Electrostatic chuck separation device

An electrostatic chuck and separation device technology, which is applied in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of damage to the electrostatic chuck, time-consuming and laborious, inconvenient operation, etc., and achieves good structural rigidity and easy manufacturing. , the effect of reducing resistance

CN110931413AActive Publication Date: 2020-03-27BEIJING U PRECISION TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2020-03-27

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Abstract

The invention discloses an electrostatic chuck separation device, and relates to a mechanical device for separating an electrostatic chuck, aiming to provide the electrostatic chuck separation devicecapable of nondestructively and quickly separating the electrostatic chuck from the chuck base. The electrostatic chuck separation device comprises a guide component, a rotating component and a cutting component, wherein the rotating component is mounted above the guide component and can synchronously move along with the guide component; the cutting component is fixedly mounted; the electrostaticchuck assembly is installed above the rotating component and can synchronously rotate along with the rotating component. The cutting component can generate heat when powered on and generate heat capable of melting the adhesive layer. And when the guide part drives the rotating part to synchronously move to a certain position, the cutting component can cut the bonding layer along with simultaneousmovement and rotation of the electrostatic chuck so as to realize separation of the electrostatic chuck from an element on the electrostatic chuck assembly. The electrostatic chuck separation device is simple in structure, easy to manufacture, high in separation efficiency, wide in application range and capable of achieving lossless separation.
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Description

technical field

[0001] The invention relates to the design and manufacture field of semiconductor equipment, in particular to a mechanical device for separating an electrostatic chuck. Background technique

[0002] Generally, after the electrostatic chuck is used for a certain period of time, its adsorption force will be lost, resulting in a decrease in the adsorption force or even unable to continue to adsorb, resulting in unstable or unreliable adsorption to the wafer, which may cause damage to the wafer by other equipment. However, the price of the wafer is expensive, and the damage of the wafer causes an increase in the cost of the enterprise. Therefore, it is necessary to regularly check or replace the electrostatic chuck to ensure that it has sufficient adsorption force on the wafer. For the convenience of maintenance or the replacement of the electrostatic chuck, it is necessary to separate the electrostatic chuck from the chuck base and process the electrostatic chu...

Examples

Embodiment Construction

[0025] In the present invention, the "height" refers to the vertical distance between the heating sheet and the guide rail seat.

[0026] Bonding technology is widely used in semiconductor processing and manufacturing processes, such as chip packaging, wafer stacking, and the connection of various functional components of electrostatic chucks. The so-called bonding is to connect at least two components together through adhesives. In processing equipment, PVD, CVD, Etch and other process equipment are equipped with electrostatic chuck components. The electrostatic chuck component includes an electrostatic chuck 6 and a chuck base 5. The electrostatic chuck 6 is bonded to the chuck through an adhesive layer. Base 5.

[0027] During long-term use, the adsorption force of the electrostatic chuck 6 will decrease, and the electrostatic chuck 6 needs to be repaired or replaced. First, the electrostatic chuck 6 needs to be separated from the chuck base 5, and then processed , in orde...