A polishing device

Abstract

The present invention discloses a polishing device, comprising a feeding end and a polishing end, wherein the polishing end is arranged behind the feeding end and both are arranged on a tile pulling line, the tile pulling line is installed on a base, and a powder spraying device is installed at a position behind the polishing end, a rotating shaft is installed on the base at a position located at the front end of the feeding end, and the rotating shaft is transmission-connected to a first cylinder installed on the base, a material dividing device is arranged between the feeding end and the polishing end, and the material dividing device is installed on the base and straddles the tile pulling line and is arranged above the tile pulling line, thereby solving the problem of low working efficiency of traditional polishing devices, effectively avoiding the occurrence of uneven grinding, and being able to meet production needs.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic processing equipment, in particular to a polishing device. Background Art

[0002] With the improvement of people's living standards, people have an increasing demand for items other than daily necessities. Ceramics are one of them. The produced ceramics need to be polished. The polishing machine is also called a grinder, which is often used for mechanical grinding, polishing and waxing. Its working principle is: the motor drives the sponge or wool polishing disc installed on the polishing machine to rotate at a high speed. Due to the joint action of the polishing disc and the polishing agent and the friction with the surface to be polished, the paint surface pollution, oxide layer and shallow marks can be removed. However, the traditional polishing device has high noise and low work efficiency during use, and the equipment will be unevenly polished due to long-term use, which cannot meet the requirements of modern production. Summary of the invention

[0003] In order to overcome the above-mentioned problems, the present invention provides a polishing device, which solves the problem of low working efficiency of traditional polishing devices, effectively avoids the occurrence of uneven grinding, and can meet production needs.

[0004] The technical solution adopted by the present invention to solve its technical problem is: the present invention provides a polishing device, including a feeding end and a polishing end, the polishing end is placed behind the feeding end and both are placed on the tile pull line, the tile pull line is installed on a base, and a powder spraying device is installed at the rear position of the polishing end, the base is provided with a rotating shaft at the front end of the feeding end, the rotating shaft is transmission-connected to a first cylinder installed on the base, a material dividing device is provided between the feeding end and the polishing end, the material dividing device is installed on the base and crosses the tile pull line and is placed above the tile pull line.

[0005] Preferably, the powder spraying device includes a fixing frame and a material box, the material box is perpendicular to the direction of the tile pulling line and can be detachably mounted on the fixing frame and is movably connected to the vibration cylinder mounted on the base, and the fixing frame crosses the tile pulling line and can be detachably mounted on the base, so as to facilitate the replacement and maintenance of the powder spraying device.

[0006] Preferably, the material box is a cavity structure with an open top, and its inner wall is sloped all around. A powder leakage groove is provided at the bottom of the material box, and a hollow net is provided inside the material box close to the bottom surface and surrounding the powder leakage groove. The sloped inner wall can facilitate the powder to flow into the bottom of the material box and to sprinkle the powder from the hollow net onto the tiles.

[0007] Preferably, the feed end includes a feed bracket, a support bracket, an extension rod and a buffer bracket, the feed bracket is installed between the bases, the support bracket is installed at the top of the feed bracket, and a second cylinder is installed through the support bracket, the feed bracket is provided with a first crossbeam at a position below the support bracket, the extension rod is installed on the first crossbeam perpendicular to the direction of the feed bracket, and a third cylinder is installed through the extension rod, the connector installed at the front end of the third cylinder is movably connected to the push head installed on the second cylinder, and the buffer bracket is fixedly installed on the rotating shaft and moves with the rotating shaft. The cylinder push can automatically load the tiles, reducing labor and improving work efficiency.

[0008] Preferably, the buffer rack is H-shaped, one end of which is mounted on the rotating shaft, and the other end is symmetrically mounted with rollers, which play a guiding role and facilitate the transmission of tiles.

[0009] Preferably, the polishing end includes a housing and a grinding device and a cleaning device installed inside the housing. The grinding device includes a driving device, a second beam, a linear guide rail and a roller row. The driving device is placed on the upper end of the second beam and is movably connected to the second beam. The roller row and the linear guide rail are both installed on the second beam and move with the second beam. A grinding disc is installed at the lower end of the roller row near the tile pulling line. The cleaning device is arranged inside the grinding device and facing the grinding disc. The swinging beam slides in parallel with the linear guide rail, which is more stable than the traditional roller row.

[0010] Preferably, the material dividing device includes a material dividing plate and a material dividing rod. The material dividing plate spans the tile pulling line and is installed on both sides of the base, and a material dividing block is welded on the top of the material dividing plate. The material dividing block is provided with a locking piece. The material dividing rod passes through the material dividing block and is fixed on the material dividing block by the locking piece. The material dividing device can control the size of the polishing tile according to the user's needs, improve the processing accuracy of the polishing device, effectively avoid the occurrence of uneven grinding, and meet the production needs.

[0011] Preferably, the tile pulling wire is transmitted by a pulley.

[0012] Preferably, a dehydration mechanism is provided between the polishing end and the powder spraying device, the dehydration mechanism comprises a U-shaped bracket and a dehydration roller, the dehydration roller is installed between the U-shaped brackets symmetrically arranged and welded on both sides of the base, and contacts with the surface of the tile, so as to dehydrate the polished tile and facilitate subsequent processing.

[0013] Preferably, the base is provided with a third crossbeam at the rear end of the material distribution device and close to the polishing end, the top end surface of the third crossbeam is symmetrically provided with strip holes, and positioning screws are installed through the strip holes, and the third crossbeam is provided with a pressing roller between the positioning screws, and the pressing roller is set close to the tile. The tile is positioned, flattened and pressed, which is convenient for the subsequent polishing of the tile.

[0014] Compared with the prior art, the present invention has the following beneficial effects: the feed end of the polishing device controls the buffer rack through the first cylinder, and at the same time, the third cylinder and the second cylinder cooperate with the movement of the connector and the push head assembled thereon, so that the tiles can be automatically loaded, which reduces labor and improves work efficiency. Furthermore, a material dividing device is provided between the feed end and the polishing end. The material dividing device can control the size of the tiles to be polished according to user needs, thereby improving the processing accuracy of the polishing device and effectively avoiding the occurrence of uneven grinding, meeting production needs, and avoiding noise generated during polishing due to the thickness of the tiles being too thick. Furthermore, a powder spraying device is installed at the rear of the polishing end, which can evenly spread the configured powder on the polished tiles, thereby increasing the performance of the tiles. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0016] Figure 1 It is a structural schematic diagram of a polishing device according to the present invention;

[0017] Figure 2 It is a schematic structural diagram of a feed end of a polishing device according to the present invention;

[0018] Figure 3 It is a partial schematic diagram of a polishing device according to the present invention;

[0019] Figure 4 It is a schematic structural diagram of a polishing end of a polishing device according to the present invention;

[0020] Figure 5 It is a structural schematic diagram of a polishing device described in the present invention.

[0021] Description of the drawings: 1. Feed end; 101. Feed bracket; 102. Support frame; 103. Extension rod; 104. Buffer frame; 105. Second cylinder; 106. First beam; 107. Third cylinder; 2. Polishing end; 201. Shell; 202. Grinding device; 3. Base; 4. Powder spraying device; 401. Fixed frame; 402. Material box; 5. Rotating shaft; 6. Dividing device; 601. Dividing plate; 602. Dividing rod; 603. Dividing block; 604. Locking piece; 7. Dehydration mechanism; 701. U-shaped bracket; 702. Dehydration roller; 8. Third beam; 9. Screw; 10. Pressing roller; 11. First cylinder; 12. Connecting piece; 13. Pushing head. DETAILED DESCRIPTION

[0022] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0023] The present invention is specifically implemented as follows: Figure 1-5 A polishing device shown includes a feed end 1 and a polishing end 2, wherein the polishing end 2 is placed behind the feed end 1 and both are placed on a tile pull line, the tile pull line is transmitted by a pulley, the tile pull line is installed on a base 3, and a powder spraying device 4 is installed behind the polishing end 2, the base 3 is located at the front end of the feed end 1 and is provided with a rotating shaft 5, the rotating shaft 5 is connected to a first cylinder 11 installed on the base 3 in transmission, a dividing device 6 is provided between the feed end 1 and the polishing end 2, the dividing device 6 is installed on the base 3 and crosses the tile pull line and is placed above the tile pull line, the dividing device 6 includes a dividing plate 601 and a dividing rod 602, the dividing plate 601 crosses the tile pull line and is installed on both sides of the base 3, and the top of the dividing plate 601 is welded There is a dividing block 603, on which a locking piece 604 is provided. A dividing rod 602 passes through the dividing block 603, and the position of the dividing rod 602 on the dividing block 603 is fixed by the locking piece 604. The dividing device 6 can control the size of the tiles to be polished according to user needs, thereby improving the processing accuracy of the polishing device, effectively avoiding the occurrence of uneven grinding, and meeting production needs. A dehydration mechanism 7 is provided between the polishing end 2 and the powder spraying device 4. The dehydration mechanism 7 includes a U-shaped bracket 701 and a dehydration roller 702. The dehydration roller 702 is installed between the U-shaped brackets 701 that are symmetrically arranged and welded on both sides of the base 3, and contacts with the surface of the tiles, so that the polished tiles can be dehydrated for subsequent processing.

[0024] The powder spraying device 4 includes a fixing frame 401 and a material box 402. The material box 402 is perpendicular to the direction of the tile pulling line and can be detachably installed on the fixing frame 401, and is movably connected to the vibration cylinder 8 installed on the base 3. The fixing frame 401 spans the tile pulling line and can be detachably installed on the base 3, which is convenient for the replacement and maintenance of the powder spraying device 4. The material box 402 is a cavity structure with an open top, and its inner walls are sloped all around. A powder leakage groove is provided at the bottom of the material box 402. The interior of the material box 402 is close to the bottom surface and a hollow net is provided around the powder leakage groove. The sloped inner wall can facilitate the powder to flow into the bottom of the material box 402, so that the powder can be sprinkled from the hollow net onto the tiles.

[0025] The feeding end 1 includes a feeding bracket 101, a supporting frame 102, an extension rod 103 and a buffer frame 104. The feeding bracket 101 is installed between the bases 3, the supporting frame 102 is installed at the top of the feeding bracket 101, and a second cylinder 105 is installed through the supporting frame 102. The feeding bracket 101 is provided with a first crossbeam 106 at a position below the supporting frame 102. The extension rod 103 is installed on the first crossbeam 106 perpendicular to the direction of the feeding bracket 101, and a third cylinder 107 is installed through the extension rod 103. The connecting piece 12 installed at the front end of the third cylinder 107 is movably connected with the pushing head 13 installed on the second cylinder 105. The buffer frame 104 is fixedly installed on the rotating shaft 5 and moves with the rotating shaft 5. The ceramic tiles can be automatically loaded by being pushed by the cylinder, which reduces labor and improves work efficiency. The buffer frame 104 is H-shaped, one end of which is installed on the rotating shaft 5, and the other end is symmetrically installed with rollers. The rollers play a guiding role to facilitate the transmission of ceramic tiles.

[0026] The polishing end 2 includes a shell 201 and a grinding device 202 and a cleaning device installed inside the shell 201. The grinding device 202 includes a driving device, a second beam, a linear guide and a roller row. The driving device is placed on the upper end of the second beam and is movably connected to the second beam. The roller row and the linear guide are both installed on the second beam and move with the second beam. A grinding disc is installed at the lower end of the roller row near the tile pulling line. The cleaning device is arranged inside the grinding device and is arranged opposite to the grinding disc. The swinging beam slides in parallel by the linear guide, which is more stable than the traditional roller row. The base 3 is located at the rear end of the dividing device 6 and close to the polishing end 2. A third beam 8 is provided. The top end face of the third beam 8 is symmetrically provided with strip holes, and positioning screws 9 are installed through the strip holes. The third beam 8 is provided with a clamping roller 10 between the positioning screws 9. The clamping roller 10 is arranged close to the tile to position, flatten and compact the tile, which is convenient for subsequent polishing of the tile.

[0027] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A polishing device, characterized in that: It includes a feeding end and a polishing end, the polishing end is placed behind the feeding end and both are placed on the tile pull line, the tile pull line is installed on the base, and a powder spraying device is installed behind the polishing end, the base is installed with a rotating shaft at the front end of the feeding end, the rotating shaft is connected to the first cylinder installed on the base, and a material distributor is provided between the feeding end and the polishing end, the material distributor is installed on the base and crosses the tile pull line and is placed above the tile pull line; The feed end includes a feed bracket, a support bracket, an extension rod and a buffer bracket, the feed bracket is installed between the bases, the support bracket is installed at the top of the feed bracket, and a second cylinder is installed through the support bracket, the feed bracket is provided with a first crossbeam at a position below the support bracket, the extension rod is installed on the first crossbeam perpendicular to the direction of the feed bracket, and a third cylinder is installed through the extension rod, the connecting piece installed at the front end of the third cylinder is movably connected to the push head installed on the second cylinder, and the buffer bracket is fixedly installed on the rotating shaft and moves with the rotating shaft; The feeding end controls the buffer rack through the first cylinder, and the third cylinder and the second cylinder cooperate with the connecting piece and the push head assembled thereon to move, so that the tiles are automatically fed; The material dividing device includes a material dividing plate and a material dividing rod. The material dividing plate spans the tile pull line and is installed on both sides of the base. A material dividing block is welded on the top of the material dividing plate. A locking piece is provided on the material dividing block. The material dividing rod passes through the material dividing block and is fixed on the material dividing block by the locking piece.

2. A polishing device according to claim 1, characterized in that: The powder spraying device includes a fixing frame and a material box. The material box is perpendicular to the direction of the tile pulling line and can be detachably installed on the fixing frame and is movably connected to a vibration cylinder installed on the base. The fixing frame spans the tile pulling line and can be detachably installed on the base.

3. A polishing device according to claim 2, characterized in that: The material box is a cavity structure with an open top, and its inner wall is sloped all around. A powder leakage groove is provided at the bottom of the material box, and a hollow net is provided inside the material box close to the bottom surface and surrounding the powder leakage groove.

4. A polishing device according to claim 1, characterized in that: The buffer frame is H-shaped, one end of which is mounted on the rotating shaft, and the other end of which is symmetrically mounted with rollers.

5. A polishing device according to claim 1, characterized in that: The polishing end includes a shell and a grinding device and a cleaning device installed inside the shell. The grinding device includes a driving device, a second beam, a linear guide rail and a roller row. The driving device is placed on the upper end of the second beam and is movably connected to the second beam. The roller row and the linear guide rail are both installed on the second beam and move with the second beam. A grinding disk is installed at the lower end of the roller row near the tile pulling line. The cleaning device is arranged inside the grinding device and is arranged directly opposite the grinding disk.

6. A polishing device according to claim 1, characterized in that: The tile pulling wire is transmitted by a pulley.

7. A polishing device according to claim 1, characterized in that: A dehydration mechanism is provided between the polishing end and the powder spraying device. The dehydration mechanism comprises a U-shaped bracket and a dehydration roller. The dehydration roller is installed between the U-shaped brackets which are symmetrically arranged and welded on both sides of the base and contacts with the surface of the tile.

8. A polishing device according to claim 1, characterized in that: The base is located at the rear end of the material distribution device and close to the polishing end, and a third cross beam is provided. The top end face of the third cross beam is symmetrically provided with strip holes, and positioning screws are installed through the strip holes. The third cross beam is located between the positioning screws and a clamping roller is provided, which is set close to the tile.

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