Heat dissipation device for new energy vehicle charging pile power supply

Abstract

The present invention relates to the technical field of new energy vehicles, and provides a heat dissipation device for a new energy vehicle charging pile power supply, comprising a heat dissipation base and a water cooling device arranged on one side of the heat dissipation base, the heat dissipation base being provided with a cooling chamber and an electronic component accommodating chamber, a heat dissipation element being provided in the cooling chamber, the water cooling device comprising a heat dissipation water drain connected to the cooling chamber and a water pump for circulating coolant between the cooling chamber and the heat dissipation water drain, the top and bottom surfaces of the cooling chamber being sealed with an upper heat absorbing plate and a lower heat absorbing plate, respectively. In the present invention, the upper heat absorbing plate and the lower heat absorbing plate can quickly transfer the heat of the power supply components to the heat dissipation base, the coolant cooled by the heat dissipation water drain enters the cooling chamber, the coolant absorbs the heat on the heat dissipation base and becomes hot water, which enters the heat dissipation water drain again for cooling, and the cooled water enters the cooling chamber again to absorb heat, and the cycle completes the heat exchange of the heat dissipation base, thereby achieving rapid heat dissipation of the power supply components and extending the service life of the power supply.

Description

Technical Field

[0001] The present invention relates to the technical field of new energy vehicles, and in particular provides a heat dissipation device for a new energy vehicle charging pile power supply. Background Art

[0002] To promote environmental protection and energy conservation, an increasing number of electric vehicles are being introduced to the market. With the advancement of society, the maturity of technology, and the rise of environmental awareness, electric vehicles are expected to gradually replace fuel-powered vehicles. However, charging issues have been a bottleneck hindering the rapid advancement of this process. The main issues with electric vehicle charging lie in the number of charging stations, their efficiency, and safety. During the charging process, the power supply releases energy within a limited timeframe, dissipating a significant amount of heat. Currently, the heat dissipation devices in charging station power supplies are ineffective, impacting charging efficiency and posing safety risks. Summary of the Invention

[0003] The purpose of the present invention is to provide a heat dissipation device for a new energy vehicle charging pile power supply, aiming to solve the technical problems in the prior art that the heat dissipation device of the charging pile power supply has poor heat dissipation effect, affects charging efficiency and poses safety hazards.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a heat dissipation device for a new energy vehicle charging pile power supply, comprising a heat dissipation base for fixing power supply components and a water cooling device arranged on one side of the heat dissipation base, the heat dissipation base is provided with a cooling chamber and an electronic component accommodating chamber, the cooling chamber is provided with a heat dissipation element, the water cooling device comprises a heat dissipation water row connected to the cooling chamber and a water pump for circulating the coolant between the cooling chamber and the heat dissipation water row, the top and bottom surfaces of the cooling chamber are respectively sealed with an upper heat absorbing plate and a lower heat absorbing plate.

[0005] Furthermore, the cooling chamber includes an upper chamber located on the top surface of the heat dissipation base and a lower chamber located on the bottom surface of the heat dissipation base, a connecting hole is provided between the upper chamber and the lower chamber, the upper heat absorbing plate is sealed at the top of the upper chamber, and the lower heat absorbing plate is sealed at the bottom of the lower chamber.

[0006] Furthermore, the heat dissipation elements are all heat dissipation fins or heat dissipation columns.

[0007] Furthermore, there are multiple electronic component accommodating cavities, which are respectively arranged on the top surface and the bottom surface of the heat dissipation base.

[0008] Furthermore, the shape of the electronic component accommodating cavity is circular or square.

[0009] Furthermore, the electronic component accommodating cavity and the electronic component accommodated therein are encapsulated by a heat-conducting potting compound.

[0010] Furthermore, the side wall of the heat dissipation base is provided with a water outlet channel connected to the upper chamber, and a water inlet channel connected to the lower chamber is provided below the water outlet channel. A water outlet joint is provided at the end of the side wall of the heat dissipation base corresponding to the water outlet channel, and a water inlet joint is provided at the end of the side wall of the heat dissipation base corresponding to the water inlet channel. The water outlet joint is connected to the heat dissipation water drain through a conduit, and the water inlet joints are both connected to the water pump through a conduit.

[0011] Furthermore, the water cooling device also includes a plurality of cooling fans, and the cooling fans are sequentially arranged on one side of the cooling water row.

[0012] Furthermore, the coolant is ethylene glycol coolant, diesel or transformer oil.

[0013] Furthermore, the heat dissipation base is made of aluminum, copper, stainless steel or thermally conductive plastic.

[0014] Beneficial effects of the present invention:

[0015] In the present invention, the upper heat absorbing plate and the lower heat absorbing plate on the top and bottom surfaces of the cooling chamber can quickly transfer the heat on the power supply component to the heat dissipation base. At the same time, the coolant is circulated and pumped between the heat dissipation water row and the cooling chamber through a water pump. The coolant cooled by the heat dissipation water row enters the cooling chamber, and the coolant absorbs the heat on the heat dissipation base and becomes hot water and enters the heat dissipation water row again for cooling. The cooled water enters the cooling chamber again to absorb heat. This cycle completes the heat exchange of the heat dissipation base, thereby realizing rapid heat dissipation of the power supply components and extending the service life of the power supply. The above structure is simple, has a fast heat dissipation speed, and a high heat dissipation efficiency, and reduces the risk of safety hazards caused by heat accumulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A schematic structural diagram of a heat dissipation device for a new energy vehicle charging pile power supply provided by an embodiment of the present invention;

[0018] Figure 2 A schematic diagram of the inverted structure of the heat dissipation device of the new energy vehicle charging pile power supply provided by an embodiment of the present invention;

[0019] Figure 3 An exploded schematic diagram of the connection between the heat dissipation device and the circuit board of the new energy vehicle charging pile power supply provided by an embodiment of the present invention;

[0020] Figure 4 An exploded schematic diagram of the heat dissipation base, upper heat absorption plate, and lower heat absorption plate in the heat dissipation device of the new energy vehicle charging pile power supply provided by an embodiment of the present invention;

[0021] Figure 5 for Figure 4 Schematic diagram of the decomposition after inversion;

[0022] Figure 6 A schematic structural diagram of a heat dissipation base in a heat dissipation device for a new energy vehicle charging pile power supply provided by an embodiment of the present invention;

[0023] Figure 7 for Figure 6 Schematic diagram of the structure after the heat sink is inverted.

[0024] Among them, the reference numerals in the figures are:

[0025] 10-heat sink base; 11-upper chamber; 111-first heat sink element; 12-lower chamber; 121-second heat sink element; 13-connecting hole; 15-first weight-reducing hole; 16-electronic component accommodating chamber; 17-connecting ribs; 18-second weight-reducing hole; 20-water cooling device; 21-heat sink; 211-water injection hole; 22-water pump; 23-cooling fan; 30-upper heat absorbing plate; 31-third heat sink element; 40-lower heat absorbing plate; 41-fourth heat sink element; 50-circuit board; 60-water outlet connector; 70-water inlet connector; 80-duct. DETAILED DESCRIPTION

[0026] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0027] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0029] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0030] Please refer to Figure 1 The heat dissipation device of the new energy vehicle charging pile power supply provided by an embodiment of the present invention includes a heat dissipation base 10 for fixing power supply components and a water cooling device 20 arranged on one side of the heat dissipation base 10. The heat dissipation base 10 is provided with a cooling chamber (not shown in the figure) and an electronic component accommodating chamber 16. A heat dissipation element is provided in the cooling chamber. The water cooling device 20 includes a heat dissipation water drain 21 connected to the cooling chamber and a water pump 22 for circulating the coolant between the cooling chamber and the heat dissipation water drain 21. The top and bottom surfaces of the cooling chamber are respectively sealed with an upper heat absorbing plate 30 and a lower heat absorbing plate 40.

[0031] In the present invention, the upper heat absorbing plate 30 and the lower heat absorbing plate 40 on the top and bottom surfaces of the cooling chamber can quickly transfer the heat on the power supply components to the heat dissipation base 10. At the same time, the coolant is circulated and pumped between the heat dissipation water row 21 and the cooling chamber through the water pump 22. The coolant cooled by the heat dissipation water row 21 enters the cooling chamber, and the coolant absorbs the heat on the heat dissipation base 10 and becomes hot water and enters the heat dissipation water row 21 again for cooling. The cooled water enters the cooling chamber again to absorb heat. The cycle completes the heat exchange of the heat dissipation base 10, thereby realizing rapid heat dissipation of the power supply components and extending the service life of the power supply. The above structure is simple, has a fast heat dissipation speed, and a high heat dissipation efficiency, and reduces the risk of safety hazards caused by heat accumulation.

[0032] Reference Figures 2 to 7In this embodiment, the heat sink base 10 is an elongated plate-like structure. A downwardly recessed upper chamber 11 is provided on the top surface of the heat sink base 10, and an upwardly recessed lower chamber 12 is provided on the bottom surface of the heat sink base 10. A connecting hole 13 is provided between the upper and lower chambers 11, 12. This connecting hole 13 connects the upper and lower chambers 11, forming a cooling channel for the flow of coolant. An upper heat absorbing plate 30 is provided to seal the top of the upper chamber 11, while a lower heat absorbing plate 40 is provided to seal the bottom of the lower chamber 12. Specifically, the upper and lower heat absorbing plates 30, 40 are secured by welding to ensure a good seal.

[0033] The heat dissipation elements include a plurality of first heat dissipation elements 111 disposed within the upper chamber 11 and a plurality of second heat dissipation elements 121 disposed within the lower chamber 12. A plurality of third heat dissipation elements 31 are disposed on the bottom surface of the upper heat absorbing plate 30, contacting the first heat dissipation elements 111. A fourth heat dissipation element 41 is disposed on the top surface of the lower heat absorbing plate 40, contacting the second heat dissipation elements 121. The upper and lower heat absorbing plates 30 and 40 are respectively connected to a circuit board 50 of a power supply component. The circuit board 50 is equipped with a plurality of heat-generating components. The upper and lower heat absorbing plates 30 and 40 are directly connected to the circuit board 50, thereby directly and quickly absorbing heat from the circuit board 50 and transferring it to the heat dissipation base 10. This heat is then exchanged with the coolant within the cooling chamber of the heat dissipation base 10, and dissipated by the coolant to the heat dissipation drain 21.

[0034] Specifically, in this embodiment, the first heat dissipation element 111 and the third heat dissipation element 31 are both heat dissipation fins; the second heat dissipation element 121 and the fourth heat dissipation element 41 are both heat dissipation fins. Of course, as an alternative, the first heat dissipation element 111 and the third heat dissipation element 31 can also be heat dissipation columns; the second heat dissipation element 121 and the fourth heat dissipation element 41 can also be heat dissipation columns.

[0035] In this embodiment, the first heat dissipating elements 111 are provided in multiple groups, each group comprising multiple heat dissipating fins. Adjacent groups of the first heat dissipating elements 111 are spaced apart. Similarly, the third heat dissipating elements 31 are provided in multiple groups, i.e., the number of groups of the third heat dissipating elements 31 is the same as the number of groups of the first heat dissipating elements 111. Each group of the third heat dissipating elements 31 also comprises multiple heat dissipating fins, the number of each group of the third heat dissipating elements 31 is the same as the number of each group of the first heat dissipating elements 111. Adjacent groups of the third heat dissipating elements 31 are also spaced apart, with each group of the first heat dissipating elements 111 correspondingly contacting each group of the third heat dissipating elements 31. Similarly, the correspondence between the second heat dissipating elements 121 and the fourth heat dissipating elements 41 is the same as the correspondence between the first heat dissipating elements 111 and the third heat dissipating elements 31. That is, the second heat dissipating elements 121 are provided in multiple groups, each group comprising multiple heat dissipating fins. Adjacent groups of the second heat dissipating elements 121 are spaced apart. Similarly, the fourth heat dissipating elements 41 are provided in multiple groups, i.e., the number of groups of the fourth heat dissipating elements 41 is the same as the number of groups of the second heat dissipating elements 121. Each set of fourth heat dissipation elements 41 also comprises a plurality of heat dissipation fins. The number of fourth heat dissipation elements 41 in each set is the same as the number of second heat dissipation elements 121 in each set. Adjacent sets of fourth heat dissipation elements 41 are also spaced apart, with each set of second heat dissipation elements 121 correspondingly contacting each set of fourth heat dissipation elements 41. The arrangement of the first heat dissipation elements 111 correspondingly contacting the third heat dissipation elements 31, and the second heat dissipation elements 121 correspondingly contacting each set of fourth heat dissipation elements 41, accelerates heat transfer from the upper heat absorbing plate 30 and the lower heat absorbing plate 40 to the cooling chamber. Furthermore, the plurality of heat dissipation fins are all located within the cooling chamber, allowing coolant to flow through the channels between adjacent heat dissipation fins. This increases the contact area between the coolant and the heat dissipation fins, and thus the contact area between the coolant and the heat dissipation base 10. This facilitates faster transfer of heat from the upper heat absorbing plate 30, the lower heat absorbing plate 40, and the heat dissipation base 10 to the coolant through the heat dissipation fins, thereby improving heat exchange efficiency.

[0036] Furthermore, the lower chamber 12 is rectangular in shape, and a plurality of electronic component accommodating cavities 16 are provided on the heat dissipation base 10 and in close proximity to one side of the lower chamber 12. The plurality of electronic component accommodating cavities 16 are arranged in sequence along a side wall of the lower chamber 12. The electronic component accommodating cavities 16 are circular in shape and are used to accommodate capacitors, which are heat-prone components in power supply components. The capacitors are placed on one side of the lower chamber 12 through the accommodating holes 14. In this way, the heat generated by the capacitors is transferred through the wall of the accommodating holes 14 to the side wall of the lower chamber 12 and then to the coolant in the lower chamber 12.

[0037] In this embodiment, a plurality of first weight-reducing holes 15 are provided around each receiving hole 14. The first weight-reducing holes 15 are used to form a cavity in the heat dissipation base 10 to reduce the weight of the heat dissipation base 10.

[0038] Furthermore, the top surface of the heat sink 10 also features a rectangular electronic component accommodating cavity 16, which is surrounded by the upper chamber 11. In other words, the upper chamber 11 forms a "mouth" shape. Electronic components are placed within the electronic component accommodating cavity 16, and heat from the components is transferred through the walls of the accommodating cavity 16 to the side walls of the upper chamber 11 and then to the coolant within the upper chamber 11.

[0039] In this embodiment, to coordinate with the circuit board 50 and optimize the layout of the electronic components, connecting ribs 17 are provided within the electronic component accommodating cavity 16. These ribs 17 divide the electronic component accommodating cavity 16 into multiple accommodating sections. Multiple second weight-reducing holes 18 are provided on these ribs. These second weight-reducing holes 18 serve the same purpose as the first weight-reducing holes 15: they form a cavity within the heat sink base 10 to reduce its weight.

[0040] Furthermore, in this embodiment, a water outlet channel (not shown in the figure) and a water inlet channel (not shown in the figure) are provided on one side wall of the heat dissipation base 10. The water outlet channel and the water inlet channel are arranged parallel to each other up and down. The water outlet channel is connected to the upper chamber 11, and the water inlet channel is connected to the lower chamber 12. The water outlet channel and the water inlet channel both pass through the end face of this side wall. At this end face, a water outlet joint 60 is provided corresponding to the water outlet channel, and a water inlet joint 70 is provided corresponding to the water inlet channel. The water outlet joint 60 is connected to the heat dissipation water drain 10 through a conduit 80, and the water inlet joint 70 is connected to the water pump 22 through the conduit 80.

[0041] Furthermore, the electronic components on the circuit board 50 and the electronic component accommodating cavity 16 are encapsulated by a thermally conductive potting compound (not shown in the figure) to further enhance the thermal conductivity and sealing performance.

[0042] In this embodiment, the heat dissipation drain 21 is plate-shaped and stands on one side of the heat dissipation base 10. The water pump 22 is located side by side with the heat dissipation drain 21. To ensure sealing performance, the heat dissipation drain 21 and the water pump 22 are sealed together with potting compound. The heat dissipation drain 21 is provided with a water injection hole 211 for injecting water.

[0043] Furthermore, in this embodiment, the water cooling device 20 also includes a plurality of cooling fans 23, which are sequentially arranged on one side of the cooling water drain 21. Specifically, the plurality of cooling fans 23 are located on the side close to the heat dissipation base 10, so that the entire heat dissipation structure formed by the water cooling structure and the heat dissipation base 10 is more compact. Of course, the plurality of cooling fans 23 can also be located on the side of the cooling water drain 21 away from the heat dissipation base 10. When the hot water heat-exchanged in the cooling chamber enters the cooling water drain 21 for cooling, the heat will be dissipated outward. The cooling fans 23 start to work after being powered on, accelerating the heat dissipation of the cooling water drain 21, so that the water in the cooling water drain 21 can be cooled more quickly so that it can re-enter the cooling chamber for heat exchange.

[0044] In this embodiment, the coolant is ethylene glycol coolant, diesel or transformer oil.

[0045] In this embodiment, in order to further improve the heat exchange efficiency of the heat dissipation base 10 , the heat dissipation base 10 is made of aluminum, copper, stainless steel or thermally conductive plastic.

[0046] In this embodiment, the heat dissipation principle of the power supply heat dissipation device is as follows: the heat dissipation water drain 21 cools the injected water. During this process, the cooling fan 23 works to dissipate heat from the heat dissipation water drain 21, thereby accelerating the cooling of the heat dissipation water drain 21. The coolant cooled by the heat dissipation water drain 21 enters the lower chamber 12 through the water inlet channel through the water pump 22, and gradually enters the upper chamber 11 through the connecting hole 13, and exchanges heat with the heat dissipation fins in the upper chamber 11 and the lower chamber 12. The heat of the electronic components connected to the upper heat absorbing plate 30, the lower heat absorbing plate 40 and the heat dissipation base 10 is transferred to the heat dissipation fins in the upper chamber 11 and the lower chamber 12 through the upper heat absorbing plate 30, the lower heat absorbing plate 40 and the heat dissipation base 10. The coolant after heat exchange becomes hot water and enters the heat dissipation water drain 21 again through the water pump 22 for cooling. And so on, the cycle continues, thereby completing the rapid heat dissipation of the power supply components.

[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation device for a new energy vehicle charging pile power supply, characterized in that: The invention comprises a heat dissipation base for fixing power components and a water cooling device provided on one side of the heat dissipation base, wherein the heat dissipation base is provided with a cooling chamber and an electronic component accommodating chamber, wherein a heat dissipation element is provided in the cooling chamber, and wherein the water cooling device comprises a heat dissipation water row communicating with the cooling chamber and a water pump for circulating coolant between the cooling chamber and the heat dissipation water row, wherein the top and bottom surfaces of the cooling chamber are respectively sealed with an upper heat absorbing plate and a lower heat absorbing plate; The cooling chamber includes an upper chamber located on the top surface of the heat dissipation base and a lower chamber located on the bottom surface of the heat dissipation base, a communicating hole is provided between the upper chamber and the lower chamber, the upper heat absorbing plate is sealed to the top of the upper chamber, and the lower heat absorbing plate is sealed to the bottom of the lower chamber; the heat dissipation element includes a plurality of first heat dissipation elements provided in the upper chamber and a plurality of second heat dissipation elements provided in the lower chamber, the bottom surface of the upper heat absorbing plate is provided with a plurality of third heat dissipation elements in contact with the first heat dissipation elements, and the top surface of the lower heat absorbing plate is provided with a fourth heat dissipation element in contact with the second heat dissipation elements; wherein the upper heat absorbing plate and the lower heat absorbing plate are respectively used to be connected to the circuit board of the power supply component, and the circuit board is provided with a plurality of heat-generating components; The side wall of the heat dissipation base is provided with a water outlet channel communicating with the upper chamber, and a water inlet channel communicating with the lower chamber is provided below the water outlet channel. A water outlet joint is provided at the end of the side wall of the heat dissipation base corresponding to the water outlet channel, and a water inlet joint is provided at the end of the side wall of the heat dissipation base corresponding to the water inlet channel. The water outlet joint is communicated with the heat dissipation water drain through a conduit, and the water inlet joints are both communicated with the water pump through a conduit; The water cooling device further comprises a plurality of cooling fans, which are sequentially arranged on one side of the cooling water row.

2. The heat dissipation device for the new energy vehicle charging pile power supply according to claim 1, characterized in that: The heat dissipation elements are all heat dissipation fins or heat dissipation columns.

3. The heat dissipation device for the new energy vehicle charging pile power supply according to claim 1, characterized in that: There are multiple electronic component accommodating cavities, which are respectively arranged on the top surface and the bottom surface of the heat dissipation base.

4. The heat dissipation device for the new energy vehicle charging pile power supply according to claim 1, characterized in that: The shape of the electronic component accommodating cavity is circular or square.

5. The heat dissipation device for the new energy vehicle charging pile power supply according to claim 1, characterized in that: The electronic component accommodating cavity and the electronic component accommodated therein are encapsulated by heat-conducting potting glue.

6. The heat dissipation device of the new energy vehicle charging pile power supply according to any one of claims 1 to 5, characterized in that: The coolant is ethylene glycol coolant, diesel or transformer oil.

7. The heat dissipation device for a new energy vehicle charging pile power supply according to any one of claims 1 to 5, characterized in that: The heat dissipation base is made of aluminum, copper, stainless steel or thermal conductive plastic.

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