A full omnidirectional light emitting LED light source for automotive lighting

Abstract

The application discloses a novel omnibearing light-emitting LED light source applied to automobile lighting, which comprises an LED support, an LED substrate, a plurality of LED chip assemblies installed on the substrate, encapsulating glue, an inner circuit structure plastic casing, assembling screws and high-temperature-resistant insulating layer wires; the LED support is formed with a column body for loading the LED chip assemblies; a plurality of planes are arranged on the outer side of the column body; the LED chip assemblies are attached to the planes on the outer side of the column body to form multi-surface light emission; and the LED substrate is provided with at least the LED chips above PCS.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of automobile lamps, in particular to a full-range light-emitting LED light source for automobile lighting. BACKGROUND

[0002] The performance of the headlamp light source is not only a component of the appearance of the automobile, but also a main lighting device for driving at night or in bad weather conditions, which plays a vital role in driving safety. At present, in order to reduce the cost of the automobile, most automobile manufacturers in the market use halogen lamps as the light source of the headlamp, and special reflector cups are equipped according to the light shape of the halogen lamp to perform light distribution, so as to avoid dazzling the drivers of oncoming vehicles. However, since the halogen lamp has large power, low brightness and short service life, the halogen lamp needs to be replaced in time to avoid safety hazards once light decay occurs. On the other hand, since the LED light source has the advantages of long service life and high light efficiency, when the halogen lamp needs to be replaced, using the LED lamp to replace the halogen lamp has become a market trend.

[0003] With the wide use of LED automobile headlamps in the application market, since the performance of the LED automobile lamp directly affects the safety of driving, people's requirements for the LED automobile headlamp are also getting higher and higher, and people are constantly pursuing the stable characteristics of the LED automobile headlamp with high light efficiency and long service life. However, a large amount of heat will be generated when using a high-power LED light source, and the accumulated heat cannot be dissipated in time and effectively, which will seriously affect the light efficiency and service life of the LED light source.

[0004] In view of the above LED light source heat dissipation and light paving road requirements, the present application provides a product that improves the heat dissipation performance of the LED light source, reduces the blind area and is easy to assemble to meet the application requirements. SUMMARY

[0005] The present application is to overcome the above-mentioned deficiencies, and aims to provide a technical solution to solve the above-mentioned problems.

[0006] A full-range light-emitting LED light source for automobile lighting, comprising: an LED support, an LED substrate module, a plurality of LED chip assemblies mounted on the LED substrate module, an encapsulating glue, an internal circuit structure plastic shell, an assembly screw and a high-temperature-resistant insulating layer wire;

[0007] The LED support is formed with a column for loading the LED chip assembly, and a plurality of planes are provided on the outer side of the column. The LED chip assembly is attached to the planes on the outer side of the column to form multi-surface light emission. The LED substrate module is provided with at least PCS or more LED chips;

[0008] The LED substrate module is provided with a substrate positive electrode and a substrate negative electrode, and the LED chip is connected to form a conduction circuit and is connected to the substrate positive electrode and the substrate negative electrode respectively. The substrate positive electrode and the substrate negative electrode of the LED substrate module are designed on the top of the LED substrate module and ensure that the substrate positive electrode and the substrate negative electrode have a height difference. The back of the LED substrate module is provided with a metal welding part. The substrate positive electrode and the substrate negative electrode of the LED substrate module are connected by an internal circuit structure plastic shell respectively, so as to ensure that the substrate positive electrode and the substrate negative electrode of each LED substrate module form a series circuit and are led out through an independent wire containing a high-temperature-resistant insulating layer.

[0009] As a further scheme of the present application: the column is provided with an internal circuit structure plastic shell, and the internal circuit structure plastic shell is provided with a plurality of groups of side lead points and lead point groups on the inside. Each group of lead point groups includes at least one positive lead point and one negative lead point, and the positive lead point and the negative lead point are one-to-one corresponding to the inside lead point of the internal circuit structure plastic shell and have a consistent height difference. The internal circuit structure plastic shell covers the lower end of the LED substrate module. The positive lead point contacts the substrate positive electrode and forms electrical conduction. The negative lead point contacts the substrate negative electrode and forms electrical conduction. The lower part of the insulating internal circuit structure plastic shell is further provided with a positive lead wire electrically connected to the positive lead point. The positive lead point is welded or fixed through a conductive spring and forms electrical conduction, so that the substrate positive electrode of the LED substrate module is connected to the positive lead wire. The lower part of the internal circuit structure plastic shell is further provided with a negative lead wire electrically connected to the negative lead point. The negative lead point is welded and fixed to the negative lead wire and forms electrical conduction, so that the substrate negative electrode of the LED substrate module is connected to the negative lead wire.

[0010] As a further scheme of the present application: the LED support is provided with a wire heat dissipation groove along the lower end surface thereof, which is used for accommodating positive and negative wires and dissipating heat. The bottom surface of the wire heat dissipation groove extends to one plane outside the column and is flush with the plane. The internal circuit structure plastic shell is positioned at the lower end of the column and covers the wire heat dissipation groove to ensure its appearance. According to the circuit control, a positive and negative wire compatible wire heat dissipation groove or positive and negative wires can be opened through separate wires to form a plurality of wire heat dissipation grooves.

[0011] As a further scheme of the present application: the wire heat dissipation groove is drilled at the positions corresponding to the substrate positive electrode and the substrate negative electrode of the LED substrate module on each plane of the LED support and the column to realize wire connection. The positions of the substrate positive electrode and the substrate negative electrode of the LED substrate module are provided with positioning probes. The positioning probes are positioned in the holes through glass sintering or injection molding process. The positions of the positioning probes are determined according to the polarity positions of the LED substrate module, and a height difference is formed. The positioning probes play a fixing role in the process of welding the LED substrate module to the column.

[0012] As a further scheme of the present application: the LED substrate module adopts any one of an aluminum oxide substrate, an aluminum nitride substrate, a superconducting aluminum substrate, and a copper substrate; and the cross section of the column is polygonal.

[0013] As a further scheme of the present application: the LED support is installed on the screw thread of the LED support platform by screwing, a reserved part is combined with a required assembly part, the bottom of the LED support is soldered to other metal contact surfaces through tin paste to form a good heat conduction and non-detachable structure, the bottom metal soldering part of the LED substrate module is soldered to the column, and high-temperature tin wire is used for soldering each wire and electrode soldering point.

[0014] As a further scheme of the present application: the LED substrate module includes an LED substrate and two or more groups of LED chip assemblies arranged on the LED substrate, each group of LED chip assemblies includes at least one LED chip, the positive electrode of the LED chip in the LED chip assembly is soldered to the positive electrode of the substrate in a one-to-one manner, and the negative electrode of the LED chip in the LED chip assembly is soldered to the negative electrode of the substrate of the LED substrate module in a one-to-one manner through a lead joint.

[0015] As a further scheme of the present application: the LED support platform is extended to a heat conduction column, the heat conduction column is surrounded by threads, the number of thread turns is set according to the focal length of the corresponding automobile lamp type, and a corresponding positioning snap ring assembly is matched.

[0016] As a further scheme of the present application: the packaging glue is packaging epoxy resin glue or silicone glue.

[0017] Compared with the prior art, the present application has the following advantages: 1. The similar products on the market design the support column part as a conductive electrode, the LED support of the present application only has a heat conduction effect, the positive and negative polarities of the substrate are designed on the substrate and connected by corresponding independent wires, the effect of heat and electricity separation is fully achieved, and the heat dissipation effect and service life of the LED light source are greatly improved;

[0018] 2. The light source support bottom and the heat dissipation base of the similar products on the market are mostly riveted or matched between a screw and a nut, and a corresponding heat conduction silicone grease is added in the middle, the heat conduction coefficient of the heat conduction silicone grease itself is lower than that of tin paste, and after a long time, the heat conduction effect cannot be effectively and long-term achieved due to dryness, there is a risk of gap in this assembly, and it cannot be guaranteed that the light source and the heat dissipation base can be completely and persistently heat-conducted, the LED light source support and the heat dissipation base of the present application are combined and fixed by a screw and a designed screw thread, and are soldered by a reflow soldering process by coating tin paste, so that the LED light source support part and the heat dissipation base are fully contacted to achieve a good and persistent heat dissipation effect and improve the product performance, and the product assembly difficulty is reduced and the cost is lowered.

[0019] 3. The LED light source of the present application is omnidirectional, and the light type is better through the lens and the light cup, which reduces the blind area at night and is safer.

[0020] 4. The present application can design a far and near integrated LED light source for vehicles, and the far and near integrated light source can maintain a thermoelectric separation structure to improve product performance.

[0021] 5. The LED flip chip is used for light emission, which has better heat dissipation effect and longer service life, and no gold wire design, which is more convenient to weld, and the LED flip chip has larger light emission area, and compared with the current LED lamp, it has the advantages of small size, wide illumination direction, convenient installation, etc., so that the present application has strong market competitiveness.

[0022] Additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor under the premise of these drawings.

[0024] Figure 1 is the structural diagram of the present application;

[0025] Figure 2 is the structural diagram of the LED light source module in the present application;

[0026] Figure 3 is the top view of the positive and negative electrode layout of the built-in circuit structure plastic shell in the present application;

[0027] Figure 4 is the three-dimensional view of the positive and negative electrode layout of the built-in circuit structure plastic shell in the present application;

[0028] Figure 5 is the schematic diagram of the connection of the positive and negative electrode wires and the substrate electrode and the wire slot in the present application;

[0029] Figure 6 is the internal circuit diagram of the built-in circuit structure plastic shell in the present application;

[0030] Figure 7 is the structural diagram of another structure of the LED light source module in the present application;

[0031] Figure 8It is the front view of another structure of the LED substrate module in the application;

[0032] Figure 9 It is the structural schematic diagram of another structure of the LED light source support in the application;

[0033] Figure 10 It is the structural schematic diagram of another structure of the LED light source in the application;

[0034] Figure 11 It is the positive and negative layout of the plastic casing of the built-in circuit structure in another structure of the LED light source in the application;

[0035] Figure 12 It is the front view of the back structure of the LED substrate module in the application. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the application will be described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the application, not all the embodiments of the application. Based on the embodiments in the application, all the other embodiments obtained by those skilled in the art without creative work are within the protection scope of the application.

[0037] Please refer to Figures 1-12 In the embodiments of the application, the omnidirectional light-emitting LED light source applied to automobile lighting comprises an LED support 1, an LED substrate module 2, a plurality of LED chip assemblies installed on the LED substrate module 2, encapsulating glue 3, a built-in circuit structure plastic casing 4, assembling screws 5 and high-temperature-resistant insulating layer wires 7.

[0038] The LED support 1 is formed with a column 11 for loading the LED chip assemblies, and a plurality of planes are arranged on the outer side of the column 11. The LED chip assemblies are attached to the planes on the outer side of the column 11 to form multi-surface light emission. The LED substrate module 2 is provided with at least one piece of LED chip 22.

[0039] The LED substrate module 2 is provided with a substrate positive electrode 201 and a substrate negative electrode 202, and the LED chip 22 is connected to form a conduction circuit and is connected to the substrate positive electrode 201 and the substrate negative electrode 202 respectively. The substrate positive electrode 201 and the substrate negative electrode 202 of the LED substrate module 2 are designed above the LED substrate module 2 and ensure that the substrate positive electrode 201 and the substrate negative electrode 202 have a height difference in spacing. The LED substrate module 2 is provided with a metal welding part 23 on the back. The substrate positive electrode 201 and the substrate negative electrode 202 of the LED substrate module 2 are connected by an internal circuit structure plastic shell 4, which ensures that the substrate positive electrode 201 and the substrate negative electrode 202 of each LED substrate module 2 form a series circuit and are led out through an independent lead wire 7 containing a high-temperature-resistant insulating layer. In this design of LED light source, the LED support 1 only plays a role of heat dissipation and does not serve as a conductive electrode to achieve the purpose of thermal-electric separation. Since the LED support 1 is only used for heat conduction and heat dissipation, it is not electrified and will not generate heat, thereby having more ideal heat conduction and heat dissipation effect and improving the service life of the LED light source. At the same time, it will not limit the design of the entire LED light source, and this invention has great market competitiveness.

[0040] The column 11 is provided with an internal circuit structure plastic shell 4. The internal circuit structure plastic shell 4 has a plurality of groups of side lead points and lead point groups on the inside. Each group of lead point groups includes at least one positive lead point 42 and one negative lead point 41, and the positive lead point 42 and the negative lead point 41 correspond to the inside of the internal circuit structure plastic shell 4 one by one and have a consistent height difference. The internal circuit structure plastic shell 4 covers the lower end of the LED substrate module 2 periphery. The positive lead point 42 contacts the substrate positive electrode 201 and forms electrical conduction. The negative lead point 41 contacts the substrate negative electrode 202 and forms electrical conduction. The lower part of the insulating internal circuit structure plastic shell 4 is also provided with a positive lead wire 8 electrically connected to the positive lead point 42. The positive lead point 42 is welded or fixed by a conductive spring to the positive lead wire 8 and forms electrical conduction, so that the substrate positive electrode 201 of the LED substrate module 2 is connected to the positive lead wire 8. The lower part of the internal circuit structure plastic shell 4 is also provided with a negative lead wire 7 electrically connected to the negative lead point 41. The negative lead point 41 is welded and fixed to the negative lead wire 7 and forms electrical conduction, so that the substrate negative electrode 202 of the LED substrate module 2 is connected to the negative lead wire 7. The lead wire 78 and the internal circuit structure plastic shell 4 are both made of high-temperature-resistant materials, that is, they are not deformed or damaged through a reflow soldering process at about 260°C. In this design of LED light source, the LED support 1 only plays a role of heat dissipation and does not serve as a conductive electrode to achieve the purpose of thermal-electric separation, thereby improving the service life of the LED light source.

[0041] The LED support 1 is provided with a wire heat dissipation groove 12 along its lower end surface, which is used for accommodating positive and negative wires and dissipating heat. The bottom surface of the wire heat dissipation groove 12 extends to a plane outside the column 11 and is flush with the plane. The built-in circuit structure plastic shell 4 is positioned at the lower end of the column 11 and covers the wire heat dissipation groove 12 to ensure its appearance. At the same time, according to the circuit control, a positive and negative wire compatible wire heat dissipation groove or positive and negative wires can pass through separate wires to form multiple wire heat dissipation grooves.

[0042] The wire heat dissipation groove 12 can be drilled at the positions of the LED substrate module 2 substrate positive electrode 201 and substrate negative electrode 202 on each plane of the LED support 1 and the column 11 to realize wire connection. The positioning probes are arranged at the positions of the substrate positive electrode 201 and the substrate negative electrode 202 of the LED substrate module 2. The positioning probes 91 are positioned in the holes by glass sintering or injection molding process. The positions of the positioning probes 9192 are determined according to the polarity positions of the LED substrate module 2, and a height difference is formed. The positioning probes 9192 play a fixed role in the process of welding the LED substrate module 2 to the column 11. This design requires the built-in circuit structure plastic shell 4 to be arranged at the bottom of the LED support 1. Figure 11 The built-in circuit structure plastic shell 4 has a significant height difference between the insertion depth of the positive positioning probe 91 and the negative positioning probe 92. The positive positioning probe 91 is shorter, and the negative positioning probe 92 is longer and can be partially exposed at the probe part of the spring at the bottom of the built-in circuit structure plastic shell 4. The negative positioning probe 92 and the exposed part of the spring at the bottom of the built-in circuit structure plastic shell 4 can be welded by high-temperature tin wire with a temperature resistance of above 260℃. This facilitates the combination of the built-in circuit structure plastic shell 4 and the LED support 1 into one body, ensures the positioning of the positive and negative positioning probes 91 and 92 in the same depth positioning hole and forms a series circuit with the high-temperature resistant insulation layer wire 8, and ensures the positioning of the positive and negative positioning probes 91 and 92 in the same depth positioning hole and forms a series circuit with the high-temperature resistant insulation layer wire 7. The positive and negative positioning probes 91 and 92 form a height difference and are assembled in the built-in circuit structure plastic shell 4, which also maintains the height difference, ensures effective prevention of mistakes during assembly, and improves assembly efficiency.

[0043] The LED substrate module 2 adopts any one of an aluminum oxide substrate, an aluminum nitride substrate, a superconducting aluminum substrate, and a copper substrate. The cross section of the column 11 is polygonal.

[0044] The LED support 1 is installed by screwing the screw 5 with the screw thread 6 on the platform of the LED support 1, the reserved part is combined with the required assembly part, and the bottom of the LED support 1 and other metal contact surfaces are soldered by tin paste to form a good heat conduction and non-detachable structure. In the temperature control of reflow soldering, the soldering temperature difference needs to be maintained for different time periods. For example, the LED chip 22 is soldered on the LED substrate module 2 by using high-temperature tin paste soldering above 280℃, the metal soldering part 23 at the bottom of the LED substrate module is soldered on the column 11 by using high-temperature tin paste soldering at 260℃, and the structure between the LED chip 22 and the LED substrate module is ensured not to be affected by the secondary reflow soldering; the soldering points of the wires and electrodes are soldered by using high-temperature tin wire above 300℃, so that the soldering point loosening problem does not occur in the reflow soldering operation; the soldering between the bottom of the LED support 1 and the heat dissipation base is soldered by using tin paste with a melting temperature below 240℃ by the third reflow soldering to ensure that other parts are not damaged in the multiple reflow soldering process. This soldering process can select different tin paste or tin wire according to the needs of the multiple soldering process of the LED automobile headlamp to meet the requirements of temperature difference, product reliability and heat conduction effect.

[0045] The LED substrate module 2 includes an LED substrate 21 and two or more groups of LED chip assemblies arranged on the LED substrate 21. Each group of LED chip assemblies includes at least one LED chip 22. The positive electrode of the LED chip 22 in the LED chip assembly is soldered and conducted with the positive electrode 201 of the substrate, and the negative electrode of the LED chip 22 in the LED chip assembly is soldered and conducted with the negative electrode 202 of the substrate of the LED substrate module 2. When working, the LED substrate module 2 is powered on, and the LED chips 22 in the first group of LED chip assemblies can be controlled to emit light at the same time, and the LED chips 22 in the second group of LED chip assemblies do not emit light; the LED chips 22 in the second group of LED chip assemblies can be controlled to emit light at the same time, and the LED chips 22 in the first group of LED chip assemblies do not emit light; the LED chips 22 in the first group of LED chip assemblies can be used as the high beam of the automobile lamp, and the LED chips 22 in the first group of LED chip assemblies can be used as the low beam of the automobile lamp, that is, the high beam and the low beam functions can be realized at the same time, and the light emission can be independently controlled. Of course, the LED chips 22 in the first and second groups of LED chip assemblies can be controlled to emit light at the same time, and the structure can be referred to Figure 7 、 Figure 8 The plurality of wires are extended to ensure that the thermoelectric separation structure can be realized on the far and near integrated LED automobile headlamp.

[0046] The LED support 1 platform extends to a heat-conducting column, a thread is wound around the heat-conducting column, the number of turns of the thread can be set according to the focal length of the corresponding automobile lamp type, and meanwhile, a corresponding positioning snap ring assembly is matched, the structure is simple and convenient, meanwhile, the corresponding structure does not cause the problems of assembly gap and different heat conduction coefficients between different materials leading to poor heat dissipation, and the heat conduction performance of the product is effectively improved.

[0047] The packaging glue 3 is a packaging epoxy resin glue or a silicon glue.

[0048] It is apparent for a person skilled in the art that the application is not limited to the details of the above-described exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, the scope of the application being defined by the appended claims rather than the above description, and all changes falling within the meaning and range of equivalence of the claims are intended to be embraced therein.

Claims

1. A omnidirectional light emitting LED light source for automotive lighting, characterized in that, It includes: LED support, LED substrate module, several LED chip assemblies installed on the LED substrate module, encapsulation glue, built-in circuit structure plastic shell, assembly screws and high-temperature-resistant insulating layer wires; The LED support is formed with a column for loading the LED chip assembly, and the outer side of the column is provided with multiple planes. The LED chip assembly is attached to the planes on the outer side of the column to form multi-surface light emission. The LED substrate is provided with at least PCS above the LED chip; The LED substrate module is formed with a substrate positive electrode and a substrate negative electrode. The LED chip is connected to form a conduction circuit and is connected to the substrate positive electrode and the substrate negative electrode, respectively. The substrate positive electrode and the substrate negative electrode of the LED substrate module are designed above the LED substrate module and ensure that the distance between the substrate positive electrode and the substrate negative electrode has a height difference. The back of the LED substrate module is provided with a metal welding site. The substrate positive electrode and the substrate negative electrode of the LED substrate module are connected by the built-in circuit structure plastic shell, respectively, to ensure that the substrate positive electrode and the substrate negative electrode of each LED substrate module form a series circuit and are led out through independent high-temperature-resistant insulating layer wires. The LED support is formed with a column for loading the LED chip assembly, and the outer side of the column is provided with multiple planes. The LED chip assembly is attached to the planes on the outer side of the column to form multi-surface light emission. The LED substrate is provided with at least PCS above the LED chip; The LED support is formed with a column for loading the LED chip assembly, and the outer side of the column is provided with multiple planes. The LED chip assembly is attached to the planes on the outer side of the column to form multi-surface light emission. The LED substrate is provided with at least PCS above the LED chip; The wiring and heat dissipation groove is drilled at the positions of the substrate positive electrode and the substrate negative electrode of the corresponding LED substrate module on each plane of the LED support and the column to realize wiring. The positioning probe is arranged at the positions of the substrate positive electrode and the substrate negative electrode of the LED substrate module. The positioning probe is positioned in each hole through glass sintering or injection molding process. The position of the positioning probe is determined according to the polarity position of the LED substrate module, and a height difference is formed. The positioning probe plays a fixing role during the welding of the LED substrate module on the column.

2. The omnidirectional light emitting LED light source for automotive lighting according to claim 1, wherein, The column is provided with an inner circuit structure plastic shell, and the inner side of the inner circuit structure plastic shell has a plurality of groups of side guide contacts and guide contact groups. Each group of guide contact groups includes at least one positive guide contact and one negative guide contact, and the positive guide contact and the negative guide contact correspond to the inner side of the inner circuit structure plastic shell one by one and have consistent height differences. The inner circuit structure plastic shell covers the lower end of the LED substrate module, and the positive guide contact contacts the positive electrode of the substrate and forms electrical conduction. The negative guide contact contacts the negative electrode of the substrate and forms electrical conduction. The lower part of the insulating inner circuit structure plastic shell is further provided with a positive lead wire electrically connected to the positive guide contact. The positive guide contact is welded or fixed by a conductive spring and forms electrical conduction, so that the positive electrode of the LED substrate module is connected to the positive lead wire. The lower part of the inner circuit structure plastic shell is further provided with a negative lead wire electrically connected to the negative guide contact. The negative guide contact is welded and fixed to the negative lead wire and forms electrical conduction, so that the negative electrode of the LED substrate module is connected to the negative lead wire.

3. The omnidirectional light emitting LED light source for automotive lighting according to claim 1, wherein, The LED substrate module adopts any one of an aluminum oxide substrate, an aluminum nitride substrate, a superconducting aluminum substrate, and a copper substrate. The cross section of the column is polygonal.

4. The omnidirectional light emitting LED light source for automotive lighting according to claim 1, wherein, The LED support is installed on the screw thread on the LED support platform by screwing, and the reserved part is combined with the required assembly part. The bottom of the LED support and the other metal contact surface are welded by tin paste to form a good heat conduction and non-detachable structure. The bottom metal welding part of the LED substrate module is welded on the column, and each lead wire and electrode welding point is welded by high-temperature tin wire.

5. The omnidirectional light emitting LED light source for automotive lighting according to claim 1, wherein, The LED substrate module includes an LED substrate and two or more groups of LED chip assemblies arranged on the LED substrate. Each group of LED chip assemblies includes at least one LED chip. The positive electrode of the LED chip in the LED chip assembly is welded and conducted one by one with the positive electrode of the substrate. The negative electrode of the LED chip in the LED chip assembly is welded and conducted one by one with the negative electrode of the substrate of the LED substrate module through the guide contact.

6. The omnidirectional light emitting LED light source for automotive lighting according to claim 1, wherein, The LED support platform is extended as a heat conduction column, and the heat conduction column is surrounded by threads. The number of threads is set according to the focal length of the corresponding car light type, and the corresponding positioning ring assembly is matched.

7. The omnidirectional light emitting LED light source for automotive lighting according to claim 1, wherein, The packaging glue is a packaging epoxy resin glue or silicone.

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