An integrated audio processing chip

Abstract

The present invention provides an integrated audio processing chip. In one embodiment, an integrated circuit of a processor, a digital-to-analog converter and an audio driver is integrated on the audio processing chip; a first metal plate and a second metal plate are arranged above the semiconductor substrate, an insulating layer is arranged between the first metal plate and the second metal plate and the semiconductor substrate, the first metal plate and the second metal plate form two poles of a capacitor, and the two poles of the capacitor are respectively connected to the audio driving circuit integrated in the semiconductor substrate through contact holes; the vibration membrane is connected to the top of the first metal plate and the second metal plate through a plurality of support columns; the processor adjusts the output voltage of the boost circuit according to the volume of the audio signal to be played so that the output voltage changes with the volume of the audio signal to be played, which helps to improve the working efficiency of the system and facilitates the design of the equipment that needs to use the audio processing chip to be more lightweight and miniaturized.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular to an integrated audio processing chip. Background Art

[0002] Traditional technology requires an audio processing chip and a separate speaker to form a headset. With the development of wireless headsets, customers are looking for lighter and more comfortable headsets. Therefore, it is necessary to consider combining an audio processing chip with a separate speaker. Summary of the invention

[0003] In view of this, an embodiment of the present application provides an integrated audio processing chip.

[0004] In a first aspect, an embodiment of the present application provides an integrated audio processing chip, including:

[0005] A semiconductor substrate having an integrated circuit on which a processor, a digital-to-analog converter and an audio driver are integrated;

[0006] A first metal plate and a second metal plate are disposed above the semiconductor substrate, wherein an insulating layer is disposed between the first metal plate and the second metal plate and the semiconductor substrate, the first metal plate and the second metal plate form two poles of a capacitor, and the two poles of the capacitor are respectively connected to an integrated circuit of an audio driver integrated in the semiconductor substrate through contact holes;

[0007] A vibration membrane is disposed above the first metal plate and the second metal plate through a plurality of support columns.

[0008] Optionally, the semiconductor substrate further integrates: an integrated circuit of a programmable gain amplifier, an analog-to-digital converter and a processor;

[0009] The programmable gain amplifier is used to amplify the received audio signal and convert the audio signal into a digital signal through an analog-to-digital converter; the processor is used to process the digital signal output by the analog-to-digital converter, convert the digital signal into an analog signal through a digital-to-analog converter, and output it to the audio driver; the audio driver is used to output a signal to drive the capacitor to cause the capacitor to generate a changing alternating electric field, and guide the vibration of the diaphragm through electrostatic induction, so that the diaphragm pushes the air to produce sound.

[0010] Optionally, the semiconductor substrate further integrates: a boost circuit;

[0011] The boost circuit is used to boost the low-voltage power supply voltage and supply the boosted voltage to the audio driver.

[0012] Optionally, the boosting range of the boosting circuit is: 100V to 200V;

[0013] The boost circuit is one of an inductor-based boost DC-DC converter or a capacitor-based charge pump circuit.

[0014] Optionally, the processor adjusts the output voltage of the boost circuit based on the volume of the audio signal to be played so that the output voltage changes with the volume of the audio signal to be played.

[0015] Optionally, the first metal plate and the second metal plate are circular, and the first metal plate and the second metal plate are located in the same plane and are arranged parallel to the vibration membrane, and at least part of the circuit of the integrated circuit is located below the vibration membrane.

[0016] Optionally, the vibration membrane is made of insulating material and has a thickness of 20 nanometers to 100 nanometers.

[0017] Optionally, the vibration membrane is circular and is provided with an opening, and the position of the opening corresponds to the pressure-bonding area formed by the chip.

[0018] Optionally, the vibration membrane is fixed by a packaging wire, and the packaging wire passes through the vibration membrane, and each packaging wire fixes two pressure welding areas corresponding to the two openings on the vibration membrane.

[0019] Optionally, the chip is packaged, and an opening is made on the package body to allow the sound signal generated inside the chip to be transmitted through the opening.

[0020] An integrated audio circuit and chip provided by an embodiment of the present application, in one embodiment, an analog-to-digital converter, a boost circuit, an audio driver, a capacitor and a vibration membrane are integrated into an audio processing chip, and a boost circuit is used to power the audio driver. The driver outputs a signal to drive the capacitor, causing the capacitor to generate a changing AC electric field, and guides the vibration membrane to vibrate through electrostatic induction, causing the vibration membrane to push the air to produce sound. At the same time, the processor adjusts the output voltage of the boost circuit according to the volume of the audio signal to be played, so that the output voltage changes with the volume of the audio signal to be played, which helps to improve the working efficiency of the system and is conducive to the design of equipment that needs to use audio processing chips to be lighter and more compact. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0022] Figure 1A schematic diagram of the structure of an integrated audio processing chip applied for the present invention;

[0023] Figure 2 A schematic diagram of the structure of an integrated circuit in an integrated audio processing chip applied for by the present invention;

[0024] Figure 3 A schematic diagram of fixing a vibrating membrane of an integrated audio processing chip applied for by the present invention. DETAILED DESCRIPTION

[0025] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments.

[0026] Figure 1 This invention is a schematic diagram of an integrated audio processing chip, see Figure 1 An integrated audio processing chip in the embodiment of the present application includes: a semiconductor substrate 101, an insulating layer 102;

[0027] An integrated circuit formed by a programmable gain amplifier, an analog-to-digital converter, a processor, a digital-to-analog converter, a boost circuit, and an audio driver is integrated on the semiconductor substrate 101 .

[0028] An insulating layer 102 is deposited on a semiconductor substrate 101, a metal layer is formed by sputtering on the insulating layer 102, and a first metal plate 1031 and a second metal plate 1032 are formed by etching. The first metal plate 1031 and the second metal plate 1032 are used as two electrodes of a capacitor. The semiconductor substrate may be a silicon substrate.

[0029] The first metal plate 1031 is connected to the audio driver on the semiconductor substrate 101 through the first contact hole 1051 ; the second metal plate 1032 is connected to the audio driver on the semiconductor substrate 101 through the second contact hole 1052 .

[0030] A plurality of support pillars are formed around the integrated circuit on the semiconductor substrate 101, and the vibration membrane 106 is fixed on the plurality of support pillars. The first metal plate and the second metal plate are located on the same plane, and the vibration membrane is arranged parallel to the first metal plate and the second metal plate.

[0031] The audio driver drives the two poles of the capacitor to generate an alternating electric field. Due to electrostatic induction, induced charges are generated on the vibration membrane 106. The induced charges and the charges on the capacitor generate electrostatic force, causing the vibration membrane 106 to vibrate in a direction perpendicular to the surface of the wafer or chip.

[0032] In a possible embodiment, two support pillars are formed on the semiconductor substrate 101 , namely a first support pillar 1041 and a second support pillar 1042 . The first support pillar 1041 and the second support pillar 1042 are used to fix the vibration membrane 106 .

[0033] In a possible embodiment, the first metal plate 1031 and the second metal plate 1032 are circular or approximately circular. Designing the first metal plate 1031 and the second metal plate 1032 to be circular or approximately circular can effectively improve uniformity in all directions.

[0034] In a possible embodiment, the boost circuit may be a step-up DC-DC converter based on an inductor, or a charge-pump circuit based on a capacitor, wherein the inductor and the capacitor may be provided by components external to the chip, or may be integrated inside the chip.

[0035] In a possible embodiment, the vibration membrane 106 is made of an insulating material, wherein the thickness of the vibration membrane 106 is 20 nanometers to 100 nanometers. Further, the vibration membrane 106 can be made of epoxy resin. When the chip is packaged later, an opening is required on the package body so that the acoustic signal generated by the vibration of the vibration membrane 106 can be transmitted through the opening. Further, the package opening can be a large overall opening, or formed by multiple small openings.

[0036] Figure 2 This is a schematic diagram of the structure of an integrated circuit in an integrated audio processing chip applied for by the present invention. Figure 2 An integrated circuit in an integrated audio processing chip in an embodiment of the present application includes: a programmable gain amplifier 201, an analog-to-digital converter 202, a processor 203, a digital-to-analog converter 204, a boost circuit 205, an audio driver 206, and a capacitor 207.

[0037] The programmable gain amplifier 201 is used to receive an audio signal, amplify the received audio signal, and then transmit the amplified audio signal to the analog-to-digital converter 202; the analog-to-digital converter 202 converts the amplified audio signal into a digital signal.

[0038] In a possible embodiment, the analog-to-digital converter 202 is a parallel comparison analog-to-digital converter or a successive approximation analog-to-digital converter. Both the parallel comparison analog-to-digital converter and the successive approximation analog-to-digital converter can directly convert analog voice signals into digital signals.

[0039] The processor 203 is used to process the digital signal output by the analog-to-digital converter 202. When an audio signal needs to be played, the processor 203 transmits the processed digital signal to the digital-to-analog converter 204. The digital-to-analog converter 204 converts the received digital signal into an analog signal and outputs it to the audio driver 206.

[0040] The audio driver 206 is used to drive the capacitor 207 according to the received analog signal, so that an alternating voltage is generated between the two poles of the capacitor 207. Due to electrostatic induction, induced charges are generated on the vibration membrane. The induced charges and the charges on the capacitor electrodes generate electrostatic force, causing the vibration membrane to vibrate. When the vibration membrane vibrates, it pushes the air to produce sound.

[0041] Furthermore, the audio driver 206 is powered by a boost circuit 205 , and the boost circuit 205 is used to boost the low voltage power supply voltage to a high voltage power supply, wherein the high voltage power supply is 100V to 600V.

[0042] In a possible embodiment, the boost circuit 205 may be a step-up DC-DC converter based on an inductor, or a charge-pump circuit based on a capacitor.

[0043] In a possible embodiment, the processor 203 adjusts the output voltage of the boost circuit 205 according to the volume of the audio signal to be played. When the volume to be played is high, the boost circuit 205 is controlled to output a higher boosted voltage; when the volume to be played is low, the boost circuit 205 is controlled to output a lower boosted voltage. The processor 203 controls the output voltage of the boost circuit 205 according to the volume of the played audio signal, which helps to improve the working efficiency of the system.

[0044] In a possible embodiment, at least part of the circuit of the integrated circuit is located below the vibration membrane, that is, the area of ​​the original chip will not be changed after the speaker is integrated into the chip.

[0045] In order to achieve a better hearing effect, in a possible embodiment, the vibration membrane is designed to be circular, such as Figure 3 As shown, it includes a vibration membrane 301 , a pressure welding area 302 , an opening 303 , and a packaging line 304 .

[0046] After the chip forms the bonding area 302, the vibration membrane 301 is placed, wherein the vibration membrane 301 is previously opened at the position corresponding to the bonding area 302. The packaging wire 304 passes through the two openings 303 on the vibration membrane 301 to fix the vibration membrane 301.

[0047] In a possible embodiment, the vibration membrane 301 may be fixed by a plurality of packaging wires 304 , which pass through the vibration membrane, each packaging wire fixing two bonding areas 302 , and each bonding area corresponds to an opening on the vibration membrane 301 .

[0048] In a possible embodiment, the packaging wire 304 is any one of a gold wire, a copper wire or an alloy wire.

[0049] The vibration membrane 301 is designed to be circular so that its vibration and sound generation are relatively uniform in all directions.

[0050] Those skilled in the art should be aware that in one or more of the above examples, the functions described in the present invention can be implemented by hardware, software, firmware or any combination thereof. When implemented by software, these functions can be stored in a computer-readable medium or transmitted as one or more instructions or codes on a computer-readable medium.

[0051] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solution of the present invention should be included in the scope of protection of the present invention.

Claims

1. An integrated audio processing chip, comprising: A semiconductor substrate having an integrated circuit on which a processor, a digital-to-analog converter and an audio driver are integrated; A first metal plate and a second metal plate are disposed above the semiconductor substrate, wherein an insulating layer is disposed between the first metal plate and the second metal plate and the semiconductor substrate, the first metal plate and the second metal plate form two poles of a capacitor, and the two poles of the capacitor are respectively connected to an integrated circuit of an audio driver integrated in the semiconductor substrate through contact holes; A vibration membrane, wherein the vibration membrane is disposed above the first metal plate and the second metal plate through a plurality of support columns; The processor is used to process the received digital signal and input the processed digital signal into the digital-to-analog converter, and the digital-to-analog converter converts the received digital signal into an analog signal and outputs it to the audio driver; The audio driver is used to drive the capacitor according to the received analog signal, so that an alternating voltage is generated between the two poles of the capacitor. Due to electrostatic induction, induced charges are generated on the vibration membrane. The induced charges and the charges on the capacitor electrodes generate electrostatic force, causing the vibration membrane to vibrate. When the vibration membrane vibrates, it pushes the air to produce sound.

2. The chip according to claim 1, characterized in that: The semiconductor substrate also integrates: an integrated circuit of a programmable gain amplifier and an analog-to-digital converter; The programmable gain amplifier is used to amplify the received audio signal; The analog-to-digital converter is used to convert the audio signal amplified by the programmable gain amplifier into a digital signal.

3. The chip according to claim 1, characterized in that: The semiconductor substrate is also integrated with: a boost circuit; The boost circuit is used to boost the low-voltage power supply voltage and supply the boosted voltage to the audio driver.

4. The chip according to claim 3, characterized in that: The boosting range of the boosting circuit is: 100V~200V; The boost circuit is one of an inductor-based boost DC-DC converter or a capacitor-based charge pump circuit.

5. The chip according to claim 1 or 3, characterized in that: The processor adjusts the output voltage of the boost circuit based on the volume of the audio signal to be played so that the output voltage changes with the volume of the audio signal to be played.

6. The chip according to claim 1, characterized in that: The first metal plate and the second metal plate are circular, and the first metal plate and the second metal plate are located in the same plane and are arranged parallel to the vibration membrane. At least part of the circuit of the integrated circuit is located below the vibration membrane.

7. The chip according to claim 1, characterized in that: The vibration film is made of insulating material and has a thickness of 20 nanometers to 100 nanometers.

8. The chip according to claim 1 or 7, characterized in that: The vibration membrane is circular and is provided with openings, the positions of the openings corresponding to the pressure-welding areas formed by the chip.

9. The chip according to claim 8, characterized in that: The vibration membrane is fixed by a packaging wire, and the packaging wire passes through the vibration membrane. Each packaging wire fixes two pressure welding areas corresponding to the two openings on the vibration membrane.

10. The chip according to claim 1, characterized in that: The chip is packaged, and an opening is made on the package body to allow the sound signal generated inside the chip to be transmitted through the opening.

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