Optical transmission equipment

Abstract

The optical transmission device of the present application includes: at least one optical module cage unit fixedly arranged on the service circuit board; the optical module cage unit includes: one or more first optical module cages arranged on the upper layer and one or more second optical module cages arranged on the lower layer; wherein, each of the first optical module cages is used to place one or more first optical modules, and each of the second optical module cages is used to place a second optical module; the first optical module is used for optical communication connection on the service side, and the second optical module is used for optical communication connection on the customer side; the solder feet of the first optical module cage and the second optical module cage are staggered from each other and do not interfere; by stacking the optical module cages on the service side and the sending side without interfering with each other, more free space inside the device can be provided to configure more optical modules, thereby improving the interface density and facilitating the heat dissipation of the first optical module on the service side with higher power consumption.

Description

Technical Field

[0001] This application relates to the technical field of optical transmission networks, and particularly to optical transmission devices. Background Art

[0002] Currently, the common optical transmission devices supporting CFP2 include blade plug-in type with large chassis and standard 1U chassis type.

[0003] Blade plug-in type with large chassis: The whole device is large and has complete functions. Although it can support different service communication functions, its disadvantages are that the height of such devices is all above 12U (540mm), and the power consumption of the equipped power supply is above 2000 watts. This kind of device is suitable for use in large-scale engineering plans with overall requirements, where the entire project needs to have sufficient planning for cabinet space and power distribution energy consumption. However, in the requirements of general single services, it will cause unnecessary cost increase. In addition, it cannot well meet the needs of operators for rapid deployment and rapid service activation.

[0004] 1U chassis type: 1U devices are small in size and easy to install. However, among all types of CFP2 modules, the highest power consumption can reach 18w. Therefore, simply increasing the interface density will pose a huge challenge to heat dissipation. So, the 1U devices in the market either have a small interface density or have restrictions on the types of CFP2 modules (high-power CFP2 modules cannot be used).

[0005] Therefore, the market needs devices for a high-density, high-speed compatible all-type CFP2 optical transmission platform. Summary of the Invention

[0006] In view of the above-mentioned disadvantages of the prior art, the purpose of this application is to provide an optical transmission device to solve the problems of the prior art.

[0007] To achieve the above objectives and other related objectives, this application provides an optical transmission device, including: at least one optical module cage unit fixedly arranged on a service circuit board; the optical module cage unit includes: one or more first optical module cages arranged on the upper layer and one or more second optical module cages arranged on the lower layer; wherein, each of the first optical module cages is used to place one or more first optical modules, and each of the second optical module cages is used to place a second optical module; the first optical module is used for optical communication connection on the service side, and the second optical module is used for optical communication connection on the client side.

[0008] In an embodiment of this application, the solder feet are made by a crimping process and / or the thickness of the service circuit board meets a preset requirement, so that the solder feet between the first optical module cage and the second optical module cage are staggered from each other and do not interfere.

[0009] In an embodiment of the present application, there are multiple optical module cage units, and their relative positions are arranged such that each first optical module cage is located on the same upper layer, and each second optical module cage is located on the same lower layer.

[0010] In an embodiment of the present application, each optical module cage unit includes: a first optical module cage with a 1×N structure and M second optical module cages, where M is an integer multiple of N; the network capacity of each first optical module is equal to the sum of the network capacities of M / N second optical modules.

[0011] In an embodiment of the present application, a plurality of sockets for inserting optical modules are provided at the front ends of the first optical module cage and the second optical module cage, and each of the sockets is exposed at the front end of the optical transmission device.

[0012] In an embodiment of the present application, the top of the first optical module cage has a hollow to expose each first optical module; the optical transmission device further includes: a heat dissipation module for contacting each first optical module disposed in the first optical module cage through the hollow to dissipate heat.

[0013] In an embodiment of the present application, the heat dissipation module includes: a plurality of heat conduction substrates for respectively contacting the first optical modules in each first optical module cage; a plurality of heat conduction tubes fixedly connected to the heat conduction substrates; and one or more heat dissipation bodies fixedly connected to each of the heat conduction tubes.

[0014] In an embodiment of the present application, a phase change heat conduction material is provided at the part of the heat conduction substrate for contacting the first optical module.

[0015] In an embodiment of the present application, the phase change heat conduction material is attached to a metal foil and is installed together at the part of the heat conduction substrate for contacting the first optical module.

[0016] In an embodiment of the present application, the heat conduction substrates are positioned and connected by spring screws.

[0017] In an embodiment of the present application, the optical transmission device includes: one or more hot-swappable fan modules disposed at the rear end of the optical transmission device for dissipating heat from the heat dissipation module.

[0018] In an embodiment of the present application, the optical transmission device includes: a power management circuit board disposed below the service circuit board and electrically connected to the service circuit board and the power module.

[0019] In an embodiment of the present application, the optical transmission device includes: one or more hot-swappable power modules disposed at the rear end of the optical transmission device for supplying power to the optical transmission device.

[0020] In an embodiment of the present application, the optical transmission device is a 1U device.

[0021] As described above, the optical transmission device of the present application includes: at least one optical module cage unit fixedly disposed on the service circuit board; the optical module cage unit includes: one or more first optical module cages disposed on the upper layer and one or more second optical module cages disposed on the lower layer; wherein, each of the first optical module cages is used to place one or more first optical modules, and each of the second optical module cages is used to place a second optical module; the first optical module is used for optical communication connection on the service side, and the second optical module is used for optical communication connection on the customer side; the solder feet of the first optical module cage and the second optical module cage are staggered from each other and do not interfere; by stacking the optical module cages on the service side and the sending side without interfering with each other, more free space inside the device can be provided to configure more optical modules, thereby increasing the interface density and facilitating the heat dissipation of the first optical module on the service side with higher power consumption. Description of the Drawings

[0022] Figure 1 It shows a combined structural schematic diagram of the front view angle of the optical transmission device in the embodiment of the present application.

[0023] Figure 2 It shows an exploded structural schematic diagram of the optical transmission device in the embodiment of the present application.

[0024] Figure 3 It shows Figure 1 a structural schematic diagram of the rear view angle of the optical transmission device in

[0025] Figure 4 It shows a structural schematic diagram of the heat dissipation module in the embodiment of the present application.

[0026] Figure 5 It shows a structural schematic diagram of the mutual positional relationship between the heat dissipation module and the first optical module in the embodiment of the present application. Detailed Embodiments

[0027] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0028] This application is about the design of optical transmission devices, especially multi-service optical transmission platform devices. Such optical transmission platform devices can insert multiple optical modules to implement various services. Optical modules can be classified into GBIC, SFP, SFP+, XFP, SFF, CFP, etc. according to their package types.

[0029] As Figure 1 shown, it shows a schematic structural view of the front end perspective of the optical transmission device 100 described in the embodiment.

[0030] In this embodiment, the optical transmission device 100 is a 1U device. A 1U device means that the width is 19 inches and the height is 1U (unit), and 1U = 1.75 inches = 1.75 * 25.4 mm = 44.45 mm.

[0031] In Figure 1 it, the optical transmission device 100 includes a stacked first optical module cage 101 and a second optical module cage 102. Both expose sockets at the front end of the optical transmission device 100. Among them, the upper socket is used to insert the first optical module, and the lower socket is used to insert the second optical module. The first optical module is used for communication on the service side, and the second optical module is used for communication on the customer side. In one embodiment, the first optical module can be, for example, a 200G CFP2 module, which can be paired with 2 100G QSFP28 modules as the second optical module, so that the communication on both the service side and the customer side can meet the 200G requirement.

[0032] Please also refer to Figure 2 shown, it shows a schematic exploded view of the optical transmission device 100.

[0033] In this embodiment, the optical transmission device 100 includes: an upper cover 103, a lower cover 104, a front panel 105 and rear plug-in accessories, so as to assemble into a chassis; among them, the rear plug-in accessories can include one or more groups of fan modules 106 and / or power modules 107, etc., that is, as Figure 3 shown.

[0034] In the illustration, a first optical module cage 101 provided on the upper layer and a plurality of second optical module cages 102 provided on the lower layer form a set of optical module cage units.

[0035] Specifically, in this embodiment, each optical module cage unit is composed of a 1×2 first optical module cage 101 and two second optical module cages 102. That is to say, each first optical module cage 101 can hold two first optical modules, and each second optical module cage 102 can hold one second optical module. Of course, the composition of the optical module cage unit in this embodiment is only one way. In other embodiments, the quantity ratio of the first optical module cage 101 and the second optical module cage 102 can be varied according to actual requirements and the size of the optical module and network capacity used, etc.

[0036] If it is necessary to meet the 200G communication requirements on both the service side and the customer side, the first optical module can have a network capacity of 200G, then the second optical module can have a network capacity of 100G. That is to say, each first optical module corresponds to two second optical modules. And in one optical module cage unit, each first optical module cage 101 corresponds to four second optical module cages 102.

[0037] Furthermore, in this embodiment, after setting four groups of optical module cage units, if the first optical modules and second optical modules with the above network capacities are fully inserted, the total optical transmission service volume of the 1U optical transmission device can reach 1600G.

[0038] Of course, the network capacities and quantities of the optical modules and the quantity of the optical module cages in the above embodiments are only examples and can be completely varied in actual situations. For example, by analogy with the above, if the device includes a first optical module cage 101 with a 1×N structure and M second optical module cages 102, where M and N are natural numbers and M is an integer multiple of N, then the network capacity of each first optical module is equal to the sum of the network capacities of M / N second optical modules with the same network capacity. In other embodiments, the network capacities of the second optical modules can be different from each other, and the network capacities of the first optical modules can also be different from each other, not limited to the above examples.

[0039] At the same time, although four groups of optical module cage units are shown in this embodiment, the number of groups can be completely varied according to requirements and is not limited thereto.

[0040] The optical transmission device 100 further includes a service circuit board 108. Each of the optical module cage units is fixedly arranged on the service circuit board 108, and the fixing method can be, for example, welding, plugging, or a combination of plugging and welding, etc.

[0041] The structures of the first optical module cage 101 and the second optical module cage 102 can be set such that the solder feet of each are staggered from each other and do not interfere. Optionally, the solder feet of the first optical module cage 101 and the second optical module cage 102 can be made by a crimping process and / or the thickness of the service circuit board 108 can be made to meet the preset requirements, so as to achieve the staggering of the solder feet from each other and non-interference.

[0042] In this way, the upper and lower spaces of the service circuit board 108 can be well utilized, that is, as Figure 2 shown, 4 groups of the optical module cage units can be placed in a 1U device with a width of 19 inches. The positions of the respective optical module cage units are set such that each of the first optical module cages 101 is located in the same upper layer and each of the second optical module cages 102 is located in the same lower layer; 8 groups of a combination of 1 first optical module and 2 second optical modules can be placed, which is the highest interface density of a 1U device. The high-density 1IU device is small in volume, convenient to install, easy to plan, and the high service capacity enables the operator to layout with ease.

[0043] In this case of high interface density, the existing heat sinks will not be able to meet the heat dissipation requirements. Therefore, as Figure 2 shown, the optical transmission device 100 of the present application can also provide a heat dissipation module 109 with an improved structure for conducting heat and dissipating heat from each of the first optical modules.

[0044] Specifically, as Figure 2 shown, the top of the first optical module cage 101 has a hollow-out for exposing each of the first optical modules. And please refer to Figure 4 shown, the heat dissipation module 109 contacts each of the first optical modules 110 in the first optical module cage 101 through this hollow-out to conduct heat and dissipate heat.

[0045] The heat dissipation module 109 includes: a plurality of heat conducting substrates 111, a plurality of heat conducting tubes 112, and one or more heat dissipating bodies 113.

[0046] The plurality of heat conducting substrates 111 are for respectively contacting the first optical modules 110 in each of the first optical module cages 101. In this embodiment, the first optical module cage 101 has a 1×2 structure, and two first optical modules 110 can be provided. Each heat conducting substrate 111 corresponds to one first optical module cage 101, that is, it contacts two first optical modules 110 in one first optical module cage 101 simultaneously to conduct heat.

[0047] Each of the heat pipes 112 is fixedly connected to a heat conduction substrate 111 and is also fixedly connected to the heat sink 113. The fixed connection method can be welding or the like. The heat conduction substrate 111, the heat pipes 112, and the heat sink 113 can be made of metal materials with good thermal conductivity, such as copper, aluminum, etc., or can also be made of ceramic materials.

[0048] In this embodiment, there are two heat sinks 113. The number is just one implementation method. In other embodiments, there can be only one heat sink 113 or more than two heat sinks 113. Preferably, the surface of the heat sink 113 can also be a shovel tooth structure to increase the heat dissipation area. The heat sink 113 can be made from a metal block (such as copper, aluminum, etc.) through a shovel tooth process. The specific material, density, and height of the shovel tooth metal block can be obtained through analysis software.

[0049] The heat sink 113 can be located on the air duct of the aforementioned rear fan module 106. In this embodiment, the heat dissipation module 109 is located in front of the fan module 106.

[0050] As Figure 2 and Figure 3 shown, in this embodiment, the optical transmission device 100 has air intake at the front end, passes through the heat dissipation module 109, and is discharged from the rear end of the optical transmission device 100 through the fan module 106 for heat dissipation.

[0051] To ensure sufficient contact between each first optical module 110 and the heat conduction substrate 111, an interference fit is preferably adopted between the two. As can be referred to Figure 5 shown, Figure 5 shows a cross-section of the interference fit portion 116 between the first optical module 110 installed in the first optical module cage 101 and the heat conduction substrate 111 of the heat dissipation module 109.

[0052] Additionally preferably, as Figure 4 shown, screws 115 sleeved with springs 114 can be used to position and connect each heat conduction substrate 111 to each other, enabling elastic plugging and unplugging for the interference design.

[0053] To prevent the gravity of the heat conduction substrate 111 that needs to be overcome during plugging and unplugging from becoming too large due to the excessive size of the heat conduction substrate 111, each heat conduction substrate 11 is divided into 4 groups corresponding to each 1×2 first optical module cage 101, and the structure of each group is the same, which is convenient for processing and control.

[0054] The above heat dissipation module of the present application can solve the heat dissipation problem of the high-power first optical module under the condition of high interface density in this embodiment, and maximize the compatibility of the device with the first optical module.

[0055] In the above embodiments, since each 1×2 first optical module cage can accommodate 2 first optical modules, but there is only one heat-conducting substrate corresponding to them, there will be an adverse phenomenon when using the first optical module cage: when one of the first optical modules is inserted into one space in the first optical module cage and the other space remains idle, due to the interference fit, the heat-conducting substrate will tilt towards the idle space side, resulting in poor contact between the inserted first optical module and the heat-conducting substrate, thus greatly reducing the heat dissipation efficiency. The solution can be to equip another model with a suitable size and insert it into the idle space to replace the first optical module to achieve the height balance on both sides of the heat-conducting substrate.

[0056] However, in actual applications, customers often lack experience, and the solid model has little value and is easily lost or forgotten to be inserted.

[0057] Therefore, the present application is improved. A phase change heat-conducting material is provided at the part of the heat-conducting substrate for contacting the first optical module. Because the phase change heat-conducting material undergoes a phase change at a high temperature (45 degrees Celsius) to form a highly plastic paste, thus filling the gap caused by the tilt of the heat-conducting substrate; preferably, the phase change heat-conducting material can be attached to an aluminum foil to form a phase change heat-conducting aluminum foil and be disposed between the heat-conducting substrate and the first optical module. On the one hand, it protects the risk of scratches caused by the direct friction between the optical module and the metal heat-conducting substrate, and also avoids the adverse situation of the optical module being attached with heat-conducting paste during plugging and unplugging.

[0058] Optionally, the phase change heat-conducting material can be made of synthetic paraffin as the base material and filled with high-performance heat-conducting particles.

[0059] After the phase change heat-conducting material is pasted on the corresponding heat dissipation part, the heat-conducting sheet will undergo a phase change at a temperature higher than 45 degrees Celsius and become a paste-like object (liquid state) similar to heat-conducting paste, which has extremely high plasticity and can fill extremely small gaps. Using it here can effectively improve the heat dissipation efficiency. Under the condition of efficient heat dissipation, the optical transmission device can integrate all types of first optical modules. Taking the CFP2 module as an example, the highest power among all types is 18W, and the improved heat dissipation module of the present application can well solve this problem.

[0060] Such as Figure 2 and Figure 3 shown, there are multiple groups of the fan modules 106, and preferably they are hot-swappable and are arranged at the rear end of the optical transmission device 100; and since the power module 107 is also placed at the rear in this embodiment, thus, enough space is left in the front for distributing service interfaces, and it is also convenient for replacement, maintenance, and upgrade.

[0061] Preferably, the power module 107 also supports hot swapping and can be as Figure 3There are two groups as shown, and the two groups can be DC power supplies or AC power supplies, thereby supporting dual DC power supply backup, dual AC power supply backup, and backup between DC power supplies and / or AC power supplies.

[0062] As Figure 2 shown, in this embodiment, the optical transmission device 100 further includes a power management circuit board 117 and a configuration circuit board 118.

[0063] In order to further utilize the space inside the device to meet the aforementioned requirement of increasing the interface density, the power management circuit board 117 can preferably be disposed below the service circuit board 108 to utilize the space below it, and is electrically connected to the service circuit board 108 and the power module 107, thereby supplying power to the service circuit board 108.

[0064] In the embodiment of the present application, in order to increase the interface density, the configuration circuit board 118 is separately provided and electrically connected to the service circuit board 108 through jumpers.

[0065] In summary, the optical transmission device of the present application includes: at least one optical module cage unit fixedly disposed on a service circuit board; the optical module cage unit includes: one or more first optical module cages disposed on the upper layer and one or more second optical module cages disposed on the lower layer; wherein, each of the first optical module cages is used to place one or more first optical modules, and each of the second optical module cages is used to place a second optical module; the first optical module is used for optical communication connection on the service side, and the second optical module is used for optical communication connection on the customer side; the solder feet of the first optical module cage and the second optical module cage are staggered from each other and do not interfere; by stacking the optical module cages on the service side and the sending side without interfering with each other, more free space inside the device can be provided to configure more optical modules, thereby increasing the interface density and facilitating the heat dissipation of the first optical module on the service side with higher power consumption.

[0066] The above embodiments are only illustrative of the principles and effects of the present application, and are not used to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present application should still be covered by the claims of the present application.

Claims

1. An optical transmission device, characterized in that, it includes: At least one optical module cage unit, fixedly arranged on the service circuit board; The optical module cage unit includes: one or more first optical module cages arranged on the upper layer and one or more second optical module cages arranged on the lower layer; wherein, each of the first optical module cages is used to place one or more first optical modules, and each of the second optical module cages is used to place a second optical module; the first optical module is used for optical communication connection on the service side, and the second optical module is used for optical communication connection on the customer side; the solder feet of the first optical module cage and the second optical module cage are staggered from each other and do not interfere; the top of the first optical module cage has a hollow to expose each first optical module; A heat dissipation module, used to contact with each of the first optical modules arranged in the first optical module cage from the hollow parts to dissipate heat; wherein, the heat dissipation module includes: a plurality of heat conduction substrates, for respectively contacting with the first optical modules in each first optical module cage and having an interference fit with each first optical module, a phase change heat conduction material is provided at the part of the heat conduction substrate for contacting with the first optical module, the phase change heat conduction material is attached to a metal foil and is installed together at the part of the heat conduction substrate for contacting with the first optical module, and fills the gap caused by the inclination of the heat conduction substrate when undergoing a phase change due to high temperature; a plurality of heat conduction tubes, fixedly connecting the heat conduction substrates; one or more heat dissipation bodies, fixedly connecting each of the heat conduction tubes; One or more groups of fan modules capable of hot plugging, arranged at the rear end of the optical transmission device.

2. The optical transmission device according to claim 1, characterized in that, The solder feet are made by a crimping process and / or the thickness of the service circuit board meets the preset requirements.

3. The optical transmission device according to claim 1, characterized in that, There are multiple optical module cage units, and their positions are set such that: all the first optical module cages are located on the same upper layer, and all the second optical module cages are located on the same lower layer.

4. The optical transmission device according to claim 1, characterized in that, Each optical module cage unit includes: a first optical module cage with a 1×N structure and M second optical module cages, where M is an integer multiple of N; the network capacity of each first optical module is equal to the sum of the network capacities of M / N second optical modules with the same network capacity.

5. The optical transmission device according to claim 1, characterized in that, The front ends of the first optical module cage and the second optical module cage are provided with a plurality of sockets for inserting optical modules, and each of the sockets is exposed at the front end of the optical transmission device.

6. The optical transmission device according to claim 1, characterized in that, The heat conduction substrates are positioned and connected by spring screws.

7. The optical transmission device according to claim 1, characterized in that, it includes: A power management circuit board, arranged below the service circuit board and electrically connected to the service circuit board and the power module.

8. The optical transmission device according to claim 1 or 7, characterized in that, it includes: One or more power modules capable of hot plugging, arranged at the rear end of the optical transmission device to supply power to the optical transmission device.

9. The optical transmission device according to claim 1, Characterized in that, Comprising: A configured circuit board, electrically connected to the service circuit board.

10. The optical transmission device according to claim 1, Characterized in that, The optical transmission device is a 1U device.

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