Display device and mask for manufacturing the same

Abstract

A display device and a mask for manufacturing the display device are disclosed. The display device includes a substrate, a thin film encapsulation layer, a conductive layer, and a dam, the substrate including a display area and a peripheral area; the thin film encapsulation layer overlaps the display area and includes an inorganic film and an organic film; the conductive layer is positioned in the peripheral area; and the dam overlaps the outer edge of the conductive layer, wherein the dam includes a first inclined portion extending from a top surface of the dam toward the display area and at least partially overlapping the conductive layer, and a second inclined portion extending in a direction opposite to the first inclined portion. The shapes of the first inclined portion and the second inclined portion are asymmetric to each other.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of and priority to Korean Patent Application No. 10-2018-0126863, filed on October 23, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] One or more embodiments of the present disclosure relate to a display device and a mask for manufacturing the display device, and more particularly, to a display device including a dam positioned in a peripheral region and a mask for manufacturing the display device. Background Art

[0004] The display device provides visual data to the user. The display device includes a substrate divided into a display area and a peripheral area outside the display area. Scan lines and data lines insulated from each other are formed in the display area, and a plurality of pixels connected to the scan lines and the data lines are positioned in the display area. In addition, thin film transistors (TFTs) corresponding to the pixels and pixel electrodes electrically connected to each TFT are provided in the display area. An opposing electrode provided in common for a plurality of pixels is provided in the display area. Various wirings, a scan driver, a data driver, and a controller for transmitting electrical signals to the display area may be provided in the peripheral area.

[0005] Technology for sealing a display area to protect the display area from moisture and / or outside air has been actively studied. Summary of the invention

[0006] One or more embodiments of the present disclosure include a display device and a mask for manufacturing a display device, and more specifically, a display device including a dam positioned in a peripheral area and a mask for manufacturing a display device. Additional aspects of the present disclosure will be set forth in part in the description that follows and in part will be apparent from the description, or may be learned by practicing the embodiments set forth herein.

[0007] According to one or more embodiments, a display device includes a substrate, a thin film encapsulation layer, a conductive layer and a dam, the substrate including a display area displaying an image and a peripheral area positioned around the display area; the thin film encapsulation layer overlaps the display area and includes at least one inorganic film and at least one organic film; the conductive layer is positioned in the peripheral area and surrounds at least a portion of the display area; and the dam overlaps with an outer edge of the conductive layer, wherein the dam includes a first inclined portion extending from a top surface of the dam toward the display area and at least partially overlapping with the conductive layer, and a second inclined portion extending in a direction opposite to the first inclined portion, wherein a shape of the first inclined portion and a shape of the second inclined portion are asymmetric to each other about a center line passing through the top surface of the dam and perpendicular to the top surface of the substrate.

[0008] A first angle of an end of the first inclined portion relative to a top surface of the conductive layer may be smaller than a second angle of an end of the second inclined portion relative to a top surface of the substrate.

[0009] The second inclined portion may include a recessed portion having a first height and an adhesion enhancing portion positioned outside the recessed portion, and wherein the adhesion enhancing portion has a second height equal to or greater than the first height.

[0010] The first inclined portion may have a first inclined angle gentler than a second inclined angle of the second inclined portion, and the second inclined portion may have a stepped shape.

[0011] The dam may have a stack structure including a first layer and a second layer covering a top surface and a side surface of the first layer, and a first inclination angle of the first inclined portion may be gentler than a second inclination angle of the first layer.

[0012] The display device may further include a touch screen layer positioned on the thin film encapsulation layer, and a touch wiring connected to the touch screen layer and extending to the peripheral area, wherein the touch wiring covers the dam.

[0013] The display device may further include an inner dam positioned between the display area and the dam, wherein the inner dam has a first height that is less than a second height of the dam.

[0014] The display device may also include an inorganic insulating layer positioned in the peripheral region and having an opening or a groove, and an organic layer filling at least a portion of the opening or the groove, wherein the substrate has a bending region positioned between the first region and the second region and is bent about a bending axis, wherein the opening or the groove overlaps with the bending region.

[0015] The display device may further include a touch screen layer positioned on the thin film encapsulation layer in the display region, a touch wiring extending from the touch screen layer to an outer edge of the dam, and a connection wiring connected to the touch wiring and positioned on the organic layer.

[0016] The display device may also include a thin film transistor positioned in the display area and including a semiconductor layer, a source electrode, a drain electrode and a gate electrode, and a display device positioned in the display area and including a pixel electrode, an intermediate layer and a relative electrode, wherein the conductive layer is positioned on the same layer as the source electrode or the drain electrode and is electrically connected to the relative electrode.

[0017] The display device may further include a connection conductive layer positioned between the conductive layer and the opposite electrode, wherein the connection conductive layer is formed of the same material as that of the pixel electrode.

[0018] The dam may partially contact the connecting conductive layer.

[0019] The display device may further include a fan-out wiring positioned in a peripheral region on the same layer as the gate electrode, wherein the fan-out wiring partially overlaps the conductive layer.

[0020] According to one or more embodiments, a display device includes a substrate, a thin film encapsulation layer, and a dam, the substrate including a display area displaying an image and a peripheral area positioned around the display area; the thin film encapsulation layer overlaps the display area and includes at least one inorganic film and at least one organic film; and the dam is positioned in the peripheral area and surrounds at least a portion of the display area, wherein the dam includes a first inclined portion extending from a top surface of the dam toward the display area and a second inclined portion extending in a direction opposite to the first inclined portion, wherein the second inclined portion includes a recessed portion having a first height and an adhesion enhancing portion positioned outside the recessed portion and having a second height greater than the first height.

[0021] The display device may further include an interlayer insulating layer positioned between the substrate and the dam and including an inorganic material, wherein ends of the first inclined portion and ends of the second inclined portion contact the interlayer insulating layer, and a shape of the first inclined portion is a mirror image of a shape of the second inclined portion.

[0022] The first inclined portion may have a first inclined angle gentler than a second inclined angle of the second inclined portion, and the second inclined portion may have a stepped shape.

[0023] The display device may further include a conductive layer positioned below the dam and at least partially overlapping a first inclined portion of the dam, wherein the first inclined portion has a first inclined angle gentler than a second inclined angle of the second inclined portion.

[0024] According to one or more embodiments, a mask for manufacturing a display device includes a first pattern corresponding to a first inclined portion, a second pattern corresponding to a top surface of a dam, and a third pattern corresponding to the second inclined portion, wherein the first pattern and the third pattern are different from each other.

[0025] The first pattern may be a half-tone mask pattern, and the third pattern may include the half-tone mask pattern and the full-tone mask pattern which are alternately positioned.

[0026] The third pattern may include a plurality of half-tone mask patterns and a plurality of full-tone mask patterns that are alternately positioned.

[0027] The second pattern may be a full-tone mask pattern, and a portion of the third pattern close to the second pattern may include a half-tone mask pattern, and a portion of the third pattern far from the second pattern may include the full-tone mask pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] These and / or other aspects of the present disclosure will become apparent and more easily understood through the following description of embodiments in conjunction with the accompanying drawings, in which:

[0029] Figure 1 is a plan view of a display device according to an embodiment;

[0030] Figure 2 is along Figure 1 A cross-sectional view taken along line II-I' and line II-II';

[0031] Figure 3 is a cross-sectional view showing a portion of a display device according to an embodiment;

[0032] Figure 4 is shown for use with Figure 3 A diagram of a comparative example for comparing embodiments of the present invention;

[0033] Figure 5 is a cross-sectional view showing a portion of a display device according to another embodiment;

[0034] Fig. 6A is a plan view showing a portion of a mask according to an embodiment;

[0035] Figure 6B is a plan view showing a portion of a mask according to another embodiment;

[0036] Figure 6C is a plan view showing a portion of a mask according to another embodiment;

[0037] Fig.6D is a plan view showing a portion of a mask according to another embodiment;

[0038] Fig. 7A and Figure 7B It is used to describe the manufacturing process Figure 3 A cross-sectional view of a method for displaying a device according to an embodiment of the present invention;

[0039] Figure 7C is shown by using Fig. 7A and Figure 7B A method of manufacturing an image of a portion of a display device;

[0040] Figure 8 is a cross-sectional view showing a portion of a display device according to another embodiment;

[0041] Fig. 9 is a cross-sectional view showing a portion of a display device according to another embodiment;

[0042] Fig.10 is a cross-sectional view showing a portion of a display device according to another embodiment;

[0043] Fig.11 is a cross-sectional view showing a portion of a display device according to another embodiment;

[0044] Fig.12 is a perspective view showing a portion of a display device according to an embodiment; and

[0045] Fig.13 It is shown Fig.12 A cross-sectional view of a portion of a display device. DETAILED DESCRIPTION

[0046] The present disclosure may include various embodiments and modifications, and some of its embodiments will be shown in the accompanying drawings and will be described in detail herein. The effects and features of the present disclosure and the methods attached thereto will become apparent through the following description of the embodiments in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments described below, and may be implemented in various modes and configurations without departing from the scope of the present disclosure.

[0047] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. In the accompanying drawings, like elements are denoted by like reference numerals, and repeated explanation thereof may be omitted.

[0048] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0049] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0050] It should also be understood that the terms “comprises” and / or “comprising” used herein indicate the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0051] It will be understood that when a layer, region or element is referred to as being “formed on” another layer, region or element, it may be directly or indirectly formed on the other layer, region or element. That is, for example, one or more intervening layers, regions or elements may be present.

[0052] For the convenience of explanation, the size of the elements in the drawings may be exaggerated. In other words, since the size and thickness of the elements in the drawings are arbitrarily shown for the convenience of explanation, the present disclosure is not limited thereto.

[0053] It should be understood that when a layer, region, or element is referred to as being "connected," the layer, region, or element may be directly connected or may be indirectly connected with one or more intervening layers, regions, or elements. For example, when a layer, region, or element is electrically connected, the layer, region, or element may be directly electrically connected or may be indirectly electrically connected with one or more intervening layers, regions, or elements.

[0054] Examples of display devices for displaying images may include liquid crystal displays, electrophoretic displays, organic light emitting displays, inorganic electroluminescent (EL) displays, field emission displays, surface conduction electron emitter displays, plasma displays, and cathode ray tube displays.

[0055] Although an organic light emitting display is described as a display device according to some embodiments of the present disclosure, the display device of the present disclosure is not limited thereto and may be any other type of display device.

[0056] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of" when following a list of elements may modify the entire list of elements rather than the individual elements in the list.

[0057] Figure 1 is a plan view of a display device according to an embodiment.

[0058] Reference Figure 1 , the substrate 110 of the display device is divided into a display area DA and a peripheral area PA positioned around the display area DA. In the display area DA, a plurality of pixels PX are positioned and an image is displayed. The plurality of pixels PX may be connected to a scan line and a data line intersecting the scan line. In addition, the plurality of pixels PX may be connected to a plurality of driving voltage lines PL.

[0059] Each of the pixels PX emits, for example, red light, green light, blue light, or white light, and may include, for example, an organic light emitting device (e.g., an organic light emitting diode). In addition, each pixel PX may also include one or more devices, such as a thin film transistor (TFT) and a storage capacitor. The display area DA provides an image by using light emitted from the pixel PX. The pixel PX may refer to a sub-pixel that emits red light, green light, blue light, or white light as described above. In some embodiments, the pixel PX may refer to a combination of two or more sub-pixels.

[0060] The peripheral area PA where no pixel PX is located does not provide an image. The first power supply voltage line 10 and the conductive layer 20 that can be used as the second power supply voltage line can be located in the peripheral area PA to apply different power supply voltages. In addition, a scan driver (not shown) and a pad unit 50 can be located in the peripheral area PA.

[0061] The dam 120 surrounding at least a portion of the display area DA may be positioned in the peripheral area PA. When an organic encapsulation layer (eg, Figure 2 When an organic encapsulation layer 420 is formed in an organic encapsulation layer 420 as shown in FIG. 1 , the dam 120 may protrude from the substrate 110 to block the flow of the organic material.

[0062] like Figure 1 As shown in , the dam 120 may continuously surround the display area DA. However, the present disclosure is not limited thereto, and the dam 120 may be configured, formed and / or positioned in various ways. For example, the dam 120 may partially surround the display area DA, or may surround the display area DA in a dotted line pattern.

[0063] The dam 120 may partially overlap the conductive layer 20. In some embodiments, the dam 120 may cover the outer edge of the conductive layer 20. An inner dam (not shown) positioned in the display area DA and / or an outer dam positioned on the edge of the substrate 110 may also be provided. The inner dam and / or the outer dam may be connected to or spaced apart from the dam 120.

[0064] The first power supply voltage line 10 may be positioned in the peripheral area PA to correspond to the lower portion of the display area DA. In other embodiments, the first power supply voltage line 10 may be positioned in the peripheral area PA to correspond to the side or upper portion of the display area DA. A plurality of driving voltage lines PL for transmitting a driving voltage to a plurality of pixels PX positioned in the display area DA may be connected to the first power supply voltage line 10. The first power supply voltage line 10 may be connected to one or more pads 51 of the pad unit 50.

[0065] The conductive layer 20 may be positioned in the peripheral area PA and may partially surround the display area DA. In some embodiments, the conductive layer 20 may extend along a side other than a side of the display area DA adjacent to the first power supply voltage line 10. However, the present embodiment is not limited thereto, and the conductive layer 20 may be configured, formed and / or positioned in various ways. For example, the conductive layer 20 may correspond to one or both sides of the display area DA. The conductive layer 20 may be connected to one or more pads 52 of the pad unit 50.

[0066] A scan driver (not shown) may be positioned in the peripheral area PA at one or both sides (e.g., the left side, the right side, or both sides) of the display area DA. A scan signal generated by the scan driver may be applied to the pixel PX through a scan line. However, the present disclosure is not limited thereto. The scan driver may not be positioned in the peripheral area PA and may be positioned in a printed circuit board (PCB) or the like.

[0067] The pad unit 50 is positioned in the peripheral area PA and includes a plurality of pads 51, 52, and 53. The pad unit 50 may be exposed without being covered by an insulating layer, and may be electrically connected to a controller (not shown) such as a flexible PCB and a driver integrated circuit (IC) chip. The controller may convert a plurality of external image signals into a plurality of image data signals, and apply the image data signals to the display area DA through the pad unit 50. In addition, the controller may receive other signals including but not limited to a vertical synchronization signal, a horizontal synchronization signal, and a clock signal, may generate a control signal for controlling the operation of a scan driver, and may transmit the control signal to the scan driver through the pad unit 50. The controller may transmit a voltage to the first power supply voltage line 10 and the conductive layer 20 through the pad unit 50. The voltages transmitted to the first power supply voltage line 10 and the conductive layer 20 may be different from each other. The pad unit 50 may be connected to Figure 2 The plurality of fan-out wirings 60 shown in FIG. 1 and may transmit one or more voltages and various signals to the display area DA.

[0068] The first power supply voltage line 10 may supply a first power supply voltage ELVDD to each pixel PX, and the conductive layer 20 may supply a second power supply voltage ELVSS to each pixel PX. For example, the first power supply voltage ELVDD may be supplied to each pixel PX through a driving voltage line PL connected to the first power supply voltage line 10. The second power supply voltage ELVSS may be supplied to an opposite electrode (not shown) of an organic light emitting device of each pixel PX in the peripheral area PA.

[0069] The fan-out wiring 60 may be connected to the pads 51, 52, and 53 of the pad unit 50 and may transmit an electrical signal received from the controller to the display area DA. That is, the fan-out wiring 60 may be connected to the pad unit 50 and may extend to the display area DA.

[0070] Reference Figure 2 and Figure 3 A structure in which elements included in a display device are stacked is described.

[0071] Figure 2 is along Figure 1 Cross-sectional views of the display device taken along lines II' and II-II'. Figure 3 is a cross-sectional view showing a portion of a display device according to an embodiment. In detail, Figure 3 A portion of the display device where the dam 120 is formed is shown.

[0072] The substrate 110 may be formed of any of various materials such as a glass material, a metal material, and a plastic material. According to an embodiment, the substrate 110 may be a flexible substrate and may include a polymer resin such as polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate (PAR), polyimide (PI), polycarbonate (PC), and cellulose acetate propionate (CAP).

[0073] The buffer layer 111 may be positioned on the substrate 110. The buffer layer 111 may reduce or prevent foreign matter, moisture, or external air from penetrating from the bottom of the substrate 110, and may planarize the substrate 110 at the same time. The buffer layer 111 may include an inorganic material such as an oxide and a nitride, an organic material, or a combination of an inorganic material and an organic material. The buffer layer 111 may have a single-layer or multi-layer structure including an inorganic material and an organic material. A barrier layer (not shown) for preventing external air from penetrating may also be provided between the substrate 110 and the buffer layer 111.

[0074] A first TFT T1 including a semiconductor layer SC1, a gate electrode G1, a source electrode S1, and a drain electrode D1, and a second TFT T2 including a semiconductor layer SC2, a gate electrode G2, a source electrode S2, and a drain electrode D2 are positioned on the buffer layer 111. The first TFT T1 may be connected to the organic light emitting device 300, and may be used as a driving TFT for driving the organic light emitting device 300. The second TFT T2 may be connected to the data line DL, and may be used as a switching TFT. However, the present disclosure is not limited thereto. For example, the first TFT T1 may be used as a switching TFT, and the second TFT T2 may be used as a driving TFT. Although in Figure 2 Two TFTs are shown in FIG. 1 , but the present embodiment is not limited thereto, and the number of TFTs included in the pixel PX may be changed in various ways. For example, the number of TFTs included in the pixel PX may be between 2 and 7.

[0075] Each of the semiconductor layers SC1 and SC2 may include amorphous silicon or polycrystalline silicon. In another embodiment, each of the semiconductor layers SC1 and SC2 may include an oxide of at least one material selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). Each of the semiconductor layers SC1 and SC2 may include a source region and a drain region doped with impurities, and a channel region.

[0076] The gate electrodes G1 and G2 are positioned on the semiconductor layers SC1 and SC2, respectively, with the first gate insulating layer 112 interposed therebetween. Each of the gate electrodes G1 and G2 may include molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), and may have a single-layer or multi-layer structure. For example, the gate electrodes G1 and G2 may have a single-layer structure including Mo.

[0077] The first gate insulating layer 112 may include silicon oxide (SiO 2 ), Silicon Nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) and / or zinc oxide (ZnO 2 ).

[0078] The second gate insulating layer 113 may cover the gate electrodes G1 and G2. The second gate insulating layer 113 may include SiO 2 、SiN x 、SiON、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 and / or ZnO 2 .

[0079] A storage capacitor Cst including a first electrode CE1 and a second electrode CE2 may be positioned in the display area DA. The first electrode CE1 of the storage capacitor Cst may overlap the first TFT T1. For example, the gate electrode G1 of the first TFT T1 may serve as the first electrode CE1 of the storage capacitor Cst.

[0080] The second electrode CE2 of the storage capacitor Cst may overlap with the first electrode CE1 with the second gate insulating layer 113 interposed therebetween. In this case, the second gate insulating layer 113 may serve as a dielectric layer of the storage capacitor Cst. The second electrode CE2 may include a conductive material such as Mo, Al, Cu, and Ti, and may have a single-layer or multi-layer structure including the conductive material. For example, the second electrode CE2 may have a single-layer structure including Mo or a multi-layer structure including Mo / Al / Mo.

[0081] although Figure 2 The storage capacitor Cst is shown to overlap with the first TFT T1, but the present disclosure is not limited thereto, and the storage capacitor Cst may be configured, formed and / or positioned in various ways. For example, the storage capacitor Cst may not overlap with the first TFT T1.

[0082] The source electrodes S1 and S2 and the drain electrodes D1 and D2 may be positioned on the interlayer insulating layer 115. Each of the source electrodes S1 and S2 and the drain electrodes D1 and D2 may include a conductive material such as Mo, Al, Cu, and Ti, and may have a single-layer or multi-layer structure including the conductive material. For example, each of the source electrodes S1 and S2 and the drain electrodes D1 and D2 may have a multi-layer structure including Ti / Al / Ti.

[0083] The planarization layer 117 may be positioned on the source electrodes S1 and S2 and the drain electrodes D1 and D2 , and the organic light emitting device 300 may be positioned on the planarization layer 117 .

[0084] The planarization layer 117 may have a flat top surface. The pixel electrode 310 of the organic light-emitting device 300 may be positioned on the planarization layer 117. The pixel electrode 310 positioned on the planarization layer 117 may also have a flat top surface. The planarization layer 117 may have a single-layer or multi-layer structure including an organic material. For example, the planarization layer 117 may include benzocyclobutene (BCB), PI, hexamethyldisiloxane (HMDSO), a general polymer such as polymethyl methacrylate (PMMA) and polystyrene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine-containing polymer, a paraxylene polymer, a vinyl alcohol polymer, and a mixture thereof. In another example, the planarization layer 117 may include an inorganic material such as SiO 2 、SiN x 、SiON、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 and ZnO 2When the planarization layer 117 includes an inorganic material, chemical mechanical polishing may be performed if necessary. The planarization layer 117 may include both an organic material and an inorganic material.

[0085] In the display area DA of the substrate 110, the organic light emitting device 300 may be positioned on the planarization layer 117. The organic light emitting device 300 includes a pixel electrode 310, an intermediate layer 320, and an opposite electrode 330.

[0086] An opening is formed in the planarization layer 117 , through which any one of the source electrode S1 and the drain electrode D1 of the first TFT T1 is exposed, and the pixel electrode 310 contacts the source electrode S1 or the drain electrode D1 through the opening and is electrically connected to the first TFT T1 .

[0087] According to one embodiment, the pixel electrode 310 may be a (semi) light-transmitting electrode or a reflective electrode. In some embodiments, the pixel electrode 310 may include a reflective film formed of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or a compound thereof and a transparent or semi-transparent electrode layer formed on the reflective film. The transparent or semi-transparent electrode layer may include a layer selected from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO), and aluminum zinc oxide (AZO). In some embodiments, the pixel electrode 310 may have a stack structure including ITO / Ag / ITO.

[0088] The pixel defining film 119 may be positioned on the planarization layer 117, and may define the emission area of ​​the pixel PX in the display area DA by having an opening 119OP corresponding to each sub-pixel. The opening 119OP exposes at least the central portion of the pixel electrode 310. In addition, the pixel defining film 119 may prevent arcing, etc., from occurring on the edge of the pixel electrode 310 by increasing the distance between the edge of the pixel electrode 310 and the opposing electrode 330 positioned on the pixel electrode 310. The pixel defining film 119 may be formed of an organic insulating material such as PI, polyamide, acrylic resin, HMDSO, and phenolic resin by using spin coating, etc.

[0089] The spacer 119' may be disposed on the pixel defining film 119. The spacer 119' may protrude from the pixel defining film 119 and may prevent the mask from being damaged during the process of forming the pixel defining film 119. The spacer 119' may be formed of an organic insulating material such as PI, polyamide, acrylic resin, BCB, HMDSO, and phenolic resin by using spin coating, etc. The spacer 119' may be formed integrally with the pixel defining film 119. That is, the spacer 119' and the pixel defining film 119 may be formed simultaneously of the same material by using the same mask process. In this case, the mask may include a full-tone area corresponding to the spacer 119' and a half-tone area corresponding to the pixel defining film 119.

[0090] The intermediate layer 320 of the organic light-emitting device 300 may include an organic emission layer. The organic emission layer may include an organic material including a fluorescent or phosphorescent material that emits red, green, blue, or white light. The organic emission layer may be formed of a low molecular weight organic material or a high molecular weight organic material. Functional layers such as a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL) may be selectively positioned below and / or above the organic emission layer. The intermediate layer 320 may correspond to each of the plurality of pixel electrodes 310. However, the present embodiment is not limited thereto, and the intermediate layer 320 may be positioned in various ways. For example, the intermediate layer 320 may be positioned entirely above the pixel electrode 310 of the pixel PX located in the display area DA.

[0091] The counter electrode 330 may be a light-transmitting electrode or a reflective electrode. In some embodiments, the counter electrode 330 may be a transparent or semi-transparent electrode and may include a metal thin film having lithium (Li), calcium (Ca), lithium fluoride (LiF) / Ca, LiF / Al, Al, Ag, Mg, and / or compounds thereof. In addition, materials such as ITO, IZO, ZnO, and In 2 O 3 The transparent conductive oxide (TCO) film of the display area DA may also be positioned on the metal film. The opposing electrode 330 may be positioned in both the display area DA and the peripheral area PA, and may be positioned on the intermediate layer 320 and the pixel defining film 119. The opposing electrode 330 may be integrally formed in the plurality of organic light emitting devices 300, and may correspond to the pixel electrode 310.

[0092] When the pixel electrode 310 is a reflective electrode and the opposing electrode 330 is a light-transmitting electrode, the light emitted by the intermediate layer 320 may be emitted toward the opposing electrode 330, and the display device may be a top-emitting display device. When the pixel electrode 310 is a transparent or semi-transparent electrode and the opposing electrode 330 is a reflective electrode, the light emitted by the intermediate layer 320 may be emitted toward the substrate 110, and the display device may be a bottom-emitting display device. However, the present embodiment is not limited thereto. The display device of the present embodiment may be a dual-emitting display device that emits light toward the top surface and the bottom surface.

[0093] The thin film encapsulation layer 400 may cover the display area DA and the peripheral area PA, and may prevent penetration of external moisture and oxygen. The thin film encapsulation layer 400 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. Figure 2 The thin film encapsulation layer 400 is shown to include two inorganic encapsulation layers (eg, a first inorganic encapsulation layer 410 and a second inorganic encapsulation layer 430) and one organic encapsulation layer (eg, an organic encapsulation layer 420), but the order in which those layers are stacked and the number of stacked layers are not limited to Figure 2 The example shown in .

[0094] The first inorganic encapsulating layer 410 may cover the opposite electrode 330 and may include silicon oxide, silicon nitride and / or silicon oxynitride. If necessary, another layer such as a cover layer may be positioned between the first inorganic encapsulating layer 410 and the opposite electrode 330. Figure 2 As shown in , since the underlying layer is uneven, the top surface of the first inorganic encapsulation layer 410 may not be flat. The organic encapsulation layer 420 may cover the first inorganic encapsulation layer 410 to have a flat top surface. In detail, the organic encapsulation layer 420 may be formed so that a portion corresponding to the display area DA has a flat top surface. The organic encapsulation layer 420 may include at least one material selected from the group consisting of PET, PEN, PC, PI, polyethylene sulfonate, polyoxymethylene, polyarylate, and HMDSO. The second inorganic encapsulation layer 430 may cover the organic encapsulation layer 420 and may include silicon oxide, silicon nitride, and / or silicon oxynitride.

[0095] Since the thin film encapsulation layer 400 has a multilayer structure including a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430, even when a crack occurs in the thin film encapsulation layer 400, the crack may not be connected between the first inorganic encapsulation layer 410 and the organic encapsulation layer 420 or between the organic encapsulation layer 420 and the second inorganic encapsulation layer 430. Accordingly, a path for external moisture or oxygen to penetrate into the display area DA and the peripheral area PA may be prevented or reduced. The second inorganic encapsulation layer 430 may contact the first inorganic encapsulation layer 410 at an edge outside the display area DA to prevent the organic encapsulation layer 420 from being exposed to the outside.

[0096] The dam 120 may be positioned in the peripheral area PA of the substrate 110. In addition, the conductive layer 20 and the fan-out wiring 60 may be positioned in the peripheral area PA.

[0097] The conductive layer 20 may be used as a wiring for supplying power to the display area DA, and may be formed on the same layer as the source electrodes S1 and S2 and the drain electrodes D1 and D2 by using the same material. The conductive layer 20 may be positioned on the interlayer insulating layer 115. In some embodiments, the conductive layer 20 may be connected to the opposite electrode 330 of the organic light emitting device 300, and may be used as a wiring for supplying the second power supply voltage ELVSS.

[0098] like Figure 2 As shown in , the conductive layer 20 is connected to the opposite electrode 330 via the connecting conductive layer 116. In some embodiments, the connecting conductive layer 116 may extend to the top surface of the first layer 121 of the dam 120. However, the present disclosure is not limited thereto, and the conductive layer 20 may be configured, formed and / or positioned in various ways. For example, the conductive layer 20 may be in direct contact with the opposite electrode 330.

[0099] In some embodiments, the connecting conductive layer 116 and the pixel electrode 310 may be formed simultaneously by using the same material. The connecting conductive layer 116 may include a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, and a transparent or semi-transparent electrode layer formed on the reflective film. The transparent or semi-transparent electrode layer may include a material selected from ITO, IZO, ZnO, In 2 O 3 , IGO and AZO.

[0100] The fan-out wiring 60 may be positioned in the peripheral area PA. The fan-out wiring 60 may include a first fan-out wiring 61 and a second fan-out wiring 63 that may be positioned on different layers. The fan-out wiring 60 may be connected to wirings in the display area DA, and may transmit various electrical signals such as data signals, gate signals, and driving voltages to the display area DA.

[0101] The first fan-out wiring 61 and the gate electrodes G1 and G2 may be positioned on the same layer. That is, the first fan-out wiring 61 may be positioned on the first gate insulating layer 112. The first fan-out wiring 61 and the gate electrodes G1 and G2 may be formed of the same material.

[0102] The second fan-out wiring 63 and the second electrode CE2 of the storage capacitor Cst may be positioned on the same layer. That is, the second fan-out wiring 63 may be positioned on the second gate insulating layer 113. The second fan-out wiring 63 and the second electrode CE2 may be formed of the same material. The second gate insulating layer 113 may be positioned between the first fan-out wiring 61 and the second fan-out wiring 63. In some embodiments, the first fan-out wiring 61 and the second fan-out wiring 63 may overlap each other to reduce space.

[0103] Each of the fan-out wirings 60 may include Mo, Al, Cu, or Ti, and may have a single-layer or multi-layer structure. For example, the fan-out wiring 60 may have a single-layer structure including Mo.

[0104] In some embodiments, the fan-out wiring 60 may partially overlap the conductive layer 20. However, the present embodiment is not limited thereto. The fan-out wiring 60 may not overlap the conductive layer 20 or may completely overlap the conductive layer 20.

[0105] In a process of forming the organic encapsulation layer 420 of the thin film encapsulation layer 400 for sealing the display area DA and the peripheral area PA, the dam 120 may prevent the formation of an edge tail of the organic encapsulation layer 420 by blocking the flow of an organic material toward the edge of the substrate 110 .

[0106] The dam 120 may cover at least a portion of the conductive layer 20 and / or the connected conductive layer 116. In some embodiments, the dam 120 may cover an edge portion of the conductive layer 20 away from the display area DA. The edge portion of the conductive layer 20 close to the display area DA may be covered by the planarization layer 117. Since the edge portion of the conductive layer 20 is covered by the dam 120 and / or the planarization layer 117, the conductive layer 20 may be protected from corrosion that may occur during the process.

[0107] Since the dam 120 covers a portion of the conductive layer 20 , a portion of the dam 120 may contact the conductive layer 20 and / or the connecting conductive layer 116 , and another portion of the dam 120 may contact the interlayer insulating layer 115 .

[0108] The dam 120 may be formed of an organic insulating material such as PI, polyamide, acrylic resin, BCB, HMDSO, and phenolic resin. The dam 120 may be formed of a photosensitive organic material. The adhesion between the organic material of the dam 120 and the conductive layer 20 and / or the conductive material of the connecting conductive layer 116 may be greater than the adhesion between the organic material of the dam 120 and the inorganic material of the interlayer insulating layer 115.

[0109] In the present embodiment, the profile of the dam 120 may be determined to increase adhesion between the dam 120 and a material positioned below the dam 120. That is, the shapes of the inclined portions 120a and 120b of the dam 120 may differ according to the material positioned below the dam 120.

[0110] The dam 120 may include a first inclined portion 120 a extending from a top surface of the dam 120 toward the display area DA and a second inclined portion 120 b extending in an opposite direction to the first inclined portion 120 a .

[0111] In the present embodiment, a portion of the dam 120 including the first inclined portion 120a may contact the conductive layer 20 and / or the connecting conductive layer 116, and a portion of the dam 120 including the second inclined portion 120b may contact the interlayer insulating layer 115. Due to the difference in adhesive force, the shape of the first inclined portion 120a may be different from the shape of the second inclined portion 120b. Figure 3 The shape of the first inclined portion 120 a and the shape of the second inclined portion 120 b are described in detail.

[0112] The dam 120 may include a plurality of layers. In some embodiments, the dam 120 may have a structure in which a first layer 121 and a second layer 123 are stacked. The first layer 121 may be formed of the same material as that of the planarization layer 117, and the second layer 123 may be formed of the same material as that of the pixel definition film 119 and / or the spacer 119'. In this case, the second layer 123 may cover both the top surface and the side surface of the first layer 121. Accordingly, the second layer 123 may be in direct contact with the top surface of the interlayer insulating layer 115 and the top surface of the connecting conductive layer 116.

[0113] although Figure 2 The dam 120 is shown to include a plurality of layers, but in other embodiments, the dam 120 may have a single-layer structure. In this case, the dam 120 may be formed of the same material as that of the planarization layer 117 or the pixel defining film 119.

[0114] Figure 3 is a cross-sectional view showing the dam 120 of the display device according to the embodiment. Figure 4 is shown for use with Figure 3 A cross-sectional view of a comparative example for comparison with the embodiment of FIG. Figure 3 and Figure 4 In, with Figure 2 The same elements as those in FIG. 1 are denoted by the same reference numerals, and thus, repeated explanation thereof may be omitted. Figure 3 , for the sake of simplicity of explanation, the connecting conductive layer 116 is omitted.

[0115] Reference Figure 3The dam 120 includes a first inclined portion 120 a extending from a top surface of the dam 120 to the display area DA and a second inclined portion 120 b extending in a direction opposite to the first inclined portion 120 a .

[0116] In the present embodiment, the first portion A1 including the first inclined portion 120a overlaps the conductive layer 20, and the second portion A2 including the second inclined portion 120b contacts the interlayer insulating layer 115 which may be formed of an inorganic material. In the present embodiment, the shapes of the first inclined portion 120a and the second inclined portion 120b may be different depending on the materials positioned below the first inclined portion 120a and the second inclined portion 120b. In addition, in the present embodiment, the first inclined portion 120a and the second inclined portion 120b may have a sufficiently gentle inclination angle so as not to cause cracks in the inorganic layer and / or wiring positioned on or above the first inclined portion 120a and the second inclined portion 120b.

[0117] Reference Figure 4 In the comparative example, the dam 120' includes the first inclined portion 120'a and the second inclined portion 120'b having the same shape regardless of the material positioned below the dam 120'.

[0118] The dam 120' may include a first layer 121' and a second layer 123', and the second layer 123' may cover both the top surface and the side surface of the first layer 121'. Since the second layer 123' is positioned on the first layer 121', the dam 120' may have a relatively greater height and be Figure 3 The first inclined portion 120'a and the second inclined portion 120'b have a relatively steeper inclination angle compared to the dam 120. The inorganic layer and the wiring may be positioned on or above the dam 120'. If the inorganic layer and the wiring are positioned on the dam 120', the risk of cracks due to their height and steep inclination angle may be high.

[0119] The conductive layer 20 is positioned under the first portion A1' including the first inclined portion 120'a, and the interlayer insulating layer 115 is positioned under the second portion A2' including the second inclined portion 120'b. If the shape of the first inclined portion 120'a and the shape of the second inclined portion 120'b are the same, then Figure 4 As shown in , because the adhesive force between the dam 120 ′ and the conductive layer 20 is greater than the adhesive force between the dam 120 ′ and the interlayer insulating layer 115 , the adhesive force in the first portion A1 ′ may be greater than the adhesive force in the second portion A2 ′.

[0120] Since the adhesive force in the second portion A2' is weak, delamination may occur at the interface between the second portion A2' and the interlayer insulating layer 115. The delamination may cause defects in an inorganic layer and / or wiring that may be formed in a subsequent process.

[0121] Return to reference Figure 3 , the display device according to the present embodiment may include the dam 120 in the peripheral area PA, and the shapes of the first inclined portion 120 a and the second inclined portion 120 b of the dam 120 may be different from each other.

[0122] The conductive layer 20 may be positioned below the first portion A1 of the dam 120 including the first inclined portion 120a, and therefore, the adhesive force between the dam 120 formed of an organic material and the conductive layer 20 may be strong. Accordingly, the first inclined portion 120a of the dam 120 in the first portion A1 may have a gentle inclination angle to prevent cracks from occurring in the inorganic layer and / or wiring positioned on or above the first portion A1. For example, the first angle θ of the end of the first inclined portion 120a relative to the top surface of the substrate 110 or the top surface of the conductive layer 20 is θ 1 1 . 1 The angle may be smaller than the second angle θ of the end of the second inclined portion 120 b relative to the top surface of the substrate 110 or the top surface of the interlayer insulating layer 115. 2 .

[0123] The second portion A2 of the dam 120 including the second inclined portion 120b contacts the interlayer insulating layer 115 positioned below the second portion A2. When the interlayer insulating layer 115 is formed of an inorganic material, the adhesion between the interlayer insulating layer 115 and the dam 120 may be weak, and thus an adhesion enhancing portion 120b2 may be formed on the edge of the second inclined portion 120b.

[0124] In the second inclined portion 120b of the dam 120, a first height h 1 The concave portion 120b1 has a height equal to or greater than the first height h 1 The second height h 2 The adhesion enhancement portion 120b2 may be positioned sequentially away from the display area DA. The second inclined portion 120b may include a recessed portion 120b1 at the middle portion. The recessed portion 120b1 may correspond to a point where the inclination angle of the second inclined portion 120b changes. The height of the second inclined portion 120b may gradually decrease from the top surface of the dam 120 until it reaches the recessed portion 120b1, may gradually increase from the recessed portion 120b1 until it reaches the top surface of the adhesion enhancement portion 120b2, and may gradually decrease from the adhesion enhancement portion 120b2 until it reaches the end of the second inclined portion 120b. The term "height" used herein refers to the height from the top surface of the layer positioned below the dam 120 (i.e., the top surface of the interlayer insulating layer 115).

[0125] A distance d1 measured between a center line CL passing through a center point of the top surface of the dam 120 and perpendicular to the substrate 110 and an end of the first inclined portion 120a may be the same as or similar to a distance d2 measured between the center line CL and an end of the second inclined portion 120b. In a cross-sectional view of the dam 120 taken along a line connecting the display area DA and the peripheral area PA, the center line CL may pass through a center point of the top surface of the dam 120 and be perpendicular to the top surface of the substrate 110.

[0126] Accordingly, the second angle θ of the end of the second inclined portion 120 b relative to the top surface of the substrate 110 or the top surface of the interlayer insulating layer 115 is 2 The angle may be greater than a first angle θ between the end of the first inclined portion 120 a and the top surface of the substrate 110 or the top surface of the conductive layer 20. 1 .

[0127] Since the second inclined portion 120b of the dam 120 includes the adhesion enhancing portion 120b2, the adhesion between the second inclined portion 120b and the interlayer insulating layer 115 can be increased. In addition, since the second inclined portion 120b has a curved or stepped shape due to the recessed portion 120b1, cracks can be prevented from occurring in the inorganic layer and / or wiring located on or above the second inclined portion 120b.

[0128] The dam 120 may include a first layer 121 and a second layer 123. The first layer 121 may cover a portion of the conductive layer 20. The second layer 123 may cover both the top surface and the side surface of the first layer 121. In this case, since the end of the second layer 123 is in direct contact with the conductive layer 20 and the interlayer insulating layer 115, the profile of the second layer 123 may correspond to the profile of the dam 120. The angle θ between the inclined portion of the first layer 121 close to the display area DA and the inclined portion of the first layer 121 away from the display area DA with respect to the top surface of the underlying layer is a and θ b The angle θ of the inclined portion of the first layer 121 relative to the top surface of the underlying layer is a and θ b The second angle θ of the end of the second inclined portion 120b may be 2 Basically the same.

[0129] Figure 5 is a cross-sectional view showing a portion of a display device according to another embodiment. Figure 5 In, with Figure 3 The same elements as those in FIG. 1 are denoted by the same reference numerals, and thus, repeated explanation thereof may be omitted.

[0130] Reference Figure 5, the display device according to the present embodiment may include the dam 120 positioned in the peripheral area PA, and the shapes of the first inclined portion 120a and the second inclined portion 120b of the dam 120 may be different from each other.

[0131] The dam 120 includes a first inclined portion 120 a and a second inclined portion 120 b . A first portion A1 including the first inclined portion 120 a contacts the conductive layer 20 , and a second portion A2 including the second inclined portion 120 b contacts the interlayer insulating layer 115 .

[0132] The first angle θ of the end of the first inclined portion 120a of the dam 120 relative to the top surface of the substrate 110 or the top surface of the conductive layer 20 is 1 The angle may be smaller than the second angle θ of the end of the second inclined portion 120 b relative to the top surface of the substrate 110 or the top surface of the interlayer insulating layer 115. 2 .

[0133] In the second inclined portion 120b of the dam 120, a first height h 1 The recessed portion 120b1 has a height substantially equal to the first height h 1 The second height h 2 The adhesion reinforcing portion 120b2 may be sequentially positioned away from the display area DA. The second inclined portion 120b may include a recessed portion 120b1 at a middle portion. The recessed portion 120b1 may correspond to a point at which an inclination angle of the second inclined portion 120b changes.

[0134] As described below, in order to form the recessed portion 120b1 and the adhesion enhancing portion 120b2 of the second inclined portion 120b, a half-tone mask pattern and a full-tone mask pattern may be used, and then a curing process may be performed. In this case, since the degree of reflow of the organic material may vary according to the conditions of the curing process, in some embodiments, the first height h of the recessed portion 120b1 is 1 and the second height h of the adhesion enhancing portion 120b2 2 can be formed to be substantially the same. However, even in this case, the first angle θ 1 and the second angle θ 2 They may also differ from each other to a certain extent.

[0135] In the present embodiment, the height of the second inclined portion 120b may gradually decrease from the top surface of the dam 120 until reaching the recessed portion 120b1, may be substantially constant from the recessed portion 120b1 until reaching the top surface of the adhesion enhancing portion 120b2, and may gradually decrease from the adhesion enhancing portion 120b2 until reaching the end of the second inclined portion 120b. The term "height" used herein refers to the height from the top surface of the layer positioned below the dam 120 (i.e., the top surface of the interlayer insulating layer 115).

[0136] A distance d1 measured between a center line CL passing through a center point of the top surface of the dam 120 and perpendicular to the substrate 110 and an end of the first inclined portion 120a may be the same as or similar to a distance d2 measured between the center line CL and an end of the second inclined portion 120b. In a cross-sectional view of the dam 120 taken along a line connecting the display area DA and the peripheral area PA, the center line CL may pass through a center point of the top surface of the dam 120 and be perpendicular to the top surface of the substrate 110.

[0137] Accordingly, the second angle θ of the end of the second inclined portion 120 b relative to the top surface of the substrate 110 or the top surface of the interlayer insulating layer 115 is 2 The angle may be greater than a first angle θ between the end of the first inclined portion 120 a and the top surface of the substrate 110 or the top surface of the conductive layer 20. 1 .

[0138] Since the second inclined portion 120b of the dam 120 includes the adhesion enhancing portion 120b2, the adhesion between the second inclined portion 120b and the interlayer insulating layer 115 can be improved. In addition, since the second inclined portion 120b has a stepped shape due to the recessed portion 120b1, cracks can be prevented from occurring in the inorganic layer and / or wiring located on or above the second inclined portion 120b.

[0139] The dam 120 may include a first layer 121 and a second layer 123. The first layer 121 may cover a portion of the conductive layer 20. The second layer 123 may cover both the top surface and the side surface of the first layer 121. In this case, since the end of the second layer 123 is in direct contact with the conductive layer 20 and the interlayer insulating layer 115, the profile of the second layer 123 may correspond to the profile of the dam 120. The angle θ between the inclined portion of the first layer 121 close to the display area DA and the inclined portion of the first layer 121 away from the display area DA with respect to the top surface of the underlying layer is a and θ b The angle θ of the inclined portion of the first layer 121 relative to the top surface of the underlying layer is a and θ b The second angle θ of the second inclined portion 120b may be 2 Basically the same.

[0140] FIG. 6A to FIG. 6D is a plan view showing a portion of a mask for manufacturing a display device according to various embodiments.

[0141] Reference FIG. 6A to FIG. 6D The masks M1, M2, M3 and M4 include a first inclined portion 120a for forming the dam 120 (see Figure 3), a first mask pattern MP1 for forming a central portion of the dam 120, and a third mask pattern MP3 for forming the second inclined portion 120b.

[0142] The first mask pattern MP1 may be a half-tone mask pattern. The first mask pattern MP1 may overlap a portion of the conductive layer 20. The half-tone mask pattern may be a semi-transmissive portion and may partially transmit and partially shield light during an exposure process. The partially transmitted light through the first mask pattern MP1 may cure the photosensitive organic material of the dam 120 to form a gentle tilt angle.

[0143] The second mask pattern MP2 is positioned beside the first mask pattern MP1 away from the display area DA and may be used to form a central portion of the dam 120. The second mask pattern MP2 may shield or expose the central portion of the dam 120 during an exposure process according to the characteristics of a photosensitive organic material used to form the dam 120. When the dam 120 is formed of a positive photosensitive organic material, the second mask pattern MP2 may be a full-tone mask pattern. When the dam 120 is formed of a negative photosensitive organic material, the second mask pattern MP2 may be a light-transmitting portion.

[0144] The third mask pattern MP3 is positioned beside the second mask pattern MP2 away from the display area DA and can be used to form the second inclined portion 120b. The third mask pattern MP3 can be formed by alternately positioning the first pattern and the second pattern having different transmittances. For example, when the dam 120 is formed of a positive photosensitive organic material, the third mask pattern MP3 can be formed by alternately placing a halftone mask pattern and a fulltone mask pattern. Accordingly, the amount of photosensitive organic material remaining in the area corresponding to the third mask pattern MP3 is greater than the amount of photosensitive organic material remaining in the area corresponding to the first mask pattern MP1. Accordingly, the second inclined portion 120b may have a greater inclination angle and / or height than the inclination angle and / or height of the first inclined portion 120a.

[0145] Reference Fig. 6A , the third mask pattern MP3 includes a first pattern MP31 and a second pattern MP32 sequentially positioned in the direction "a" from the second mask pattern MP2. The first pattern MP31 may be a half-tone mask pattern, and the second pattern MP32 may be a full-tone mask pattern. Fig. 6A The widths of the first pattern MP31 and the second pattern MP32 are shown to be the same, but the present disclosure is not limited thereto. The width of the second pattern MP32 may vary to increase the adhesion between the materials of the underlying layers. In some embodiments, the width of the second pattern MP32 may be in the range of about 2 μm to about 10 μm. In some embodiments, the width of the first pattern MP31 may be in the range of about 5 μm to about 13 μm.

[0146] Reference Figure 6B The third mask pattern MP3 includes a first pattern MP31, a second pattern MP32, a first pattern MP31, and a second pattern MP32 sequentially positioned in the direction "a" from the second mask pattern MP2. The first pattern MP31 may be a half-tone mask pattern, and the second pattern MP32 may be a full-tone mask pattern.

[0147] Reference Figure 6C , the third mask pattern MP3 includes a first pattern MP31 and a third pattern MP33 positioned in direction "a" from the second mask pattern MP2. The first pattern MP31 may be a halftone mask pattern. The third pattern MP33 may include a plurality of halftone mask patterns and a plurality of full-tone mask patterns alternately positioned in a direction "b" intersecting the direction "a".

[0148] Reference Fig.6D The third mask pattern MP3 includes a third pattern MP33 disposed in direction "a" from the second mask pattern MP2. The third pattern MP33 may include a plurality of halftone mask patterns and a plurality of fulltone mask patterns alternately positioned in direction "b" intersecting direction "a".

[0149] Fig. 7A and Figure 7B It is used to describe the manufacturing process Figure 3 A cross-sectional view of a method for displaying a device according to an embodiment of the present invention. Figure 7C is shown by using Fig. 7A and Figure 7B A method of manufacturing an image of a portion of a display device.

[0150] Reference Fig. 7A , by using Fig. 6A The photosensitive organic material PR is patterned using a mask M1.

[0151] First, the first layer 121 of the dam 120 is formed on the interlayer insulating layer 115 to cover the edge of the conductive layer 20 .

[0152] Next, after applying the photosensitive organic material PR onto the interlayer insulating layer 115 to cover the first layer 121, an exposure and development process is performed by using the mask M1. In one embodiment, the photosensitive organic material PR may be a positive photosensitive organic material. The amount of the remaining photosensitive organic material may vary according to the amount of light exposed to the photosensitive organic material during the exposure process. That is, the amount of the remaining photosensitive organic material PR in the region corresponding to the first pattern MP31 of the first mask pattern MP1 and the third mask pattern MP3 may be less than the amount of the remaining photosensitive organic material PR in the region corresponding to the second pattern MP32 of the second mask pattern MP2 and the third mask pattern MP3.

[0153] Reference Figure 7B , the patterned photosensitive organic material PR is cured by a curing process. The curing process may be performed by heating for a predetermined period of time. During the curing process, the photosensitive organic material PR may flow back. Due to the backflow of the photosensitive organic material PR, the shape of the second layer 123 of the dam 120 may change, and the degree of change may depend on the amount of the remaining photosensitive organic material PR. For example, the first angle θ of the first inclined portion 120a is 1 may be smaller than the second angle θ of the second inclined portion 120b. 2 .

[0154] Figure 7C is shown by using Fig. 7A and Figure 7B A method for manufacturing a display device for displaying an image of a portion of the device. In detail, Figure 7C is an enlarged image showing the dam 120 .

[0155] Reference Figure 7C The dam 120 includes a first inclined portion 120a and a second inclined portion 120b. The first angle θ of the first inclined portion 120a 1 smaller than the second angle θ of the second inclined portion 120b 2 In addition, the dam 120 includes a recessed portion 120b1 and an adhesion enhancing portion 120b2 positioned outside the recessed portion 120b1. The second height h of the adhesion enhancing portion 120b2 is 2 is greater than the first height h of the recessed portion 120b1 1 This structure may increase adhesion even when an inorganic insulating layer is positioned below the dam 120 , and may prevent cracks from occurring in the inorganic layer and / or wiring positioned on or over the dam 120 .

[0156] Figure 8 is a cross-sectional view showing a portion of a display device according to another embodiment. Figure 8 In, with Figure 3 The same elements as those in FIG. 1 are denoted by the same reference numerals, and thus repeated explanation thereof may be omitted.

[0157] Reference Figure 8 , the display device according to the present embodiment may include the dam 120 positioned in the peripheral area PA, and the dam 120 may not be in contact with the conductive layer 20. For example, the interlayer insulating layer 115 formed of only an inorganic material may be positioned below the dam 120. In this case, the shapes of the first inclined portion 120a and the second inclined portion 120b of the dam 120 may be mirror images of each other.

[0158] The first and second inclined portions 120a and 120b of the dam 120 may include recessed portions 120a1 and 120b1 and adhesion enhancing portions 120a2 and 120b2 positioned outside the recessed portions 120a1 and 120b1. The adhesion enhancing portions 120a2 and 120b2 have a first height h equal to or greater than the recessed portions 120a1 and 120b1. 1 The second height h 2 .

[0159] The dam 120 may include a first layer 121 and a second layer 123. The first layer 121 may cover a portion of the interlayer insulating layer 115. The second layer 123 may cover both the top surface and the side surface of the first layer 121. In this case, since an end of the second layer 123 is in direct contact with the interlayer insulating layer 115, the profile of the second layer 123 may correspond to the profile of the dam 120.

[0160] Since the dam 120 has a curved or stepped portion due to the recessed portions 120a1 and 120b1, cracks may be prevented from occurring in an inorganic layer and / or wiring positioned on or over the dam 120. Since the adhesion reinforcing portions 120a2 and 120b2 are positioned outside the recessed portions 120a1 and 120b1, adhesion between the dam 120 and the interlayer insulating layer 115 formed of an inorganic material and positioned below the dam 120 may be increased.

[0161] Fig. 9 is a cross-sectional view showing a portion of a display device according to another embodiment. Fig. 9 In, with Figure 2 The same elements in FIG. 1 are denoted by the same reference numerals, and thus repeated explanation thereof may be omitted.

[0162] Reference Fig. 9 , the display device according to the embodiment may include the dam 120 positioned in the peripheral area PA, and the shapes of the first and second inclined portions 120 a and 120 b of the dam 120 may vary according to the material positioned under the dam 120 .

[0163] In this embodiment, the end of the first inclined portion 120a may contact the conductive layer 20, and the end of the second inclined portion 120b may contact the interlayer insulating layer 115. In this case, the end of the first inclined portion 120a is at a first angle θ relative to the top surface of the conductive layer 20. 1 The angle between the end of the second inclined portion 120 b and the top surface of the interlayer insulating layer 115 may be smaller than the second angle θ 2 .

[0164] The second inclined portion 120b may include a recessed portion 120b1 and an adhesion reinforcing portion 120b2 positioned outside the recessed portion 120b1 and having a height equal to or greater than that of the recessed portion 120b1. Accordingly, adhesion with the interlayer insulating layer 115 formed of an inorganic insulating layer may be increased.

[0165] In the present embodiment, the display device may further include a touch screen layer 700 positioned on the thin film encapsulation layer 400. A cover layer (not shown) protecting the touch screen layer 700 may be positioned on the touch screen layer 700.

[0166] When the mutual capacitance between the touch electrodes 710 of the touch screen layer 700 changes when the cover layer (not shown) is touched, the touch screen layer 700 can detect the change in mutual capacitance by using, for example, a capacitive sensing method, and can determine the touch position. Alternatively, the touch screen layer 700 can detect the change in mutual capacitance and can determine the touch position by using any of a variety of other sensing methods.

[0167] The touch screen layer 700 according to the embodiment may have a structure in which a first touch conductive layer 711 , a first insulating layer 712 , a second touch conductive layer 713 , and a second insulating layer 714 are sequentially stacked. The touch electrode 710 may include the first touch conductive layer 711 , and the second touch conductive layer 713 .

[0168] In some embodiments, the second touch conductive layer 713 may be used as a sensor for detecting a position of a touch input, and the first touch conductive layer 711 may be used as a connector for connecting the second touch conductive layer 713 in one direction.

[0169] In some embodiments, both the first touch conductive layer 711 and the second touch conductive layer 713 may be used as sensors. For example, the first insulating layer 712 may include a through hole exposing the top surface of the first touch conductive layer 711, and the first touch conductive layer 711 and the second touch conductive layer 713 may be connected to each other through the through hole. Because the first touch conductive layer 711 and the second touch conductive layer 713 are connected to each other, the resistance of the touch electrode 710 may be reduced, and the response speed of the touch screen layer 700 may be improved.

[0170] In some embodiments, the touch electrode 710 may have a mesh structure through which light emitted from the organic light emitting device 300 may pass. In this case, the first touch conductive layer 711 and the second touch conductive layer 713 of the touch electrode 710 may be positioned so as not to overlap with the emission region of the organic light emitting device 300.

[0171] Each of the first touch conductive layer 711 and the second touch conductive layer 713 may be a single-layer film or a multi-layer film formed of a conductive material having high conductivity. For example, each of the first touch conductive layer 711 and the second touch conductive layer 713 may include a transparent conductive layer, Al, Cu and / or Ti. The transparent conductive layer may include a transparent conductive oxide such as ITO, IZO, ZnO and indium tin zinc oxide (ITZO). The transparent conductive layer may include a conductive polymer such as poly (3,4-ethylenedioxythiophene) (PEDOT), metal nanowires and graphene. In some embodiments, each of the first touch conductive layer 711 and the second touch conductive layer 713 may have a stacked structure including Ti / Al / Ti.

[0172] Each of the first insulating layer 712 and the second insulating layer 714 may be formed of an inorganic material or an organic material. The inorganic material may include at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride. The organic material may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, and perylene resin.

[0173] Despite Fig. 9 Although not shown in the figure, a touch buffer layer may be further provided between the thin film encapsulation layer 400 and the touch screen layer 700. The touch buffer layer may prevent the thin film encapsulation layer 400 from being damaged, and may block interference signals that may be generated when the touch screen layer 700 operates. The touch buffer layer may include an inorganic material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, and titanium nitride, or an organic material such as PI, polyester, and acrylic, and may have a structure in which multiple layers of the above materials are stacked.

[0174] The touch buffer layer and / or the touch screen layer 700 may be directly formed on the thin film encapsulation layer 400 by using a deposition process, etc. In this case, it may not be necessary to form an adhesive layer on the thin film encapsulation layer 400. Therefore, the thickness of the display device may be reduced.

[0175] The touch wiring 720 may be connected to the touch electrode 710 and may extend from the top of the thin film encapsulation layer 400 to the peripheral area PA along the side surface of the thin film encapsulation layer 400. The touch wiring 720 may also extend along the shape of the side and top surfaces of the dam 120. In some embodiments, the touch wiring 720 may cover the dam 120.

[0176] The touch wiring 720 may be formed simultaneously with the first touch conductive layer 711, the second touch conductive layer 713, or both by using the same material. The touch wiring 720 may be a single layer film or a multilayer film formed of a conductive material including a transparent conductive layer, Al, Cu, and / or Ti.

[0177] In this embodiment, since the first inclined portion 120a of the dam 120 has a gentle inclination angle and the second inclined portion 120b has a curved shape due to the recessed portion 120b1, defects such as cracks and disconnections may be prevented from occurring in the touch wiring 720 covering the dam 120.

[0178] Fig.10 is a cross-sectional view showing a portion of a display device according to another embodiment. Fig.10 In, with Figure 2 The same elements as those in FIG. 1 are denoted by the same reference numerals, and thus repeated explanation thereof may be omitted.

[0179] Reference Fig.10 , the display device according to the embodiment may include the dam 120 positioned in the peripheral area PA, and the shapes of the first and second inclined portions 120 a and 120 b of the dam 120 may vary according to the material positioned under the dam 120 .

[0180] In this embodiment, the end of the first inclined portion 120a may contact the conductive layer 20, and the end of the second inclined portion 120b may contact the interlayer insulating layer 115. In this case, the end of the first inclined portion 120a is at a first angle θ relative to the top surface of the conductive layer 20. 1 The angle between the end of the second inclined portion 120 b and the top surface of the interlayer insulating layer 115 may be smaller than the second angle θ 2 .

[0181] The second inclined portion 120b may include a recessed portion 120b1 and an adhesion reinforcing portion 120b2 positioned outside the recessed portion 120b1 and having a height equal to or greater than that of the recessed portion 120b1. Accordingly, adhesion with the interlayer insulating layer 115 formed of an inorganic insulating layer may be increased.

[0182] In the present embodiment, the display device may further include an inner dam 125. The inner dam 125 may be spaced apart from the dam 120 and may be positioned adjacent to the display area DA. The inner dam 125 and the pixel defining film 119 and / or the spacer 119' may be formed simultaneously by using the same material. The height of the inner dam 125 may be less than the height of the dam 120. Both ends of the inner dam 125 may overlap with the conductive layer 20. The connecting conductive layer 116 may be positioned between the inner dam 125 and the conductive layer 20.

[0183] Although not in Fig.10 1, but an outer dam (not shown) may be further provided outside the dam 120. Since a plurality of dams such as the dam 120 and the inner dam 125 are provided, the flow of the organic encapsulating layer 420 may be more effectively blocked.

[0184] Fig.11 is a cross-sectional view showing a portion of a display device according to another embodiment. Fig.11 In, with Figure 2 The same elements as those in FIG. 1 are denoted by the same reference numerals, and thus repeated explanation thereof may be omitted.

[0185] Reference Fig.11 The display device according to the embodiment may further include an inorganic protective layer PVX. The inorganic protective layer PVX may be disposed on the interlayer insulating layer 115 to cover the data line DL, the source electrodes S1 and S2, and the drain electrodes D1 and D2.

[0186] The inorganic protective layer PVX can be made of silicon nitride (SiN x ) and / or silicon oxide (SiO x ) is a single-layer film or a multi-layer film formed by the inorganic protective layer PVX. The inorganic protective layer PVX can cover and protect the exposed wiring in the peripheral area PA. Part of the wiring and / or the conductive layer 20 formed in the same process as the data line DL may be exposed in a portion of the substrate 110 (for example, a portion of the peripheral area PA). The exposed portion of the wiring and / or the conductive layer 20 may be damaged by the etchant used when patterning the pixel electrode 310. Since the inorganic protective layer PVX covers the data line DL and at least some of the wiring formed simultaneously with the data line DL, the wiring and / or the conductive layer 20 can be prevented from being damaged in the process of patterning the pixel electrode 310.

[0187] In this embodiment, the inorganic protective layer PVX may expose a portion of the conductive layer 20. The conductive layer 20 may function as a second power supply voltage line and may be connected to the opposite electrode 330. In one embodiment, the opposite electrode 330 may be connected to the conductive layer 20 through the connecting conductive layer 116.

[0188] Fig.12 is a perspective view showing a portion of a display device according to an embodiment. Fig.13 It is shown Fig.12 A cross-sectional view of a portion of a display device. Fig.13 In, with Fig. 9 The same elements as those in FIG. 1 are denoted by the same reference numerals, and thus repeated explanation thereof may be omitted.

[0189] like Fig.12 As shown in , a portion of the substrate 110 included in the display device may be bent. Fig.12 As shown in FIG. 1 , the substrate 110 has a curved region BA extending in a first direction (eg, +y direction). The curved region BA is positioned between the first region 1A and the second region 2A in a second direction (eg, +x direction) intersecting the first direction. Fig.12As shown in , the substrate 110 may be bent about a bending axis BAX extending in a first direction (eg, +y direction).

[0190] Reference Fig.13 , the buffer layer 111 may extend over the first region 1A, the bending region BA, and the second region 2A. Each of the first gate insulating layer 112, the second gate insulating layer 113, and the interlayer insulating layer 115 may have an opening corresponding to the bending region BA. The buffer layer 111, the first gate insulating layer 112, the second gate insulating layer 113, and the interlayer insulating layer 115, each of which includes an inorganic material, may be collectively referred to as an inorganic insulating layer. The inorganic insulating layer including the buffer layer 111, the first gate insulating layer 112, the second gate insulating layer 113, and the interlayer insulating layer 115 may include a groove corresponding to the bending region BA. The groove may include the top surface of the buffer layer 111 and the openings of the first gate insulating layer 112, the second gate insulating layer 113, and the interlayer insulating layer 115. The inorganic insulating layer may include a groove having any of various other shapes. For example, a portion of the top surface of the buffer layer 111 in a direction (eg, +z direction) may be removed, and a bottom surface of the first gate insulating layer 112 in a direction (eg, −z direction) may remain without being removed.

[0191] The groove may overlap the bending area BA. In this case, the area of ​​the groove may be larger than the area of ​​the bending area BA. Fig.13 In the embodiment, the width GW of the groove may be greater than the width of the bending area BA.

[0192] The display device according to the present embodiment includes an organic layer 160 filling at least a portion of the groove of the inorganic insulating layer. The connection wiring 215 may extend from the first region 1A to the second region 2A through the bending region BA and may overlap the organic layer 160. The connection wiring 215 may also extend to overlap an inorganic insulating layer such as an interlayer insulating layer 115.

[0193] For convenience, Fig.13 FIG. 4 shows a state where the display device is before being bent, and FIG. Fig.12 As shown in , the display device according to the present embodiment may be in a state where the substrate 110 and the like are actually bent in the bending area BA. Fig.13 As shown in , the display device may be initially manufactured in a state where the substrate 110 is substantially flat, and may be subsequently bent by bending the substrate 110 in the bending area BA, etc. In this case, when the substrate 110, etc. is bent, tensile stress may be applied to the connection wiring 215. The groove of the inorganic insulating layer and the organic layer 160 may prevent or reduce the occurrence of defects in the connection wiring 215 during the bending process.

[0194] The connection wiring 215 may be formed of the same material as that of the data line DL, the source electrodes S1 and S2, and the drain electrodes D1 and D2. In some embodiments, the connection wiring 215 may be connected to the touch wiring 720 in the first region 1A, and may be used as a wiring for transmitting / receiving electrical signals to / from the touch screen layer 700. The connection wiring 215 may be connected to the lower wiring 213 positioned on a different layer through a contact hole in the second region 2A. The lower wiring 213 may be connected to the pad unit 50, and may transmit / receive electrical signals to / from the connection wiring 215.

[0195] Since the touch wiring 720 is positioned on the thin film encapsulation layer 400 , the touch wiring 720 may be connected to the connection wiring 215 through a contact hole that may be formed in an end portion of the thin film encapsulation layer 400 .

[0196] As described above, the display device according to one or more embodiments includes the dam having a gentle inclination angle and a profile to increase adhesion between a conductive layer and an inorganic insulating layer, thereby ensuring high reliability.

[0197] It should be noted that one or more effects described herein do not limit the scope of the present disclosure.

[0198] Although one or more embodiments of the present disclosure have been described with reference to the drawings, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the present disclosure as defined in the following claims.

Claims

1. A display device, comprising: a substrate including a display area displaying an image and a peripheral area positioned around the display area; a thin film encapsulation layer, the thin film encapsulation layer overlaps the display area and includes at least one inorganic film and at least one organic film; a conductive layer positioned in the peripheral region and surrounding at least a portion of the display region; a dam, the dam at least partially overlapping an outer edge of the conductive layer; as well as an interlayer insulating layer positioned between the substrate and the dam and including an inorganic material, wherein the dam includes a first inclined portion extending from a top surface of the dam toward the display area and at least partially overlapping the conductive layer, and a second inclined portion extending in a direction opposite to the first inclined portion and contacting the interlayer insulating layer, wherein the second inclined portion comprises a recessed portion having a first height and an adhesion enhancing portion positioned outside the recessed portion, wherein the adhesion enhancing portion has a second height equal to or greater than the first height, and The shape of the first inclined portion and the shape of the second inclined portion are different from each other.

2. The display device according to claim 1, wherein: The shape of the first inclined portion and the shape of the second inclined portion are asymmetrical to each other about a center line passing through the top surface of the dam and perpendicular to a top surface of the substrate.

3. The display device according to claim 1, wherein: A first angle of an end of the first inclined portion relative to a top surface of the conductive layer is smaller than a second angle of an end of the second inclined portion relative to the top surface of the substrate.

4. The display device according to claim 1, wherein: The first inclined portion has a first inclination angle that is gentler than a second inclination angle of the second inclined portion, and the second inclination portion has a step shape.

5. The display device according to claim 1, wherein: The dam has a stacked structure including a first layer and a second layer covering a top surface and a side surface of the first layer, and a first inclination angle of the first inclined portion is gentler than a second inclination angle of the first layer.

6. The display device according to claim 1, further comprising: a touch screen layer, the touch screen layer being positioned on the thin film encapsulation layer; as well as touch wiring, the touch wiring is connected to the touch screen layer and extends to the peripheral area, Wherein, the touch wiring covers the dam.

7. The display device according to claim 1, further comprising: an inner dam positioned between the display area and the dam, Wherein, the inner dam has a first height that is smaller than a second height of the dam.

8. The display device according to claim 1, further comprising: an inorganic insulating layer positioned in the peripheral region and having an opening or a groove; as well as an organic layer, the organic layer filling at least a portion of the opening or the groove, wherein the substrate has a bending region positioned between the first region and the second region and is bent about a bending axis, Wherein, the opening or the groove overlaps with the bending area.

9. The display device according to claim 8, further comprising: a touch screen layer, the touch screen layer being positioned on the thin film encapsulation layer in the display area; a touch wiring extending from the touch screen layer to an outer edge of the dam; as well as A connection wiring is connected to the touch wiring and is positioned on the organic layer.

10. The display device according to claim 1, further comprising: a thin film transistor positioned in the display area and comprising a semiconductor layer, a source electrode, a drain electrode, and a gate electrode; as well as a display device positioned in the display area and comprising a pixel electrode, an intermediate layer and an opposing electrode, The conductive layer is located on the same layer as the source electrode or the drain electrode and is electrically connected to the opposite electrode.

11. The display device according to claim 10, further comprising: a connecting conductive layer positioned between the conductive layer and the opposing electrode, Wherein, the connecting conductive layer is formed of the same material as that of the pixel electrode.

12. The display device according to claim 11, wherein: The dam partially contacts the connecting conductive layer.

13. The display device according to claim 10, further comprising: a fan-out wiring positioned in the peripheral region on the same layer as the gate electrode, The fan-out wiring partially overlaps with the conductive layer.

14. A display device, comprising: a substrate including a display area displaying an image and a peripheral area positioned around the display area; a thin film encapsulation layer, the thin film encapsulation layer overlaps the display area and includes at least one inorganic film and at least one organic film; a dam positioned in the peripheral region and surrounding at least a portion of the display region; as well as an interlayer insulating layer positioned between the substrate and the dam and including an inorganic material, wherein the dam includes a first inclined portion extending from a top surface of the dam toward the display area and a second inclined portion extending in a direction opposite to the first inclined portion and contacting the interlayer insulating layer, The second inclined portion includes a recessed portion having a first height and an adhesion enhancing portion located outside the recessed portion and having a second height greater than the first height.

15. The display device according to claim 14, in, An end portion of the first inclined portion and an end portion of the second inclined portion are in contact with the interlayer insulating layer, and a shape of the first inclined portion is a mirror image of a shape of the second inclined portion.

16. The display device according to claim 14, wherein: The first inclined portion has a first inclination angle that is gentler than a second inclination angle of the second inclined portion, and the second inclination portion has a step shape.

17. The display device according to claim 14, further comprising: a conductive layer positioned below the dam and at least partially overlapping the first inclined portion of the dam, The first inclined portion has a first inclined angle that is gentler than a second inclined angle of the second inclined portion.

18. A mask for manufacturing a display device, wherein: The display device comprises: a substrate including a display area displaying an image and a peripheral area positioned around the display area; a thin film encapsulation layer, the thin film encapsulation layer overlaps the display area, and comprising at least one inorganic film and at least one organic film; a conductive layer positioned in the peripheral region and surrounding at least a portion of the display region; a dam at least partially overlapping an outer edge of the conductive layer; and an interlayer insulating layer positioned between the substrate and the dam and including an inorganic material, wherein the dam includes a first inclined portion extending from a top surface of the dam toward the display area and at least partially overlapping the conductive layer, and a second inclined portion extending in a direction opposite to the first inclined portion and contacting the interlayer insulating layer, wherein the second inclined portion comprises a recessed portion having a first height and an adhesion enhancing portion positioned outside the recessed portion, wherein the adhesion enhancing portion has a second height equal to or greater than the first height, wherein the shape of the first inclined portion and the shape of the second inclined portion are different from each other, and Wherein, the mask comprises: a first pattern, the first pattern corresponding to the first inclined portion; a second pattern corresponding to a top surface of the dam; and a third pattern, the third pattern corresponding to the second inclined portion, Wherein, the first pattern and the third pattern are different from each other.

19. The mask of claim 18, wherein: The shape of the first inclined portion and the shape of the second inclined portion are asymmetrical to each other about a center line passing through the top surface of the dam and perpendicular to a top surface of the substrate.

20. The mask of claim 18, wherein: The first pattern is a half-tone mask pattern, and Wherein, the third pattern includes the half-tone mask pattern and the full-tone mask pattern positioned alternately.

21. The mask of claim 20, wherein: The third pattern includes a plurality of half-tone mask patterns and a plurality of full-tone mask patterns that are alternately positioned.

22. The mask of claim 18, wherein: The second pattern is a full-tone mask pattern, and A portion of the third pattern close to the second pattern includes a half-tone mask pattern, and a portion of the third pattern far from the second pattern includes a full-tone mask pattern.

Images