Integrated antenna packaging structure

Abstract

The present invention discloses an integrated antenna packaging structure, comprising a packaging body, an RDL metal layer, a conductive connection part, a bare chip and a conductive structure, wherein the RDL metal layer, the conductive connection part, the bare chip and the conductive structure are located in the packaging body; the conductive structure comprises a first surface and a second surface, the first surface of the conductive structure is electrically connected to the bare chip, and the second surface of the conductive structure is flush with the surface of the packaging body or extends out of the packaging body; there are multiple conductive connection parts, one end of the conductive connection part is electrically connected to the RDL metal layer, and the other end is electrically connected to the bare chip or the conductive structure; the RDL metal layer has an antenna structure. The packaged antenna of the present invention has excellent performance, greatly reduced volume, and low packaging cost.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to an integrated antenna packaging structure. Background Art

[0002] With the widespread promotion of IoT technology, 2.4G, BLE, WIFI and other technologies have occupied the main market in IoT applications. At the same time, the demand for miniaturization, lightweight, high integration and low cost of wireless systems is increasing. The demand for packaged antenna (AIP) technology to be applied to the 2.4G frequency band has been further strengthened. This technology can not only lower the technical development threshold of solution companies, but also reduce volume and cost, providing a good solution for further integration of 2.4G wireless systems. However, due to the relatively long wavelength of the 2.4G frequency band, it is difficult to integrate the antenna into the package. Even if it is integrated, it will either sacrifice performance, volume, or increase packaging costs. Summary of the invention

[0003] Purpose of the invention: In order to solve the problem in the prior art that it is difficult to integrate the antenna into the package, the present invention provides an integrated antenna packaging structure.

[0004] Technical solution: An integrated antenna packaging structure includes a packaging body, an RDL metal layer, a conductive connection part, a bare chip and a conductive structure, wherein the RDL metal layer, the conductive connection part, the bare chip and the conductive structure are located within the packaging body; the conductive structure includes a first surface and a second surface, the first surface of the conductive structure is electrically connected to the bare chip, and the second surface of the conductive structure is flush with the surface of the packaging body or extends out of the packaging body; there are multiple conductive connections, one end of the conductive connection part is connected to the RDL metal layer, and the other end is connected to the bare chip or the conductive structure; the RDL metal layer has an antenna structure.

[0005] Furthermore, the conductive connection portion includes at least a first conductive connection portion and a second conductive connection portion, the first conductive connection portion is used to connect the RDL metal layer and the radio frequency signal interface of the bare chip; the second conductive connection portion is used to connect the RDL metal layer and the conductive structure.

[0006] Furthermore, the antenna structure on the RDL metal layer adopts an IFA antenna.

[0007] Furthermore, the antenna structure includes an antenna feed part, an antenna ground part and an antenna radiating arm, one end of the antenna feed part is connected to a first conductive connecting part, the other end is connected to one end of the antenna ground part, and the other end of the antenna ground part is connected to a second conductive connecting part; the antenna radiating arm is led out from the connection between the antenna feed part and the antenna ground part; the antenna radiating arm includes a tail and multiple bending parts, the multiple bending parts are connected end to end, and the tail is connected to the end of the bending part and is perpendicular to the antenna feed part.

[0008] Furthermore, the antenna structure on the RDL metal layer is fed by a coplanar waveguide.

[0009] Furthermore, the antenna structure includes a central conductor strip, a first metal patch, a second metal patch, a third metal patch and a fourth metal patch; there is no conductive contact between the central conductor strip, the first metal patch, the second metal patch, the third metal patch and the fourth metal patch; the first metal patch and the second metal patch are symmetrically distributed on both sides of the central conductor strip, and the first metal patch and the second metal patch are respectively connected to a second conductive connection part; one end of the central conductor strip is connected to the first conductive connection part; the third metal patch is located outside the other end of the central conductor strip; the fourth metal patch is located outside the third metal patch, and rectangular grooves are provided between the fourth metal patch and the first metal patch, and between the fourth metal patch and the second metal patch; gaps are provided on the first metal patch, the second metal patch and the fourth metal patch; the antenna structure is square, and a pair of corners of the square are beveled angles.

[0010] Furthermore, the gaps on the first metal patch and the second metal patch include a plurality of branches, and the plurality of branches are distributed divergently.

[0011] Furthermore, the gaps on the first metal patch and the second metal patch are cross-shaped gaps, and each branch has the same length and width.

[0012] Furthermore, the gap on the fourth metal patch includes a U-shaped gap, and the U-shaped gap accommodates the third metal patch in the U-shaped opening of the U-shaped gap.

[0013] Furthermore, the conductive connection portion is made by a bump process, or a metallized through hole; the conductive structure includes one or more of a base island, a substrate, and a pad.

[0014] Compared with the prior art, the integrated antenna packaging structure provided by the present invention has the following advantages:

[0015] 1. Adopting the existing chip internal packaging structure layer and packaging materials, greatly reducing the packaging structure and material costs;

[0016] 2. The low profile and size of the antenna can be achieved by using a conductive connection to connect the antenna to the RF signal and the ground layer;

[0017] 3. The coplanar waveguide feeding method only requires one RDL metal layer to realize the antenna design, which simplifies the internal stacking structure of the package. In addition, the design can flexibly achieve 50 ohm impedance matching and flexibly adjust the gap distance with the ground metal patch to adjust the impedance bandwidth and antenna gain of the antenna;

[0018] 4. The coplanar waveguide and grounded metal patch gap coupling excitation method can realize the integration of low-frequency antennas in a smaller area; the IFA antenna is used to achieve the integration of low-frequency antennas by lengthening the bending part and increasing the number; it is suitable for antennas with a frequency band of ≥2.4G, and the AIP size of the 2.4G band can be 6mm*6mm;

[0019] 5. Epoxy resin is used as the medium, which is the material used for conventional chip packaging. It has low cost, and its dielectric constant and loss tangent are relatively stable under high and low temperature environments. Adjusting the height of the epoxy resin can fine-tune the bandwidth and resonant frequency of the antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the integrated antenna packaging structure of the first embodiment;

[0021] Figure 2 It is a schematic structural diagram of the RDL metal layer of the first embodiment;

[0022] Figure 3 It is a schematic diagram of the structure of the RDL metal layer of the second embodiment. DETAILED DESCRIPTION

[0023] The present invention is further explained below in conjunction with the accompanying drawings and specific embodiments.

[0024] Embodiment 1:

[0025] like Figure 1 As shown, an integrated antenna packaging structure includes a packaging body 6, an RDL metal layer 1, a conductive connection part, a bare chip 3 and a conductive structure 4. The RDL metal layer 1, the conductive connection part, the bare chip 3 and the conductive structure 4 are located in the packaging body 6. The packaging body 6 is made of epoxy resin, and the packaging body 6 is uniformly filled around the RDL metal layer 1, the conductive connection part, and the bare chip 3; the conductive structure 4 includes a first surface and a second surface, the first surface of the conductive structure 4 is electrically connected to the bare chip 3, and the second surface of the conductive structure 4 is flush with the surface of the packaging body 6, and can also extend out of the packaging body 6; the RDL metal layer 1 has an antenna structure. In this embodiment, there are two conductive connection parts, including a first conductive connection part 2 and a second conductive connection part 5. The first conductive connection part 2 is used to electrically connect the RDL metal layer 1 and the radio frequency signal interface of the bare chip 3; the second conductive connection part 5 is used to electrically connect the RDL metal layer 1 and the conductive structure 4. The conductive connection part can also be set to other numbers according to the needs of the antenna. The conductive structure 4 in this embodiment is a pad, and can also be other conductive structures that can achieve electrical connection with the outside world.

[0026] The conductive connection portion is made by a bump process, and may also be made by a metallized through hole or other process that can achieve conductive connection; the conductive structure may be a base island, a substrate or a pad, etc.

[0027] like Figure 2 As shown, the antenna structure on the RDL metal layer 1 adopts an IFA antenna, including an antenna feed part 11, an antenna ground part 12 and an antenna radiating arm 13, one end of the antenna feed part 11 is connected to the first conductive connection part 2, and the other end is connected to one end of the antenna ground part 12, and the other end of the antenna ground part 12 is connected to the second conductive connection part 5; the antenna radiating arm 13 is led out from the connection between the antenna feed part 11 and the antenna ground part 12; the antenna radiating arm 13 includes a tail and multiple bending parts, the multiple bending parts are connected end to end, and the tail is connected to the end of the bending part and is perpendicular to the antenna feed part 11.

[0028] The first conductive connection part 2 connects the antenna feeding part 11 with the radio frequency signal interface of the bare chip 3 to complete the feeding excitation; the second conductive connection part 5 connects the antenna grounding part 12 with the ground of the bare chip 3 .

[0029] The epoxy resin is uniformly filled under the RDL metal layer 1, and the bandwidth and resonant frequency of the antenna can be adjusted by adjusting the height of the package body 6. By utilizing the length and width of the RDL metal layer, the width and number of bends of the antenna radiation arm 13 are fully increased to achieve the desired resonant frequency and radiation gain, and the linear polarization of the antenna can be achieved.

[0030] Embodiment 2:

[0031] An integrated antenna packaging structure includes a packaging body 6, an RDL metal layer 1, a conductive connection part, a bare chip 3 and a conductive structure 4. The RDL metal layer 1, the conductive connection part, the bare chip 3 and the conductive structure 4 are located in the packaging body 6. The packaging body 6 is made of epoxy resin, and the packaging body 6 is uniformly filled around the RDL metal layer 1, the conductive connection part and the bare chip 3; the conductive structure 4 includes a first surface and a second surface, the first surface of the conductive structure 4 is electrically connected to the bare chip 3, and the second surface of the conductive structure 4 is flush with the surface of the packaging body 6, and can also extend out of the packaging body 6; the RDL metal layer 1 has an antenna structure. In this embodiment, there is a first conductive connection part 2 and two second conductive connection parts 5, the first conductive connection part 2 is used to electrically connect the RDL metal layer 1 and the radio frequency signal interface of the bare chip 3; the second conductive connection part 5 is used to electrically connect the RDL metal layer 1 and the conductive structure 4, and the conductive connection part can also be set to other numbers according to the needs of the antenna. The conductive structure 4 in this embodiment is a pad, and can also be other conductive structures to achieve electrical connection with the outside world.

[0032] The conductive connection portion is made by a bump process, and may also be made by a metallized through hole or other process that can achieve conductive connection; the conductive structure may be a base island, a substrate or a pad, etc.

[0033] like Figure 3As shown, the antenna structure on the RDL metal layer 1 of this embodiment is fed by a coplanar waveguide, including a central conductor strip 21, a first metal patch 22, a second metal patch 23, a third metal patch 24 and a fourth metal patch 25; the central conductor strip 21, the first metal patch 22, the second metal patch 23, the third metal patch 24 and the fourth metal patch 25 have no conductive contact with each other; the first metal patch 22 and the second metal patch 23 are symmetrically distributed on both sides of the central conductor strip 21, and the first metal patch 22 and the second metal patch 23 are respectively connected to a second conductive connection portion 5 ; One end of the central conductor band 21 is connected to the first conductive connecting part 2; the third metal patch 24 is located outside the other end of the central conductor band 21; the fourth metal patch 25 is located outside the third metal patch 24, and rectangular grooves 26 are provided between the fourth metal patch 25 and the first metal patch 22, and between the fourth metal patch 25 and the second metal patch 23; gaps are provided on the first metal patch 22, the second metal patch 23 and the fourth metal patch 25; the antenna structure is a square, and one of the two corners of the square is a bevel angle 27, and the rectangular groove 26 and the bevel angle 27 are used to realize the circular polarization of the antenna.

[0034] The gaps on the first metal patch 22 and the second metal patch 23 include a plurality of branches distributed divergently. In this embodiment, the gaps on the first metal patch 22 and the second metal patch 23 are cross-shaped gaps 28, and the branches of the cross are equal in length and width. A Y-shaped gap may also be used, but the effect is not as good as the cross-shaped gap.

[0035] The gap on the fourth metal patch 25 is a U-shaped gap 29 , and the U-shaped gap 29 accommodates the third metal patch 24 in the U-shaped opening of the U-shaped gap 29 . Other gap structures can also be added on the basis of the U-shaped gap, but the U-shaped gap 29 is easier to debug.

[0036] The coplanar waveguide (CPW) structure connects the RF signal transmission interface of the bare chip through the first conductive connection part 2 to complete the feeding of the antenna; if the dielectric material and dielectric thickness are fixed, the impedance and gap energy coupling strength can be adjusted by adjusting the width of the center conductor strip and the width of the gap between the center conductor strip and the grounded metal patch.

[0037] On the one hand, the U-shaped slot 29 can increase the current cross section to achieve the resonance of the low-frequency antenna in a smaller area, and on the other hand, it can form a multi-tuned circuit to reduce the Q value to increase the radiation bandwidth; the cross-shaped slot 28 adjusts the resonant frequency of the antenna by adjusting the length and width parameters of the cross slot, and reduces the resonant frequency of the antenna without affecting the antenna performance, thereby further reducing the size of the antenna. Therefore, the main functions of the cross-shaped slot and the U-shaped slot are to realize a low-frequency antenna on a smaller metal patch, that is, to reduce the antenna resonant frequency.

[0038] The feeding surface on the RDL metal layer 1 is fed by a coplanar waveguide, so only one layer of RDL metal layer is needed, which greatly reduces the packaging cost, and can realize linear polarization, circular polarization and multi-band antennas, and its effect is better than that of embodiment 1. The antenna structure on the RDL metal layer 1 adopts multiple metal patches, and multiple gap coupling is formed between the metal patches and between the metal patches and the central conductor strip, which can greatly reduce the size of the antenna. Epoxy resin is evenly filled under the RDL metal layer 1, and the bandwidth and resonant frequency of the antenna can be adjusted by adjusting the height of the package body 6.

Claims

1. An integrated antenna packaging structure, characterized in that: The invention comprises a package body, an RDL metal layer, a conductive connection part, a bare chip and a conductive structure, wherein the RDL metal layer, the conductive connection part, the bare chip and the conductive structure are located in the package body; the conductive structure comprises a first surface and a second surface, the first surface of the conductive structure is electrically connected to the bare chip, and the second surface of the conductive structure is flush with the surface of the package body or extends out of the package body; there are multiple conductive connections, including at least a first conductive connection part and a second conductive connection part, the first conductive connection part is used to connect the RDL metal layer and the radio frequency signal interface of the bare chip; the second conductive connection part is used to connect the RDL metal layer and the conductive structure; the RDL metal layer has an antenna structure, which is fed by a coplanar waveguide method, and the antenna structure comprises a central conductor strip, a first metal patch, a second metal patch, a third metal patch and a fourth metal patch; the central conductor strip, the first metal patch, the second metal patch There is no conductive contact between the first metal patch, the third metal patch and the fourth metal patch; the first metal patch and the second metal patch are symmetrically distributed on both sides of the central conductor strip, and the first metal patch and the second metal patch are respectively connected to a second conductive connecting portion; one end of the central conductor strip is connected to the first conductive connecting portion; the third metal patch is located outside the other end of the central conductor strip; the fourth metal patch is located outside the third metal patch, and rectangular grooves are provided between the fourth metal patch and the first metal patch, and between the fourth metal patch and the second metal patch; gaps are provided on the first metal patch, the second metal patch and the fourth metal patch, and the gaps on the first metal patch and the second metal patch include a plurality of branches, and the plurality of branches are divergently distributed; the gap on the fourth metal patch includes a U-shaped gap, and the U-shaped gap accommodates the third metal patch in the U-shaped opening of the U-shaped gap.

2. The integrated antenna packaging structure according to claim 1, characterized in that: The gaps on the first metal patch and the second metal patch are cross-shaped gaps, and each branch has the same length and width.

3. The integrated antenna packaging structure according to claim 1 or 2, characterized in that: The conductive connection portion is made by a bump process or a metallized through hole; the conductive structure includes one or more of a base island, a substrate, and a pad.

Images