Manufacturing system and preparation method of segmented photovoltaic welding ribbon

Abstract

The present invention relates to the technical field of segmented photovoltaic welding strips, and in particular to a manufacturing system and a preparation method of a segmented photovoltaic welding strip. The system cleverly utilizes a base strip to move, and cooperates with a driving component to drive a powder baffle plate to reciprocate between a shielding station and a powder adding station, so that solder powder dropped from a hopper is dropped onto a patterned surface of the base strip at intervals, and solder powder exceeding a predetermined thickness is scraped off through a forming die, so that the solder powder layer on the patterned surface is at a predetermined thickness, and then a hot melt device is used to melt the solder powder on the patterned surface, and after exiting the hot melt device, the solder powder is cooled to form a flat solder segment, so that the pattern grooves on the patterned surface are intermittently filled into flat solder segments, thereby achieving high-efficiency and high-precision production of segmented photovoltaic welding strips, greatly reducing production costs, and improving market competitiveness. The system also has a simple and novel structure, a low failure rate, and is suitable for mass production.

Description

Technical Field

[0001] The present invention relates to the technical field of segmented photovoltaic welding ribbons, and in particular to a manufacturing system and a preparation method of a segmented photovoltaic welding ribbon. Background Art

[0002] Currently, most of the reflective welding tapes on the market have one flat side and the other side in a patterned shape. The main function of the pattern is to reflect sunlight to increase the shading reuse rate, thereby improving the power generation efficiency of photovoltaic modules.

[0003] In order to protect the copper substrate of the welding strip and to be able to weld with the battery cell, the surface of the welding strip needs to be coated with a tin-lead solder layer, and the tin-lead solder layer on the surface of the welding strip is generally coated evenly. This kind of welding strip has very high requirements on the thickness of the tin-lead solder layer coated thereon. If the thickness of the tin-lead solder layer is too thick, then after hot-melt welding, the pattern grooves on the patterned surface of the welding strip will be easily filled with tin-lead solder; if the thickness of the tin-lead solder layer is too thin, then after hot-melt welding, the phenomenon of cold welding will occur, resulting in poor welding between the welding strip and the battery cell;

[0004] In this regard, segmented reflective solder strips are currently available on the market, that is, the patterned surface of the solder strip is segmented; the tin-lead solder layer is thinner in the areas where reflection is required on the patterned surface; and the tin-lead solder layer is thicker in the areas where welding is required on the patterned surface; then how to segmentally form the tin-lead solder layer on the patterned surface of the solder strip is the key to achieving mass production of segmented solder strips, and this is also a technical problem that technical personnel in the field urgently need to solve. Summary of the invention

[0005] The technical problem to be solved by the present invention is: in order to solve how to form a tin-lead solder layer in sections on the patterned surface of the welding strip, a manufacturing system and a preparation method of a segmented photovoltaic welding strip are provided.

[0006] The technical solution adopted by the present invention to solve the technical problem is: a manufacturing system of a segmented photovoltaic welding strip, comprising a solder powder adding device and a hot melting device sequentially arranged along the moving direction of the base strip, wherein the side of the base strip having the pattern groove is the pattern surface, and the pattern surface of the base strip faces upward;

[0007] The solder powder adding device comprises a hopper for containing solder powder, a powder blocking plate arranged between the discharge port of the hopper and the base belt, a forming die and a driving assembly, wherein the hopper is located above the base belt, and its discharge port is opposite to the pattern surface of the base belt, and the driving assembly is used to drive the powder blocking plate to reciprocate between the shielding station and the powder adding station, and when the powder blocking plate is located at the shielding station, the powder blocking plate blocks the solder powder at the discharge port from reaching the pattern surface of the base belt, and when the powder blocking plate is located at the powder adding station, the powder blocking plate releases the blocking of the solder powder;

[0008] The forming die is located between the hot melt device and the powder baffle plate and is used to scrape off solder powder exceeding a predetermined thickness on the pattern surface;

[0009] The hot melting device is used to melt the solder powder on the pattern surface onto the pattern surface.

[0010] This solution cleverly utilizes the movement of the base belt and the driving assembly to drive the powder baffle plate to reciprocate between the shielding station and the powder adding station, so that the solder powder dropped from the hopper falls onto the patterned surface of the base belt at intervals, and the solder powder exceeding the predetermined thickness is scraped off through the forming die, so that the solder powder layer on the patterned surface is at a predetermined thickness, and then the solder powder on the patterned surface is melted on the patterned surface by the hot melt device, and cooled after leaving the hot melt device to form a flat solder segment, thereby filling the pattern grooves on the patterned surface with intermittent flat solder segments, thereby achieving high-efficiency and high-precision production of segmented photovoltaic welding strips, greatly reducing production costs, and having a simple and novel structure, a low failure rate, and being suitable for mass production.

[0011] Furthermore, the molding die includes a scraper and a support plate, the scraper is located above the base belt, the support plate is located below the base belt and supports the base belt, the scraper is inclined along the length direction of the base belt, and the angle A between the scraper and the length direction of the base belt is an acute angle;

[0012] A channel of a certain height is formed between the scraper and the support plate so that the channel only allows a solder powder layer of a preset thickness to pass through with the base tape, and excess solder powder will be scraped off the base tape by the scraper, thereby ensuring that the solder powder layer on the base tape is at a predetermined thickness and improving the forming accuracy. The inclined scraper can scrape excess solder powder to the side of the base tape to avoid the solder powder being scraped onto the reflective section of the base tape.

[0013] Furthermore, a protective cover is provided under the powder baffle, the base belt passes through the protective cover, and an opening is provided on the upper surface of the protective cover at a position opposite to the discharge port of the hopper; the protective cover is provided so that the solder powder falling from the discharge port of the hopper can only reach the patterned surface of the base belt through the opening of the protective cover, thereby preventing the solder powder from falling to a position outside the flat solder section of the patterned surface.

[0014] Furthermore, a recovery trough for collecting solder powder is provided below the base belt, and the recovery trough is opposite to the powder baffle plate; thus, the solder powder falling outside the powder baffle plate and the base belt can be collected for recycling.

[0015] Furthermore, the forming die is opposite to the recovery tank, so that the solder powder scraped off by the forming die can be collected for recycling.

[0016] Furthermore, it also includes a flux trough for containing flux. The base tape is pre-immersed in the flux trough before reaching the solder powder adding device. After the base tape passes through the flux trough, a certain amount of flux will be attached to its surface, which is conducive to the subsequent solder powder staying on the pattern surface.

[0017] Furthermore, it also includes an annealing device, and the base strip is pre-annealed by the annealing device before reaching the flux tank; after the base strip is continuously annealed by the annealing device, the yield strength is greatly reduced, and it has the characteristic of being ultra-soft, which effectively reduces the risk of hidden cracks and fragments occurring during welding and increases the reliability of the components.

[0018] Furthermore, it also includes a marking device. The base tape reaches the marking device after passing through the hot melt device; the marking device marks a marking point at the starting point of each flat solder section to facilitate subsequent customer identification.

[0019] Furthermore, it also includes an electroplating device, and the base tape reaches the electroplating device after passing through the marking device; a 5-20um tin-lead solder coating is plated on the surface other than the patterned surface of the base tape, and a 1-5um tin-lead solder coating is plated on the patterned surface.

[0020] Furthermore, it also includes a winding device, and the base tape reaches the winding device after passing through the electroplating device.

[0021] A method for preparing a manufacturing system using the above-mentioned segmented photovoltaic welding ribbon comprises at least the following steps:

[0022] Step 1), adding powder: the base belt with the pattern grooves pressed thereon is continuously passed through the solder powder adding device to add solder powder, and the pattern surface of the base belt is facing upward, and the solder powder in the hopper is kept falling from the discharge port of the hopper to the pattern surface of the base belt;

[0023] At the same time, the driving component drives the powder shielding plate to move back and forth between the shielding station and the powder adding station. When the powder shielding plate moves to the shielding station, the powder shielding plate blocks the solder powder at the discharge port from reaching the patterned surface of the base belt, so that a section on the patterned surface is free of solder powder, which is a reflective section. When the powder shielding plate is located at the powder adding station, the powder shielding plate releases the blocking of the solder powder, and the solder powder dropped from the discharge port will fall onto the patterned surface of the base belt, so that a section on the patterned surface has a layer of solder powder.

[0024] Step 2), scraping powder: passing the base strip after adding powder in step 1 through the forming die, so that the forming die scrapes off the solder powder exceeding the predetermined thickness on the pattern surface;

[0025] Step 3), hot melting: the base tape after the powder scraping in step 2 is passed through a hot melting device, and the solder powder layer on the pattern surface is melted in the hot melting device. After the base tape exits the hot melting device, the solder powder layer on the pattern surface is cooled and condensed on the base tape to form a flat solder section.

[0026] The beneficial effects of the present invention are as follows: the present invention cleverly utilizes the base belt to move, and cooperates with the driving component to drive the powder baffle plate to reciprocate between the shielding station and the powder adding station, so that the solder powder dropped from the hopper falls onto the patterned surface of the base belt at intervals, and the solder powder exceeding the predetermined thickness is scraped off through the forming die, so that the solder powder layer on the patterned surface is at a predetermined thickness, and then the solder powder on the patterned surface is melted on the patterned surface by the hot melt device, and cooled after exiting the hot melt device to form a flat solder segment, so that the pattern grooves on the patterned surface are intermittently filled with flat solder segments, thereby realizing the high-efficiency and high-precision production of segmented photovoltaic welding strips, which greatly reduces production costs and improves market competitiveness, and has a simple and novel structure, a low failure rate, and is suitable for mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0028] Figure 1 is a schematic diagram of a manufacturing system for a segmented photovoltaic welding ribbon of the present invention;

[0029] Figure 2 It is a schematic diagram of the coordination of the hopper, the powder baffle, the drive assembly and the base belt in the manufacturing system of the segmented photovoltaic welding belt of the present invention;

[0030] Figure 3 It is a schematic diagram of the main view of the forming die in the manufacturing system of the segmented photovoltaic welding strip of the present invention;

[0031] Figure 4 It is a top view schematic diagram of a forming die in a manufacturing system of a segmented photovoltaic welding ribbon of the present invention;

[0032] Figure 5 It is a schematic diagram of the segmented photovoltaic welding strip in the present invention.

[0033] In the figure: 1. Annealing device;

[0034] 2. Flux tank;

[0035] 3. solder powder adding device, 3-1. hopper, 3-11. discharge port, 3-2. powder baffle plate, 3-3. drive assembly, 3-4. forming die, 3-41. scraper, 3-42. support plate, 3-5. protective cover, 3-6. recovery tank;

[0036] 4. Hot melt device;

[0037] 5. Marking device;

[0038] 6. Electroplating equipment;

[0039] 7. Winding device;

[0040] 8. Base tape, 8-1. Flat solder section, 8-2. Reflective section, 8-3. Marking point. DETAILED DESCRIPTION

[0041] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention, and directions and references (e.g., up, down, left, right, etc.) may only be used to help describe the features in the drawings. Therefore, the following specific embodiments are not to be taken in a limiting sense, and the scope of the subject matter claimed is limited only by the attached claims and their equivalents.

[0042] Example 1

[0043] like Figure 1 As shown, a manufacturing system for a segmented photovoltaic welding strip includes a solder powder adding device 3 and a hot melting device 4 sequentially arranged along the moving direction of a base strip 8, wherein a side of the base strip 8 having a pattern groove is a pattern surface, and the pattern surface of the base strip 8 faces upward;

[0044] The solder powder adding device 3 comprises a hopper 3-1 for containing solder powder, a powder baffle plate 3-2 arranged between a discharge port 3-11 of the hopper 3-1 and the base tape 8, a molding die 3-4 and a driving assembly 3-3. The hopper 3-1 is located above the base tape 8, and its discharge port 3-11 is opposite to the patterned surface of the base tape 8. The driving assembly 3-3 is used to drive the powder baffle plate 3-2 to reciprocate between the shielding station and the powder adding station. When the powder baffle plate 3-2 is located at the shielding station, the powder baffle plate 3-2 blocks the solder powder at the discharge port 3-11 from reaching the patterned surface of the base tape 8. When the powder baffle plate 3-2 is located at the powder adding station, the powder baffle plate 3-2 releases the blocking of the solder powder.

[0045] The molding die 3-4 is located between the hot melt device 4 and the powder baffle 3-2, and is used to scrape off the solder powder exceeding a predetermined thickness on the pattern surface;

[0046] The hot melting device 4 is used to melt the solder powder on the pattern surface onto the pattern surface.

[0047] Among them, the driving component 3-3 in this embodiment can adopt a motor or a cylinder. When the driving component 3-3 adopts a motor, the output end of the motor is connected to the powder blocking plate 3-2 by transmission, and the motor drives the powder blocking plate 3-2 to rotate from the powder adding station to the blocking station, and then from the blocking station to the powder adding station, and so on. In this cycle; when the driving component 3-3 adopts a cylinder, the output end of the cylinder is connected to the powder blocking plate 3-2 by transmission, and the cylinder drives the powder blocking plate 3-2 to move from the powder adding station to the blocking station, and then from the blocking station back to the powder adding station, and so on.

[0048] The molding die 3-4 includes a scraper 3-41 and a support plate 3-42, wherein the scraper 3-41 is located above the base belt 8, and the support plate 3-42 is located below the base belt 8 and supports the base belt 8, and the scraper 3-41 is inclined along the length direction of the base belt 8, and the angle A between the scraper 3-41 and the length direction of the base belt 8 is an acute angle;

[0049] A channel of a certain height is formed between the scraper 3-41 and the support plate 3-42, so that the channel only allows a solder powder layer of a preset thickness to pass through the base tape 8, and excess solder powder will be scraped off the base tape 8 by the scraper 3-41, thereby ensuring that the solder powder layer on the base tape 8 is at a predetermined thickness and improving the molding accuracy. The inclined scraper 3-41 can scrape excess solder powder to the side of the base tape 8 to avoid the solder powder being scraped onto the reflective section 8-2 of the base tape 8.

[0050] A protective cover 3-5 is provided below the powder baffle 3-2, and the base belt 8 passes through the protective cover 3-5. An opening is provided on the upper surface of the protective cover 3-5 at a position opposite to the discharge port 3-11 of the hopper 3-1; the length of the opening on the protective cover 3-5 is slightly larger than the length of the flat solder section 8-1. The setting of the protective cover 3-5 ensures that the solder powder dropped from the discharge port 3-11 of the hopper 3-1 can only reach the patterned surface of the base belt 8 through the opening of the protective cover 3-5, thereby preventing the solder powder from falling onto a position other than the flat solder section 8-1 of the patterned surface.

[0051] A recovery trough 3-6 for collecting solder powder is provided below the base tape 8, and the recovery trough 3-6 is opposite to the powder shielding plate 3-2; thus, the solder powder falling outside the powder shielding plate 3-2 and the base tape 8 can be collected for recycling.

[0052] The forming die 3-4 is opposite to the recovery tank 3-6, so that the solder powder scraped off by the forming die 3-4 can be collected for recycling.

[0053] It also includes a flux trough 2 for containing flux. The base tape 8 is pre-immersed in the flux trough 2 before reaching the solder powder adding device 3. After the base tape 8 passes through the flux trough 2, a certain amount of flux will be attached to its surface, which is conducive to the subsequent solder powder staying on the pattern surface.

[0054] It also includes an annealing device 1, and the base tape 8 is pre-annealed by the annealing device 1 before reaching the flux tank 2; after the base tape 8 is continuously annealed by the annealing device 1, the yield strength is greatly reduced, and it has the characteristic of being ultra-soft, which effectively reduces the risk of hidden cracks and fragments occurring during welding and increases the reliability of the component.

[0055] It also includes a marking device 5. The base tape 8 reaches the marking device 5 after passing through the hot melt device 4. The marking device 5 marks a marking point 8-3 at the starting point of each flat solder section 8-1 to facilitate subsequent customer identification.

[0056] It also includes an electroplating device 6. The base tape 8 reaches the electroplating device 6 after passing through the marking device 5; a 5-20um tin-lead solder coating is plated on the surface other than the patterned surface of the base tape 8, and a 1-5um tin-lead solder coating is plated on the patterned surface.

[0057] It also includes a winding device 7 , and the base tape 8 reaches the winding device 7 after passing through the electroplating device 6 .

[0058] The cross-section of the soldering strip in this embodiment is square, and the patterned surface of the base strip 8 is pressed into continuous pattern grooves by a pattern roller. The base strip 8 can specifically be a copper base strip 8. Under the driving force of an external power mechanism, the base strip 8 moves at a speed of 100-150 m / min and passes through the relevant devices of the manufacturing system in sequence; the solder powder in the hopper 3-1 specifically uses spherical tin-lead solder powder with a particle size of 25-45 μm.

[0059] A method for preparing a manufacturing system using the above-mentioned segmented photovoltaic welding ribbon comprises at least the following steps:

[0060] Step 1), annealing: the base belt 8 with the pressed grooves is continuously passed through the annealing device 1 for annealing; the yield strength of the base belt 8 is reduced, and the base belt 8 has the characteristics of being ultra-soft, which effectively reduces the risk of hidden cracks and fragments occurring during welding and increases the reliability of the assembly;

[0061] Step 2), adding flux: the annealed base tape 8 is continuously passed through the flux tank 2 to be attached with a certain amount of flux; this is conducive to the subsequent solder powder staying on the pattern surface;

[0062] Step 3), adding powder: the base tape 8 after adding the flux is continuously passed through the solder powder adding device 3 to add solder powder, and the patterned surface of the base tape 8 is facing upward, and the solder powder in the hopper 3-1 is kept falling from the discharge port 3-11 of the hopper 3-1 to the patterned surface of the base tape 8;

[0063] At the same time, the driving component 3-3 drives the powder blocking plate 3-2 to move back and forth between the shielding station and the powder adding station. When the powder blocking plate 3-2 moves to the shielding station, the powder blocking plate 3-2 blocks the solder powder at the discharge port 3-11 from reaching the patterned surface of the base belt 8, so that a section on the patterned surface is free of solder powder, which is the reflective section 8-2; when the powder blocking plate 3-2 is located at the powder adding station, the powder blocking plate 3-2 releases the blocking of the solder powder, and the solder powder dropped from the discharge port 3-11 will fall onto the patterned surface of the base belt 8, so that a section on the patterned surface has a layer of solder powder;

[0064] Step 4), scraping powder: passing the base tape 8 after adding powder in step 3 through the forming die 3-4, so that the forming die 3-4 scrapes off the solder powder exceeding the predetermined thickness on the pattern surface;

[0065] Step 5), hot melting: the base tape 8 after the powder is scraped in step 2 is passed through the hot melting device 4, and the solder powder layer on the pattern surface is melted in the hot melting device 4. After the base tape 8 exits the hot melting device 4, the solder powder layer on the pattern surface is cooled and condensed on the base tape 8 to form a flat solder segment 8-1;

[0066] Step 6), marking: the base tape 8 after the hot melt device 4 is continuously passed through the marking device 5, and the marking device 5 marks a marking point 8-3 at the starting point of each flat solder section 8-1; so as to facilitate subsequent customer use and identification;

[0067] Step 7), electroplating: the base tape 8 after the marking device 5 is continuously passed through the electroplating device 6, and the electroplating device 6 plates a 5-20um tin-lead solder coating on the surface other than the pattern surface of the base tape 8, and plates a 1-5um tin-lead solder coating on the pattern surface;

[0068] Step 8), winding the solder strip obtained after electroplating through a collecting device to complete the preparation of the solder strip.

[0069] The patterned surface of the prepared segmented reflective welding tape has several repeating units along the length direction, and each repeating unit is composed of a reflective segment 8-2 and a flat solder segment 8-1; the upper surface of the reflective segment 8-2 has a patterned groove structure, and the lower surface of the portion of the welding tape corresponding to the reflective segment 8-2 is flat, and is welded on the front of the battery cell, so as to fully realize multiple utilization of light and increase the output power of the component; the upper and lower surfaces of the portion of the welding tape corresponding to the flat solder segment 8-1 are both flat, and are welded on the back of the battery cell, and are in flat contact with the back electrode to form a good ohmic contact;

[0070] In this preparation method, the base band 8 has a fast running speed and high production capacity, and the tin-lead solder powder can be recycled, with a utilization rate of more than 98%, which greatly reduces the production cost;

[0071] The flat solder segment 8-1 of the segmented photovoltaic solder strip produced by the preparation method is filled with tin-lead solder powder, which greatly improves the reliability of welding and reduces the customer's empty welding and series reverse rate.

[0072] The solder strip has undergone online annealing and is ultra-soft, which effectively reduces the risk of hidden cracks and fragments during welding and increases the reliability of the components.

[0073] The welding strip can be directly welded using traditional methods without increasing the cost of single string welding, and is suitable for mass production.

[0074] The principle of this embodiment is: when the base belt 8 is moving, the driving component 3-3 is cooperated to drive the powder baffle plate 3-2 to reciprocate between the shielding station and the powder adding station, so that the solder powder dropped from the hopper 3-1 is dropped onto the patterned surface of the base belt 8 at intervals, and the solder powder exceeding the predetermined thickness is scraped off through the forming die 3-4, so that the solder powder layer on the patterned surface is at a predetermined thickness, and then the solder powder on the patterned surface is melted on the patterned surface by the hot melt device 4, and cooled after exiting the hot melt device 4 to form a flat solder segment 8-1, so that the pattern grooves on the patterned surface are intermittently filled with flat solder segments 8-1, thereby realizing the high-efficiency and high-precision production of segmented photovoltaic welding strips, which greatly reduces the production cost, and has a simple and novel structure, a low failure rate, and is suitable for mass production; wherein, the solder powder in the hopper 3-1 can specifically use its own weight to continuously fall by itself.

[0075] The above-mentioned ideal embodiments of the present invention are for inspiration. Through the above-mentioned description, relevant staff can make various changes and modifications without departing from the technical idea of ​​the present invention. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A manufacturing system for a segmented photovoltaic ribbon, characterized in that: It comprises a solder powder adding device (3) and a hot melting device (4) which are arranged in sequence along the moving direction of the base belt (8), wherein the side of the base belt (8) having the patterned grooves is the patterned surface, and the patterned surface of the base belt (8) faces upward; The solder powder adding device (3) comprises a hopper (3-1) for accommodating solder powder, a powder blocking plate (3-2) arranged between a discharge port (3-11) of the hopper (3-1) and a base tape (8), a molding die (3-4) and a driving assembly (3-3); the hopper (3-1) is located above the base tape (8), and its discharge port (3-11) is opposite to the pattern surface of the base tape (8); the driving assembly (3-3) is used to drive the powder blocking plate (3-2) to reciprocate between a shielding station and a powder adding station; when the powder blocking plate (3-2) is located at the shielding station, the powder blocking plate (3-2) blocks the solder powder at the discharge port (3-11) from reaching the pattern surface of the base tape (8); when the powder blocking plate (3-2) is located at the powder adding station, the powder blocking plate (3-2) releases the blocking of the solder powder; The forming die (3-4) is located between the hot melt device (4) and the powder blocking plate (3-2), and is used to scrape off solder powder exceeding a predetermined thickness on the pattern surface; The hot melting device (4) is used to melt the solder powder on the pattern surface onto the pattern surface; A recovery groove (3-6) for collecting solder powder is provided below the base belt (8), and the recovery groove (3-6) is opposite to the powder blocking plate (3-2); It also comprises a soldering flux tank (2) for containing soldering flux, and the base tape (8) is preliminarily soaked in the soldering flux tank (2) before reaching the solder powder adding device (3).

2. The manufacturing system of segmented photovoltaic welding ribbon according to claim 1, characterized in that: The molding die (3-4) comprises a scraper (3-41) and a support plate (3-42), wherein the scraper (3-41) is located above the base belt (8), and the support plate (3-42) is located below the base belt (8) and supports the base belt (8), and the scraper (3-41) is arranged obliquely along the length direction of the base belt (8), and an angle A between the scraper (3-41) and the length direction of the base belt (8) is an acute angle.

3. The manufacturing system of segmented photovoltaic welding ribbon according to claim 1, characterized in that: A protective cover (3-5) is provided below the powder baffle (3-2), the base belt (8) passes through the protective cover (3-5), and an opening is provided on the upper surface of the protective cover (3-5) at a position opposite to the discharge port (3-11) of the hopper (3-1).

4. The manufacturing system of segmented photovoltaic welding ribbon according to claim 1, characterized in that: The molding die (3-4) is opposite to the recovery tank (3-6).

5. The manufacturing system of segmented photovoltaic welding ribbon according to claim 1, characterized in that: It also comprises an annealing device (1), wherein the base tape (8) is pre-annealed in the annealing device (1) before reaching the soldering flux tank (2).

6. The manufacturing system of segmented photovoltaic welding ribbon according to claim 5, characterized in that: It also comprises a marking device (5), and the base tape (8) reaches the marking device (5) after passing through the hot-melt device (4).

7. The manufacturing system of segmented photovoltaic welding ribbon according to claim 6, characterized in that: It also includes an electroplating device (6), and the base tape (8) reaches the electroplating device (6) after passing through the marking device (5).

8. The manufacturing system of segmented photovoltaic welding ribbon according to claim 1, characterized in that: It also comprises a winding device (7), and the base tape (8) reaches the winding device (7) after passing through the electroplating device (6).

9. A method for preparing a manufacturing system of a segmented photovoltaic welding ribbon using any one of claims 1 to 8, characterized in that: At least the following steps are included: Step 1), adding powder: the base belt (8) with the pattern grooves pressed thereon is continuously passed through the solder powder adding device (3) to add solder powder, and the pattern surface of the base belt (8) is facing upward, and the solder powder in the hopper (3-1) is kept falling from the discharge port (3-11) of the hopper (3-1) to the pattern surface of the base belt (8); At the same time, the driving component (3-3) drives the powder blocking plate (3-2) to move back and forth between the shielding station and the powder adding station. When the powder blocking plate (3-2) moves to the shielding station, the powder blocking plate (3-2) blocks the solder powder at the discharge port (3-11) from reaching the patterned surface of the base belt (8), so that a section on the patterned surface is free of solder powder, which is the reflective section (8-2); when the powder blocking plate (3-2) is located at the powder adding station, the powder blocking plate (3-2) releases the blocking of the solder powder, and the solder powder dropped from the discharge port (3-11) falls onto the patterned surface of the base belt (8), so that a section on the patterned surface has a layer of solder powder. Step 2), scraping powder: passing the base tape (8) after adding powder in step 1 through the forming die (3-4), so that the forming die (3-4) scrapes off the solder powder exceeding a predetermined thickness on the pattern surface; Step 3), hot melting: the base tape (8) after the powder is scraped in step 2 is passed through a hot melting device (4), and the solder powder layer on the pattern surface is melted in the hot melting device (4). After the base tape (8) exits the hot melting device (4), the solder powder layer on the pattern surface is cooled and condensed on the base tape (8), forming a flat solder section (8-1).

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