A material exchange device with dual temperature zones to avoid temperature crosstalk
By designing a material exchange device that avoids temperature crosstalk in the dual temperature zone, using the combined structure of the electric hoist and elastic components, the sealing exchange of solder paste inside and outside the refrigerator is achieved, which solves the problems of temperature crosstalk and equipment structure in the prior art, improves the storage quality of solder paste and reduces equipment costs.
Patent Information
- Application Number
- CN202010066879.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-01-20
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2040-01-20
AI Technical Summary
The prior art cannot effectively avoid temperature crosstalk during the transfer of solder paste from the refrigeration area to the back temperature zone, resulting in the leakage of the cooling capacity in the refrigeration area, and the equipment structure is complex, which increases production and maintenance costs.
A material exchange device with dual temperature zone avoids temperature crosstalk is designed, and a dual temperature zone partition, elastic components, pallets, seals and electric hoist rods are used. Through the push rod and sleeve structure of the electric hoist rod, combined with the elastic action of the elastic components, the sealing exchange of solder paste inside and outside the refrigerator cabinet is realized.
Effectively prevent temperature crosstalk, improve the storage quality of solder paste, simplify the equipment structure, reduce equipment costs, and realize the dual functions of sealed switch doors and material exchange.
Smart Images

Figure CN111180375B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of material exchange, and in particular to a material exchange device with double temperature zones to avoid temperature crosstalk. Background Art
[0002] Surface mount technology (SMT) is the most commonly used process technology in the current electronic packaging industry. The solder paste used in the process needs to be refrigerated during storage and needs to be warmed up before use. The management of the solder paste inevitably involves the process of transferring the solder paste from the cold storage area to the warming up area. As long as mechanical automatic placement is used, a window must be reserved between the cold storage area and the warming up area for the mechanical device to pass through. In order to minimize the loss of cold in the cold storage area, the prior art generally sets a heat preservation device, but the heat preservation device is limited to a heat preservation curtain, etc., which cannot provide a sufficiently good heat preservation function, causing the cold in the cold storage area to leak.
[0003] In order to achieve a better sealing effect, other manufacturers have specially set up independently operated sealing doors. The mechanism for entering and exiting materials is independent of the mechanism for opening the sealing door and they operate independently, which complicates the equipment structure and increases the production and maintenance costs of the equipment. Summary of the invention
[0004] The technical problem to be solved by the present invention is to provide a material exchange device with dual temperature zones to avoid temperature crosstalk.
[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:
[0006] A dual-temperature zone material exchange device for avoiding temperature crosstalk, comprising a dual-temperature zone baffle, an elastic component, a tray, a seal and an electric push rod; the electric push rod comprises a push rod and a sleeve;
[0007] The tray is fixedly mounted on the end of the push rod;
[0008] The dual-temperature zone partition is provided with a material access opening;
[0009] The size of the sealing member is matched with the material taking-in and putting-out opening. The sealing member is movably sleeved on the push rod. The elastic component is sleeved on the push rod and is located between the sealing member and the sleeve.
[0010] On the basis of the above, the present invention can also be improved as follows:
[0011] Furthermore, the material access opening and the sealing member are both truncated cone-shaped; the upper bottom surface diameter of the sealing member is smaller than the lower bottom surface diameter of the material access opening, and the lower bottom surface diameter of the sealing member is larger than the upper bottom surface diameter of the material access opening; the elastic member is sleeved on the push rod, with one end of the elastic member resting on the sealing member and the other end resting on the sleeve. Here, for the truncated cone shape, the end surface with a smaller diameter is the upper side, and the end surface with a larger diameter is the lower side.
[0012] Furthermore, the elastic component is a spring; a spring baffle is provided on the sleeve;
[0013] Furthermore, the push rod is arranged vertically or horizontally; the dual-temperature zone partition is arranged horizontally or vertically.
[0014] Compared with the prior art, the present invention has the following technical effects:
[0015] The dual-temperature zone material exchange device for avoiding temperature crosstalk of the present invention can seal the refrigerator during the process of exchanging solder paste inside and outside the refrigerator, thereby preventing temperature crosstalk and improving the storage quality of solder paste. Only one mechanism is used to simultaneously perform the dual functions of sealing the opening and closing doors and exchanging materials, thereby simplifying the equipment structure and reducing the equipment cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A schematic diagram of a material exchange device for avoiding temperature crosstalk in dual temperature zones of the present invention;
[0017] Figure 2 A detailed schematic diagram of a material exchange device for avoiding temperature crosstalk in dual temperature zones of the present invention;
[0018] Figure 3 An exploded view of a material exchange device for avoiding temperature crosstalk in dual temperature zones of the present invention;
[0019] Figure 4 A schematic perspective view of the solder paste of the material exchange device for avoiding temperature crosstalk in dual temperature zones of the present invention outside a refrigerated storage cabinet;
[0020] Figure 5 A schematic diagram of solder paste in a refrigerated storage cabinet of a material exchange device for avoiding temperature crosstalk in dual temperature zones of the present invention;
[0021] Figure 6-1 A schematic diagram of the first position of the material exchange device for avoiding temperature crosstalk in dual temperature zones of the present invention when it is horizontally arranged;
[0022] Figure 6-2 A schematic diagram of a second position of a material exchange device for avoiding temperature crosstalk in dual temperature zones of the present invention when it is horizontally arranged;
[0023] In the accompanying drawings, the component names represented by the reference numerals are listed as follows:
[0024] 1. Dual temperature zone partition;
[0025] 1-1. Material loading and unloading port;
[0026] 4-1, sleeve;
[0027] 4-2, driving motor;
[0028] 4-3, Putting;
[0029] 4-4, spring;
[0030] 4-5. Pallet;
[0031] 4-6, seals;
[0032] 4-7, spring baffle;
[0033] 5.Solder paste. DETAILED DESCRIPTION
[0034] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.
[0035] Please refer to Figure 1-Figure 3 As shown, a dual-temperature zone material exchange device to avoid temperature crosstalk; including a sleeve 4-1, a drive motor 4-2, an electric push rod composed of a push rod 4-3 and a spring 4-4, a tray 4-5, a seal 4-6, a spring baffle 4-7 and a drive motor 4-2; the spring baffle 4-7 is fixed on the sleeve 4-1.
[0036] The push rod 4-3 is inserted into the sleeve 4-1;
[0037] The driving motor 4-2 drives the push rod 4-3 to extend and retract in the sleeve 4-1;
[0038] The tray 4-5 is fixedly mounted on the free end of the push rod 4-3;
[0039] The material access opening 1-1 provided on the refrigerated storage cabinet is a truncated cone type;
[0040] The sealing member 4-6 is in the shape of a truncated cone and is movably mounted on the push rod 4-3. The diameter of its upper bottom surface is smaller than the diameter of the lower bottom surface of the material access port, and the diameter of its lower bottom surface is larger than the diameter of the upper bottom surface of the material access port. The spring 4-4 is mounted on the push rod 4-3, one end of which is against the sealing member 4-6, and the other end is against the spring baffle 4-7 fixed on the sleeve 4-1. In the initial state, the sealing member 4-6 is stuck in the material access port 1-1 under the elastic force of the spring, so as to achieve sealing inside and outside the cabinet 1.
[0041] like Figure 4 As shown, in the default state, the dual temperature zone material exchange device for avoiding temperature crosstalk is in Figure 4 In the position shown, the seal 4-6 seals the material access opening; the tray 4-5 is located outside the dual-temperature zone partition 1, and the solder paste to be stored in the refrigerated storage cabinet can be placed on the tray 4-5. Please note that there is no fixed bonding relationship between the tray 4-5 and the seal 4-6, so if the push rod 4-3 continues to push upward, the tray 4-5 can be higher than the dual-temperature zone partition 1 by a certain distance, and the seal 4-6 continues to be sealed in the material access opening 1-1 due to its adaptation relationship with the material access opening 1-1.
[0042] When solder paste needs to be stored, the push rod 4-3 moves into the cold storage cabinet under the drive of the drive motor 4-2, and at the same time drives the solder paste placed on the tray 4-5 to move into the cold storage cabinet; the tray 4-5 squeezes the seal 4-6, and the seal 4-6 squeezes the spring 4-4, so that the seal is separated from the material access port and moves into the cold storage cabinet together;
[0043] like Figure 5 As shown, when the solder paste 5 placed on the tray 4-5 completely enters the cold storage cabinet, the solder paste 5 is taken away by other mechanisms, and the driving motor 4-2 drives the push rod 4-3 to rise and return to the state as shown in FIG. Figure 4 Status shown.
[0044] The device is not limited to vertical arrangement, but can also be arranged horizontally, such as Figure 6-1 and Figure 6-2 shown.
[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A dual-temperature zone material exchange device to avoid temperature crosstalk, characterized in that: It includes a dual-temperature zone baffle, an elastic component, a tray, a seal and an electric push rod; the electric push rod includes a push rod, a drive motor and a sleeve; the push rod is inserted in the sleeve; the drive motor drives the push rod to extend and retract in the sleeve; The tray is fixedly mounted on the end of the push rod; The dual-temperature zone partition is provided with a material access opening; The size of the sealing member is adapted to the material access opening, the sealing member is movably sleeved on the push rod, and the elastic member is sleeved on the push rod and is located between the sealing member and the sleeve; The material access opening and the sealing member are both truncated cone-shaped; the upper bottom surface diameter of the sealing member is smaller than the lower bottom surface diameter of the material access opening, and the lower bottom surface diameter of the sealing member is larger than the lower bottom surface diameter of the material access opening.
2. The material exchange device according to claim 1, characterized in that: The elastic component is sleeved on the push rod, one end of the elastic component abuts against the sealing component, and the other end abuts against the sleeve.
3. The material exchange device according to claim 1, characterized in that: The elastic component is a spring.
4. The material exchange device according to claim 1, characterized in that: The push rod is arranged vertically or horizontally; the dual-temperature zone partition is arranged horizontally or vertically.
Citation Information
Patent Citations
Material exchange device capable of avoiding temperature crosstalk in double temperature zones
CN211017039U