A flushing channel device for integrated circuits

Abstract

The invention discloses a flow channel flushing device for integrated circuits, comprising a frame, and a buffer area, a flow channel flushing area and a collection area located on the frame. The flow channel flushing device has a compact structure and improves work efficiency.

Description

Technical Field

[0001] The invention relates to manufacturing equipment for integrated circuits, in particular to a flushing channel equipment for integrated circuits. Background Art

[0002] At present, the process work after integrated circuit packaging is completed by scattered different equipment. For example, the flushing process of integrated circuits is completed by the flushing mold. After the flushing process, the finished product after the flushing is placed in the finished product collection device manually, or the finished product is first taken out of the flushing mold by a robot, and then placed in the finished product collection device. Since each device is set up separately, on the one hand, it occupies more space, and on the other hand, it requires more operators, which leads to unstable and uncontrollable product quality, low production efficiency and high cost. Summary of the invention

[0003] The invention provides a flow channel flushing device for integrated circuits, which has a compact structure and improves work efficiency.

[0004] To solve the above technical problems, the embodiments of the present invention adopt the following technical solutions:

[0005] A flushing channel device for integrated circuits comprises a frame, and a buffer area, a flushing channel area and a collection area located on the frame.

[0006] As a preferred example, during normal operation, the integrated circuit flows in the order of the buffer area, the flushing channel area, and the collection area.

[0007] As a preferred example, the flushing channel area and the collection area are arranged side by side, and the buffer area is located on the same side of the flushing channel area and the collection area.

[0008] As a preferred example, the flushing channel equipment for integrated circuits further includes a grabbing device movably connected to the frame, and the grabbing device is used to grab the plastic-sealed integrated circuit chip from the buffer area to the flushing channel area.

[0009] As a preferred example, the grabbing device is also used to grab the integrated circuit chip after flushing the flow channel from the flushing channel area to the collection area.

[0010] As a preferred example, the flushing channel area includes a first guide rail, a flushing channel mold including an upper mold and a lower mold, the first guide rail and the upper mold are respectively connected to the frame; the lower mold is located on the first guide rail and can move along the first guide rail; the lower mold can be opposite to the upper mold.

[0011] As a preferred example, the flushing channel area also includes a lower mold cleaning device, which is connected to the upper mold or the frame, and is used to clean the lower mold.

[0012] As a preferred example, the lower mold cleaning device includes a negative pressure device and a first pipeline, and the upper end of the first pipeline is connected to the air inlet of the negative pressure device.

[0013] As a preferred example, the lower mold cleaning device also includes a second pipe, one end of the second pipe is connected to the air outlet of the negative pressure device, and the other end of the second pipe is located in the waste collection device.

[0014] As a preferred example, the lower end of the first pipe is strip-shaped and arranged along the longitudinal direction of the lower mold; or, there are multiple first pipes, and the multiple hoses are arranged along the longitudinal direction of the lower mold.

[0015] As a preferred example, the flow channel flushing equipment for integrated circuits further includes a first detection device, which is connected to the grabbing device and is used to detect whether the central flow channel of the plastic-sealed integrated circuit chip grabbed from the buffer area is intact.

[0016] As a preferred example, the first detection device includes a suction cup and a suction cup bracket, the suction cup is connected to the suction cup bracket, the suction cup bracket is connected to a grasping device, and the grasping device provides an air source for the suction cup.

[0017] As a preferred example, the collection area includes a waste collection sub-area, a detection sub-area, and a finished product collection sub-area which are arranged in sequence.

[0018] As a preferred example, the collection area includes a bracket, a second guide rail, a finished product collection device, a waste collection device and a second detection device; the second guide rail is connected to the frame; the bracket is located on the second guide rail and can move along the second guide rail; the second detection device is used to detect whether the integrated circuit chip after flushing the flow channel is qualified; the finished product collection device is used to collect the integrated circuit chips that have passed the inspection of the second inspection device; the waste collection device is used to collect the integrated circuit chips that have failed the inspection of the second inspection device.

[0019] As a preferred example, the second detection device includes a visual sensor, which is distributed above and below the second guide rail and is used to detect the integrated circuit chip located in the detection sub-area.

[0020] As a preferred example, the finished product collecting device and the waste collecting device are both located below the second guide rail, the finished product collecting device is located in the finished product collecting sub-area, and the waste collecting device is located in the waste collecting sub-area.

[0021] Compared with the prior art, the equipment of the embodiment of the present invention has a compact structure, a small footprint, and high work efficiency. The equipment of the embodiment of the present invention includes a frame, and a buffer area, a flow channel area, and a collection area located on the frame. The equipment integrates the buffer, flow channel, and collection processes. Compared with the existing decentralized devices, the equipment of this embodiment has a compact structure and a small footprint. At the same time, the buffer, flow channel, and collection are compactly connected, which improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a top view of an embodiment of the present invention;

[0023] Figure 2 is a front view of an embodiment of the present invention;

[0024] Figure 3 is a stereogram of an embodiment of the present invention;

[0025] Figure 4 It is a schematic structural diagram of the first detection device in an embodiment of the present invention.

[0026] In the figure, there are: frame 1, buffer area 2, flushing channel area 3, first guide rail 301, flushing channel mold 302, upper mold 3021, lower mold 3022, lower mold cleaning device 303, collection area 4, bracket 401, second guide rail 402, finished product collection device 403, waste collection device 404, second detection device 405, grasping device 5, first detection device 6, suction cup 601, suction cup bracket 602. DETAILED DESCRIPTION

[0027] The technical solution of the present invention is described in detail below in conjunction with the accompanying drawings.

[0028] like Figures 1 to 3 As shown, a flushing channel device for integrated circuits according to an embodiment of the present invention comprises a frame 1 , and a buffer area 2 , a flushing channel area 3 and a collection area 4 located on the frame 1 .

[0029] In this embodiment, multiple functions are integrated on the same device. The integrated circuit chip after plastic sealing is placed in the buffer area 2 of this embodiment, then enters the flushing channel area 3 for flushing channel treatment, and finally enters the collection area 4. In the collection area 4, qualified integrated circuit chips are collected. The device of this embodiment realizes the automated operation of the integrated circuit chips after plastic sealing, reduces manual operation, and improves work efficiency. Compared with the existing decentralized devices, the device of this embodiment has a compact structure and occupies a small area.

[0030] During normal operation, the integrated circuit chips flow in the order of the buffer area 2, the flushing channel area 3, and the collecting area 4. When the integrated circuit chip is detected to be damaged, the flow is stopped.

[0031] In order to realize fully automated operation, the flushing channel equipment of this embodiment also includes a grabbing device 5 movably connected to the frame 1. The grabbing device 5 is used to grab the integrated circuit chip after plastic sealing from the buffer area 2 to the flushing channel area 3. The buffer area 2 can hold multiple integrated circuit chips. The grabbing device 5 grabs the integrated circuit chip after plastic sealing and places it on the lower mold of the flushing channel area 3. Preferably, after the integrated circuit chip is processed by the flushing channel, the grabbing device 5 is used to grab the integrated circuit chip after the flushing channel from the flushing channel area 3 to the collection area 4. Preferably, the grabbing device 5 is a manipulator that can move up and down. Taking the manipulator as an example, when it is necessary to grab the integrated circuit chip, the manipulator moves downward to grab the integrated circuit chip; after grabbing, the manipulator moves upward to place the integrated circuit chip in a suitable position.

[0032] Preferably, the gripping device 5 is mounted on the frame 1 via a guide rail. According to the motion trajectory requirements, the gripping device 5 can move forward and backward and left and right along the guide rail. Figure 1 As shown, the guide rails include a transverse guide rail and two longitudinal guide rails, and the gripping device 5 is connected to the transverse guide rail and can move left and right along the transverse guide rail. The transverse guide rail is connected to the two longitudinal guide rails, and the transverse guide rail can move forward and backward along the longitudinal guide rails.

[0033] In the above embodiment, the flushing channel area 3 and the collection area 4 are arranged in parallel, and the buffer area 2 is located on the same side of the flushing channel area 3 and the collection area 4. With this arrangement, the structure is more compact. At the same time, the same grabbing device 5 can be used to grab the integrated circuit chip from the buffer area 2 to the flushing channel area 3, and to grab the integrated circuit chip from the flushing channel area 3 to the collection area 4. In this preferred example, the layout of the buffer area 2, the flushing channel area 3 and the collection area 4 can reduce the movement track of the grabbing device 5 and improve work efficiency.

[0034] Preferably, the buffer area 2 may be provided with a plurality of brackets for holding the integrated circuit chips after plastic packaging. The integrated circuit chips on the brackets of the buffer area 2 are grabbed to the flushing channel area 3 by the grabbing device 5 .

[0035] Preferably, the flushing channel area 3 includes a first guide rail 301, a flushing channel mold 302 including an upper mold 3021 and a lower mold 3022. The first guide rail 301 and the upper mold 3021 are respectively connected to the frame 1, and the lower mold 3022 is located on the first guide rail 301 and can move along the first guide rail 301. The lower mold 3022 can be opposite to the upper mold 3021.

[0036] In this preferred embodiment, the packaged integrated circuit chip is first placed on the lower mold 3022; then the lower mold 3022 is moved so that the lower mold 3022 and the upper mold 3021 are opposite to each other; then the upper mold 3021 is started, the upper mold 3021 moves downward, and the upper mold 3021 and the lower mold 3022 begin to close the mold, punching out the unwanted waste on the product, and realizing the flushing of the integrated circuit chip. After the flushing of the flow channel is completed, the upper mold 3021 is started to move upward; then the lower mold 3022 is moved in the first guide rail 301 to move out of the position opposite to the upper mold 3021; ​​the integrated circuit chip located on the lower mold 3022 is taken out by the grasping device 5, and enters the next collection process.

[0037] After the flushing process is completed, the lower mold 3022 moves along the first guide rail 301, away from the position relative to the upper mold 3021, and enters the collection process. The flushing process and the collection process are closely connected, which improves work efficiency.

[0038] To further improve work efficiency, the device of this embodiment further includes a power device, which is connected to the lower mold 3022 to drive the lower mold 3022 to move along the first guide rail 301. The power device is used to drive the lower mold 3022 to move along the first guide rail 301 to achieve the movement of the lower mold 3022, which can improve work efficiency.

[0039] During operation, after the grabbing device 5 grabs the integrated circuit chip after the flushing, the lower mold 3022 moves along the first guide rail 301 toward the upper mold 3021. At this time, there may still be residual waste on the lower mold 3022. If these wastes are not cleaned up, it will affect the placement of new integrated circuit chips in the subsequent steps, and further affect the flushing process. Therefore, before the lower mold 3022 carries the new plastic-sealed integrated circuit, it is necessary to clean the waste on the surface of the lower mold 3022.

[0040] In a preferred embodiment, the flushing channel area 3 further includes a lower mold cleaning device 303, which is connected to the upper mold 3021 or the frame 1, and is used to clean the lower mold 3022. The lower mold cleaning device 303 can be moved up and down by a cylinder.

[0041] Preferably, the lower mold cleaning device 303 includes a negative pressure device and a first pipe, and the upper end of the first pipe is connected to the air inlet of the negative pressure device. When working, the first pipe sucks the waste on the surface of the lower mold 3022 into the first pipe through the negative pressure generated by the negative pressure device, thereby achieving the purpose of cleaning the surface of the lower mold 3022.

[0042] Preferably, the lower mold cleaning device 303 further includes a second pipe. One end of the second pipe is connected to the air outlet of the negative pressure device, and the other end of the second pipe is located in the waste collection device. In this way, the waste on the surface of the lower mold 3022 is sent to the waste collection device through the first pipe and the second pipe. Preferably, the waste collection device is located in the collection area 4.

[0043] To improve the cleaning effect, preferably, the lower end of the first pipe is strip-shaped and arranged along the longitudinal direction of the lower mold 3022; or, the first pipe is multiple, and the multiple hoses are arranged along the longitudinal direction of the lower mold 3022. Since the lower mold 3022 moves horizontally along the first guide rail 301, the first pipe adopts the arrangement method of this preferred example, and waste can be cleaned as much as possible during the horizontal movement of the lower mold 3022.

[0044] In this embodiment, after all products on the lower mold 3022 are moved to the next workstation by the robot, the lower mold 3022 is moved to the side of the upper mold 3021 again. During the movement, the lower mold cleaning device 303 cleans and absorbs any debris that may remain on the lower mold 3022. Finally, the lower mold 3022 moves to the initial position, waiting to receive the next new loading frame.

[0045] In order to ensure that the central flow channel of the plastic-sealed integrated circuit chip entering the flushing channel area 3 from the buffer area 2 is not damaged, preferably, the equipment also includes a first detection device 6, which is connected to the grasping device 5, and the first detection device 6 is used to detect whether the central flow channel of the plastic-sealed integrated circuit chip grasped from the buffer area 2 is intact.

[0046] If the integrated circuit chip is incomplete, it cannot enter the flushing process. A first detection device 6 is set on the gripping device 5. If the first detection device 6 detects that the integrated circuit chip is incomplete, an alarm is issued. After the alarm is issued, the alarm can be eliminated after human intervention, and then the next link process is carried out.

[0047] Preferably, Figure 4 As shown, the first detection device 6 includes a suction cup 601 and a suction cup bracket 602, wherein the suction cup 601 is connected to the suction cup bracket 602, and the suction cup bracket 602 is connected to the grasping device 5, and the grasping device 5 provides an air source for the suction cup 601. The suction cup 601 corresponds to the central flow channel of the integrated circuit chip one by one. If the central flow channel is damaged, the suction cup 601 cannot establish a set negative pressure value when adsorbing the central flow channel, thereby an alarm is triggered.

[0048] Preferably, the collection area 4 includes a waste collection sub-area, a detection sub-area, and a finished product collection sub-area which are arranged in sequence. The integrated circuit chip after the flow channel may be a qualified product or an unqualified product. In this preferred example, the collection area 4 includes a waste collection sub-area, a detection sub-area, and a finished product collection sub-area which are arranged in sequence. The detection sub-area is used to detect whether the integrated circuit chip after the flow channel is qualified. The waste collection sub-area is used to collect unqualified integrated circuit chips. The finished product collection sub-area is used to collect qualified integrated circuit chips. In this way, the collection area 4 integrates the two functions of detection and collection.

[0049] Preferably, the collection area 4 includes a bracket 401, a second guide rail 402, a finished product collection device 403, a waste collection device 404, and a second detection device 405. The second guide rail 402 is connected to the frame 1, and the bracket 401 is located on the second guide rail 402 and can move along the second guide rail 402; the second detection device 405 is used to detect whether the integrated circuit chip after the flow channel is flushed is qualified; the finished product collection device 403 is used to collect the integrated circuit chips that are qualified by the second detection device 405; the waste collection device 404 is used to collect the integrated circuit chips that are unqualified by the second detection device 405.

[0050] The bracket 401 is used to hold the integrated circuit chips after the flow channel is grabbed from the flow channel area 3. At this time, the bracket 401 can be located in the waste collection sub-area. This can reduce the length of the second guide rail 402, making the structure more compact. The bracket 401 carries the integrated circuit chips after the flow channel, moves on the second guide rail 402, and moves from the waste collection sub-area to the detection sub-area. In the detection sub-area, the integrated circuit chips after the flow channel located on the bracket 401 are detected by the second detection device 405 to see whether they are qualified products. If the test result is a qualified product, it moves along the second guide rail 402 to the finished product collection sub-area, unloads the integrated circuit chips to the finished product collection device 403, and then returns to the initial position (i.e., the waste collection sub-area) to wait for the next integrated circuit chip after the flow channel. If the test result is an unqualified product, it returns to the waste collection sub-area (i.e., the initial position) along the second guide rail 402, unloads the integrated circuit chips to the waste collection device 404, and then waits in place for the next integrated circuit chip after the flow channel.

[0051] Preferably, the second detection device 405 includes visual sensors, which are distributed above and below the second guide rail 402 and are used to detect the integrated circuit chip located in the detection sub-area. The second detection device 405 can be four visual sensors, which can perform comprehensive detection on the front and back of the integrated circuit chip after the flushing flow channel.

[0052] Preferably, the finished product collection device 403 and the waste collection device 404 are both located below the second guide rail 402, the finished product collection device 403 is located in the finished product collection sub-area, and the waste collection device 404 is located in the waste collection sub-area. The finished product collection device 403 is used to collect the integrated circuit chips that have passed the inspection of the second inspection device 405. The waste collection device 404 is used to collect the integrated circuit chips that have failed the inspection of the second inspection device 405. The waste collection device 404 can also be used to collect residues on the surface of the lower mold 3022 in the flushing channel area 3.

[0053] The device of the above embodiment integrates the functions of caching, flushing and collecting the integrated circuit chips to be processed into one device, and transforms manual operation into mechanical automatic operation. The device saves space, reduces the number of operators, and can also make the product quality stable and controllable, significantly improving work efficiency.

[0054] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above specific embodiments. The above specific embodiments and the description in the specification are only for further illustrating the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of the present invention to be protected is defined by the claims and their equivalents.

Claims

1. A flushing channel device for integrated circuits, characterized in that: It comprises a frame (1), and a buffer area (2), a flow channel area (3) and a collection area (4) located on the frame (1); It also includes a grabbing device (5) movably connected to the frame (1), the grabbing device (5) being used to grab the plastic-sealed integrated circuit chip from the buffer area (2) to the flushing channel area (3); It also comprises a first detection device (6), the first detection device (6) is connected to the grasping device (5), and the first detection device (6) is used to detect whether the central flow channel of the integrated circuit chip after plastic sealing grasped from the buffer area (2) is complete; the first detection device (6) comprises a suction cup (601) and a suction cup support (602), the suction cup (601) is connected to the suction cup support (602), the suction cup support (602) is connected to the grasping device (5), and the grasping device (5) provides an air source for the suction cup (601); During normal operation, the integrated circuit flows in the order of the buffer area (2), the flushing channel area (3), and the collection area (4); The flushing channel area (3) and the collecting area (4) are arranged in parallel, and the buffer area (2) is located on the same side of the flushing channel area (3) and the collecting area (4); The grabbing device (5) is also used to grab the integrated circuit chip after flushing the flow channel from the flushing flow channel area (3) to the collection area (4).

2. The flushing channel device for integrated circuits according to claim 1, characterized in that: The flushing channel area (3) comprises a first guide rail (301), a flushing channel mold (302) comprising an upper mold (3021) and a lower mold (3022), wherein the first guide rail (301) and the upper mold (3021) are respectively connected to the frame (1); the lower mold (3022) is located on the first guide rail (301) and can move along the first guide rail (301); and the lower mold (3022) can be opposite to the upper mold (3021).

3. The flushing channel device for integrated circuits according to claim 2, characterized in that: The flushing channel area (3) further comprises a lower die cleaning device (303), the lower die cleaning device (303) being connected to the upper die (3021) or the frame (1), and the lower die cleaning device (303) being used to clean the lower die (3022).

4. The flushing channel device for integrated circuits according to claim 3, characterized in that: The lower mold cleaning device (303) comprises a negative pressure device and a first pipeline, and the upper end of the first pipeline is connected to the air inlet of the negative pressure device.

5. The flushing channel device for integrated circuits according to claim 4, characterized in that: The lower mold cleaning device (303) also includes a second pipe, one end of the second pipe is connected to the air outlet of the negative pressure device, and the other end of the second pipe is located in the waste collection device.

6. The flushing channel device for integrated circuits according to claim 4, characterized in that: The lower end of the first pipe is strip-shaped and is arranged along the longitudinal direction of the lower mold (3022); or, there are multiple first pipes, and the multiple hoses are arranged along the longitudinal direction of the lower mold (3022).

7. The flushing channel device for integrated circuits according to claim 1, characterized in that: The collection area (4) comprises a waste collection sub-area, a detection sub-area, and a finished product collection sub-area which are arranged in sequence.

8. The flushing channel device for integrated circuits according to claim 7, characterized in that: The collection area (4) comprises a bracket (401), a second guide rail (402), a finished product collection device (403), a waste product collection device (404) and a second detection device (405); The second guide rail (402) is connected to the frame (1); The bracket (401) is located on the second guide rail (402) and can move along the second guide rail (402); the second detection device (405) is used to detect whether the integrated circuit chip after flushing the flow channel is qualified; the finished product collection device (403) is used to collect the integrated circuit chips that are qualified by the second detection device (405); and the waste collection device (404) is used to collect the integrated circuit chips that are unqualified by the second detection device (405).

9. The flushing channel device for integrated circuits according to claim 8, characterized in that: The second detection device (405) comprises a visual sensor, which is distributed above and below the second guide rail (402) and is used to detect the integrated circuit chip located in the detection sub-area.

10. The flushing channel device for integrated circuits according to claim 8, characterized in that: The finished product collection device (403) and the waste product collection device (404) are both located below the second guide rail (402), the finished product collection device (403) is located in the finished product collection sub-area, and the waste product collection device (404) is located in the waste product collection sub-area.

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