Display device

Abstract

A display device is provided. The display device includes a substrate having a display area and a non-display area. A light-emitting element is disposed in the display area. An encapsulation layer is configured to cover the display area and encapsulate the light-emitting element. A line of force is disposed in the non-display area. A first edge of the encapsulation layer in the non-display area is arranged to coincide with an edge of the line of force, or is arranged to be closer to the display area than the edge of the line of force.

Description

[0001] This application claims priority from Korean Patent Application No. 10-2018-0129142 filed on October 26, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a display device, and more particularly, to an organic light emitting diode display. Background Art

[0003] An organic light-emitting diode display includes a display panel fabricated by forming light-emitting elements and circuit elements on a substrate. The circuit elements are configured to drive the light-emitting elements. The display panel may include an encapsulation substrate to prevent moisture or oxygen from penetrating from the outside, thereby protecting the light-emitting elements from damage. In recent years, a technology has been developed to form an encapsulation layer directly on the light-emitting elements to reduce the weight of the display panel and prevent damage to the display panel.

[0004] Most areas of a display panel may belong to a display area in which a screen is displayed. However, certain areas of the display panel, such as edge areas, may belong to a non-display area where drive circuits, signal lines, etc. are provided. Typically, the size of the non-display area of a display panel is limited to improve the screen-to-body ratio of the display device. Summary of the Invention

[0005] Exemplary embodiments of the present inventive concept provide a display device having improved reliability while reducing a peripheral area of a display panel.

[0006] According to an exemplary embodiment of the present invention, a display device is provided, including a substrate having a display area and a non-display area. A light-emitting element is disposed in the display area. An encapsulation layer is configured to cover the display area and encapsulate the light-emitting element. A line of force is disposed in the non-display area. A first edge of the encapsulation layer in the non-display area is disposed to coincide with an edge of the line of force, or is disposed closer to the display area than the edge of the line of force.

[0007] According to another exemplary embodiment of the present invention, a display device is provided, comprising a substrate having a display area and a non-display area. A light-emitting element is disposed in the display area and includes a first electrode, a second electrode, and an emission layer located between the first electrode and the second electrode. An encapsulation layer is configured to cover the display area and encapsulate the light-emitting element. The encapsulation layer includes a first edge disposed in the non-display area. A power line is disposed in the non-display area. A connecting member is configured to electrically connect the power line and the second electrode. The encapsulation layer contacts the power line or the connecting member in an area where the encapsulation layer overlaps the power line. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic top view of a display device according to an exemplary embodiment of the inventive concept is shown.

[0009] Figure 2 is along the exemplary embodiment according to the present inventive concept Figure 1 Schematic cross-sectional view taken along line AA'.

[0010] Figure 3 is along the exemplary embodiment according to the present inventive concept Figure 1 A schematic cross-sectional view taken along line BB'.

[0011] Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 8 is along the exemplary embodiment according to the present inventive concept Figure 1 Schematic cross-sectional view taken along line AA'. DETAILED DESCRIPTION

[0012] The inventive concept will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. As those skilled in the art will appreciate, the described embodiments may be modified in various different ways without departing from the spirit or scope of the inventive concept.

[0013] To clearly describe the exemplary embodiments of the inventive concept, parts irrelevant to the description are omitted, and the same reference numerals may refer to the same or similar constituent elements throughout the specification.

[0014] In addition, since the sizes and thicknesses of the constituent elements shown in the drawings are arbitrarily given for better understanding and ease of description, the inventive concept is not limited to the sizes and thicknesses shown. In the drawings, the thicknesses of layers, films, panels, regions, etc. may be exaggerated for clarity. In the drawings, the thicknesses of some layers and regions may be exaggerated for improved understanding and ease of description.

[0015] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present.

[0016] In addition, unless explicitly described to the contrary, the word “comprise” and variations such as “comprises” and “comprising” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

[0017] In the drawings, reference character x for indicating a direction is a first direction, reference character y is a second direction perpendicular to the first direction, and reference character z is a third direction perpendicular to the first and second directions.

[0018] A display device according to exemplary embodiments will now be described in detail with reference to the accompanying drawings.

[0019] Reference Figure 1 The display device may include a display panel 10 , a flexible printed circuit film 20 coupled to the display panel 10 , a driving unit including an integrated circuit chip 30 , and the like.

[0020] The display panel 10 may include a display area DA corresponding to a screen on which an image is displayed and a non-display area NA provided around the display area DA. The display panel 10 may also include signal lines and / or circuits configured to generate and / or transmit various signals provided in the display area DA. For example, Figure 1 , the quadrangle BO corresponds to the boundary of the display area DA.

[0021] The pixels PX are arranged in the display area DA of the display panel 10. For example, the pixels PX can be arranged in a matrix form. Signal lines (not shown) such as scan lines (also referred to as gate lines), light emission control lines, data lines, and drive voltage lines can be arranged in the display area DA. The scan lines, light emission control lines, data lines, and drive voltage lines can be connected to each pixel PX. Each pixel PX can be configured to receive a scan signal (also referred to as a gate signal), a light emission control signal, a data signal, and a drive voltage. Each pixel PX can include a light emitting element, which can be an organic light emitting diode.

[0022] The display area DA may include a touch sensor layer configured to sense a user's touch or contactless touch. Although the display area DA is exemplarily shown as having a rectangular shape with rounded corners, the display area DA may have various shapes such as polygonal, circular, elliptical, etc.

[0023] A pad portion PP including pads configured to receive signals from outside the display panel 10 is provided in the non-display area NA of the display panel 10. The pad portion PP may be configured to extend in a first direction x along one edge of the display panel 10. The flexible printed circuit film 20 may be bonded to the pad portion PP, and the pads of the flexible printed circuit film 20 may be electrically connected to the pads of the pad portion PP.

[0024] The drive unit may be disposed in the non-display area NA of the display panel 10. The drive unit is configured to generate and / or process various signals for driving the display panel 10. The drive unit may include a data driver, a scan driver, an emission driver, and a signal controller. The data driver is configured to apply data signals to data lines, the scan driver is configured to apply scan signals to scan lines, the emission driver is configured to apply light emission control signals to light emission control lines, and the signal controller is configured to control the data driver, scan driver, and emission driver. The scan driver and emission driver may be integrated into the display panel 10 and may be disposed on opposite sides of the display area DA or on one side of the display area DA. The data driver and signal controller may be configured as an integrated circuit chip (also referred to as a driver IC chip) 30, and the integrated circuit chip 30 may be mounted in the non-display area NA of the display panel 10. The integrated circuit chip 30 may be mounted on a flexible printed circuit film 20, etc., which may be bonded to the display panel 10, and may be electrically connected to the display panel 10.

[0025] The display panel 10 may include an encapsulation layer EN configured to completely cover the display area DA. The encapsulation layer EN is used to encapsulate the display area DA (especially the light emitting element) to prevent water or oxygen from penetrating into the display panel 10. An edge of the encapsulation layer EN may be disposed between an edge of the display panel 10 and the display area DA.

[0026] At least one dam DM may be provided in the non-display area NA. Figure 2 In the embodiment shown in FIG, one dam DM is provided in the non-display area NA. The dam DM can prevent the material (especially, organic material) forming the encapsulation layer EN from overflowing to the outside of the display panel 10.

[0027] like Figure 1 As shown in , the display panel 10 may include a bending area BR. The bending area BR may be provided in the non-display area NA between the display area DA and the pad portion PP. The bending area BR may extend across the display panel 10 in a first direction x. The display panel 10 may be configured to bend with a predetermined radius of curvature around a bending axis parallel to the first direction x in the bending area BR. When the display panel 10 is a top emission type, the display panel 10 may be configured to bend so that the pad portion PP and the flexible printed circuit film 20, which are farther from the display area DA than the bending area BR, may be provided behind the display panel 10. The display panel 10 may be provided in such a configuration in an electronic device to which the display device is applied. The bending area BR may be configured to bend around one bending axis, or may be bent around two or more bending axes. Although in Figure 1The bending region BR is shown as being disposed in the non-display area NA in the exemplary embodiment shown in FIG, but the bending region BR may extend throughout the display area DA and the non-display area NA, or may be disposed in the display area DA.

[0028] Now refer to Figure 2 and Figure 3 The cross-sectional structure of the display panel 10 is described in detail.

[0029] Figure 2 A cross-sectional view of the display panel 10 according to an exemplary embodiment is shown near the left edge of the display panel 10. In an exemplary embodiment, near the right edge of the display panel 10 may have a cross-sectional structure substantially symmetrical to that near the left edge of the display panel 10.

[0030] The display panel 10 may include a substrate 110 and various layers, wiring, and components formed on the substrate 110. Although a large number of pixels PX may be arranged in the display area DA of the display panel 10, only one pixel PX will be briefly illustrated to avoid complicating the drawings to be described. Each pixel PX may include a transistor, a capacitor, and a light-emitting element. However, the stacked structure of the display panel 10 will be described based on the transistor TR and the light-emitting element LD connected thereto.

[0031] The substrate 110 may be a flexible substrate. The substrate 110 may be made of a polymer such as polyimide, polyamide, polycarbonate, or polyethylene terephthalate. In an alternative exemplary embodiment, the substrate 110 may be a rigid substrate made of glass, quartz, ceramic, or the like.

[0032] The barrier layer 115 may be provided on the substrate 110 to prevent moisture from penetrating from the outside. In an exemplary embodiment, the barrier layer 115 may include a silicon oxide (SiO x ), silicon nitride (SiN x ) and other inorganic insulating materials.

[0033] The buffer layer 120 may be provided on the barrier layer 115. The buffer layer 120 may be configured to block impurities that may diffuse from the substrate 110 to the semiconductor layer 154 and reduce stress applied to the substrate 110 in the process of forming the semiconductor layer 154. The buffer layer 120 may include a silicon oxide (SiO x ), silicon nitride (SiN x ) and other inorganic insulating materials.

[0034] The semiconductor layer 154 of the transistor TR may be provided on the buffer layer 120. The semiconductor layer 154 may include a channel region overlapping the gate electrode 124 and a source region and a drain region to be doped provided at opposite sides of the gate electrode 124. In exemplary embodiments, the semiconductor layer 154 may include polysilicon, amorphous silicon, or an oxide semiconductor.

[0035] A first insulating layer 140 including an inorganic insulating material such as silicon oxide or silicon nitride may be disposed on the semiconductor layer 154. The first insulating layer 140 may be referred to as a gate insulating layer.

[0036] A gate conductor including a scan line and a gate electrode 124 of the transistor TR may be disposed on the first insulating layer 140. The gate conductor may include a metal such as molybdenum (Mo), copper (Cu), aluminum (Al), silver (Ag), chromium (Cr), tantalum (Ta), or titanium (Ti), or a metal alloy thereof.

[0037] The second insulating layer 160 may be disposed on the first insulating layer 140 and the gate conductor. The second insulating layer 160 may include silicon oxide (SiO x ), silicon nitride (SiN x ) etc. The second insulating layer 160 may be referred to as a gate insulating layer.

[0038] A data conductor including a data line, a driving voltage line, a power line 177 , a driving control signal line 178 , and the source and drain electrodes 173 and 175 of the transistor TR may be disposed on the second insulating layer 160 .

[0039] The source electrode 173 and the drain electrode 175 may be connected to the source region and the drain region of the semiconductor layer 154 through contact holes formed in the second insulating layer 160 and the first insulating layer 140 , respectively.

[0040] The power line 177 may be configured to transmit power of a predetermined voltage level that may be applied to the light emitting element LD of the pixel PX. For example, the power line 177 may transmit a common voltage (ELVSS). The first and second ends of the power line 177 may be electrically connected to the pad portion PP.

[0041] The drive control signal lines 178 may be configured to transmit signals such as a vertical start signal and a clock signal, and a signal for providing a low voltage of a specific level, to a scan driver and / or an emission driver in the drive circuit area DCA that may be provided in the non-display area NA. In an exemplary embodiment, some of the drive control signal lines 178 may be formed of the same material and layer as the gate conductor.

[0042] The data conductor may be made of aluminum (Al), copper (Cu), silver (Ag), gold (Au), platinum (Pt), palladium (Pd), nickel (Ni), molybdenum (Mo), tungsten (W), titanium (Ti), chromium (Cr), tantalum (Ta), etc. The data conductor may have a multi-layer structure, such as a multi-layer structure of titanium / aluminum / titanium (Ti / Al / Ti), titanium / copper / titanium (Ti / Cu / Ti), or molybdenum / aluminum / molybdenum (Mo / Al / Mo).

[0043] The gate electrode 124, the source electrode 173, and the drain electrode 175 together with the semiconductor layer 154 constitute the transistor TR. Figure 2 In the exemplary embodiment shown in FIG, the transistor TR includes a gate electrode 124 provided on a semiconductor layer 154. However, the structure of the transistor TR may be variously modified without being limited thereto.

[0044] The third insulating layer 180 may be disposed on the second insulating layer 160 and the data conductor. In exemplary embodiments, the third insulating layer 180 may include an organic insulating material such as polyimide, acrylic polymer, siloxane polymer, or the like.

[0045] The first electrode E1 of the light-emitting element LD may be disposed on the third insulating layer 180. The first electrode E1 may be connected to the drain electrode 175 through a contact hole formed in the third insulating layer 180. A connection member 195 in contact with and connected to the power line 177 may be disposed on the third insulating layer 180. A portion of the third insulating layer 180 overlapping the power line 177 may be removed to facilitate connection between the connection member 195 and the power line 177.

[0046] A valley 81 may be formed in the third insulating layer 180. The connecting member 195 may contact the second insulating layer 160 in the valley 81 of the third insulating layer 180. In the present embodiment, a portion of the third insulating layer 180, which is an organic insulating layer that is easily permeated by moisture, may be removed, and this portion of the third insulating layer 180 may be filled with a material that effectively prevents moisture permeation to block the permeation of moisture and outgassing (for example, outgassing generated in the second insulating layer 160 disposed at the outer side of the valley 81).

[0047] In an exemplary embodiment, the connection member 195 as a conductive layer can be formed of the same material as the first electrode E1 by the same process as the first electrode E1. For example, the first electrode E1 and the connection member 195 can be made of a metal such as silver (Ag), nickel (Ni), gold (Au), platinum (Pt), aluminum (Al), copper (Cu), aluminum neodymium (AlNd), aluminum nickel lanthanum (AlNiLa), or a metal alloy thereof. The first electrode E1 and the connection member 195 can include a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The first electrode E1 and the connection member 195 can have a multilayer structure, such as a multilayer structure consisting of ITO / silver (Ag) / ITO or ITO / aluminum (Al).

[0048] The fourth insulating layer 360 may have an opening overlapping the first electrode E1. The fourth insulating layer 360 may be disposed on the third insulating layer 180. The opening of the fourth insulating layer 360 may define each pixel region, and the fourth insulating layer 360 may be referred to as a pixel defining layer. The fourth insulating layer 360 may include an organic insulating material.

[0049] The emission layer EL may be provided on the first electrode E1. The second electrode E2 may be provided on the emission layer EL. The second electrode E2 may be connected to the connecting member 195. Since the connecting member 195 is connected to the power line 177, the second electrode E2 may be electrically connected to the power line 177 through the connecting member 195. Therefore, when the power line 177 transmits the common voltage (ELVSS) as the power supply voltage, the second electrode E2 may receive the common voltage (ELVSS). The second electrode E2 may be formed of a low work function metal. For example, the second electrode E2 may be formed of a thin layer of calcium (Ca), barium (Ba), magnesium (Mg), aluminum (Al), and silver (Ag) to have light transmittance. The second electrode E2 may be formed of a transparent conductive material such as ITO or IZO.

[0050] The first electrode E1 , the emission layer EL, and the second electrode E2 of each pixel PX may constitute a light emitting element LD, such as an organic light emitting diode.

[0051] The encapsulation layer EN may be disposed on the second electrode E2. The encapsulation layer EN is configured to encapsulate the light emitting element LD to prevent moisture or oxygen from penetrating from the outside. In an exemplary embodiment, the encapsulation layer EN may completely cover the display area DA, and the edge of the encapsulation layer EN may be disposed in the non-display area NA.

[0052] The encapsulation layer EN may include at least one inorganic layer and at least one organic layer stacked. In the illustrated embodiment, the encapsulation layer EN is a thin film encapsulation layer including a first inorganic layer 391, an organic layer 392, and a second inorganic layer 393. In the encapsulation layer EN, the first inorganic layer 391 and the second inorganic layer 393 are configured to prevent water penetration. The organic layer 392 is configured to flatten the surface of the encapsulation layer EN (particularly the surface of the second inorganic layer 393 in the display area DA). The first inorganic layer 391 and the second inorganic layer 393 may include a silicon oxide (SiO x ), silicon nitride (SiN x ) etc. The organic layer 392 may include an organic material such as acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, and perylene resin.

[0053] In an exemplary embodiment, the first inorganic layer 391 and the second inorganic layer 393 may be formed to extend across the substrate 110 wider than the organic layer 392. The first inorganic layer 391 and the second inorganic layer 393 may contact each other near the edge of the encapsulation layer EN. For example, the first inorganic layer 391 and the second inorganic layer 393 may contact each other in an area overlapping the power line 177. In one exemplary embodiment, the edge of the first inorganic layer 391 and the edge of the second inorganic layer 393 may substantially coincide with each other. In this way, the first inorganic layer 391 and the second inorganic layer 393 may be formed to be large to prevent moisture or oxygen from penetrating from the side surface of the display area DA, and to delay penetration by making the penetration path of moisture or oxygen long and complex.

[0054] Edges of the first and second inorganic layers 391 and 393 may be disposed on the power lines 177 to overlap with the power lines 177. The overlapped first and second inorganic layers 391 and 393 cover a portion of the power lines 177. The edges of the first and second inorganic layers 391 and 393 may be disposed closer to the display area DA than outer edges of the power lines 177 (e.g., edges of the power lines 177 away from the display area DA).

[0055] When the encapsulation layer EN is formed so that the edges of the first inorganic layer 391 and the second inorganic layer 393 are arranged to contact each other approximately near the edge of the encapsulation layer EN as described above, the size of the non-display area NA is not increased due to the formation of the encapsulation layer EN. Therefore, the width of the non-display area NA can be reduced or the formation and design margin of the wiring or components provided in the non-display area NA can be increased. For example, compared to a display device in which the first inorganic layer 391 and the second inorganic layer 393 completely cover the power line 177, the width of the non-display area NA can be reduced, and the screen-to-body ratio of the display device can be increased. Alternatively, the width of the power line 177 can be increased instead of reducing the width of the non-display area NA. In this embodiment, the resistance of the power line 177 can be reduced to improve power efficiency.

[0056] When the width w of the portion of the first inorganic layer 391 in contact with the power line 177 or the connection member 195 is equal to or greater than a predetermined value, the encapsulation layer EN can effectively prevent the penetration of moisture or oxygen even if the formation area of the encapsulation layer EN is reduced. For example, in an exemplary embodiment, it was determined in a 500-hour unbiased highly accelerated stress test (UHAST) reliability evaluation that when the width w of the portion of the first inorganic layer 391 in contact with the power line 177 or the connection member 195 is equal to or greater than approximately 82.53 μm, the encapsulation layer EN effectively prevents the penetration of moisture or oxygen.

[0057] The first inorganic layer 391 may be directly disposed on the connection member 195 or the power line 177. Therefore, the lower surface of the first inorganic layer 391 may contact the connection member 195 or the power line 177. The first inorganic layer 391 may contact the edge of the connection member 195, including the side surface of the edge of the connection member 195. Figure 2 In the exemplary embodiment shown in , the first inorganic layer 391 together with the second inorganic layer 393 covers the edge of the connection member 195, and the edge of the first inorganic layer 391 contacts the power line 177. However, the edge of the connection member 195 in the non-display area NA may not be covered by the first inorganic layer 391 and may substantially coincide with the edge of the first inorganic layer 391. Alternatively, the edge of the connection member 195 in the non-display area NA may be farther away from the display area DA than the edge of the first inorganic layer 391. In this embodiment, even when the first inorganic layer 391 overlaps the power line 177, it may not contact the power line 177.

[0058] A polarization layer for reducing external light reflection may be provided on the encapsulation layer EN, and a touch sensor layer including touch electrodes for sensing touch may be provided between the encapsulation layer EN and the polarization layer.

[0059] A dam DM may be provided on the second insulating layer 160 in the non-display area NA. The dam DM may be used to prevent organic materials, such as monomers, from overflowing when forming the organic layer 392 of the encapsulation layer EN. Therefore, the edge of the organic layer 392 of the encapsulation layer EN may be substantially disposed between the dam DM and the display area DA. The first and second inorganic layers 391 and 393 of the encapsulation layer EN may be configured to extend over the dam DM to cover the dam DM. In this case, since the contact area between the first and second inorganic layers 391 and 393 is increased, adhesion between the first and second inorganic layers 391 and 393 may be improved.

[0060] The dam DM may include at least one layer. The dam DM may be formed by using an insulating layer formed in the display area DA. For example, when the dam DM is formed as a single layer, the dam DM may be formed of the same material as the fourth insulating layer 360 by the same process as the fourth insulating layer 360. In other exemplary embodiments, the dam DM may be formed of the same material as the second insulating layer 160 by the same process as the second insulating layer 160. In an exemplary embodiment, when the dam DM is formed as a multilayer, the lower layer of the dam DM may be formed of the same material as the second insulating layer 160 by the same process as the second insulating layer 160, and the upper layer of the dam DM may be formed of the same material as the fourth insulating layer 360 by the same process as the fourth insulating layer 360. Figure 2 As shown in FIG, the lower surface of the dam DM may contact the connection member 195 in one region.

[0061] A protective layer 50 for protecting the display panel 10 may be provided below the display panel 10. The protective layer 50 may be attached to the rear surface of the display panel 10, such as by an adhesive. The protective layer 50 may be made of plastic such as polyethylene terephthalate, polyethylene naphthalate, polyimide, or polyethylene sulfide.

[0062] A crack dam CD may be provided between the power line 177 and the edge of the substrate 110 in the non-display area NA. For example, the crack dam CD is configured to prevent cracks from propagating in inorganic insulating layers such as the barrier layer 115 and the buffer layer 120 when the display panel 10 is cut to correspond to the edge of the substrate 110. The crack dam CD may be formed of an organic material. For example, in an exemplary embodiment, the crack dam CD may be formed of the same material as the second insulating layer 160 through the same process as the second insulating layer 160, or may be formed of the same material as the fourth insulating layer 360 through the same process as the fourth insulating layer 360.

[0063] The first and second insulating layers 140 and 160 may be formed such that their edges in the non-display area NA are positioned within the edges of the substrate 110 (e.g., closer to the display area DA than the edges of the substrate 110 in the non-display area NA). A crack dam CD may be formed to cover the edges of the first and second insulating layers 140 and 160 in the non-display area NA. A slit may be formed in the first and second insulating layers 140 and 160 in the region overlapping the crack dam CD. The first and second insulating layers 140 and 160 may be formed discontinuously due to the slit, thereby increasing the crack propagation prevention capability of the crack dam CD. The slit may be formed only in the second insulating layer 160. However, in some exemplary embodiments, the slit may not be formed in the crack dam CD. The crack dam CD may be formed so as not to overlap the first and / or second insulating layers 140 and 160.

[0064] In an exemplary embodiment, the crack dam CD may be configured to cover at least a portion of the side surface of the power line 177. In this embodiment, the crack dam CD prevents foreign particles from adhering to the side surface of the power line 177 or prevents corrosion of the side surface of the power line 177. For example, when the power line 177 is a multilayer structure (such as a multilayer structure including titanium / aluminum / titanium (Ti / Al / Ti)), during the etching process used to form the power line 177, the aluminum layer is etched more than the titanium layer, thereby potentially forming the power line 177 with a recessed edge side surface. Materials such as metal particles may be trapped in the recessed side surface during subsequent processes, resulting in unintentional stepping. When the crack dam CD is configured to cover the side surface of the edge of the power line 177, the crack dam CD fills such a recess and prevents unintentional stepping.

[0065] exist Figure 3 , an exemplary embodiment of a cross section of an edge of the display panel 10 provided with the pad portion PP is shown. Figure 1 As shown in FIG, since the dam DM surrounds the display area DA, the reference Figure 3 , the dam DM may be spaced apart from a portion of the display panel 10 where the pad portion PP is provided. Figure 2 The power line 177 shown in FIG may not be provided in the lower edge of the display panel 10. Therefore, the connection member 195 electrically connecting the power line 177 and the second electrode E2 may not overlap or contact the dam DM. The dam DM may be provided directly above the second insulating layer 160, and the lower surface of the dam DM may contact the second insulating layer 160. The first inorganic layer 391 and the second inorganic layer 393 of the encapsulation layer EN may be formed to cover the dam DM.

[0066] We will now describe Figure 3FIG. A bending region BR of an exemplary embodiment of a display device is shown in FIG. A connection wiring 179 is provided in the bending region BR. The connection wiring 179 is configured to electrically connect the first and second wirings 127 and 129, which are provided on opposite sides of the connection wiring 179. Therefore, signals output from the integrated circuit chip 30 (e.g., data signals, control signals, or voltage signals), signals input to the pad portion PP (e.g., a drive voltage (ELVDD) or a common voltage (ELVSS)), and the like can be transmitted to the display region DA, a driver, and the like via the second wiring 129, the connection wiring 179, and the first wiring 127. Because the connection wiring 179 is configured to bend when the bending region BR is bent, it can be formed from a metal with good flexibility and a low Young's modulus. In an exemplary embodiment, the connection wiring 179 can be formed from the same material as the source electrode 173 and the drain electrode 175 using the same process. The increased flexibility of the connection wiring 179 can reduce the risk of degradation (e.g., cracking) or disconnection of the connection wiring 179 during bending.

[0067] A first protective layer 165 may be provided between the substrate 110 and the connection wiring 179 in the bending region BR. The first protective layer 165 may include an organic insulating material such as polyimide, an acrylic polymer, or a siloxane polymer. A second protective layer 185 and a third protective layer 365 may be provided on the connection wiring 179. In an exemplary embodiment, the second protective layer 185 may be formed from the same material as the third insulating layer 180 using the same process as the third insulating layer 180. In an exemplary embodiment, the third protective layer 365 may be formed from the same material as the fourth insulating layer 360 using the same process as the fourth insulating layer 360. A bending protection layer 400 may be provided on the third protective layer 365. The bending protection layer 400 is configured to release tensile stress and protect the connection wiring 179. The bending protection layer 400 may be referred to as a stress neutralization layer. In an exemplary embodiment, the bending protection layer 400 may include an organic insulating material such as an acrylic resin.

[0068] The barrier layer 115, the buffer layer 120, the first insulating layer 140, and the second insulating layer 160, which are inorganic insulating layers including inorganic insulating materials, may be removed in the bending region BR. The inorganic insulating layer is easily cracked during bending, and the cracks may damage the wiring.

[0069] The protective layer 50 may be configured to completely cover the rear surface of the display panel 10 , but may not be disposed in the bending region BR to reduce bending stress of the bending region BR and reduce a curvature radius during bending.

[0070] In the following, reference will be made to Figures 4 to 8Some exemplary embodiments are described, focusing on differences from the above-mentioned embodiments.

[0071] Reference Figure 4 , the encapsulation layer EN can be formed so that the edges of the first inorganic layer 391 and the second inorganic layer 393 in the non-display area NA are substantially aligned with the edges of the power lines 177 and coincide with the edges of the power lines 177. As the widths of the first inorganic layer 391 and the second inorganic layer 393 increase, the moisture permeation prevention capability of the encapsulation layer EN can be increased. However, since the area where the first inorganic layer 391 and the second inorganic layer 393 are formed is within the area where the power lines 177 are formed, it is not necessary to increase the non-display area NA to have sufficient space for the encapsulation layer EN.

[0072] Figure 5 Examples and Figure 6 Examples and Figure 2 Examples and Figure 4 The embodiment of the present invention is different in that the display panel 10 does not include the dam DM and the crack dam CD. Since the manufacturing process of the display panel 10 is more accurately controlled, even when the dam DM and the crack dam CD are not formed, overflow of the forming material of the organic layer 392 of the encapsulation layer EN or cracks occurring during cutting of the display panel 10 can be prevented. Figures 1 to 4 Unlike the exemplary embodiments shown in , the dam DM or the crack dam CD may not be included in other exemplary embodiments.

[0073] Reference Figure 7 , two dams DM1 and DM2 may be located above the power line 177 in the non-display area NA. The first dam DM1 may be disposed closer to the display area DA than the second dam DM2. The first dam DM1 may be formed in at least one layer.

[0074] In exemplary embodiments, the first dam DM1 may be formed of the same material as the fourth insulating layer 360 in the same process as that of the fourth insulating layer 360. A lower surface of the first dam DM1 may contact the connection member 195. The second dam DM2 may include a plurality of layers.

[0075] The second dam DM2 may include a first layer L1 and a second layer L2 disposed on the first layer L1. A connecting member 195 may be disposed between the first layer L1 and the second layer L2. In an exemplary embodiment, the first layer L1 may be formed by the same process as the third insulating layer 180 and from the same material as the third insulating layer 180. The lower surface of the first layer L1 may be in contact with the power line 177. In an exemplary embodiment, the second layer L2 may be formed by the same process as the fourth insulating layer 360 and from the same material as the fourth insulating layer 360. Therefore, the first dam DM1, the second layer L2 of the second dam DM2, and the fourth insulating layer 360 may be formed by stacking organic insulating materials and patterning the organic insulating materials.

[0076] In exemplary embodiments, the first dam DM1 may be formed of a material different from that of the second layer L2 of the second dam DM2 or may be formed through another process. The first dam DM1 may include a plurality of layers, and the second dam DM2 may include a single layer.

[0077] The first and second inorganic layers 391 and 393 of the encapsulation layer EN can be formed to extend over the first and second dams DM1 and DM2. The edges of the first and second inorganic layers 391 and 393 can substantially coincide with the outer edges of the power lines 177. In this manner, by forming the first and second dams DM1 and DM2 and the first and second inorganic layers 391 and 393, overflow of the material forming the organic layer 392 of the encapsulation layer EN can be more effectively prevented. Furthermore, the contact area between the first and second inorganic layers 391 and 393 can be increased to enhance adhesion between the first and second inorganic layers 391 and 393, thereby improving the moisture permeation prevention capability of the encapsulation layer EN. However, since the first and second dams DM1 and DM2 and the first and second inorganic layers 391 and 393 are formed within the formation region of the power lines 177, the non-display area NA is not increased by the first and second dams DM1 and DM2 and the first and second inorganic layers 391 and 393. Alternatively, the width of the power line 177 may be increased instead of reducing the width of the non-display area NA, and in this case, the resistance of the power line 177 may be reduced to improve power efficiency.

[0078] Figure 8 The exemplary embodiment shown in Figure 7The embodiment of the present invention is different in that the second dam DM2 is disposed closer to the first dam DM1, and the edges of the first and second inorganic layers 391 and 393 in the non-display area NA are disposed closer to the display area DA than the outer edges of the power lines 177. It is confirmed that if the width w of the first inorganic layer 391 in contact with the power lines 177 or the connection members 195 is equal to or greater than a predetermined value, even when the first and second inorganic layers 391 and 393 are formed as described above, moisture penetration can be effectively prevented.

[0079] While the inventive concept has been described in connection with what are presently considered to be practical exemplary embodiments, it is to be understood that the inventive concept is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A display device, comprising: A substrate including a display area and a non-display area; a light emitting element disposed in the display area and comprising a first electrode, a second electrode, and an emission layer disposed between the first electrode and the second electrode; an encapsulation layer configured to cover the display area and encapsulate the light emitting element, and comprising a first inorganic layer, a second inorganic layer, and an organic layer disposed between the first inorganic layer and the second inorganic layer; a power line disposed in the non-display area; as well as a connecting member electrically connecting the second electrode to the power line, The first edge of the encapsulation layer in the non-display area is arranged to coincide with the edge of the power line, or is arranged to be closer to the display area than the edge of the power line. wherein the first inorganic layer is configured to contact the power line and the connection member in a region where the encapsulation layer overlaps the power line, and Wherein, the first edge of the encapsulation layer in the non-display area contacts the power line.

2. The display device according to claim 1, wherein The first edge of the encapsulation layer corresponds to edges of the first inorganic layer and the second inorganic layer.

3. The display device according to claim 2, wherein: The first inorganic layer and the second inorganic layer are in contact with each other in a region where the encapsulation layer overlaps the power line.

4. The display device according to claim 1, further comprising: at least one dam disposed in the non-display area, The at least one dam is configured to overlap the power line and be covered by the first inorganic layer and the second inorganic layer of the encapsulation layer.

5. The display device according to claim 4, wherein The at least one dam is configured to contact the power line or the connection member connected to the power line.

6. The display device according to claim 1, further comprising: A crack dam is provided between an edge of the substrate in the non-display area and the electric force lines.

7. The display device according to claim 6, wherein: The crack dam covers at least a portion of a side surface of the power line.

8. The display device according to claim 1, wherein The power lines are configured to transmit a common voltage.

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