Speaker modules and electronic devices

Abstract

The present invention discloses a speaker module and an electronic device, wherein the speaker module comprises a shell and at least two speaker units, the shell has at least two receiving spaces, the shell comprises a side wall and a bottom wall connected to the side wall, two speaker units are arranged in the two receiving spaces, and the receiving spaces are separated into a front sound cavity connected to the front side of the diaphragm of the speaker unit, one of the speaker units is a low-frequency speaker unit, and the other speaker unit is a high-frequency speaker unit, and at least the low-frequency speaker unit of the two speaker units separates the corresponding receiving space into a rear sound cavity connected to the rear side space of the speaker unit diaphragm. The diaphragms of the two speaker units both face the bottom wall, and a front cavity opening is provided on the bottom wall corresponding to at least one of the two front sound cavities, and the housing of the electronic device seals and covers the front cavity opening. The technical solution of the present invention can improve the structural compactness of the speaker module and reduce the external dimensions of the speaker module.

Description

Technical Field

[0001] The present invention relates to the technical field of sound energy conversion, and in particular to a speaker module and electronic equipment. Background Art

[0002] At present, mainstream tablets and laptops use multiple identical full-range speakers to improve sound quality. However, for full-range speakers, low and high frequencies cannot be taken into account at the same time, especially the high frequencies cannot restore the system output sound quality. It is necessary to use a combination of woofers and tweeters to improve the full-range sound quality. In the current structure that uses a combination of woofers and tweeters to improve sound quality, the woofers and tweeters are assembled separately on the whole machine. This has a large assembly error and poor consistency, resulting in the woofers and tweeters occupying a large space in the whole machine, which will make the whole machine such as tablets and laptops thicker. Summary of the invention

[0003] The main purpose of the present invention is to provide a speaker module, aiming to improve the structural compactness of the speaker module and reduce the external dimensions of the speaker module.

[0004] To achieve the above object, the speaker module proposed in the present invention is used in electronic equipment, comprising:

[0005] A shell having at least two receiving spaces, the shell comprising a side wall and a bottom wall connected to the side wall; and

[0006] At least two speaker units are disposed in the two receiving spaces, and the receiving spaces are separated into a front sound cavity connected to the front side of the diaphragm of the speaker unit, one of the speaker units is a low-frequency speaker unit, and the other speaker unit is a high-frequency speaker unit. At least the low-frequency speaker unit of the two speaker units separates the corresponding receiving space into a rear sound cavity connected to the space on the rear side of the diaphragm of the speaker unit;

[0007] The diaphragms of the two speaker units both face the bottom wall, a front cavity opening is provided on the bottom wall corresponding to at least one of the two front sound cavities, and the housing of the electronic device seals and covers the front cavity opening.

[0008] Optionally, the bottom wall includes a first bottom wall and a second bottom wall connected to and opposite to the side wall, and the diaphragms of the two speaker units both face the first bottom wall, or the diaphragms of the two speaker units face the first bottom wall and the second bottom wall respectively.

[0009] Optionally, the orthographic projection of the hole wall of the front cavity opening on the corresponding diaphragm is located outside the folding ring portion of the diaphragm.

[0010] Optionally, a cavity wall of at least one of the rear sound cavities is provided with a clearance opening, and one end of the speaker unit away from its diaphragm extends into the clearance opening.

[0011] Optionally, the speaker module further includes a sealing gasket, which is arranged around the outer periphery of the front cavity opening and is arranged between the housing of the electronic device and the bottom wall.

[0012] Optionally, a mounting groove is provided on the outer surface of the bottom wall, the front cavity opening is opened at the bottom of the mounting groove, the sealing gasket is arranged at the bottom of the mounting groove, and the thickness of the sealing gasket is greater than the depth of the mounting groove.

[0013] Optionally, the shell also includes a side wall connected to the bottom wall, the side wall is provided with two sound output channels respectively connected to the two front sound cavities; a channel opening is opened on the bottom wall corresponding to at least one of the two sound output channels, and the outer shell of the electronic device seals and covers the channel opening.

[0014] Optionally, the shell includes an upper shell, a first lower shell and a second lower shell, the first lower shell and the upper shell together form one receiving space, and the second lower shell and the upper shell together form another receiving space.

[0015] Optionally, the first lower shell and the second lower shell are metal parts.

[0016] The present invention also proposes an electronic device, including a housing and a speaker module, the speaker module including a shell and at least two speaker units, the shell having at least two receiving spaces, and the shell including a bottom wall. The two speaker units are arranged in the two receiving spaces, and the receiving spaces are separated into a front sound cavity connected to the front side of the diaphragm of the speaker unit, one of the speaker units is a low-frequency speaker unit, and the other speaker unit is a high-frequency speaker unit, and at least the low-frequency speaker unit of the two speaker units separates the corresponding receiving space into a rear sound cavity connected to the rear side space of the speaker unit diaphragm. The diaphragms of the two speaker units face the bottom wall, and a front cavity opening is provided on the bottom wall corresponding to at least one of the two front sound cavities, and the housing of the electronic device seals and covers the front cavity opening. Wherein, the speaker module is arranged in the housing, and the housing seals and covers the front cavity opening of the speaker module.

[0017] Optionally, the front cavity opening constitutes a sound outlet channel of the speaker module, and a sound outlet hole is provided on the shell corresponding to the front cavity opening.

[0018] The technical solution of the present invention is to set two speaker units on the shell, and set one of them as a low-frequency speaker unit and the other as a high-frequency speaker unit, so that the full-frequency sound quality can be improved by the combination of the low-frequency speaker unit and the high-frequency speaker unit. By installing the low-frequency speaker unit and the high-frequency speaker unit in the same shell to form an integral speaker module, the assembly between the low-frequency speaker unit and the high-frequency speaker unit is more compact, the structural compactness of the speaker module can be improved, and the external size of the speaker module can be reduced. Moreover, when the speaker module is installed on the electronic device, the assembly of the low-frequency speaker unit and the high-frequency speaker unit can be completed by installing the speaker module once, which can reduce the assembly error. In addition, by setting a front cavity opening on the bottom wall facing the diaphragm, and making the inner wall of the shell of the electronic device seal and cover the front cavity opening, it is equivalent to using the shell of the electronic device as a cover plate of the front sound cavity of the speaker module, omitting the cover plate of the front sound cavity of the speaker module, and reducing the size of the speaker module by the thickness of a cover plate, thereby reducing the overall thickness of the speaker module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 It is a structural schematic diagram of an embodiment of a speaker module of the present invention;

[0021] Figure 2 for Figure 1 A schematic cross-sectional view of one of the speaker units of the middle speaker module;

[0022] Figure 3 for Figure 2 The enlarged view of point A in the middle;

[0023] Figure 4 for Figure 1 A schematic cross-sectional view of the middle speaker module;

[0024] Figure 5 for Figure 4 The enlarged view of point B in the middle;

[0025] Figure 6 for Figure 4 Enlarged view of point C in the middle;

[0026] Figure 7 for Figure 1 Exploded diagram of the middle speaker module;

[0027] Figure 8 It is a structural schematic diagram of an embodiment of an electronic device of the present invention;

[0028] Fig. 9 It is a structural schematic diagram of another embodiment of the electronic device of the present invention;

[0029] Fig.10 for Figure 8 A schematic cross-sectional view of an electronic device;

[0030] Fig.11 for Fig.10 Enlarged view of point D in the middle.

[0031] Description of Figure Numbers:

[0032] Label name Label name 100 Speaker module 13 First lower shell 10 case 14 Second lower shell 11 Containment space 15 Make way for opening 111 Front voice cavity 20 Speaker unit 112 Back cavity 30 Gasket 12 Upper shell 40 Electronic devices 121 Front cavity opening 41 shell 122 Output channel 123 Channel opening

[0033] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions, taking "A and / or B as an example", including solution A, or solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0037] The present invention provides a speaker module, which can be used in electronic devices capable of making sound, such as earphones and mobile phones.

[0038] In the embodiments of the present invention, please refer to Figures 1 to 6 The speaker module 100 includes a shell 10 and at least two speaker units 20. The shell 10 has at least two receiving spaces 11. Two speaker units 20 are used as an example for explanation, but the invention is not limited thereto. The shell 10 includes a side wall and a bottom wall connected to the side wall. The two speaker units 20 are respectively arranged in the two receiving spaces 11, and the receiving spaces 11 are separated into a front sound cavity 111 connected to the front side of the diaphragm of the speaker unit 20, wherein one of the speaker units 20 is a low-frequency speaker unit, and the other speaker unit 20 is a high-frequency speaker unit. At least the low-frequency speaker unit of the two speaker units 20 separates the corresponding receiving space 11 into a rear sound cavity 112 connected to the rear side space of the diaphragm of the speaker unit 20. In this embodiment, the two receiving spaces 11 are divided into a front sound cavity 111 and a rear sound cavity 112 by the two speaker units 20. The present invention is not limited to the case where one low-frequency speaker unit and one high-frequency speaker unit are provided in the speaker module 100. Two or more low-frequency speaker units may be provided. Similarly, two or more high-frequency speaker units may also be provided. The shell 10 is provided with the same number of receiving spaces 11, and one speaker unit 20 corresponds to one receiving space 11, that is, each speaker unit 20 is provided in a different receiving space 11, and each receiving space 11 is provided with a speaker unit 20.

[0039] The diaphragms of the two speaker units 20 are facing the bottom wall (not shown), and a front cavity opening 121 is provided on the bottom wall corresponding to at least one of the two front sound cavities 111. The housing 41 of the electronic device (please refer to Fig.11 ) seals and covers the front cavity opening 121.

[0040] In another embodiment, when the F0 (resonance frequency) of the high-frequency speaker unit itself is high enough, it is no longer necessary to set a separate rear acoustic cavity 112 in the module housing 10. The space behind the diaphragm of the high-frequency speaker unit can be connected to the internal space of the housing 41 of the electronic device, and the internal space of the housing of the electronic device also serves as the rear acoustic cavity of the high-frequency speaker unit.

[0041] In one embodiment, the bottom wall includes a first bottom wall and a second bottom wall connected to and opposite to the side wall. In this specific embodiment, the diaphragms of the two speaker units 20 face the first bottom wall. In another embodiment, the diaphragms of the two speaker units 20 can also face the first bottom wall and the second bottom wall respectively.

[0042] The two receiving spaces 11 are separated from each other, that is, the two receiving spaces 11 are not connected to each other in the housing 10. The front cavity opening 121 passes through the bottom wall, and the penetration direction of the front cavity opening 121 is perpendicular or approximately perpendicular to the diaphragm surface of the speaker unit 20. When the front cavity opening 121 is set, it is equivalent to making the front sound cavity 111 open. When the speaker module 100 is installed in the housing 41 of the electronic device, the front cavity opening 121 can be sealed and covered by the inner wall of the housing 41 of the electronic device. It is equivalent to using the housing 41 of the electronic device as a cover plate of the front sound cavity 111 of the speaker module 100. In this way, the cover plate of the front sound cavity 111 of the speaker module 100 is omitted, and the size of the speaker module 100 can be reduced by the thickness of a cover plate. Among them, the number of the front cavity openings 121 can be set according to actual conditions. For example, when the space corresponding to one of the speaker units 20 in the housing 41 of the electronic device is small, and the space corresponding to the other speaker unit 20 is large, the front cavity opening 121 can be set only for the speaker unit 20 installed in the smaller space. Of course, two front cavity openings 121 may also be provided, and the two front cavity openings 121 correspond one-to-one to the front sound cavities 111 of the two speaker units 20. It can be understood that the low-frequency speaker unit is the woofer speaker unit, and the high-frequency speaker unit is the tweeter speaker unit.

[0043] In this embodiment, the speaker unit 20 includes a vibration system (not shown) and a magnetic circuit system (not shown). The vibration system includes a diaphragm and a voice coil fixed to one side of the diaphragm. The diaphragm includes a center portion, a folding ring portion arranged around the center portion, and a fixed portion arranged around the folding ring portion. The diaphragm may also include a composite layer combined with the center portion. The magnetic circuit system includes a magnetic yoke, and the magnetic yoke is provided with an inner magnetic circuit portion and an outer magnetic circuit portion, and a magnetic gap for accommodating the voice coil is formed between the two. In one case, the inner magnetic circuit portion includes a central magnet arranged at the center of the magnetic yoke and a central magnetic plate arranged on the central magnet, and the outer magnetic circuit portion includes a side magnet arranged at the edge of the magnetic yoke and a side magnetic plate arranged on the side magnet. The speaker unit 20 may also include an auxiliary system, and the auxiliary system (not shown) includes a unit housing, and the unit housing is used to accommodate and fix the vibration system and the magnetic circuit system. In addition, the auxiliary system may also include a front cover, which is combined with the upper part of the unit housing, and the front cover and the unit housing enclose a protective frame of the speaker unit 20. Of course, in some cases, the speaker unit 20 may not include an auxiliary system.

[0044] The technical solution of the present invention is to set two speaker units 20 on the housing 10, and set one of them as a low-frequency speaker unit and the other as a high-frequency speaker unit, so that the full-frequency sound quality can be improved by the combination of the low-frequency speaker unit and the high-frequency speaker unit. By installing the low-frequency speaker unit and the high-frequency speaker unit in the same housing 10 to form an integral speaker module 100, the assembly between the low-frequency speaker unit and the high-frequency speaker unit is made more compact, the structural compactness of the speaker module 100 can be improved, and the external size of the speaker module 100 can be reduced. Moreover, when the speaker module 100 is installed on the electronic device, the assembly of the low-frequency speaker unit and the high-frequency speaker unit can be completed by installing the speaker module 100 once, which can reduce the assembly error. In addition, by providing a front cavity opening 121 on the bottom wall facing the diaphragm and making the inner wall of the housing 41 of the electronic device seal and cover the front cavity opening 121, it is equivalent to using the housing 41 of the electronic device as a cover plate of the front sound cavity 111 of the speaker module 100. By omitting the cover plate of the front sound cavity 111 of the speaker module 100, the speaker module 100 can be reduced by the thickness of the cover plate, thereby reducing the overall thickness of the speaker module 100.

[0045] In one embodiment, the orthographic projection of the hole wall of the front cavity opening 121 on the corresponding diaphragm is located outside the folding ring portion of the diaphragm. In other words, the orthographic projection of the folding ring portion of the diaphragm on the bottom wall is located inside the corresponding front cavity opening 121, so that the fixing portion of the diaphragm can be installed on the bottom wall, and the folding ring portion and the center portion of the diaphragm are located inside the corresponding front cavity opening 121. When the diaphragm vibrates, the folding ring portion can move far into the front cavity opening 121, which is equivalent to using the front cavity opening 121 as the vibration space of the diaphragm. In this way, there is no need to set an additional avoidance space on the bottom wall for the diaphragm to vibrate, which can reduce the overall thickness of the speaker module 100. Of course, in other embodiments, the folding ring portion can also be accommodated in the inner cavity of the speaker unit 20. In addition, in one embodiment, the folding ring portion is arranged to protrude in the direction of the front cavity opening 121, so that the inner cavity height of the speaker unit 20 can be reduced, and the overall thickness of the speaker module 100 can be further reduced. In addition. In one embodiment. The clearance opening 15 can also be used as the front sound cavity 111 , that is, the supporting part of the bottom wall and the fixing part of the diaphragm, so that the folding ring part of the diaphragm extends into the clearance opening 15 .

[0046] In one embodiment, the cavity wall of at least one rear acoustic cavity 112 is provided with a clearance opening 15, and one end of the speaker unit 20 away from its diaphragm extends into the clearance opening 15. Specifically, the two rear acoustic cavities 112 are respectively provided with a clearance opening 15, and the two speaker units 20 are respectively extended into the clearance opening 15. Among them, the end of the speaker unit 20 away from its diaphragm can be arranged roughly flush with the outer edge of the clearance opening 15, that is, roughly flush with the outer surface of the shell 10. This is equivalent to moving the speaker unit 20 from the clearance opening 15 to the outside of the receiving space 11, which can reduce the space occupied by the speaker unit 20 in the receiving space 11, thereby reducing the thickness of the shell 10, so as to reduce the overall thickness of the speaker module 100. Specifically, part of the magnetic circuit system of the speaker unit 20 extends into the clearance opening 15, for example, the magnetic yoke is completely or partially located in the clearance opening 15, so that the magnetic yoke is exposed from the clearance opening 15 to the outside of the receiving space 11. In this way, the heat of the speaker unit 20 can be dissipated from the clearance opening 15, which can improve the heat dissipation effect of the speaker module 100. Of course, in other embodiments, only one of the rear sound cavities 112 may be provided with a clearance opening 15.

[0047] In one embodiment, the speaker module 100 further includes a sealing gasket 30, which is arranged around the outer periphery of the front cavity opening 121 and is arranged between the housing 41 and the bottom wall of the electronic device. Specifically, the sealing gasket 30 is arranged in an annular shape, and the sealing gasket 30 is arranged on the outside of the bottom wall. When the speaker module 100 is assembled on the electronic device, the sealing gasket 30 is abutted between the housing 41 and the bottom wall of the electronic device to seal the front cavity opening 121. Among them, the sealing gasket 30 can be pre-bonded to the bottom wall to prevent the sealing gasket 30 from falling off when the speaker module 100 is installed on the electronic device, so as to facilitate assembly. Of course, in other embodiments, the sealing gasket 30 can also be pre-bonded to the housing 41 of the electronic device.

[0048] In addition, in one embodiment, in order to improve the sealing effect of the sealing gasket 30, the sealing gasket 30 is set as an elastic member, and its material can be elastic silicone, rubber or foam, etc. In this way, it can ensure that the sealing gasket 30 is better supported between the housing 41 and the bottom wall of the electronic device, and the gap between the sealing gasket 30 and the housing 41 of the electronic device can be reduced, the sealing effect is better, and the assembly precision can be reduced, which is convenient for installation. Of course, in other embodiments, the sealing gasket 30 can also be made of hard materials.

[0049] In one embodiment, the outer surface of the bottom wall is provided with a mounting groove (not shown), the front cavity opening 121 is opened at the bottom of the mounting groove, the sealing gasket 30 is arranged at the bottom of the mounting groove, and the thickness of the sealing gasket 30 is greater than the groove depth of the mounting groove. That is, when the sealing gasket 30 is installed at the bottom of the mounting groove, the sealing gasket 30 can protrude from the outer surface of the bottom wall, so that the portion of the sealing gasket 30 protruding from the bottom wall can abut against the housing 41 of the electronic device, thereby playing a sealing role. The sealing gasket 30 is arranged in the mounting groove, which can reduce the overall thickness of the speaker module 100. Moreover, when the sealing gasket 30 is set as an elastic member, the housing 41 of the electronic device can compress the sealing gasket 30 completely into the mounting groove, so that the housing 41 of the electronic device can approach or even fit the outer surface of the bottom wall, thereby reducing the space occupied by the speaker module 100 on the electronic device, so that the speaker module 100 can be applied to thinner electronic devices.

[0050] In one embodiment, the housing 10 further includes a side wall (not shown) connected to the bottom wall, the side wall is provided with two sound outlet channels 122 respectively connected to the two front sound cavities 111, a channel opening 123 is provided on the bottom wall corresponding to at least one of the two sound outlet channels 122, and the housing 41 of the electronic device seals and covers the channel opening 123. Specifically, the two front sound cavities 111 are respectively provided with a sound outlet channel 122, the two sound outlet channels 122 are located on the same side of the speaker module 100, and the two sound outlet channels 122 are arranged at intervals. The channel opening 123 is provided on a side of the sound outlet channel 122 close to the front cavity opening 121, and the channel opening 123 is connected to the front cavity opening 121 to form an opening structure on the bottom wall together, and the hole wall of the channel opening 123 facing the front cavity opening 121 is away from the speaker unit 20. In this way, the entrance part of the sound outlet channel 122 is formed between the part of the speaker unit 20 close to the sound outlet channel 122 and the housing 41 of the electronic device. Since there is no need to set a bottom wall above this part of the speaker unit 20, the distance between the speaker unit 20 and the outer surface of the bottom wall can be reduced while ensuring that the aperture of the sound outlet channel 122 meets the sound outlet performance, which is beneficial to reduce the overall thickness of the speaker module 100, and can also make full use of the space of the front cavity opening 121, so that the structure of the speaker module 100 is more compact. In addition, in the embodiment where the sealing gasket 30 is set, the sealing gasket 30 is also set around the channel opening 123, that is, the sealing gasket 30 is set around the channel opening 123 and the front cavity opening 121 at the same time. Among them, a channel opening 123 can be opened on the bottom wall only corresponding to one of the sound outlet channels 122, or a channel opening 123 can be opened corresponding to each sound outlet channel 122.

[0051] Please refer to Figures 5 to 7In one embodiment, the housing 10 includes an upper housing 12, a first lower housing 13 and a second lower housing 14. The first lower housing 13 and the upper housing 12 together form a receiving space 11, and the second lower housing 14 and the upper housing 12 together form another receiving space 11. Specifically, the bottom wall is the portion of the upper housing 12 facing the diaphragm, and the side wall is the portion of the upper housing 12 connected to the bottom wall. The first lower housing 13 and the second lower housing 14 are separately arranged, so that two speaker units 20 can be installed separately. Even if one of the speaker units 20 has a problem during the installation process, it will not affect the installation of the other speaker unit 20. Moreover, the first lower housing 13 and the second lower housing 14 are mainly used to fix the speaker unit 20, so when the first lower housing 13 and the second lower housing 14 are removed from the upper housing 12, it is easy to cause the speaker unit 20 to fall off. By setting up a split first lower shell 13 and a second lower shell 14 to fix two speaker units 20 respectively, when one of the speaker units 20 is damaged and the other can be used normally, only the first lower shell 13 or the second lower shell 14 can be opened, which can prevent the speaker unit 20 in normal use from falling or even being damaged. In addition, compared with the structure in which the first lower shell 13 and the second lower shell 14 are integrally formed, this can also reduce the overall assembly accuracy of the speaker module 100. In the embodiment in which the clearance opening 15 is set, the first lower shell 13 and the second lower shell 14 are respectively provided with a clearance opening 15. Of course, in other embodiments, the shell 10 may also include an upper shell 12 and an integrally formed lower shell, and two receiving spaces 11 are respectively formed between the lower shell and the upper shell 12.

[0052] In the embodiment where the bottom wall includes a first bottom wall and a second bottom wall, the first bottom wall is located at the upper shell 12, and the first lower shell 13 and the second lower shell 14 each have a second bottom wall, that is, the first bottom wall is the portion of the upper shell 12 facing the diaphragm, the second bottom wall of the first lower shell 13 is the portion of the first lower shell 13 facing the diaphragm of the corresponding speaker unit 20, and the second bottom wall of the second lower shell 14 is the portion of the second lower shell 14 facing the diaphragm of the corresponding speaker unit 20. In the embodiment where the clearance opening 15 is provided, the clearance opening 15 is provided at the second bottom wall of the first lower shell 13 and / or the clearance opening 15 is provided at the second bottom wall of the second lower shell 14.

[0053] In one embodiment, the first lower shell 13 and the second lower shell 14 are metal parts. This makes the strength of the first lower shell 13 and the second lower shell 14 higher, and the thickness of the first lower shell 13 and the second lower shell 14 smaller, so that the volume of the receiving space 11 can be increased. When the speaker unit 20 is installed to form the rear sound cavity 112, the volume of the rear sound cavity 112 can be increased, the low-frequency performance of the speaker module 100 can be increased, and the overall strength of the shell 10 can be improved. In addition, the thermal conductivity of metal is good. When the first lower shell 13 and the second lower shell 14 are set in this way, the heat dissipation effect of the speaker unit 20 can also be improved. Among them, the material of the first lower shell 13 and the second lower shell 14 can be stainless steel, copper, copper alloy, titanium alloy and aluminum alloy, etc.

[0054] Please refer to Figures 8 to 11 The present invention also proposes an electronic device 40, which includes a housing 41 and a speaker module 100. The specific structure of the speaker module 100 refers to the above embodiment. Since the electronic device 40 adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. Among them, the speaker module 100 is arranged in the housing 41, and the housing 41 seals and covers the front cavity opening 121 of the speaker module 100. The electronic device 40 can be a mobile phone, a computer, a tablet computer or a smart speaker, etc. In addition, a plurality of speaker modules 100 can be provided on an electronic device 40, for example, the electronic device 40 is provided with two, three or four speaker modules 100, etc.

[0055] In one embodiment, the front cavity opening 121 constitutes a sound outlet channel 122 of the speaker module 100, and a sound outlet hole (not shown) is provided on the housing 41 corresponding to the front cavity opening 121. Specifically, two front cavity openings 121 are provided on the speaker module 100, and the two front cavity openings 121 correspond to the front sound cavities 111 of the two speaker units 20 respectively, and each speaker unit 20 can transmit sound to the outside through the front cavity opening 121 and the sound outlet hole on the housing 41. That is, there is no need to set a sound outlet channel 122 on the side wall of the housing 10 of the speaker module 100, and there is no need to reserve a setting space for the sound outlet channel 122 on the side wall of the housing 10, and the thickness of the housing 10 can be set smaller, thereby reducing the overall thickness of the speaker module 100.

[0056] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A speaker module for electronic equipment, characterized in that: include: A shell having at least two receiving spaces, the shell comprising a side wall and a bottom wall connected to the side wall; as well as, At least two speaker units are disposed in the two receiving spaces, and the receiving spaces are separated into a front sound cavity communicating with the front side of the diaphragm of the speaker unit, wherein one of the speaker units is a low-frequency speaker unit, and the other speaker unit is a high-frequency speaker unit, and the low-frequency speaker unit and the high-frequency speaker unit are installed in the same housing, and at least the low-frequency speaker unit of the two speaker units separates the corresponding receiving space into a rear sound cavity communicating with the space on the rear side of the diaphragm of the speaker unit; The diaphragms of the two speaker units both face the bottom wall, a front cavity opening is provided on the bottom wall corresponding to at least one of the two front sound cavities, and the housing of the electronic device seals and covers the front cavity opening.

2. The speaker module according to claim 1, wherein: The bottom wall includes a first bottom wall and a second bottom wall connected to and opposite to the side wall, and the diaphragms of the two speaker units both face the first bottom wall, or the diaphragms of the two speaker units respectively face the first bottom wall and the second bottom wall.

3. The speaker module according to claim 1, wherein: The orthographic projection of the hole wall of the front cavity opening on the corresponding diaphragm is located outside the folding ring portion of the diaphragm.

4. The speaker module according to claim 1, wherein: A cavity wall of at least one of the rear sound cavities is provided with a clearance opening, and one end of the speaker unit away from its diaphragm extends into the clearance opening.

5. The speaker module according to claim 1, wherein: The speaker module also includes a sealing pad, which is arranged around the outer periphery of the front cavity opening and is arranged between the housing of the electronic device and the bottom wall.

6. The speaker module according to claim 5, characterized in that: An installation groove is provided on the outer surface of the bottom wall, the front cavity opening is opened at the bottom of the installation groove, the sealing gasket is arranged at the bottom of the installation groove, and the thickness of the sealing gasket is greater than the depth of the installation groove.

7. The speaker module according to claim 1, wherein: The side wall is provided with two sound outlet channels respectively connected with the two front sound cavities; A channel opening is provided on the bottom wall corresponding to at least one of the two sound outlet channels, and the housing of the electronic device seals and covers the channel opening.

8. The speaker module according to any one of claims 1 to 7, characterized in that: The shell comprises an upper shell, a first lower shell and a second lower shell. The first lower shell and the upper shell together form one receiving space, and the second lower shell and the upper shell together form another receiving space.

9. The speaker module according to claim 8, characterized in that: The first lower shell and the second lower shell are metal parts.

10. An electronic device, characterized in that: It comprises a housing and a speaker module as claimed in any one of claims 1 to 9, wherein the speaker module is arranged in the housing, and the housing seals and covers a front cavity opening of the speaker module.

11. The electronic device according to claim 10, characterized in that: The front cavity opening constitutes a sound outlet channel of the speaker module, and a sound outlet hole is provided on the shell corresponding to the front cavity opening.

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