Drive control integrated device and air conditioner

Abstract

The present invention provides a drive control integrated device and an air conditioner, wherein the drive control integrated device comprises: a substrate, on which a rectifier, a power factor corrector, a motor drive component of a fan and a motor drive component of a compressor are sequentially integrated along the direction of the first edge of the substrate; the motor drive component comprises: a driver, the driver is configured to receive a drive control signal sent by a processor and generate a pulse modulation signal according to the drive control signal; an inverter, the input end of the inverter is connected to the output end of the driver, the inverter is configured to drive the motor to operate according to the pulse modulation signal, wherein the inverter is connected across the high-voltage bus and the low-voltage bus. The drive control integrated device provided by the present invention improves the integration, electromagnetic interference and anti-interference capabilities, power density and heat dissipation performance of the drive control integrated device, and comprehensively improves the reliability of the drive control integrated device.

Description

Technical Field

[0001] The present invention relates to the technical field of drive control, and more specifically, to a drive control integrated device and an air conditioner. Background Art

[0002] Household variable frequency air conditioners usually have an outdoor unit and an indoor unit. The drive controller of the outdoor unit and the drive controller of the indoor unit are respectively set outdoors and indoors. They basically adopt a discrete combination solution of "rectifier power devices, power factor corrector, compressor inverter and fan inverter, etc.". This solution has the disadvantages of high cost, large area of ​​electric control board, numerous electrical installation processes, low reliability, high labor cost and low assembly efficiency.

[0003] In the related art, the driving devices of household variable frequency air conditioners are constantly developing in the direction of integration. However, the main technical problems of integrated driving control devices include large electromagnetic interference, difficult packaging and complex wiring.

[0004] In addition, any discussion of background technology throughout the specification does not mean that the background technology is necessarily the prior art known to technicians in the relevant field, and any discussion of prior art throughout the specification does not mean that the prior art is necessarily widely known or necessarily constitutes common knowledge in the field. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0006] To this end, an object of a first aspect of the present invention is to provide a drive control integrated device.

[0007] Another aspect of the present invention is to provide an air conditioner.

[0008] To achieve the above-mentioned purpose, a technical solution of one aspect of the present invention provides a drive control integrated device, which is externally connected to a processor, and comprises: a substrate, on which a rectifier, a power factor corrector, a motor drive component of a fan and a motor drive component of a compressor are sequentially integrated along the direction of the first edge of the substrate; the motor drive component comprises: a driver, which is configured to receive a drive control signal sent by the processor and generate a pulse modulation signal according to the drive control signal; an inverter, whose input end is connected to the output end of the driver, and the inverter is configured to drive the motor to operate according to the pulse modulation signal, wherein the inverter is connected across the high-voltage bus and the low-voltage bus, the input end of the motor is connected to the output end of the inverter via the pins of the first edge, and the processor is connected to the driver via the pins of the second edge of the substrate.

[0009] The drive control integrated device provided by the above technical solution of the present invention has a rectifier, a power factor corrector, a motor drive assembly of a fan and a motor drive assembly of a compressor integrated on the substrate in sequence along the direction of the first edge of the substrate. The power factor corrector, the motor drive assembly of the fan and the motor drive assembly of the compressor are controlled by an external processor. The drive control integrated device is easy to assemble in electrical equipment, especially a split-type air conditioner. The outdoor unit electrical control board and the indoor unit electrical control board are integrated into the same drive control integrated device, which simplifies the complexity of equipment assembly and the difficulty of maintenance, and is also conducive to further improving the thermal stability, anti-interference characteristics and integration of the drive control integrated device. At the same time, it is conducive to reducing the layout area and volume of the drive control integrated device.

[0010] Specifically, each motor drive component includes a driver and an inverter, etc. Since the heat dissipation of the rectifier is lower than the heat dissipation of the power factor corrector, and the heat dissipation of the power factor corrector is lower than the heat dissipation of the motor drive component of the fan, and the heat dissipation of the motor drive component of the fan is lower than the heat dissipation of the motor drive component of the compressor, especially the motor drive component of the compressor is arranged close to the edge of the substrate, which is conducive to further improving the heat dissipation efficiency of the substrate. The above-mentioned drive control integrated device is conducive to improving the heat dissipation effect of the substrate, which not only realizes the high integration of the drive control integrated device, but also improves the power density and reliability. In addition, it is conducive to improving the miniaturization and production cost of the drive control integrated device.

[0011] In addition, the drive control integrated device provided by the above technical solution of the present invention also has the following additional technical features:

[0012] In one embodiment, the motor drive assembly of the fan is recorded as a fan drive assembly, and the motor drive assembly of the compressor is recorded as a compressor drive assembly. The driver of the fan drive assembly and the driver of the compressor drive assembly are integrated into the same driver chip, or the driver of the fan drive assembly and the driver of the compressor drive assembly are arranged in two separate driver chips.

[0013] In one embodiment, the first edge and the second edge are parallel opposite sides of the substrate, the heat dissipation of the fan drive assembly is less than the heat dissipation of the compressor drive assembly, and the heat dissipation of the power factor corrector is greater than the heat dissipation of the rectifier.

[0014] In one embodiment, the pin diameter of the driver of the fan drive assembly ranges from 0.3 mm to 1.5 mm, or the pin diameter of the driver of the compressor drive assembly ranges from 0.5 mm to 2 mm.

[0015] In one embodiment, the pins of the motor drive assembly are plugged and / or soldered onto the substrate.

[0016] In one embodiment, the drive control integrated device also includes: a rectifier, the rectifier includes four switch bridge arms, each switch bridge arm is provided with a switch tube, and the power supply signal is input to the rectifier through an external pin, wherein the rectifier is configured to convert the power supply signal into a bus signal and load the bus signal to the high-voltage bus and the low-voltage bus.

[0017] In the above embodiments, the power supply signal is converted into a bus signal after being processed by a rectifier. The rectifier can be a bridge diode circuit, that is, a diode is arranged in the bridge arm, or the rectifier can be a totem pole rectifier, that is, a power tube is arranged in the bridge arm, which can further reduce the power consumption and electromagnetic interference signal of the totem pole rectifier. The rectifier is configured to convert the AC signal into a DC signal.

[0018] In one embodiment, the drive control integrated device is connected to the inductive element through an external pin, the first end of the inductive element is connected to the high-voltage bus, the drive control integrated device also includes: a power factor corrector, which is controlled by the driver, and the power factor corrector includes: a power tube, the control end of the power tube is connected to the output pin of the driver, the first end of the power tube is connected to the ground wire, the second end of the power tube is connected to the second end of the inductive element via the pin of the first edge, the first end of the inductive element is connected to the high-voltage bus via the pin of the second edge, and the pulse modulation signal is configured to control the power tube to be turned on or off; a first unidirectional conductive element is connected between the second end of the power tube and the input end of the inverter.

[0019] In the above embodiment, a power factor corrector is provided including a power tube, a first unidirectional conducting element and an inductive element, wherein the inductive element is connected to the outside of the substrate. On the one hand, the power factor corrector provides the inverter with the required adjustable DC bus voltage, and on the other hand, the power factor corrector adjusts the power factor of the entire machine operation.

[0020] Among them, since the volume of the inductive element is large and the fluctuation signal generated by the inductive element is large, therefore, by placing the inductive element outside the substrate, on the one hand, it is beneficial to optimize the volume, layout and integration of the substrate, on the other hand, it is beneficial to reduce the electromagnetic interference signal on the substrate, and on the other hand, if the inductive element fails, it is also convenient for maintenance and replacement.

[0021] In one embodiment, the driving control integrated device further includes: a second unidirectional conducting element connected between the first end of the power tube and the second end of the power tube.

[0022] In one embodiment, after the second end of the power tube is connected to the first unidirectional conductive element, it is connected to the second end of the capacitive element through the pin of the first edge, and the first end of the capacitive element is connected to the ground line. The capacitive element is configured to filter out ripple signals and / or surge signals flowing through the high-voltage bus.

[0023] In the above embodiment, the capacitive element is configured to filter out ripple signals and / or surge signals, and load the filtered bus signal to the inverter and the load. Similarly, due to the large volume and fluctuation signal of the capacitive element, the drive control integrated device is connected to the capacitive element through an external pin to further reduce the volume and electromagnetic interference signal of the drive control integrated device.

[0024] In one embodiment, the inverter includes: at least two half-bridge circuits connected in parallel, the half-bridge circuits are connected across a high-voltage bus and a low-voltage bus, the half-bridge circuits include: two switching tubes connected in series, the control end of the switching tube is connected to the output pin of the driver, and the pulse modulation signal is configured to control the two switching tubes in series to be alternately turned on.

[0025] In the above embodiment, the inverter is arranged to include at least two half-bridge circuits connected in parallel, and the control end of the switch tube is connected to the output pin of the driver, that is, the switch tube is also controlled by the driver, and the bus signal is converted into an AC signal AC and loaded to the load, thereby further improving the reliability and integration of the drive control integrated device.

[0026] In one embodiment, the switch tube is a metal oxide semiconductor field effect transistor or an insulated gate bipolar transistor, wherein the gate of the metal oxide semiconductor field effect transistor is the control terminal, a reverse freewheeling diode is connected between the source and the drain of the metal oxide semiconductor field effect transistor, the base of the insulated gate bipolar transistor is the control terminal, and a reverse freewheeling diode is connected between the emitter and the collector of the insulated gate bipolar transistor.

[0027] In one embodiment, the metal oxide semiconductor field effect transistor includes at least one of a silicon metal oxide semiconductor field effect transistor, a silicon carbide metal oxide semiconductor field effect transistor and a gallium nitride metal oxide semiconductor field effect transistor.

[0028] In one embodiment, an overcurrent detection pin of a driver is connected to a second pin of a detection resistor via a pin at a first edge, a first pin of the detection resistor is connected to a ground terminal of an inverter, and the driver feeds back an overcurrent signal generated by the detection resistor to a processor, wherein the first pin and the second pin are arranged adjacent to each other, wherein the processor outputs a drive control signal in response to the overcurrent signal to cut off the inverter and / or the power factor corrector.

[0029] In the above embodiment, a detection resistor is arranged on the outside of the substrate and connected to the processor through an external pin. On the one hand, the detection resistor sends an overcurrent signal to the processor so that the processor can control the switch tube to be cut off, thereby improving the reliability of the rectifier, power factor corrector and inverter. On the other hand, the detection resistor is a thermistor and the heat generation varies significantly. Setting the detection resistor on the outside of the substrate can reduce the heat dissipation on the substrate, thereby further improving the thermal stability, reliability, electromagnetic interference and anti-interference performance of the drive control integrated device.

[0030] In one embodiment, the drive control integrated device also includes: a temperature detection resistor, which is arranged on the substrate, the first end of the temperature detection resistor is connected to the driver, and the second end of the temperature detection resistor is connected to the processor via a pin on the second edge, wherein the resistance value of the temperature detection resistor is positively correlated or negatively correlated with the temperature of the substrate.

[0031] In the above embodiment, a temperature detection resistor is set on the substrate, and the temperature detection resistor sends the temperature of the substrate to the processor. In particular, when it is detected that the temperature on the substrate is too high, the processor is triggered to control any heating component in the rectifier, power factor corrector and inverter to stop working, so as to avoid burning of electronic devices, thereby further improving the reliability and thermal stability of the drive control integrated device.

[0032] In one embodiment, the diameter of the pins of the rectifier ranges from 0.5 mm to 2 mm.

[0033] In one embodiment, the pin diameter of the power factor corrector ranges from 0.5 mm to 2 mm.

[0034] In one embodiment, the long side of the substrate is less than 100 mm, or the short side of the substrate is less than 50 mm, or the thickness of the substrate is less than 10 mm.

[0035] The technical solution of the second aspect of the present invention provides an air conditioner, comprising: an indoor unit, the indoor unit is provided with an indoor fan; an outdoor unit, the outdoor unit is provided with a compressor and / or an outdoor fan; a drive control integrated device such as any of the above technical solutions, the external pins of the drive control integrated device are connected to the indoor unit and / or the outdoor unit, and the drive control integrated device is configured to control the operation of at least one load among the indoor fan, the compressor and the outdoor fan.

[0036] Additional aspects and advantages of the present invention will become apparent from the following description or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0038] Figure 1 is a schematic diagram of a drive control integrated device disclosed in an embodiment of the present invention;

[0039] Figure 2 is a schematic diagram of a drive control integrated device disclosed in another embodiment of the present invention;

[0040] Figure 3 is a schematic diagram of a drive control integrated device disclosed in another embodiment of the present invention;

[0041] Figure 4 It is a schematic diagram of a drive control integrated device disclosed in another embodiment of the present invention. DETAILED DESCRIPTION

[0042] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0043] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0044] The drive control integrated device and the air conditioner according to the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0045] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a drive control integrated device provided according to some embodiments of the present invention includes: a substrate, on which a rectifier, a power factor corrector, a motor drive component of a fan and a motor drive component of a compressor are integrated in sequence along the direction of the first edge of the substrate; the motor drive component includes: a driver, the driver is configured to receive a drive control signal sent by a processor MCU, and generate a pulse modulation signal according to the drive control signal; an inverter, the input end of the inverter is connected to the output end of the driver, and the inverter is configured to drive the motor to operate according to the pulse modulation signal, wherein the inverter is connected across the high-voltage bus and the low-voltage bus, the input end of the motor is connected to the output end of the inverter via the pins of the first edge, and the processor MCU is connected to the driver via the pins of the second edge of the substrate.

[0046] The drive control integrated device provided by the above technical solution of the present invention has a rectifier, a power factor corrector, a motor drive component of a fan and a motor drive component of a compressor integrated thereon in sequence along the direction of the first edge of the substrate. The power factor corrector, the motor drive component of the fan and the motor drive component of the compressor are controlled by an external processor MCU. The drive control integrated device is convenient for assembly in electrical equipment, especially a split-type air conditioner. The external machine electric control board and the internal machine electric control board are integrated into the same drive control integrated device, which simplifies the complexity of equipment assembly and the difficulty of maintenance, and is also conducive to further improving the thermal stability, anti-interference characteristics and integration of the drive control integrated device. At the same time, it is conducive to reducing the layout area and volume of the drive control integrated device.

[0047] Specifically, each motor drive component includes a driver and an inverter, etc. Since the heat dissipation of the rectifier is lower than the heat dissipation of the power factor corrector, and the heat dissipation of the power factor corrector is lower than the heat dissipation of the motor drive component of the fan, and the heat dissipation of the motor drive component of the fan is lower than the heat dissipation of the motor drive component of the compressor, especially the motor drive component of the compressor is arranged close to the edge of the substrate, which is conducive to further improving the heat dissipation efficiency of the substrate. The above-mentioned drive control integrated device is conducive to improving the heat dissipation effect of the substrate, which not only realizes the high integration of the drive control integrated device, but also improves the power density and reliability. In addition, it is conducive to improving the miniaturization and production cost of the drive control integrated device.

[0048] In addition, the drive control integrated device provided by the above technical solution of the present invention also has the following additional technical features:

[0049] In one embodiment, the motor drive assembly of the fan is recorded as a fan drive assembly, and the motor drive assembly of the compressor is recorded as a compressor drive assembly. The driver of the fan drive assembly and the driver of the compressor drive assembly are integrated into the same driver chip, or the driver of the fan drive assembly and the driver of the compressor drive assembly are arranged in two separate driver chips.

[0050] In one embodiment, the first edge and the second edge are parallel opposite sides of the substrate, the heat dissipation of the fan drive assembly is less than the heat dissipation of the compressor drive assembly, and the heat dissipation of the power factor corrector is greater than the heat dissipation of the rectifier.

[0051] In one embodiment, Figure 3 As shown, the driver of the fan drive assembly and the driver of the compressor drive assembly are integrated into the same driver chip, or as shown in Figure 4 As shown, the driver of the fan drive assembly and the driver of the compressor drive assembly are arranged in two separate driver chips.

[0052] In one embodiment, the rectifier is arranged in area 102 of the substrate, the power factor corrector is arranged in area 104 of the substrate, the compressor drive assembly is arranged in area 108 of the substrate, and the fan drive assembly is arranged in area 106 of the substrate.

[0053] In one embodiment, the pin diameter of the driver of the fan drive assembly ranges from 0.3 mm to 1.5 mm, or the pin diameter of the driver of the compressor drive assembly ranges from 0.5 mm to 2 mm.

[0054] In one embodiment, the pins of the motor drive assembly are plugged and / or soldered onto the substrate.

[0055] In one embodiment, the drive control integrated device also includes: a rectifier, the rectifier includes four switch bridge arms, each switch bridge arm is provided with a switch tube, and the power supply signal is input to the rectifier through an external pin, wherein the rectifier is configured to convert the power supply signal into a bus signal and load the bus signal to the high-voltage bus and the low-voltage bus.

[0056] In the above embodiments, the power supply signal is converted into a bus signal after being processed by a rectifier. The rectifier may be a bridge diode circuit, i.e., a diode is provided in the bridge arm, or the rectifier may be a totem pole rectifier, i.e., a power tube is provided in the bridge arm, which can further reduce the power consumption and electromagnetic interference signal of the totem pole rectifier. The rectifier is configured to convert the AC signal AC into a DC signal.

[0057] In one embodiment, the drive control integrated device is connected to the inductive element L through an external pin, and the first end of the inductive element L is connected to the high-voltage bus. The drive control integrated device also includes: a power factor corrector, which is controlled by a driver. The power factor corrector includes: a power tube, the control end of the power tube is connected to the output pin of the driver, the first end of the power tube is connected to the ground wire, the second end of the power tube is connected to the second end of the inductive element L via the pin of the first edge, the first end of the inductive element L is connected to the high-voltage bus via the pin of the second edge, and the pulse modulation signal is configured to control the power tube to be turned on or off; a first unidirectional conductive element is connected between the second end of the power tube and the input end of the inverter.

[0058] In the above embodiment, a power factor corrector is provided including a power tube, a first unidirectional conducting element and an inductive element L, wherein the inductive element L is connected to the outside of the substrate. On the one hand, the power factor corrector provides the inverter with the required adjustable DC bus voltage, and on the other hand, the power factor corrector adjusts the power factor of the whole machine operation.

[0059] Among them, since the volume of the inductive element L is large and the fluctuation signal generated by the inductive element L is large, therefore, by arranging the inductive element L outside the substrate, on the one hand, it is beneficial to optimize the volume, layout and integration of the substrate, on the other hand, it is beneficial to reduce the electromagnetic interference signal on the substrate, and on the other hand, if the inductive element L fails, it is also convenient for maintenance and replacement.

[0060] In one embodiment, the driving control integrated device further includes: a second unidirectional conducting element connected between the first end of the power tube and the second end of the power tube.

[0061] In one embodiment, the second end of the power tube is connected to the first unidirectional conductive element and then connected to the capacitive element C through the pin of the first edge. 1 The second end of the capacitive element C 1 The first end of the capacitive element C is connected to the ground line. 1 The system is configured to filter out ripple signals and / or surge signals flowing through the high voltage bus.

[0062] In the above embodiment, the capacitive element C 1 is configured to filter out ripple signals and / or surge signals and to apply the filtered bus signal to the inverter and the load. Similarly, due to the capacitive element C 1 The volume and fluctuation signal are large, so the drive control integrated device is connected to the capacitive element C through an external pin. 1 , in order to further reduce the volume and electromagnetic interference signal of the drive control integrated device.

[0063] In one embodiment, the inverter includes: at least two half-bridge circuits connected in parallel, the half-bridge circuits are connected across a high-voltage bus and a low-voltage bus, the half-bridge circuits include: two switching tubes connected in series, the control end of the switching tube is connected to the output pin of the driver, and the pulse modulation signal is configured to control the two switching tubes in series to be alternately turned on.

[0064] In the above embodiment, the inverter is arranged to include at least two half-bridge circuits connected in parallel, and the control end of the switch tube is connected to the output pin of the driver, that is, the switch tube is also controlled by the driver, and the bus signal is converted into an AC signal AC and loaded to the load, thereby further improving the reliability and integration of the drive control integrated device.

[0065] In one embodiment, the switch tube is a metal oxide semiconductor field effect transistor or an insulated gate bipolar transistor, wherein the gate of the metal oxide semiconductor field effect transistor is the control terminal, a reverse freewheeling diode is connected between the source and the drain of the metal oxide semiconductor field effect transistor, the base of the insulated gate bipolar transistor is the control terminal, a reverse freewheeling diode is connected between the emitter and the collector of the insulated gate bipolar transistor, and the insulated gate bipolar transistor is an insulated gate bipolar translator, hereinafter referred to as IGBT.

[0066] In one embodiment, the metal oxide semiconductor field effect transistor includes at least one of a silicon metal oxide semiconductor field effect transistor, a silicon carbide metal oxide semiconductor field effect transistor and a gallium nitride metal oxide semiconductor field effect transistor.

[0067] In one embodiment, an overcurrent detection pin of a driver is connected to a second pin of a detection resistor via a pin at a first edge, a first pin of the detection resistor is connected to a ground terminal of an inverter, and the driver feeds back an overcurrent signal generated by the detection resistor to a processor MCU, wherein the first pin and the second pin are arranged adjacent to each other, wherein the processor MCU outputs a drive control signal in response to the overcurrent signal to cut off the inverter and / or the power factor corrector.

[0068] In the above embodiment, a detection resistor is arranged on the outside of the substrate and connected to the processor MCU through an external pin. On the one hand, the detection resistor sends an overcurrent signal to the processor MCU so that the processor MCU can control the switch tube to be cut off, thereby improving the reliability of the rectifier, power factor corrector and inverter. On the other hand, the detection resistor is a thermistor and the heat generation changes significantly. Setting the detection resistor on the outside of the substrate can reduce the heat dissipation on the substrate, thereby further improving the thermal stability, reliability, electromagnetic interference and anti-interference performance of the drive control integrated device.

[0069] In one embodiment, the drive control integrated device also includes: a temperature detection resistor, which is arranged on a substrate, wherein a first end of the temperature detection resistor is connected to a driver, and a second end of the temperature detection resistor is connected to a processor MCU via an external pin, wherein the resistance value of the temperature detection resistor is positively correlated or negatively correlated with the temperature of the substrate.

[0070] In the above embodiment, a temperature detection resistor is set on the substrate, and the temperature detection resistor sends the temperature of the substrate to the processor MCU. In particular, when it is detected that the temperature on the substrate is too high, the processor MCU is triggered to control any heating component in the rectifier, power factor corrector and inverter to stop working, so as to avoid burning of electronic devices, thereby further improving the reliability and thermal stability of the drive control integrated device. The temperature detection resistor is usually an NTC (Negative Temperature Coefficient) resistor or a PTC (Positive Temperature Coefficient) resistor.

[0071] In one embodiment, the diameter of the pins of the rectifier ranges from 0.5 mm to 2 mm.

[0072] In one embodiment, the pin diameter of the power factor corrector ranges from 0.5 mm to 2 mm.

[0073] In one embodiment, the long side of the substrate is less than 100 mm, or the short side of the substrate is less than 50 mm, or the thickness of the substrate is less than 10 mm.

[0074] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown in Table 1, the substrate of the drive control integrated device of the present invention carries a rectifier, a power factor corrector, a fan M 1 Drive components and compressor M 2 The specific implementation of the driving component is as follows:

[0075] The output of the rectifier is connected to the power factor corrector, and the output of the power factor corrector is connected to the fan M 1 Drive components and compressor M 2 Drive components, fan M 1 Drive components and compressor M 2 The driving components are connected in parallel.

[0076] The rectifier is a full-bridge rectifier consisting of four diodes.

[0077] The power factor corrector includes a BOOST boost type PFC (Power Factor Correction) circuit consisting of an insulated gate bipolar transistor, a freewheeling diode anti-parallel connected with the insulated gate bipolar transistor, and a fast recovery diode.

[0078] Fan M 1 The driver comprises an inverter 1 and a driver 1 . The inverter 1 comprises six insulated gate bipolar transistors and a fast recovery diode connected in parallel with the power transistor.

[0079] Compressor M 2 The driver comprises an inverter 2 and a driver 2, wherein the inverter 2 comprises six insulated gate bipolar transistors and a fast recovery diode connected in parallel with the power transistor.

[0080] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown in the figure, the external wiring signal flow defined by the base pin arrangement is:

[0081] The AC power supply AC is input from pins 2 and 3, and a half-wave positive voltage is output from pin 1 through the positive end of the internal rectifier. It is input from pin 43 after being connected in series with the inductor L connected to the substrate. The first path is output from pin 42 after passing through the power factor corrector inside the substrate and connected to the external large electrolytic capacitor C. 1 After charging and smoothing to obtain the DC bus voltage, a branch is connected from pin 42 to the fan M 1 The drive circuit is powered by the second branch from pin 26 to the compressor M 2 The drive circuit is powered.

[0082] Table 1

[0083] Serial number definition Serial number definition 1 Rectifier output positive terminal 24 Compressor driver IC power supply positive terminal 2 AC input 1 25 Compressor driver IC power supply negative terminal 3 AC input 2 26 Compressor bus voltage P 4 NTC temperature detection output 27 Compressor U phase floating power supply 5 Negative terminal of fan driver IC power supply 28 Compressor U phase output 6 Fan driver IC power supply positive terminal 29 Compressor V phase floating power supply 7 Fan fault output port 30 Compressor V phase output 8 PFC IGBT drive signal 31 Compressor W phase floating power supply 9 Fan WL drive signal 32 Compressor W phase output 10 Fan VL drive signal 33 Compressor bus voltage N 11 Fan UL drive signal 34 Driver IC power supply negative terminal 2 12 Fan WH drive signal 35 Fan bus voltage N 13 Fan VH drive signal 36 Fan U phase output 14 Fan UH drive signal 37 Wind turbine U-phase floating power supply 15 Fan overcurrent protection 38 Fan V phase output 16 Compressor overcurrent protection 39 Fan V-phase floating power supply 17 Compressor fault output port 40 Fan W phase output 18 Compressor WL drive signal 41 Wind turbine W phase floating power supply 19 Compressor VL drive signal 42 Fan bus voltage P 20 Compressor UL drive signal 43 PFC positive terminal 21 Compressor WH drive signal 44 PFC negative terminal 22 Compressor VH drive signal 45 Rectifier output negative terminal 23 Compressor UH drive signal

[0084] Fan M 1 The U, V and W pins of the drive circuit are 36, 38 and 40 respectively, and the corresponding bootstrap voltage charging pins are 37 (connected to the bootstrap capacitor C 4 )、39 feet (connected with bypass filter capacitor C 3 ) and pin 41 (connected with bypass filter capacitor C 2 ), compressor M 2 The U, V and W pins of the drive circuit are 27, 29 and 31 respectively, and the corresponding bootstrap voltage charging pins are 28 (connected to the bootstrap capacitor C 7 )、30 feet (connected with bootstrap capacitor C 6 ) and pin 32 (connected with bootstrap capacitor C 5 ).

[0085] Fan M 1 After the power is supplied from the 42-pin P, the current is controlled by vector operation from the three upper bridge transistors inside the substrate → U / V / W → the three lower bridge transistors inside the substrate → 35-pin N output, and then through the fan M 1 Sampling resistor R 1 Then it flows back to the large electrolytic capacitor C 1 of the negative electrode.

[0086] Compressor M 2After the power is supplied from pin 26, the current is controlled by vector operation from the three upper bridge transistors inside the substrate → U / V / W → the three lower bridge transistors inside the substrate → output from pin 33 N, and then through the compressor M 2 Sampling resistor R 2 Then it flows back to the large electrolytic capacitor C 1 of the negative electrode.

[0087] The second path is output from pin 44 through the power factor corrector inside the substrate and connected to the large electrolytic capacitor C 1 After the negative electrodes are collected, the current sampling resistor R 3 Finally, it enters the negative terminal of the rectifier from pin 45 and then flows back to the AC power supply AC.

[0088] This pin arrangement definition is conducive to the layout of external components, and the corresponding layout and routing are beneficial to improving electromagnetic interference performance.

[0089] The drive control integrated device defined in this application has an overcurrent protection function, which is implemented in at least the following two ways:

[0090] (1) Figure 1 As shown, pins 15 and 16 are set on the second edge, and the first motor M is connected to the inside of the substrate. 1 and the second motor M 2 Current detection path: The first motor M 1 The overcurrent protection port ITRIP is set at pin 15 of the upper row of pins on the substrate. 1 The current through the sampling resistor R 1 After that, through the overcurrent detection circuit R 4 Finally, the overcurrent protection port of driver 1 inside the substrate is entered from pin 15 for overcurrent protection.

[0091] The second motor M 2 The overcurrent protection port FITRIP is set at the 16th pin of the upper row of pins on the substrate, and the second motor M 2 The current through the sampling resistor R 2 After that, through the overcurrent detection circuit R 5 Finally, the overcurrent protection port of driver 2 inside the substrate is entered from pin 16 for overcurrent protection.

[0092] (2) Figure 2 As shown, pins 15 and 16 are set at the first edge, and the first motor M is connected inside the substrate. 1 and the second motor M 2 Current detection path: The first motor M 1 The overcurrent protection port ITRIP is set at pin 15 of the lower row of pins on the substrate. 1 The current through the sampling resistor R 1After that, through the overcurrent detection circuit R 4 Finally, the overcurrent protection port of driver 1 inside the substrate is entered from pin 15 for overcurrent protection.

[0093] The second motor M 2 The overcurrent protection port FITRIP is set at pin 16 of the bottom row of pins on the substrate. 2 The current through the sampling resistor R 2 After that, through the overcurrent detection circuit R 5 Finally, the overcurrent protection port of driver 2 inside the substrate is entered from pin 16 for overcurrent protection.

[0094] (3) Figure 1 and Figure 2 As shown, pins 15 and 16 are arranged at the edge of the substrate. If pins 15 and 16 are arranged at the second edge, it is beneficial to reduce the impact of the first motor M on the inside of the substrate. 1 and the second motor M 2 The current detection path is connected between pins 15 and 16 to the overcurrent protection segment of the processor to directly trigger the processor to perform overcurrent protection, wherein the overcurrent protection end can be an ordinary data port or an interrupt port.

[0095] Optionally, the substrate is a rectangular structure with dimensions of 50 mm to 100 mm on a long side, 10 mm to 50 mm on a short side, and 3 mm to 10 mm in thickness.

[0096] Optionally, the spacing between the centers of the high-voltage pins is 2.5 mm to 6.0 mm, and the spacing between the centers of the low-voltage pins is 0.3 mm to 3.0 mm.

[0097] Optionally, the diameter of the strong current pin is 0.3 mm to 2 mm. Specifically, the rectifier, power factor corrector, fan M 1 The pin diameter of the driver is 0.5mm~2.0mm, and the compressor M 2 The pin diameter of the driver is 0.3mm to 1.5mm.

[0098] Optionally, the diameter of the low-voltage pin is 0.1 mm to 1 mm.

[0099] The first edge of the substrate is provided with the above-mentioned pins 1 to 25, and the second edge of the substrate is provided with the above-mentioned pins 26 to 45. The pins are extended from the two long sides, and the arrangement method is "one side single row, one side double row", or "both sides single row", or "both sides double row".

[0100] Optionally, the pins are in a direct-insert package form or a surface-mount package form.

[0101] In addition, the substrate has a built-in temperature detection resistor that can detect and output the internal temperature of the substrate, which is beneficial for the external processor MCU to promptly execute protection measures such as voltage limiting and frequency reduction.

[0102] An air conditioner defined in an embodiment of the present invention includes: an indoor unit, the indoor unit is provided with an indoor fan; an outdoor unit, the outdoor unit is provided with a compressor and / or an outdoor fan; a drive control integrated device such as any of the above technical solutions, the external pins of the drive control integrated device are connected to the indoor unit and / or the outdoor unit, and the drive control integrated device is configured to control the operation of at least one load among the indoor fan, the compressor and the outdoor fan.

[0103] In response to the technical problems raised in the prior art, the present invention proposes a drive control integrated device and an air conditioner. Along the direction of the first edge of the substrate, a rectifier, a power factor corrector, a motor drive assembly of a fan and a motor drive assembly of a compressor are integrated in sequence on the substrate. The power factor corrector, the motor drive assembly of the fan and the motor drive assembly of the compressor are controlled by an external processor. The drive control integrated device is easy to assemble in electrical equipment, especially a split-type air conditioner. The external machine electric control board and the internal machine electric control board are integrated into the same drive control integrated device, which simplifies the complexity of equipment assembly and the difficulty of maintenance, and is also conducive to further improving the thermal stability, anti-interference characteristics and integration of the drive control integrated device. At the same time, it is conducive to reducing the layout area and volume of the drive control integrated device.

[0104] It should be noted that, in the claims, any reference signs placed between parentheses shall not be constructed as limiting the claim.

[0105] The word "comprising" does not exclude the presence of elements or steps not listed in a claim.

[0106] The word "a" or "an" preceding a component does not exclude the presence of a plurality of such components. The invention may be implemented by means of hardware comprising several distinct components and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names.

[0107] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0108] In the description of the present invention, unless otherwise clearly specified and limited, the term "plurality" refers to two or more than two; unless otherwise specified or explained, the terms "connection", "fixed" and the like should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0109] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0110] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the scope of the claims of the present invention and its equivalent technology, and the present invention is also intended to include these changes and modifications.

Claims

1. A drive control integrated device, characterized in that: The drive control integrated device is externally connected to a processor, and the drive control integrated device includes: A substrate, on which a rectifier, a power factor corrector, a motor drive assembly of a fan, and a motor drive assembly of a compressor are sequentially integrated along a first edge of the substrate; The motor drive assembly comprises: A driver, the driver being configured to receive a driving control signal sent by the processor and generate a pulse modulation signal according to the driving control signal; an inverter, wherein an input end of the inverter is connected to an output end of the driver, and the inverter is configured to drive the motor to operate according to the pulse modulation signal, The inverter is connected across the high-voltage bus and the low-voltage bus, the input end of the motor is connected to the output end of the inverter via the pins on the first edge, and the processor is connected to the driver via the pins on the second edge of the substrate; The power factor corrector comprises: A power tube, wherein a control end of the power tube is connected to an output pin of the driver, a first end of the power tube is connected to a ground line, a second end of the power tube is connected to a second end of an inductive element via a pin of the first edge, a first end of the inductive element is connected to the high-voltage bus via a pin of the second edge, and the pulse modulation signal is configured to control the power tube to be turned on or off; A first unidirectional conductive element, connected between the second end of the power tube and the input end of the inverter; After the second end of the power tube is connected to the first unidirectional conductive element, it is connected to the second end of the capacitive element through the pin of the first edge, the first end of the capacitive element is connected to the ground line, and the capacitive element is configured to filter out the ripple signal and / or surge signal flowing through the high-voltage bus; The substrate is externally connected with a first sampling resistor, a first current detection resistor, a second sampling resistor and a second current detection resistor; Wherein, at least two of the motor drive assemblies include a first driver and a second driver respectively, the first driver is used to drive the fan, and the second driver is used to drive the compressor; A third pin and a fourth pin are provided at the first edge of the substrate, and the current detection path for the fan and the compressor inside the substrate is as follows: the overcurrent protection port of the fan is provided at the third pin, the current of the fan flows back to the first end of the capacitive element after passing through the first sampling resistor, the current of the fan passes through the first current detection resistor of the overcurrent detection loop, and then enters the overcurrent protection port of the first driver inside the substrate from the third pin for overcurrent protection; the overcurrent protection port of the compressor is provided at the fourth pin, the current of the compressor flows back to the first end of the capacitive element after passing through the second sampling resistor, the current of the compressor passes through the second current detection resistor of the overcurrent detection loop, and then enters the overcurrent protection port of the second driver inside the substrate from the fourth pin for overcurrent protection; or The third pin and the fourth pin are provided at the second edge of the substrate, and the current detection path for the fan and the compressor inside the substrate is as follows: the overcurrent protection port of the fan is provided at the third pin, and the current of the fan flows back to the first end of the capacitive element after passing through the first sampling resistor, and the current of the fan enters the overcurrent protection port of the first driver inside the substrate from the third pin for overcurrent protection after passing through the first current detection resistor of the overcurrent detection loop; the overcurrent protection port of the compressor is provided at the fourth pin, and the current of the compressor flows back to the first end of the capacitive element after passing through the second sampling resistor, and the current of the compressor enters the overcurrent protection port of the second driver inside the substrate from the fourth pin for overcurrent protection after passing through the second current detection resistor of the overcurrent detection loop.

2. The drive control integrated device according to claim 1, characterized in that: The motor drive assembly of the fan is referred to as a fan drive assembly, and the motor drive assembly of the compressor is referred to as a compressor drive assembly. The driver of the fan drive assembly and the driver of the compressor drive assembly are integrated into the same driver chip, or the driver of the fan drive assembly and the driver of the compressor drive assembly are arranged in two separate driver chips.

3. The drive control integrated device according to claim 2, characterized in that: The first edge and the second edge are parallel opposite sides of the substrate, the heat dissipation of the fan drive assembly is less than the heat dissipation of the compressor drive assembly, and the heat dissipation of the power factor corrector is greater than the heat dissipation of the rectifier.

4. The drive control integrated device according to claim 3, characterized in that: The pin diameter of the driver of the fan drive assembly ranges from 0.3 mm to 1.5 mm, or the pin diameter of the driver of the compressor drive assembly ranges from 0.5 mm to 2 mm.

5. The drive control integrated device according to any one of claims 1 to 4, characterized in that: The pins of the motor drive assembly are plugged and / or welded on the substrate.

6. The drive control integrated device according to any one of claims 1 to 4, characterized in that: The rectifier includes four switch bridge arms, each of which is provided with a switch tube, and a power supply signal is input to the rectifier through the pin of the second edge. The rectifier is configured to convert the power supply signal into a bus signal, and load the bus signal to the high-voltage bus and the low-voltage bus.

7. The drive control integrated device according to claim 1, characterized in that: Also includes: The second unidirectional conductive element is connected between the first end of the power tube and the second end of the power tube.

8. The drive control integrated device according to any one of claims 1 to 4, characterized in that: The inverter comprises: At least two half-bridge circuits connected in parallel, the half-bridge circuits being connected across the high-voltage bus and the low-voltage bus, the half-bridge circuits comprising: Two switch tubes connected in series, the control end of the switch tube is connected to the output pin of the driver, and the pulse modulation signal is configured to control the two switch tubes connected in series to be alternately turned on.

9. The drive control integrated device according to claim 8, characterized in that: The switch tube is a metal oxide semiconductor field effect transistor or an insulated gate bipolar transistor. The gate of the metal oxide semiconductor field effect transistor is the control terminal, and a reverse freewheeling diode is connected between the source and drain of the metal oxide semiconductor field effect transistor. The base of the insulated gate bipolar transistor is the control terminal, and a reverse freewheeling diode is connected between the emitter and the collector of the insulated gate bipolar transistor.

10. The drive control integrated device according to claim 9, characterized in that: The metal oxide semiconductor field effect transistor includes at least one of a silicon type metal oxide semiconductor field effect transistor, a silicon carbide type metal oxide semiconductor field effect transistor and a gallium nitride type metal oxide semiconductor field effect transistor.

11. The drive control integrated device according to any one of claims 1 to 4, characterized in that: Also includes: a temperature detection resistor, disposed on the substrate, wherein a first end of the temperature detection resistor is connected to the driver, and a second end of the temperature detection resistor is connected to the processor via a pin on the second edge, Wherein, the resistance of the temperature detection resistor is positively correlated or negatively correlated with the temperature of the substrate.

12. The drive control integrated device according to any one of claims 1 to 4, characterized in that: The pin diameter of the rectifier ranges from 0.5 mm to 2 mm.

13. The drive control integrated device according to any one of claims 1 to 4, characterized in that: The pin diameter of the power factor corrector ranges from 0.5 mm to 2 mm.

14. The drive control integrated device according to any one of claims 1 to 4, characterized in that: The long side of the substrate is less than 100 mm, or the short side of the substrate is less than 50 mm, or the thickness of the substrate is less than 10 mm.

15. An air conditioner, characterized in that: include: An indoor unit, wherein the indoor unit is provided with an indoor fan; An outdoor unit, wherein the outdoor unit is provided with a compressor and / or an outdoor fan; According to any one of claims 1 to 14, the external pins of the drive control integrated device are connected to the indoor unit and / or the outdoor unit, and the drive control integrated device is configured to control the operation of at least one load among the indoor unit fan, the compressor and the outdoor unit fan.

Images