Display device

Abstract

A display device is disclosed. The display device includes a display panel and an input sensor, the input sensor being disposed on the display panel and including a signal line group arranged in a wiring region and a first sensing electrode and a second sensing electrode disposed in a sensing region, each of the first sensing electrode and the second sensing electrode having one end electrically connected to a corresponding signal line, wherein the second sensing electrode has a length greater than that of the first sensing electrode, the signal line group including a first signal line group and a second signal line group electrically connected to the first sensing electrode and the second sensing electrode, respectively, each of the first sensing electrodes including a first bridge pattern, the first bridge pattern overlapping the second sensing electrode and disposed on a different layer from the second sensing electrode, and one of the first sensing electrode and the second sensing electrode being configured to receive a sinusoidal signal.

Description

Technical Field

[0001] Exemplary embodiments of the present invention generally relate to a display device, and more particularly, to a display device including an input sensor. Background Art

[0002] Various display devices are being developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles. Input devices for display devices typically include keyboards, mice, and the like. In addition, display devices may include touch panels as input devices.

[0003] The above information disclosed in this Background section is only for understanding the background of the inventive concept and therefore it may contain information that does not constitute prior art. Summary of the Invention

[0004] A display device constructed according to an exemplary embodiment of the invention includes an input sensor having improved sensitivity.

[0005] Additional features of the inventive concepts will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concepts.

[0006] A display device according to an exemplary embodiment includes a display panel and an input sensor, the input sensor being disposed on the display panel and including a sensing area and a wiring area located outside the sensing area, the input sensor including a signal line group arranged in the wiring area and a first sensing electrode and a second sensing electrode disposed in the sensing area, each of the first sensing electrode and the second sensing electrode having one end electrically connected to a corresponding signal line in the signal line group, wherein the second sensing electrode has a length greater than that of the first sensing electrode, the signal line group including a first signal line group electrically connected to the first sensing electrode and a second signal line group electrically connected to the second sensing electrode, each of the first sensing electrodes including a first bridge pattern, the first bridge pattern overlapping the second sensing electrode and disposed on a different layer from the second sensing electrode, and one of the first sensing electrode and the second sensing electrode being configured to receive a sinusoidal signal.

[0007] The other of the first sensing electrode and the second sensing electrode may be configured to provide a sensing signal corresponding to the sinusoidal signal to the sensing circuit.

[0008] Each of the second sensing electrodes may have a unitary shape.

[0009] The display panel may include a display area corresponding to the sensing area and a non-display area corresponding to the wiring area, the display area may include a light emitting area and a non-light emitting area, and each of the first sensing electrodes may have an opening corresponding to the light emitting area.

[0010] At least a portion of a corresponding signal line in the signal line group may be disposed on the same layer as the second sensing electrode.

[0011] The input sensor may further include an insulating layer disposed between the first bridge pattern and the second sensing electrode and covering the sensing area.

[0012] The first signal line group may include a first side signal line and a second side signal line, the first side signal line is electrically connected to the odd-numbered sensing electrodes among the first sensing electrodes, the second side signal line is electrically connected to the even-numbered sensing electrodes among the first sensing electrodes, and the first side signal line and the second side signal line may be separated from each other along an extension direction of the first sensing electrode, and the sensing area is located between the first side signal line and the second side signal line.

[0013] The input sensor may further include: first dummy patterns respectively arranged in the first sensing electrodes; and second dummy patterns respectively arranged in the second sensing electrodes.

[0014] The input sensor may further include a second bridge pattern connecting the first dummy patterns.

[0015] At least one of the first dummy patterns may include a central portion and extension portions arranged on both sides of the central portion along an extension direction of the first sensing electrode, and each of the extension portions may be connected to a corresponding second bridge pattern among the second bridge patterns.

[0016] The first bridge pattern and the second bridge pattern may be provided on the same layer.

[0017] The second bridge patterns may be arranged to correspond to the first bridge patterns, and the second bridge patterns may have a length greater than a length of a corresponding first bridge pattern among the first bridge patterns.

[0018] The input sensor may further include a dummy signal line connected to outermost first dummy patterns among the first dummy patterns in an extending direction of the first sensing electrode.

[0019] The input sensor may further include a third bridge pattern crossing and insulated from the dummy signal line, and the third bridge pattern may connect the first sensing electrode and the signal line of the first signal line group.

[0020] The display device may further include a notch area that is recessed inward in a plan view.

[0021] The display panel may include a base layer, a circuit element layer arranged on the base layer, a display element layer arranged on the circuit element layer, and an upper insulating layer arranged on the display element layer. The display device may also include a signal transmission area, in which at least a portion of the base layer, the circuit element layer, the display element layer and the upper insulating layer is removed.

[0022] According to another exemplary embodiment, a display device includes a display panel and an input sensor disposed on the display panel, the input sensor including a first sensing electrode and a second sensing electrode, the second sensing electrode intersecting the first sensing electrode and having a length greater than that of the first sensing electrode, wherein the first sensing electrode includes a sensor portion disposed on the same layer as the second sensing electrode and a bridge pattern disposed on a different layer from the second sensing electrode, at least one of the bridge patterns overlaps the second sensing electrode, and one of the first sensing electrode and the second sensing electrode is configured to receive a sinusoidal signal through one end of the first sensing electrode and the second sensing electrode.

[0023] According to yet another exemplary embodiment, a display device includes a display panel and an input sensor disposed on the display panel, the input sensor including an insulating layer, a first sensing electrode, and a second sensing electrode, the second sensing electrode intersecting the first sensing electrode, having a length greater than that of the first sensing electrode, and having an integral shape, wherein the first sensing electrode includes a first portion and a second portion, the first portion being disposed on the insulating layer, the second portion being disposed below the insulating layer and connected to the first portion through a contact hole penetrating the insulating layer, and one of the first sensing electrode and the second sensing electrode being configured to receive a sinusoidal signal through one end of the first sensing electrode and the second sensing electrode.

[0024] The second sensing electrode may be disposed on the insulating layer.

[0025] A first end of the second sensing electrode may be connected to the signal line, and a second end of the second sensing electrode is electrically isolated.

[0026] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept. The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification.

[0028] Figure 1 is a perspective view of a display device according to an exemplary embodiment of the inventive concept.

[0029] Figure 2A、 Figure 2B 、 Figure 2C and Figure 2D is a cross-sectional view of a display device according to an exemplary embodiment of the inventive concept.

[0030] Figure 3A and Figure 3B is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept.

[0031] Figure 4 is a plan view of a display panel according to an exemplary embodiment of the inventive concept.

[0032] Figure 5A According to an exemplary embodiment of the inventive concept Figure 3A An enlarged cross-sectional view of a display panel.

[0033] Figure 5B is an enlarged cross-sectional view of an upper insulating layer according to an exemplary embodiment of the inventive concept.

[0034] Figure 6A is a cross-sectional view of an input sensing layer according to an exemplary embodiment of the inventive concept.

[0035] Figure 6B is a plan view of an input sensing layer according to an exemplary embodiment of the inventive concept.

[0036] Figure 6C and Figure 6D is a partial cross-sectional view of an input sensing layer according to an exemplary embodiment of the inventive concept.

[0037] Figure 6E yes Figure 6B An enlarged plan view of area AA.

[0038] Figure 7A is a plan view of a sensing unit according to an exemplary embodiment of the inventive concept.

[0039] Figure 7B is an enlarged plan view of a crossing region of a sensing unit according to an exemplary embodiment of the inventive concept.

[0040] Figure 7C is an equivalent circuit diagram of an input sensor according to an exemplary embodiment of the inventive concept.

[0041] Figure 7D is a graph illustrating a waveform of a driving signal according to an exemplary embodiment of the inventive concept.

[0042] Figure 7E is a graph showing 1 dB bandwidth characteristics due to the structure of the input sensor.

[0043] Figure 8Ais a plan view of an input sensor according to an exemplary embodiment of the inventive concept.

[0044] Figure 8B is a partial plan view of an input sensor according to an exemplary embodiment of the inventive concept.

[0045] Figure 8C is an enlarged plan view of a crossing area of an input sensor according to an exemplary embodiment of the inventive concept.

[0046] Figure 8D is a plan view of an input sensor according to an exemplary embodiment of the inventive concept.

[0047] Figure 9A is a plan view of an input sensor according to an exemplary embodiment of the inventive concept.

[0048] Figure 9B is a partial cross-sectional view of an input sensor according to an exemplary embodiment of the inventive concept.

[0049] Figure 9C is an equivalent circuit diagram of an input sensor according to an exemplary embodiment of the inventive concept.

[0050] Figure 10A is a perspective view of a display module according to an exemplary embodiment of the inventive concept.

[0051] Figure 10B is a plan view of an input sensing layer according to an exemplary embodiment of the inventive concept.

[0052] Figure 11A is a perspective view of a display module according to an exemplary embodiment of the inventive concept.

[0053] Figure 11B is a plan view of an input sensing layer according to an exemplary embodiment of the inventive concept. DETAILED DESCRIPTION

[0054] In the following description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of the various exemplary embodiments or implementations of the invention. As used herein, "embodiment" and "implementation" are interchangeable words, and "embodiment" and "implementation" are non-limiting examples of devices or methods using one or more inventive concepts disclosed herein. However, it is apparent that the various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form to avoid making the various exemplary embodiments unnecessarily vague. In addition, the various exemplary embodiments can be different, but do not have to be exclusive. For example, without departing from the inventive concept, the specific shape, construction and characteristics of the exemplary embodiment can be used or implemented in another exemplary embodiment.

[0055] Unless otherwise specified, the exemplary embodiments shown will be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of the various embodiments may be further combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0056] The use of cross hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Thus, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for the specific materials, material properties, dimensions, proportions, commonalities between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative sizes of the elements may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, a specific process sequence can be performed differently from the order described. For example, two successively described processes can be performed substantially simultaneously or in an order opposite to the order described. In addition, the same reference numerals represent the same elements.

[0057] When an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element or layer may be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, and / or a fluid connection with or without the presence of intervening elements. In addition, the DR1 axis, the DR2 axis, and the DR3 axis are not limited to the three axes of a rectangular coordinate system (such as the x-axis, the y-axis, and the z-axis), but may be interpreted in a broader sense. For example, the DR1 axis, the DR2 axis, and the DR3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ for example. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0058] Although the terms "first," "second," etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be referred to as a second element without departing from the disclosed teachings.

[0059] For descriptive purposes, spatially relative terms such as "under," "beneath," "under," "down," "over," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc., may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the drawings is turned over, an element described as "under" or "beneath" other elements or features would subsequently be positioned "over" the other elements or features. Thus, the exemplary term "under" can include both above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0060] The terms used herein are for the purpose of describing specific embodiments, rather than being intended to limit. As used herein, unless the context clearly indicates otherwise, the singular forms "one", "a kind of" and "the (said)" are also intended to include plural forms. In addition, when the terms "comprise" and variations thereof and / or "include" and variations thereof are used in this specification, it is indicated that there are stated features, integral bodies, steps, operations, elements, components and / or their groups, but it is not excluded that there are or add one or more other features, integral bodies, steps, operations, elements, components and / or their groups. It is also noted that, as used herein, the terms "substantially", "approximately" and other similar terms are used as approximate terms rather than as degree terms, and are thus used to explain the inherent deviations of measured values, calculated values and / or provided values that will be recognized by those of ordinary skill in the art.

[0061] Various exemplary embodiments are described herein with reference to cross-sectional and / or exploded views that are schematic representations of idealized exemplary embodiments and / or intermediate structures. As such, variations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the specific illustrated shapes of regions, but rather are to include deviations in shape due to, for example, manufacturing. In this manner, the regions illustrated in the accompanying drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of regions of a device, and as such are not necessarily intended to be limiting.

[0062] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Unless expressly defined as such herein, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense.

[0063] Figure 1 is a perspective view of a display device DD according to an exemplary embodiment of the inventive concept.

[0064] like Figure 1 As shown in FIG, the display device DD can display an image IM through a display surface DD-IS. The display surface DD-IS is substantially parallel to a plane defined by a first direction axis DR1 and a second direction axis DR2. A normal direction of the display surface DD-IS (e.g., a thickness direction of the display device DD) is indicated by a third direction axis DR3.

[0065] The front surface (or top surface) and the rear surface (or bottom surface) of each component or unit described below are defined by the third directional axis DR3. However, the first directional axis DR1 to the third directional axis DR3 are merely exemplary and may be changed in some exemplary embodiments. Hereinafter, the first direction to the third direction indicated by the first directional axis DR1 to the third directional axis DR3 are represented by the same reference numerals.

[0066] In the exemplary embodiment, the display device DD is shown as having a flat display surface DD-IS, but the inventive concept is not limited thereto. For example, the display device DD may include a curved display surface or a three-dimensional display surface. The three-dimensional display surface may include multiple display areas indicating different directions and may include, for example, a polygonal columnar display surface.

[0067] The display device DD may be a rigid display device. However, the inventive concept is not limited thereto, and in some exemplary embodiments, the display device DD may be a flexible display device DD. The flexible display device DD may include a partially bent bendable display device or a foldable display device.

[0068] For example, the display device DD according to the illustrated exemplary embodiment is shown as being applicable to a cellular phone. Although not shown, the electronic module, camera module, power module, etc. mounted on the mainboard may be arranged together with the display device DD in a bracket / housing, etc., to provide the cellular phone. In addition, in some exemplary embodiments, the display device DD may be applied to large electronic devices (such as televisions, monitors, etc.) or small or medium-sized electronic devices (such as tablet computers, car navigation systems, game consoles, smart watches, etc.).

[0069] like Figure 1 As shown in FIG, the display surface DD-IS includes an image area DD-DA in which an image IM is displayed and a frame area DD-NDA adjacent to the image area DD-DA. No image is displayed in the frame area DD-NDA. Figure 1 An icon image is shown as an example of the image IM.

[0070] like Figure 1 As shown in , the image area DD-DA may be substantially rectangular. As used herein, the term "substantially rectangular" refers to a geometric rectangular shape as well as a rectangular shape having curved boundaries in its vertex regions (or corner regions).

[0071] The frame area DD-NDA may surround the image area DD-DA. However, the inventive concept is not limited thereto, and the shapes of the image area DD-DA and the frame area DD-NDA may be designed relatively.

[0072] Figures 2A to 2Dis a cross-sectional view of a display device DD according to an exemplary embodiment of the inventive concept. Figures 2A to 2D A cross section defined by the second direction axis DR2 and the third direction axis DR3 is shown. Figures 2A to 2D A cross section showing a stacked structure of functional members included in the display device DD according to an exemplary embodiment is exemplarily shown.

[0073] A display device DD according to an exemplary embodiment of the inventive concept may include a display panel, an input sensor, an anti-reflector, and a window. At least some of the display panel, the input sensor, the anti-reflector, and the window may be formed through a continuous process or may be bonded to each other using an adhesive member. Figures 2A to 2D An optically clear adhesive (OCA) is exemplarily shown as a bonding member. The bonding member may include a typical adhesive or a removable adhesive. In exemplary embodiments of the inventive concept, the anti-reflector and the window may be replaced with other elements or may be omitted.

[0074] against Figures 2A to 2D Among the input sensor, anti-reflector, and window, any element formed through a continuous process with another element is called a "layer." Among the input sensor, anti-reflector, and window, any element bonded to another element by an adhesive member is called a "panel." A panel includes a base layer (e.g., a synthetic resin film, a composite material film, a glass substrate, etc.) that provides a base surface, but a "layer" may not be provided with a base layer. Specifically, a unit called a "layer" is arranged on a base surface provided by another unit.

[0075] The input sensor, anti-reflector, and window may be referred to as an input sensing panel ISP, an anti-reflection panel RPP, and a window panel WP, respectively, or may be referred to as an input sensing layer ISL, an anti-reflection layer RPL, and a window layer WL, respectively.

[0076] like Figure 2A As shown in FIG, a display device DD may include a display panel DP, an input sensing layer ISL, an anti-reflection panel RPP, and a window panel WP. The input sensing layer ISL may be disposed directly on the display panel DP. As used herein, the term "element B disposed directly on element A" may mean that no additional adhesive layer or adhesive member is disposed between element A and element B. For example, after element A is formed, element B may be formed on the substrate surface provided by element A through a continuous process.

[0077] The display panel DP and the input sensing layer ISL disposed directly on the display panel DP may be defined as a display module DM. An optically clear adhesive OCA is disposed between the display module DM and the anti-reflection panel RPP and between the anti-reflection panel RPP and the window panel WP.

[0078] The display panel DP generates an image, and the input sensing layer ISL obtains coordinate information of an external input (e.g., a touch event). The display module DM according to an exemplary embodiment of the inventive concept may further include a protective member disposed under the display panel DP. The protective member and the display panel DP may be bonded by an adhesive member. Figures 2B to 2D The display device DD shown in FIG may also include a protective member.

[0079] The display panel DP according to an exemplary embodiment of the inventive concept may be a light-emitting display panel, but the inventive concept is not limited thereto. For example, the display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The emission layer of the organic light-emitting display panel may include an organic light-emitting material. The emission layer of the quantum dot light-emitting display panel may include quantum dots, quantum rods, etc. Hereinafter, the display panel DP will be described as an organic light-emitting display panel.

[0080] The anti-reflection panel RPP reduces the reflectivity of external light incident on the window panel WP. The anti-reflection panel RPP according to an exemplary embodiment of the inventive concept may include a phase retarder and a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined form. The phase retarder and the polarizer may also include a protective film. The phase retarder and the polarizer or the phase retarder and the polarizer including their protective films may be used as a base layer of the anti-reflection panel RPP.

[0081] An anti-reflection panel RPP according to an exemplary embodiment of the inventive concept may include color filters. The color filters may have a predetermined arrangement. The arrangement of the color filters may be determined in consideration of the color of light emitted from the pixels included in the display panel DP. The anti-reflection panel RPP may further include a black matrix adjacent to the color filters.

[0082] An anti-reflection panel (RPP) according to an exemplary embodiment of the inventive concept may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer may destructively interfere with each other, thereby reducing the reflectivity of external light.

[0083] A window panel WP according to an exemplary embodiment of the inventive concept includes a base layer WP-BS and a light-shielding pattern WP-BZ. The base layer WP-BS may include a glass substrate and / or a synthetic resin film. The base layer WP-BS is not limited to a single layer. For example, the base layer WP-BS may include two or more films bonded together by an adhesive member.

[0084] The light-shielding pattern WP-BZ partially overlaps the base layer WP-BS. The light-shielding pattern WP-BZ may be provided on the rear surface of the base layer WP-BS and may substantially define a bezel area DD-NDA of the display device DD. The area not provided with the light-shielding pattern WP-BZ may define an image area DD-DA of the display device DD. In the window panel WP, the area provided with the light-shielding pattern WP-BZ may be defined as the light-shielding area of the window panel WP, while the area not provided with the light-shielding pattern WP-BZ may be defined as the transmissive area of the window panel WP.

[0085] The light-shielding pattern WP-BZ may have a multi-layer structure. The multi-layer structure may include a coloring layer and a black light-shielding layer. The coloring layer and the black light-shielding layer may be formed by a deposition process, a printing process, or a coating process. The window panel WP may further include a functional coating layer provided on the front surface of the base layer WP-BS. The functional coating layer may include an anti-fingerprint layer, an anti-reflection layer, a hard coating layer, etc. Figures 2B to 2D , the window panel WP and the window layer WL are simply shown without distinguishing the base layer WP-BS and the light shielding pattern WP-BZ.

[0086] like Figure 2B and Figure 2C As shown in , the display device DD may include a display panel DP, an input sensing panel ISP, an anti-reflection panel RPP, and a window panel WP. In some exemplary embodiments, the stacking order of the input sensing panel ISP and the anti-reflection panel RPP may be changed.

[0087] like Figure 2D As shown in FIG, the display device DD may include a display panel DP, an input sensing layer ISL, an anti-reflection layer RPL, and a window layer WL. Figure 2A Compared to the display device DD shown in FIG. 1 , the display device DD according to the exemplary embodiment shown in FIG. 1 is not provided with an adhesive member, and the input sensing layer ISL, the anti-reflection layer RPL, and the window layer WL may be formed on the base surface provided by the display panel DP through a continuous process. In some exemplary embodiments, the stacking order of the input sensing layer ISL and the anti-reflection layer RPL may be changed.

[0088] Figure 3A and Figure 3B is a cross-sectional view of a display panel DP according to an exemplary embodiment of the inventive concept.

[0089] like Figure 3A As shown in FIG, the display panel DP according to the exemplary embodiment includes a base layer BL and a circuit element layer DP-CL, a display element layer DP-OLED, and an upper insulating layer TFL disposed on the base layer BL. Figure 1DD-DA and the frame area DD-NDA shown in FIG. 1 correspond to the display area DP-DA and the non-display area DP-NDA. As used herein, when an area is referred to as corresponding to another area, the areas overlap each other but do not necessarily have the same area / shape.

[0090] The base layer BL may include at least one plastic film, a plastic substrate, a glass substrate, a metal substrate, an organic / inorganic composite material substrate, or the like.

[0091] The circuit element layer DP-CL includes circuit elements and at least one insulating layer. The insulating layer may include at least one inorganic film and at least one organic film. The circuit elements include signal lines, pixel driving circuits, etc., which will be described in more detail below.

[0092] The display element layer DP-OLED may include at least one organic light emitting diode. The display element layer DP-OLED may further include an organic film, such as a pixel defining film.

[0093] The upper insulating layer TFL includes a plurality of thin films. Some of the thin films are configured to improve optical efficiency, and other thin films are configured to protect the organic light emitting diode. The upper insulating layer TFL will be described in more detail below.

[0094] like Figure 3B As shown in , a display panel DP according to an exemplary embodiment includes a base layer BL, a circuit element layer DP-CL arranged on the base layer BL, a display element layer DP-OLED and an encapsulation substrate ES, and a sealant SM for bonding the base layer BL (e.g., the circuit element layer DP-CL) and the encapsulation substrate ES. The encapsulation substrate ES may be separated from the display element layer DP-OLED, and a predetermined gap GP may be provided between the encapsulation substrate ES and the display element layer DP-OLED. The base layer BL and the encapsulation substrate ES may include a plastic substrate, a glass substrate, a metal substrate, an organic / inorganic composite material substrate, or the like. The sealant SM may include an organic adhesive member, glass material, or the like. The sealant SM may be in contact with the circuit element layer DP-CL, however, the inventive concept is not limited thereto. For example, a portion of the circuit element layer DP-CL may be removed, and the sealant SM may be in contact with the base layer BL.

[0095] Figure 4 is a plan view of a display panel DP according to an exemplary embodiment of the inventive concept. Figure 5A yes Figure 3A An enlarged cross-sectional view of the display panel DP. Figure 5B is an enlarged cross-sectional view of an upper insulating layer TFL according to an exemplary embodiment of the inventive concept.

[0096] like Figure 4As shown in the figure, the display panel DP may include a driving circuit GDC, a plurality of signal lines SGL (hereinafter referred to as "signal lines"), a plurality of signal pads (or pads) DP-PD (hereinafter referred to as "signal pads") and a plurality of pixels PX (hereinafter referred to as "pixels").

[0097] The display area DP-DA may be defined as an area in which pixels PX are arranged. Each pixel PX may include an organic light emitting diode and a pixel driving circuit connected to the organic light emitting diode. The driving circuit GDC, the signal line SGL, the signal pad DP-PD, and the pixel driving circuit may be included in Figure 3A and Figure 3B The circuit element layer DP-CL is shown.

[0098] The drive circuit GDC may include a scan drive circuit. The scan drive circuit generates a plurality of scan signals (hereinafter referred to as "scan signals") and sequentially outputs the scan signals to a plurality of scan lines GL (hereinafter referred to as "scan lines"), which will be described in more detail later. The scan drive circuit may also output additional control signals to the drive circuit of the pixel PX.

[0099] The scan driving circuit may include a plurality of thin film transistors, which may be formed by substantially the same process as that used to form the driving circuit of the pixel PX (eg, a low temperature polysilicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process).

[0100] The signal lines SGL include scan lines GL, data lines DL, power lines PL, and control signal lines CSL. The scan lines GL are connected to corresponding pixels PX, and the data lines DL are connected to corresponding pixels PX. The power lines PL are connected to the pixels PX. The control signal lines CSL can provide control signals to the scan drive circuit.

[0101] The signal line SGL overlaps the display area DP-DA and the non-display area DP-NDA. The signal line SGL may include a pad unit and a line unit. The line unit overlaps the display area DP-DA and the non-display area DP-NDA. The pad unit is disposed at the end of the line unit. The pad unit is disposed in the non-display area DP-NDA and overlaps corresponding signal pads among the signal pads DP-PD. The portion of the non-display area DP-NDA in which the signal pads DP-PD are disposed may be defined as a pad area DP-PA. The circuit substrate may be connected to the pad area DP-PA.

[0102] The line unit connected to the pixel PX may form a larger portion of the signal line SGL. The line unit is connected to the transistors T1 and T2 of the pixel PX (see FIG. Figure 5AThe line unit may have a single-layer structure or a multi-layer structure and may be integral or have at least two parts. The at least two parts may be arranged on different layers and may be connected to each other via a contact hole penetrating an insulating layer provided between the at least two parts.

[0103] Figure 5A This is a partial cross-sectional view of the display panel DP, corresponding to transistors T1 and T2 and the organic light-emitting diode (OLED). The circuit element layer DP-CL, disposed on the base layer BL, includes circuit elements and at least one insulating layer. The circuit elements include signal lines, pixel driver circuits, and the like. The circuit element layer DP-CL can be formed by processes such as coating and deposition to form insulating, semiconductor, and conductive layers, and by patterning these layers using photolithography.

[0104] The circuit element layer DP-CL according to an exemplary embodiment may include a buffer film BFL, a first inorganic film 10, a second inorganic film 20, and an organic film 30. The buffer film BFL may include a plurality of stacked inorganic films. Figure 5A The arrangement of the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, the first control electrode GE1, the second control electrode GE2, the first input electrode DE1, the first output electrode SE1, the second input electrode DE2, and the second output electrode SE2, which form the switching transistor T1 and the driving transistor T2, is exemplarily shown. The first through hole CH1, the second through hole CH2, the third through hole CH3, and the fourth through hole CH4 are also exemplarily shown.

[0105] The display element layer DP-OLED may include an organic light emitting diode OLED. The display element layer DP-OLED may include a pixel defining layer PDL. For example, the pixel defining layer PDL may be an organic layer.

[0106] The first electrode AE is disposed on the organic film 30. The first electrode AE is connected to the second output electrode SE2 via a fifth through hole CH5 penetrating the organic film 30. An opening OP is defined in the pixel-defining film PDL. The opening OP of the pixel-defining film PDL exposes at least a portion of the first electrode AE. The opening OP of the pixel-defining film PDL is referred to as an "emission opening" to distinguish it from other openings.

[0107] like Figure 5A As shown in FIG, the display area DP-DA may include a light-emitting area PXA and a non-light-emitting area NPXA adjacent to the light-emitting area PXA. The non-light-emitting area NPXA may surround the light-emitting area PXA. In the illustrated exemplary embodiment of the inventive concept, the light-emitting area PXA is defined as a portion corresponding to the first electrode AE exposed by the light-emitting opening OP.

[0108] The hole control layer HCL may be commonly disposed in the light-emitting area PXA and the non-light-emitting area NPXA. The hole control layer HCL may include a hole transport layer and may also include a hole injection layer. The emission layer EML is disposed on the hole control layer HCL. The emission layer EML may be disposed in a region corresponding to the light-emitting opening OP. More specifically, the emission layer EML may be formed separately in each pixel PX. The emission layer EML may include an organic material and / or an inorganic material. The emission layer EML may generate light of a predetermined color.

[0109] The electron control layer (ECL) is disposed on the emission layer (EML). The electron control layer (ECL) may include an electron transport layer and may also include an electron injection layer. The hole control layer (HCL) and the electron control layer (ECL) may be formed together in multiple pixels (PX) using an open mask. The second electrode (CE) is disposed on the electron control layer (ECL). The second electrode (CE) is integrally formed and commonly disposed in multiple pixels (PX).

[0110] like Figure 5A and Figure 5B As shown in FIG, an upper insulating layer TFL is disposed on the second electrode CE. The upper insulating layer TFL may include a plurality of thin films. The upper insulating layer TFL according to an exemplary embodiment may include a cover layer CPL and a thin film encapsulation layer TFE. The thin film encapsulation layer TFE may include a first inorganic layer IOL1, an organic layer OL, and a second inorganic layer IOL2.

[0111] The cover layer CPL is disposed on and contacts the second electrode CE. The cover layer CPL may include an organic material. The first inorganic layer IOL1 is disposed on and contacts the cover layer CPL. The organic layer OL is disposed on and contacts the first inorganic layer IOL1. The second inorganic layer IOL2 is disposed on and contacts the organic layer OL.

[0112] The cover layer CPL protects the second electrode CE from subsequent processes (eg, a sputtering process) and improves light emitting efficiency of the organic light emitting diode OLED. The cover layer CPL may have a refractive index greater than that of the first inorganic layer IOL1.

[0113] The first inorganic layer IOL1 and the second inorganic layer IOL2 protect the display element layer DP-OLED from moisture / oxygen, and the organic layer OL protects the display element layer DP-OLED from foreign matter (such as dust particles). The first inorganic layer IOL1 and the second inorganic layer IOL2 may be any one of a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. In exemplary embodiments of the inventive concept, the first inorganic layer IOL1 and the second inorganic layer IOL2 may further include a titanium oxide layer, an aluminum oxide layer, or the like. The organic layer OL may include, but is not limited to, an acrylic organic layer.

[0114] In an exemplary embodiment, an inorganic layer (eg, a LiF layer) may be further disposed between the cover layer CPL and the first inorganic layer IOL1. The LiF layer may improve the light emission efficiency of the organic light emitting diode OLED.

[0115] Figure 6A is a cross-sectional view of an input sensing layer ISL according to an exemplary embodiment of the inventive concept. Figure 6B is a plan view of an input sensing layer ISL according to an exemplary embodiment of the inventive concept. Figure 6C and Figure 6D is a partial cross-sectional view of an input sensing layer ISL according to an exemplary embodiment of the inventive concept, specifically, Figure 6C It is along Figure 6B A cross-sectional view taken along line II' in FIG. Figure 6D It is along Figure 6B A cross-sectional view taken along line II-II'. Figure 6E yes Figure 6B An enlarged plan view of area AA. Figures 6A to 6E An input sensing layer ISL is exemplarily shown as an input sensor.

[0116] like Figure 6A As shown in FIG, the input sensing layer ISL may include a first insulating layer IS-IL1, a first conductive layer IS-CL1, a second insulating layer IS-IL2, a second conductive layer IS-CL2, and a third insulating layer IS-IL3. The first insulating layer IS-IL1 may be directly disposed on the upper insulating layer TFL. In an exemplary embodiment of the inventive concept, the first insulating layer IS-IL1 may be omitted.

[0117] Each of the first conductive layer IS-CL1 and the second conductive layer IS-CL2 may have a single-layer structure, or may have a multi-layer structure stacked along the third directional axis DR3. The multi-layer conductive layer may include at least two layers of a transparent conductive layer and a metal layer. The multi-layer conductive layer may include a metal layer containing different metals. The transparent conductive layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. The metal layer may include molybdenum, silver, titanium, aluminum, and alloys thereof. For example, each of the first conductive layer IS-CL1 and the second conductive layer IS-CL2 may have a metal three-layer structure, such as a three-layer structure of titanium / aluminum / titanium.

[0118] Each of the first conductive layer IS-CL1 and the second conductive layer IS-CL2 includes a plurality of conductive patterns. Hereinafter, the first conductive layer IS-CL1 is described as including first conductive patterns, and the second conductive layer IS-CL2 is described as including second conductive patterns. Each of the first conductive patterns and the second conductive pattern may include a sensing electrode and a signal line connected to the sensing electrode.

[0119] Each of the first to third insulating layers IS-IL1 to IS-IL3 may include an inorganic material or an organic material. In an exemplary embodiment of the inventive concept, the first to second insulating layers IS-IL1 and IS-IL2 may be inorganic films including an inorganic material. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The third insulating layer IS-IL3 may include an organic film. The organic film may include at least one of an acrylic resin, a methacrylic resin, polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin.

[0120] In exemplary embodiments of the inventive concept, the second insulating layer IS-IL2 may cover a sensing area IS-DA, which will be described later. Specifically, the second insulating layer IS-IL2 may substantially overlap the sensing area IS-DA. In some exemplary embodiments, the second insulating layer IS-IL2 may include a plurality of insulating patterns. The plurality of insulating patterns may be arranged at each intersection region of the sensing unit SU to insulate the first sensing electrodes IE1 to IE1-10 from the second sensing electrodes IE2-1 to IE2-8.

[0121] like Figure 6B As shown in , the input sensing layer ISL may include a sensing area IS-DA and a wiring area IS-NDA corresponding to the display area DP-DA and the non-display area DP-NDA of the display panel DP, respectively. The sensing area IS-DA may be defined as an area in which the first electrode group EG1 and the second electrode group EG2 are arranged.

[0122] The input sensing layer ISL includes a first electrode group EG1 , a second electrode group EG2 , and a signal line group connected to the first electrode group EG1 and the second electrode group EG2 . Figure 6B An input sensing layer ISL including two signal line groups SG1 and SG2 according to an exemplary embodiment is shown. The first signal line group SG1 and the second signal line group SG2 are arranged in a wiring area IS-NDA.

[0123] In an exemplary embodiment of the inventive concept, the input sensing layer ISL may be a capacitive touch sensor. One of the first electrode group EG1 and the second electrode group EG2 may receive a driving signal, and the other may output a change in capacitance between the first electrode group EG1 and the second electrode group EG2 as a sensing signal.

[0124] The first electrode group EG1 includes a plurality of first sensing electrodes IE1 - 1 to IE1 - 10 . Figure 6BThe first electrode group EG1 includes, for example, ten first sensing electrodes IE1-1 to IE1-10. The first sensing electrodes IE1-1 to IE1-10 have a shape that extends substantially along the second direction DR2. The first sensing electrodes IE1-1 to IE1-10 extend away from the pad area PA1 (for example, the pad areas PA1-1 and PA1-2) and PA2 (for example, the pad areas PA1-1 and PA1-2) in the first direction DR1. Figure 9A The pad areas PA1, PA2 and PA3 are arranged in the direction of the pad areas PA1, PA2 and PA3.

[0125] The second electrode group EG2 includes a plurality of second sensing electrodes IE2 - 1 to IE2 - 8 . Figure 6B The second electrode group EG2 includes, for example, eight second sensing electrodes IE2-1 to IE2-8. The second sensing electrodes IE2-1 to IE2-8 extend substantially along the first direction DR1. The second sensing electrodes IE2-1 to IE2-8 may be longer than the first sensing electrodes IE1-1 to IE1-10.

[0126] The first signal line group SG1 may include the same number of first signal lines as the first sensing electrodes IE1-1 to IE1-10. A first signal line may be connected to only one of the two ends of the first sensing electrodes IE1-1 to IE1-10. The other end may be electrically isolated and not connected to another conductive structure. Therefore, when the input sensing layer ISL operates, no current path is formed from one end of the first sensing electrodes IE1-1 to IE1-10 to the other end. This connection relationship between the signal lines and the sensing electrodes is referred to as a "single routing structure."

[0127] The second signal line group SG2 may include the same number of second signal lines as the number of second sensing electrodes IE2-1 to IE2-8. The second signal line may be connected to only one of the two ends of the second sensing electrodes IE2-1 to IE2-8. The second signal line group SG2 and the second sensing electrodes IE2-1 to IE2-8 may have a single routing structure. Figure 6B Eight signal lines of the second signal line group SG2 respectively connected to one lower end of the second sensing electrodes IE2 - 1 to IE2 - 8 are shown.

[0128] In an exemplary embodiment of the inventive concept, the first signal lines can be divided into two groups. One of the groups can be defined as a one-side signal line group SG1-1, and the other group can be defined as an other-side signal line group SG1-2. The one-side signal line group SG1-1 is connected to a portion of the first sensing electrodes IE1-1 to IE1-10, and the other-side signal line group SG1-2 is connected to another portion of the first sensing electrodes IE1-1 to IE1-10. The one-side signal line group SG1-1 is separated from the other-side signal line group SG1-2 in the second direction DR2, and the sensing area IS-DA is located between the one-side signal line group SG1-1 and the other-side signal line group SG1-2. Since the first signal lines are arranged separately on both sides, the width of the wiring area IS-NDA can be reduced.

[0129] For example, one-side signal line group SG1-1 can be electrically connected to odd-numbered sensing electrodes or even-numbered sensing electrodes among the first sensing electrodes IE1-1 to IE1-10. The other-side signal line group SG1-2 can be connected to sensing electrodes not connected to the one-side signal line group SG1-1. In the illustrated exemplary embodiment of the inventive concept, the five signal lines of the one-side signal line group SG1-1 are shown as being connected to one right end of each of the even-numbered first sensing electrodes.

[0130] The signal lines of the first signal line group SG1 (hereinafter referred to as "first signal lines") and the signal lines of the second signal line group SG2 (hereinafter referred to as "second signal lines") may include pad units PD and line units LP. The pad units PD provided in the pad areas PA1 and PA2 are connected to the circuit board. The circuit board connected to the pad areas PA1 and PA2 may be mounted with a sensing circuit, or may be connected to a circuit board mounted with a sensing circuit.

[0131] The first sensing electrodes IE1-1 to IE1-10 and the second sensing electrodes IE2-1 to IE2-8 may intersect each other while being insulated from each other. A bridge pattern (hereinafter referred to as a "first bridge pattern") is arranged in the intersection region. In an exemplary embodiment of the inventive concept, the first bridge pattern may form a portion of the first sensing electrodes IE1-1 to IE1-10 having a relatively short length. Since the first bridge pattern is formed in the first sensing electrodes IE1-1 to IE1-10, the equivalent resistance of the input sensing layer ISL can be reduced, thereby improving sensing sensitivity. A detailed description of this will be provided later.

[0132] Each of the first sensing electrodes IE1-1 to IE1-10 may include a plurality of first sensor parts SP1 and a plurality of first connection parts CP1. The first sensor parts SP1 are substantially arranged along the second direction DR2. Each first connection part CP1 connects two adjacent first sensor parts among the first sensor parts SP1.

[0133] Each of the second sensing electrodes IE2-1 to IE2-8 includes a plurality of second sensor parts SP2 and a plurality of second connection parts CP2. The second sensor parts SP2 are substantially arranged along the first direction DR1. Each second connection part CP2 connects two adjacent second sensor parts among the second sensor parts SP2.

[0134] Figure 6B It is shown that the first connection portion CP1 and the second connection portion CP2 according to an exemplary embodiment intersect. In the illustrated exemplary embodiment of the inventive concept, the first connection portion CP1 may correspond to a first bridge pattern.

[0135] like Figure 6C As shown in FIG, a plurality of first connection parts CP1 may be formed by the first conductive layer IS-CL1, and a plurality of first sensor parts SP1, a plurality of second sensor parts SP2, and a plurality of second connection parts CP2 may be formed by the second conductive layer IS-CL2. The first sensor parts SP1 and the first connection parts CP1 may be connected via contact holes CNT-I penetrating the second insulating layer IS-IL2.

[0136] According to the illustrated exemplary embodiment, the plurality of first connection portions CP1 and the plurality of second connection portions CP2 are shown to intersect with each other, however, the inventive concept is not limited thereto. For example, each of the first connection portions CP1 may have a curved shape (such as "∧" and / or "∨") so as not to overlap with the second connection portions CP2. In this case, the curved first connection portions CP1 may overlap with the second sensor portions SP2 in a plan view.

[0137] Return to reference Figure 6B , the sensing area IS-DA can be divided into a plurality of sensing units SU.

[0138] The plurality of sensing units SU may have the same area. Each of the plurality of sensing units SU includes a corresponding intersection region among intersection regions between the first sensing electrodes IE1 to IE1-10 and the second sensing electrodes IE2-1 to IE2-8. The intersection region is a region where the first bridge pattern is arranged. Figure 6B The sensing area IS-DA divided into sensing units SU in an 8×10 matrix is exemplarily shown.

[0139] Figure 6D Two signal lines SG1-14 and SG1-15 of the first signal line group SG1 are shown. The signal lines of the first signal line group SG1 and the signal lines of the second signal line group SG2 include at least a portion arranged on the same layer as the second sensing electrodes IE2-1 to IE2-8. The signal lines of the first signal line group SG1 and the signal lines of the second signal line group SG2 may be formed by the second conductive layer IS-CL2 (see FIG. Figure 6A )form.

[0140] In some exemplary embodiments, the signal lines of the first signal line group SG1 and the signal lines of the second signal line group SG2 may further include a first conductive layer IS-CL1 (see Figure 6A The portion formed by the second conductive layer IS-CL2 and the portion formed by the first conductive layer IS-CL1 can be connected through a contact hole penetrating the second insulating layer IS-IL2. This double-layer signal line can have low resistance.

[0141] The first sensing electrodes IE1 - 1 to IE1 - 10 and the second sensing electrodes IE2 - 1 to IE2 - 8 may have a mesh shape. Figure 6E The first sensor part SP1 having a grid shape is exemplarily shown.

[0142] Three types of openings OP-MG, OP-MR, and OP-MB are defined in the first sensor portion SP1. The three types of openings OP-MG, OP-MR, and OP-MB may correspond to the three types of light emitting openings OP-G, OP-R, and OP-B. The three types of light emitting openings OP-G, OP-R, and OP-B may correspond to the three types of light emitting openings OP-G, OP-R, and OP-B. Figure 5A The light emitting opening OP of the pixel defining film PDL shown in FIG.

[0143] The three types of light-emitting openings OP-G, OP-R and OP-B can be defined by their opening sizes, and the areas of the first type of light-emitting opening OP-G, the second type of light-emitting opening OP-R and the third type of light-emitting opening OP-B are proportional to the light-emitting area of the corresponding pixel.

[0144] Figure 7A is an enlarged plan view of a sensing unit SU according to an exemplary embodiment of the inventive concept. Figure 7B is an enlarged plan view of a crossing area SU-CA of a sensing unit SU according to an exemplary embodiment of the inventive concept. Figure 7C is an equivalent circuit diagram of an input sensor according to an exemplary embodiment of the inventive concept. Figure 7D is a graph illustrating a waveform of a driving signal according to an exemplary embodiment of the inventive concept. Figure 7E It is a graph showing the 1 decibel (db) bandwidth characteristics due to the structure of the input sensor. Figures 1 to 6E Configurations and elements described herein that are substantially the same are described repeatedly to avoid redundancy.

[0145] Figure 7A The sensing unit SU may correspond to Figure 6BThe sensing unit SU includes a first sensor portion SP1 and another first sensor portion SP1, and a first connection portion CP1 is located between the first sensor portion SP1 and the other first sensor portion SP1. The sensing unit SU includes a second sensor portion SP2 and another second sensor portion SP2, and a second connection portion CP2 is located between the second sensor portion SP2 and the other second sensor portion SP2. Figure 7A As shown in , two first connection parts CP1 may be arranged. Each of the two first connection parts CP1 may be a first bridge pattern.

[0146] Reference Figure 7B The two first connection parts CP1 connect the two separated first sensor parts SP1. The first to fourth connection regions CNT-A1 to CNT-A4 are formed between the two first connection parts CP1 and the two first sensor parts SP1.

[0147] Four contact holes CNT-I may be formed in the first to fourth connection regions CNT-A1 to CNT-A4, respectively. The first and second connection regions CNT-A1 and CNT-A2 may be formed around the second light-emitting region PXA-B, and the third and fourth connection regions CNT-A3 and CNT-A4 may be formed around the first light-emitting region PXA-R.

[0148] The first connection portion CP1 intersects the grid lines of the second sensor portion SP2. The first connection portion CP1 may partially replace the grid lines of the second sensor portion SP2 at the intersection. Except at the intersection, the grid lines of the first connection portion CP1 and the grid lines of the second sensor portion SP2 may not overlap. The grid lines of the first connection portion CP1 and the grid lines of the second sensor portion SP2 may define openings that replace the first opening OP-MR, the second opening OP-MB, and the third opening OP-MG.

[0149] Figure 7C An equivalent circuit of an input sensor between a driving circuit 210 and a sensing circuit 220 according to an exemplary embodiment is shown. Figure 7C An equivalent circuit based on a reference capacitor Cse formed in a cross region between one first sensing electrode and one second sensing electrode is shown. In addition, in the exemplary embodiment of the inventive concept shown, a driving signal Sdr is applied to the second sensing electrode through a second signal line. Figure 7C exemplarily shows the pad unit PD2 of the second signal line and the pad unit PD1 of the first signal line.

[0150] The driving circuit 210 may sequentially provide the driving signal Sdr to the second sensing electrodes IE2-1 to IE2-8 (see FIG. Figure 6BThe sensing signal Sse corresponding to the driving signal Sdr having passed through the reference capacitor Cse is output through the first sensing electrodes IE1-1 to IE1-10. The sensing signal Sse is input to the sensing circuit 220.

[0151] The sensing circuit 220 amplifies, converts, and processes the sensing signal Sse, and detects an external input based on the results of the amplification, conversion, and signal processing. The sensing circuit 220 may include a sensing channel 222, an analog-to-digital converter (ADC) 224, and a processor (or MPU) 226. A sensing channel 222 may be formed for each of the first sensing electrodes IE1-1 to IE1-10. Multiple sensing channels 222 may be connected to the same ADC 224.

[0152] In the exemplary embodiment of the inventive concept shown, the sensing channel 222 may include an amplifier AMP1, such as an operational amplifier. A first input terminal IN1 of the amplifier AMP1 (e.g., an inverting input terminal of the operational amplifier) may receive a sensing signal Sse. Furthermore, a second input terminal IN2 of the amplifier AMP1 (e.g., a non-inverting input terminal of the operational amplifier) is a reference potential terminal and may receive a reference voltage (e.g., a ground (GND) voltage). A capacitor CC and a reset switch SW may be connected in parallel between the first input terminal IN1 and the output terminal OUT1 of the amplifier AMP1.

[0153] ADC 224 converts the analog signal output from the sensing channel 222 into a digital signal. The processor 226 processes the conversion signal (digital signal) from ADC 224 and detects the touch input based on the result of the signal processing. For example, the processor 226 can comprehensively analyze the signal (amplified and converted sensing signal Sse) input via the sensing channel 222 and ADC 224 of each of the multiple sensing electrodes to detect the occurrence and position of the external input. In an exemplary embodiment, the processor 226 can be implemented as a microprocessor MPU. In this case, the sensing circuit 220 may also include a memory required to drive the processor 226. In an exemplary embodiment of the inventive concept, the processor 226 may be implemented as a microcontroller.

[0154] Although the driving circuit 210 and the sensing circuit 220 are shown as being separate, the inventive concept is not limited thereto. For example, the driving circuit 210 and the sensing circuit 220 may be integrated into a single chip.

[0155] Reference Figure 7C, the first resistor R-L2 and the second resistor R-E2 are connected in series between the pad unit PD2 of the second signal line and the reference capacitor Cse. The first resistor R-L2 has an equivalent resistance of the second signal line, and the second resistor R-E2 has an equivalent resistance of the second sensing electrode. The first parasitic capacitor C-L2 and the second parasitic capacitor C-E2 are connected between the pad unit PD2 of the second signal line and the reference capacitor Cse. The first parasitic capacitor C-L2 is the second signal line and the second electrode CE (see Figure 5A ), and the second parasitic capacitance C-E2 is the capacitance between the second sensing electrode and the second electrode CE.

[0156] In addition, the third resistor R-L1 and the fourth resistor R-E1 are connected in series between the pad unit PD1 of the first signal line and the reference capacitor Cse. The third resistor R-L1 has an equivalent resistance of the first signal line, and the fourth resistor R-E1 has an equivalent resistance of the first sensing electrode. The third parasitic capacitor C-L1 and the fourth parasitic capacitor C-E1 are connected between the pad unit PD1 of the first signal line and the reference capacitor Cse. The third parasitic capacitor C-L1 is a resistor between the first signal line and the second electrode CE (see FIG. Figure 5A ), and the fourth parasitic capacitance C-E1 is the capacitance between the first sensing electrode and the second electrode CE.

[0157] When a touch event occurs, the reference capacitor Cse at the corresponding position may change. Due to the occurrence of the touch event, a touch capacitor connected in parallel with the reference capacitor Cse is generated. The processor 226 can measure the capacitance change (ΔCm) generated after the touch event from the sensing signal Sse. The capacitance change (ΔCm) can be measured by sensing the change in the current of the sensing signal Sse.

[0158] Figure 7D The waveform of a sinusoidal signal as a drive signal is shown. Figure 7E Shows the Figure 7D The 1 dB bandwidth characteristic of the sensing signal measured with respect to the driving signal shown in FIG. Figure 7E , a first graph GP1 represents a 1-dB bandwidth characteristic of an input sensor according to an exemplary embodiment, and a second graph GP2 represents a 1-dB bandwidth characteristic of an input sensor according to a comparative example. Figure 7E The x-axis is shown in a logarithmic scale.

[0159] For a system having eight sensing units SU arranged in a sensing unit row (see Figure 6B ) and an input sensor of 17 sensing units arranged in a sensing unit column measures 1 dB bandwidth characteristics. According to the exemplary embodiment of the inventive concept shown, as Figures 6B to 7BAs shown in , the second sensing electrode has an integral shape, and the first bridge pattern is arranged in the first sensing electrode. According to the comparative example, the first sensing electrode has an integral shape, and the first bridge pattern is arranged in the second sensing electrode.

[0160] based on Figure 7C , the exemplary embodiment shown includes 8 first bridge patterns, and the comparative example includes 17 first bridge patterns. The total resistance of the second resistor R-E2 and the fourth resistor R-E1 according to the exemplary embodiment shown is measured to be approximately 649 ohms, and the total resistance of the second resistor R-E2 and the fourth resistor R-E1 according to the comparative example is measured to be approximately 692 ohms. Due to fewer first bridge patterns with high contact resistance, the exemplary embodiment shown has a relatively low total resistance compared to the comparative example. In the exemplary embodiment shown and the comparative example, the first resistor R-L2, the third resistor R-L1, and the first parasitic capacitor C-L2, the second parasitic capacitor C-E2, the third parasitic capacitor C-L1, and the fourth parasitic capacitor C-E1 are substantially the same.

[0161] The 1 dB bandwidth of the first curve GP1 was measured to be approximately 340 kΩ, and the 1 dB bandwidth of the second curve GP2 was measured to be approximately 290 kΩ. Compared to the comparative example, the exemplary embodiment of the illustrated inventive concept has a relatively low total resistance and, therefore, has excellent 1 dB bandwidth characteristics and a wider AC signal bandwidth. The wide AC signal bandwidth can improve the sensitivity of an input sensor using a sinusoidal signal as a drive signal.

[0162] Figure 8A is a plan view of an input sensor IS according to an exemplary embodiment of the inventive concept. Figure 8B yes Figure 8A An enlarged plan view of a local area. Figure 8C is an enlarged plan view of a crossing area SU-CA according to an exemplary embodiment of the inventive concept. Figure 8D 1 is a plan view of an input sensor IS according to an exemplary embodiment of the inventive concept. Figures 6A to 7E Configurations and elements described herein that are substantially the same are described repeatedly to avoid redundancy.

[0163] like Figure 8A As shown in FIG, the input sensor IS may further include a first dummy pattern FP1 disposed within and insulated from the first sensor portion SP1, and a second dummy pattern FP2 disposed within and insulated from the second sensor portion SP2. The first dummy pattern FP1 and the second dummy pattern FP2 may reduce the distance between the input sensor IS and the display panel DP (e.g., see FIG). Figure 6A ) between the parasitic capacitance (for example, Figure 7C In this way, the sensitivity of the input sensor IS can be improved due to the reduced parasitic capacitance.

[0164] The input sensor IS may further include a bridge pattern BP (hereinafter referred to as a "second bridge pattern") connecting the first dummy patterns FP1. The second bridge pattern BP may be formed by Figure 6A The second bridge pattern BP is arranged to correspond to the cross region. The second bridge pattern BP may overlap with the second sensor portion SP2. The second bridge pattern BP may overlap with the first bridge pattern CP1 (see FIG. Figure 7B ) are arranged on the same layer.

[0165] like Figure 8A As shown in FIG, the input sensor IS may further include a dummy signal line GSL. The dummy signal line GSL may receive a predetermined bias voltage, such as a ground voltage. The dummy signal line GSL may be connected to the first dummy pattern FP1. The dummy signal line GSL may be formed by Figure 6A The second conductive layer IS-CL2 shown in FIG is formed.

[0166] In an exemplary embodiment of the inventive concept, the dummy signal line GSL may be connected to the sensing circuit 220 (see FIG. Figure 7C The dummy signal line GSL may be electrically connected to the second input terminal IN2 of the amplifier AMP1 (see Figure 7C In this case, the first dummy pattern FP1 may have a noise detection function. In this way, the sensing signal Sse may be processed to reflect the noise affecting the first dummy pattern FP1.

[0167] Figure 8B An enlarged view of a portion of four first sensing electrodes IE1-2 to IE1-5 and the rightmost second sensing electrode IE2-8 according to an exemplary embodiment is shown. A dummy signal line GSL may be electrically connected to a first dummy pattern FP1 arranged within the odd-numbered first sensing electrodes IE1-3 and IE1-5. The dummy signal line GSL may be directly connected to the outermost first dummy pattern FP1 among the first dummy patterns FP1, substantially in the second direction DR2. In an exemplary embodiment of the inventive concept, the dummy signal line GSL may be connected to the first dummy pattern FP1 via a bridge pattern.

[0168] like Figure 8BAs shown in , at least one of the first dummy patterns FP1 may include extensions FP1-20 and FP1-30 arranged substantially on both sides of a central portion FP1-10 along the second direction DR2. Each of the extensions FP1-20 and FP1-30 is connected to a corresponding second bridge pattern BP. Some of the first dummy patterns FP1 arranged at both ends along the second direction DR2 may have shapes different from those of the other first dummy patterns FP1. For example, the first dummy patterns FP1 arranged at both ends may include a central portion and one extension disposed on one side of the central portion.

[0169] like Figure 8B As shown in FIG, the input sensor IS may further include a bridge pattern BP-S (hereinafter referred to as a "third bridge pattern") that may cross the dummy signal line GSL and be insulated from the dummy signal line GSL. The third bridge pattern BP-S may connect the first sensing electrodes IE1-2 and IE1-4 with the signal lines SG1-11 and SG1-12. The third bridge pattern BP-S may be formed by Figure 6A The first conductive layer IS-CL1 shown in FIG is formed.

[0170] Figure 8C is an enlarged view of one intersection area SU-CA according to an exemplary embodiment of the inventive concept. Figure 8C The area shown in corresponds to Figure 7B The area shown in Figure 8A and Figure 8B different, Figure 8C It is shown that two bridge patterns BP according to an exemplary embodiment are arranged in the intersection area SU-CA. The second bridge pattern BP may be arranged to correspond to the first bridge pattern CP1.

[0171] The two second bridge patterns BP may be arranged outside the two first bridge patterns CP1. The second bridge pattern BP may have a length greater than that of the first bridge pattern CP1. Four connection regions may be formed between the two second bridge patterns BP and the two first dummy patterns FP1. Four contact holes CNT-I may be arranged in each of the four connection regions.

[0172] like Figure 8D As shown in , a plurality of dummy signal lines GSL may be provided. In the exemplary embodiment shown, the same number of dummy signal lines GSL as the number of first sensing electrodes IE1-1 to IE1-10 may be arranged. Each dummy signal line GSL may be connected to a first dummy pattern FP1 adjacent to a corresponding first sensing electrode IE1-1 to IE1-10. The dummy signal line GSL may be connected to the sensing channel 222 corresponding to the first sensing electrodes IE1-1 to IE1-10 and the second input terminal IN2 of the amplifier AMP1.

[0173] Figure 9A is a plan view of an input sensing layer ISL according to an exemplary embodiment of the inventive concept. Figure 9B is a partial cross-sectional view of an input sensing layer ISL according to an exemplary embodiment of the inventive concept, specifically, Figure 9B It is along Figure 9A A cross-sectional view taken along line II' in FIG. Figure 9C 1 is an equivalent circuit diagram of the input sensing layer ISL according to an exemplary embodiment of the inventive concept. Figures 1 to 8D Configurations and elements described herein that are substantially the same are described repeatedly to avoid redundancy.

[0174] and Figure 6B Compared with the input sensing layer ISL of FIG. 1 , the input sensing layer ISL according to the exemplary embodiment of the illustrated inventive concept further includes a third signal line group SG3. Figure 6B Compared with the connection relationship between the first electrode group EG1 and the second electrode group EG2 and the first signal line group SG1 and the second signal line group SG2 of the input sensing layer ISL, the input sensing layer ISL according to the exemplary embodiment of the illustrated inventive concept has a different connection relationship between the first electrode group EG1 and the second electrode group EG2 and the first signal line group SG1 and the second signal line group SG2.

[0175] Specifically, the right ends of the first sensing electrodes IE1-1 to IE1-10 are connected to a signal line of the first signal line group SG1. The lower ends of the second sensing electrodes IE2-1 to IE2-8 are connected to a signal line of the second signal line group SG2. The upper ends of the second sensing electrodes IE2-1 to IE2-8 are connected to a signal line of the third signal line group SG3. Thus, according to an exemplary embodiment, both ends of the second sensing electrodes IE2-1 to IE2-8 are connected to signal lines. This connection relationship between signal lines and sensing electrodes is referred to as a dual routing structure.

[0176] Furthermore, according to an exemplary embodiment of the inventive concept, the first bridge pattern is applied to the second sensing electrodes IE2-1 to IE2-8 having a greater length. Specifically, the second connection portion CP2 may correspond to the first bridge pattern. Each of the first sensing electrodes IE1-1 to IE1-10 may have an integral shape.

[0177] Figure 9B FIG. 4 shows the fifth first sensing electrode IE1-5 of the first electrode group EG1. Figure 9B As shown in FIG, the first sensor portion SP1 and the first connection portion CP1 may be arranged on the same layer and may be formed as one body. The first sensor portion SP1 and the first connection portion CP1 may be formed by substantially the same process. Figure 6AThe second connection part CP2 may be connected to the second sensor part SP2 through a contact hole CNT-1 penetrating the second insulating layer IS-IL2.

[0178] Reference Figure 9C The equivalent circuit of , the driving signal Sdr is provided to both ends of the second sensing electrode through the second signal line and the signal line of the third signal line group SG3 (hereinafter referred to as “third signal line”).

[0179] The second resistor R-E21 of the dual routing structure has a Figure 7C The resistance of the second resistor R-E2 is low. This is because the second resistor R-E21 corresponds to a portion of the second sensing electrode. However, the dual routing structure further includes a fifth resistor R-L3 and a sixth resistor R-E22 connected in parallel with the first resistor R-L2 and the second resistor R-E21. The fifth resistor R-L3 has an equivalent resistance of the third signal line. The sixth resistor R-E22 corresponds to a portion of the second sensing electrode, and the total resistance of the second resistor R-E21 and the sixth resistor R-E22 corresponds to Figure 7C The total resistance of the second resistor R-E2.

[0180] exist Figure 9C The fifth parasitic capacitor C-L3 is the capacitance between the third signal line and the second electrode CE (see Figure 5A ), the sixth parasitic capacitor C-E22 is the capacitance between a portion of the second sensing electrode and the second electrode CE. The second parasitic capacitor C-E21 is the capacitance between another portion of the second sensing electrode and the second electrode CE, so the second parasitic capacitor C-E21 is less than Figure 7C The second parasitic capacitance C-E2.

[0181] exist Figure 9C In the embodiment, it is desirable that the second resistor R-E21 and the sixth resistor R-E22 have relatively large values so that the total resistance between the pad unit PD2 of the second signal line and the reference capacitor Cse has a low value. Figure 9A and Figure 9B As shown in FIG, by applying the first bridge pattern to the second connection portion CP2, the values of the second resistor R-E21 and the sixth resistor R-E22 can be relatively increased. Furthermore, since the first sensing electrode has a unitary shape, the value of the fourth resistor R-E1 can be reduced. This reduces the overall resistance, thereby improving the bandwidth characteristics of the input sensing layer ISL having a dual routing structure.

[0182] Figure 10A is a perspective view of a display module DM according to an exemplary embodiment of the inventive concept. Figure 10Bis a plan view of an input sensing layer ISL according to an exemplary embodiment of the inventive concept. Figure 11A is a perspective view of a display module DM according to an exemplary embodiment of the inventive concept. Figure 11B 1 is a plan view of an input sensing layer ISL according to an exemplary embodiment of the inventive concept. Figures 1 to 9C Configurations and elements described herein that are substantially the same are described repeatedly to avoid redundancy.

[0183] Reference Figure 10A , the display module DM may include a notch area NTA that is recessed inward in a plan view. The notch area NTA may be defined in each of the display panel DP and the input sensing layer ISL, but the notch areas NTA may be the same or different. The notch area NTA may be defined in a central area along the second direction DR2. In some exemplary embodiments, the notch area NTA may not be provided in a precise central area.

[0184] like Figure 10B As shown in FIG, the shapes of the first electrode group EG1 and the second electrode group EG2 may be changed due to the notch area NTA. The positions and arrangements of the first signal line group SG1 and the second signal line group SG2 may be different from those of FIG. Figure 6B The positions and arrangements of the first signal line group SG1 and the second signal line group SG2 of the input sensing layer ISL are substantially the same.

[0185] like Figure 10B As shown in FIG, the tenth first sensing electrode IE1-10 may be divided into two parts due to the notch area NTA. The two parts may be connected by a dummy connection line DSL. The fourth to sixth second sensing electrodes IE2-4 to IE2-6 of the second electrode group EG2 may have a length shorter than that of the other sensing electrodes.

[0186] like Figure 11A As shown in , the display module DM according to an exemplary embodiment may include a signal transmission area HA in a plan view. The signal transmission area HA may be defined by partially or completely removing a portion of the display panel DP and the input sensing layer ISL. The signal transmission area HA may be divided into an area having a first transmittance and another area having a second transmittance lower than the first transmittance. For example, the display panel DP or the input sensing layer ISL may be removed in the area having the second transmittance, and both the display panel DP and the input sensing layer ISL may be removed in the area having the first transmittance. For example, the light emitting element of the display panel DP may be partially removed in the area having the second transmittance, and the light emitting element of the display panel DP may be completely removed in the area having the first transmittance.

[0187] The signal transmission area HA of the display panel DP and the signal transmission area HA of the input sensing layer ISL may be the same or different. The signal transmission area HA may be a transmission channel for the optical signal. A plurality of signal transmission areas HA may be defined in the display module DM.

[0188] The signal transmission area HA of the display panel DP is formed by removing at least a portion of the base layer BL, the circuit element layer DP-CL disposed on the base layer BL, the display element layer DP-OLED, and the upper insulating layer TFL. The sensor parts SP1 and SP2 can be removed from the signal transmission area HA of the input sensing layer ISL.

[0189] like Figure 11B As shown in FIG, the shapes of the first electrode group EG1 and the second electrode group EG2 may be changed due to the signal transmission area HA. The positions and arrangements of the first signal line group SG1 and the second signal line group SG2 may be different from those of FIG. Figure 6B The positions and arrangements of the first signal line group SG1 and the second signal line group SG2 of the input sensing layer ISL are substantially the same.

[0190] The signal transmission region HA of the input sensing layer ISL may be disposed in the intersection region between the first electrode group EG1 and the second electrode group EG2. Here, a dummy connection line may be disposed around the signal transmission region HA of the input sensing layer ISL. For example, the dummy connection line may bypass the signal transmission region HA to connect the separated electrodes of the first electrode group EG1 and the second electrode group EG2.

[0191] According to an exemplary embodiment of the inventive concept, the position of the connection portion (or bridge pattern) relative to the sensor portion changes according to the connection structure of the signal line and the sensing electrode. Specifically, the bridge pattern is provided in the first sensing electrode or the second sensing electrode according to the connection structure of the signal line and the sensing electrode.

[0192] According to exemplary embodiments of the inventive concept, since the resistance of the input sensor is reduced, the AC bandwidth characteristic can be improved, and since the bandwidth of the sensing signal is increased, the sensing sensitivity can be increased.

[0193] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those of ordinary skill in the art.

Claims

1. A display device, comprising: Display panel; as well as An input sensor is provided on the display panel and includes a sensing area and a wiring area outside the sensing area, the input sensor including: a signal line group arranged in the wiring area; a first sensing electrode and a second sensing electrode arranged in the sensing area, each of the first sensing electrode and the second sensing electrode having one end electrically connected to a corresponding signal line in the signal line group; a first dummy pattern arranged in each of the first sensing electrodes; and a second dummy pattern arranged in each of the second sensing electrodes. wherein the second sensing electrode has a length greater than that of the first sensing electrode; The signal line group includes a first signal line group electrically connected to a first end of the first sensing electrode and a second signal line group electrically connected to a first end of the second sensing electrode; The second end of the second sensing electrode is electrically isolated; Each of the first sensing electrodes includes a first bridge pattern and a first sensor portion, the first bridge pattern overlaps the second sensing electrode and is disposed on a different layer from the second sensing electrode, and the first sensor portion is disposed on the same layer as the second sensing electrode; Each of the second sensing electrodes has a unitary shape; Each of the first bridge patterns includes two connecting portions connecting two adjacent first sensor portions; The first signal line group includes: a first side signal line electrically connected to the first ends of the even-numbered sensing electrodes among the first sensing electrodes; and a second side signal line electrically connected to the second ends of the odd-numbered sensing electrodes among the first sensing electrodes; The first dummy patterns in the odd-numbered sensing electrodes are connected to a dummy signal line on a first side adjacent to the first-side signal line, and the first dummy patterns in the even-numbered sensing electrodes are connected to a dummy signal line on a second side adjacent to the second-side signal line; and The second sensing electrode is configured to receive a sinusoidal signal through the second signal line group.

2. The display device according to claim 1, wherein The first sensing electrode is configured to provide a sensing signal corresponding to the sinusoidal signal to a sensing circuit.

3. The display device according to claim 1, wherein: The display panel includes a display area corresponding to the sensing area and a non-display area corresponding to the wiring area; The display area includes a light-emitting area and a non-light-emitting area; and Each of the first sensing electrodes has an opening corresponding to the light emitting area.

4. The display device according to claim 1, wherein At least a portion of the corresponding signal line in the signal line group is disposed on the same layer as the second sensing electrode.

5. The display device according to claim 1, wherein The input sensor further includes an insulating layer disposed between the first bridge pattern and the second sensing electrode and covering the sensing area. The display device according to claim 1 , wherein: The first side signal line and the second side signal line are spaced apart from each other along an extending direction of the first sensing electrode, and the sensing area is located between the first side signal line and the second side signal line.

7. The display device according to claim 1, wherein The input sensor further includes a second bridge pattern connecting the first dummy patterns.

8. The display device according to claim 7, wherein: At least one of the first dummy patterns includes a central portion and extended portions, the extended portions being arranged on both sides of the central portion along an extending direction of the first sensing electrode; and Each of the extending portions is connected to a corresponding second bridge pattern among the second bridge patterns.

9. The display device according to claim 7, wherein: The first bridge pattern and the second bridge pattern are provided on the same layer.

10. The display device according to claim 7, wherein: The second bridge pattern is arranged to correspond to the first bridge pattern; and The second bridge patterns have lengths greater than lengths of corresponding first bridge patterns among the first bridge patterns.

11. The display device according to claim 7, wherein: The input sensor further includes a dummy signal line connected to an outermost first dummy pattern among the first dummy patterns in an extending direction of the first sensing electrode.

12. The display device according to claim 11, wherein: The input sensor further includes a third bridge pattern crossing the dummy signal line and being insulated from the dummy signal line; and The third bridge pattern connects the first sensing electrode and the signal line of the first signal line group.

13. The display device according to claim 1, wherein The display device further includes a notch area that is recessed inward in a plan view.

14. The display device according to claim 1, wherein: The display panel includes a base layer, a circuit element layer disposed on the base layer, a display element layer disposed on the circuit element layer, and an upper insulating layer disposed on the display element layer; and The display device further includes a signal transmission region in which at least a portion of the base layer, the circuit element layer, the display element layer, and the upper insulating layer is removed.

15. A display device, comprising: Display panel; as well as An input sensor is provided on the display panel, the input sensor comprising: a first sensing electrode; a second sensing electrode intersecting the first sensing electrode and having a length greater than that of the first sensing electrode; a first signal line electrically connected to a first end of the first sensing electrode; a second signal line electrically connected to a first end of the second sensing electrode; and a third signal line electrically connected to a second end of the second sensing electrode; first dummy patterns respectively arranged in the first sensing electrodes; and second dummy patterns respectively arranged in the second sensing electrodes. The first sensing electrode includes a first sensor portion provided on the same layer as the second sensing electrode. The first sensing electrode has an integral shape, The second sensing electrode includes a bridge pattern provided at a different layer from the first sensing electrode and a second sensor portion provided at the same layer as the first sensing electrode. At least one of the bridge patterns overlaps the first sensing electrode; Each of the bridge patterns includes two connecting portions connecting two adjacent second sensor portions; The first signal line includes: a first side signal line electrically connected to the first ends of the even-numbered sensing electrodes among the first sensing electrodes; and a second side signal line electrically connected to the second ends of the odd-numbered sensing electrodes among the first sensing electrodes; and The first dummy patterns in the odd-numbered sensing electrodes are connected to a dummy signal line on a first side adjacent to the first-side signal line, and the first dummy patterns in the even-numbered sensing electrodes are connected to a dummy signal line on a second side adjacent to the second-side signal line; and The second sensing electrode is configured to receive a sinusoidal signal through the second signal line and the third signal line.

16. A display device, comprising: Display panel; as well as An input sensor is provided on the display panel, the input sensor comprising: an insulating layer; a first sensing electrode; a second sensing electrode intersecting the first sensing electrode, having a length greater than that of the first sensing electrode and having an integral shape; a signal line connected to the first sensing electrode; first dummy patterns respectively arranged in the first sensing electrodes; and second dummy patterns respectively arranged in the second sensing electrodes. The first sensing electrode includes a first sensor portion and a first connecting portion, wherein the first sensor portion is disposed on the insulating layer, and the first connecting portion is disposed under the insulating layer and connected to the first sensor portion through a contact hole penetrating the insulating layer; The second sensing electrode includes a second sensor portion and a second connecting portion, the second sensor portion being disposed on the insulating layer, the second connecting portion being disposed on the insulating layer and extending from the second sensor portion; The first connecting portion overlaps the second sensor portion but does not overlap the second connecting portion; Two first connecting portions among the first connecting portions connect two adjacent first sensor portions; The signal lines include: first-side signal lines electrically connected to first ends of even-numbered sensing electrodes among the first sensing electrodes; and second-side signal lines electrically connected to second ends of odd-numbered sensing electrodes among the first sensing electrodes; The first dummy patterns in the odd-numbered sensing electrodes are connected to a dummy signal line on a first side adjacent to the first-side signal line, and the first dummy patterns in the even-numbered sensing electrodes are connected to a dummy signal line on a second side adjacent to the second-side signal line; The second sensing electrode is configured to receive a sinusoidal signal through one end of the second sensing electrode.

17. The display device according to claim 16, wherein: The second sensing electrode is disposed on the insulating layer.

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