Display Devices

Abstract

A display device is disclosed, the display device comprising: a light source configured to generate light; a display panel configured to display an image using the light; a light guide having at least one surface adjacent to the light source; and an optical member located between the light guide and the display panel. The optical member comprises: a low refractive index layer located on a light exit surface of the light guide; a first cover layer located on the low refractive index layer; and a light conversion layer located on the first cover layer and configured to convert a wavelength band of incident light.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0135703 filed on November 7, 2018, in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of the present invention relate to a display device, and more particularly, to a display device having improved display quality. Background Art

[0004] Among display devices, next-generation advanced display elements with low power consumption, good portability, and high added value are attracting attention. The display device includes a thin film transistor ("TFT") that can control on / off of a voltage of each pixel.

[0005] The display device may include a display panel and a light providing unit for providing light to the display panel. The display panel includes an active grid that modulates light emitted from the light providing unit. The light providing unit may include a light source and a light guide plate. The light generated from the light source is guided in the light guide plate and provided to the display panel.

[0006] It will be understood that this background technology section is intended to provide useful background technology for understanding the technology and the same as disclosed herein, so that the background technology section may include ideas, concepts or cognitions that were not known or understood by those skilled in the art before the corresponding actual filing date of the subject matter disclosed herein. Summary of the invention

[0007] Embodiments of the present invention may relate to a display device having improved durability and display quality.

[0008] According to an embodiment, a display device includes: a light source configured to generate light; a display panel configured to display an image using the light; a light guide having at least one surface adjacent to the light source; and an optical member located between the light guide and the display panel. The optical member includes: a low refractive index layer located on a light exit surface of the light guide; a first cover layer located on the low refractive index layer; and a light conversion layer located on the first cover layer, the light conversion layer configured to convert a wavelength band of incident light. The first cover layer includes: a first barrier layer located on the low refractive index layer; and a second barrier layer located on the first barrier layer and having a density lower than that of the first barrier layer.

[0009] The refractive index of the low refractive index layer may be greater than or substantially equal to about 1.1 and less than or substantially equal to about 1.3.

[0010] The first barrier layer may have a higher refractive index than that of the second barrier layer.

[0011] The second barrier layer may have a pore density higher than that of the first barrier layer.

[0012] The first barrier layer and the second barrier layer may include substantially the same material.

[0013] The first barrier layer and the second barrier layer may include different materials from each other.

[0014] Each of the first barrier layer and the second barrier layer may include SiO x 、SiN x and SiO x N x At least one of .

[0015] The sum of the thicknesses of the first barrier layer and the second barrier layer may be greater than or substantially equal to about 3000 angstroms.

[0016] The sum of the thicknesses of the first barrier layer and the second barrier layer may be greater than or substantially equal to about

[0017] The first barrier layer may have a thickness greater than or substantially equal to about and less than about

[0018] The display device may further include a second cover layer on the light conversion layer.

[0019] The first cover layer may cover a side surface of the low refractive index layer, and the second cover layer may cover a side surface of the light conversion layer.

[0020] According to an embodiment, a display device includes: a light source configured to generate light; a display panel configured to display an image using the light; a light guide having at least one surface adjacent to the light source; and an optical member located between the light guide and the display panel. The optical member includes: a low refractive index layer located on a light exit surface of the light guide; a first cover layer located on the low refractive index layer; and a light conversion layer located on the first cover layer, the light conversion layer configured to convert a wavelength band of incident light. The first cover layer includes: a first barrier layer formed on the low refractive index layer by depositing a first inorganic material at a first temperature; and a second barrier layer formed on the first barrier layer by depositing a second inorganic material at a second temperature higher than the first temperature.

[0021] The first temperature may be greater than or substantially equal to about 300 degrees (°C), and the second temperature may be less than about 300°C.

[0022] The first barrier layer may have a thickness greater than or substantially equal to about and less than about

[0023] According to an embodiment, a method for manufacturing a display device includes: forming a low refractive index layer on a substrate; forming a first covering layer on the low refractive index layer; and forming a light conversion layer on the first covering layer. Forming the first covering layer includes: forming a first barrier layer by depositing a first inorganic material on the low refractive index layer at a first temperature for a first period of time; and forming a second barrier layer by depositing a second inorganic material on the first barrier layer at a second temperature for a second period of time, the second temperature being lower than the first temperature.

[0024] Each of the first inorganic material and the second inorganic material may include SiO x 、SiN x and SiO x N x At least one of .

[0025] The first temperature may be greater than or substantially equal to about 300°C, and the second temperature may be less than about 300°C.

[0026] The first time period may exceed or be substantially equal to about 60 seconds (s) and less than about 120 s.

[0027] According to an embodiment, a light providing unit includes: a light source configured to generate light; a light guide having at least one surface adjacent to the light source; and an optical member located on the light guide. The optical member includes: a low refractive index layer located on a light exit surface of the light guide; a blocking layer located on the low refractive index layer; and a light conversion layer located on the blocking layer, the light conversion layer configured to convert a wavelength band of incident light. The density of a first portion of the blocking layer is greater than the density of a second portion of the blocking layer, and the second portion of the blocking layer is farther away from the low refractive index layer than the first portion of the blocking layer.

[0028] The foregoing is illustrative only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] A more complete understanding of the present invention will become more apparent by describing in detail embodiments of the present invention with reference to the accompanying drawings, in which:

[0030] Figure 1 is an exploded perspective view showing a display device according to an embodiment;

[0031] Figure 2 It is along Figure 1 A cross-sectional view taken along line II' shown in FIG.

[0032] Figure 3 is an enlarged cross-sectional view of a display member according to an embodiment;

[0033] Figure 4 is a perspective view showing a light guide member and an optical member according to an embodiment;

[0034] Figure 5A It is along Figure 4 A cross-sectional view taken along line II-II' shown in FIG.

[0035] Figure 5B It is along Figure 4 A cross-sectional view taken along line III-III' shown in FIG.

[0036] Figure 5C It is along Figure 4 A cross-sectional view taken along line II-II' shown in FIG.

[0037] Figure 6 is a flowchart showing a method of manufacturing an optical member according to an embodiment;

[0038] Figure 7 is a flowchart illustrating a method of manufacturing a first cover layer according to an embodiment; and

[0039] 8A to 9C is a graph showing changes in brightness over time according to the material of the first barrier layer and the deposition temperature. DETAILED DESCRIPTION

[0040] Hereinafter, embodiments will be described in more detail with reference to the accompanying drawings, and in all the accompanying drawings, the same reference numerals refer to the same elements. However, the present invention can be implemented in a variety of different forms and should not be construed as being limited only to the embodiments shown herein. More specifically, these embodiments are provided as examples so that the disclosure will be comprehensive and complete, and will fully convey the aspects and features of the present invention to those skilled in the art. Therefore, unnecessary processes, elements and techniques for a complete understanding of the aspects and features of the present invention by those of ordinary skill in the art may not be described. Unless otherwise stated, in all the accompanying drawings and written descriptions, the same reference numerals refer to the same elements, and therefore, their descriptions will not be repeated. In the accompanying drawings, for clarity, the relative sizes of elements, layers and regions may be exaggerated.

[0041] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, without departing from the spirit and scope of the present invention, the first element, first component, first region, first layer or first section described below may be referred to as the second element, second component, second region, second layer or second section.

[0042] For ease of description, spatially relative terms such as "below," "below," "lower," "under," "above," "upper," etc. may be used herein to describe the relationship of one element or feature to another element (or elements) or feature (or features) as shown in the figures. It should be understood that, in addition to the orientation depicted in the drawings, the spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the drawings is flipped, the elements described as being "below" or "below" or "under" other elements or features will then be oriented "above" the other elements or features. Therefore, the exemplary terms "below" and "under" may encompass both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0043] It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or there may be one or more intervening elements or layers. Additionally, it will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or there may also be one or more intervening elements or layers.

[0044] The term used herein is only for the purpose of describing a specific embodiment, and is not intended to limit the present invention. As used herein, the singular form "a" and "an" are intended to also include plural forms, unless the context clearly states otherwise. It will be further understood that when used in this specification, the terms "comprises", "comprising", "includes" and "including" specify the existence of the features, integral bodies, steps, operations, elements and / or components set forth, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, components and / or their groups. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items. When positioned after the element of a list, statements such as "at least one of ... " modify the elements of the entire list rather than modifying the individual elements in the list.

[0045] As used herein, the terms "substantially", "approximately" and similar terms are used as approximate terms rather than as terms of degree, and are intended to allow for the inherent deviations of measurements or calculations that will be recognized by those of ordinary skill in the art. For example, "approximately" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the value described. In addition, the use of "may" when describing embodiments of the present invention means "one or more embodiments of the present invention". As used herein, the terms "use", "using" and "used" may be understood as synonymous with the terms "utilize", "utilizing" and "utilized", respectively. In addition, the term "exemplary" is intended to mean an example or illustration.

[0046] The display device according to the embodiment of the present invention described herein can be implemented using any appropriate hardware, firmware (e.g., an application specific integrated circuit), software, or a combination of software, firmware, and hardware. For example, the display device may include a display member, a light providing unit, and a containing member. The display member may be a liquid crystal display (LCD), and the light providing unit may include a light source, a light guide, an optical member, a reflective member, and / or a mold frame. The various components of these devices may be formed on an integrated circuit (IC) chip or on separate IC chips. In addition, the various components of these devices may be implemented on a flexible printed circuit film, a carrier package (TCP), a printed circuit board (PCB), or formed on a substrate.

[0047] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art in the art to which the present invention belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0048] Hereinafter, desired embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

[0049] Figure 1 is an exploded perspective view showing a display device according to an embodiment, and Figure 2 It is along Figure 1 A cross-sectional view taken along line II' shown in FIG.

[0050] refer to Figure 1 and Figure 2 , the display device 1000 according to the embodiment has a quadrilateral shape having short sides in the first direction DR1 and long sides in the second direction DR2. However, the display device 1000 according to another embodiment is not limited thereto and may have various suitable shapes as understood by those skilled in the art.

[0051] The display apparatus 1000 includes a window member (or window) 100 , a display member (or display) 200 , a light providing unit (or backlight) BLU, and a receiving member 700 .

[0052] For convenience of description, the direction in which an image is provided in the display device 1000 is defined as an upward direction, and the direction opposite to the upward direction is defined as a downward direction. In the present embodiment, the upward direction and the downward direction are parallel to a third direction DR3, and the third direction DR3 is defined as a direction orthogonal to the first direction DR1 and the second direction DR2. The third direction DR3 may be a reference direction for distinguishing the top surface and the bottom surface of an element to be described below. However, the upward direction and the downward direction may be transformed into different directions as relative concepts.

[0053] The window member 100 includes a transmission portion TA for transmitting an image provided from the display member 200 and a light blocking portion CA adjacent to the transmission portion TA and not transmitting the image. The transmission portion TA is located at a central portion of the display device 1000 on a plane defined by a first direction DR1 and a second direction DR2. The light blocking portion CA is disposed around the transmission portion TA and has a frame shape surrounding (e.g., surrounding in a plane) the transmission portion TA. However, the embodiment is not limited thereto. According to another embodiment, the window member 100 may include only the transmission portion TA, in which case the light blocking portion CA is not included.

[0054] Window member 100 may include materials including glass, sapphire, plastic, or any other suitable transparent material as will be appreciated by those skilled in the art.

[0055] The display member 200 is disposed under the window member 100. The display member 200 displays an image using light provided from the light providing unit BLU. That is, the display member 200 may include a light receiving type display panel. According to an embodiment, for example, the display member 200 may include a liquid crystal display ("LCD") panel.

[0056] In a plan view, a surface of the display member 200 on which an image is displayed is defined as a display surface. The display surface includes a display area DA where an image is displayed and a non-display area NDA where an image is not displayed. The display area DA may be defined at a central portion of the display member 200 in a plan view and may overlap with the transmissive portion TA of the window member 100.

[0057] The light providing unit BLU is disposed below the display member 200 and provides light to the display member 200. According to the present embodiment, the light providing unit BLU may be an edge-type light providing unit. However, the embodiment is not limited thereto. For example, the light providing unit BLU may be a full-array backlight, which may include an array of light-emitting diodes (LEDs) corresponding to the pixels of the display member 200. According to another embodiment, although not shown in the figure, the light providing unit BLU may be, for example, a direct-type light providing unit.

[0058] The light providing unit BLU according to the present embodiment includes a light source LS, a light guide member 300 , an optical member 400 , a reflective member 500 , and a mold frame 600 .

[0059] The light source LS (eg, edge type light source) is disposed adjacent to one side surface of the light guide member 300 in the first direction DR1. However, embodiments are not limited to the location of the light source LS, and the light source LS may be disposed adjacent to at least one of the side surfaces of the light guide member 300.

[0060] The light source LS includes a plurality of light source units LSU and a light source substrate LSS.

[0061] The light source unit LSU generates light to be provided to the display member 200 , and provides the light to the light guide member 300 .

[0062] According to an embodiment, the light source unit LSU may generate a first light. The first light may have a first wavelength band. For example, the first wavelength band may be greater than or substantially equal to about 400 nm and less than or substantially equal to about 500 nm. That is, the light source unit LSU may substantially generate blue light, however, the wavelength band is not so limited, and any suitable wavelength band as understood by those skilled in the art may be used.

[0063] According to an embodiment, the light source unit LSU may be a light emitting diode ("LED"), each of which functions as a point light source. However, the present invention is not limited to the type of the light source unit LSU.

[0064] In addition, the present invention is not limited to the number of light source units LSU. According to another embodiment, the light source unit LSU may be provided as a point light source having a single LED instead of a plurality of LEDs, or may be provided as a plurality of LED groups. In addition, according to another embodiment, the light source unit LSU may be a line light source such as a plurality of LEDs forming a line or a cold cathode fluorescent lamp.

[0065] The light source unit LSU may be mounted on a light source substrate LSS. The light source substrate LSS is disposed to face one side of the light guide member 300 in the first direction DR1 and extend in the second direction DR2. However, embodiments are not particularly limited to the shapes and arrangement relationships of the light source unit LSU and the light source substrate LSS.

[0066] The light source substrate LSS may include a light source controller connected to the light source unit LSU. The light source controller may analyze an image to be displayed on the display member 200 to output a local dimming signal, and control the brightness of light generated by the light source unit LSU in response to the local dimming signal. For example, the light source controller may be configured to control the brightness of light generated by a single light source unit LSU or a plurality of light source units LSU grouped together in zones, and each of these zones may correspond to an area of ​​the display member 200. In another embodiment, the light source controller may be mounted on a separate circuit board, and its location is not particularly limited.

[0067] The light guiding member 300 includes a material having a high light transmittance in the visible light range. For example, the light guiding member 300 may include a glass material. In another embodiment, the light guiding member 300 may include a transparent polymer resin such as polymethyl methacrylate ("PMMA"). In the present embodiment, the light guiding member 300 may have a refractive index greater than or substantially equal to about 1.4 and less than or substantially equal to about 1.55.

[0068] The light guide member 300 includes a light exit surface TS, a bottom surface, and a plurality of side surfaces IS, SS, and OS (eg, Figure 2 and Figure 4). A side surface adjacent to the light source LS may be considered a light incident surface IS, and a side surface opposite to the light incident surface IS may be considered a light opposite surface OS.

[0069] Although not shown in the drawings, the light guide member 300 may include a plurality of light emitting patterns formed on the light exit surface TS or the bottom surface. The light emitting patterns are used to refract light incident to the light exit surface TS or the bottom surface of the light guide member 300 and change the reflection angle of the light. The light emitting patterns may have a concave or embossed shape on the light exit surface TS or the bottom surface.

[0070] The optical member 400 is disposed on the light guide member 300. The lower surface of the optical member 400 is in contact with the upper surface of the light guide member 300. Figures 4 to 6 The optical member 400 is described in more detail.

[0071] The reflective member 500 is disposed below the light guide member 300. The reflective member 500 reflects light emitted in a direction below the light guide member 300 in an upward direction. The reflective member 500 includes a material that reflects light. For example, the reflective member 500 may include aluminum, silver, or any other suitable reflective material as will be understood by those skilled in the art.

[0072] Although not shown in the figure, the light providing unit BLU may further include at least one optical sheet disposed between the optical member 400 and the display member 200. When a plurality of optical sheets are provided, the plurality of optical sheets may include a diffusion sheet, a prism sheet, and a protective sheet. The diffusion sheet may diffuse the light provided from the optical member 400. The prism sheet is disposed on the diffusion sheet and is used to collimate the light diffused by the diffusion sheet in an upward direction perpendicular to the plane. The protective sheet may protect the prisms of the prism sheet from external friction. The number and type of the optical sheets of the present invention are not limited.

[0073] The mold frame 600 is disposed between the display member 200 and the optical member 400. In the case where the display apparatus 1000 includes the optical sheet described above, the mold frame 600 may be disposed between the optical sheet and the optical member 400.

[0074] According to an embodiment, the mold frame 600 has a frame shape. For example, the mold frame 600 may be disposed on the upper surface of the optical member 400 to correspond to the edge area. In such an embodiment, the mold frame 600 does not overlap the display area DA. The display member 200 is disposed on the mold frame 600. The mold frame 600 is used to fix the display member 200 and the light providing unit BLU.

[0075] The receiving member 700 is disposed at the lowermost end of the display device 1000 to receive the light providing unit BLU. The receiving member 700 includes a bottom portion 710 and a plurality of side wall portions 720 connected to the bottom portion 710. In an embodiment, the light source LS may be disposed on an inner side surface of one of the side wall portions 720 of the receiving member 700. The receiving member 700 may include, for example, a rigid metal material.

[0076] Figure 3 is an enlarged cross-sectional view of a display member according to an embodiment.

[0077] refer to Figure 3 , the display member 200 includes a first polarizing layer POL1 and a display panel PNL. The first polarizing layer POL1 is disposed between the display panel PNL and the light providing unit BLU, and polarizes a component of light provided from the light providing unit BLU. The first polarizing layer POL1 may have a transmission axis having a given direction (eg, a predetermined direction).

[0078] The display panel PNL is disposed on the first polarizing layer POL1 to pass through the display area DA ( Figure 1 and Figure 2 ) displays an image. As described above, the display panel PNL may be a light receiving type display panel. For example, according to an embodiment, the display panel PNL may be a liquid crystal display ("LCD") panel.

[0079] The display panel PNL includes a first substrate SUB1, a second polarizing layer POL2, a second substrate SUB2, and a liquid crystal layer LC.

[0080] The first substrate SUB1 is disposed on the first polarization layer POL1. The first substrate SUB1 may include a material having a high (e.g., relatively high) light transmittance so as to easily transmit the light provided from the light providing unit BLU. For example, the first substrate SUB1 may be a transparent glass substrate, a transparent plastic substrate, a transparent film, or any other suitable transparent material as will be understood by those skilled in the art.

[0081] Although not shown, at least one pixel region and a non-pixel region adjacent to the pixel region are defined on the first substrate SUB1 in a plan view. In this embodiment, a plurality of pixel regions are provided, and the non-pixel region may be defined between the pixel regions.

[0082] The pixels may be respectively arranged in the pixel region of the first substrate SUB1. The pixels may include a plurality of pixel electrodes and a plurality of thin film transistors electrically connected to the pixel electrodes in a one-to-one correspondence. The thin film transistors may each be connected to a corresponding one of the pixel electrodes to switch a driving signal provided to each of the pixel electrodes.

[0083] The second substrate SUB2 is disposed on the first substrate SUB1 and is opposed to (eg, opposite to or facing) the first substrate SUB1. The liquid crystal layer LC may be interposed between the second substrate SUB2 and the first substrate SUB1. The liquid crystal layer LC includes a plurality of liquid crystal molecules LCM arranged (eg, arranged in a predetermined direction).

[0084] The second substrate SUB2 may include a common electrode to form an electric field for controlling the arrangement of the liquid crystal molecules LCM together with the pixel electrode. The display member 200 drives the liquid crystal layer LC to display an image in a third direction DR3 that is an upward direction.

[0085] Although not shown, a driving chip for providing a driving signal, a tape carrier package for mounting the driving chip thereon, and a printed circuit board electrically connected to the display panel PNL through the tape carrier package may be provided at the display member 200 .

[0086] The second polarization layer POL2 is disposed between the liquid crystal layer LC and the second substrate SUB2. However, the present invention is not limited to Figure 3 For example, according to another embodiment, the second polarizing layer POL2 may be disposed on the second substrate SUB2.

[0087] In this embodiment, the second polarizing layer POL2 may be a wire grid polarizer. Although not shown in the figure, the second polarizing layer POL2 may include a plurality of nanowires including a metal material. However, the present invention is not limited to a specific shape and material of the second polarizing layer POL2.

[0088] The second polarizing layer POL2 may have an absorption axis (eg, an absorption axis having a predetermined direction) and transmits light when the display mode of the display device 1000 is bright, and absorbs light when the display mode of the display device 1000 is dark.

[0089] According to this embodiment, the angle between the transmission axis of the first polarization layer POL1 and the absorption axis of the second polarization layer POL2 can be set according to the arrangement mode of the liquid crystal molecules LCM. For example, in a plan view, the transmission axis of the first polarization layer POL1 can be orthogonal to the absorption axis of the second polarization layer POL2.

[0090] Figure 4 is a perspective view showing a light guide member and an optical member according to an embodiment, Figure 5A It is along Figure 4 A cross-sectional view taken along line II-II' shown in FIG. Figure 5B It is along Figure 4 A cross-sectional view taken along line III-III' shown in FIG. Figure 5CIt is along Figure 4 A cross-sectional view taken along line II-II' is shown in FIG.

[0091] refer to Figures 4 to 5C , the optical member 400 includes a low refractive index layer 410 , a light conversion layer 420 , a first cover layer 430 , and a second cover layer 440 .

[0092] The low refractive index layer 410 is disposed on the light exit surface TS (eg, Figure 2 The light from the light source LS leaves the surface TS). The low refractive index layer 410 has a refractive index smaller than that of the light guiding member 300. For example, the refractive index of the low refractive index layer 410 may be higher than or substantially equal to about 1.1 and lower than or substantially equal to about 1.3. The low refractive index layer 410 forms a refractive index difference at the interface between the low refractive index layer 410 and the light guiding member 300, so that the light provided from the light source LS to the light guiding member 300 can be reflected (e.g., totally reflected) in the light guiding member 300.

[0093] Although not shown in the figure, the low refractive index layer 410 may include a plurality of holes. The refractive index of the low refractive index layer 410 may be adjusted according to the density of the holes. For example, as the number of holes included in the low refractive index layer 410 increases, the refractive index of the low refractive index layer 410 may decrease.

[0094] According to the present embodiment, the thickness of the low refractive index layer 410 may be greater than or substantially equal to about 0.5 μm. Unlike the present embodiment, in the case where the thickness of the low refractive index layer 410 is less than about 0.5 μm, light satisfying a reflection condition (e.g., a total reflection condition) among the light provided to the light guide member 300 may not be totally reflected in the light guide member 300, and may thus be incident to the light conversion layer 420 through the low refractive index layer 410.

[0095] The low refractive index layer 410 overlaps a portion of the light exit surface TS of the light guide member 300. The area of ​​the upper surface of the low refractive index layer 410 may be smaller than the area of ​​the light exit surface TS of the light guide member 300. Therefore, a portion of the light exit surface TS of the light guide member 300, where the low refractive index layer 410 is not provided, may be exposed by the low refractive index layer 410 in a plan view. The exposed area may overlap with an edge area of ​​the light exit surface TS of the light guide member 300.

[0096] The light conversion layer 420 is disposed on the low refractive index layer 410. The light conversion layer 420 has a refractive index higher than that of the light guide member 300. For example, the refractive index of the light conversion layer 420 may be greater than or substantially equal to about 1.65.

[0097] The light conversion layer 420 converts the wavelength band of the incident light. The light conversion layer 420 according to the embodiment may include a plurality of conversion particles QD1 and QD2. Each of the conversion particles QD1 and QD2 absorbs at least a portion of the incident light and emits light having a color (e.g., a specific color) associated with the conversion particle QD1 or QD2, or transmits light as it is.

[0098] For example, when light incident to the light conversion layer 420 has energy sufficient to excite the conversion particles QD1 or QD2, the conversion particles QD1 or QD2 absorb at least a portion of the incident light and are excited, and the conversion particles QD1 or QD2 are stabilized and emit light of a specific color during the stabilization process. When the incident light has energy insufficient to excite the conversion particles QD1 and QD2, the incident light may pass through the light conversion layer 420 as it is and be visible from the outside.

[0099] The color of light emitted by the conversion particle QD1 or QD2 may vary according to the particle size of the conversion particle QD1 or QD2. Generally, as the particle size increases, light with a longer wavelength is generated, and as the particle size decreases, light with a shorter wavelength is generated.

[0100] For example, according to an embodiment, each of the conversion particles QD1 and QD2 may be a quantum dot. Light emitted from the conversion particles QD1 and QD2 of the light conversion layer 420 may be emitted in various directions.

[0101] For example, the conversion particles QD1 and QD2 include a first quantum dot QD1 and a second quantum dot QD2. Each of the first quantum dots QD1 can absorb the first light and convert the first light into a second light having a second wavelength band. The center wavelength of the second wavelength band can be greater than the center wavelength of the first wavelength band. For example, the second wavelength band can be greater than or substantially equal to about 640nm and less than or substantially equal to about 780nm. That is, each of the first quantum dots QD1 can substantially convert blue light into red light.

[0102] Each of the second quantum dots QD2 can absorb the first light and convert the first light into a third light having a third wavelength band. The central wavelength of the third wavelength band is greater than the central wavelength of the first wavelength band and less than the central wavelength of the second wavelength band. For example, the third wavelength band may be greater than or substantially equal to about 480 nm and less than or substantially equal to about 560 nm. That is, each of the second quantum dots QD2 can substantially convert blue light into green light.

[0103] As described above, the wavelength of light generated by the conversion particle QD1 or QD2 may be determined according to the particle size of the corresponding conversion particle. According to the present embodiment, the size of each of the first quantum dots QD1 may be greater than the size of each of the second quantum dots QD2.

[0104] Although not shown in the drawings, the light conversion layer 420 may further include a scatterer. The scatterer may be mixed with the first quantum dots QD1 and the second quantum dots QD2.

[0105] The first cover layer 430 is disposed between the low refractive index layer 410 and the light conversion layer 420. The first cover layer 430 is disposed on the low refractive index layer 410 and contacts (e.g., directly contacts) the low refractive index layer 410. For example, the first cover layer 430 covers the upper surface and the side surface of the low refractive index layer 410. The first cover layer 430 according to the present embodiment may include an inorganic material. For example, the first cover layer 430 may include silicon oxide (SiO x ), silicon nitride (SiN x ) and / or silicon oxynitride (SiO x N x ).

[0106] refer to Figure 5A and Figure 5B , the low refractive index layer 410 according to an embodiment may be disposed on the light exit surface TS (eg, Figure 2 The first cover layer 430 covers the upper surface and all side surfaces of the low refractive index layer 410. In addition, the first cover layer 430 may directly contact the edge area of ​​the light exit surface TS of the light guide member 300 that does not overlap with the low refractive index layer 410.

[0107] refer to Figure 5C , the first cover layer 430 may cover only some of the side surfaces of the low refractive index layer 410. For example, one side surface of the low refractive index layer 410 adjacent to the light source LS is not covered by the first cover layer 430. The other side surfaces (e.g., not the above-mentioned one side surface) of the low refractive index layer 410 are covered by the first cover layer 430. The portion of the area on the light exit surface TS of the light guide member 300 that does not overlap with the low refractive index layer 410 is covered by the first cover layer 430. The portion that does not overlap with the low refractive index layer 410 may directly contact the first cover layer 430.

[0108] The first cover layer 430 may include a first barrier layer 431 disposed on the low refractive index layer 410 and a second barrier layer 432 disposed on the first barrier layer 431. The first barrier layer 431 and the second barrier layer 432 may completely overlap each other.

[0109] The first barrier layer 431 may be formed by deposition on the low refractive index layer 410 at a first temperature for a first period of time. The second barrier layer 432 may be formed by deposition on the first barrier layer 431 at a second temperature for a second period of time.

[0110] Each of the first barrier layer 431 and the second barrier layer 432 may include an inorganic material. For example, each of the first barrier layer 431 and the second barrier layer 432 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxide nitride (SiO x N x ) and / or any other suitable material as would be appreciated by a person skilled in the art.

[0111] The first barrier layer 431 and the second barrier layer 432 may include substantially the same material. Alternatively, the first barrier layer 431 and the second barrier layer 432 may include different materials, respectively. For example, according to an embodiment, the first barrier layer 431 may include silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N x ), and the second barrier layer 432 may include silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N x ) is another one of them.

[0112] According to an embodiment, the first temperature at which the first barrier layer 431 is deposited is higher than the second temperature at which the second barrier layer 432 is deposited. For example, the first temperature at which the first barrier layer 431 is deposited may be higher than or substantially equal to about 250°C. In some embodiments, the first temperature may be about 300°C or higher, and in some embodiments, the first temperature may be about 350°C or higher. In some embodiments, the first temperature may be about 500°C or lower, and in some embodiments, the first temperature may be about 400°C or lower. In some embodiments, the second temperature at which the second barrier layer 432 is deposited may be lower than about 250°C. For example, the second temperature may be about 200°C.

[0113] According to an embodiment, the thickness of the first barrier layer 431 may be greater than or substantially equal to about and less than about For example, the thickness of the first barrier layer 431 may be greater than or substantially equal to about and less than about The thickness of the second barrier layer 432 may be greater than or substantially equal to about

[0114] The sum of the thicknesses of the first barrier layer 431 and the second barrier layer 432 may be approximately or greater. According to an embodiment, the sum of the thicknesses may be about or greater, and in another embodiment, the sum of the thicknesses may be about or larger.

[0115] The first cover layer 430 including the first barrier layer 431 and the second barrier layer 432 may have a moisture-proof property. The water vapor transmission rate ("WVTR") of the first cover layer 430 measured under a relative humidity condition of 90% at 38° C. according to a standard test method for water vapor permeability (such as ASTM F1249) is less than or substantially equal to about 1.1 g / m 2 / day, and may be less than or substantially equal to about 0.4 g / m 2 / sky.

[0116] According to an embodiment, the density of the first barrier layer 431 may be greater than the density of the second barrier layer 432. For example, the density of the first barrier layer 431 may be greater than the density of the second barrier layer 432 by about 0.1 g / cm 3 or more, and in some embodiments, the density of the first barrier layer 431 may be about 0.2 g / cm greater than the density of the second barrier layer 432. 3 According to an embodiment, the density of the first barrier layer 431 may be about 0.3 g / cm greater than the density of the second barrier layer 432. 3 or more.

[0117] For example, each of the first barrier layer 431 and the second barrier layer 432 may include SiO x , and the density of the first barrier layer 431 may be from about 2.3 g / cm 3 To about 2.5g / cm 3 In addition, the density of the second barrier layer 432 can be in the range of about 2.1 g / cm 3 To about 2.3g / cm 3 within the range.

[0118] For example, each of the first barrier layer 431 and the second barrier layer 432 may include SiN x , and the density of the first barrier layer 431 may be from about 2.3 g / cm 3 To about 2.7g / cm 3 In addition, the density of the second barrier layer 432 can be in the range of about 2.0 g / cm 3 To about 2.3g / cm 3 within the range.

[0119] Alternatively, each of the first barrier layer 431 and the second barrier layer 432 may include a bond structure of Si-OH and Si-H, and the Si-OH bond ratio of the first barrier layer 431 may be greater than the Si-OH bond ratio of the second barrier layer 432. For example, in the region of the FP-IR peak, the Si-OH bond ratio of the first barrier layer 431 may be approximately 5% to approximately 50% greater than the Si-OH bond ratio of the second barrier layer 432.

[0120] Alternatively, each of the first barrier layer 431 and the second barrier layer 432 may include a bond structure of Si—N, NH, and Si—H, and the Si—N bond ratio of the first barrier layer 431 may be greater than the Si—N bond ratio of the second barrier layer 432. For example, in the region of the FP-IR peak, the Si—N bond ratio of the first barrier layer 431 may be approximately 5% to approximately 50% greater than the Si—N bond ratio of the second barrier layer 432.

[0121] According to an embodiment, the refractive index of the first barrier layer 431 may be greater than the refractive index of the second barrier layer 432 .

[0122] For example, each of the first barrier layer 431 and the second barrier layer 432 may include SiO x , and the refractive index of the first barrier layer 431 may be in a range from about 1.46 to about 1.50. In addition, the refractive index of the second barrier layer 432 may be in a range from about 1.42 to about 1.46. For example, the refractive index of the first barrier layer 431 may be greater than that of the second barrier layer 432 by about 0.04 or more.

[0123] For example, each of the first barrier layer 431 and the second barrier layer 432 may include SiN x , and the refractive index of the first barrier layer 431 may be in the range of about 1.90 to about 2.10. In addition, the refractive index of the second barrier layer 432 may be in the range of about 1.80 to about 1.90. For example, the refractive index of the first barrier layer 431 may be greater than that of the second barrier layer 432 by about 0.1 or more.

[0124] In addition, the density of the pores included in the first barrier layer 431 may be less than that in the second barrier layer 432. For example, the density of the pores included in the second barrier layer 432 may be greater than that in the first barrier layer 431 by about 5% to about 50%.

[0125] The second cover layer 440 is disposed on the light conversion layer 420. The second cover layer 440 may directly contact an upper surface of the light conversion layer 420. The second cover layer 440 may directly contact a side surface of the light conversion layer 420 and an upper surface of the first cover layer 430.

[0126] The second capping layer 440 may include an inorganic material. For example, the second capping layer 440 may include silicon oxide (SiO x ), silicon nitride (SiN x ) and / or silicon oxynitride (SiO x N x ). The second cover layer 440 protects the light conversion layer 420 from the outside to prevent the conversion particles QD1 and QD2 of the light conversion layer 420 from being degraded.

[0127] In the present embodiment, the second capping layer 440 includes a material substantially the same as that included in the first capping layer 430, but the embodiment is not limited thereto. According to another embodiment, the first capping layer 430 and the second capping layer 440 may include inorganic materials different from each other.

[0128] Although not shown, the optical member 400 according to the embodiment may further include a third cover layer. The third cover layer may be disposed on the second cover layer 440 to cover the upper surface of the second cover layer 440. The third cover layer may include an organic material. The third cover layer is used to cover the void space that may be generated in the second cover layer 440.

[0129] Although not shown, the first cover layer 430 may further include an adhesive layer.

[0130] An adhesive layer may be disposed between the first barrier layer 431 and the light guide member 300 to increase adhesion between the first barrier layer 431 and the light guide member 300 .

[0131] Figure 6 is a flowchart showing a method of manufacturing an optical member according to an embodiment, and

[0132] Figure 7 is a flowchart illustrating a method of manufacturing a first cover layer according to an embodiment.

[0133] In the following, reference Figure 6 and Figure 7 , a method of manufacturing the optical member 400 according to an embodiment will be described.

[0134] First, a low refractive index layer 410 is formed on the light guiding member 300 (S10). For example, an initial solution as a material for forming the low refractive index layer 410 is applied to the light guiding member 300. For example, the initial solution may include hollow silica and / or silica polymer. The low refractive index layer 410 is formed using the applied initial solution through a post-processing process. For example, the post-processing process may include a post-heat treatment process. The post-heat treatment process may be performed at a temperature of less than about 250° C. A plurality of holes may be generated in the low refractive index layer 410 through the post-processing process. The refractive index of the low refractive index layer 410 may be set by controlling the density of the holes included in the low refractive index layer 410.

[0135] Next, a first covering layer 430 is formed on the low refractive index layer 410 (S20). The first covering layer 430 may cover the upper surface and all side surfaces of the low refractive index layer 410. In some embodiments, the first covering layer 430 may only cover a portion of the side surfaces and the upper surface of the low refractive index layer 410. Figure 7 The formation of the first capping layer 430 ( S20 ) is described.

[0136] Next, the light conversion layer 420 is formed on the first cover layer 430 (S30). The light conversion layer 420 includes a plurality of conversion particles QD1 and QD2. For example, the conversion particles QD1 and QD2 may be quantum dots.

[0137] Next, a second covering layer 440 is formed on the light conversion layer 420 (S40). The second covering layer 440 may cover the upper surface and all side surfaces of the light conversion layer 420. In some embodiments, the second covering layer 440 may only cover a portion of the side surfaces and the upper surface of the light conversion layer 420. The second covering layer 440 may include an inorganic material. For example, the second covering layer 440 may include silicon oxide (SiO x ), silicon nitride (SiN x ) and / or silicon oxynitride (SiO x N x ). However, the present invention is not particularly limited to the material of the second cover layer 440.

[0138] refer to Figure 7 , forming the first capping layer 430 (S20) may include forming a first barrier layer 431 (S21) on the low refractive index layer 410 and forming a second barrier layer 432 (S22) on the first barrier layer 431. The first barrier layer 431 (S21) is formed by depositing a first material on the low refractive index layer 410 at a first temperature for a first period of time. The second barrier layer 432 (S22) is formed by depositing a second material on the first barrier layer 431 at a second temperature for a second period of time.

[0139] The first barrier layer 431 and the second barrier layer 432 may be deposited by chemical vapor deposition ("CVD"). For example, the second barrier layer 432 may be deposited by plasma enhanced chemical vapor deposition ("PECVD").

[0140] The first material of the first barrier layer 431 and the second material of the second barrier layer 432 may be an inorganic material. For example, each of the first material and the second material may include silicon oxide (SiO x ), silicon nitride (SiN x ) and / or silicon oxynitride (SiO x N x ).

[0141] The first material and the second material may be substantially the same material. Alternatively, the first material and the second material may be different materials (eg, materials different from each other). For example, the first material may include silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N x ), and the second material may include silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N x ) is another one of them.

[0142] For example, the first barrier layer 431 may include SiN deposited by a PECVD method. x In this case, the first barrier layer 431 may be deposited under the following process conditions: 4 The flow rate of NH 3 The flow rate is about 610 sccm, N 2 The flow rate of was about 3255 sccm, the process pressure was about 1000 mTorr, and the RF power was about 1000W.

[0143] For example, the first barrier layer 431 may include SiO deposited by a PECVD method. x In this case, the first barrier layer 431 may be deposited under the following process conditions: 4 The flow rate is about 70 sccm, N 2 The flow rate of O was about 4200 seem, the process pressure was about 1200 mTorr, and the RF power was about 200W.

[0144] For example, the second barrier layer 432 may include SiN deposited by a PECVD method. xIn this case, the second barrier layer 432 may be deposited under the following process conditions: 4 The flow rate of NH 3 The flow rate is about 1500 sccm, N 2 The flow rate was about 5250 sccm, the process pressure was about 900 mTorr, and the RF power was about 1000W.

[0145] For example, the second barrier layer 432 may include SiO deposited by a PECVD method. x In this case, the second barrier layer 432 may be deposited under the following process conditions: 4 The flow rate is about 120 sccm, N 2 The flow rate of O was about 5800 sccm, the process pressure was about 1000 mTorr, and the RF power was about 200W.

[0146] However, the embodiments are not limited thereto, and as understood by those skilled in the art, the flow rate of each gas, the process pressure, and the RF power may be modified according to the material of the low refractive index layer 410, the thickness of the first barrier layer 431 and the second barrier layer 432, the deposition temperature, the deposition time, and the plasma energy.

[0147] According to an embodiment, the first temperature at which the first barrier layer 431 is deposited is higher than the second temperature at which the second barrier layer 432 is deposited. For example, the first temperature at which the first barrier layer 431 is deposited may be greater than or substantially equal to about 250° C. For example, the first temperature may be about 300° C. or higher, or may be about 350° C. or higher. For example, the second temperature at which the second barrier layer 432 is deposited may be less than about 250° C. For example, the second temperature may be about 200° C.

[0148] As described above, the first temperature for depositing the first barrier layer 431 is relatively high. 8A to 9C As described, depositing the first barrier layer 431 at a relatively high first temperature may substantially suppress a luminance variation of the light providing unit BLU over time.

[0149] The first time period for depositing the first barrier layer 431 may be in the range of from about 30 seconds (s) to about 240s. For example, the first time period may be in the range of from about 60s to about 120s. The first barrier layer 431 is deposited at a relatively high first temperature. Therefore, the low refractive index layer 410 disposed below the first barrier layer 431 and including an organic material may be decomposed. Therefore, in an embodiment, the first time period as the deposition time of the first barrier layer 431 is less than the time period after the low refractive index layer 410 begins to decompose.

[0150] In an embodiment, when the deposition temperature (ie, first temperature) of the first barrier layer 431 is about 373° C. and the time (ie, first time period) for depositing the first barrier layer 431 is about 120 s, decomposition of the low refractive index layer 410 may be substantially avoided.

[0151] In an embodiment, when the deposition temperature (ie, first temperature) of the first barrier layer 431 is about 373° C. and the time (ie, first time period) for depositing the first barrier layer 431 is about 240 s, the low refractive index layer 410 may begin to decompose.

[0152] In an embodiment, when the deposition temperature (ie, first temperature) of the first barrier layer 431 is about 373° C. and the time (ie, first time period) for depositing the first barrier layer 431 is about 360 s, a large amount of decomposition of the low refractive index layer 410 may be caused.

[0153] According to an embodiment, the first time period for depositing the first barrier layer 431 is less than about 240 s and may be less than or substantially equal to about 120 s. However, the first time period for depositing the first barrier layer 431 is not limited thereto, and the first time period may be any time period less than the time period after the low refractive index layer 410 begins to decompose according to the material of the low refractive index layer 410, the deposition temperature, the pressure of the raw material gas, the plasma energy, and the flow rate of the gas. Such a time period may be determined according to the material of the low refractive index layer 410, the deposition temperature, the pressure of the raw material gas, the plasma energy, and the flow rate of the gas.

[0154] The thickness of the first barrier layer 431 may be determined according to the first time period and the deposition rate of the first barrier layer 431. According to an embodiment, the first time period is about 120 s, and the deposition rate of the first barrier layer 431 is about 10 s. to about More preferably, within the range of from about to about According to an embodiment, the thickness of the first barrier layer 431 is in the range of about to about within the range.

[0155] The second barrier layer 432 is deposited on the first barrier layer 431. The second temperature at which the second barrier layer 432 is deposited may be a relatively low temperature at which the low refractive index layer 410 is not decomposed.

[0156] Table 1 below shows water vapor transmission rates (“WVTR”) according to the thickness of the barrier layer. Referring to Table 1, the WVTR of the first cover layer 430 may depend on the sum of the thicknesses of the first barrier layer 431 and the second barrier layer 432 .

[0157] Table 1

[0158]

[0159]

[0160] The WVTR of the first cover layer 430 including the first barrier layer 431 and the second barrier layer 432 may be less than or substantially equal to about 1.1 g / m 2 / day, and preferably less than or substantially equal to about 0.4 g / m 2 / sky.

[0161] The sum of the thicknesses of the first barrier layer 431 and the second barrier layer 432 may be approximately about or about More preferably, the sum of the thicknesses of the first barrier layer 431 and the second barrier layer 432 may be greater than or substantially equal to about Preferably, the sum of the thicknesses of the first barrier layer 431 and the second barrier layer 432 may be in the range of about to about within the range.

[0162] As described above, the deposition time may be limited due to the relatively high deposition temperature of the first barrier layer 431 , and thus, it may be difficult to form the first barrier layer 431 having a sufficient thickness.

[0163] Therefore, in order to achieve a sufficient thickness of the first capping layer 430, the second barrier layer 432 may be deposited to a desired thickness at a relatively low second temperature. For example, the thickness of the second barrier layer 432 may be greater than or substantially equal to about

[0164] As described above, the first barrier layer 431 is deposited at a relatively higher temperature than the temperature at which the second barrier layer 432 is deposited. Therefore, the density of the first barrier layer 431 may be greater than that of the second barrier layer 432. In addition, each of the first barrier layer 431 and the second barrier layer 432 may include a bond structure of Si-OH and Si-H, and a Si-OH bond ratio of the first barrier layer 431 may be greater than that of the second barrier layer 432. In addition, each of the first barrier layer 431 and the second barrier layer 432 may include a bond structure of Si-N, NH, and Si-H, and a Si-N bond ratio of the first barrier layer 431 may be greater than that of the second barrier layer 432. In addition, the refractive index of the first barrier layer 431 may be greater than that of the second barrier layer 432. In addition, the density of holes included in the first barrier layer 431 may be less than that of holes included in the second barrier layer 432.

[0165] The above has been described mainly about the temperature of depositing the first and second barrier layers 431 and 432 , but the embodiment is not limited thereto. For example, higher plasma energy or higher process pressure may be used when depositing the first barrier layer 431 than when depositing the second barrier layer 432 .

[0166] For example, each of the first barrier layer 431 and the second barrier layer 432 may include SiN x , the first barrier layer 431 may be deposited under a process condition where the RF power is about 1250W, and the second barrier layer 432 may be deposited under a process condition where the RF power is about 1000W.

[0167] For example, each of the first barrier layer 431 and the second barrier layer 432 may include SiO x , the first barrier layer 431 may be deposited under a process condition where the RF power is about 300W, and the second barrier layer 432 may be deposited under a process condition where the RF power is about 200W.

[0168] For example, each of the first barrier layer 431 and the second barrier layer 432 may include SiN x , the first barrier layer 431 may be deposited under a process condition where the process pressure is about 1600 Torr, and the second barrier layer 432 may be deposited under a process condition where the process pressure is about 1000 Torr.

[0169] For example, each of the first barrier layer 431 and the second barrier layer 432 may include SiO x , the first barrier layer 431 may be deposited under a process condition where the process pressure is about 1500 Torr, and the second barrier layer 432 may be deposited under a process condition where the process pressure is about 1200 Torr.

[0170] However, embodiments are not limited thereto, and corresponding process pressure and RF power may be modified according to deposition conditions such as the material of the low refractive index layer 410, the thickness of the first barrier layer 431 and the second barrier layer 432, the deposition temperature, and the deposition time.

[0171] In addition, although the first capping layer 430 has been described as including the first barrier layer 431 and the second barrier layer 432 in the above description, the first capping layer 430 according to an embodiment may include a third barrier layer disposed on the second barrier layer 432. The third barrier layer may have a low density, or may be deposited at a lower temperature than the deposition temperature of the second barrier layer 432.

[0172] In addition, the first barrier layer 431 and the second barrier layer 432 may be a single barrier layer. In an embodiment having a single barrier layer, a first portion of the barrier layer relatively close to the low refractive index layer 410 may have a greater density than a second portion of the barrier layer relatively far from the low refractive index layer 410. The single barrier layer may have a density that decreases (e.g., continuously decreases) as the distance from the low refractive index layer 410 increases. In addition, such a barrier layer may be deposited at a continuously decreasing deposition temperature.

[0173] 8A to 9C is a graph showing changes in luminance over time according to the material of the first barrier layer 431 and the deposition temperature.

[0174] 8A to 9C 4 shows the change of brightness over time in a light providing unit, wherein the light providing unit includes a low refractive index layer 410, a first barrier layer 431, and a light guiding member 300 having glass. 8A to 9C , the horizontal axis represents the distance from the light incident surface IS (eg, between the light incident surface IS and the light opposing surface OS), and the vertical axis represents the relative magnitude of brightness. 8A to 9C Each of the three lines includes three lines. The three lines respectively represent the brightness at the beginning (initial), the brightness after two hours, and the brightness after 19 hours. FIG. 8A to FIG. 8C The first barrier layer 431 includes SiO x situation, and 9A to 9C The first barrier layer 431 includes SiN x situation.

[0175] like Fig. 8A As shown in FIG. , when SiO is deposited at about 200°C x When the first barrier layer 431 is formed, the brightness changes significantly over time. Figure 8B As shown in FIG. , when SiO is deposited at about 250°C and at a higher density, x When the first barrier layer 431 is removed, the change in brightness over time is significantly reduced, but the change in brightness over time is still relatively large. Figure 8C As shown in FIG. , when depositing SiO at about 373° C. and at an even higher density (e.g., at a much higher density) x When the first barrier layer 431 is formed, the brightness does not substantially change over time.

[0176] The light directing member 300 may include dangling bonds that previously existed or were generated during processing of the light directing member 300, the low refractive index layer 410, and / or the first cover layer 430. For example, oxidation reactions may be promoted in the dangling bonds by high temperature deposition of the first barrier layer 431. Thus, when the first barrier layer 431 is deposited at a high temperature, any dangling bonds may be reduced or eliminated, and initial changes in brightness over time may be reduced.

[0177] like 9A to 9C As shown in FIG. , when the deposition includes SiN x When the first barrier layer 431 includes SiO x Compared to the case of , relatively low brightness changes occur over time.

[0178] like Fig. 9A As shown in FIG. , when SiN is deposited at about 200°C x When the first barrier layer 431 is formed, the brightness changes slightly over time. Fig. 9B As shown in FIG. , when SiN is deposited at a higher density at about 250°C, x When the first barrier layer 431 is formed, the brightness changes with time. Fig. 9C As shown in FIG. , when depositing SiN at an even higher density (eg, much higher density) at about 373° C. x When the first barrier layer 431 is formed, the brightness does not substantially change over time.

[0179] Table 2 below shows temporal changes in brightness and WVTR occurring in the comparative example and the exemplary embodiment of the present invention.

[0180] The thickness of the first covering layer 430 in both the comparative example and the exemplary embodiment is substantially equal to about

[0181] In a comparative example, when the first covering layer 430 includes a barrier layer deposited at a relatively low temperature and at a relatively low density (eg, including only the second barrier layer 432 according to an embodiment), a luminance increase in a range from about 10% to about 40% relative to the initial luminance occurs over time.

[0182] In exemplary embodiments 1 to 5, the thickness of the first barrier layer 431 and the second barrier layer 432 are substantially the same in each embodiment, and the first barrier layer 431 and the second barrier layer 432 have a thickness of about 100 mm / s, respectively. and of thickness, and their types are different from each other.

[0183] As in Exemplary Embodiments 1 to 5, substantially no change in brightness over time is observed regardless of the types of the first barrier layer 431 and the second barrier layer 432 .

[0184] In addition, the WVTR of both the comparative example and the exemplary embodiment was 0.4 g / m 2 / sky.

[0185] Table 2

[0186]

[0187] Therefore, the light providing unit BLU according to the embodiment may substantially suppress initial changes in brightness over time, and an aging process for suppressing initial changes in brightness over time may be omitted. In addition, the light providing unit BLU according to the embodiment may have a low WVTR.

[0188] As set forth above, the display device according to one or more embodiments may be improved in durability and display quality.

[0189] While the invention has been shown and described with reference to embodiments thereof, it will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention and its equivalents.

Claims

1. Display equipment, including: a light source configured to generate light; a display panel configured to display an image using the light; a light guide having at least one surface adjacent to the light source; as well as an optical member disposed between the light guide and the display panel, Wherein, the optical component comprises: a low refractive index layer located on a light exiting surface of the light guide; A first covering layer, located on the low refractive index layer; and a light conversion layer, located on the first cover layer, and the light conversion layer is configured to convert the wavelength band of incident light, wherein the first cover layer comprises: A first barrier layer located on the low refractive index layer; and The second barrier layer is located on the first barrier layer, and the second barrier layer has a density lower than that of the first barrier layer.

2. The display device according to claim 1, wherein: The refractive index of the low refractive index layer is greater than or equal to 1.1 and less than or equal to 1.

3.

3. The display device according to claim 1, wherein: The first barrier layer has a refractive index higher than that of the second barrier layer.

4. The display device according to claim 1, wherein: The second barrier layer has a pore density higher than that of the first barrier layer.

5. The display device according to claim 1, wherein: The first barrier layer and the second barrier layer include the same material.

6. The display device according to claim 1, wherein: The first barrier layer and the second barrier layer include materials different from each other.

7. The display device according to claim 1, wherein: Each of the first barrier layer and the second barrier layer includes SiO x 、SiN x and SiO x N x At least one of .

8. The display device according to claim 1, wherein: The sum of the thickness of the first barrier layer and the second barrier layer is greater than or equal to 9. The display device according to claim 1, wherein: The sum of the thickness of the first barrier layer and the second barrier layer is greater than or equal to 10. The display device according to claim 1, wherein: The thickness of the first barrier layer is greater than or equal to and less than 11. The display device of claim 1, further comprising a second cover layer on the light conversion layer.

12. The display device according to claim 11, wherein: The first covering layer covers the side surface of the low refractive index layer, and The second covering layer covers a side surface of the light conversion layer.

13. Display equipment, including: a light source configured to generate light; a display panel configured to display an image using the light; a light guide having at least one surface adjacent to the light source; as well as an optical member located between the light guide and the display panel, Wherein, the optical component comprises: a low refractive index layer located on a light exiting surface of the light guide; A first covering layer, located on the low refractive index layer; and a light conversion layer, located on the first cover layer, and the light conversion layer is configured to convert the wavelength band of incident light, wherein the first cover layer comprises: a first barrier layer formed on the low refractive index layer by depositing a first inorganic material at a first temperature; and A second barrier layer is formed on the first barrier layer by depositing a second inorganic material at a second temperature lower than the first temperature.

14. The display device according to claim 13, wherein: The first temperature is higher than or equal to 300°C, and the second temperature is lower than 300°C.

15. The display device according to claim 13, wherein: The thickness of the first barrier layer is greater than or equal to and less than

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