An integrated laser packaging structure suitable for automated mass production

Abstract

This invention relates to an integrated laser packaging structure suitable for automated mass production, comprising a packaging box containing an upper cooler, a lower cooler, a laser chip assembly, an optical propagation assembly, an electrical connection assembly, a heat sink, and an optical fiber tail. The lower end face of the upper cooler has an upper coupling groove, and the upper end face of the lower cooler has a lower coupling groove and a first mounting groove, forming a coupling cavity. The heat sink is located within the first mounting groove, and the upper end of the heat sink has a second mounting groove, in which the laser chip assembly is mounted. A mounting assembly is fixedly installed within the coupling cavity. The position of each component within the packaging structure is predetermined, eliminating reliance on semi-automated testing and modulation during assembly, making it suitable for assembly line production. Furthermore, the use of a grooved cooler structure instead of the traditional sheet-like structure of a cooler allows the laser chip assembly and optical propagation assembly to be located within the laser-fiber coupling space formed by the grooves, resulting in better temperature control.

Description

Technical Field

[0001] This invention relates to the field of laser packaging technology, and in particular to an integrated laser packaging structure suitable for automated mass production. Background Technology

[0002] The purpose of laser packaging is to protect the laser chip, enable electrical and optical connections between the chip and the external environment, and facilitate heat dissipation. Butterfly packaging is a commonly used laser packaging method. Traditional butterfly packaging structures (such as...) Figure 8 The external structure includes a housing, a fiber optic connector, and seven pins on each side. The ample internal space allows for the inclusion of functional electronic components to enhance laser performance, such as a thermoelectric cooler (TEC), inductors, and thermistors. t ).

[0003] The challenge in butterfly packaging for lasers lies in aligning the optical path, as shown in the attached diagram. Figure 8 As shown, the laser emitted by the laser enters the fiber optic pigtail through the first collimating lens, the optical isolator, and the second collimating lens, and is then transmitted to the outside via the fiber optic pigtail. The optical path from the laser to the fiber optic pigtail is transmitted through the air, which is called the air optical path. The laser spot mode is an ellipse with a diameter of 2-5 μm, which is very small. Therefore, the alignment accuracy of each component in the air optical path is very high, usually 0.1-2 μm. Alignment deviations of a few micrometers can cause coupling losses of tens of percentages between the chip and the fiber optic pigtail, greatly reducing the output power of the packaged optical module. Therefore, in actual production, to achieve an alignment accuracy of 0.1-2 μm, the assembler needs to operate a precision coupling alignment device (including a six-axis displacement stage, a vision inspection system, a dispensing system, etc.) to semi-automatically position the laser chip, lens, and isolator, and then fix them to the substrate with thermally conductive adhesive. However, alignment remains a major obstacle in packaging technology. To improve alignment accuracy, various solutions have been devised, such as adjusting the mounting order of the collimating lens and the laser chip, using special fixtures to improve alignment accuracy and prevent post-soldering misalignment, and replacing the inverted packaging structure with the upright packaging structure; however, the effects have been minimal.

[0004] The fundamental reason for the poor alignment accuracy and low quality stability in the laser butterfly packaging process is that the packaging process has not yet formed a complete and fully automated assembly line production mode. The entire operation is carried out in a semi-automated, workshop-style manner with manual operation of equipment: the assembly of parts has no specific position or fixed standard, and it largely depends on the accuracy of the alignment equipment, the skills and experience of the assemblers. Even two laser packaged products manufactured by the same operator may have some differences in performance. Therefore, the current semi-automated production form is difficult to meet the requirements of laser packaging for stable and standardized product performance. Therefore, it is necessary to develop a laser packaging structure suitable for automated mass production. Summary of the Invention

[0005] This invention improves upon traditional butterfly packaging, providing an integrated laser packaging structure suitable for automated mass production. In this structure, the relative positions of components such as the laser chip, lens, optical isolator, and fiber optic tail are determined by slots within the structure, which are generated synchronously during the production of each component. That is, the position of each component is predetermined during production, and its alignment no longer relies on semi-automated testing and modulation during assembly. The assembly process simply involves inserting different components into their corresponding slots. This integrated structure is suitable for standardized mass production, standardizes the production process, improves production efficiency, and effectively enhances product quality and stability, overcoming the limitations of existing laser butterfly packaging solutions.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An integrated laser packaging structure suitable for automated mass production includes a packaging box, wherein an upper cooler, a lower cooler, a laser chip assembly, an optical propagation assembly, an electrical connection assembly, and a heat sink are disposed within the packaging box, and the lower end face of the upper cooler and the upper end face of the lower cooler are connected.

[0008] The upper cooler has an upper coupling groove on its lower end face, and the lower cooler has a lower coupling groove and a first mounting groove communicating with the lower coupling groove on its upper end face. The upper coupling groove and the lower coupling groove constitute a coupling cavity.

[0009] The heat sink plate is disposed in the first mounting groove, and a second mounting groove is provided at the upper end of the heat sink plate near the coupling cavity. The laser chip assembly is installed in the second mounting groove, and the laser chip assembly is electrically connected to the electrical connection assembly.

[0010] An installation assembly is fixedly installed inside the coupling cavity, and the optical propagation assembly is mounted on the installation assembly.

[0011] The side wall of the aforementioned encapsulation box is provided with an optical fiber interface that communicates with the aforementioned coupling cavity. The aforementioned optical fiber interface is provided with an optical fiber tail wire. The aforementioned optical fiber interface, the aforementioned coupling cavity, and the aforementioned second mounting slot are arranged sequentially along the direction of light propagation.

[0012] Preferably, the bottom of the mounting groove is provided with a plurality of first protrusions, and the lower side wall of the heat sink plate is provided with the same number of first grooves that cooperate with the first protrusions. The heat sink plate is installed in the first mounting groove through the cooperation of the first protrusions and the first grooves.

[0013] Preferably, the end of the first mounting groove away from the coupling cavity is provided with a first inclined surface, the heat sink plate is provided with a second inclined surface, the first inclined surface and the second inclined surface have the same slope, and any one of the first protrusions is inclined and its central axis is parallel to the plane where the first inclined surface is located.

[0014] Preferably, the laser chip assembly includes a laser chip, an optoelectronic chip, a thermistor, and a monitoring photodetector. The laser chip is inserted into an end groove provided on the optoelectronic chip, and the thermistor and the monitoring photodetector are integrated on the optoelectronic chip.

[0015] Preferably, the second mounting groove is provided with a plurality of second protrusions, and the lower sidewall of the optoelectronic chip is provided with the same number of second grooves that cooperate with the second protrusions at the corresponding positions. The optoelectronic chip is installed in the second mounting groove through the cooperation of the second protrusions and the second grooves.

[0016] Preferably, the end of the second mounting groove away from the coupling cavity is provided with a third inclined surface, the optoelectronic chip is provided with a fourth inclined surface, the fourth inclined surface has the same inclination as the third inclined surface, and any one of the second protrusions is inclined and its central axis is parallel to the plane where the third inclined surface is located.

[0017] Preferably, the lower surface of the upper cooler and the upper surface of the lower cooler abut against each other, and the upper surface of the laser chip, the upper surface of the optoelectronic chip, the upper surface of the heat sink plate, and the upper surface of the lower cooler are flush.

[0018] Preferably, the optical propagation component includes a first collimating lens, an optical isolator, and a second collimating lens arranged sequentially, and the mounting component includes three sets of mounting brackets, all of which are fixed to the inner sidewall of the coupling cavity; the first collimating lens, the optical isolator, and the second collimating lens are respectively mounted on the corresponding mounting brackets.

[0019] Preferably, the electrical connection assembly includes a first electrical connection assembly and a second electrical connection assembly; the first electrical connection assembly includes a first probe assembly, a circuit board, and a first socket area disposed on the package, wherein the laser chip assembly, the first probe assembly, the circuit board, and the first socket area are electrically connected in sequence; the second electrical connection assembly includes a second probe assembly and a second socket area, wherein the upper cooler and the lower cooler are both electrically connected to the second socket area through the second probe assembly.

[0020] Preferably, the packaging box includes an upper cover and a box body, the upper cover and the box body are fastened together, and the upper cooler and the lower cooler are fastened together.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] 1. The relative positions of the packaged components are determined during the assembly process, leaving no room for free movement during assembly. The laser butterfly packaging structure significantly reduces the dependence on the packaging process level, and packaging can be easily completed without meticulous operation. In the modular structure, the position of each component in the system is predetermined by the slot and other structures when producing the packaging shell, no longer relying on the semi-automated testing and modulation of the assembly process. It is suitable for standardized mass production mode, standardizes the production process, improves production efficiency, and can effectively improve product quality and quality stability, thus breaking through the limitations of existing laser butterfly packaging solutions.

[0023] 2. Integrating thermistors, photodetectors, and other functions onto the chip reduces packaging space and increases assembly integration.

[0024] 3. The new TEC structure is adopted, which makes the TEC occupy almost the entire package space, greatly improving the temperature control performance.

[0025] 4. The use of solder, silver paste and other adhesive materials in traditional packaging structures has been eliminated. Instead, surface grooves, raised engagement and other methods are used to fix all components in the packaging structure, avoiding the impact of changes in adhesive material thickness on alignment and coupling efficiency.

[0026] 5. Eliminate soft structures such as leads and gold wires, and replace them with hard structures such as probes and circuit boards to improve the stability of the packaging structure. Attached Figure Description

[0027] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 The figure shows a front sectional view of the overall packaging structure in an embodiment of the present invention (where the four dashed lines in the top cover represent the four insertion holes at the rear of the top cover, and the dashed lines at the bottom of the box represent the insertion holes at the rear of the box, as shown in the figure).

[0029] Figure 2 This is an overall diagram of the packaging structure in an embodiment of the present invention;

[0030] Figure 3 This is a three-dimensional perspective view of the upper cooler and its components in an embodiment of the present invention;

[0031] Figure 4 This is a three-dimensional perspective view of the lower cooler and its components in an embodiment of the present invention (wherein the first protrusion, the second protrusion, the first groove, and the second groove are not shown);

[0032] Figure 5 This is a schematic diagram of the structure of the laser chip, optoelectronic chip, heat sink, and downcooler in an embodiment of the present invention;

[0033] Figure 6 This is a connection structure diagram of the top cover, the first probe assembly, and the circuit board in an embodiment of the present invention (the figure shows the inner sidewall of the top cover);

[0034] Figure 7 This is a diagram showing the connection structure between the first probe assembly and the laser chip assembly in an embodiment of the present invention;

[0035] Figure 8 This is a diagram of the laser butterfly package structure described in the background section of this invention.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1. Encapsulation box; 101. Top cover; 102. Box body; 2. Upper cooler; 201. Upper coupling groove; 3. Lower cooler; 301. Lower coupling groove; 302. First mounting groove; 303. First protrusion; 304. First bevel; 4. Heat sink plate; 401. Second mounting groove; 402. Second protrusion; 403. Second bevel; 404. Third bevel; 5. Laser chip; 6. Optoelectronic chip; 601. Second groove; 602. Fourth bevel; 7. Thermistor; 8. Monitoring photodetector; 9. First collimating lens; 10. Optical isolator; 11. Second collimating lens; 12. Card holder; 13. Fiber optic interface; 14. Fiber optic tail; 15. Circular slot; 16. Circuit board; 17. First probe; 18. 19. Second probe; 20. Third probe; 21. Fourth probe; 22. Fifth probe; 23. Sixth probe; 24. Seventh probe; 25. Probe through hole; 26. Laser chip positive terminal socket; 27. Laser chip negative terminal socket; 28. Monitoring photodetector positive terminal socket; 29. ​​Monitoring photodetector negative terminal socket; 30. Thermistor positive terminal socket; 31. Upper cooler positive terminal socket; 32. Upper cooler negative terminal socket; 33. Lower cooler positive terminal socket; 34. Lower cooler negative terminal socket; 35. Eighth probe; 36. Ninth probe; 37. Upper cooler positive contact point; 38. Upper cooler negative contact point; 39. Lower cooler positive contact point; 40. Lower cooler negative contact point. Detailed Implementation

[0038] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0041] This invention provides an integrated laser packaging structure suitable for automated mass production, such as... Figure 1-4 As shown, the device includes a packaging box 1, which contains an upper cooler 2, a lower cooler 3, a laser chip assembly, an optical propagation assembly, an electrical connection assembly, and a heat sink 4. The lower end face of the upper cooler 2 is connected to the upper end face of the lower cooler 3. The lower end face of the upper cooler 2 has an upper coupling groove 201, and the upper end face of the lower cooler 3 has a lower coupling groove 301 and a first mounting groove 302 communicating with the lower coupling groove 301. The upper coupling groove 201 and the lower coupling groove 301 form a coupling cavity. The heat sink 4 is disposed in the first mounting groove 302, and the upper end of the heat sink 4 near the coupling cavity has a second mounting groove 401. The laser chip assembly is mounted in the second mounting groove 401 and is electrically connected to the electrical connection assembly. The mounting assembly is fixedly disposed in the coupling cavity, and the optical propagation assembly is disposed on the mounting assembly. The side wall of the packaging box 1 has an optical fiber interface 13 communicating with the coupling cavity. The optical fiber interface 13 has an optical fiber tail wire 14. The optical fiber interface 13, the coupling cavity, and the second mounting groove 401 are arranged sequentially along the direction of optical propagation. Figure 1 As shown, the fiber optic interface 13, the coupling cavity, and the second mounting slot 401 are arranged sequentially from left to right.

[0042] Firstly, as Figure 1 As shown, the heat sink plate 4 is installed in the first mounting groove 302; secondly, as... Figure 1 , 5 As shown, the laser chip assembly is installed in the second mounting slot 401, the optical propagation assembly is placed on the mounting assembly in the coupling cavity, then the upper cooler 2 and lower cooler 3 are connected and installed in the packaging box 1, and then the fiber optic tail 14 is installed. The installation is then complete. The positions of the fiber optic interface 13, the mounting assembly, and the second mounting slot 401 are determined during the production of each component of the laser packaging structure. That is, there is no freedom to change the relative positions of the optical propagation assembly, laser chip assembly, and fiber optic tail 14 during installation. Furthermore, the positions of each component in the entire packaging structure are strictly defined by slots, leaving no space for free movement. The packaging assembly process does not change the relative positions, thus significantly reducing the dependence of the laser packaging structure on the level of the packaging process. Packaging can be easily completed without meticulous operation, compared to... Figure 8In the case of existing laser butterfly packaging structures, the position of each component in the system is predetermined by the slot and other structures during the production of the packaging shell. It no longer relies on semi-automated testing and modulation during the assembly process, making it suitable for standardized mass production mode, standardizing the production process, improving production efficiency, and effectively improving product quality and quality stability, thus breaking through the limitations of existing laser butterfly packaging solutions.

[0043] Specifically, the packaging box 1 includes an upper cover 101 and a box body 102, which are fastened together. The upper cooler 2 and the lower cooler 3 are also fastened together, making the packaging process of the laser simpler and more convenient.

[0044] Specifically, both the upper cooler 2 and the lower cooler 3 are semiconductor coolers, and the overall size of the cooler, consisting of the upper cooler 2 and the lower cooler 3, matches the internal size of the housing 102, allowing the cooler volume to be extended within the entire packaging structure. Furthermore, the entire cooler only leaves the necessary laser-fiber coupling space, reducing the vacancy rate, decreasing the volume of the heat-generating unit, increasing the volume of the temperature control unit, enhancing the system's temperature control function, and increasing the maximum allowable luminous power. While typical semiconductor coolers are sheet-like structures, where heat dissipation components are placed on the sheet-like semiconductor cooler, this embodiment uses upper and lower coolers with grooves, allowing a laser-fiber coupling space to be opened within the entire cooler, where the laser chip assembly and the optical propagation assembly are both located. Compared to sheet-like semiconductor coolers, this results in stronger temperature control and better performance.

[0045] The upper cooler 2 has an upper semi-circular slot at the lower side wall end that communicates with the upper coupling cavity, and the lower cooler 3 has a lower semi-circular slot at the upper side wall end that communicates with the lower coupling cavity. The fiber optic tail wire 14 passes through the fiber optic interface 13 and is snapped into the circular slot 15 formed by the upper and lower semi-circular slots.

[0046] Preferably, such as Figure 5As shown, the bottom of the mounting groove is provided with multiple first protrusions 303, which are arranged in multiple rows on the bottom of the first mounting groove 302. The lower side wall of the heat sink plate 4 is provided with the same number of first grooves that cooperate with the first protrusions 303. Specifically, the end of the first mounting groove 302 away from the coupling cavity is provided with a first inclined surface 304, and the heat sink plate 4 is provided with a second inclined surface 403. The first inclined surface 304 and the second inclined surface 403 have the same inclination. Any one of the first protrusions 303 is inclined and its central axis is parallel to the plane where the first inclined surface 304 is located. When installing the heat sink plate 4, the first inclined surface 304 and the second inclined surface 403 are made to fit together. Then, the heat sink plate 4 is pushed down along the direction of the first inclined surface 304, so that the first protrusions 303 are engaged in the first groove. Thus, the heat sink plate 4 can only be removed from the first mounting groove 302 along the direction of the first inclined surface 304, further restricting the movement of the heat sink plate 4 within the first mounting groove 302.

[0047] Preferably, such as Figure 5 and Figure 7 As shown, the laser chip assembly includes a laser chip 5, an optoelectronic chip 6, a thermistor 7, and a monitoring photodetector 8. The laser chip 5 is inserted into an end groove provided on the optoelectronic chip 6, and the thermistor 7 and the monitoring photodetector 8 are integrated on the optoelectronic chip 6, which reduces the packaging space and increases the assembly integration.

[0048] Preferably, such as Figure 5As shown, the bottom of the second mounting groove 401 is provided with multiple second protrusions 402, which are arranged in multiple rows on the bottom of the second mounting groove 401. The lower sidewall of the optoelectronic chip 6 has the same number of second grooves 601 that cooperate with the second protrusions 402. The optoelectronic chip 6 is mounted in the second mounting groove 401 through the cooperation of the second protrusions 402 and the second grooves 601. The laser chip 5 is at the same height as the optoelectronic chip 6, and the lower sidewall of the laser chip 5 is also provided with second grooves 601, which cooperate with the second protrusions 402 in the second mounting groove 401. Specifically, the end of the second mounting groove 401 away from the coupling cavity is provided with a third inclined surface 404, and the optoelectronic chip 6 is provided with a fourth inclined surface 602. The fourth inclined surface 602 and the third inclined surface 404 are connected. 4. With consistent inclination, each of the second protrusions 402 is inclined and its central axis is parallel to the plane containing the third inclined surface 404. When installing the optoelectronic chip 6, the fourth inclined surface 602 is made to fit against the third inclined surface 404. Then, the optoelectronic chip 6 is pushed down along the direction of the third inclined surface 404, so that the second protrusion 402 is engaged in the second groove 601. Thus, the optoelectronic chip 6 can only exit the second mounting groove 401 along the direction of the third inclined surface 404, further restricting the movement of the optoelectronic chip 6 within the second mounting groove 401. To a certain extent, this ensures that the optoelectronic chip 6 and the laser chip 5 will not move arbitrarily during the packaging process, that is, the relative position of the laser chip 5 and the light propagation component will not change, thereby ensuring that the preset laser coupling efficiency will not change.

[0049] Preferably, after encapsulation, the lower surface of the upper cooler 2 and the upper surface of the lower cooler 3 abut against each other, and the upper surfaces of the laser chip 5, the optoelectronic chip 6, the heat sink plate 4, and the lower cooler 3 are flush. Thus, the lower surface of the upper cooler 2 will abut against the upper surfaces of the laser chip 5, the optoelectronic chip 6, and the heat sink plate 4, thereby further restricting the positions of the laser chip 5, the optoelectronic chip 6, and the heat sink plate 4, limiting their degrees of freedom, and ensuring the coupling efficiency of the laser after encapsulation.

[0050] The aforementioned heat sink plate 4 and optoelectronic chip 6 are fixed by protrusion and groove interlocking to replace the use of solder, silver paste and other adhesive materials in the traditional packaging structure. This avoids the impact of changes in the thickness of the adhesive material on the alignment effect and coupling efficiency, and further ensures the laser alignment effect and coupling efficiency.

[0051] Preferred, such as Figure 1 and Figure 4As shown, the optical propagation assembly includes a first collimating lens 9, an optical isolator 10, and a second collimating lens 11 arranged sequentially. The mounting assembly includes three sets of mounting brackets 12. Each set of mounting brackets 12 includes two sub-mount brackets 12. The two sub-mount brackets 12 are respectively fixed to the bottom sidewall of the upper coupling groove 201 and the bottom sidewall of the lower coupling groove 301. The first collimating lens 9, the optical isolator 10, and the second collimating lens 11 are respectively mounted on the corresponding mounting brackets 12 and respectively engaged between the corresponding two sub-mount brackets 12. The first collimating lens 9, the optical isolator 10, and the second collimating lens 11 are arranged from left to right in the coupling cavity.

[0052] Preferred, such as Figure 1 and Figure 6 The electrical connection assembly includes a first electrical connection assembly and a second electrical connection assembly. The first electrical connection assembly includes a first probe assembly, a circuit board 16, and a first socket area disposed on the upper cover 101. The laser chip assembly, the first probe assembly, the circuit board 16, and the first socket area are electrically connected sequentially. Specifically, the first probe assembly includes seven probes, namely, first probe 17, second probe 18, third probe 19, fourth probe 20, fifth probe 21, sixth probe 22, and seventh probe 23. The first socket area includes a laser chip positive terminal socket 25, a laser chip negative terminal socket 26, a monitoring photodetector positive terminal socket 27, a monitoring photodetector negative terminal socket 28, a thermistor positive terminal socket 29, and a thermistor negative terminal socket 30, such as... Figure 6 As shown, all the aforementioned sockets are located on the upper surface of the upper housing and are electrically connected to circuit board 16. The upper ends of the seven probes are all electrically connected to circuit board 16 and connected to the corresponding sockets through circuit board 16. Circuit board 16 is simplified as a line in the figure. Its purpose is to guide the densely distributed probe roots to the loosely distributed first socket area and electrically connect them to the corresponding sockets through the lines on circuit board 16; Figure 7 As shown, the lower ends of the seven probes pass through the probe through-holes 24 inside the upper cooler 2 to the upper surface of the lower cooler 3. The lower ends of the first probe 17 and the second probe 18 contact the positive electrode Pad on the upper surface of the laser chip 5. The third probe 19 contacts the solder coating on the surface of the heat sink plate 4 (which is the negative electrode of the laser chip 5). The fourth probe 20 and the fifth probe 21 contact the negative and positive electrodes of the monitoring photodetector 8, respectively. The sixth probe 22 and the seventh probe 23 contact the positive and negative electrodes of the thermistor 7, respectively.

[0053] The second electrical connection assembly includes a second probe assembly and a second socket area. The upper cooler 2 and the lower cooler 3 are electrically connected to the second socket area via the second probe assembly, such as... Figure 2 and 6As shown, the second probe assembly includes an eighth probe 35, a ninth probe 36, a tenth probe, and an eleventh probe. The second insertion area includes an upper cooler positive insertion hole 31, an upper cooler negative insertion hole 32, a lower cooler positive insertion hole 33, and a lower cooler negative insertion hole 34. The upper cooler positive insertion hole 31 and the upper cooler negative insertion hole 32 are located on the upper end face of the upper housing, and the lower cooler positive insertion hole 33 and the lower cooler negative insertion hole 34 are located on the lower end face of the housing. The upper end face of the upper cooler 2 is provided with an upper cooler positive contact point 37 and an upper cooler negative contact point 38. The lower end face of the lower cooler 3 is provided with a lower cooler positive contact point 39 and a lower cooler negative contact point 40. The two ends of the eighth probe 35 are electrically connected to the upper cooler negative socket 32 ​​and the upper cooler negative contact point 38, respectively. The two ends of the ninth probe 36 are electrically connected to the upper cooler positive socket 31 and the upper cooler positive contact point 37, respectively. The upper end of the tenth probe is electrically connected to the lower cooler positive socket 33 and the lower cooler positive contact point 39, respectively. The two ends of the eleventh probe are electrically connected to the lower cooler negative socket 34 and the lower cooler negative contact point 40, respectively.

[0054] The above-mentioned electrical connection components abandon the original form of external power supply using gold wires and electrical wires, and instead use a hard connection form using probes, circuit boards, and electrical sockets. There are no soft wires in the entire package structure, making the internal structure cleaner and more orderly, the connection more stable and firm, and reducing uncontrollable factors.

[0055] To achieve an alignment tolerance of 0.1-2μm between the laser and the fiber optic pigtail by machining grooves and slots within the packaging structure, the machining accuracy of the first mounting groove 302, the second mounting groove 401, the upper semi-circular slot, the lower semi-circular slot, the first protrusion 303, the first groove, the second protrusion 402, the second groove 601, and the slots within the sub-slot 12 must reach 0.1-2μm during the processing of each component. Specific processing techniques can include laser etching, 3D printing, etc. Furthermore, if the groove and slot design of the packaging structure is to stably and permanently fix the laser chip 5 and achieve alignment between the laser chip 5 and the fiber optic pigtail 14, the materials of the packaging structure need to have a certain mechanical strength to prevent deformation due to external forces, and each material must have a low and similar coefficient of thermal expansion to prevent deformation due to temperature changes, which could lead to alignment failure. Currently, there are various materials available on the market that meet the above requirements.

[0056] Packaging process: First, clean the surfaces of each component to remove dust and other dirt; then, such as... Figure 5The heat sink plate 4 is placed into the first mounting groove 302 of the lower cooler 3. Specifically, the second inclined surface 403 of the heat sink plate 4 is first brought into contact with the first inclined surface 304, and then slid downwards so that the first protrusion 303 enters the first groove. The laser chip 5 is inserted into the optoelectronic chip 6. The optoelectronic chip 6 is placed into the second mounting groove 401. Specifically, the fourth inclined surface 602 of the optoelectronic chip 6 is first brought into contact with the third inclined surface 404, and then slid downwards so that the second protrusion 402 enters the second groove 601. At this time, the upper surface of the laser chip 5, the upper surface of the optoelectronic chip 6, the upper surface of the heat sink plate 4, and the upper surface of the lower cooler 3 form a horizontal surface. The lower cooler 3 is placed in the housing 102, and the first collimating lens 9 and the optical isolation... The lower ends of the first collimator 9, the optical isolator 10, and the second collimator 11 are snapped onto the three sub-slots 12 in the lower coupling groove 301. The fiber tail 14 is passed through the fiber optic interface 13 on the housing 102 and inserted into the semi-circular slot 15 on the lower cooler 3. Then the upper cooler 2 is snapped onto the lower cooler 3. The upper ends of the first collimator 9, the optical isolator 10, and the second collimator 11 are snapped onto the three sub-slots 12 in the upper coupling groove 201. At the same time, the optical fiber is snapped into the semi-circular slot 15 on the upper cooler 2. Then the upper cover 101 is placed on the upper cooler 2, so that the probe connected to the circuit board 16 on the upper cover 101 will contact the pad position on the laser chip assembly through the probe through hole 24. Finally, the upper cover 101 is snapped onto the housing 102.

[0057] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. An integrated laser packaging structure suitable for automated mass production, characterized in that, The package includes a packaging box, which contains an upper cooler, a lower cooler, a laser chip assembly, an optical propagation assembly, an electrical connection assembly, and a heat sink plate. The lower end face of the upper cooler is connected to the upper end face of the lower cooler. The upper cooler has an upper coupling groove on its lower end face, and the lower cooler has a lower coupling groove and a first mounting groove communicating with the lower coupling groove on its upper end face. The upper coupling groove and the lower coupling groove form a coupling cavity. The heat sink plate is disposed in the first mounting groove, and the upper end of the heat sink plate near the coupling cavity is provided with a second mounting groove, and the laser chip assembly is installed in the second mounting groove; The electrical connection assembly includes a first electrical connection assembly and a second electrical connection assembly; the first electrical connection assembly includes a first probe assembly, a circuit board, and a first socket area disposed on the package, wherein the laser chip assembly, the first probe assembly, the circuit board, and the first socket area are electrically connected in sequence; the second electrical connection assembly includes a second probe assembly and a second socket area, wherein the upper cooler and the lower cooler are both electrically connected to the second socket area through the second probe assembly; An installation assembly is fixedly installed inside the coupling cavity, and the optical propagation assembly is disposed on the installation assembly; The side wall of the encapsulation box is provided with an optical fiber interface that communicates with the coupling cavity. The optical fiber interface is provided with an optical fiber tail wire. The optical fiber interface, the coupling cavity and the second mounting slot are arranged sequentially along the direction of light propagation.

2. The packaging structure according to claim 1, characterized in that, The bottom of the mounting groove is provided with a plurality of first protrusions, and the lower side wall of the heat sink plate is provided with the same number of first grooves that cooperate with the first protrusions. The heat sink plate is installed in the first mounting groove through the cooperation of the first protrusions and the first grooves.

3. The packaging structure according to claim 2, characterized in that, The first mounting groove has a first inclined surface at the end away from the coupling cavity, and the heat sink plate has a second inclined surface. The first inclined surface and the second inclined surface have the same slope. Any one of the first protrusions is inclined and its central axis is parallel to the plane where the first inclined surface is located.

4. The packaging structure according to claim 1, characterized in that, The laser chip assembly includes a laser chip, an optoelectronic chip, a thermistor, and a monitoring photodetector. The laser chip is inserted into an end groove provided on the optoelectronic chip, and the thermistor and the monitoring photodetector are integrated on the optoelectronic chip.

5. The packaging structure according to claim 4, characterized in that, The second mounting groove is provided with a plurality of second protrusions, and the lower sidewall of the optoelectronic chip is provided with the same number of second grooves that cooperate with the second protrusions. The optoelectronic chip is installed in the second mounting groove by the cooperation of the second protrusions and the second grooves.

6. The packaging structure according to claim 5, characterized in that, The second mounting groove has a third inclined surface at the end away from the coupling cavity, and the optoelectronic chip has a fourth inclined surface. The fourth inclined surface has the same slope as the third inclined surface. Any one of the second protrusions is inclined and its central axis is parallel to the plane where the third inclined surface is located.

7. The packaging structure according to claim 4, characterized in that, The lower surface of the upper cooler and the upper surface of the lower cooler abut each other, and the upper surface of the laser chip, the upper surface of the optoelectronic chip, the upper surface of the heat sink plate and the upper surface of the lower cooler are flush.

8. The packaging structure according to claim 1, characterized in that, The optical propagation assembly includes a first collimating lens, an optical isolator, and a second collimating lens arranged sequentially. The mounting assembly includes three sets of mounting brackets, each fixed to the inner sidewall of the coupling cavity. The first collimating lens, the optical isolator, and the second collimating lens are respectively mounted on their respective mounting brackets.

9. The packaging structure according to claim 1, characterized in that, The packaging box includes an upper cover and a box body, the upper cover and the box body are fastened together, and the upper cooler and the lower cooler are fastened together.

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