna according to claim 1, characterized in that: The array structure of the first radiation patch, the second radiation patch, and the upper radiation patch is a sparse array structure.
Citation Information
Patent Citations
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