A micro spherical reflector antenna and array antenna based on MEMS technology and a preparation method thereof

Abstract

The present invention provides a micro spherical reflector antenna and array antenna based on MEMS technology and a preparation method thereof, wherein the spherical reflector antenna comprises: a substrate, wherein the substrate is provided with an upper surface and a lower surface corresponding to the upper surface, wherein the upper surface of the substrate is provided with a groove; a glass bubble spherical reflector, which is located on the upper surface of the substrate and is connected with the opening of the groove to form a spherical microcavity; and a feed source, which is placed at the focus of the glass bubble spherical reflector; wherein the glass bubble spherical reflector comprises a glass bubble and a metal reflective layer covering the surface of the glass bubble. Through the MEMS process, the miniaturization of the spherical reflector and the feed source is simultaneously realized, which can significantly reduce the overall size and weight of the wireless system and open up new space for its application; moreover, the spherical reflector array antenna of the present invention realizes the integrated design and preparation of the spherical reflector and the feed source by using MEMS technology, which is of great significance for mass production and reducing production costs.

Description

Technical Field

[0001] The present invention belongs to the field of MEMS (micro-electromechanical systems) technology, and in particular relates to a micro spherical reflector antenna and an array antenna based on MEMS technology and a preparation method thereof. Background Art

[0002] Antennas can realize the mutual conversion between guided waves and free space waves, and are an essential component of current radar and wireless communication systems. Traditional antennas are usually obtained by mechanical processing. The size of the antennas made by traditional mechanical technicians is too large, which limits the development of traditional antennas. The process integration with modern integrated circuits is poor, and the surface morphology of small-sized antennas is difficult to guarantee. In the millimeter wave band, it has a great impact on signal transmission.

[0003] Currently, miniaturization is an important trend in the development of antennas. As microwave frequencies become higher and higher, the size of antennas will become smaller and smaller. At the same time, lighter antennas will significantly reduce the overall size and weight of wireless systems, opening up new space for their applications. The microstructure precision produced by the microelectromechanical system (MEMS) processing technology can reach the micron level and can process complex three-dimensional structures with high aspect ratios.

[0004] Therefore, it is necessary to provide an antenna manufacturing method that can achieve miniaturization and integration of spherical reflector antennas and reduce manufacturing costs. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a micro spherical reflector antenna and an array antenna based on MEMS technology and a preparation method thereof, so as to achieve miniaturization and integration of the spherical reflector antenna and reduce costs.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides a micro spherical reflector antenna and an array antenna based on MEMS technology and a method for manufacturing the same. The spherical reflector antenna comprises:

[0007] A substrate, wherein the substrate is provided with an upper surface and a lower surface corresponding to the upper surface, and the upper surface of the substrate is provided with a groove;

[0008] A glass bubble spherical reflective surface is located on the upper surface of the substrate and is connected with the groove to form a spherical microcavity;

[0009] A feed source is placed at the focal position of the spherical reflecting surface of the glass bulb;

[0010] Wherein, the glass bulb spherical reflective surface comprises a glass bulb and a metal reflective layer covering the surface of the glass bulb.

[0011] Optionally, the material of the substrate includes silicon, and the material of the metal reflective layer includes gold or copper.

[0012] Optionally, the structure of the feed source includes any one of a dipole linear structure, a ring structure, a microstrip line structure or a coplanar waveguide structure.

[0013] Optionally, the structure of the feed source is a microstrip line structure, and the feed source includes a radiation patch arranged on the bottom surface of the groove, a middle portion of a metal ground line arranged on the lower surface of the substrate and corresponding to the position of the radiation patch, and a substrate between the radiation patch and the middle portion of the metal ground line, and the feed source is led out by a transmission line.

[0014] Optionally, the structure of the feed source is a coplanar waveguide structure, the feed source includes a radiation patch arranged on the lower surface of the substrate and a metal ground wire surrounding portion surrounding the radiation patch, and the feed source is led out by a transmission line.

[0015] Optionally, the material of the radiation patch includes gold or copper.

[0016] The present invention also provides a micro spherical reflector array antenna based on MEMS technology, wherein the spherical reflector array antenna is composed of a number of micro spherical reflector antennas as described in any of the above items arranged and combined in a specific array, and the specific array includes any one of a rectangular grid array, a circular array, a rectangular triangular grid array, a hexagonal array, and a concentric circle array.

[0017] The present invention also provides a method for preparing a micro spherical reflector antenna based on MEMS technology, which at least comprises the following steps:

[0018] Providing a substrate, wherein the substrate has an upper surface and a lower surface corresponding to the upper surface;

[0019] Forming a groove on the upper surface of the substrate by an etching process;

[0020] Bonding a glass plate to the upper surface of the substrate to form a sealing structure, and heating the sealing structure to form glass bubbles;

[0021] Depositing metal on the surface of the glass bulb to form a metal reflective layer, wherein the glass bulb and the metal reflective layer constitute a spherical reflective surface;

[0022] A feed source is formed at the focal position of the spherical reflecting surface.

[0023] Optionally, the structure of the feed source includes any one of a dipole linear structure, a ring structure, a microstrip line structure or a coplanar waveguide structure.

[0024] Optionally, the feed source is a microstrip line structure, and the step of forming the feed source includes:

[0025] After forming a groove on the upper surface of the substrate by etching and before bonding the glass plate to the upper surface of the substrate, forming a radiation patch on the bottom surface of the groove;

[0026] Depositing metal on the lower surface of the substrate and patterning it to form a metal ground wire layer, wherein the metal ground wire layer is provided with a metal ground wire middle portion corresponding to the radiation patch and a metal ground wire connecting portion connected to the metal middle portion of the wire;

[0027] The metal ground wire layer is used as a mask and an etching process is adopted to remove the substrate not covered by the metal ground wire to form a feed source and a transmission line connected to the feed source.

[0028] Optionally, the structure of the feed source is a coplanar waveguide structure, and the step of forming the feed source includes:

[0029] Metal is deposited and patterned on the lower surface of the substrate to form a radiation patch and a metal ground wire surrounding portion surrounding the radiation patch, wherein the radiation patch and the metal ground wire surrounding portion constitute a feed source; at the same time, a transmission line connecting the feed source is formed.

[0030] The present invention also provides a method for preparing a spherical reflector array antenna based on MEMS technology, characterized in that the micro spherical reflector antenna in the array is prepared by using any of the above-mentioned methods for preparing a micro spherical reflector antenna based on MEMS technology.

[0031] The present invention uses MEMS technology to prepare a miniature spherical reflector and a miniaturized feed source, which can significantly reduce the overall size and weight of the wireless system and open up new space for the application of the wireless system. At the same time, the present invention realizes the integration of the spherical reflector and the feed source, which is of great significance for mass production and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Shown is a schematic structural diagram of a substrate provided in Example 1.

[0033] Figure 2 It shows a schematic structural diagram of etching a substrate to form a groove provided in the first embodiment.

[0034] Figure 3 Shown is a schematic diagram of the structure of forming a radiation patch provided in the first embodiment.

[0035] Figure 4 Shown is a schematic structural diagram of a bonded glass plate provided in Example 1.

[0036] Figure 5 Shown is a schematic diagram of the structure for forming glass bubbles provided in Example 1.

[0037] Figure 6Shown is a schematic structural diagram of forming a metal reflective layer provided in Example 1.

[0038] Figure 7 Shown is a top view schematic diagram of forming a patterned metal ground layer provided in the first embodiment.

[0039] Figure 8 The display is provided in Example 1. Figure 7 Schematic diagram of the cross-section along the AA' direction.

[0040] Fig. 9 The diagram shows a top view of a substrate that is completely etched and not covered by a metal ground layer, as provided in the first embodiment.

[0041] Fig.10 The display is provided in Example 1. Fig. 9 Schematic diagram of the cross-section along the BB' direction.

[0042] Fig.11 Shown is a schematic structural diagram of a spherical reflector array antenna provided in Example 1.

[0043] Fig.12 Shown is a schematic structural diagram of a substrate provided in Example 2.

[0044] Fig.13 It is a schematic diagram of the structure of forming grooves by etching provided in the second embodiment.

[0045] Fig.14 Shown is a schematic diagram of the structure bonded to a glass plate provided in Example 2.

[0046] Fig.15 Shown is a schematic diagram of the structure of forming glass bubbles provided in Example 2.

[0047] Fig.16 Shown is a schematic diagram of the structure of forming a metal reflective layer provided in the second embodiment.

[0048] Fig.17 Shown is a schematic structural diagram of forming a patterned metal ground layer provided in the second embodiment.

[0049] Fig.18 The display is provided in Example 2. Fig.17 Schematic diagram of the cross-section along the CC' direction.

[0050] Component number description

[0051] 1 Micro Spherical Reflector Antenna

[0052] 10 Substrate

[0053] 101 Upper surface

[0054] 102 Lower surface

[0055] 11 Groove

[0056] 12 Radiation patch

[0057] 13 Glass Bulb Spherical Reflector

[0058] 131 Glass plate or glass bubble

[0059] 132 Metal reflective layer

[0060] 14 Metal ground layer

[0061] 141 Metal ground wire middle part

[0062] 142 Metal ground connection

[0063] 15 Transmission Line

[0064] 20 Substrate

[0065] 201 Upper surface

[0066] 202 Lower surface

[0067] 21 Grooves

[0068] 22 Radiation patch

[0069] 23 Glass Bulb Spherical Reflector

[0070] 231 Glass plate or glass bubble

[0071] 232 Metal reflective layer

[0072] 241 Metal ground wire surround

[0073] 242 Transmission Line DETAILED DESCRIPTION

[0074] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0075] See also Figures 1 to 18 It should be noted that the illustrations provided in this embodiment are only schematic illustrations of the basic concept of the present invention. Although the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation, the form, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the component layout may also be more complicated.

[0076] Embodiment 1

[0077] The present invention provides a micro spherical reflector antenna, which mainly comprises: a substrate, wherein the substrate is provided with an upper surface and a lower surface corresponding to the upper surface, the upper surface of the substrate is provided with a groove, a glass bubble spherical reflector surface is connected with the groove opening to form a spherical microcavity, and the glass bubble spherical reflector surface comprises a glass bubble and a metal reflective layer covering the surface of the glass bubble and a feed source located at the focal position of the spherical reflector surface.

[0078] As an example, the material of the substrate may be silicon. The material of the metal reflective layer may be gold or copper, and the thickness of the metal reflective layer is 0.5-3 μm.

[0079] As an example, the feed source may take the form of various micro-antennas such as a dipole linear structure, a ring structure, a microstrip line structure or a coplanar waveguide structure.

[0080] In this embodiment, the feed source adopts a microstrip line structure. The feed source of the microstrip line structure includes a radiation patch arranged on the bottom surface of the groove, a middle part of a metal ground line located on the lower surface of the substrate and arranged corresponding to the radiation patch, and a substrate between the radiation patch and the middle part of the metal ground line. The feed source is led out by a transmission line.

[0081] like Figure 7 as well as Figure 8 As shown, in this embodiment, the feed source is a micro-spherical reflector antenna with a microstrip line structure, including: a substrate 10, the substrate is provided with an upper surface 101 and a lower surface 102 corresponding to the upper surface, the upper surface of the substrate is provided with a groove 11 and a glass bulb spherical reflector 13 connected to the opening of the groove 11, the glass bulb spherical reflector 13 includes a glass bulb 131 and a metal reflective layer 132 covering the glass bulb; the feed source is located at the focal position of the spherical reflector, the feed source includes a radiation patch 12 located at the bottom of the groove, a metal ground wire middle portion 141 located on the lower surface 102 of the substrate and corresponding to the position of the radiation patch 12, and a substrate between the radiation patch 12 and the metal ground wire middle portion 141, and a transmission line 15 connects the feed source. Figure 8 for Figure 7 Cross-sectional view along the A-A' direction.

[0082] The present invention also provides a method for preparing a micro spherical reflector antenna based on MEMS technology, which at least comprises the following steps: providing a substrate, wherein the substrate is provided with an upper surface and a lower surface corresponding thereto;

[0083] Forming a groove on the upper surface of the substrate by an etching process;

[0084] Bonding a glass plate to the upper surface of the substrate to form a sealing structure, and heating the sealing structure to form glass bubbles;

[0085] Depositing metal on the surface of the glass bulb to form a metal reflective layer, wherein the glass bulb and the metal reflective layer constitute a spherical reflective surface;

[0086] A feed source is formed at the focal position of the spherical reflecting surface.

[0087] As an example, the feed structure may take the form of various micro-antennas such as a dipole linear structure, a ring structure, a microstrip line structure or a coplanar waveguide structure.

[0088] In this embodiment, the steps of forming a feed source of a microstrip line structure include:

[0089] After forming a groove on the upper surface of the substrate by etching and before bonding the glass plate to the upper surface of the substrate, forming a radiation patch on the bottom surface of the groove;

[0090] Depositing metal on the lower surface of the substrate and patterning it to form a metal ground wire layer, wherein the metal ground wire layer is provided with a metal ground wire middle portion corresponding to the radiation patch and a metal ground wire connecting portion connected to the metal ground wire middle portion;

[0091] The metal ground wire layer is used as a mask and an etching process is adopted to remove the substrate not covered by the metal ground wire to form a feed source and a transmission line connecting the feed source.

[0092] The following is a detailed description of the method for preparing a micro spherical reflector antenna using a microstrip line structure as a feed source through the accompanying drawings.

[0093] like Figure 1 As shown, step 1) is performed to provide a substrate 10, wherein the substrate 10 has an upper surface 101 and a lower surface 102 corresponding to the upper surface.

[0094] In this embodiment, silicon is selected as the substrate 10 .

[0095] like Figure 2 As shown, step 2) is performed to form a groove 11 on the upper surface of the substrate 10 by using an etching process.

[0096] As an example, the size of the groove 11 determines the size and shape of the glass bubble, and the radius of the groove can be limited to 100 μm to 10 mm.

[0097] like Figure 3 As shown, step 3) is performed to form a radiation patch 12 on the bottom surface of the groove 11.

[0098] As an example, the material of the radiation patch 12 is gold or copper. In this embodiment, gold is selected as the material of the radiation patch. The shape of the radiation patch can be square, circular or other shapes as needed. The radiation patch is set at the focal position of the spherical reflection surface, and the focal point of the spherical reflection surface is adjusted by the size and shape of the glass bubble.

[0099] like Figure 4 and Figure 5 As shown, step 4) is performed to bond the glass plate to the upper surface of the substrate 10 to form a sealing structure, and the sealing structure is heated to form a glass bubble 131.

[0100] Specifically, the process of step 4) is: anodically bond the glass plate 131 to the upper surface of the substrate 10 to form a sealed structure, and then place the sealed structure in a heating furnace to heat it to a temperature above the softening temperature of the glass and keep it warm. Under the action of high temperature, the gas in the groove 11 is heated so that the pressure in the cavity is greater than the external pressure, and the pressure difference between the inside and outside of the cavity causes the softened glass plate 131 to move away from the groove 11 to form a spherical glass bubble. The size and shape of the glass bubble can be controlled by the size of the groove 11 and the heating process conditions.

[0101] like Figure 6 As shown, step 5) is performed to deposit a layer of metal on the surface of the glass bulb 131 to form a metal reflective layer 132 . The glass bulb 131 and the metal reflective layer 132 constitute a spherical reflective surface 13 .

[0102] As an example, the material of the metal reflective layer 132 includes gold or copper. The metal reflective layer can be prepared by sputtering or vapor deposition. In this embodiment, the metal reflective layer 132 is prepared by sputtering.

[0103] like Figure 7 and Figure 8 As shown, step 6) is performed to deposit a layer of metal on the lower surface of the substrate 10 and pattern it to form a metal ground layer 14, and the metal ground layer 14 is provided with a metal ground middle portion 141 corresponding to the radiation patch 12 and a metal ground connection portion 142 connected to the middle portion 141.

[0104] like Fig. 9 As shown, the metal ground layer 14 on the lower surface is used as a mask, and an etching process is adopted to remove the substrate not covered by the metal ground layer to form a feed source and a transmission line 15 connecting the feed source. Fig.10 for Fig. 9 Cross-sectional view along the B-B' direction.

[0105] In this embodiment, a microstrip line structure is used as a feed source, and the radiation direction of the antenna is on one side of the radiation patch. By removing the remaining part of the substrate at the bottom of the groove, the absorption and interference of the substrate on the incident or outgoing microwave signal can be reduced.

[0106] like Fig.11As shown, the present invention also provides a MEMS-based spherical reflector array antenna, which is composed of a number of closely arranged spherical reflector antennas 1 as described above arranged in a specific array, and its specific structure can be any one of a rectangular grid array, a circular array, a rectangular triangle grid array, a hexagonal array, and a concentric circle array.

[0107] The present invention also provides a method for preparing a MEMS-based spherical reflector array antenna, which is prepared by the preparation method of the MEMS-based micro spherical reflector antenna as described above, but different from the above method in that in the step of forming grooves on the upper surface of the substrate by using an etching process, a set groove array is formed on the upper surface of the substrate by using an etching process. The other steps are the same as those of the above-mentioned preparation method of the micro spherical reflector antenna, and will not be repeated here.

[0108] The antenna is formed into an array according to different parameters such as feed current, spacing, electrical length, etc., which can increase the effective area and adjust the beam directivity.

[0109] This embodiment uses the MEMS process to simultaneously achieve miniaturization of the spherical reflector and the feed source, which can significantly reduce the overall size and weight of the wireless system and open up new space for its application; moreover, the spherical reflector array antenna of this embodiment uses the MEMS technology to achieve integrated design and preparation of the spherical reflector and the feed source, which is of great significance for mass production and reducing production costs.

[0110] Embodiment 2

[0111] This embodiment provides a miniature spherical reflector antenna, and its technical solution is similar to that of the first embodiment. The difference from the first embodiment is that the structure of the feed source is a coplanar waveguide structure.

[0112] In this embodiment, the feed source of the coplanar waveguide structure includes a radiation patch located on the lower surface of the substrate and a metal ground wire surrounding portion surrounding the radiation patch, and the feed source is led out by a transmission line.

[0113] like Fig.12 as well as Fig.13 As shown, a micro spherical reflector antenna with a coplanar waveguide structure as a feed source includes: a substrate 20, the substrate 20 is provided with an upper surface 201 and a lower surface 202 corresponding to the upper surface, the upper surface of the substrate is provided with a groove 21 and a glass bulb spherical reflector 23 connected to the opening of the groove 21, the glass bulb spherical reflector 23 includes a glass bulb 231 and a metal reflective layer 232 covering the glass bulb; the feed source is located at the focal center of the spherical reflector 23, the feed source includes a radiation patch 22 located on the lower surface of the substrate 20, a metal ground wire surrounding portion 241 surrounding the radiation patch 22, and the feed source is led out by a transmission line 242.

[0114] In this embodiment, metal is deposited and patterned on the lower surface of the substrate to form a radiation patch and a metal ground wire surround portion surrounding the radiation patch, wherein the radiation patch and the metal ground wire surround portion constitute a feed source; at the same time, a transmission line leading out the feed source is formed.

[0115] The following is a detailed description of the method for preparing a micro spherical reflector antenna using a coplanar waveguide structure as a feed source through the accompanying drawings.

[0116] like Fig.12 As shown, step 1) is performed to provide a substrate 20 , wherein the substrate 20 has an upper surface 201 and a lower surface 202 .

[0117] As an example, the material of the substrate 20 may be a semiconductor substrate such as a silicon substrate, a gallium nitride substrate, etc. In the present embodiment, silicon is selected as the substrate 20 .

[0118] like Fig.13 As shown, step 2) is performed to form a groove 21 on the upper surface of the substrate 20 by using an etching process.

[0119] As an example, the size of the groove 21 determines the size and shape of the glass bubble, and the radius of the groove can be limited to 100 μm to 10 mm.

[0120] like Fig.14 and 15 As shown, step 3) is performed to bond the glass plate 231 to the upper surface of the substrate 20 to form a sealing structure, and the sealing structure is heated to form the glass bubble 231.

[0121] Specifically, the process of step 3) is: anodically bond the glass plate 231 to the upper surface of the substrate 20 to form a sealed structure, and then place the sealed structure in a heating furnace to heat it to a temperature above the softening temperature of the glass and keep it warm. Under the action of high temperature, the gas in the groove 21 is heated so that the pressure in the cavity is greater than the external pressure. The pressure difference between the inside and outside of the cavity causes the softened glass plate 231 to move away from the groove 11 to form a spherical glass bubble 231. The size and shape of the glass bubble can be controlled by the size of the groove 21 and the heating process conditions.

[0122] like Fig.16 As shown, step 4 is performed to deposit a layer of metal on the surface of the glass bulb 231 to form a metal reflective layer 232 . The glass bulb 231 and the metal reflective layer 232 constitute a spherical reflective surface 23 .

[0123] As an example, the material of the metal reflective layer 232 includes gold or copper. The metal reflective layer can be prepared by sputtering or vapor deposition. In this embodiment, the metal reflective layer 232 is prepared by sputtering.

[0124] like Fig.17 and 18As shown, step 5) is performed to deposit a layer of metal on the lower surface of the substrate 20 and pattern it to form a radiation patch 22, a metal ground wire surrounding portion 241 surrounding the radiation patch 22, and a transmission line 242 leading out of the radiation patch 22 and the metal ground wire surrounding portion 241. Fig.18 for Fig.17 The cross-section view in the CC' direction. The radiation patch is set at the focus of the spherical reflector, and the focus of the spherical reflector is adjusted by the size and shape of the glass bubble.

[0125] Similar to the first embodiment, in this embodiment, the array antenna can also be prepared by using the method for preparing a micro spherical reflector antenna using a coplanar waveguide structure as a feed source as described above.

[0126] This embodiment uses the MEMS process to simultaneously achieve miniaturization of the spherical reflector and the feed source, which can significantly reduce the overall size and weight of the wireless system and open up new space for its application; moreover, the spherical reflector array antenna of this embodiment uses the MEMS technology to achieve integrated design and preparation of the spherical reflector and the feed source, which is of great significance for mass production and reducing production costs.

[0127] In summary, the present invention provides a micro spherical reflector antenna based on MEMS technology, the spherical reflector antenna comprising: a substrate, the substrate being provided with an upper surface and a lower surface corresponding to the upper surface, the upper surface of the substrate being provided with a groove; a glass bulb spherical reflector surface, located on the upper surface of the substrate and connected with the opening of the groove to form a spherical microcavity; a feed source, located at the focal center of the glass bulb spherical reflector surface; wherein the glass bulb spherical reflector surface comprises a glass bulb and a metal reflective layer covering the glass bulb. Based on the above technical scheme, the present invention prepares a micro spherical reflector surface and a miniaturized feed source through the MEMS process, which can significantly reduce the overall size and weight of the wireless system and open up new space for the application of the wireless system; at the same time, the present invention realizes the integration of the spherical reflector surface and the feed source, which is of great significance for mass production and reducing production costs.

[0128] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A micro spherical reflector antenna based on MEMS technology, characterized in that: The spherical reflector antenna comprises: a substrate, the substrate is provided with an upper surface and a lower surface corresponding to the upper surface, and the upper surface of the substrate is provided with a groove; A glass bubble spherical reflective surface is located on the upper surface of the substrate and is connected with the groove to form a spherical microcavity; A feed source is placed at the focal position of the spherical reflecting surface of the glass bulb; Wherein, the glass bubble spherical reflective surface comprises a glass bubble and a metal reflective layer covering the outer surface of the glass bubble, and the glass bubble is formed by bonding a glass plate to the upper surface of the substrate to form a sealing structure, and heating the sealing structure; The metal reflective layer is formed by depositing metal on the surface of the glass bubble.

2. The micro spherical reflector antenna based on MEMS technology according to claim 1, characterized in that: The material of the substrate includes silicon, and the material of the metal reflective layer includes gold or copper.

3. The micro spherical reflector antenna based on MEMS technology according to claim 1, characterized in that: The structure of the feed source includes any one of a dipole linear structure, a ring structure, a microstrip line structure or a coplanar waveguide structure.

4. The micro spherical reflector antenna based on MEMS technology according to claim 3 is characterized in that: The structure of the feed source is a microstrip line structure, and the feed source includes a radiation patch arranged on the bottom surface of the groove, a middle part of a metal ground line arranged on the lower surface of the substrate and corresponding to the position of the radiation patch, and a substrate between the radiation patch and the middle part of the metal ground line, and the feed source is led out by a transmission line.

5. The micro spherical reflector antenna based on MEMS technology according to claim 3 is characterized in that: The structure of the feed source is a coplanar waveguide structure. The feed source comprises a radiation patch arranged on the lower surface of the substrate and a metal ground wire surrounding portion surrounding the radiation patch. The feed source is led out by a transmission line.

6. The micro spherical reflector antenna based on MEMS technology according to claim 4 or 5, characterized in that: The material of the radiation patch includes gold or copper.

7. A spherical reflector array antenna based on MEMS technology, characterized in that: The spherical reflector array antenna is composed of a number of miniature spherical reflector antennas as described in any one of claims 1 to 6 arranged and combined in a specific array, and the specific array includes any one of a rectangular grid array, a circular array, a rectangular triangle grid array, a hexagonal array, and a concentric circle array.

8. A method for preparing a micro spherical reflector antenna based on MEMS technology, characterized in that: At least the following steps are included: Providing a substrate, wherein the substrate has an upper surface and a lower surface corresponding to the upper surface; Forming a groove on the upper surface of the substrate by an etching process; Bonding a glass plate to the upper surface of the substrate to form a sealing structure, and heating the sealing structure to form glass bubbles; Depositing metal on the outer surface of the glass bulb to form a metal reflective layer, wherein the glass bulb and the metal reflective layer constitute a spherical reflective surface; A feed source is formed at the focal position of the spherical reflecting surface.

9. A method for preparing a micro spherical reflector antenna based on MEMS technology as claimed in claim 8, characterized in that: The structure of the feed source includes any one of a dipole linear structure, a ring structure, a microstrip line structure or a coplanar waveguide structure.

10. The method for preparing a micro spherical reflector antenna based on MEMS technology according to claim 9, wherein the feed source is a microstrip line structure, characterized in that: The step of forming a feed source comprises: After forming a groove on the upper surface of the substrate by etching and before bonding the glass plate to the upper surface of the substrate, forming a radiation patch on the bottom surface of the groove; Depositing metal on the lower surface of the substrate and patterning it to form a metal ground wire layer, wherein the metal ground wire layer is provided with a metal ground wire middle portion corresponding to the radiation patch and a metal ground wire connecting portion connected to the metal ground wire middle portion; The metal ground layer is used as a mask and an etching process is adopted to remove the substrate not covered by the metal ground layer to form a feed source and a transmission line connected to the feed source.

11. The method for preparing a micro spherical reflector antenna based on MEMS technology according to claim 9, wherein the structure of the feed source is a coplanar waveguide structure, characterized in that: The step of forming a feed source comprises: Metal is deposited and patterned on the lower surface of the substrate to form a radiation patch and a metal ground wire surrounding portion surrounding the radiation patch, wherein the radiation patch and the metal ground wire surrounding portion constitute a feed source; at the same time, a transmission line connecting the feed source is formed.

12. A method for preparing a spherical reflector array antenna based on MEMS technology, characterized in that: The micro spherical reflector antenna in the array is prepared by the preparation method of the micro spherical reflector antenna based on MEMS technology as described in any one of claims 8 to 11.

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