Dual-band dual-polarized microstrip antenna

Abstract

The application provides a kind of dual-band dual-polarized microstrip antenna, including reflecting floor, matching sleeve, upper pcb substrate, dielectric substrate, lower pcb substrate;Radiation patch, feed port, ground pad are fixed in the middle position of the upper surface of upper pcb substrate, the lower surface is coated with first metal sheet;The upper and lower surfaces of the four around of dielectric substrate are coated with second metal sheet and third metal sheet respectively, and the middle position is the cavity region that is penetrated from top to bottom;The upper surface of lower pcb substrate is coated with fourth metal sheet around, and the middle is coated with feed metal sheet, and the feed metal sheet is fed to radiation patch through two feed ports;The pin of the top of matching sleeve is electrically connected with ground pad.The advantages are that the application can greatly reduce the size of antenna by sharing one radiation patch with double emission, and the back-feed mode will make the phased array formed by the array more advantageous.The first to fourth metal sheets play a regulating role on the gain and wave width of the antenna.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of antennas, in particular to a dual-band dual-polarized microstrip antenna. BACKGROUND

[0002] In the modern mobile communication field, with the development of the communication industry, more and more communication devices are loaded on mobile communication bodies. Therefore, reducing the device size, increasing the communication system bandwidth and improving the device performance become the goals pursued by people. As the current satellite launch boom is rising, the ground receiving terminal will become more and more, the satellite communication traffic will become larger and larger, and the performance of the communication system will also be improved accordingly. However, in the satellite communication industry, the performance of the antenna affects the performance of the entire satellite communication system. Obviously, it is particularly important to find an antenna with low profile, small size and high bandwidth.

[0003] The microstrip antenna is commonly used in satellite antennas. The bandwidth of the traditional microstrip antenna is relatively low, and the relative bandwidth is generally only 10%. The structure is difficult to realize, the processing precision is high, and in order to improve the gain, the array form is often used to realize it. This will greatly increase the size and processing difficulty of the antenna. At the same time, the satellite terminal antenna is often integrated with receiving and transmitting. Therefore, it is particularly important to find an antenna with small size, high bandwidth and integrated receiving and transmitting. SUMMARY

[0004] The technical problem to be solved by the application is how to improve the adaptability of the microstrip antenna to various frequency bands while achieving smaller size, and realizing receiving and transmitting sharing one radiation unit.

[0005] The application solves the above technical problems through the following technical scheme:

[0006] A dual-band dual-polarized microstrip antenna, comprising a reflecting floor, a microstrip antenna and a matching sleeve; the microstrip antenna comprises an upper pcb substrate, a lower pcb substrate and a dielectric substrate between the upper pcb substrate and the lower pcb substrate;

[0007] A radiation patch is fixed in the middle of the upper surface of the upper pcb substrate, and a plurality of first metal sheets are applied to the periphery of the lower surface; the plurality of first metal sheets are symmetrically arranged with the center line of the upper pcb substrate; a feed port and a ground pad are arranged on the upper pcb substrate;

[0008] Second metal sheets and third metal sheets corresponding to the number and vertical position of the first metal sheets are respectively applied to the periphery of the upper and lower surfaces of the dielectric substrate, and the middle vertically corresponds to the position of the radiation patch, which is an upper and lower through cavity area;

[0009] The upper surface of the lower PCB substrate is surrounded by fourth metal sheets corresponding to the number and vertical position of the third metal sheets, and a feeding metal sheet is arranged in the middle, which feeds the radiation patch through a feeding port;

[0010] The first metal sheet and the second metal sheet at the corresponding position are electrically connected, and the third metal sheet and the fourth metal sheet at the corresponding position are electrically connected.

[0011] The bottom end of the matching sleeve is electrically connected with the reflecting floor, and the top end extends a pin upward, which is electrically connected with the ground pad through the lower PCB substrate, the feeding metal sheet, the dielectric substrate, the upper PCB substrate and the ground pad in sequence.

[0012] Preferably, two feeding ports are arranged on the upper PCB substrate, and the center lines of the two feeding ports and the center line of the radiation patch are perpendicular to each other.

[0013] Preferably, two H-shaped grooves are arranged on the feeding metal sheet, and the two H-shaped grooves feed the radiation patch through the two feeding ports.

[0014] Preferably, two orthogonal transmission lines are arranged on the lower surface of the feeding metal sheet, one end of each transmission line is coupled with one of the two H-shaped grooves, and the other end of each transmission line is electrically connected with an SMA connector, which is electrically connected with the feeding port through the SMA connector.

[0015] Preferably, the matching sleeve is a cylindrical structure with two open ends, the SMA connector 1 is coaxially sleeved in the matching sleeve, one end of the SMA connector 1 is fixed on the reflecting floor to realize grounding, and the other end of the SMA connector 1 is electrically connected with the transmission line and the feeding port through the matching sleeve.

[0016] Preferably, one ground pad is arranged on each side of each feeding port.

[0017] Preferably, two pins extend upward from the top end of each matching sleeve; a through hole is arranged on the lower PCB substrate, the feeding metal sheet, the dielectric substrate, the upper PCB substrate and the ground pad at a vertically corresponding position, and the two pins of each matching sleeve pass through the through hole and are electrically connected with the two ground pads on both sides of one feeding port.

[0018] Preferably, the lower PCB substrate, the dielectric substrate and the upper PCB substrate are rectangular substrates, and the first metal sheet, the second metal sheet, the third metal sheet and the fourth metal sheet are four pieces.

[0019] Preferably, mounting holes are arranged on the reflecting floor, the lower PCB substrate, the dielectric substrate and the upper PCB substrate at vertically corresponding positions, and a non-metal screw passes through the mounting holes of the reflecting floor, the lower PCB substrate, the dielectric substrate and the upper PCB substrate in sequence and is fastened and fixed by a nut to form an integral body.

[0020] Preferably, the matching sleeve is made of copper material.

[0021] The present application has the advantages of:

[0022] The present application can greatly reduce the size of the antenna by using a radiation patch shared by two antennas, and the back-feed mode can make the phased array more advantageous, and the feed is convenient and the size is smaller.

[0023] By adjusting the length of the first to fourth metal sheets, the gain and beam width of the antenna are adjusted, and according to actual needs, the gain and beam width of the antenna can be controlled by designing different sizes of the first to fourth metal sheets. Similarly, by designing different sizes of the radiation patch, the resonant frequency of the antenna can be adjusted. The structure can assemble the first metal sheet and the radiation patch of different sizes according to actual needs to achieve the required antenna performance.

[0024] Similarly, the size of the cavity area can also affect the resonant frequency of the antenna.

[0025] Adjusting the physical parameters of the matching sleeve can adjust the return loss (standing wave ratio) of the microstrip antenna, and the two pins extending out can play a grounding role and improve the isolation of the antenna. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 An exploded structure diagram of a dual-band dual-polarized microstrip antenna according to an embodiment of the present application;

[0027] Figure 2 An overall structure diagram of a dual-band dual-polarized microstrip antenna according to an embodiment of the present application;

[0028] Figure 3 A top view structure diagram of an upper pcb substrate in a dual-band dual-polarized microstrip antenna according to an embodiment of the present application;

[0029] Figure 4 A top view structure diagram of a dielectric substrate in a dual-band dual-polarized microstrip antenna according to an embodiment of the present application;

[0030] Figure 5 A top view structure diagram of a lower pcb substrate in a dual-band dual-polarized microstrip antenna according to an embodiment of the present application;

[0031] Figure 6 A structure diagram of a matching sleeve and an SMA connector in a dual-band dual-polarized microstrip antenna according to an embodiment of the present application. DETAILED DESCRIPTION

[0032] In order to make the structural features of the present application and the achieved effects have further understanding and recognition, the preferred embodiments are described below in conjunction with the accompanying drawings.

[0033] As shown in Figure 1 , Figure 2 , a dual-band dual-polarized microstrip antenna includes a reflecting floor 7, a three-layer microstrip antenna (not marked in the figure), two matching sleeves 8, and four non-metal fixing screws 9. The reflecting floor 7 and the three-layer microstrip antenna are both rectangular structures, and the three-layer microstrip antenna is located above the reflecting floor. The reflecting floor 7 and the three-layer microstrip antenna are both provided with mounting holes at four corners, and the four non-metal fixing screws 9 pass through the mounting holes in sequence to fix the reflecting floor 7 and the three-layer microstrip antenna as a whole.

[0034] The three-layer microstrip antenna includes an upper pcb substrate 2, a lower pcb substrate 4, and a dielectric substrate 30 between the upper pcb substrate 2 and the lower pcb substrate 4. The upper pcb substrate 2 and the lower pcb substrate 4 are generally made of Rogers 5880 plate material.

[0035] As shown in Figure 3 , Figure 1 is an isometric view, and the perspective view does not correspond to that of Figures 3-5 , the upper surface of the upper pcb substrate 2 is fixed with a square radiation patch 20 at the middle position. The radiation patch 20 is a metal copper sheet, and the four edges of the radiation patch 20 can be parallel to the four edges of the upper pcb substrate to realize linear polarization, or the radiation patch 20 can be rotated by a certain angle to realize circular polarization. The upper pcb substrate 2 is provided with feeding ports 50 and 60 at positions adjacent to two edges of the radiation patch 20, respectively, and the two feeding ports are orthogonal. The ground pads 21 are arranged on both sides of each feeding port along the length direction of the radiation patch 20. The first metal sheet 22 is applied around the lower surface of the upper pcb substrate 2, and the first metal sheet 22 is a rectangular copper sheet. Changing the size of the radiation patch 20 can adjust the resonant frequency of the antenna transceiver, for example, when the size of the radiation patch is 5.2*6.9mm, the transceiver resonant frequency points are 12.5GHz and 14.25GHz, respectively, and when the size of the radiation patch is 5.4*7.2mm, the transceiver resonant frequency points are 13GHz and 14.5GHz, respectively. Changing the size of the first metal sheet 22, and of course, the sizes of the second metal sheet, the third metal sheet, and the fourth metal sheet introduced below are consistent with the first metal sheet, can adjust the gain and beam width of the antenna, for example, when the metal sheet is 8*2mm, the receiving gain is 8.5dB, and the beam width is 64°, and when the metal sheet is 13*2mm, the gain is 9.4dB, and the beam width is 55°. If used for array, the antenna unit pattern can be adjusted as needed.

[0036] As shown in Figure 4As shown, the dielectric substrate 30 is a rectangular Rogers RT / duroid 6010 dielectric board with a dielectric constant of 10.2, a thickness of 8 mm, and dimensions of 23.8 mm × 50 mm. A second metal sheet 31 and a third metal sheet 32 ​​are respectively applied to its upper and lower surfaces. A through-cavity region 33 is located vertically opposite to the radiating patch 20 in the center. This cavity region 33 improves the antenna bandwidth. The size of the cavity region 33 also affects the antenna's resonant frequency. For example, when the cavity region size is 5.2 * 6.9 mm, the transmit and receive resonant frequencies are 12.5 GHz and 14.25 GHz, respectively; when the cavity region size is 5 * 6 mm, the transmit and receive resonant frequencies are 13.2 GHz and 14.3 GHz, respectively. A first through-hole 34 and a second through-hole 35 are provided at positions vertically corresponding to the feed ports 50 and 60 and the ground pad 21.

[0037] like Figure 5 As shown, the upper surface of the lower PCB substrate 4 is covered with fourth metal sheets 41 corresponding to the number and position of the third metal sheets 32. Similarly, the second metal sheets 31, third metal sheets 32, and fourth metal sheets 41 are all the same size and material as the first metal sheets 22. The upper PCB substrate 2 and the dielectric substrate 30 are fixed by welding four first metal sheets 22 and four second metal sheets 31 one-to-one. Similarly, the dielectric substrate 30 and the lower PCB substrate 4 are fixed by welding four third metal sheets 32 and four fourth metal sheets 41 one-to-one, thereby electrically connecting the three substrates into a whole.

[0038] A rectangular copper sheet 40, 0.018 mm thick and 23.8 mm × 50 mm in size, is applied to the center of the upper surface of the lower PCB substrate 4. Two H-shaped slots are formed on the feed metal sheet 40. Two orthogonal transmission lines 42 are arranged on the lower surface of the feed metal sheet 40. One end of each transmission line 42 is electrically connected to one of the two H-shaped slots, and the other end is electrically connected to an SMA connector 1. The SMA connector 1 connects to the feed port, thereby feeding power to the radiating patch 20. A third through-hole 43 and a fourth through-hole 44 are formed on the feed metal sheet 40 at vertically corresponding positions to the ground pad 21 and the feed ports 50 and 60.

[0039] like Figure 6 As shown, the matching sleeve 8 is a cylindrical structure made of copper. Its bottom end is electrically connected to the reflective ground plane 7, and two pins 81 extend upward from the top end. The two pins 81 pass through the third through hole 43 (the corresponding position of the lower PCB substrate also has a through hole for the pins 81 to pass through) and the second through hole 35 in sequence, and are electrically connected to the pad 21 on the upper PCB substrate 2. Adjusting the height and inner diameter of the matching sleeve can adjust the return loss (VSWR) of the microstrip antenna. The two extended pins serve as grounding and improve the isolation of the antenna.

[0040] The SMA joint 1 is sleeved in the matching sleeve 8 and coaxial with the matching sleeve 8, the bottom end of which is electrically connected to the reflecting floor 7 to realize grounding, the transmission core of which is electrically connected to the transmission line 42 through the matching sleeve 8 and is electrically connected to the feed port through the fourth through hole 44 and the first through hole 34 to realize coaxial feeding.

[0041] The microstrip antenna provided by the embodiment is suitable for any frequency band, and specifically is:

[0042] According to the transmission line theory,

[0043]

[0044]

[0045] Wherein, L is the length of the radiation patch, W is the width of the radiation patch, △L is the correction factor, ε is the dielectric constant, u is the magnetic permeability, c0 is the speed of light in free space, and f is the working frequency. For this microstrip antenna, the proportion of the working frequency adjustment model can be suitable for any frequency band, especially for lower working frequency, since the double radiation patches share one radiation patch, the size of the antenna can be greatly reduced, and the back feeding mode is adopted, which makes the phased array formed by the array more advantageous, the feeding is convenient, and the size is smaller.

[0046] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A dual-band dual-polarized microstrip antenna, characterized in that: It includes a reflective ground plane, a microstrip antenna, and a matching sleeve; the microstrip antenna includes an upper PCB substrate, a lower PCB substrate, and a dielectric substrate located between the upper PCB substrate and the lower PCB substrate. A radiating patch is fixed at the center of the upper surface of the upper PCB substrate, and multiple first metal sheets are applied around the lower surface. The multiple first metal sheets are symmetrically arranged along the center line of the upper PCB substrate. A power supply port and a grounding pad are provided on the upper PCB substrate. The upper and lower surfaces of the dielectric substrate are respectively covered with second and third metal sheets corresponding to the number and vertical position of the first metal sheets, and the middle position corresponding to the vertical position of the radiating patch is a cavity area that runs vertically through the substrate. The upper surface of the lower PCB substrate is covered with fourth metal sheets around all four sides, corresponding to the number and vertical position of the third metal sheets, and a feeding metal sheet is placed in the middle. The feeding metal sheet feeds the radiating patch through the feeding port. The first metal piece and the second metal piece at corresponding positions are electrically connected, and the third metal piece and the fourth metal piece at corresponding positions are electrically connected; The bottom ends of the matching sleeves are electrically connected to the reflective ground plane, and the top ends of the sleeves extend upwards with pins. The pins pass through the lower PCB substrate, the feeding metal sheet, the dielectric substrate, the upper PCB substrate, and are electrically connected to the grounding pad. Design first to fourth metal sheets of different sizes to achieve antenna gain and bandwidth control; design different sizes of radiating patches to adjust the antenna resonant frequency.

2. The dual-band dual-polarized microstrip antenna according to claim 1, characterized in that: Two power supply ports are provided on the upper PCB substrate, and the center of the two power supply ports is perpendicular to the line connecting the center of the radiating patch.

3. The dual-band dual-polarized microstrip antenna according to claim 2, characterized in that: The feeding metal sheet has two H-shaped slots, which feed power to the radiating patch through two feeding ports.

4. A dual-band dual-polarized microstrip antenna according to claim 3, characterized in that: Two orthogonal transmission lines are provided on the lower surface of the feeding metal sheet. One end of each transmission line is coupled to the two H-shaped slots, and the other end is electrically connected to the SMA connector. The power is fed to the feeding port through the SMA connector.

5. A dual-band dual-polarized microstrip antenna according to claim 4, characterized in that: There are two matching sleeves, both of which are cylindrical structures with open ends. The SMA connector 1 is coaxially sleeved inside the matching sleeve, with one end fixed to the reflector floor for grounding, and the other end passing through the matching sleeve and electrically connected to the transmission line and the power supply port.

6. A dual-band dual-polarized microstrip antenna according to claim 5, characterized in that: Each power supply port has a grounding pad on both sides.

7. A dual-band dual-polarized microstrip antenna according to claim 6, characterized in that: Two pins extend upward from the top of each matching sleeve; through holes are respectively opened at the vertically corresponding positions of the lower PCB substrate, the power supply metal sheet, the dielectric substrate, the upper PCB substrate, and the grounding pad for the pins to pass through; the two pins on each matching sleeve pass through the through holes and are electrically connected to the two grounding pads on both sides of a power supply port.

8. A dual-band dual-polarized microstrip antenna according to any one of claims 1 to 7, characterized in that: The lower PCB substrate, dielectric substrate, and upper PCB substrate are rectangular substrates, and there are four metal sheets: the first metal sheet, the second metal sheet, the third metal sheet, and the fourth metal sheet.

9. A dual-band dual-polarized microstrip antenna according to any one of claims 1 to 7, characterized in that: Mounting holes are provided at corresponding vertical positions on the reflective floor, lower PCB substrate, dielectric substrate, and upper PCB substrate. Non-metallic screws are passed through the mounting holes on the reflective floor, lower PCB substrate, dielectric substrate, and upper PCB substrate in sequence, and then tightened with nuts to fix them into a whole.

10. A dual-band dual-polarized microstrip antenna according to any one of claims 1 to 7, characterized in that: The matching sleeve is made of copper.

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