A device for calibrating the correlation between wave velocity and temperature in ultrasonic measurement

Abstract

The present invention relates to a device for calibrating the relationship between wave velocity and temperature in ultrasonic measurement, comprising: a microcontroller, an electromagnetic ultrasonic transceiver module, a heating module, a heat preservation module, a temperature measurement module and a display module; the electromagnetic ultrasonic transceiver module, the heating module, the heat preservation module and the temperature measurement module all act on a test piece; the microcontroller is respectively connected to the electromagnetic ultrasonic transceiver module, the heating module and the temperature measurement module to control the operation of each module, and collects data from the electromagnetic ultrasonic transceiver module and the temperature measurement module to calculate the relationship between the wave velocity and temperature of the ultrasonic wave in the test piece; the display module is connected to the microcontroller to display the calibration results of the wave velocity and temperature. The device realizes the integration and automatic measurement of the calibration experiment, can obtain the relationship between the wave velocity and the temperature simply and quickly, can calibrate the ultrasonic propagation characteristics of the material according to the demand, and expands the adaptability of ultrasonic temperature measurement, thickness measurement and other technologies to the material in actual use.

Description

Technical Field

[0001] The invention relates to the field of ultrasonic detection, and in particular to a device for calibrating the correlation between wave velocity and temperature in ultrasonic measurement. Background Art

[0002] In terms of ultrasonic temperature and thickness measurement, the correlation between the propagation speed (wave velocity) of ultrasonic waves in solid media and temperature is an important basis and prerequisite for obtaining accurate measurement results. Since there are many propagation waveforms of ultrasonic waves in solid media, the influence of solid physical properties on wave velocity is complex, and there is no clear theoretical formula to describe the wave velocity. It is necessary to calibrate the empirical formula corresponding to different materials through experiments. The calibration method is to measure the propagation time of ultrasonic waves in uniform solids under a series of uniform temperature conditions, and then calculate the wave velocity through the thickness of the medium.

[0003] At present, calibration experiments are mainly carried out in laboratories, and operators are required to extract data at set temperatures. At the same time, there are problems with the installation and fixation of thermocouples and the insulation of test pieces in the high temperature range (above 200°C). The calibration process is relatively complicated, which is not conducive to the promotion of ultrasonic temperature and thickness measurement engineering applications. Therefore, developing an automated measurement device for the calibration experiment of ultrasonic wave velocity and temperature is of great significance for improving the accuracy and application of ultrasonic temperature and thickness measurement methods. Summary of the invention

[0004] In view of the above problems, an automated measuring device for calibration experiments of ultrasonic wave velocity and temperature is provided.

[0005] The technical solution adopted by the present invention is as follows: a device for calibrating the correlation between wave velocity and temperature in ultrasonic measurement, comprising: a microcontroller, an electromagnetic ultrasonic transceiver module, a heating module, a heat preservation module, a temperature measurement module, a test piece and a display module; the electromagnetic ultrasonic transceiver module, the heating module, the heat preservation module and the temperature measurement module all act on the test piece; the microcontroller is respectively connected to the electromagnetic ultrasonic transceiver module, the heating module and the temperature measurement module to control the operation of each module, and collects data from the electromagnetic ultrasonic transceiver module and the temperature measurement module to calculate the relationship between the wave velocity and temperature of the ultrasonic wave in the test piece; the display module is connected to the microcontroller to display the calibration results of the wave velocity and the temperature.

[0006] Furthermore, the test piece is placed inside the insulation module, and the temperature measurement module includes a temperature collector and a temperature sensor. The temperature sensor is inserted into the test piece and fixed on the insulation module to measure the internal temperature of the test piece. The temperature collector collects temperature data from the temperature sensor and transmits it to the microcontroller.

[0007] Furthermore, the insulation module is a hollow cylindrical structure, and the through hole of the hollow cylinder is formed by splicing two cylindrical through holes with different apertures, the aperture of the upper through hole is smaller than the aperture of the lower through hole, and the lower part of the insulation module also has a threaded through hole horizontally opened from the side, and the temperature sensor is fixed through the threaded through hole.

[0008] Furthermore, the tested piece is placed in the lower through hole of the hollow cylinder, and the electromagnetic ultrasonic transceiver module is installed in the upper through hole of the hollow cylinder.

[0009] Furthermore, the thermal insulation module is made of zirconium oxide.

[0010] Furthermore, the temperature sensor is a high temperature resistant K-type thermocouple.

[0011] Furthermore, the heating module is composed of an electrically controlled heating plate, and the heating temperature of the electrically controlled heating plate is controlled by a microcontroller.

[0012] Furthermore, the electromagnetic ultrasonic transceiver module includes an acoustic signal collector and an ultrasonic transceiver which are respectively connected to a microcontroller. The microcontroller controls the ultrasonic transceiver to emit ultrasonic waves to the test piece for round-trip transmission. The acoustic signal collector collects the propagation time of the ultrasonic waves in the test piece and transmits the data to the microcontroller.

[0013] Furthermore, the microcontroller is an FPGA chip with built-in data processing software for acoustic information and temperature information, which is used to calculate the wave velocity according to the corresponding ultrasonic propagation time at a stable temperature and obtain the correlation relationship between the wave velocity and temperature.

[0014] Compared with the prior art, the beneficial effects of adopting the above technical scheme are as follows: the device realizes the integration and automated measurement of the calibration experiment by integrating various modules of ultrasonic wave velocity and temperature calibration, and directly obtains the correlation between wave velocity and temperature; the device can simply and quickly obtain the relationship between wave velocity and temperature, and can calibrate the ultrasonic propagation characteristics of the material according to the needs of the user, thereby expanding the adaptability of ultrasonic temperature measurement, thickness measurement and other technologies to materials in actual use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the principle of the calibration device of the present invention.

[0016] Figure 2 It is a stereoscopic diagram of a calibration device according to an embodiment of the present invention.

[0017] Figure 3 It is a schematic diagram of a heat preservation module in a calibration device according to an embodiment of the present invention.

[0018] Figure numerals: 1-microcontroller, 2-electromagnetic ultrasonic transceiver module, 3-insulation module, 4-heating module, 5-display module, 6-threaded through hole, 7-upper through hole, 8-lower through hole. DETAILED DESCRIPTION

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] like Figure 1 A device for calibrating the correlation between wave velocity and temperature for an ultrasonic measurement method includes a microcontroller 1, an electromagnetic ultrasonic transceiver module 2, a heating module 4, a heat preservation module 3, a temperature measurement module and a display module 5.

[0021] Among them, the electromagnetic ultrasonic transceiver module, the heating module, the insulation module and the temperature measurement module all act on the tested piece; the microcontroller is respectively connected to the electromagnetic ultrasonic transceiver module, the heating module and the temperature measurement module to control the operation of each module, and collects data from the electromagnetic ultrasonic transceiver module and the temperature measurement module to calculate the relationship between the wave velocity and temperature of the ultrasonic wave in the tested piece; the display module is connected to the microcontroller to display the calibration results of the wave velocity and temperature. The microcontroller is an FPGA chip. The temperature measurement module includes a temperature collector and a temperature sensor. The temperature sensor is inserted into the tested piece and fixed on the insulation module to measure the internal temperature of the tested piece. The temperature collector collects the temperature data of the temperature sensor and transmits it to the microcontroller.

[0022] In order to obtain the correlation between the acoustic time and the temperature of the solid medium at a high temperature of 600° C., the thermal insulation module is made of zirconium oxide, and the temperature sensor is a high-temperature resistant K-type thermocouple.

[0023] In view of the requirement of installing a temperature sensor to monitor the temperature of the test piece under high temperature, the test piece is placed inside the insulation module, the temperature sensor is inserted into the test piece and fixed on the insulation module to measure the internal temperature of the test piece.

[0024] The heat preservation module is a hollow cylindrical structure, the through hole of the hollow cylinder is formed by splicing two cylindrical through holes with different apertures, the aperture of the upper through hole 7 is smaller than the aperture of the lower through hole 8, and the lower part of the heat preservation module is also provided with a threaded through hole from the side, through which the temperature sensor is fixed. The threaded through hole is perpendicular to the axis of the hollow cylinder.

[0025] Preferably, the lower through hole is a cylindrical through hole with a diameter of 60 mm and a depth of 12 mm. During testing, the test piece is placed in the lower through hole. The shape of the test piece is a cylinder matching the insulation shell, with a diameter of 59 mm and a height of 10 mm.

[0026] In order to meet the requirement of temperature stability of the test piece, the heating module is composed of an electrically controlled heating plate, which is used to heat the test piece. After the temperature is stabilized, the temperature fluctuation of the test piece is within 1°C.

[0027] The electromagnetic ultrasonic transceiver module includes an acoustic signal collector and an ultrasonic transceiver, which are respectively connected to a microcontroller. The microcontroller controls the ultrasonic transceiver to emit ultrasonic waves to the test piece for round-trip transmission. The acoustic signal collector collects the propagation time of the ultrasonic waves in the test piece and transmits the time data to the microcontroller.

[0028] Preferably, the acoustic signal collector is an oscilloscope.

[0029] The microcontroller can set the temperature of the heating module step by step, determine whether the received data from the temperature measurement module is stable, and control the operation of the electromagnetic ultrasonic transceiver module. At the same time, the microcontroller also has built-in data processing software for acoustic information and temperature information, which is used to calculate the wave speed according to the corresponding ultrasonic propagation time under stable temperature, and obtain the correlation between wave speed and temperature.

[0030] Preferably, the display module is a touch display screen.

[0031] The calibration device provided in this embodiment is an integrated device, and the above modules are respectively integrated on or inside the housing, the display module 5 is arranged on the outer housing of the housing, the microcontroller 1 and the temperature collector in the temperature measurement module are arranged inside the housing, and the heating module 4, the heat preservation module 3, and the electromagnetic ultrasonic transceiver module 2 installed from bottom to top are arranged on the top of the housing. The temperature collector collects the temperature of the temperature sensor arranged in the heat preservation module through a wire.

[0032] The device integrates various modules for ultrasonic wave velocity and temperature calibration to achieve integrated and automated measurement of calibration experiments and directly obtain the correlation between wave velocity and temperature.

[0033] At the same time, the ultrasonic propagation characteristics of the material can be calibrated according to the needs of the user, which expands the adaptability of ultrasonic temperature measurement, thickness measurement and other technologies to the material in actual use.

[0034] The present invention is not limited to the above-mentioned specific embodiments. The present invention extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed. If non-substantial changes or improvements made by those skilled in the art without departing from the spirit of the present invention should fall within the scope of protection of the claims of the present invention.

[0035] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0036] Any feature disclosed in this specification, unless otherwise stated, can be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

Claims

1. A device for calibrating the correlation between wave velocity and temperature in ultrasonic measurement, characterized in that: include: A microcontroller, an electromagnetic ultrasonic transceiver module, a heating module, a heat preservation module, a temperature measurement module and a display module; the electromagnetic ultrasonic transceiver module, the heating module, the heat preservation module and the temperature measurement module all act on the test piece; the microcontroller is respectively connected to the electromagnetic ultrasonic transceiver module, the heating module and the temperature measurement module to control the operation of each module, and collects data from the electromagnetic ultrasonic transceiver module and the temperature measurement module to calculate the relationship between the wave velocity and temperature of the ultrasonic wave in the test piece; the display module is connected to the microcontroller to display the calibration result of the association between the wave velocity and the temperature; The tested piece is placed inside the heat preservation module. The temperature measurement module includes a temperature collector and a temperature sensor. The temperature sensor is inserted into the tested piece and fixed on the heat preservation module to measure the internal temperature of the tested piece. The temperature collector collects temperature data from the temperature sensor and transmits it to the microcontroller. The insulation module is a hollow cylindrical structure, and the hollow cylindrical through hole is formed by splicing two cylindrical through holes with different apertures, the aperture of the upper through hole is smaller than the aperture of the lower through hole, and the lower part of the insulation module is also provided with a threaded through hole from the side, and the temperature sensor is fixed through the threaded through hole; The tested piece is placed in the lower through hole of the hollow cylinder, and the electromagnetic ultrasonic transceiver module is installed in the upper through hole of the hollow cylinder; The thermal insulation module is made of zirconium oxide; The temperature sensor is a K-type thermocouple; The heating module is composed of an electrically controlled heating plate, and the heating temperature of the electrically controlled heating plate is controlled by a microcontroller; The electromagnetic ultrasonic transceiver module includes an acoustic signal collector and an ultrasonic transceiver, which are respectively connected to a microcontroller. The microcontroller controls the ultrasonic transceiver to send ultrasonic waves to the test piece for round-trip transmission. The acoustic signal collector collects the propagation time of the ultrasonic waves in the test piece and transmits the time data to the microcontroller. The microcontroller is an FPGA chip, which is used to calculate the wave speed according to the corresponding ultrasonic wave propagation time at a stable temperature, and obtain the correlation relationship between the wave speed and the temperature.

2. The calibration device according to claim 1, characterized in that: The display module is a display touch screen.

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