A packaging substrate

Abstract

The present disclosure relates to a packaging carrier, which is used to carry a packaging body, and includes: a carrier sheet and a medium thinner than the carrier sheet, wherein a portion of the carrier sheet belongs to a first area where the medium is attached, and at least another portion of the carrier sheet belongs to a second area where a metal electrode is attached; wherein the carrier sheet can be peeled off relative to the packaging body and reused for the packaging carrier; and the medium includes any of the following: a release film, a transition coating, or other medium that can form a weak bonding force with the packaging body or the carrier sheet. In this way, the present disclosure realizes a simpler, more environmentally friendly, and lower-cost packaging carrier and its supporting process.

Description

Technical Field

[0001] The present disclosure belongs to the field of electronics, and specifically relates to a packaging carrier. Background Art

[0002] The integrated circuit industry is a basic and leading industry in the information society, among which the packaging and testing of various integrated circuits is an important part of the entire industry chain. In terms of packaging technology, the mainstream packaging substrates mostly adopt the HDI technology route, the core of which is the formation of micro-hole conduction and fine lines. However, the equipment and technical threshold of this technology route are high, the investment is large, and it needs to match a dedicated substrate, and the size and thickness are limited by the material specifications.

[0003] How to design a simpler, more environmentally friendly, and lower-cost packaging substrate and its supporting processes is a technical problem that the packaging industry urgently needs to solve. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present disclosure discloses a packaging carrier, the packaging carrier is used to carry a packaging body, and the packaging carrier includes:

[0005] A carrier sheet and a medium thinner than the carrier sheet, wherein a portion of the carrier sheet belongs to a first area to which the medium is attached, and at least another portion of the carrier sheet belongs to a second area to which a metal electrode is attached;

[0006] in,

[0007] The carrier sheet can be peeled off relative to the package body and reused for the package carrier;

[0008] The medium includes any of the following: a release film, a transition coating, or other medium that can form a weak bonding force with the package body or the carrier sheet.

[0009] Through the above technical solution, the present invention realizes a new type of packaging carrier, which has a simple structure, is peelable, and can improve production efficiency, reduce costs, and is more environmentally friendly. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1-1 It is a structural schematic diagram of an embodiment of the present disclosure;

[0011] Figure 1-2 It is a structural schematic diagram of another embodiment of the present disclosure;

[0012] Figure 1-3 It is a structural schematic diagram of another embodiment of the present disclosure;

[0013] Figure 2 It is a structural schematic diagram of another embodiment of the present disclosure;

[0014] Figure 3 It is a structural schematic diagram of another embodiment of the present disclosure;

[0015] Figure 4-1 It is a structural schematic diagram of another embodiment of the present disclosure;

[0016] Figure 4-2 It is a structural schematic diagram of another embodiment of the present disclosure;

[0017] Figure 4-3 It is a structural schematic diagram of another embodiment of the present disclosure;

[0018] Figure 5-1 It is a structural schematic diagram of another embodiment of the present disclosure;

[0019] Figure 5-2 It is a structural schematic diagram of another embodiment of the present disclosure;

[0020] Figure 5-3 It is a structural schematic diagram of another embodiment of the present disclosure;

[0021] Figure 5-4 It is a structural schematic diagram of another embodiment of the present disclosure;

[0022] Figure 6 It is a structural schematic diagram of another embodiment of the present disclosure;

[0023] Figure 7-1 It is a structural schematic diagram of another embodiment of the present disclosure;

[0024] Figure 7-2 It is a structural schematic diagram of another embodiment of the present disclosure;

[0025] Figure 7-3 It is a structural schematic diagram of another embodiment of the present disclosure;

[0026] Figure 8-1 It is a structural schematic diagram of another embodiment of the present disclosure;

[0027] Figure 8-2 It is a structural schematic diagram of another embodiment of the present disclosure;

[0028] Figure 8-3 It is a structural schematic diagram of another embodiment of the present disclosure;

[0029] Figure 8-4 It is a structural schematic diagram of another embodiment of the present disclosure;

[0030] Figure 9-1 It is a structural schematic diagram of another embodiment of the present disclosure;

[0031] Figure 9-2 It is a structural schematic diagram of another embodiment of the present disclosure;

[0032] Figure 9-3 It is a structural schematic diagram of another embodiment of the present disclosure;

[0033] The reference numerals are as follows:

[0034] 1: Metal electrode; 2: Dielectric; 3: Carrier; 4: Release film; 5: Transition coating; 6: Insulating layer; 7: Conductive paste; 8: Base material; 9: Glue; 10: Electroplatable conductive paste; 11: Dry film; 12: Resin; 13: Metal pillar; 14: Bottom electrode; 15: Chip base; 16: Top electrode; 17: Plastic encapsulation resin; 18: Chip; 19: Bonding wire. DETAILED DESCRIPTION

[0035] The following is attached Figure 1-1 To Attachment Figure 9-3 With the more particular description of the preferred embodiments of the invention shown, the features and advantages of the invention will be apparent from the description.

[0036] See also Figure 1-1 In one embodiment, a package carrier is disclosed, wherein the package carrier is used to carry a package body, and the package carrier comprises:

[0037] A carrier sheet and a medium thinner than the carrier sheet, wherein a portion of the carrier sheet belongs to a first area to which the medium is attached, and at least another portion of the carrier sheet belongs to a second area to which a metal electrode is attached;

[0038] in,

[0039] The carrier sheet can be peeled off relative to the package body and reused for the package carrier;

[0040] The medium includes any of the following: a release film, a transition coating, or other medium that can form a weak bonding force with the package or the carrier. Figure 1-2 , Figure 1-3 Different situations of the medium are illustrated respectively.

[0041] For the technical solution of the above embodiment, since the medium is thinner than the carrier sheet, the medium is attached, and the metal electrode is attached, when the medium includes any of the following: a release film, a transition coating, or other medium that can form a weak bonding force with the package body or the carrier sheet, the carrier sheet and the package body have a peelable structural feature, which further makes the above-mentioned package carrier have the technical effects of simple structure, improved packaging efficiency, reduced cost, and more environmental protection. Furthermore, since the carrier sheet can be reused for the package carrier, this allows the carrier sheet to be repeatedly used until its physical or electrical performance indicators no longer meet the packaging requirements, so the overall cost of the technical solution can be greatly reduced.

[0042] It can be understood that, as far as the medium is concerned, on the one hand, it is thinner than the carrier sheet, and on the other hand, a weak bonding force needs to be formed between it and the package body or the carrier sheet to facilitate the peeling of the carrier sheet relative to the package body. Specific examples are as follows:

[0043] (1) When the carrier sheet is peeled off from the package body, if the medium is of the type that can form a weak bonding force with the package body, then the medium will be separated from the package body along with the carrier sheet. For example, when the medium is the above-mentioned release film, the release film-type medium is combined with the carrier sheet and solidified in the liquid state. The bonding force of the solidified release film when it is attached to other substances (such as the package body) belongs to the category of weak bonding force. In comparison, the solidified release film has a stronger bonding force with the carrier sheet. Therefore, when the carrier sheet is peeled off from the package body, the release film can still belong to the carrier sheet, and the release film and the carrier sheet can still be attached together. The release film can include various types of release films.

[0044] (2) When the carrier sheet is peeled off relative to the package body, if the medium is of the type that can form a weak bonding force with the carrier sheet, then the medium will be separated from the carrier sheet along with the package body, for example, when the medium is the above-mentioned transition coating: due to the characteristics of the coating process itself, the bonding force between the carrier sheet and the transition coating is in the category of weak bonding force. Therefore, when the carrier sheet is peeled off relative to the package body, the transition coating can still belong to the package body, the transition coating and the package body can still be attached together, and the transition coating is separated from the carrier sheet. The transition coating can be formed by gold plating, silver plating, nickel plating, copper plating, etc. Preferably, the transition coating is formed by copper plating.

[0045] (3) Naturally, when the medium is thinner than the carrier sheet and the medium is other medium that can form a weak bonding force with the package or the carrier sheet, then the medium at this time is also conducive to the peeling of the carrier sheet relative to the package, and either the medium and the carrier sheet can still be attached together after peeling, or the medium and the package can still be attached together after peeling.

[0046] It can be understood that the carrier sheet is the bottom, and the first area and the second area are both located above the carrier sheet. Theoretically, the first area and the second area can both be used to carry the package. Figure 1-1 to Figure 1-3 The carrier sheet shown in the figure can be the active peeling party, and the package body can also be the active peeling party. The package body includes different packaging forms of various integrated circuits. As for the first area and the second area, they are to facilitate the formation of the electrode corresponding area and the non-electrode corresponding area during the packaging process.

[0047] In another embodiment, the height of the metal electrode and the thickness of the dielectric can be designed according to specific packaging requirements. In addition, according to different designs, the height of the metal electrode can be slightly higher / slightly lower than the thickness of the dielectric, can be significantly higher / lower than the thickness of the dielectric, or can be flush.

[0048] In another embodiment, the metal electrode may include multiple electrode forms.

[0049] In another embodiment, if the side of the metal electrode in contact with the carrier sheet is used as the bottom surface, then the other side of the metal electrode opposite to the bottom surface, that is, the surface of the metal electrode, can be further surface treated according to packaging needs, such as: gold plating, silver plating, tin plating, roughening, anti-oxidation, passivation treatment, covering with a protective layer, etc. More preferably, the surface of the metal electrode can be subjected to operations such as die bonding, wire bonding, welding and plastic sealing.

[0050] In another embodiment,

[0051] The metal electrode is realized by electroplating on the carrier sheet.

[0052] Although the above embodiments use electroplating to form electrodes, this does not mean that only electroplating can be used. This depends on whether there are other ways to form electrodes on the carrier during the technological development process, such as growing electrodes or spraying electrodes.

[0053] It can be understood that there is a situation: when using a release film as a medium, if the release film pre-covers all areas of the carrier sheet, then the release film of the area to be electroplated can be removed first to expose the carrier sheet, and the metal electrode can be electroplated on the carrier sheet. Naturally, although the thickness of the dielectric layer is determined according to the thickness of the required coating, it must meet the insulation performance of electroplating; assuming that the coating required for the metal electrode is relatively thick, then you can choose to cover the release film with a layer of dry film or wet film photosensitive material, expose the area to be electroplated by exposure and development, and then electroplate on the exposed area on the carrier sheet to form a metal electrode. Similarly, there is also a situation: when using a transition coating as a medium, if the transition coating pre-covers all areas of the carrier sheet, then the metal electrode can be electroplated in the following manner: first, a layer of dry film photosensitive material is covered on the transition coating corresponding to the electroplating area, exposed and developed, and then the transition coating is removed by etching to expose the corresponding electroplating area on the carrier sheet, and then electroplating is performed on the exposed area on the carrier sheet to form a metal electrode.

[0054] See also Figure 2 In another embodiment,

[0055] An insulating layer is attached to the first area. It can be understood that the insulating layer is required by common packaging processes during the packaging process, but not all packaging processes require it. Similar to the previous text, this embodiment aims to emphasize that in a scenario where an insulating layer is required, when the carrier sheet is peeled off relative to the packaging body, the insulating layer belongs to the packaging body.

[0056] More preferably, at least a portion of the insulating layer is attached to the metal electrode. Obviously, when the insulating layer is provided, the package carrier can realize a multi-layer design, and more specific examples are described below. In view of the above description of other embodiments, it can be understood that the present disclosure can use the aforementioned package carrier with peeling characteristics for the multi-layer process of the package body, and still make the carrier sheet have the characteristic of easy peeling.

[0057] In another embodiment,

[0058] When the carrier sheet is peeled off relative to the package body, the metal electrode belongs to the package body.

[0059] As far as this embodiment is concerned, it means that by adopting the packaging carrier described in this embodiment, the metal electrode can still be integrated with the packaging body after peeling, that is, the metal electrode can still be connected to and belong to the packaging body. This just illustrates the excellent effect of this embodiment: the peelable carrier sheet can improve packaging efficiency and reduce costs.

[0060] In another embodiment,

[0061] The metal electrode includes a first attachment, and when the carrier sheet is peeled off relative to the package body, the first attachment belongs to the package body.

[0062] It can be understood that the first attachment on the metal electrode can be any reasonable attachment on the metal electrode in the packaging process of the integrated circuit, including various attachment possibilities such as glue, film, insulating layer, welding wire, IC, etc. As in the previous embodiment, this embodiment aims to emphasize that after the carrier sheet is peeled off, the relevant attachment can still be connected and belong to the package body.

[0063] In another embodiment, the carrier sheet is in a strip shape. It can be understood that the shape of the carrier sheet can be any shape that is convenient for production, and the strip shape is conducive to assembly line operation. Preferably, in another embodiment, the long direction of the carrier sheet is a closed loop mode.

[0064] It can be understood that the carrier sheet is generally rectangular, extending in the transverse direction, and has two sides, long and wide, and the long direction refers to the long side. When the long direction of the carrier sheet is a closed loop mode, it is conducive to uninterrupted production, thereby greatly improving the efficiency of subsequent packaging.

[0065] In another embodiment,

[0066] The carrier sheet includes any one of the following: stainless steel with a low thermal expansion coefficient, or other metals with a thermal expansion coefficient matching that of the molding resin.

[0067] It can be understood that this embodiment is to select the carrier sheet. In this embodiment, the carrier sheet is selected by the thermal expansion coefficient in order to overcome the negative impact that thermal expansion may bring in the packaging process. It should be noted that according to the description of the basic scheme and principles of the present disclosure in the previous embodiments, with the continuous development of science and technology, the present disclosure does not exclude non-metallic materials as carrier sheets.

[0068] In another embodiment, after the carrier sheet is peeled off relative to the package body, the insulating layer belongs to the package body. As for this embodiment, this embodiment aims to emphasize that after the carrier sheet is peeled off, the insulating layer can still be connected to and belong to the package body. This means that the package carrier disclosed in the present disclosure can be used for: a packaging process of a package body containing an insulating layer.

[0069] More preferably, the insulating layer includes a second attachment, and when the carrier sheet is peeled off relative to the package body, the second attachment belongs to the package body. It can be understood that the second attachment on the insulating layer can be any reasonable attachment on the insulating layer in the packaging process of the integrated circuit, including various attachment possibilities such as glue, film, electrode, welding wire, IC, etc. As in the previous embodiment, this embodiment aims to emphasize that after the carrier sheet is peeled off, the relevant attachment can still be connected and belong to the package body.

[0070] See also Figure 3 In another embodiment, a conductive paste may be further attached to the insulating layer to meet the needs of certain packaging processes.

[0071] More preferably, the conductive paste may be an electroplatable conductive paste.

[0072] See also Figure 4-1 In another embodiment, in a packaging process without an insulating layer, a metal electrode and a release film are attached to the carrier sheet, and glue is successively attached to the metal electrode and the release film (corresponding to the first area and the second area), and a substrate is further attached on the glue.

[0073] See also Figure 4-2 , Figure 4-3 , which respectively illustrate that in a packaging process with an insulating layer, a conductive paste is also attached to the insulating layer, and the conductive paste is preferably a conductive paste that can be electroplated: a metal electrode and a release film are attached to the carrier sheet, and an insulating layer, a conductive paste that can be electroplated, and a glue are successively attached to the metal electrode and the release film (corresponding to the first area and the second area), and a substrate is further attached on the glue.

[0074] Can be found in Figure 4-2 , Figure 4-3 In the case shown, the conductive paste or electroplatable conductive paste not only covers the insulating layer, but also can bridge between metal electrodes. Figure 4-2 The three metal electrodes shown in the figure are named as the first metal electrode, the second metal electrode and the third metal electrode from left to right. Obviously, the conductive paste is bridged between the first metal electrode and the third metal electrode.

[0075] Right here Figure 4-2 , Figure 4-3 It should be noted that the insulating layer can be used for electrical insulation isolation, and the conductive paste on the insulating layer can achieve electrical connectivity across the two ends of the insulating layer due to the bridging between different metal electrodes. At this time, the packaging substrate is obviously conducive to the packaging of double-sided circuits.

[0076] In another embodiment, in order to meet certain packaging requirements, the conductive paste and the metal electrode may be further subjected to pattern plating, that is, the surface of the conductive paste and the metal electrode may be patterned. It is understood that the metal layer obtained by pattern plating may be electrically connected to the bottom of the metal electrode (i.e., the part of the metal electrode in contact with the carrier sheet, which may be referred to as the bottom electrode) or to other electrodes that need to be connected according to packaging requirements, according to packaging requirements. Preferably, in another embodiment, the patterned relevant surface may be further subjected to metal thickening, surface treatment, etching, etc., according to packaging requirements.

[0077] For the above embodiment, further pattern plating can improve the conductivity and surface characteristics of the bridging area, reduce resistivity, and improve the conductive surface, which is particularly important in high-frequency application environments, especially when the skin effect is obvious.

[0078] In another embodiment,

[0079] The release film includes a third attachment, and when the carrier sheet is peeled off relative to the package body, the third attachment belongs to the package body. It can be understood that the third attachment on the release film can be any reasonable attachment on the release film in the packaging process of the integrated circuit, including various attachment possibilities such as photosensitive film, dry film, insulating film, glue, electrode, welding wire, IC, etc. As in the previous embodiment, this embodiment aims to emphasize that after the carrier sheet is peeled off, the relevant attachment can still be connected and belong to the package body.

[0080] In another embodiment, when the release film includes various types of films such as photosensitive film, dry film or insulating film, the above types of films on the release film can be further processed by exposure, development or laser burning, so that: a part of the area of ​​the carrier sheet belongs to the first area where the release film is attached, and at least another part of the area of ​​the carrier sheet belongs to the second area where the metal electrode is attached. Preferably, the metal electrode in the second area is formed by electroplating as described above.

[0081] Furthermore, in another embodiment, the above-mentioned various types of films on the release film may be further processed as follows:

[0082] First, remove the photosensitive film, dry film or insulating film;

[0083] Secondly, an insulating coating is applied on the release film;

[0084] Thirdly, performing metallization treatment on the insulating coating to obtain a metal layer on the release film;

[0085] Thirdly, the metal layer on the release film is connected to the bottom electrode, wherein the bottom electrode refers to the portion of the metal electrode in contact with the carrier sheet;

[0086] Next, patterning the metal layer on the release film, and performing metal thickening, surface treatment and etching on the metal layer on the release film;

[0087] Next, packaging processes such as die bonding, wire bonding, welding and plastic sealing are performed on the metal layer on the release film.

[0088] It can be understood that the above embodiments are examples of further processing of the release film on the packaging carrier described in the present disclosure.

[0089] In another embodiment, Figure 5-1 The diagram illustrates a case where the third attachment on the release film is a dry film and the metal electrode is a conventional electrode, and also illustrates a case where there are three metal electrodes.

[0090] In another embodiment, Figure 5-2 The diagram illustrates a situation where the third attachment on the release film is a resin and the metal electrode is a special-shaped electrode, and also illustrates a situation where there are two metal electrodes, wherein each metal electrode includes the bottom electrode portion described in many places above and the remaining columnar metal column portion outside the bottom electrode.

[0091] In another embodiment, Figure 5-3 The diagram illustrates a situation where the third attachment on the release film is a dry film and the metal electrode is a special-shaped electrode, and also illustrates a situation where two metal electrodes are provided, wherein each metal electrode includes a bottom electrode portion and the remaining columnar metal pillar portion outside the bottom electrode.

[0092] In another embodiment, Figure 5-4 The diagram illustrates a situation in which the third attachment on the release film includes a resin, a dry film on the resin, and a chip base on the dry film, and the metal electrode is a special-shaped electrode, and the diagram also illustrates a situation in which two metal electrodes are provided, wherein each metal electrode includes a bottom electrode portion, a top electrode portion flush with the chip base, and the remaining columnar metal pillar portion between the bottom electrode and the top electrode, and the chip base is located between the top electrodes of the two metal electrodes, and between the chip base and each top electrode is the dry film on the resin.

[0093] In another embodiment, Figure 6 The present invention illustrates a case where the package carrier described in the present invention is used for chip packaging. The third attachment on the release film includes a resin and a plastic encapsulation resin attached to the resin, and the plastic encapsulation resin is used to encapsulate the chip on the chip base. The plastic encapsulation resin is also attached to two metal electrodes, and each metal electrode includes a bottom electrode and a top electrode. In addition, bonding wires are connected between the chip and the two top electrodes.

[0094] also, Figure 6 In the embodiment, the chip base and the top electrode both have two lateral ends, wherein the molding resin is included between one end of the chip base and one end of the top electrode at the opposite end. Furthermore, each end of the chip base and the top electrode includes two upper and lower protruding portions and a recessed portion between the upper and lower protruding portions, which is understandable for better bonding with the molding resin.

[0095] The above schematic diagrams and embodiments describe in detail how the package carrier described in the present disclosure is used in relevant application scenarios in the field when the medium is a release film. When the carrier sheet is peeled off, the release film often follows the carrier sheet.

[0096] The following is an explanation of other embodiments and schematic diagrams of how the package carrier described in the present disclosure is used in relevant application scenarios in the field when the medium is a transition coating. When the carrier sheet is peeled off, the transition coating often follows the package body.

[0097] In another embodiment, Figure 7-1 The diagram illustrates a case where the deposit on the transition coating is a dry film and the metal electrode is a conventional electrode, and also illustrates a case where there are three metal electrodes.

[0098] In another embodiment, Figure 7-2 The example shows a case where the deposit on the transition coating is a resin and the metal electrode is a conventional electrode, and also shows a case where there are three metal electrodes. Figure 7-3 The case of a special-shaped electrode, such as a T-shaped electrode, is illustrated, and the case of three metal electrodes is illustrated.

[0099] In another embodiment, Figure 8-1 It indicates Figure 7-3 The situation after the carrier sheet is peeled off; Figure 8-2 Then, in another embodiment, the situation after the transition coating is removed is further illustrated; Figure 8-3 In another embodiment, the situation of packaging the chip and bonding the wires is shown; Figure 8-4 In another embodiment, Figure 8-3 The chip is further packaged using a molding resin.

[0100] In another embodiment, Figure 9-1 The figure shows the case where the attachment on the transition coating is resin, the metal electrode is a special-shaped electrode, and the chip is packaged using a plastic resin, wherein each metal electrode includes not only a T-shaped electrode, but also the bottom electrode portion described in many places above and the remaining metal pillar portions in a columnar shape outside the bottom electrode. In another embodiment, Figure 9-2 It shows the package body after the carrier sheet is peeled off, and the transition coating layer still belongs to the package body. Figure 9-3 In another embodiment, the package body after the transition coating is further removed is illustrated.

[0101] From the aforementioned Figure 7-3 to Figure 8-4 It can be understood that the present disclosure can first peel off the carrier sheet and remove the transition coating, and then package the chip and make the bonding wires; it can also be like Figure 9-1 to Figure 9-3 In that case, the present disclosure can also continue chip packaging and bonding wires without peeling off the carrier sheet first, and finally peel off the carrier sheet and remove the transition coating. In fact, for the relevant embodiments of the release film described above, the carrier sheet and its release film can also be peeled off first, or the packaging can be completed first and then the carrier sheet and its release film can be peeled off. This is beneficial to the division of labor in the industry, which means that the supply chain manufacturer can peel off the carrier sheet and then provide the package body to the customer, or directly deliver a mixed product together with the package carrier and the package body to the customer and let the customer peel off the carrier sheet.

[0102] For the above-mentioned multiple embodiments, under the existing process capabilities (mainly referring to line width and line spacing), even with two layers of different attachments, if the electrical connectivity between different electrodes cannot be achieved, then it can be considered to add another layer of attachment to achieve electrical connectivity between different electrodes. That is to say, in theory, each attachment mentioned above can be two to N layers, where N is a positive integer. In this way, the packaging substrate disclosed in the present invention can be used for RGB LED packaging substrates, and can also be used for BGA-like IC packaging substrates, etc. In addition, it should be noted that, as mentioned above, the insulating layer can be used to achieve a multi-layer design. If a reasonable design is performed, electrode layers can be designed at the bottom and top of the insulating layer, and each electrode layer can be achieved by electroplating. In other words, the insulating layer and each attachment described in the present invention can have a multi-layer structure, and can be used to achieve electrical connectivity between different electrodes. Similarly, the attachment on the metal electrode can also have a multi-layer structure. Furthermore, the metal electrode and the insulating layer can overlap and be spaced to form a multi-layer structure, such as a layer of insulating layer, a layer of metal electrode on it, and another layer of insulating layer on the metal electrode, or: a layer of metal electrode, an insulating layer on it, and another layer of metal electrode on the insulating layer, and so on.

[0103] It should be noted that, for each of the embodiments described above, when the carrier sheet is peeled off relative to the metal electrode or insulating layer or attachment or a specific package, a transfer object with a sticky material can be used to transfer the metal electrode or insulating layer or attachment or a specific package to the transfer object. For example, the bonding and transfer can be achieved in the following ways: (1) using a pressure-sensitive adhesive with sufficient viscosity; (2) using a UV-reducing adhesive with sufficient viscosity, and irradiating UV light after the transfer is completed to reduce the viscosity of the UV adhesive; (3) using a hot melt adhesive for heating and transfer. After the transfer is completed, the hot melt adhesive is not sticky at room temperature; (4) using a thermosetting hot melt adhesive for bonding and transfer. After the transfer is completed, heating and curing the hot melt adhesive.

[0104] Together with all the electrodes mentioned above, the present disclosure can effectively control the thickness of each electrode layer, thereby greatly saving the metal required for electroplating compared to the prior art, especially in high-frequency application scenarios. In addition, the carrier sheet of the present disclosure does not require a thicker copper layer for support, which also significantly saves metal.

[0105] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Any common changes and substitutions made by those skilled in the art within the scope of the technical solution of the present disclosure should be included in the protection scope of the present disclosure.

Claims

1. A packaging carrier, the packaging carrier is used to carry a packaging body, the packaging carrier comprises: A carrier sheet and a medium thinner than the carrier sheet, wherein a portion of the carrier sheet belongs to a first area to which the medium is attached, and at least another portion of the carrier sheet belongs to a second area to which a metal electrode is attached; in, The carrier sheet can be peeled off relative to the package body and reused for the package carrier; The medium includes any of the following: a release film, a transition coating, or other medium that can form a weak bonding force with the package body or the carrier sheet; An insulating layer is attached to the first area, and when the carrier sheet is peeled off relative to the package body, the insulating layer belongs to the package body; The metal electrode includes a first attachment, and when the carrier sheet is peeled off relative to the package body, the first attachment belongs to the package body; The insulating layer includes a second attachment, and when the carrier sheet is peeled off relative to the package body, the second attachment belongs to the package body; Furthermore, the carrier sheet is the bottom, the first area and the second area are both located above the carrier sheet, and the areas above the first area and the second area are used to carry the package body; When the carrier sheet is peeled off relative to the package body, the metal electrode belongs to the package body.

2. The package carrier according to claim 1, wherein: The metal electrode is realized by electroplating on the carrier sheet.

3. The packaging carrier according to claim 1, wherein: The carrier sheet is in a belt shape.

4. The packaging carrier according to claim 1, wherein: The long direction of the carrier sheet is a closed loop mode.

5. The package carrier according to claim 1, wherein: The attachment has a multi-layer structure.

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